TI1 INA240A2QDRQ1 Automotive, wide common-mode range, high- and low-side, bidirectional, zero-drift, current-sense amplifier with enhanced pwm rejection Datasheet

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INA240-Q1
SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
1 Features
3 Description
•
•
The INA240-Q1 device is an automotive-qualified,
voltage-output, current-sense amplifier with enhanced
PWM rejection that can sense drops across shunt
resistors over a wide common-mode voltage range
from –4 V to 80 V, independent of the supply voltage.
The negative common-mode voltage allows the
device to operate below ground, accommodating the
flyback period of typical solenoid applications.
Enhanced PWM rejection provides high levels of
suppression for large common-mode transients
(ΔV/Δt) in systems that use pulse width modulation
(PWM) signals (such as motor drives and solenoid
control systems). This feature allows for accurate
current measurements without large transients and
associated recovery ripple on the output voltage.
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range
– Device Temperature Grade 0: –40°C to
+150°C Ambient Operating Temperature
Range
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C5
Enhanced PWM Rejection
Excellent CMRR:
– 132-dB DC CMRR
– 93-dB AC CMRR at 50 kHz
Wide Common-Mode Range: –4 V to 80 V
Accuracy:
– Gain Error: 0.20% (Maximum) With 2.5 ppm/°C
(Maximum Drift)
– Offset Voltage: ±25 μV (Maximum) With 250
nV/°C (Maximum Drift)
Available Gains:
– INA240A1-Q1: 20 V/V
– INA240A2-Q1: 50 V/V
– INA240A3-Q1: 100 V/V
– INA240A4-Q1: 200 V/V
This device operates from a single 2.7-V to 5.5-V
power supply, drawing a maximum of 2.4 mA of
supply current. Four fixed gains are available: 20 V/V,
50 V/V, 100 V/V, and 200 V/V. The low offset of the
zero-drift architecture enables current sensing with
maximum drops across the shunt as low as 10-mV
full-scale. Grade 1 versions are specified over the
extended operating temperature range (–40°C to
+125°C) and are offered in an 8-pin TSSOP and 8pin SOIC packages. Grade 0 versions are specified
over the extended operating temperature range
(–40°C to +150°C) and are offered in an 8-pin SOIC
package.
Device Information(1)
PART NUMBER
2 Applications
Electronic Power Steering
Stability and Traction Control
Motor and Actuator Control
Solenoid and Valve Control
Typical Application
TSSOP (8) - Grade
1 only
3.00 mm × 4.40 mm
SOIC (8) - Grade 0
and 1
4.00 mm × 3.91 mm
Enhanced PWM Rejection
Supply
(2.7V to 5.5V)
IN-
IN+
BODY SIZE (NOM)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
+
OUT
REF1
REF2
Common-Mode StepDDDDDDDDDDDDD
•
•
•
•
INA240-Q1
PACKAGE
270
270
Y1
240
240
210
210
180
180
150
3.5
150
1.5
Common-Mode Step
1
INA240 OUT
0.5
3
2.5
2
120
90
03.50
Y1
-0.53
2.5
-1 2
1.5
-1.5
60
30
0
-30
DDDDDDDDDDDDDINA240 Output
1
Time (2 µs/div)
D004
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCT PREVIEW
INA240-Q1 Automotive, Wide Common-Mode Range, High- and Low-Side, Bidirectional,
Zero-Drift, Current-Sense Amplifier With Enhanced PWM Rejection
INA240-Q1
SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (cont.) .................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
2
3
3
4
8.1
8.2
8.3
8.4
8.5
8.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
PRODUCT PREVIEW
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
10
10
10
12
10 Application and Implementation........................ 18
10.1 Application Information.......................................... 18
10.2 Typical Applications .............................................. 20
10.3 Do's and Don'ts .................................................... 24
11 Power Supply Recommendations ..................... 24
11.1 Power Supply Decoupling ..................................... 24
12 Layout................................................................... 25
12.1 Layout Guidelines ................................................. 25
12.2 Layout Example .................................................... 25
13 Device and Documentation Support ................. 26
13.1
13.2
13.3
13.4
13.5
13.6
13.7
Documentation Support .......................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
26
26
26
26
26
26
26
14 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (August 2016) to Revision A
Page
•
Added 8-pin D (SOIC) package for the INA240-Q1 Grade 0 and Grade 1 device ............................................................... 1
•
Added thermal values for the D (SOIC) package in the Thermal Information table .............................................................. 4
5 Description (cont.)
This device operates from a single 2.7-V to 5.5-V power supply, drawing a maximum of 2.4 mA of supply current.
Four fixed gains are available: 20 V/V, 50 V/V, 100 V/V, and 200 V/V. The low offset of the zero-drift architecture
enables current sensing with maximum drops across the shunt as low as 10-mV full-scale. Grade 1 versions are
specified over the extended operating temperature range (–40°C to +125°C) and are offered in an 8-pin TSSOP
and 8-pin SOIC packages. Grade 0 versions are specified over the extended operating temperature range
(–40°C to +150°C) and are offered in an 8-pin SOIC package.
