Skyworks AAT2601AIIH-T1 Total power solution for portable application Datasheet

DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
General Description
Features
The AAT2601 and AAT2601A are members of Skyworks'
Total Power Management IC (TPMICTM) product family.
They contain a single-cell Lithium Ion/Polymer battery
charger, a fully integrated step-down converter and 5 low
dropout (LDO) regulators. The device also includes 2 load
switches for dynamic power path/sleep mode operation,
making it ideal for small handheld portable GSM or CDMA
mobile telephones.
• Voltage Regulator VIN Range: 4.5V to 6V
• Complete Power Integration
▪ Integrated Load Switches to Power Converters from
AC Adapter or Battery Automatically
• Low Standby Current
▪ 170μA (typ) w/ Buck (Core), LDO1 (PowerDigital),
and LDO2 (PowerAnalog) Active, No Load
• One Step-Down Buck Converter (Core)
▪ 1.8V, 300mA Output
▪ 3.3V, 300mA Output (AAT2601A-3.3 ONLY)
▪ 1.5MHz Switching Frequency
▪ Fast Turn-On Time (100μs typ)
• Five LDOs Programmable with I2C
▪ LDO1: 3.0V, 300mA (PowerDigital)
▪ LDO2: 3.0V, 150mA (PowerAnalog or PLL)
▪ LDO3: 3.0V, 150mA (TCXO)
▪ LDO4: 3.0V, 150mA (TX)
▪ LDO5: 3.0V, 150mA (RX)
▪ PSRR: 60dB@10kHz
▪ Noise: 50μVrms for LDO3, LDO4, and LDO5
• One Battery Charger
▪ Digitized Thermal Regulation
▪ Charge Current Programming up to 1.4A
▪ Charge Current Termination Programming
▪ Automatic Trickle Charge for Battery Preconditioning
(2.8V Cutoff)
• Adapter OK (ADPP) and Reset (RESET) Timer Outputs
• AAT2601 Typical UVLO: 2.35V
• AAT2601A Typical UVLO: 2.9V
• Separate Enable Pins for Supply Outputs
• Over-Current Protection
• Over-Temperature Protection
• 5x5mm TQFN55-36 Package
The battery charger is a complete thermally regulated
constant current/constant voltage linear charger. It
includes an integrated pass device, reverse blocking protection, high accuracy current and voltage regulation,
charge status, and charge termination. The charging
current, charge termination current, and recharge voltage are programmable with an external resistor and/or
by a standard I2C interface. The AAT2601 has a typical
battery under-voltage lockout of 2.35V and the AAT2601A
has a typical battery under-voltage lockout of 2.9V.
The step-down DC/DC converter is integrated with internal
compensation and operates at a switching frequency of
1.5MHz, thus minimizing the size of external components
while keeping switching losses low and efficiency greater
than 92%. All LDO output voltages are programmable
using the I2C interface.
The five LDOs offer 60dB power supply rejection ratio
(PSRR) and low noise operation making them suitable for
powering noise-sensitive loads.
All six voltage regulators operate with low quiescent current. The total no load current when the step-down converter and 2 LDOs are enabled is only 170μA.
The AAT2601 and AAT2601A are available in a thermally
enhanced low profile 5x5x0.75mm 36-pin TQFN package.
Applications
•
•
•
•
•
Digital Cameras
GSM or CDMA Cellular Phones
Handheld Instruments
PDAs and Handheld Computers
Portable Media Players
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
1
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Application
To AVIN1,AVIN2, PVIN
SYSOUT
System
Supply
SYSOUT
LDO
500mΩ
100mΩ
BAT
CHGIN
5V from
AC Adapter or USB Port
+
10μF
To SYSOUT
-
10μF
1 cell
Li+
battery
100k
ADPP
Charger
Control
STAT
ISET
TS
CT
ENBAT
Ref
USE_USB
To
SYSOUT
100k
To
SYSOUT
100k
10kΩ
NTC
For BAT
Temp sense
1.24k
0.1μF
SDA
SCL
To SYSOUT
PVIN
EN_TEST
μC
UVLO
EN_HOLD
I 2C
and
Enable
Control
EN_KEY
LX
VIN
3.3μH
Core : 1.8V
300mA
Step-down
BUCK
Ref
ON_KEY
10μF
4.7μF
OUTBUCK
PGND
Enable
RESET
To OUT1
100k
EN2
EN3
EN4
VIN
REF
CNOISE
EN5
AVIN1
AVIN2
VIN
Ref
To SYSOUT
LDO1
LDO2
Enable
VIN
Ref
LDO3
Enable
VIN
Ref
LDO4
LDO5
Enable
VIN
Ref
Enable
Ref
VIN
Enable
To SYSOUT
AGND
OUT5
RX
3.0V
150mA
OUT4
TX
3.0V
150mA
4.7μF
2
OUT3
TCXO
3.0V
150mA
4.7μF
OUT2
OUT1
PowerAnalog
3.0V
150mA
PowerDigital
3.0V
300mA
4.7μF
4.7μF
22μF
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
0.01μF
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Pin Descriptions
Pin #
Symbol
1
EN_TEST
2
EN_HOLD
3
EN_KEY
4
5
6
7
8
9
10
11
12
13
14
15
16
17
ON_KEY
EN2
EN3
EN4
EN5
OUT5
OUT4
AVIN2
OUT3
OUT2
AVIN1
OUT1
AGND
CNOISE
18
RESET
19
ADPP
20
21
22
23
LX
PGND
PVIN
OUTBUCK
24, 25
SYSOUT
26, 27
28
BAT
CHGIN
29
USE_USB
30
ENBAT
31
TS
32
ISET
33
CT
34
STAT
35
36
SDA
SCL
EP
EP
Function
Similar to EN_HOLD but intended for use with the automatic tester or as a hands free enable input pin indicating hands free phone operation with a headset. It is also internally pulled to GND when floating.
Enable for the system. EN_HOLD must be held high by the processor to maintain core power. It is internally pulled to GND when floating.
Enable for the system. An internal pull-up resistor keeps the pin pulled up to an internal supply to keep
the system off when there is no CHGIN input. Connect a normally-open pushbutton switch from this pin to
GND. There is an internal 300ms debounce delay circuit to filter noise.
Buffered logic output of the EN_KEY pin with a logic signal from ground to OUT1.
Enable for LDO2 (PowerAnalog or PLL). (Internally pulled low when floating)
Enable for LDO3 (TCXO). (Internally pulled low when floating)
Enable for LDO4 (TX) (Internally pulled low when floating)
Enable for LDO5 (RX) (Internally pulled low when floating)
Output for LDO5 (RX) (when shut down, pulled down with 10kΩ)
Output for LDO4 (TX) (when shut down, pulled down with 10kΩ)
Analog voltage input. Must be tied to SYSOUT on the PCB.
Output for LDO3 (TCXO)
Output for LDO2 (PowerAnalog)
Analog voltage input. Must be tied to SYSOUT on the PCB.
Output for LDO1 (PowerDigital)
Signal ground
Noise Bypass pin for the internal reference voltage. Connect a 0.01μF capacitor to AGND.
RESET is the open drain output of a 65ms reset timer. RESET is released after the 50ms timer times out.
RESET is active low and is held low during shutdown. RESET should be tied to a 10K or larger pullup to
OUTBUCK.
Open Drain output. Will pull low when VCHGIN > 4.5V. When this happens, depending on the status of the
USE_USB pin, the charge current will be reset to the default values (see Battery Charger and I2C Serial
Interface and Programmability section)
Step-down Buck converter (Core) switching node. Connect an inductor between this pin and the output.
Power Ground for step-down Buck converter (Core)
Input power for step-down Buck converter (Core). Must be tied to SYSOUT.
Feedback input for the step-down Buck converter (Core)
System Power output. Connect to the input voltage pins PIN, AVIN1/2 for the step-down converter and
LDOs and other external supply requirements.
Connect to a Lithium Ion battery.
Power input from either external adapter or USB port.
When pulled high, fast charge current is set to 100mA regardless of the resistor value present on the
ISET pin. Additionally, the CHGIN-SYSOUT LDO will be disabled and the BAT-SYSOUT load switch will be
enabled.
Active low enable for the battery charger (Internally pulled low when floating)
Battery Temperature Sense pin with 75μA output current. Connect the battery’s NTC resistor to this pin
and ground.
Charge current programming input pin (Tie a 1k to GND for maximum fast charge current). Can be used
to monitor charge current.
Charger Safety Timer Pin. A 0.1μF ceramic capacitor should be connected between this pin and GND. Connect directly to GND to disable the timer function.
Battery charging status pin output. Connected internally between GND and OUT1 (PowerDigital). Used to
monitor battery charge status.
I2C serial data pin, open drain; requires a pullup resistor.
I2C serial clock pin, open drain; requires a pullup resistor.
The exposed thermal pad (EP) must be connected to board ground plane and pins 16 and 21. The ground
plane should include a large exposed copper pad under the package for thermal dissipation (see package
outline).
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
3
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Pin Configuration
SCL
SDA
STAT
CT
ISET
TS
ENBAT
USE_USB
CHGIN
TQFN55-36
(Top View)
36
EN_TEST
EN_HOLD
EN_KEY
ON_KEY
EN2
EN3
EN4
EN5
OUT5
35
34
33
32
31
30
29
28
1
27
2
26
3
25
4
24
5
23
6
22
7
21
8
20
9
19
11
12
13
14
15
16
17
18
OUT4
AVIN2
OUT3
OUT2
AVIN1
OUT1
AGND
CNOISE
RESET
10
BAT
BAT
SYSOUT
SYSOUT
OUTBUCK
PVIN
PGND
LX
ADPP
4
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Absolute Maximum Ratings1
TA = 25°C unless otherwise noted.
Symbol
VIN
Power and logic pins
TA
TS
TLEAD
Description
Input Voltage, CHGIN, BAT
Maximum Rating
Operating Temperature Range
Storage Temperature Range
Maximum Soldering Temperature (at leads, 10 sec)
Value
Units
-0.3 to 6.5
VIN + 0.3
-40 to 85
-65 to 150
300
V
V
°C
°C
°C
Value
Units
25
4
°C/W
W
Recommended Operating Conditions2
Symbol
θJA
PD
Description
Thermal Resistance
Maximum Power Dissipation
1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions
specified is not implied.
2. Thermal Resistance was measured with the AAT2601 device on the 4-layer FR4 evaluation board in a thermal oven. The amount of power dissipation which will cause the
thermal shutdown to activate will depend on the ambient temperature and the PC board layout ability to dissipate the heat. See Figures 11-14. Measurements are also valid
for the AAT2601A device.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
5
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Electrical Characteristics1
VIN = 5V, VBAT = 3.6V, -40C ≤ TA ≤ +85C, unless noted otherwise. Typical values are TA = 25C.
Symbol
Description
Power Supply
CHGIN Input Voltage
VIN
IQ
Battery Standby Current
ISHDN
Battery Shutdown Current
Under-Voltage Lockout for CHGIN
UVLO
Battery Under-Voltage Lockout
IBAT
Leakage Current from BAT Pin
Startup Timers
RESET
Reset Timer
Charger Voltage Regulation
VBAT_REG
Output Charge Voltage Regulation
VMIN
Preconditioning Voltage Threshold
VRCH
Battery Recharge Voltage Threshold
Conditions
Min
Typ
Max
Units
6
V
μA
10.0
μA
4.5
Buck, LDO1 + LDO2, no load
EN_TEST, EN_HOLD, EN2, EN3, EN4,
EN5 = GND, EN_KEY floating
CHGIN rising
CHGIN falling
BAT rising
AAT2601
BAT falling
BAT rising
AAT2601A
BAT falling
VBAT = 4V, VCHGIN = 0V
Initiated when OUT1 = 90% of final value
0C ≤ TA ≤ +70C
(No trickle charge option available)
I2C Recharge Code = 00 (default)
I2C Recharge Code = 01
I2C Recharge Code = 10
I2C Recharge Code = 11
170
3.0
2.8
4.25
4.15
2.6
2.35
3.1
2.9
2
4.5
V
V
3.2
3.0
5
35
V
μA
ms
4.158
2.6
4.200
2.8
4.00
4.05
4.10
4.15
4.242
3.0
720
800
880
V
V
V
V
V
V
Charger Current Regulation
ICH_CC
KI_SET
ICH_PRE
Constant-Current Mode Charge Current
Charge Current Set Factor: ICH_CC/IISET
Preconditioning Charge Current
RISET = 1.24k (for 0.8A), USE_USB = Low,
I2C ISET code = 000, VBAT = 3.6V, VCHGIN =
5.0V
USE_USB = High, I2C ISET Code = 000,
VBAT = 3.6V
Constant Current Mode, VBAT = 3.6V
Charge Termination Threshold Current
Charging Devices
RDS(ON)
Charging Transistor ON Resistance
Logic Control / Protection
VEN_HOLD,
Input High Threshold
VEN_KEY,
Input Low Threshold
VEN_TEST
VADPP
Output Low Voltage
IADPP
Output Pin Current Sink Capability
VSTAT
Output High Voltage
ISTAT
Output Pin Current Source Capability
Over-Voltage Protection Threshold
VOVP
85
100
115
800
RISET = 1.24k, USE_USB = Low
12
IC
I2C
I2C
I2C
I2C
50
5
10
15
20
2
ICH_TERM
mA
ISET Code = 000, USE_USB = High
Term Code = 00 (default)
Term Code = 01
Term Code = 10
Term Code = 11
VIN = 5V
mA
%
ICH_CC
mA
%
ICH_CC
0.6
0.9
1.4
V
Pin Sinks 4mA
0.4
V
0.4
8
VOUT1
1.5
V
mA
V
mA
V
4.3
1. Specification over the –40°C to +85°C operating temperature range is assured by design, characterization and correlation with statistical process controls.
6
Ω
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Electrical Characteristics1
VIN = 5V, VBAT = 3.6V, -40C ≤ TA ≤ +85C, unless noted otherwise. Typical values are TA = 25C.
Symbol
Description
Logic Control / Protection (continued)
VOCP
Over Current Protection Threshold
TC
Constant Current Mode Time Out
TK
Trickle Charge Time Out
TV
Constant Voltage Mode Time Out
ITS
Current Source from TS Pin
TS1
TS Hot Temperature Fault
TS2
TS Cold Temperature Fault
TLOOP_IN
TLOOP_OUT
TREG
Load Switches /
RDS(ON),BAT-SYSOUT
RDS(ON),CHGIN-SYSOUT
Thermal Loop Entering Threshold
Thermal Loop Exiting Threshold
Thermal Loop Regulation
SYSOUT LDO
On-Resistance of BAT-SYSOUT
Load Switch
On-Resistance of CHGIN-SYSOUT
Load Switch
Sysout LDO Input Voltage Range
Sysout LDO Output Voltage
Conditions
Min
CCT = 100nF, VCHGIN = 5V
Falling Threshold
Hysteresis
Rising Threshold
Hysteresis
71
318
2.30
Typ
105
3
TC/8
3
75
331
25
2.39
25
115
85
100
Max
79
346
Units
%VCS
Hours
Hours
Hours
μA
mV
2.48
V
mV
°C
°C
°C
VBAT = 3.6V
100
150
mΩ
VCHGIN = 4.5V
0.5
0.75
Ω
3.4
3.9
4.2
V
1.71
1.80
1.89
V
5
%
4.5
ISYSOUT  900mA, VCHGIN = 4.5V ~ 6.0V
V
Step-Down Buck Converter (Core)
VOUT ≤ 2V
VOUTBUCK
Output Voltage Accuracy
VOUT > 2V
ILIMOUTBUCK
RDS(ON)L
RDS(ON)H
FOSC
TS
P-Channel Current Limit
High Side Switch On-Resistance
Low Side Switch On-Resistance
Oscillator Frequency
Start-Up Time
LDO1 (PowerDigital)
VOUT1
Output Voltage Accuracy
IOUT1
Output Current
Output Current Limit
ILIM1
VDO1
Dropout Voltage
VOUT1(VOUT1VIN1) Line Regulation
VOUT1
Load Regulation
PSRR
Power Supply Rejection Ratio
TS
Start Up Time
IOUTBUCK = 0 ~ 300mA;
VIN = 2.7V ~ 5.5V
IOUTBUCK = 0 ~ 300mA;
VIN = VOUTBUCK +1V ~ 5.5V
-5
TA = 25°C
From Enable to Regulation; COUTBUCK =
4.7μF, CNOISE = On
IOUT1 = 0~300mA, VAVINx = 3.3V ~ 5.5V
IOUT1 = 300mA
IOUT1 = 100mA, 3.3V < VAVINx < 5.5V
IOUT1 = 0.5mA ~ 150mA
IOUT1 = 10mA, COUT1=22μF, 100Hz ~ 10KHz
From Enable to Regulation; C OUT1 = 22μF,
CNOISE = On
0.8
0.8
0.8
1.5
A
Ω
Ω
MHz
100
μs
-3
300
+3
1000
150
0.07
40
60
300
175
%
mA
mA
mV
%/V
mV
dB
μs
1. Specification over the –40°C to +85°C operating temperature range is assured by design, characterization and correlation with statistical process controls.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
7
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Electrical Characteristics1
VIN = 5V, VBAT = 3.6V, -40C ≤ TA ≤ +85C, unless noted otherwise. Typical values are TA = 25C.
Symbol
Description
LDO2 (PowerAnalog)
VOUT2
Output Voltage Accuracy
IOUT2
Output Current
ILIM2
Output Current Limit
VDO2
Dropout Voltage
VOUT2/
Line Regulation
(VOUT2VIN2)
VOUT2
Load Regulation
PSRR
Power Supply Rejection Ratio
Ts
Start Up Time
LDO3 (TCXO), LDO4 (TX) and LDO5 (RX)
VOUTx
Output Voltage Accuracy
IOUTx
Output Current
ILIMx
Output Current Limit
VDOx
Dropout Voltage
VOUTx/
Line Regulation
(VOUTxVINx)
VOUTx
Load Regulation
PSRR
Power Supply Rejection Ratio
eN
Output Noise Voltage
Ts
Start Up Time
Logic Control
VIH
Enable Pin Logic High Level
Enable Pin Logic Low Level
VIL
Thermal
TSD
Over Temperature Shutdown Threshold
THYS
Over Temperature Shutdown Hysteresis
SCL, SDA (I2C Interface)
FSCL
Clock Frequency
TLOW
Clock Low Period
Clock High Period
THIGH
THD_STA
Hold Time START Condition
TSU_STA
Setup Time for Repeat START
TSU_DTA
Data Setup Time
TSU_STO
Setup Time for STOP Condition
Bus Free Time Between STOP and
TBUF
START Condition
VIL
Input Threshold Low
Input Threshold High
VIH
II
Input Current
VOL
Output Logic Low (SDA)
Conditions
Min
IOUT2 = 0 ~ 150mA, VAVINx: 3.3V ~ 5.5V
-3
150
Typ
Max
Units
+3
IOUT2 = 150mA
1000
150
%
mA
mA
mV
IOUT2 = 100mA, 3.3V<VAVINx<5.5V
0.07
%/V
40
60
mV
dB
65
μs
Load: 0.5mA~150mA
IOUT2 = 10mA, COUT2 = 4.7μF, 10 ~ 10KHz
From Enable to Regulation; COUT2 = 4.7μF,
CNOISE = On
IOUTX = 0 ~ 150mA, VAVINx = 3.3V ~ 5.5V
-3
150
IOUTX = 150mA
1000
150
%
mA
mA
mV
IOUTX = 100mA, 3.3V < VAVINx < 5.5V
0.07
%/V
40
60
40
mV
dB
μVrms
65
μs
IOUTX = 0.5mA ~ 150mA
IOUTX = 10mA, COUTx = 4.7μF, 10 ~ 10KHz
IOUTX = 10mA, Power BW: 10kHz ~ 100KHz
From Enable to Regulation; COUTX = 4.7μF,
CNOISE = On
For EN2, EN3, EN4 and EN5
+3
1.4
V
0.4
140
15
0
1.3
0.6
0.6
0.6
100
0.6
˚C
˚C
400
1.3
2.7V ≤ VIN ≤ 5.5V
2.7V ≤ VIN ≤ 5.5V
1.4
-1.0
IPULLUP = 3mA
0.4
1.0
0.4
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
KHz
μs
μs
μs
μs
ns
μs
μs
1. Specification over the –40°C to +85°C operating temperature range is assured by design, characterization and correlation with statistical process controls.
