CO LO & MP LI GE AN N T FR EE *R oH S ** HA Features Applications n Surface mount packaging for automated n Thermal protection for Li-ion and polymer n n Game consoles n n *R oH S CO M PL IA N T n assembly Small footprint size (1210) and low profile for space-constrained mobile applications Ultra-low resistance RoHS compliant* and halogen free** Agency recognition: battery packs n PC motherboards n USB port protection - USB 2.0, 3.0 & OTG n Mobile phones n Digital cameras MF-USML Series - Low Ohmic PTC Resettable Fuses 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 I max. Amps 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 Ihold Itrip Amperes at 23 °C Hold Trip 1.75 3.50 1.90 4.90 2.00 4.00 2.30 4.60 2.50 5.00 2.70 5.40 3.00 6.00 3.50 7.00 3.80 8.00 4.00 8.00 4.50 9.00 5.00 10.00 6.00 12.00 6.50 13.00 7.00 14.00 Resistance Ohms at 23 °C RMin. R1Max. 0.0060 0.0400 0.0060 0.0300 0.0050 0.0240 0.0045 0.0240 0.0045 0.0220 0.0040 0.0200 0.0040 0.0180 0.0030 0.0180 0.0020 0.0160 0.0015 0.0155 0.0010 0.0150 0.0010 0.0145 0.0010 0.0140 0.0010 0.0140 0.0010 0.0135 Ro VE LEA HS RS D CO ION FRE M SA E PL R IA E NT * MF-USML175 MF-USML190 MF-USML200 MF-USML230 MF-USML250 MF-USML270 MF-USML300 MF-USML350 MF-USML380 MF-USML400*** MF-USML450*** MF-USML500*** MF-USML600*** MF-USML650*** MF-USML700*** V max. Volts LE AD Model FR EE Electrical Characteristics Max. Time To Trip Amperes at 23 °C Seconds at 23 °C 8.00 9.50 8.00 8.00 8.00 8.00 8.00 17.50 19.00 20.00 22.50 25.00 30.00 32.50 35.00 2.50 3.00 3.00 3.50 3.50 4.00 4.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 2.00 Tripped Power Dissipation Watts at 23 °C Typ. 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 0.8 *** TÜV approval pending. Environmental Characteristics Operating Temperature.......................................... -40 °C to +85 °C Passive Aging........................................................ +85 °C, 1000 hours................................................ ±10 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours................................ ±15 % typical resistance change Thermal Shock...................................................... +85 °C to -40 °C, 20 times..................................... ±30 % typical resistance change Solvent Resistance................................................ MIL-STD-202, Method 215.................................... No change Vibration................................................................ MIL-STD-883C, Method 2007.1,............................ No change Condition A Test Procedures And Requirements For Model MF-USML Series Test Test Conditions Accept/Reject Criteria Visual/Mech........................................................... Verify dimensions and materials............................ Per MF physical description Resistance............................................................. In still air @ 23 °C.................................................. Rmin ≤ R ≤ R1max Time to Trip............................................................ At specified current, Vmax, 23 °C.......................... T ≤ max. time to trip (seconds) Hold Current.......................................................... 30 min. at Ihold...................................................... No trip Trip Cycle Life........................................................ Vmax, Imax, 100 cycles......................................... No arcing or burning Trip Endurance...................................................... Vmax, 48 hours...................................................... No arcing or burning Solderability........................................................... ANSI/J-STD-002.................................................... 