2
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SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
6 Device Comparison Table
PRODUCT
GAIN (V/V)
INA240A1-Q1
20
INA240A2-Q1
50
INA240A3-Q1
100
INA240A4-Q1
200
7 Pin Configuration and Functions
INA240-Q1 PW Package
8-Pin TSSOP
Top View
NC
1
8
OUT
IN+
2
7
REF1
IN±
3
6
REF2
GND
4
5
VS
IN±
1
8
IN+
GND
2
7
REF1
REF2
3
6
VS
NC
4
5
OUT
PRODUCT PREVIEW
INA240-Q1 D Package
8-Pin SOIC
Top View
Not to scale
Not to scale
For INA240-Q1, Grade 1 only
For INA240-Q1, Grade 1 and Grade 0
Pin Functions
PIN
INA240-Q1
NAME
GND
I/O
DESCRIPTION
PW
(TSSOP)
D
(SOIC)
4
2
Analog
Ground
Connect to load side of shunt resistor
Connect to supply side of shunt resistor
IN–
3
1
Analog
input
IN+
2
8
Analog
input
NC
1
4
—
Output voltage
Reserved. Connect to ground.
OUT
8
5
Analog
output
REF1
7
7
Analog
input
Reference 1 voltage. Connect to 0 V to VS; see the Adjusting the Output Midpoint With
the Reference Pins section for connection options
REF2
6
3
Analog
input
Reference 2 voltage. Connect to 0 V to VS; see the Adjusting the Output Midpoint With
the Reference Pins section for connection options
VS
5
6
Analog
Power supply, 2.7 V to 5.5 V
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INA240-Q1
SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
6
V
Supply voltage
Analog inputs, VIN+, VIN– (2)
Differential (VIN+) – (VIN–)
–80
80
Common-mode
–6
90
GND – 0.3
VS + 0.3
V
GND – 0.3
VS + 0.3
V
–55
150
REF1, REF2, NC inputs
Output
Operating, TA
Temperature
Junction, TJ
150
Storage, Tstg
(1)
(2)
V
–65
°C
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.
8.2 ESD Ratings
PRODUCT PREVIEW
VALUE
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002 (1)
±2000
Charged-device model (CDM), per AEC Q100-011
±1000
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
–4
MAX
80
UNIT
VCM
Common-mode input voltage
V
VS
Operating supply voltage
2.7
5.5
V
TA
Operating free-air temperature
–40
125
°C
8.4 Thermal Information
INA240-Q1
THERMAL METRIC (1)
PW (TSSOP)
D (SOIC)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
149.1
113.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
33.2
57.3
°C/W
RθJB
Junction-to-board thermal resistance
78.4
53.5
°C/W
ψJT
Junction-to-top characterization parameter
1.5
11.1
°C/W
ψJB
Junction-to-board characterization parameter
76.4
53
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
8.5 Electrical Characteristics
at TA = 25 °C, VS = 5 V, VSENSE = VIN+ – VIN–, VCM = 12 V, and VREF1 = VREF2 = VS / 2 (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT
VCM
Common-mode input range
CMRR
Common-mode rejection ratio
VIN+ = –4 V to 80 V, VSENSE = 0 mV,
TA = – 40°C to 125°C
–4
VIN+ = –4 V to 80 V, VSENSE = 0 mV,
TA = –40°C to 125°C
120
f = 50 kHz
80
132
V
dB
93
VOS
Offset voltage, input-referred
VSENSE = 0 mV
±5
±25
µV
dVOS/dT
Offset voltage drift
VSENSE = 0 mV, TA = –40°C to 125°C
±50
±250
nV/°C
PSRR
Power-supply rejection ratio
VS = 2.7 V to 5.5 V, VSENSE = 0 mV,
TA = –40°C to 125°C
±1
±10
µV/V
IB
Input bias current
IB+, IB–, VSENSE = 0 mV
Reference input range
90
0
µA
VS
V
OUTPUT
G
Gain
Gain error
RVRR
50
INA240A3-Q1
100
INA240A4-Q1
200
GND + 50 mV ≤ VOUT ≤ VS – 200 mV
GND + 10 mV ≤ VOUT ≤ VS – 200 mV
Reference divider accuracy
VOUT = | (VREF1 – VREF2) | / 2 at VSENSE =
0 mV, TA = –40°C to 125°C
Maximum capacitive load
±0.05%
TA = –40°C to 125°C
Non-linearity error
Reference voltage rejection ratio
(input-referred)
20
INA240A2-Q1
±0.5
V/V
±0.20%
±2.5 ppm/°C
±0.01%
0.02%
INA240A1-Q1
20
INA240A3-Q1
5
INA240A2-Q1, INA240A4-Q1
2
No sustained oscillation
1
0.1%
µV/V
nF
VOLTAGE OUTPUT (1)
Swing to VS power-supply rail
RL = 10 kΩ to GND,
TA = –40°C to 125°C
VS – 0.05
VS – 0.2
Swing to GND
RL = 10 kΩ to GND, VSENSE = 0 mV,
VREF1 = VREF2 = 0 V,
TA = –40°C to 125°C
VGND + 1
VGND + 10
V
mV
FREQUENCY RESPONSE
BW
Bandwidth
Settling time - output settles to 0.5% of
final value
SR
All gains, –3-dB bandwidth
400
All gains, 2% THD+N (2)
100
INA240A1-Q1
9.6
INA240A4-Q1
9.8
Slew rate
kHz
µs
2
V/µs
40
nV/√Hz
NOISE (INPUT REFERRED)
Voltage noise density
POWER SUPPLY
VS
Operating voltage range
TA = –40°C to 125°C
2.7
VSENSE = 0 mV
IQ
Quiescent current
5.5
1.8
IQ vs temperature,
TA = –40°C to 125°C
V
2.4
2.6
mA
TEMPERATURE RANGE
Specified range
(1)
(2)
–40
125
°C
See Figure 13.
See the Input Signal Bandwidth section for more details.
