Top View 1.00mm [0.039"] 31.00mm [1.220"] 1.00mm [0.039"] 1.00mm [0.039"] 31.00mm [1.220"] Side View 1.68mm [0.066"] 1 3.76mm [0.148"] Ø 0.20mm [0.008"] ±0.0005" 29.00mm [1.142"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA SMT Land Socket 896 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 30x30 array) Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA896A-41 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: B Drawing: S.Natarajan Date: 3/3/05 File: LS-BGA896A-41 Dwg Modified: 4/19/05 A th b F w A a