8
V
V
V
μA
V
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Basic I2C Timing Diagram
SDA
TSU_DAT
TLOW
THD_STA
TBUF
SCL
THD_STA
THD_DAT
THIGH
TSU_STA
TSU_STO
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
202179B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 19, 2013
9
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—Charger
Preconditioning Threshold Voltage
vs. Temperature
Preconditioning Charge Current vs. Temperature
(VBAT = 2.5V, RISET = 1.24kΩ)
2.810
115
2.808
2.802
VCHGIN = 5.5V
ICH_PRE (mA)
VMIN (V)
2.804
VCHGIN = 6.0V
2.800
2.798
2.796
VCHGIN = 5.0V
2.794
VCHGIN = 4.5V
105
100
95
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
90
85
2.792
2.790
-50
VCHGIN = 6.0V
110
2.806
-25
0
25
50
75
80
-50
100
-25
0
Temperature (°C)
(VRCH set to 4.0V)
4.24
4.04
4.23
VRCH (V)
4.03
VCHGIN = 6.0V
4.00
3.99
VCHGIN = 5.0V
VCHGIN = 4.5V
3.98
3.97
3.96
-50
-25
0
25
50
75
VBAT_REG (V)
4.25
4.05
VCHGIN = 5.5V
4.21
4.20
4.19
VCHGIN = 5.0V
4.18
4.16
100
-50
-25
800
50
40
-50
VCHGIN = 5.5V
600
VCHGIN = 5.0V
500
400
VCHGIN = 4.5V
300
100
-25
0
25
50
Temperature (°C)
10
100
200
VCHGIN = 4.5V
10
0
75
VCHGIN = 6.0V
700
VCHGIN = 6.0V
ICH (mA)
ICH_TERM (mA)
80
VCHGIN = 5.0V
50
(RISET = 1.24kΩ
Ω)
900
20
25
Charging Current vs. Battery Voltage
90
30
0
Temperature (°C)
100
60
VCHGIN = 4.5V
4.17
Charge Termination Threshold Current
vs. Temperature
VCHGIN = 5.5V
100
VCHGIN = 6.0V
VCHGIN = 5.5V
4.22
Temperature (°C)
70
75
Output Charge Voltage Regulation vs. Temperature
(End of Charge Voltage)
4.06
4.01
50
Temperature (°C)
Recharge Voltage Threshold vs. Temperature
4.02
25
75
100
0
2.5
2.9
3.3
3.7
4.1
Battery Voltage (V)
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4.5
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—Charger (continued)
Constant Current Mode Charge Current
vs. Input Voltage
Constant Current Mode Charge Current
vs. Temperature
(VBAT = 3.6V; RISET = 1.24kΩ
Ω)
900
VCHGIN = 6.0V
700
VCHGIN = 4.5V
880
860
ICH_CC (mA)
ICH_CC (mA)
800
(RISET = 1.24kΩ)
900
VCHGIN = 5.5V
600
VCHGIN = 5.0V
500
VBAT = 3.3V
820
800
780
VBAT = 3.6V
VBAT = 4.1V
760
740
400
300
840
720
700
-50
-25
0
25
50
Temperature (°C)
75
100
4.5
4.75
5
5.25
5.5
5.75
6
CHGIN Voltage (V)
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11
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—Step-Down Buck Converter
Step-Down Buck Load Regulation
vs. Output Current
Step-Down Buck Efficiency vs. Output Current
(VOUT = 1.8V; L = 3.3µH)
90
VBAT = 3.6V
Efficiency (%)
80
(VOUT = 1.8V; L = 3.3µH)
VBAT = 2.7V
0.5
Load Regulation (%)
100
VBAT = 4.2V
70
60
50
40
VCHGIN = 4.5V
VCHGIN = 5.5V
30
VCHGIN = 6.0V
20
VCHGIN = 5.0V
10
0
1
10
100
0.4
0.0
-0.1
VBAT = 2.7V
-0.2
-0.3
1
-0.2
-0.3
1.815
IOUT = 200mA
IOUT = 10mA
IOUT = 1mA
-0.4
-0.5
2.5
IOUT = 50mA
VBAT
3
4 4.2
3.5
VCHGIN
4.5
1000
VCHGIN = 5.0V
1.820
VOUT (V)
Line Regulation (%)
0
-0.1
100
(IOUT = 10mA)
IOUT = 300mA
0.1
10
1.825
0.5
IOUT = 0.01mA
VCHGIN = 5.0V
Step-Down Buck Output Voltage vs. Temperature
(VOUT = 1.8V; L = 3.3µH)
0.2
VBAT = 3.6V
-0.4
Output Current (mA)
Step-Down Buck Line Regulation
vs. CHGIN and Battery Input Voltage
0.3
VCHGIN = 6.0V
0.1
Output Current (mA)
0.4
VCHGIN = 5.5V
VBAT = 4.2V
0.2
-0.5
1000
VCHGIN = 4.5V
0.3
1.810
1.805
1.800
VBAT = 3.6V
VCHGIN = 5.5V
VBAT = 2.7V
VCHGIN = 4.5V
VCHGIN = 6.0V
1.795
1.790
IOUT = 100mA
1.785
5
1.780
-50
5.5
6
VBAT = 4.2V
-25
0
25
50
75
100
Temperature (°C)
Input VBAT, VCHGIN (V)
VBAT Line Transient Response Step-Down Buck
VCHGIN Line Transient Response Step-Down Buck
(VBAT = 3.5V to 4.2V; IOUT = 300mA; VOUT = 1.8V; COUT = 4.7µF)
(VCHGIN = 4.5V to 5.5V; IOUT = 300mA; VOUT = 1.8V; COUT = 4.7µF)
VO
1.80
1.76
4.5
4.0
VBAT
3.5
3.0
Time (100µs/div)
12
Output Voltage (top) (V)
Output Voltage (top) (V)
1.84
1.86
1.84
1.82
VO
1.80
1.78
6.0
1.76
5.5
VCHGIN
5.0
4.5
4.0
Time (100µs/div)
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Input Voltage (bottom) (V)
1.88
Input Voltage (bottom) (V)
1.92
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—Step-Down Buck Converter (continued)
(IOUTBUCK = 100mA to 300mA; VBAT = 3.6V;
VOUT = 1.8V; COUT = 4.7µF)
2.00
1.90
1.60
100
IO
50
0
Time (100µs/div)
2.00
1.90
VO
1.80
1.70
1.60
300
200
IO
100
Output Current
(bottom) (mA)
1.70
Output Current
(bottom) (mA)
VO
1.80
Output Voltage (top) (V)
Load Transient Response Step-Down Buck
(IOUTBUCK = 10mA to 100mA; VBAT = 3.6V;
VOUT = 1.8V; COUT = 4.7µF)
Output Voltage (top) (V)
Load Transient Response Step-Down Buck
0
Time (100µs/div)
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13
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—LDO1
LDO1 Load Regulation vs. Output Current
LDO1 Line Regulation vs. Battery
and CHGIN Input Voltage
(VOUT1 = 3.0V)
(VOUT1 = 3.0V)
0.8
Line Regulation (%)
Load Regulation (%)
1.0
0.6
0.4
0.2
VBAT = 4.2V
0.0
-0.2
-0.4
VBAT = 3.6V
-0.6
VBAT = 3.3V
-0.8
-1.0
0.1
1
10
0.05
0.03
0.01
-0.01
-0.03
-0.07
-0.09
-0.11
-0.13
100
VBAT
-0.15
3
1000
3.5
Output Current (mA)
VCHGIN
4.5
5
5.5
(VOUT1 = 3.0V)
3.10
3.002
3.000
2.998
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.1V
2.996
2.994
-25
0
25
50
75
Output Voltage VOUT1 (V)
3.004
3.05
3.00
IOUT = 1mA
IOUT = 50mA
IOUT = 100mA
IOUT = 150mA
IOUT = 200mA
IOUT = 250mA
IOUT = 300mA
2.95
2.90
2.85
2.80
100
3.0
3.1
3.2
Temperature (°C)
3.3
3.4
3.5
VBAT Line Transient Response LDO1
(VOUT1 = 3.0V)
(VBAT = 3.5V to 4.2V; IOUT1 = 300mA; VOUT1 = 3V)
Output Voltage (top) (V)
Dropout Voltage (mV)
3.02
180
160
140
120
100
80
60
-40°C
25°C
85°C
40
20
0
50
100
150
200
Output Current (mA)
250
3.01
VO
3.00
2.99
2.98
4.5
4.0
VBAT
3.5
3.0
300
Time (100µs/div)
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Input Voltage (bottom) (V)
200
14
3.6
Input Voltage (V)
LDO1 Dropout Voltage vs. Output Current
0
6
LDO1 Dropout Characteristics vs. Input Voltage
(IOUT1 = 10mA)
Output Voltage VOUT1 (V)
4.2
4
Input Voltage VBAT, VCHGIN (V)
LDO1 Output Voltage vs. Temperature
2.992
-50
IOUT = 0.01mA
IOUT = 1mA
IOUT = 10mA
IOUT = 50mA
IOUT = 100mA
IOUT = 200mA
IOUT = 300mA
-0.05
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—LDO1 (continued)
VCHGIN Line Transient Response LDO1
Load Transient Response LDO1
(VCHGIN = 4.5V to 5.5V; IOUT = 300mA; VOUT = 3V)
(IOUT1 = 10mA to 100mA; VBAT = 3.6V; VOUT1 = 3V)
3.00
2.99
2.98
6.0
5.5
5.0
VCHGIN
4.5
4.0
Time (100µs/div)
Output Voltage (top) (V)
VO
3.04
3.02
VO
3.00
2.98
2.96
100
IO
50
Output Current
(bottom) (mA)
Output Voltage (top) (V)
3.01
Input Voltage (bottom) (V)
3.02
0
Time (100µs/div)
Load Transient Response LDO1
(IOUT1 = 100mA to 300mA; VBAT = 3.6V; VOUT1 = 3V)
3.02
VO
3.00
2.98
2.96
300
200
IO
100
Output Current
(bottom) (mA)
Output Voltage (top) (V)
3.04
0
Time (100µs/div)
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15
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—LDO4
LDO4 Load Regulation vs. Output Current
LDO4 Load Regulation vs. Output Current
(VOUT4 = 3.0V)
(VOUT4 = 3.0V)
1.0
1.0
VCHGIN = 4.5V
VCHGIN = 5.0V
VCHGIN = 5.5V
VCHGIN = 6.0V
0.6
0.4
Load Regulation (%)
Load Regulation (%)
0.8
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
0.1
1
10
100
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.3V
VBAT = 3.1V
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
0.1
1000
1
Output Current (mA)
LDO4 Output Voltage vs. Temperature
100
1000
LDO4 Line Regulation vs. Battery
and CHGIN Input Voltage
(IOUT4 = 10mA)
(VOUT4 = 3.0V)
3.008
3.006
Line Regulation (%)
Output Voltage VOUT4 (V)
10
Output Current (mA)
3.004
3.002
3.000
VCHGIN = 6.0V
VCHGIN = 5.5V
VCHGIN = 5.0V
VCHGIN = 4.5V
VBAT = 4.2V
VBAT = 3.6V
VBAT = 3.1V
2.998
2.996
2.994
2.992
2.990
-50
-25
0
25
50
75
0.06
0.04
0.02
0
-0.02
-0.04
-0.08
-0.1
-0.12
-0.14
100
IOUT = 0.01mA
IOUT = 1mA
IOUT = 10mA
IOUT = 50mA
IOUT = 100mA
IOUT = 150mA
-0.06
VBAT
3
3.5
Temperature (°C)
4
4.2
VCHGIN
4.5
5
5.5
Input Voltage VBAT, VCHGIN (V)
LDO4 Dropout Characteristics vs. Input Voltage
LDO4 Dropout Voltage vs. Output Current
(VOUT4 = 3.0V)
(VOUT4 = 3.0V)
200
3.05
3.00
2.95
2.90
IOUT = 1mA
IOUT = 50mA
IOUT = 100mA
IOUT = 150mA
2.85
3.0
3.1
3.2
3.3
3.4
Input Voltage (V)
16
Dropout Voltage (mV)
Output Voltage (V)
3.10
2.80
6
3.5
3.6
180
160
140
120
100
80
60
-40°C
25°C
85°C
40
20
0
0
25
50
75
100
Output Current (mA)
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125
150
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—LDO4 (continued)
VBAT Line Transient Response LDO4
VCHGIN Line Transient Response LDO4
(VBAT = 3.5V to 4.2V; IOUT4 = 150mA; VOUT4 = 3V)
(VCHGIN = 4.5V to 5.5V; IOUT4 = 150mA; VOUT4 = 3V)
3.00
2.99
2.98
4.5
4.0
VBAT
3.5
3.0
Output Voltage (top) (V)
Output Voltage (top) (V)
VO
3.02
3.01
VO
3.00
2.99
6.0
2.98
5.5
4.5
4.0
Time (100µs/div)
Time (100µs/div)
Load Transient Response LDO4
(IOUT4 = 10mA to 75mA; VBAT = 3.6V;
VOUT4 = 3V; COUT = 4.7µF)
(IOUT4 = 75mA to 150mA; VBAT = 3.6V;
VOUT4 = 3V; COUT = 4.7µF)
3.04
3.02
2.98
2.96
100
IO
50
0
Time (100µs/div)
3.04
3.02
VO
3.00
2.98
2.96
150
IO
100
50
Output Current
(bottom) (mA)
VO
3.00
Output Voltage (top) (V)
Load Transient Response LDO4
Output Current
(bottom) (mA)
Output Voltage (top) (V)
5.0
VCHGIN
Input Voltage (bottom) (V)
3.01
Input Voltage (bottom) (V)
3.02
0
Time (100µs/div)
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17
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Typical Characteristics—General
Quiescent Current vs. Input Voltage
Start-up Sequence
(VOUT = 1.8V; L = 3.3µH)
(VCHGIN = 5.0V)
450
400
350
300
250
200
150
-40°C
25°C
85°C
100
50
0
VBAT
2.7
3.2
3.7
4.2
VCHGIN
4.7
5.2
Output Voltage (2V/div)
Quiescent Current (µA)
500
Buck
LDO1
LDO2
LDO3
LDO4
LDO5
5.7
Time (50µs/div)
LDO Output Voltage Noise
LDO Output Voltage Noise
(No Load; Power BW: 100~100KHz)
(IOUT3 = 10mA, Power BW = 100~100KHz)
6.00
6.00
5.40
5.40
4.80
4.80
Noise (µVRMS)
Noise (µVRMS)
Input VBAT, VCHGIN (V)
4.20
3.60
3.00
2.40
1.80
4.20
3.60
3.00
2.40
1.80
1.20
1.20
0.60
0.60
0.00
100
1000
10000
100000
Frequency (Hz)
0.00
100
1000
10000
Frequency (Hz)
LDO Power Supply Rejection Ratio, PSRR
(IOUT3 = 10mA, BW = 100~100KHz)
150
Magnitude (dB)
135
120
105
90
75
60
45
30
15
0
100
1000
10000
100000
Frequency (Hz)
18
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100000
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Functional Block Diagram
SYSOUT
SYSOUT
LDO
500mΩ
100 mΩ
CHGIN
BAT
ADPP
ENBAT
Charger
Control
USE_USB
STAT
ISET
TS
CT
Ref
RESET
SDA
SCL
PVIN
UVLO
EN_TEST
I 2C
and
Enable
Control
EN_HOLD
EN_KEY
ON_KEY
LX
VIN
BUCK
Ref
OUTBUCK
Enable
PGND
EN2
EN3
EN4
VIN
REF
CNOISE
EN5
AVIN2
AVIN1
VIN
Ref
LDO1
LDO2
Enable
VIN
Ref
LDO3
Enable
VIN
Ref
LDO4
Enable
VIN
Ref
LDO5
Enable
Ref
VIN
Enable
AGND
OUT1
The AAT2601 and AAT2601A are complete power management solutions which seamlessly integrate an intelligent, stand-alone CC/CV (Constant Current/Constant
Voltage), linear-mode single-cell battery charger with
one step-down Buck converter and five low-dropout
(LDO) regulators to provide power from either a wall
adapter or a single-cell Lithium Ion/Polymer battery.
OUT2
OUT3
OUT4
OUT5
Functional Description
Internal load switches allow the LDO regulators and
DC-DC converter to operate from the best available
power source of either an AC wall adapter, USB port supply or battery.
If only the battery is available, then the voltage regulators and converter are powered directly from the battery
through a 100mΩ load switch. (The charger is put into
sleep mode and draws less than 1μA quiescent current.)
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19
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
If the system is connected to a wall adapter, then the
voltage converters are powered directly from the adapter through a 500mΩ load switch and the battery is disconnected from the voltage converter inputs.
This
allows the system to operate regardless of the charging
state of the battery or with no battery.
System Output (SYSOUT)
Intelligent control of the integrated load switches is
managed by the switch control circuitry to allow the
Step-down converter and the LDOs to have the best
available power source. When the CHGIN pin voltage is
above 4.5V, the system automatically turns on and the
power to the SYSOUT pin will be provided by either the
CHGIN pin or the BAT pin. When the USE_USB pin is
low, the CHGIN provides power to SYSOUT through an
internal LDO regulated to 3.9V. When the USE_USB pin
is high or if forced through use of an I2C command, the
BAT pin is shorted to SYSOUT through a 100mohm
switch. If a CHGIN voltage is not present and the system is enabled, SYSOUT will be shorted to BAT.
This system allows the step-down converter and LDOs to
always have the best available source of power. This
also allows the voltage converters to operate with no
battery, or with a battery voltage that falls below the
precondition trickle charge threshold.
Typical Power Up Sequence
The AAT2601 and AAT2601A support a variety of pushbutton or enable/disable schemes. A typical startup and
shutdown process proceeds as follows (referring to
Figures 1 and 2): System startup is initiated whenever
one of the following conditions occurs:
1) A push-button is used to assert EN_KEY low.
2) A valid supply (>CHGIN UVLO) is connected to the
charger input CHGIN.
3) A hands free device or headset is connected, asserting EN_TEST high.
The startup sequence for the AAT2601 and AAT2601A
core (Buck and LDO1) is typically initiated by pulling the
EN_KEY pin low with a pushbutton switch as shown in
Figure 1. The Buck (Core) is the first block to be turned
on. When the output of the Buck reaches 90% of its
final value, then LDO1 is enabled. When LDO1
(PowerDigital) reaches 90% of its final value, the 65ms
RESET timer is initiated holding the microprocessor in
reset. When the RESET pin goes High, the μP can begin
a power up sequence. After the startup sequence has
20
commenced, LDO2 (PowerAnalog), LDO3 (TCXO), LDO4
(TX) and LDO5 (RX) can be enabled and disabled as
desired using their independent enable pins, even while
the Buck and LDO1 are still starting up. However, if they
are shut down, then LDO2, LDO3, LDO4, and LDO5 cannot be enabled. The μP must pull the EN_HOLD signal
high before the EN_KEY signal can be released by the
push-button. This procedure requires that the pushbutton be held until the μP assumes control of EN_HOLD,
providing protection against inadvertent momentary
assertions of the pushbutton. Once EN_HOLD is high the
startup sequence is complete. If the μP is unable to
complete its power-up routine successfully before the
user lets go of the push-button, the AAT2601 will automatically shut itself down. (EN_KEY and EN_HOLD are
OR’d internally to enable the two core converters.)
Alternatively, the startup sequence is automatically
started without the pushbutton switch when the CHGIN
pin rises above its UVLO threshold. The system cannot
be disabled until the voltage at the CHGIN pin drops
below the falling UVLO threshold. Thirdly, the EN_TEST
pin can be used to startup the device for test purposes
or for hands free operation such as when connecting a
headset to the system.
Typical Power Down Sequence
If only the battery is connected and the voltage level is
above the BAT UVLO , then the EN_KEY pin can be held
low in order to power down the AAT2601/AAT2601A. The
user can initiate a shutdown process by pressing the
push-button a second time. Upon detecting a second
assertion of EN_KEY (by depressing the push-button), the
AAT2601 asserts ON_KEY to interrupt the microprocessor
which initiates an interrupt service routine that the user
pressed the push-button. If EN_TEST and CHGIN are both
low, the microprocessor then initiates a power-down routine, the final step of which will be to de-assert EN_HOLD,
disabling LDO2, LDO3, LDO4, and LDO5.
When the voltage at the CHGIN pin is above the CHGIN
UVLO, the device cannot be powered down. If the voltage at the CHGIN pin is below the CHGIN UVLO, both the
EN_KEY and EN_HOLD pins must be held low in order to
power down the AAT2601/AAT2601A. If LDO2, LDO3,
LDO4, and LDO5 have not been disabled individually
prior to global power down, then they will be turned off
simultaneously with the Buck. The outputs of LDO4 and
LDO5 are internally pulled to ground with 10k during
shutdown to discharge the output capacitors and ensure
a fast turn-off response time.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
CHGIN
UVLO
Debounce
BAT
EN_KEY
Push-button
On Switch
Enable for
SYSOUT and
Regulators
OUT1
ON_KEY
Micro
EN_HOLD
Processor
μP
EN_BAT
Automatic
Tester or
Handsfree
Operation
Enable for
Battery Charger
EN_TEST
Figure 1: Enable Function Detailed Schematic.
Power Up Sequence
Power Down Sequence
300ms
debounce
delay
EN_KEY
ON_KEY
EN_HOLD must be held high
before EN _KEY can be released .
EN_HOLD
OUTBuck
(Core)
90% Regulation
OUT1
(PowerDigital)
90% Regulation
65ms
RESET
Figure 2: Typical Power Up/Down Sequence.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Battery Charger
Constant Current Mode Charge Current
Figure 3 illustrates the entire battery charging profile
which consists of three phases.
Trickle charge continues until the battery voltage reaches VMIN. At this point the battery charger begins constant-current charging. The current level default for this
mode is programmed using a resistor from the ISET pin
to ground. Once that resistor has been selected for the
default charge current, then the current can be adjusted
through I2C from a range of 40% to 180% of the programmed default charge current. Programmed current
can be set at a minimum of 100mA and up to a maximum of 1A. When the ADPP signal goes high, the default
I2C setting of 100% is reset. If the USE_USB signal is
high when this happens, the charge current is reset to
an internally set 100mA current until the microcontroller
sends another I2C signal to change the charge current.
(see I2C Programming section).
1.
2.
3.
Preconditioning Current Mode (Trickle) Charge
Constant Current Mode Charge
Constant Voltage Mode Charge
Battery charging commences only after the AAT2601/
AAT2601A's battery charger checks several conditions in
order to maintain a safe charging environment. The system operation flow chart for the battery charger operation is shown in Figure 4. The input supply must be
above the minimum operating voltage (UVLO) and the
enable pin (ENBAT) must be low (it is internally pulled
down). When the battery is connected to the BAT pin,
the battery charger checks the condition of the battery
and determines which charging mode to apply.
Constant Voltage Mode Charge
Preconditioning Current Mode
Charge Current
If the battery voltage is below the preconditioning voltage threshold VMIN, then the battery charger initiates
precondition trickle charge mode and charges the battery at 12% of the programmed constant-current magnitude. For example, if the programmed current is
500mA, then the trickle charge current will be 60mA.
Trickle charge is a safety precaution for a deeply discharged cell. It also reduces the power dissipation in the
internal series pass MOSFET when the input-output voltage differential is at its highest.
Constant current charging will continue until the battery
voltage reaches the Output Charge Voltage Regulation
point VBAT_REG. When the battery voltage reaches the regulation voltage (VBAT_REG), the battery charger will transition
to constant-voltage mode. VBAT_REG is factory programmed
to 4.2V (nominal). Charging in constant-voltage mode
will continue until the charge current has reduced to the
end of charge termination current programmed using the
I2C interface (5%, 10%, 15%, or 20%).
I (mA)
V (V)
Preconditioning
Trickle Charge
Phase
Constant Current
Charge Phase
Constant Voltage
Charge Phase
FAST-CHARGE to
TOP-OFF Charge
Threshold
Constant-Current Mode
Charge Current (ICH_CC)
Battery End of Charge
Voltage Regulation (VBAT_REG)
Charge Voltage
Preconditioning Threshold
Voltage (VMiN)
Charge Current
Preconditioning Charge
Current (ICH_PRE)
Charge Termination
Threshold Current
(ICH_TERM)
T (s)
Trickle Charge
Timeout
(TK)
Constant Current Timeout
(TC)
Constant Voltage Timeout
(TV)
Figure 3: Current vs. Voltage and Charger Time Profile.
22
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Enable
No
Power On Reset
Yes
Power Input
Voltage
VCHGIN > VUVLO
No
Expired
Yes
Shut Down
Yes
Fault
Conditions Monitoring
OV, OT,
VTS1 < VTS < V TS2
Charge Timer
Control
T < Timeout
No
Preconditioning
Test
VBAT < VMIN
Yes
Preconditioning
(Trickle Charge)
Yes
Constant
Current Charge
Mode
Thermal
Loop
Thermal
Loop
Current
Current
ReductionininADP
Reduction
C.C. ModeMode
Charging
No
No
Recharge Test
VBAT < VRCH
Yes
Current Phase Test
VBAT < VBAT_REG
Device Thermal
Loop Monitor
TJ > 115°C
No
Voltage Phase Test
ICH > ICH_TERM
No
Yes
Constant
Voltage Charge
Mode
No
Charge Completed
Figure 4: System Operation Flow Chart for the Battery Charger.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Power Saving Mode
After the charge cycle is complete, the battery charger
turns off the series pass device and automatically goes
into a power saving sleep mode. During this time, the
series pass device will block current in both directions to
prevent the battery from discharging through the battery
charger.
The battery charger will remain in sleep mode even if the
charger source is disconnected. It will come out of sleep
mode if either the battery terminal voltage drops below
the VRCH threshold, the charger EN pin is recycled, or the
charging source is reconnected. In all cases, the battery
charger will monitor all parameters and resume charging
in the most appropriate mode.
Temperature Sense (TS)
The TS pin is available to monitor the battery temperature. Connect a 10k NTC resistor from the TS pin to
ground. The TS pin outputs a 75μA constant current into
the resistor and monitors the voltage to ensure that the
battery temperature does not fall outside the limits
depending on the temperature coefficient of the resistor
used. When the voltage goes above 2.39V or goes below
0.331V, the charging current will be suspended.
in the internal timing control circuit. The constant current provided to charge the timing capacitor is very
small, and this pin is susceptible to noise and changes in
capacitance value. Therefore, the timing capacitor should
be physically located on the printed circuit board layout
as close as possible to the CT pin. Since the accuracy of
the internal timer is dominated by the capacitance value,
a 10% tolerance or better ceramic capacitor is recommended. Ceramic capacitor materials, such as X7R and
X5R types, are a good choice for this application.
Programming Charge Current (ISET)
The default constant current mode charge level is user
programmed with a set resistor placed between the ISET
pin and ground. The accuracy of the constant charge current, as well as the preconditioning trickle charge current, is dominated by the tolerance of the set resistor. For
this reason, a 1% tolerance metal film resistor is recommended for the set resistor function. The constant charge
current levels from 100mA to 1A may be set by selecting
the appropriate resistor value from Table 1 and Figure 5.
The ISET pin current to charging current ratio is 1 to 800.
It is regulated to 1.25V during constant current mode
unless changed using I2C commands. It can be used as a
charging current monitor, based on the equation:
Charge Safety Timer (CT)
While monitoring the charge cycle, the AAT2601/
AAT2601A utilizes a charge safety timer to help identify
damaged cells and to ensure that the cell is charged
safely. Operation is as follows: upon initiating a charging
cycle, the AAT2601/AAT2601A charges the cell at 12% of
the programmed maximum charge until VBAT >2.8V. If the
cell voltage fails to reach the preconditioning threshold of
2.8V (typ) before the safety timer expires, the cell is
assumed to be damaged and the charge cycle terminates.