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PRODUCT PREVIEW
INA240A1-Q1
INA240-Q1
SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
www.ti.com
8.6 Typical Characteristics
at TA = 25°C, VS = 5 V, VCM = 12 V, and VREF = VS / 2 (unless otherwise noted)
50
40
Population
Offset Voltage (PV)
30
20
10
0
-10
-20
-30
-40
-15
-13.5
-12
-10.5
-9
-7.5
-6
-4.5
-3
-1.5
0
1.5
3
4.5
6
7.5
9
10.5
12
13.5
15
-50
-50
VOS (PV)
-25
0
25
50
75
Temperature (°C)
100
125
150
D001
All gains
Figure 2. Offset Voltage vs Temperature
Figure 1. Input Offset Voltage Production Distribution
PRODUCT PREVIEW
0.4
0.3
Population
CMRR ( PV/V)
0.2
0.1
0
-0.1
-0.2
-0.5
-0.45
-0.4
-0.35
-0.3
-0.25
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
-0.3
-50
D003
-25
0
25
50
75
Temperature (°C)
100
125
150
CMR (PV/V)
All gains
Figure 4. Common-Mode Rejection Ratio vs Temperature
-0.2
-0.18
-0.16
-0.14
-0.12
-0.1
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
Population
-0.15
-0.135
-0.12
-0.105
-0.09
-0.075
-0.06
-0.045
-0.03
-0.015
0
0.015
0.03
0.045
0.06
0.075
0.09
0.105
0.12
0.135
0.15
Population
Figure 3. Common-Mode Rejection Production Distribution
Gain Error (%)
Gain Error (%)
D501
Figure 5. Gain Error Production Distribution (INA240A1)
6
D502
Figure 6. Gain Error Production Distribution (INA240A2)
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Typical Characteristics (continued)
-0.2
-0.18
-0.16
-0.14
-0.12
-0.1
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
-0.2
-0.18
-0.16
-0.14
-0.12
-0.1
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
Population
Population
at TA = 25°C, VS = 5 V, VCM = 12 V, and VREF = VS / 2 (unless otherwise noted)
D503
Gain Error (%)
D504
Gain Error (%)
Figure 7. Gain Error Production Distribution (INA240A3)
Figure 8. Gain Error Production Distribution (INA240A4)
INA240A4
100
INA240A3
50
INA240A3
75
PRODUCT PREVIEW
60
Gain Error vs Temperature
40
INA240A4
Gain (dB)
Gain Error (m%)
50
25
0
20
INA240A2
INA240A2
-25
30
INA240A1
10
-50
0
INA240A1
-75
-100
-50
-10
10
-25
0
25
50
75
Temperature (°C)
100
125
100
150
1k
10k
100k
Frequency (Hz)
1M
10M
100k
1M
VCM = 0 V, VDIF = 10-mVPP sine
Figure 9. Gain Error vs Temperature
Figure 10. Gain vs Frequency
150
140
135
120
CMRR (dB)
PSRR (dB)
120
100
80
105
90
60
75
40
60
1
10
100
1k
10k
Frequency (Hz)
100k
1M
Figure 11. Power-Supply Rejection Ratio vs Frequency
1
10
100
1k
10k
Frequency (Hz)
Figure 12. Common-Mode Rejection Ratio vs Frequency
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INA240-Q1
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Typical Characteristics (continued)
at TA = 25°C, VS = 5 V, VCM = 12 V, and VREF = VS / 2 (unless otherwise noted)
120
25qC
125qC
-40qC
100
VS - 1
Input Bias Current ( PA)
Output Voltage Swing (V)
VS
VS - 2
GND + 3
GND + 2
80
60
40
20
GND + 1
0
-20
-10
GND
0
1
2
3
4
Output Current (mA)
5
6
7
0
10
20
30
40
50
60
Common-Mode Voltage (V)
D010
70
80
90
VS = 5 V
Figure 14. Input Bias Current vs Common-Mode Voltage
Figure 13. Output Voltage Swing vs Output Current
100
100
PRODUCT PREVIEW
95
90
Input Bias Current (PA)
Input Bias Current ( PA)
80
60
40
20
85
80
75
70
65
60
0
55
-20
-10
0
10
20
30
40
50
60
Common-Mode Voltage (V)
70
80
90
50
-50
-25
0
25
50
75
Temperature (°C)
100
125
150
VS = 0 V
Figure 15. Input Bias Current vs Common-Mode Voltage
Figure 16. Input Bias Current vs Temperature
100
2
1.8
1.4
Refered-to-Input
Voltage Noise (nV/—Hz)
Quiescent Current (mA)
1.6
VS= 2.7-V
VS= 3.3-V
1.2
1
VS= 5-V
0.8
0.6
0.4
0.2
0
-50
10
-25
0
25
50
75
Temperature (°C)
100
125
Figure 17. Quiescent Current vs Temperature
8
150
1
10
100
1k
10k
Frequency (Hz)
100k
1M
Figure 18. Input-Referred Voltage Noise vs Frequency
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Typical Characteristics (continued)
at TA = 25°C, VS = 5 V, VCM = 12 V, and VREF = VS / 2 (unless otherwise noted)
Referred-to-Input
Voltage Noise (200 nV/div)
Output Voltage
(0.5 V/div)
2-VPP Output Signal
Input Voltage
(5 mV/div)
0
10-mVPP Input Signal
0
Time (1 s/div)
Time (10 Ps/div)
D016
D017
VS = ±2.5 V, VCM = 0 V, VDIF = 0 V, VREF1 = VREF2 = 0 V
VREF1 = VREF2 = 0 V
2.5
2
120
90
60
30
0
-30
1.5
13.5
Y1
0.5
3
2.5
02
1.5
Common-Mode Input Signal -0.5
1
INA240 Output
1
-1
Time (0.25 Ps/div)
240
240
Y1210
240
210
180
180
150
150
3.5
3
2.5
2
120
1.5
Common-Mode Input Signal
INA240 Output
13.5
Y1
0.5
3
2.5
02
1.5
-0.5
1
1
-1
Time (0.25 Ps/div)
90
60
30
0
-30
D021
D022
Output
(1.5 V/div)
Supply Voltage
(2.5 V/div)
Figure 21. Common-Mode Voltage Transient Response:
Rising Edge
0
0
PRODUCT PREVIEW
3
INA240 Output
3.5
Common-Mode Input SignalDDDDDDDDDDDD
240
240
Y1210
240
210
180
180
150
150
Figure 20. Step Response
(10-mVPP Input Step)
INA240 Output
Common-Mode Input SignalDDDDDDDDDDDD
Figure 19. 0.1-Hz to 10-Hz Voltage Noise
(Input Referred)
Figure 22. Common-Mode Voltage Transient Response:
Falling Edge
Time (2 Ps/div)
D019
VREF1 = VREF2 = 0 V
Figure 23. Start-Up Response
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9 Detailed Description
9.1 Overview
The INA240-Q1 is a current-sense amplifier that offers a wide common-mode range, precision, zero-drift
topology, excellent common-mode rejection ratio (CMRR), and features enhanced pulse width modulation (PWM)
rejection. Enhanced PWM rejection reduces the effect of common-mode transients on the output signal that are
associated with PWM signals. Multiple gain versions are available to allow for the optimization of the desired fullscale output voltage based on the target current range expected in the application.