95 % min. coverage cUL File Number.................................................... E174545 http://www.ul.com/ Follow link to Certifications, then cUL File No., enter E174545 TÜV Certificate Number........................................ R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USML Series - Low Ohmic PTC Resettable Fuses Product Dimensions Model MF-USML175 MF-USML190 MF-USML200 MF-USML230 MF-USML250 MF-USML270 MF-USML300 MF-USML350 MF-USML380 MF-USML400 MF-USML450 MF-USML500 MF-USML600 MF-USML650 MF-USML700 Min. A Max. Min. 3.00 (0.118) 3.43 (0.135) 3.00 (0.118) 3.43 (0.135) B Max. D Min. Min. 0.30 (0.012) 0.60 (0.024) 0.25 (0.010) 0.05 (0.002) 0.45 (0.018) 0.60 (0.024) 1.20 (0.047) 0.25 (0.010) 0.05 (0.002) 0.45 (0.018) Max. Min. 2.35 (0.093) 2.80 (0.110) 2.35 (0.093) 2.80 (0.110) C Packaging: MF-USML175~MF-USML400 = 5000 pcs. per reel MF-USML450~MF-USML700 = 3500 pcs. per reel Side View Top View A C Max. DIMENSIONS: Bottom View D E Recommended Pad Layout E 1.0 ± 0.05 (.039 ± .002) 1.0 ± 0.05 (.039 ± .002) 2.5 ± 0.1 (.098 ± .004) B 2.0 ± 0.1 (.079 ± .004) MM (INCHES) Terminal material: ENIG-plated terminals (Tin-plated terminals available upon request). Termination pad solderability: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. Thermal Derating Chart - Ihold (Amps) Model MF-USML175 MF-USML190 MF-USML200 MF-USML230 MF-USML250 MF-USML270 MF-USML300 MF-USML350 MF-USML380 MF-USML400 MF-USML450 MF-USML500 MF-USML600 MF-USML650 MF-USML700 -40 °C 2.57 2.89 3.26 3.55 3.70 3.98 4.41 5.00 6.00 5.71 6.62 7.35 8.82 9.56 10.29 -20 °C 2.33 2.58 2.87 3.17 3.35 3.60 3.99 4.60 5.28 5.26 5.99 6.60 7.98 8.65 9.31 0 °C 2.07 2.25 2.50 2.78 2.95 3.18 3.54 4.05 4.52 4.63 5.31 5.90 7.08 7.67 8.26 Ambient Operating Temperature 23 °C 40 °C 50 °C 1.75 1.49 1.34 1.90 1.54 1.36 2.00 1.70 1.48 2.30 1.94 1.72 2.50 2.10 1.90 2.70 2.28 2.03 3.00 2.55 2.30 3.50 2.80 2.40 3.80 3.15 2.65 4.00 3.20 2.70 4.50 3.83 3.50 5.00 4.25 3.88 6.00 5.10 4.66 6.50 5.53 5.05 7.00 5.96 5.44 60 °C 1.24 1.21 1.29 1.55 1.75 1.90 2.13 2.00 2.39 2.29 3.20 3.55 4.26 4.62 4.97 70 °C 1.00 0.94 1.09 1.27 1.40 1.52 1.71 1.60 2.09 2.00 2.57 2.85 3.43 3.71 3.99 85 °C 0.91 0.77 0.78 1.06 1.30 1.40 1.56 1.00 1.60 1.37 2.34 2.60 3.12 3.38 3.64 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USML Series - Low Ohmic PTC Resettable Fuses Solder Reflow Recommendations Notes: tp TP • CRITICAL ZONE T L TO TP RAMP-UP • TL Temperature tL • TS MAX. RAMP-DOWN TS MIN. • • ts PREHEAT • 25 MF-USML models cannot be wave soldered or hand soldered. Please contact Bourns for soldering recommendations. All temperatures refer to topside of the package, measured on the package body surface. If reflow temperatures exceed the recommended profile, devices may not meet the published specifications. Compatible with Pb and Pb-free solder reflow profiles. Excess solder may cause a short circuit, especially during hand soldering. Please refer to the Multifuse® Polymer PTC Soldering Recommendation guidelines. Designed for single solder reflow operations. 8 MINS. t 25 *C TO PEAK Time Profile Feature Average Ramp-Up Rate (TSmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (TSmin) Temperature Max. (TSmax) Time (tsmin to tsmax) Process TIME MAINTAINED ABOVE: Materials Description Temperature (TL) 1. Apply solder • Sn 96.5 / Ag 3.0 / Cu 0.5 Time (tLpaste ) to 150 °C 200 °C 60~180 seconds Temperature Room temperature Alloy water soluble or no clean solder paste Peak / Classification Temperature (TP) (see note 1) • single sided epoxy glass (tp) Time within 5 °C of Actual Peak Temperature (G10) (UL approved) Ramp-Down Rate • PC board approx. 