If the cell voltage exceeds 2.8V prior to the expiration of
the timer, the charge cycle proceeds into fast charge.
There are three timeout periods: 1 hour for Trickle Charge
mode, 3 hours for Constant Current mode, and 3 hours
for Constant Voltage mode.
The CT pin is driven by a constant current source and will
provide a linear response to increases in the timing
capacitor value. Thus, if the timing capacitor were to be
doubled from the nominal 0.1μF value, the time-out
periods would be doubled. If the programmable watchdog timer function is not needed, it can be disabled by
terminating the CT pin to ground. The CT pin should not
be left floating or unterminated, as this will cause errors
24
ICH = 800 ⋅
⎛ VISET⎞
⎝ RISET⎠
During preconditioning charge, the ISET pin is regulated
to 12% of the fast charge current ISET voltage level
(Figure 5), but the equation stays the same. During constant voltage charge mode, the ISET pin voltage will
slew down and be directly proportional to the battery
current at all times.
Constant Charging
Current ICH_CC (mA)
Set Resistor
Value (kΩ)
100
200
300
400
500
600
700
800
900
1000
10
4.99
3.32
2.49
2
1.65
1.43
1.24
1.1
1
Table 1: Constant Current Charge vs.
ISET Resistor Value.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Constant Current Mode Charge Current
vs. ISET Resistor
ISET Voltage vs. Battery Voltage
(CHGIN = 5.0V, RISET = 1.24kΩ
Ω)
(VIN = 5V; VBAT = 3.6V)
1.4
1400
1.2
1
1000
VISET (V)
ICH_CC (mA)
1200
800
600
0.8
0.6
400
0.4
200
0.2
0
0.1
1
10
100
ISET Resistor (kΩ
Ω)
0
2.5
2.9
3.3
3.7
4.1
4.5
Battery Voltage (V)
Figure 5: Constant Current Mode Charge ICH_CC Setting vs. ISET Resistor
and ISET Voltage vs. Battery Voltage.
Reverse Battery Leakage
CHGIN Bypass Capacitor Selection
The AAT2601/AAT2601A includes internal circuitry that
eliminates the need for series blocking diodes, reducing
solution size and cost as well as dropout voltage relative
to conventional battery chargers. When the input supply
is removed or when CHGIN goes below the AAT2601’s
under voltage-lockout (UVLO) voltage, or when CHGIN
drops below VBAT, the AAT2601/AAT2601A automatically
reconfigures its power switches to minimize current
drain from the battery.
CHGIN is the power input for the AAT2601/AAT2601A battery charger. The battery charger is automatically enabled
whenever a valid voltage is present on CHGIN. In most
applications, CHGIN is connected to either a wall adapter
or USB port. Under normal operation, the input of the
charger will often be “hot-plugged” directly to a powered
USB or wall adapter cable, and supply voltage ringing and
overshoot may appear at the CHGIN pin. A high quality
capacitor connected from CHGIN to G, placed as close as
possible to the IC, is sufficient to absorb the energy. Walladapter powered applications provide flexibility in input
capacitor selection, but the USB specification presents
limitations to input capacitance selection. In order to meet
both the USB 2.0 and USB OTG (On The Go) specifications
while avoiding USB supply under-voltage conditions
resulting from the current limit slew rate (100mA/μs)
limitations of the USB bus, the CHGIN bypass capacitance
value must be between 1μF and 4.7μF. Ceramic capacitors
are often preferred for bypassing due to their small size
and good surge current ratings, but care must be taken in
applications that can encounter hot plug conditions as
their very low ESR, in combination with the inductance of
the cable, can create a high-Q filter that induces excessive
ringing at the CHGIN pin. This ringing can couple to the
output and be mistaken as loop instability, or the ringing
may be large enough to damage the input itself. Although
the CHGIN pin is designed for maximum robustness and
an absolute maximum voltage rating of +6.5V for tran-
Adapter Power Indicator (ADPP)
This is an open drain output which will pull low when
VCHGIN > 4.5V. When this happens, depending on the status of the USE_USB pin, the charge current will be reset
to the default ISET values or I2C programmed values.
Charge Status Output (STAT)
The AAT2601/AAT2601A provides battery charging status via a status pin. This pin is a buffered output with a
supply level up to the LDO1 output (PowerDigital). The
status pin can indicate the following conditions:
Event Description
STAT
No battery charging activity
Battery charging
Charging completed
Low (to GND)
High (to VOUT1)
Low (to GND)
Table 2: Charge Status Output (STAT).
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
sients, attention must be given to bypass techniques to
ensure safe operation. As a result, design of the CHGIN
bypass must take care to “de-Q” the filter. This can be
accomplished by connecting a 1Ω resistor in series with a
ceramic capacitor (as shown in Figure 6A), or by bypassing with a tantalum or electrolytic capacitor to utilize its
higher ESR to dampen the ringing (as shown in Figure 6A).
For additional protection, Zener diodes with 6V clamp voltages may also be used. In any case, it is always critical to
evaluate voltage transients at the CHGIN pin with an oscilloscope to ensure safe operation.
Thermal Considerations
The actual maximum charging current is a function of
charge adapter input voltage, the state of charge of the
battery at the moment of charge, the system supply current from SYSOUT, and the ambient temperature and the
thermal impedance of the package and printed circuit
board. The maximum programmable current may not be
achievable under all operating parameters. One issue to
consider is the amount of current being sourced to the
SYSOUT pin from the CHGIN LDO while the battery is
being charged.
The AAT2601 and AAT2601A are offered in a TQFN55-36
package which can provide up to 4W of power dissipation
when it is properly bonded to a printed circuit board and
has a maximum thermal resistance of 25°C/W. Many
considerations should be taken into account when
designing the printed circuit board layout, as well as the
placement of the charger IC package in proximity to
other heat generating devices in a given application
design. The ambient temperature around the charger IC
will also have an effect on the thermal limits of a battery
charging application. The maximum limits that can be
expected for a given ambient condition can be estimated
by the following discussion. First, the maximum power
dissipation for a given situation should be calculated:
PD(MAX) =
(TJ(MAX) - TA)
θJA
Where:
PD(MAX) = Maximum Power Dissipation (W)
θJA = Package Thermal Resistance (°C/W)
TJ(MAX) = Maximum Device Junction Temperature (°C)
[150°C]
TA = Ambient Temperature (°C)
CHGIN
To USB Port or
Wall Adapter
To USB Port or
Wall Adapter
1Ω
CHGIN
4.7μF
ESR > 1Ω
1μF Ceramic
(XR5/XR7)
(A)
(B)
Figure 6: Hot Plug Requirements.
26
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Next, the power dissipation for the charger can be calculated by the following equation:
PD = (VCHGIN - VBAT) · ICH_CC + (VCHGIN · IOP) + (VCHGIN - VSYSOUT) · ISYSOUT
+ (VSYSOUT - VOUT1) · IOUT1 + (VSYSOUT - VOUT2) · IOUT2
+ (VSYSOUT - VOUT3) · IOUT3 + (VSYSOUT - VOUT4) · IOUT4
+ (VSYSOUT - VOUT5) · IOUT5
VOUTBUCK RDS(ON)H · [VSYSOUT - VOUTBUCK]⎞
⎛
+ IOUTBUCK2 · RDS(ON)L · V
+
⎝
⎠
VSYSOUT
SYSOUT
Where:
PD = Total Power Dissipation by the Device
VCHGIN = CHGIN Input Voltage
VBAT = Battery Voltage at the BAT Pin
ICH_CC = Constant Charge Current Programmed for the
Application
IOP = Quiescent Current Consumed by the IC for Normal
Operation [0.5mA]
VSYSOUT and ISYSOUT = Output voltage and load current
from the SYSOUT pin for the system LDOs and stepdown converter [3.9V out for SYSOUT]
RDS(ON)H and RDS(ON)L = On-resistance of step-down high
and low side MOSFETs [0.8Ω each]
VOUTX and IOUTX = Output voltage and load currents for
the LDOs and step-down converter [3V out for each
LDO]
By substitution, we can derive the maximum charge current before reaching the thermal limit condition (TREG =
100°C, Thermal Loop Regulation). The maximum charge
current is the key factor when designing battery charger
applications.
ICH_CC(MAX) =
⎛(TREG - TA)
⎞
- (VCHGIN · IOP) - (VCHGIN - VSYSOUT) · ISYSOUT)
⎝
⎠
θJA
- [(VSYSOUT - VOUT1) · IOUT1] - (VSYSOUT - VOUT2) · IOUT2
- [(VSYSOUT - VOUT3) · IOUT3] - (VSYSOUT - VOUT4) · IOUT4
- (VSYSOUT - VOUT5) · IOUT5
VOUTBUCK
RDS(ON)H · (VSYSOUT - VOUTBUCK)⎞
⎛
- IOUTBUCK2 · RDS(ON)L · V
+
⎠
VSYSOUT
⎝
SYSOUT
VCHGIN - VBAT
In general, the worst condition is when there is the
greatest voltage drop across the charger, when battery
voltage is charged up to just past the preconditioning
voltage threshold and the LDOs and step-down converter are sourcing full output current.
For example, if 913mA is being sourced from the 3.9V
SYSOUT pin to the LDOs and Buck channels (300mA to
LDO1, 100mA to LDO2-5, and 213mA to the Buck; see
buck efficiency graph for 300mA output current) with a
CHGIN supply of 5V, and the battery is being charged at
3.0V with 800mA charge current, then the power dissipated will be 3.32W. A reduction in the charge current
(through I2C) may be necessary in addition to the reduction provided by the internal thermal loop of the charger
itself.
For the above example at TA = 30°C, the ICH_CC(MAX) =
546mA.
Thermal Overload Protection
The AAT2601 and AAT2601A integrate thermal overload
protection circuitry to prevent damage resulting from
excessive thermal stress that may be encountered under
fault conditions, for example. This circuitry disables all
regulators if the AAT2601/AAT2601A die temperature
exceeds 140°C, and prevents the regulators from being
enable until the die temperature drops by 15°C (typ).
Synchronous Step-Down
Converter (Buck)
The AAT2601 and AAT2601A contain a high performance
300mA, 1.5MHz synchronous step-down converter. The
step-down converter operates to ensure high efficiency
performance over all load conditions. It requires only
three external power components (CIN, COUT, and L). A
high DC gain error amplifier with internal compensation
controls the output. It provides excellent transient
response and load/line regulation. Transient response
time is typically less than 20μs. The converter has soft
start control to limit inrush current and transitions to
100% duty cycle at drop out.
The step-down converter input pin PVIN should be connected to the SYSOUT LDO output pin. The output voltage is internally fixed at 1.8V. Power devices are sized
for 300mA current capability while maintaining over
90% efficiency at full load.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Input/Output Capacitor and Inductor
Apart from the input capacitor that is shared with the LDO
inputs, only a small L-C filter is required at the output side
for the step-down converter to operate properly. Typically,
a 3.3μH inductor such as the Sumida CDRH2D11NP3R3NC and a 4.7μF ceramic output capacitor are recommended for low output voltage ripple and small component size. Ceramic capacitors with X5R or X7R dielectrics
are highly recommended because of their low ESR and
small temperature coefficients. A 10μF ceramic input
capacitor is sufficient for most applications.
Control Loop
The converter is a peak current mode step-down converter. The inner, wide bandwidth loop controls the
inductor peak current. The inductor current is sensed
through the P-channel MOSFET (high side) which is also
used for short circuit and overload protection. A fixed
slope compensation signal is added to the sensed current to maintain stability for duty cycles greater than
50%. The peak current mode loop appears as a voltage
programmed current source in parallel with the output
capacitor.
The output of the voltage error amplifier programs the
current mode loop for the necessary peak inductor current to force a constant output voltage for all load and
line conditions. The voltage feedback resistive divider is
internal and the error amplifier reference voltage is
0.45V. The voltage loop has a high DC gain making for
excellent DC load and line regulation. The internal voltage loop compensation is located at the output of the
transconductance voltage error amplifier.
Soft Start
Soft start slowly increases the internal reference voltage
when the input voltage or enable input is initially applied.
It limits the current surge seen at the input and eliminates output voltage overshoot.
Current Limit and
Over-Temperature Protection
For overload conditions the peak input current is limited.
As load impedance decreases and the output voltage
falls closer to zero, more power is dissipated internally,
28
raising the device temperature. Thermal protection completely disables switching when internal dissipation
becomes excessive, protecting the device from damage.
The junction over-temperature threshold is 140°C with
15°C of hysteresis.
Linear LDO Regulators (OUT1-5)
The advanced circuit design of the linear regulators has
been specifically optimized for very fast start-up and
shutdown timing. These proprietary LDOs are tailored for
superior transient response characteristics. These traits
are particularly important for applications which require
fast power supply timing.
There are two LDO input pins, AVIN1/2, which should be
connected to the SYSOUT LDO output pin. All LDO outputs
are initially fixed at 3.0V. The user can program the output
voltages for the LDOs to 2.8V, 2.85V, or 2.9V using I2C.
The high-speed turn-on capability is enabled through the
implementation of a fast start control circuit, which
accelerates the power up behavior of fundamental control and feedback circuits within the LDO regulator. For
LDO4 and LDO5, fast turn-off time response is achieved
by an active output pull down circuit, which is enabled
when the LDO regulator is placed in the shutdown mode.
This active fast shutdown circuit has no adverse effect on
normal device operation.
Input/Output Capacitors
The LDO regulator output has been specifically optimized
to function with low cost, low ESR ceramic capacitors.
However, the design will allow for operation over a wide
range of capacitor types. The input capacitor is shared
with all LDO inputs and the step-down converter. A 10μF
is sufficient. A 4.7μF ceramic output capacitor is recommended for LDO2-5 and a 22μF output capacitor for
LDO1.
Current Limit and
Over-Temperature Protection
The regulator comes with complete short circuit and
thermal protection. The combination of these two internal
protection circuits gives a comprehensive safety system
to guard against extreme adverse operating conditions.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
I2C Serial Interface
and Programmability
The timing diagram in Figure 7 depicts the transmission
protocol.
START and STOP Conditions
Serial Interface
Many of the features of the AAT2601/AAT2601A can be
controlled via the I2C serial interface. The I2C serial
interface is a widely used interface where it requires a
master to initiate all the communications with the slave
devices. The I2C protocol consists of 2 active wire SDA
(serial data line) and SCL (serial clock line). Both wires
are open drain and require an external pull up resistor
to VCC (SYSOUT may be used as VCC). The SDA pin
serves I/O function, and the SCL pin controls and references the I2C bus. I2C protocol is a bidirectional bus
which allows both read and write actions to take place,
but the AAT2601/AAT2601A supports the write protocol
only. Since the protocol has a dedicated bit for Read or
Write access (R/W), when communicating with the
AAT2601/AAT2601A, this bit must be set to “0”.
ACK from slave
START
MSB
Chip
Address
1
0
LSB
W
ACK MSB
START and STOP conditions are always generated by the
master. Prior to initiating a START condition, both the
SDA and SCL pin are idle mode (idle mode is when there
is no activity on the bus and SDA and SCL are pulled to
VCC via external resistor). As depicted in Figure 7, a
START condition is defined to be when the master pulls
the SDA line low and after a short period pulls the SCL
line low. A START condition acts as a signal to all ICs
that something is about to be transmitted on the BUS.
A STOP condition, also shown in Figure 7, is when the
master releases the bus and SCL changes from low to
high followed by SDA low to high transition. The master
does not issue an ACKNOWLEGE and releases the SCL
and SDA pins.
ACK from slave
Register
Address
LSB ACK MSB
ACK from slave
Data
LSB ACK STOP
SCL
SDA
0
1
1
0
0
0
including R/W bit,
Chip Address = 0x98
Figure 7: I2C Timing Diagram.
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Transferring Data
Every byte on the bus must be 8 bits long. A byte is
always sent with a most significant bit first (see Figure
8).
Acknowledge Bit
The acknowledge bit is the ninth bit of data. It is used
to send back a confirmation to the master that the
data has been received properly. For acknowledge to
take place, the MASTER must first release the SDA
line, then the SLAVE will pull the data line low as
shown in Figure 7.
R/W
LSB
MSB
The full 8-bit address including the R/W bit is 0x98
(hex) or 10011000 in binary.
Figure 8: Bit Order.
The address is embedded in the first seven bits of the
byte. The eighth bit is reserved for the direction of the
information flow for the next byte of information. For
the AAT2601/AAT2601A, this bit must be set to “0”.
Serial Programming Code
After sending the chip address, the master should send
an 8-bit data stream to select which register to program
and then the codes that the user wishes to enter.
Register 0x00:
Timer
RCHG1
RCHG0
CHG2
CHG1
CHG0
Term1
Term0
Not used
Not used
Not used
Not used
SYS
LDO11
LDO10
LDO50
LDO41
LDO40
LDO31
LDO30
LDO21
LDO20
Register 0x01:
Not used
Register 0x02:
LDO51
Figure 9: Serial Programming Register Codes.
USE_USB Pin
CHG2
CHG1
CHG0
1
0
0
0
0
0
0
0
X
X
X
X
X
X
X
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
Constant Current Charge
ICH_CC
100mA
(fixed internally)
800mA
(set by ISET resistor)
640mA
480mA
320mA
960mA
1120mA
1280mA
1440mA
Constant Current Charge as
% of ISET Current
(default)
100% (default)
80%
60%
40%
120%
140%
160%
180%
Table 3: CHG Bit Setting for the Constant Current Charge Level
(assuming ISET resistor is set to default 800mA charge current).
30
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Notes concerning the operation of the CHG2, CHG1 and
CHG0 bits or ISET code:
• Once the part is turned on using the EN_KEY pin (and
there is a BAT and/or CHGIN supply), and data is sent
through I2C, the I2C codes in the registers will always
be preserved until the part is shut down using the
EN_HOLD (going low) or if the BAT and CHGIN supply
are removed.
• If the part is turned on by connecting supply CHGIN
(and not through EN_KEY), then when the CHGIN is
removed, the part will shut down and all I2C registers
will be cleared.
If USE_USB = L:
• The charge current is set by the ISET code in Register
0x00, bits 2,3,4. (code 000 will equal 100%)
• If the part has been turned on by EN_KEY and CHGIN
is disconnected then reconnected, it will still contain
the code it had before (if it was 60% then it will
remain 60%).
• If the part has NOT been turned on by EN_KEY and
CHGIN is disconnected then reconnected, it will be
reset to 100% (since the whole part was shutdown).
If USE_USB = H:
• ISET Code 000 in Register 0x00, bits 2,3,4 = 100mA.
The other codes stay the same as if USE_USB=H.
• If the part has been turned on by EN_KEY and CHGIN
is disconnected then reconnected, the ISET code will
be forced to 000 and the current will be set to 100mA.
• The next time any I2C register is programmed (even if
it is not for the ISET code), the ISET code will revert
back to what it was before. For example, if the ISET
code is set to 010 and USE_USB=H and the part was
turned on with EN_KEY, then when CHGIN is disconnected then reconnected, the charger will be set to
100mA. Then if any other command is sent, the ISET
code will remain 010.