9.2 Functional Block Diagram
VS
IN±
IN+
PWM
Rejection
±
OUT
+
50 k
REF2
50 k
PRODUCT PREVIEW
REF1
GND
9.3 Feature Description
9.3.1 Amplifier Input Signal
The INA240-Q1 is designed to handle large common-mode transients over a wide voltage range. Input signals
from current measurement applications for linear and PWM applications can be connected to the amplifier to
provide a highly accurate output, with minimal common-mode transient artifacts.
9.3.1.1 Enhanced PWM Rejection Operation
The enhanced PWM rejection feature of the INA240 provides increased attenuation of large common-mode
ΔV/Δt transients. Large ΔV/Δt common-mode transients associated with PWM signals are employed in
applications such as motor or solenoid drive and switching power supplies. Traditionally, large ΔV/Δt commonmode transitions are handled strictly by increasing the amplifier signal bandwidth, which can increase chip size,
complexity and ultimately cost. The INA240-Q1 is designed with high common-mode rejection techniques to
reduce large ΔV/Δt transients before the system is disturbed as a result of these large signals. The high AC
CMRR, in conjunction with signal bandwidth, allows the INA240-Q1 to provide minimal output transients and
ringing compared with standard circuit approaches.
9.3.1.2 Input Signal Bandwidth
The INA240-Q1 input signal, which represents the current being measured, is accurately measured with minimal
disturbance from large ΔV/Δt common-mode transients as previously described. For PWM signals typically
associated with motors, solenoids, and other switching applications, the current being monitored varies at a
significantly slower rate than the faster PWM frequency.
The INA240-Q1 bandwidth is defined by the –3-dB bandwidth of the current-sense amplifier inside the device;
see the Electrical Characteristics table. The device bandwidth provides fast throughput and fast response
required for the rapid detection and processing of overcurrent events. Without the higher bandwidth, protection
circuitry may not have adequate response time and damage may occur to the monitored application or circuit.
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Feature Description (continued)
Figure 24 shows the performance profile of the device over frequency. Harmonic distortion increases at the
upper end of the amplifier bandwidth with no adverse change in detection of overcurrent events. However,
increased distortion at the highest frequencies must be considered when the measured current bandwidth begins
to approach the INA240 bandwidth.
For applications requiring distortion sensitive signals, Figure 24 provides information to show that there is an
optimal frequency performance range for the amplifier. The full amplifier bandwidth is always available for fast
overcurrent events at the same time that the lower frequency signals are amplified at a low distortion level. The
output signal accuracy is reduced for frequencies closer to the maximum bandwidth. Individual requirements
determine the acceptable limits of distortion for high-frequency, current-sensing applications. Testing and
evaluation in the end application or circuit is required to determine the acceptance criteria and to validate the
performance levels meet the system specifications.
10%
0.1%
90% FS Input
0.01%
1
10
100
1k
10k
Frequency (Hz)
100k
1M
D006
Figure 24. Performance Over Frequency
9.3.2 Selecting the Sense Resistor, RSENSE
The INA240-Q1 determines the current magnitude from measuring the differential voltage developed across a
resistor. This resistor is referred to as a current-sensing resistor or a current-shunt resistor. The flexible design of
the device allows a wide input signal range across this current-sensing resistor.
The current-sensing resistor is ideally chosen solely based on the full-scale current to be measured, the full-scale
input range of the circuitry following the device, and the device gain selected. The minimum current-sensing
resistor is a design-based decision in order to maximize the input range of the signal chain circuitry. Full-scale
output signals that are not maximized to the full input range of the system circuitry limit the ability of the system
to exercise the full dynamic range of system control.
Two important factors to consider when finalizing the current-sensing resistor value are: the required current
measurement accuracy and the maximum power dissipation across the resistor. A larger resistor voltage
provides for a more accurate measurement, but increases the power dissipation in the resistor. The increased
power dissipation generates heat, which reduces the sense resistor accuracy because of the temperature
coefficient. The voltage signal measurement uncertainty is reduced when the input signal gets larger because
any fixed errors become a smaller percentage of the measured signal. The design trade-off to improve
measurement accuracy increases the current-sensing resistor value. The increased resistance value results in an
increased power dissipation in the system which can additionally decrease the overall system accuracy. Based
on these relationships, the measurement accuracy is inversely proportional to both the resistance value and
power dissipation contributed by the current-shunt selection.
