Through Hole Lamp Product Data Sheet LTL17KSL5D-041A Spec No.: DS20-2012-0004 Effective Date: 02/07/2012 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Features * Lead (Pb) free product – RoHS compliant. * High luminous intensity output. * Low power consumption. * High efficiency. * Versatile mounting on P.C. Board or panel. * I.C. Compatible/low current requirement. * Popular T-1 diameter package. Package Dimensions Part No. Lens Source Color LTL17KSL5D-041A Yellow Diffused AlInGaP Yellow Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. 6. The LED lamp original is LTL17KSL5D. Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 1 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Absolute Maximum Ratings at TA=25°C Parameter Maximum Rating Unit 75 mW 60 mA Continuous Forward Current 30 mA Derating Linear From 50°C 0.66 mA/°C 5 V Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Reverse Voltage (IR =100 μA) Operating Temperature Range -40°C to + 80°C Storage Temperature Range -55°C to + 100°C Lead Soldering Temperature [2 mm(.0787") From Body] Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 260°C for 5 Seconds Max. Page : 2 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Electrical / Optical Characteristics Parameter at TA=25°C Symbol Min. Typ. Max. Unit IV 180 400 880 mcd 2θ1/2 - 50 - deg Peak Emission Wavelength λP - 588 - nm Dominant Wavelength λd 584 587 596 nm Δλ - 15 - nm Forward Voltage VF - 2.0 2.4 V Reverse Current IR - - 100 μA Capacitance C - 40 - pF Luminous Intensity Viewing Angle Spectral Line Half-Width Test Condition IF = 20mA Note 1 Note 2 (Fig.5) Measurement @Peak (Fig.1) Note 4 IF = 20mA VR = 5V VF= 0 , f = 1MHz NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. Iv classification code is marked on each packing bag. 4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 3 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Typical Electrical / Optical Characteristics (25°C Ambient Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Temperature Unless Otherwise Curves Noted) Page : 4 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Features * Compatible with radial lead automatic insertion equipment. * Most radial lead plastic lead lamps available packaged in tape and reel. * 5mm (0.197") formed lead spacing available. * Reel packaging simplifies handling and testing. * Ammo packing series lamp type 24 LED+GAP. Package Dimensions Specification Item Symbol Minimum Maximum mm inch mm inch Tape Feed Hole Diameter D 3.8 0.149 4.2 0.165 Component Lead Pitch F 4.8 0.188 5.8 0.228 Front to Rear Deflection △H -- -- 2.0 0.078 Height of Seating Plane H 15.5 0.610 16.5 0.649 Feed Hole to Bottom of Component H1 21.5 0.846 23.5 0.925 Feed Hole to Overall Component Height H2 26.6 1.047 29.2 1.149 11.0 0.433 Lead Length After Component Height L Feed Hole Pitch P 12.4 0.488 13.0 0.511 Lead Location P1 3.15 0.124 4.55 0.179 Center of Component Location P2 5.05 0.198 7.65 0.301 Total Taped Thickness T -- -- 0.90 0.035 Feed Hole Location W0 8.5 0.334 9.75 0.384 Adhesive Tape Width W1 14.5 0.571 15.5 0.610 Adhesive Tape Position W2 0 0 3.0 0.118 Tape Width W3 17.5 0.689 19.0 0.748 Part No. : LTL17KSL5D-041A BNS-OD-C131/A W0 Page : 5 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Packing Spec 3,000 pcs per inner carton 10 Inner cartons per outer carton, total 30,000 pcs per outer carton In every shipping lot, only the last pack will be non-full packing Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 6 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Bin Table Specification Luminous Intensity Unit : mcd @20mA Bin Code Min. Max. HJ 180 310 KL 310 520 MN 520 880 Note: Tolerance of each bin limit is ±15% Dominant Wavelength Unit : nm @20mA Bin Code Min. Max. H15 584.0 586.0 H16 586.0 588.0 H17 588.0 590.0 H18 590.0 592.0 H19 592.0 594.0 H20 594.0 596.0 Note: Tolerance of each bin limit is ±1nm Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 7 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only CAUTIONS 1. Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. Storage The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary. 4. Lead Forming & Assembly During lead forming, the leads should be bent at a point at least 1.6mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress. 5. Soldering When soldering, For Lamp without stopper type and must be leave a minimum of 2mm clearance from the base of the lens to the soldering point. To avoided the Epoxy climb up on lead frame and was impact to non-soldering problem, Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 120°C Max. 60 sec. Max. 260°C Max. 5 sec. Max. Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED. IR re-flow is not suitable process for through-hole type LED lamp production. Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 8 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only 6. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A Circuit model B LED LED (A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs 7. ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti- electrostatic glove when handling these LEDs All devices, equipment, and machinery must be properly grounded Work tables, storage racks, etc. should be properly grounded Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of friction between LEDs during storage and handing ESD-damaged Leeds will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “no light up” at low currents. To verify for ESD damage, check for “light up” and Vf of the suspect LEDs at low currents. The Vf of “good” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product. Chip ESD level Machine Model Human Body Model InGaN / Sapphire 100 V 300 V AlInGaP 200 V 500 V InGaN / SiC 600 V 1000 V Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 9 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only Suggested checking list : Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DSL? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for Blue LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycle? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 10 of 11 LITE-ON TECHNOLOGY CORPORATION. Property of Lite-On Only 8. Reliability Test Classification Test Item Operation Life Endurance Test Test Condition Ta= Under room temperature as per data sheet maximum rating. *Test Time= 1000HRS (-24HRS,+72HRS) Reference Standard MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) High Temperature High Humidity Storage Ta= 65±5°C RH= 90 ～ 95% High Temperature Storage Ta= 105±5°C *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) Low Temperature Storage Ta= -55±5°C *Test Time=1000HRS (-24HRS,+72HRS) JIS C 7021:B-12 (1982) Temperature Cycling 105°C ～ 25°C ～ -55°C ～ 25°C 30mins 5mins 30mins 5mins 10 Cycles MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021: A-4(1982) Thermal Shock 105 ± 5°C ～ -55°C ± 5°C 10mins 10mins 10 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Solder Resistance T.sol = 260 °C Max. Dwell Time= 5secs Max. MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021: A-1(1982) T. sol = 230 ± 5°C Dwell Time= 5 ± 1secs MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) JIS C 7021: A-2(1982) Environmental Test Solderability Test Time= 240HRS±2HRS MIL-STD-202F: 103B(1980) JIS C 7021 : B-11(1982) 9. Others The appearance and specifications of the product may be modified for improvement, without prior notice. Part No. : LTL17KSL5D-041A BNS-OD-C131/A4 Page : 11 of 11