SMD EAST1010RGBA3 Features Package in 8mm tape on 7〞diameter reel Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow Solder process Full-color type Pb-free Component solderable surface finish is Gold RoHS compliant Description The EAST1010 SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Moreover, with its black PCB, the EAST1010 possess an ideal solution for high-contract and high-resolution indoor signage display. Applications Indoor signage display applications Indoor decorating and entertainment design Flat backlight for LCD, switch and symbol Indicator and backlighting for all consumer electronics Page 1 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Device Selection Guide Chip Materials Emitted Color AlGaInP Brilliant Red InGaN Brilliant Green InGaN Brilliant Blue Resin Color Surface Diffused Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Reverse Voltage VR V Forward Current IF Peak Forward Current (Duty 1/10 @1KHz) IFP Power Dissipation Pd Junction Temperature Operating Temperature Storage Temperature ESD (Classification acc. AEC Q101) Tj Topr Tstg 5 R6:10 GA:10 BD:10 R6:20 GA:20 BD:20 R6:24 GA:35 BD:35 100 -40 ~ +85 -40 ~ +90 ESDHBM R:2000 G:1000 B:1000 Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. Page 2 of 12 mA mA mW ℃ ℃ ℃ V Rev. 0.01 DATASHEET EAST1010RGBA3 Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Luminous Intensity Iv Viewing Angle 2θ1/2 Peak Wavelength Λp Dominant Wavelength Spectrum Radiation Bandwidth Λd Δλ Forward Voltage VF Reverse Current IR Min. R6 37.0 GA 120.0 BD 20.0 ----R6 GA ----BD R6 618.0 GA 513.0 BD 461.0 R6 GA ----BD R6 GA BD 1.7 2.5 2.5 ----- Typ. Max. ------------120 632 518 468 94.0 300.0 60.0 ----- mcd IF=10mA deg IF=10mA ----- nm IF=10mA 630.0 531.0 476.0 nm IF=10mA ----- nm IF=10mA V IF=10mA μA VR=5V ----- Unit Condition 20 25 25 2.0 3.3 3.3 ----- 2.35 3.7 3.7 10 Note: 1. Tolerance of Luminous Intensity: ±10% 2. Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V Page 3 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Floating Bin(R6) Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition RA RB RC RD RE 37 45 54 65 78 45 54 65 78 94 mcd IF =10mA Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition R1 R2 R3 R4 618.0 621.0 624.0 627.0 621.0 624.0 627.0 630.0 nm IF =10mA Bin Range of Dominant Voltage Bin Code Min. Max. Unit Condition R1 1.7 2.35 v IF =10mA Note: 1.Tolerance of Luminous Intensity: ±10% 2.Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V Page 4 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Floating Bin(GA) Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition GA GB GC GD GE 120 144 173 208 250 144 173 208 250 300 mcd IF =10mA Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition G1 G2 G3 G4 G5 G6 513.0 516.0 519.0 522.0 525.0 528.0 516.0 519.0 522.0 525.0 528.0 531.0 nm IF =10mA Bin Range of Dominant Voltage Bin Code Min. Max. Unit Condition G1 2.5 3.7 v IF =10mA Note: 1.Tolerance of Luminous Intensity: ±10% 2.Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V Page 5 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Floating Bin(BD) Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition BA BB BC BD BE BF 20 24 29 35 42 50 24 29 35 42 50 60 mcd IF =10mA Bin Range of Dominant Wavelength Bin Code Min. Max. Unit Condition B1 B2 B3 B4 B5 461.0 464.0 467.0 470.0 473.0 464.0 467.0 470.0 473.0 476.0 nm IF =10mA Bin Range of Dominant Voltage Bin Code Min. Max. Unit Condition B1 2.5 3.7 v IF =10mA Note: 1.Tolerance of Luminous Intensity: ±10% 2.Tolerance of Dominant Wavelength: ±1nm 3. Tolerance of Forward Voltage: ±0.1V Page 6 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Typical Electro-Optical Characteristics Curves Relative luminous intensity (%) Spectrum Distribution Radiation Diagram Ta=25°C 0° 10° 20° 30° Ta=25°C 100 GREEN RED BLUE 75 40° 1.0 50 25 0.9 50° 0.8 60° 70° 80° 90° 0.7 0 400 450 500 550 600 650 700 0.5 0.3 Wavelength λ (nm) 5 50 40 30 25 20 RED BLUE GREEN 10 0 1.6 Page 7 of 12 Forward Current Derating Curve Ta=25°C Relative luminous intensity Forward Current IF (mA) Forward Current vs. Forward Voltage 0.1 0.2 0.4 0.6 2.0 3.8 2.4 2.8 3.0 3.4 Forward Voltage VF (V) 4.2 4 3 RED BLUE 2 GREEN 1 0 0 20 40 60 80 100 Forward Current I FP (mA) Rev. 0.01 DATASHEET EAST1010RGBA3 Package Dimension Note: Tolerances unless mentioned ±0.1mm. Unit = mm Page 8 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Moisture Resistant Packing Materials Label Explanation ‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTQ: Packing Quantity ‧CAT: Luminous Intensity Rank ‧HUE: Dom. Wavelength Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number Reel Dimensions Page 9 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Carrier Tape Dimensions: The minimum quantity of packing is 10000 pcs per reel. The rest quantity which could not reach 10000 pcs per reel will goes to 4000 pcs per reel. Note: Tolerances unless mentioned ±0.1mm. Unit = mm Moisture Resistant Packing Process Label Aluminum moistue-proof bag Desiccant Label Note: Tolerances unless mentioned ±0.1mm. Unit = mm Page 10 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 Precautions for Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 168Hrs under 30℃ or less and 60% RH or less.If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 2.5 Before using LEDs, baking treatment should be implemented based on the following conditions: pre-curing at 60±5℃ for 24 hours or 125±5℃ for 3 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 260°C Max. 10sec. Max. Above255°C 30sec.Max. 3°C/sec.Max. 6°C/sec.Max. Pre-heating Above 217°C 60~150sec. 150~200°C 60~120sec. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. Page 11 of 12 Rev. 0.01 DATASHEET EAST1010RGBA3 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 6.Directions for use The LEDs should be operated with forward bias. The driving circuit must be designed so that the LEDs are not subjected to forward or reverse voltage while it is off. If reverse voltage is continuously applied to the LEDs, It may cause migration resulting in LED damage. Page 12 of 12 Rev. 0.01