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Feature Description (continued)
By increasing the current-shunt resistor, the differential voltage is increased across the resistor. Larger input
differential voltages require a smaller amplifier gain to achieve a full-scale amplifier output voltage. Smaller
current-shunt resistors are desired but require large amplifier gain settings. The larger gain settings often have
increased error and noise parameters, which are not attractive for precision designs. Historically, the design
goals for high-performance measurements forced designers to accept selecting larger current-sense resistors
and the lower gain amplifier settings. The INA240-Q1 provides 100-V/V and 200-V/V gain options that offer the
high-gain setting and maintains high-performance levels with offset values below 25 µV. These devices allow for
the use of lower shunt resistor values to achieve lower power dissipation and still meet high system performance
specifications.
Table 1 shows an example of the different results obtained from using two different gain versions of the INA240Q1. From the table data, the higher gain device allows a smaller current-shunt resistor and decreased power
dissipation in the element. The Calculating Total Error section provides information on the error calculations that
should be considered in addition to the gain and current-shunt value when designing with the INA240.
Table 1. RSENSE Selection and Power Dissipation (1)
PARAMETER
EQUATION
Gain
PRODUCT PREVIEW
VDIFF
Ideal maximum differential input voltage
RSENSE
Current-sense resistor value
PRSENSE
Current-sense resistor power dissipation
(1)
RESULTS
INA240A1-Q1
INA240A4-Q1
—
20 V/V
200 V/V
VDIFF = VOUT / Gain
150 mV
15 mV
RSENSE = VDIFF / IMAX
15 mΩ
1.5 mΩ
1.5 W
0.15 W
RSENSE × IMAX
2
Full-scale current = 10 A, and full-scale output voltage = 3 V.
9.4 Device Functional Modes
9.4.1 Adjusting the Output Midpoint With the Reference Pins
Figure 25 shows a test circuit for reference-divider accuracy. The INA240-Q1 output is configurable to allow for
unidirectional or bidirectional operation.
VS
VS
IN±
IN+
±
+
OUT
REF2
REF1
GND
Figure 25. Test Circuit For Reference Divider Accuracy
NOTE
Do not connect the REF1 pin or the REF2 pin to any voltage source lower than GND or
higher than VS.
The output voltage is set by applying a voltage or voltages to the reference voltage inputs, REF1 and REF2. The
reference inputs are connected to an internal gain network. There is no operational difference between the two
reference pins.
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Device Functional Modes (continued)
9.4.2 Reference Pin Connections for Unidirectional Current Measurements
Unidirectional operation allows current measurements through a resistive shunt in one direction. For
unidirectional operation, connect the device reference pins together and then to the negative rail (see the Ground
Referenced Output section) or the positive rail (see the VS Referenced Output section). The required differential
input polarity depends on the output voltage setting. The amplifier output moves away from the referenced rail
proportional to the current passing through the external shunt resistor. If the amplifier reference pins are
connected to the positive rail, then the input polarity must be negative to move the amplifier output down
(towards ground). If the amplifier reference pins are connected at ground, then the input polarity must be positive
to move the amplifier output up (towards supply).
The following sections describe how to configure the output for unidirectional operation cases.
9.4.2.1 Ground Referenced Output
When using the INA240-Q1 in a unidirectional mode with a ground referenced output, both reference inputs are
connected to ground; this configuration takes the output to ground when there is a 0-V differential at the input (as
Figure 26 shows).
PRODUCT PREVIEW
VS
VS
IN±
±
OUT
+
REF2
IN+
REF1
GND
Figure 26. Ground Referenced Output
9.4.2.2 VS Referenced Output
Unidirectional mode with a VS referenced output is configured by connecting both reference pins to the positive
supply. Use this configuration for circuits that require power-up and stabilization of the amplifier output signal and
other control circuitry before power is applied to the load (as shown in Figure 27).
VS
VS
IN±
±
+
IN+
OUT
REF2
REF1
GND
Figure 27. VS Referenced Output
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Device Functional Modes (continued)
9.4.3 Reference Pin Connections for Bidirectional Current Measurements
Bidirectional operation allows the INA240-Q1 to measure currents through a resistive shunt in two directions. For
this operation case, the output voltage can be set anywhere within the reference input limits. A common
configuration is to set the reference inputs at half-scale for equal range in both directions. However, the reference
inputs can be set to a voltage other than half-scale when the bidirectional current is non-symmetrical.
9.4.3.1 Output Set to External Reference Voltage
Connecting both pins together and then to a reference voltage results in an output voltage equal to the reference
voltage for the condition of shorted input pins or a 0-V differential input; this configuration is shown in Figure 28.
The output voltage decreases below the reference voltage when the IN+ pin is negative relative to the IN– pin
and increases when the IN+ pin is positive relative to the IN– pin. This technique is the most accurate way to
bias the output to a precise voltage.
VS
VS
PRODUCT PREVIEW
IN±
±
OUT
+
IN+
REF2
REF1
REF5025
2.5-V
Reference
GND
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Figure 28. External Reference Output
9.4.3.2 Output Set to Mid-Supply Voltage
By connecting one reference pin to VS and the other to the GND pin, the output is set at half of the supply when
there is no differential input, as shown in Figure 29. This method creates a ratiometric offset to the supply
voltage, where the output voltage remains at VS / 2 for 0 V applied to the inputs.
