Material Content Data Sheet Sales Product Name IPD30N03S2L-20 MA# MA000254991 Package PG-TO252-3-11 Issued 29. August 2013 Weight* 369.55 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 1.348 0.36 0.234 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.36 3648 3648 635 0.070 0.02 234.187 63.39 63.47 633714 190 634539 0.984 0.27 0.27 2662 2662 1.274 0.34 3448 22.301 6.03 103.860 28.10 34.47 281048 344844 3.740 1.01 1.01 10121 10121 0.091 0.02 0.000 0.00 0.036 0.01 0.029 0.01 1.390 0.38 60348 246 0.02 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 247 79 0.40 Important Remarks: 1. 1 98 3762 3939 1000000