Term1
Term0
Termination Current (as % of Constant Current Charge)
0
0
1
1
0
1
0
1
5% (default)
10%
15%
20%
Table 4: Term Bit Setting for the Termination Current Level.
RCHG1
RCHG0
Recharge Threshold
0
0
1
1
0
1
0
1
4.00V (default)
4.05V
4.10V
4.15V
Table 5: RCHG Bit Setting for the Battery Charger Recharge Voltage Level.
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31
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Timer
Charger Watchdog Timer
0
1
ON (default)
OFF (and reset to zero)
Table 6: Timer Bit Setting for
the Charger Watchdog Timer.
LDO11
LDO10
LDO1 Output Voltage
0
0
1
1
0
1
0
1
3.00V (default)
2.90V
2.85V
2.80V
LDO21
LDO20
LDO2 Output Voltage
0
0
1
1
0
1
0
1
3.00V (default)
2.90V
2.85V
2.80V
LDO31
LDO30
LDO3 Output Voltage
0
0
1
1
0
1
0
1
3.00V (default)
2.90V
2.85V
2.80V
LDO41
LDO40
LDO4 Output Voltage
0
0
1
1
0
1
0
1
3.00V (default)
2.90V
2.85V
2.80V
LDO51
LDO50
LDO5 Output Voltage
0
0
1
1
0
1
0
1
3.00V (default)
2.90V
2.85V
2.80V
Table 7: LDO Bit Setting for
LDO Output Voltage Level.
SYS Bit
0
1
SYSOUT Power Source
Layout Guidance
Figure 10 is the schematic for the evaluation board. The
evaluation board has extra components for easy evaluation; the actual BOM need for a system is shown in Table
9. When laying out the PC board, the following layout
guideline should be followed to ensure proper operation
of the AAT2601/AAT2601A:
1.
2.
3.
4.
5.
6.
7.
The exposed pad EP must be reliably soldered to
PGND/AGND and multilayer GND. The exposed thermal pad should be connected to board ground plane
and pins 2 and 16. The ground plane should include
a large exposed copper pad under the package with
VIAs to all board layers for thermal dissipation.
The power traces, including GND traces, the LX
traces and the VIN trace should be kept short, direct
and wide to allow large current flow. The L1 connection to the LX pins should be as short as possible.
Use several via pads when routing between layers.
The input capacitors (C1 and C2) should be connected as close as possible to CHGIN (Pin 28) and
PGND (Pin 2) to get good power filtering.
Keep the switching node LX away from the sensitive
OUTBUCK feedback node.
The feedback trace for the OUTBUCK pin should be
separate from any power trace and connected as
closely as possible to the load point. Sensing along a
high current load trace will degrade DC load regulation.
The output capacitor C4 and L1 should be connected
as close as possible and there should not be any
signal lines under the inductor.
The resistance of the trace from the load return to
the PGND (Pin 2) should be kept to a minimum. This
will help to minimize any error in DC regulation due
to differences in the potential of the internal signal
ground and the power ground.
If USE_USB = H, SYSOUT powered from BAT
If USE_USB = L, SYSOUT powered from CHGIN
SYSOUT always powered from BAT
Table 8: SYS Bit Setting for SYSOUT Power Path.
32
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Quantity
Value
Designator
Footprint
Description
5
2
4
3
1
1
9
8
1
10μF
22μF
4.7μF
0.1μF
0.01μF
3.3μH
100K
10K
1.24K
C1, C2, C3, C14, C15
C9
C4, C5, C6, C7, C8
C10, C11, C12
C13
L1
R5, R8, R20, R21, R22, R23, R25, R26, R27
R17, R19, R24, R29, R31, R32, R33, R37
R18
0603
0805
0603
0402
0402
CDRH2D
0402
0402
0402
Capacitor, Ceramic, X5R, 6.3V, ±20%
Capacitor, Ceramic, 20%, 6.3V, X5R
Capacitor, Ceramic, 20%, 6.3V, X5R
Capacitor, Ceramic, 16V, 10%, X5R
Capacitor, Ceramic, 16V, 10%, X7R
Inductor, Sumida CDRH2D11NP-3R3NC
Resistor, 5%
Resistor, 5%
Resistor, 1%
Table 9: Minimum AAT2601/AAT2601A Bill of Materials.
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33
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
D1
R30
1K
J1
STA T
R32
BA T_I D
10K
R1 0
USE_USB
V DIG
PON_N
TP11
Sysout
1
3
5
7
9
11
13
15
17
19
21
23
25
LED GREEN
1
2
4
6
8
10
12
14
16
18
20
22
24
26
3
EXT PWR
VANA
A COK_N
VTCXO
J12
I NT/EXT PWR
2
J10
R31
RESET_N
1
2
3
4
10K
R33
TX _EN
PW R_HOLD
10K
SDA
SCL
GND
DA TA HEA DER
VCORE
V BATT
TP1
VB ATT
Header 13X2H
J11
TP2
CHGIN
CHG_EN
J3
V BATT
U1
3
2
CHGIN
28
1
C1
10μF
V B US/V CHG
R2
0
30
R3
0
29
R4
0
35
36
R6
0
3
2
1
VBATT
R7
DNP
VD IG
R5
100K
R8
J2
VTX
SDA
SCL
TCXO_EN
VRX
A NA_EN
100K
V BUS
VBA TT
V CHG
1
3
5
7
9
11
13
15
17
19
21
23
25
2
4
6
8
10
12
14
16
18
20
22
24
26
R9
0
R10
0
R12
0
R14
0
5
6
7
8
CHGIN
BAT
BAT
32
B AT_I D
SYSOUT
SYSOUT
A VIN1
A VIN2
PVI N
USE_USB
SDA
SCL
EN_KEY
EN_HOLD
EN_TEST
OUT1
OUT2
OUT3
OUT4
OUT5
LX
OUTBUCK
AAT2601/2601A
31
CT
ISET
ADPP
ON-KEY
RESET
STAT
TS
CNOISE
R28
PW R_ON
RX_EN
HF_PW R
4.75K
C10
0.1μF
Header 13X2H
Q1
CMPT3904
C11
0.1μF
R17
10K
TP10 Sysout
25
24
14
11
22
C12
0.1μF
R18
1.24K
AGND
PGND
EP
V DIG
R19
10K
VD IG
R20
100K
VDI G
R21
100K
J13
SW 1
15
13
12
10
9
20
23
PW R_ON
RX _EN
PW R_ON
TX _EN
1
2
3
RX _EN
BAT
V DIG
R24
10K
R25
100K
J17
HF_PW R
1
2
3
R26
100K
R27
100K
J19
USE_USB
PWR_HOLD
1
2
3
3.3μH
17
R11
0
ACOK _N
R13
0
PON_N
R15
0
RESET_N
R16
0
C4
4.7μF
C5
4.7μF
STAT
R29
10K
16
21
37
A COK_N
TP3
R37
10K
RESET_N
TP5
V DIG
VCORE
STA T_N
TP6
1
2
3
ANA _EN
TP8
GND
TP12
GND
J20
CHG_EN
USE_USB
TP7
GND
1
2
3
CHG_EN
Figure 10: AAT2601/AAT2601A Evaluation Kit Schematic.
34
VD IG
J9
OUT1
buckout
L1
CHGIN
J18
1
PWR_HOLD 2
3
HF_PW R
TCX O_EN
VANA
J8
OUT2
LX
19
4
18
34
J16
A NA_EN
V TCX O
J7
OUT3
10μF
OUT1
OUT2
OUT3
OUT4
OUT5
R23
100K
1
2
3
TX_EN
CHGIN
VTX
J6
OUT4
C2 10μF
10μF
(TBD)
C13
0.01μF
J15
TCX O_EN
VRX
J5
OUT5
V DIG
R22
100K
J14
1
2
3
J4
BUCK
C15
PON_N
TP4
BAT
C3
10μF
Sysout
R34 0
R35 0
R36 0
TP9
33
VCORE
BA T
C14
ENBAT
EN2
EN3
EN4
EN5
27
26
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C6
4.7μF
C7
4.7μF
C8
4.7μF
C9
22μF
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Figure 11: AAT2601/AAT2601A Evaluation Kit Top Layer.
Figure 12: AAT2601/AAT2601A Evaluation Kit Mid1 Layer.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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35
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Figure 13: AAT2601/AAT2601A Evaluation Kit Mid2 Layer.
Figure 14: AAT2601/AAT2601A Evaluation Kit Bottom Layer.
36
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DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Ordering Information
Package
Part Marking1
Part Number (Tape and Reel)2
TQFN55-36
TQFN55-36
TQFN55-36
XPXYY
Q3XYY
9AXYY
AAT2601IIH-T1
AAT2601AIIH-3.3-T1
AAT2601AIIH-T1
Skyworks Green™ products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of Green™, document number
SQ04-0074.
Packaging Information
TQFN55-364
R = 0.1
3.600 ± 0.050
5.000 ± 0.050
Index Area
(D/2 x E/2)
C = 0.3
5.000 ± 0.050
Detail "A"
3.600 ± 0.050
Bottom View
Top View
0.750 ± 0.050
0.450 ± 0.050
0.200 ± 0.050
0.203 REF
+ 0.050
0.000 - 0.000
Side View
0.40 BSC
Detail "A"
All dimensions in millimeters.
1. XYY = assembly and date code.
2. Sample stock is generally held on part numbers listed in BOLD.
3. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the lead terminals due to the manufacturing
process. A solder fillet at the exposed copper edge cannot be guaranteed and is not required to ensure a proper bottom solder connection.
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37
DATA SHEET
AAT2601/2601A
Total Power Solution for Portable Applications
Copyright © 2012, 2013 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a
service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no
responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR
PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES
NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM
THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper
use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product
design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for
identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
38
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