VS
VS
IN±
IN+
±
+
OUT
Output
REF2
REF1
GND
Figure 29. Midsupply Voltage Output
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Device Functional Modes (continued)
9.4.3.3 Output Set to Mid-External Reference
In this case, an external reference is divided by two by connecting one REF pin to ground and the other REF pin
to the reference, as shown in Figure 30.
VS
VS
IN±
±
OUT
+
IN+
REF2
REF1
REF5025
2.5-V
Reference
GND
Figure 30. Mid-External Reference Output
9.4.3.4 Output Set Using Resistor Divider
The INA240-Q1 REF1 and REF2 pins allow for the midpoint of the output voltage to be adjusted for system
circuitry connections to analog to digital converters (ADCs) or other amplifiers. The REF pins are designed to be
connected directly to supply, ground, or a low-impedance reference voltage. The REF pins can be connected
together and biased using a resistor divider to achieve a custom output voltage. If the amplifier is used in this
configuration, as shown in Figure 31, use the output as a differential signal with respect to the resistor divider
voltage. Use of the amplifier output as a single-ended signal in this configuration is not recommended because
the internal impedance shifts can adversely affect device performance specifications.
VS
VS
IN±
IN+
±
+
R1
OUT
TO ADC+
TO ADC±
REF2
REF1
R2
GND
Figure 31. Setting the Reference Using a Resistor Divider
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Device Functional Modes (continued)
9.4.4 Calculating Total Error
The INA240-Q1 electrical specifications (see the Electrical Characteristics table) include typical individual errors
terms (such as gain error, offset error, and nonlinearity error). Total error, including all of these individual error
components, is not specified in the Electrical Characteristics table. In order to accurately calculate the expected
error of the device, the device operating conditions must first be known. Some current-shunt monitors specify a
total error in the product data sheet. However, this total error term is accurate under only one particular set of
operating conditions. Specifying the total error at this point has limited value because any deviation from these
specific operating conditions no longer yields the same total error value. This section discusses the individual
error sources and how the device total error value can be calculated from the combination of these errors for
specific conditions.
Two examples are provided in Table 2 and Table 3 that detail how different operating conditions can affect the
total error calculations. Typical and maximum calculations are shown as well to provide the user more
information on how much error variance is present from device to device.
9.4.4.1 Error Sources
The typical error sources that have the largest effect on the total error of the device are gain error, nonlinearity,
common-mode rejection ratio, and input offset voltage error. For the INA240-Q1, an additional error source
(referred to as the reference voltage rejection ratio) is also included in the total error value.
PRODUCT PREVIEW
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Device Functional Modes (continued)
9.4.4.2 Reference Voltage Rejection Ratio Error
Reference voltage rejection ratio refers to the amount of error induced by applying a reference voltage to the
INA240-Q1 that deviates from the mid-point of the device supply voltage.
9.4.4.2.1 Total Error Example 1
Table 2. Total Error Calculation: Example 1 (1)
SYMBOL
EQUATION
TYPICAL VALUE
Initial input offset voltage
VOS
—
5 µV
Added input offset voltage
because of commonmode voltage
VOS_CM
Added input offset voltage
because of reference
voltage
VOS_REF
Total input offset voltage
VOS_Total
(VOS)2 + (VOS_CM)2 + (VOS_REF)2
5 µV
Error from input offset
voltage
Error_VOS
VOS_Total
VSENSE ´ 100
0.05%
Gain error
Error_Gain
—
0.05%
Error_Lin
—
0.01%
—
(Error_VOS)2 + (Error_Gain)2 + (Error_Lin)2
0.07%
10
Total error
(1)
(
20
´ (VCM - 12V)
RVRR × |VS / 2 – VREF|
0 µV
0 µV
PRODUCT PREVIEW
Nonlinearity error
1
CMRR_dB
(
TERM
The data for Table 2 was taken with the INA240A4-Q1, VS = 5 V, VCM = 12 V, VREF1 = VREF2 = VS / 2, and VSENSE = 10 mV.
9.4.4.2.2 Total Error Example 2
Table 3. Total Error Calculation: Example 2 (1)
TERM
Initial input offset voltage
SYMBOL
EQUATION
TYPICAL VALUE
—
5 µV
VOS
1
Added input offset voltage
because of commonmode voltage
VOS_CM
Added input offset voltage
because of reference
voltage
VOS_REF
Total input offset voltage
VOS_Total
(VOS)2 + (VOS_CM)2 + (VOS_REF)2
14 µV
Error from input offset
voltage
Error_VOS
VOS_Total
VSENSE ´ 100
0.14%
Gain error
Error_Gain
—
0.05%
Error_Lin
—
0.01%
—
(Error_VOS)2 + (Error_Gain)2 + (Error_Lin)2
0.15%
Total error
(1)
CMRR_dB
20
(
Nonlinearity error
10
(
´ (VCM - 12V)
RVRR × |VS / 2 – VREF|
12.1 µV
5 µV
The data for Table 3 was taken with the INA240A4-Q1, VS = 5 V, VCM = 60 V, VREF1 = VREF2 = 0 V, and VSENSE = 10 mV.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The INA240-Q1 measures the voltage developed as current flows across the current-sensing resistor. The device
provides reference pins to configure operation as either unidirectional or bidirectional output swing. When using
the INA240-Q1 for inline motor current sense, the device is commonly configured for bidirectional operation.
10.1.1 Input Filtering
NOTE
Input filters are not required for accurate measurements using the INA240-Q1, and use of
filters in this location is not recommended. If filter components are used on the input of the
amplifier, follow the guidelines in this section to minimize the effects on performance.
PRODUCT PREVIEW
Based strictly on user design requirements, external filtering of the current signal may be desired. The initial
location that can be considered for the filter is at the output of the current amplifier. Although placing the filter at
the output satisfies the filtering requirements, this location changes the low output impedance measured by any
circuitry connected to the output voltage pin. The other location for filter placement is at the current amplifier
input pins. This location satisfies the filtering requirement also, however the components should be carefully
selected to minimally impact device performance. Figure 32 shows a filter placed at the inputs pins.
VS
RS
IN±
Bias
R
t
OUT
+
RS
REF2
IN+
REF1
GND
Figure 32. Filter at Input Pins
External series resistance provide a source of additional measurement error, so keep the value of these series
resistors to 10-Ω or less to reduce loss of accuracy. The internal bias network shown in Figure 32 creates a
mismatch in input bias currents (see Figure 33) when a differential voltage is applied between the input pins. If
additional external series filter resistors are added to the circuit, a mismatch is created in the voltage drop across
the filter resistors. This voltage is a differential error voltage in the shunt resistor voltage. In addition to the
absolute resistor value, mismatch resulting from resistor tolerance can significantly impact the error because this
value is calculated based on the actual measured resistance.
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Application Information (continued)
250
IB+
Input Bias Current (PA)
200
150
100
IB50
0
-50
-100
0
0.2
0.4
0.6
Differential Input Voltage (V)
0.8
1
The measurement error expected from the additional external filter resistors can be calculated using Equation 1,
where the gain error factor is calculated using Equation 2.
Gain Error (%) = 100 - (100 ´ Gain Error Factor)
(1)
The gain error factor, shown in Equation 1, can be calculated to determine the gain error introduced by the
additional external series resistance. Equation 1 calculates the deviation of the shunt voltage resulting from the
attenuation and imbalance created by the added external filter resistance. Table 4 provides the gain error factor
and gain error for several resistor values.
Gain Error Factor
3000
RS 3000
Where:
•
RS is the external filter resistance value
(2)
Table 4. Gain Error Factor and Gain Error For External Input Resistors
EXTERNAL RESISTANCE (Ω)
GAIN ERROR FACTOR
GAIN ERROR (%)
5
0.998
0.17
10
0.997
0.33
100
0.968
3.23
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PRODUCT PREVIEW
Figure 33. Input Bias Current vs Differential Input Voltage
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10.2 Typical Applications
The INA240-Q1 offers advantages for multiple applications including the following:
• High common-mode range and excellent CMRR enables direct inline sensing
• Ultra-low offset and drift eliminates the necessity of calibration
• Wide supply range enables a direct interface with most microprocessors
Two specific applications are provided and include more detailed information.
10.2.1 Inline Motor Current-Sense Application
5V
VS
40 V
IN+
OUT
INA240
REF2
REF1
IN±
GND
100 PŸ
PRODUCT PREVIEW
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Figure 34. Inline Motor Application Circuit
10.2.1.1 Design Requirements
Inline current sensing has many advantages in motor control, from torque ripple reduction to real-time motor
health monitoring. However, the full-scale PWM voltage requirements for inline current measurements provide
challenges to accurately measure the current. Switching frequencies in the 50-kHz to 100-kHz range create
higher ΔV/Δt signal transitions that must be addressed in order to obtain accurate inline current measurements.
With a superior common-mode rejection capability, high precision, and a high common-mode specification, the
INA240-Q1 provides optimal performance for a wide range of common-mode voltages.
10.2.1.2 Detailed Design Procedure
For this application, the INA240-Q1 measures current in the drive circuitry of a 36-V, 4000-RPM motor.
To demonstrate the performance of the device, the INA240A1-Q1 with a gain of 20 V/V was selected for this
design and powered from a 5-V supply.
Using the information in the Adjusting the Output Midpoint With the Reference Pins section, the reference point is
set to midscale by splitting the supply with REF1 connected to ground and REF2 connected to supply. This
configuration allows for bipolar current measurements. Alternatively, the reference pins can be tied together and
driven with an external precision reference.
The current-sensing resistor is sized so that the output of the INA240-Q1 is not saturated. A value of 100-mΩ
was selected to maintain the analog input within the device limits.
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Typical Applications (continued)
270
3.5
240
3
210
2.5
180
2
150
Input Signal
INA240A1 Output
1
90
0.5
60
0
30
-0.5
0
-1
-30
-1.5
Time (25 s/div)
C005
Figure 35. Inline Motor Current-Sense Input and Output Signals
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PRODUCT PREVIEW
Common-Mode Input Signal
120
1.5
INA240A1 Output
10.2.1.3 Application Curve
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Typical Applications (continued)
10.2.2 Solenoid Drive Current-Sense Application
12 V
5V
Control
VS
IN+
OUT
10 m
INA240
REF2
REF1
IN±
GND
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PRODUCT PREVIEW
Figure 36. Solenoid Drive Application Circuit
10.2.2.1 Design Requirements
Challenges exist in solenoid drive current sensing that are similar to those in motor inline current sensing. In
certain topologies, the current-sensing amplifier is exposed to the full-scale PWM voltage between ground and
supply. The INA240-Q1 is well suited for this type of application.
10.2.2.2 Detailed Design Procedure
For this application, the INA240-Q1 measures current in the driver circuit of a 24-V, 500-mA water valve.
To demonstrate the performance of the device, the INA240A4-Q1 with a gain of 200 V/V was selected for this
design and powered from a 5-V supply.
Using the information in the Adjusting the Output Midpoint With the Reference Pins section, the reference point is
set to midscale by splitting the supply with REF1 connected to ground and REF2 connected to supply.
Alternatively, the reference pins can be tied together and driven with an external precision reference.
A value of 10 mΩ was selected to maintain the analog input within the device limits.
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Typical Applications (continued)
66
2
Y
60
2
2
54
1
1
48
1
6
42
2
36
Common-Mode Input Signal 1
INA240 Output
0
5
4
3
30
DDDDDDDDDDDDDINA240 Output
Common-Mode Input SignalDDDDDDDDDDDDD
10.2.2.3 Application Curve
24
-1
18
-2
12
3.50
-3
3.50
-4 Y1
3
2.5
-5
2
1.5
-6
6
0
-6
PRODUCT PREVIEW
Time (20 ms/div)
D020
Figure 37. Solenoid Drive Current Sense Input and Output Signals
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10.3 Do's and Don'ts
10.3.1 High-Precision Applications
For high-precision applications, verify accuracy and stability of the amplifier by:
• Providing a precision reference connected to REF1 and REF2
• Optimizing the layout of the power and sensing path of the sense resistor (see the Layout section)
• Providing adequate bypass capacitance on the supply pin (see the Power Supply Decoupling section)
10.3.2 Kelvin Connection from the Current-Sense Resistor
To provide accurate current measurements, verify the routing between the current-sense resistor and the
amplifier uses a Kelvin connection. Use the information provided in Figure 38 and the Connection to the CurrentSense Resistor section during device layout.
RSHUNT
RSHUNT
1
2
3
4
1
2
3
4
INA240
8
7
6
5
8
7
6
5
PRODUCT PREVIEW
INA240
'21¶7
DO
Kelvin Connection from Shunt Resistor
Non-Kelvin Connection from Shunt Resistor
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Figure 38. Shunt Connections to the INA240-Q1
11 Power Supply Recommendations
The INA240-Q1 series makes accurate measurements beyond the connected power-supply voltage (VS)
because the inputs (IN+ and IN–) operate anywhere between –4 V and 80 V independent of VS. For example,
the VS power supply equals 5 V and the common-mode voltage of the measured shunt can be as high as 80 V.
Although the common-mode voltage of the input can be beyond the supply voltage, the output voltage range of
the INA240-Q1 series is constrained to the supply voltage.
11.1 Power Supply Decoupling
Place the power-supply bypass capacitor as close as possible to the supply and ground pins. TI recommends a
bypass capacitor value of 0.1 μF. Additional decoupling capacitance can be added to compensate for noisy or
high-impedance power supplies.
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12 Layout
12.1 Layout Guidelines
12.1.1 Connection to the Current-Sense Resistor
Poor routing of the current-sensing resistor can result in additional resistance between the input pins of the
amplifier. Any additional high-current carrying impedance can cause significant measurement errors because the
current resistor has a very-low-ohmic value. Use a Kelvin or 4-wire connection to connect to the device input
pins. This connection technique ensures that only the current-sensing resistor impedance is detected between
the input pins.
12.2 Layout Example
RSHUNT
Power
Supply
Load
4
3
2
1
GND
IN±
IN+
NC
PRODUCT PREVIEW
VIA to
Ground
Plane
VIA to
Ground
Plane
CBYPASS
INA240
5
6
Supply
Voltage
REF1
OUT
8
REF2
7
VS
Output Voltage
VIA to
Ground
Plane
Copyright © 2016, Texas Instruments Incorporated
Figure 39. Recommended Layout
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Product Folder Links: INA240-Q1
25
INA240-Q1
SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
www.ti.com
13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
For related documentation see the following:
• INA240EVM User's Guide (SBOU177)
• Motor Control Application Report (SBOA172)
• Shunt Based In-Line Phase Current Sensing with 48V/10A Design Guide (TIDA-00913)
13.2 Related Links
Table 5 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 5. Related Links
PRODUCT PREVIEW
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
INA240A1-Q1
Click here
Click here
Click here
Click here
Click here
INA240A2-Q1
Click here
Click here
Click here
Click here
Click here
INA240A3-Q1
Click here
Click here
Click here
Click here
Click here
INA240A4-Q1
Click here
Click here
Click here
Click here
Click here
13.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
13.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.5 Trademarks
E2E is a trademark of Texas Instruments.
13.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
26
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Product Folder Links: INA240-Q1
INA240-Q1
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SBOS808A – AUGUST 2016 – REVISED DECEMBER 2016
14 Mechanical, Packaging, and Orderable Information
PRODUCT PREVIEW
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: INA240-Q1
27
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jan-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
(4/5)
INA240A1EDRQ1
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 125
INA240A1QDRQ1
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 125
INA240A1QPWRQ1
PREVIEW
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 125
INA240A2EDRQ1
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
TBD
Call TI
Call TI
-40 to 125
INA240A2QDRQ1
PREVIEW
SOIC
D
8
INA240A2QPWRQ1
PREVIEW
TSSOP
PW
8
INA240A3EDRQ1
PREVIEW
SOIC
D
8
INA240A3QDRQ1
PREVIEW
SOIC
D
8
INA240A3QPWRQ1
PREVIEW
TSSOP
PW
8
INA240A4EDRQ1
PREVIEW
SOIC
D
8
INA240A4QDRQ1
PREVIEW
SOIC
D
8
INA240A4QPWRQ1
PREVIEW
TSSOP
PW
8
2000
2000
2000
2000
Device Marking
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Jan-2017
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF INA240-Q1 :
• Catalog: INA240
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
1
3.1
2.9
NOTE 3
2X
1.95
4
5
B
4.5
4.3
NOTE 4
SEE DETAIL A
8X
0.30
0.19
0.1
C A
1.2 MAX
B
(0.15) TYP
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
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EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
1
8
(R0.05)
TYP
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
(R0.05) TYP
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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