4x4x.06 in. test board (8 - 10 mil thick) 2. Time Place test units 25 onto°C board 6 units/board within to Peak Temperature 3. Ramp up Convection oven 4. Preheat (TS) 5. Time above liquidus (TL) How to Order 6. Peak temperature (TP) MF - USML 175 - 2 Multifuse Product 7. Ramp down Designator Series 8. Cleaning clean profile High pressure deionized USMLwater = 1210 Low-Ohmic water 65 PSI max. Surface Mount Component Hold Current, Ihold 175 - 700 (1.75 - 7.00 Amps) Packaging Temperature of Lead/Pad Junction Packaged per EIA 481-1 -2 =using Tape6-zone and Reel (Derived Convection Oven) ® Pb-Free Assembly (see note 2) Inspect solder joint to determine if solder joint is acceptable (i.e. exhibits wetting of joint’s surface). 217 °C Use the following criteria (ref. acceptability of printed board assemblies, IPC-A-610): 60~150 seconds Time Interval 260 °C A) Acceptable (see Figure 1) (1) The solder connection wetting angle (solder to 20~40 secondscomponent and solder to PCB termination) does not exceed 90 °. 6 °C / second max. (2) Solder balls that do not violate minimum 8 minutes max.electrical clearances and are attached (soldered) to a metal surface. 2.5 °C ± 0.5 °/sec. B) Unacceptable (see Figure 2) 90 ± 30 sec. 150 °C to 190 °C (1) Solder connection wetting angle exceeding 220 °Typical C 0-90 sec. Part 6Marking 90 °. 250 °C +0 °/-5 ° (2) Incomplete reflow of solder paste. Represents total content. Layout may vary. 10-20 sec. within Asia-Pacific: 5 °C of peak (3) Dewetting. PART IDENTIFICATION: Tel: +886-2 2562-4117 Room temperature 3 °CMF-USML175 ± 0.5 °C/se=cU17 . If unacceptable, determine cause and correct prior to Email: [email protected] (see note 2) MF-USML190 = U19 next run. MF-USML200 = U20 72 °F to 160 °F As required Europe: MF-USML230 = U23 NOTES: MF-USML250 = U25 (22 °C to 71 °C) Tel: +36 88 520 390 above 100K. U30 MF-USML270 = U27 1. Water soluble solder paste only MF-USML300 MF-USML350 MF-USML380 MF-USML400 MF-USML450 MF-USML500 MF-USML600 MF-USML650 MF-USML700 = U30 = U35 = U38 = U40 = U45 = U50 = U60 = U65 = U70 Email: [email protected] 2. Refer to ref. temperature profile. Temperature at lead/pad junction with “K” type thermocouple. The Americas: 3. Units that are board mounted for environmental Tel: +1-951 781-5500 testing must see a peak temperature in the reflow Email: [email protected] zone, as specified. This is to ensure that all test units will see “worst case conditions”. www.bourns.com 4. Ramp down rate to be measured from 245 °C to °C. MANUFACTURING DATE CODE IS 150 LOCATED ON PACKING LABEL. 5. Process Description 8 does not apply to open frame trimmers. MF-USML SERIES, REV. F, 05/17 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-USML Series - Low Ohmic PTC Resettable Fuses MF-USML Series per EIA 481-2 12.0 ± 0.3 (0.472 ± 0.012) 4.0 ± 0.1 (0.157 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 2.9 ± 0.10 (0.114 ± 0.004) 3.50 ± 0.10 (0.138 ± 0.004) 4.5 (0.177) 1.5 + 0.1/-0.0 (0.059 + 0.004/-0) 5.5 ± 0.05 (0.216 + 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 10.25 (0.404) 0.6 (0.024) 0.1 (0.004) 0.65 ± 0.10 (0.026 ± 0.004) 1.10 ± 0.10 (0.043 ± 0.004) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 typ. T max. T1 max. K0 (MF-USML175~MF-USML400) K0 (MF-USML450~MF-USML700) Leader min. Trailer min. Reel Dimensions 185 (7.283) 50 (1.97) 12.4 + 1/-0 (0.488 + 0.039/-0) 15.4 (0.606) A max. N min. W1 W2 max. DIMENSIONS: T D0 P2 P0 E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 A0 P1 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. W1(MEASURED AT HUB) MM (INCHES)