MN101E04G Type MN101E04G ROM (×× 16-bit) 128 K RAM (×× 16-bit) 4K Package QFP084-P-1818E *Lead-free Minimum Instruction Execution Time 100 ns (at 3.135 V to 3.465 V, normal-mode) Interrupts External (5 lines) Internal (13 lines) : Timer × 4, A/D × 1, RESET × 1, OSD × 1, Serial × 2, I2C × 1, Caption × 1, Remote control × 1, HSYNC× 1, VSYNC× 1 Timer Counter 8-bit timer × 4 Watchdog timer: Serial Interface I2C × 1: for multimaster mode, bus line (output) has 2 systems Sync serial / UART × 1 Caption/Teletext Decoder I/O Pins I/O Time-out period is selectable. • Built-in sync separator × 1 30 • Common use A/D Inputs PWM 10-bit × 8-ch. (with S/H) Special Ports Remote control reception CRTC 1-layer display (graphics, characters, splits) Notes Remote control input discriminant circuit built-in, build-in NTSC/PAL/SECAM video signal processing circuit, built-in 3-line comb filter (NTSC) built-in adaptive 2-line comb filter (PAL) 8-bit × 4-ch. , 14-bit × 1-ch. MAD00042CEM MN101E04G VDD(VPP)*2 P07,ADIN7,VDAF P06,ADIN6,HDAF P05,ADIN5 DVDD DVSS P04,ADIN4 P03,ADIN3 P02,ADIN2 P01,ADIN1 P00,ADIN0 MMOD OSC2 OSC1 PDO VCOI AVDD AVSS BOUT SIREF SCOMP 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 Pin Assignment P10,RMIN,IRQ0 64 42 GOUT *1 P11,SDA0 65 41 ROUT *1 P12,SCL0 66 40 VIREF *1 P13,PWM 67 39 VCOMP P14,VOUT0 68 38 VMOUT P15,SBT0 69 37 AVDD P16,SBD0 70 36 FBPIN P17,SBO0 71 35 AVSS *1 P20,SDA1 72 34 EW *1 P21,SCL1 73 33 VOUT *1 P22,PWM0 74 32 AVDD P23,PWM1 75 31 FSCOUT P24,PWM2 76 30 FSCIN DVDD 77 29 FPCO DVSS 78 28 AVSS P25,SYSCLK 79 27 FVCOI *1 P26,TM0IO 80 26 HOUT *1 P27,TM1IO 81 25 HDOWN P30,NRST 82 24 EHTIN P31,IRQ1 83 23 BEAMIN P32,IRQ2 84 22 ABLIN 8 9 10 11 12 13 14 15 16 17 18 19 20 21 PIPUIN AVDD AVSS VREFH VREFM MCOMPIN VREFL MSCIN CREFH MVIN CLH MUIN CLL CREFL 5 PIPYS 7 4 P36,PWM4 PIPVIN 3 VSYNC 6 2 P34,IRQ4 PIPYIN 1 P33,IRQ3 MN101E04G QFP084-P-1818E *Lead-free *1: 5V dielectric Nch open drain output pin *2: Mask ROM=VDD, Flash Memory built-in type=VPP Support Tool In-circuit Emulator PX-PAC101E02-4W9J Flash Memory Built-in Type Type MN101EF04G [ES (Engineering Sample) available] ROM (× 8-bit) 128 K RAM (× 8-bit) 4K Minimum instruction execution time 100 ns Package QFP084-P-1818E *Lead-free MAD00042CEM Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP