AM3894
AM3892
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
AM389x Sitara™
ARM® Processors
Check for Samples: AM3894, AM3892
1 Device Summary
1.1
Features
1234567891011
• High-Performance Sitara™ ARM® Processors
– ARM® Cortex™-A8 RISC Processor
• Up to 1.35 GHz
• ARM® Cortex™-A8 Core
– ARMv7 Architecture
• In-Order, Dual-Issue, Superscalar
Processor Core
• NEON™ Multimedia Architecture
– Supports Integer and Floating Point (VFPv3IEEE754 compliant)
• Jazelle® RCT Execution Environment
• ARM® Cortex™-A8 Memory Architecture
– 32K-Byte Instruction and Data Caches
– 256K-Byte L2 Cache
– 64K-Byte RAM, 48K-Byte Boot ROM
• 512K-Bytes On-Chip Memory Controller
(OCMC) RAM
• SGX530 3D Graphics Engine (available only on
the AM3894 device)
– Delivers up to 30 MTriangles/s
– Universal Scalable Shader Engine
– Direct3D® Mobile, OpenGL® ES 1.1 and 2.0,
OpenVG™ 1.1, OpenMax™ API Support
– Advanced Geometry DMA Driven Operation
– Programmable HQ Image Anti-Aliasing
• Endianness
– ARM Instructions/Data – Little Endian
• HD Video Processing Subsystem (HDVPSS)
– Two 165 MHz HD Video Capture Channels
• One 16/24-bit and One 16-bit Channel
• Each Channel Splittable Into Dual 8-bit
Capture Channels
– Two 165 MHz HD Video Display Channels
• One 16/24/30-Bit and One 16-bit Channel
•
•
•
•
•
– Simultaneous SD and HD Analog Output
– Digital HDMI 1.3 transmitter with PHY with
HDCP up to 165-MHz pixel clock
– Advanced Video Processing Features Such
as Scan/Format/Rate Conversion
– Three Graphics Layers and Compositors
Dual 32-bit DDR2/3 SDRAM Interfaces
– Supports up to DDR2-800 and DDR3-1600
– Up to Eight x8 Devices Total
– 2 GB Total Address Space
– Dynamic Memory Manager (DMM)
• Programmable Multi-Zone Memory
Mapping and Interleaving
• Enables Efficient 2D Block Accesses
• Supports Tiled Objects in 0°, 90°, 180°, or
270 Orientation and Mirroring
• Optimizes Interlaced Accesses
One PCI Express® (PCIe®) 2.0 Port With
Integrated PHY
– Single Port With 1 or 2 Lanes at 5.0 GT/s
– Configurable as Root Complex or Endpoint
Serial ATA (SATA) 3.0 Gbps Controller With
Integrated PHYs
– Direct Interface for Two Hard Disk Drives
– Hardware-Assisted Native Command
Queuing (NCQ) from up to 32 Entries
– Supports Port Multiplier and CommandBased Switching
Two 10/100/1000 Mbps Ethernet MACs (EMAC)
– IEEE 802.3 Compliant (3.3V I/O Only)
– MII and GMII Media Independent I/Fs
– Management Data I/O (MDIO) Module
Dual USB 2.0 Ports With Integrated PHYs
– USB 2.0 High-/Full-Speed Client
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Sitara, SmartReflex, Code Composer Studio, DSP/BIOS, XDS are trademarks of Texas Instruments.
Cortex, NEON are trademarks of ARM Ltd or its subsidiaries.
ARM, Jazelle, Thumb are registered trademarks of ARM Ltd or its subsidiaries.
USSE, POWERVR are trademarks of Imagination Technologies Limited.
OpenVG, OpenMax are trademarks of Khronos Group Inc.
Direct3D, Microsoft, Windows are registered trademarks of Microsoft Corporation in the United States and/or other countries.
I2C BUS is a registered trademark of NXP B.V. Corporation Netherlands.
PCI Express, PCIe are registered trademarks of PCI-SIG.
OpenGL is a registered trademark of Silicon Graphics International Corp. or its subsidiaries in the United States and/or other
countries.
All other trademarks are the property of their respective owners.
2
3
4
5
6
7
8
9
10
11
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated
AM3894
AM3892
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
•
•
•
•
•
•
•
•
2
www.ti.com
– USB 2.0 High-/Full-/Low-Speed Host
– Supports End Points 0-15
General Purpose Memory Controller (GPMC)
– 8-/16-bit Multiplexed Address/Data Bus
– Up to 6 Chip Selects With up to 256M-Byte
Address Space per Chip Select Pin
– Glueless Interface to NOR Flash, NAND
Flash (With BCH and Hamming Error Code
Detection), SRAM and Pseudo-SRAM
– Error Locator Module (ELM) Outside of
GPMC to Provide Up to 16-Bit/512-Bytes
Hardware ECC for NAND
– Flexible Asynchronous Protocol Control for
Interface to FPGA, CPLD, ASICs, etc.
Enhanced Direct-Memory-Access (EDMA)
Controller
– Four Transfer Controllers
– 64/8 Independent DMA/QDMA Channels
Seven 32-bit General-Purpose Timers
One System Watchdog Timer
Three Configurable UART/IrDA/CIR Modules
– UART0 With Modem Control Signals
– Supports up to 3.6864 Mbps UART
– SIR, MIR, FIR (4.0 MBAUD), and CIR
One 40-MHz Serial Peripheral Interface (SPI)
With Four Chip-Selects
SD/SDIO serial interface (1-/4-Bit)
Dual Inter-Integrated Circuit ( I2C BUS®) Ports
• Three Multichannel Audio Serial Ports
– One Six-Serializer Transmit/Receive Port
– Two Dual-Serializer Transmit/Receive Ports
– DIT-Capable For S/PDIF (All Ports)
• Multichannel Buffered Serial Port (McBSP)
– Transmit/Receive Clocks up to 48 MHz
– Two Clock Zones and Two Serial Data Pins
– Supports TDM, I2S, and Similar Formats
• Real-Time Clock (RTC)
– One-Time or Periodic Interrupt Generation
• Up to 64 General-Purpose I/O (GPIO) Pins
• On-Chip ARM® ROM Bootloader (RBL)
• Power, Reset, and Clock Management
– SmartReflex™ Technology (Level 2)
– Seven Independent Core Power Domains
– Clock Enable/Disable Control For
Subsystems and Peripherals
• IEEE-1149.1 (JTAG) and IEEE-1149.7 (cJTAG)
Compatible
• 1031-Pin Pb-Free BGA Package (CYG Suffix),
0.65-mm Ball Pitch
• Via Channel™ Technology Enables use of 0.8mm Design Rules
• 40-nm CMOS Technology
• 3.3-V Single-Ended LVCMOS I/Os (except for
DDR3 at 1.5 V, DDR2 at 1.8 V, and DEV_CLKIN
at 1.8 V)
Device Summary
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1.2
•
•
•
•
•
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Applications
Single-Board Computing
Network and Communications Processing
Industrial Automation
Human Machine Interface
Interactive Point-of-Service Kiosks
1.3
Description
The AM389x Sitara™ ARM® Processors are a highly-integrated, programmable platform that leverages
TI's Sitara™ technology to meet the processing needs of the following applications: Single-Board
Computing, Network and Communications Processing, Industrial Automation, Human Machine Interface,
and Interactive Point-of-Service Kiosks.
The device enables OEMs and ODMs to quickly bring to market devices featuring robust operating
systems support, rich user interfaces, and high processing performance through the maximum flexibility of
a fully integrated mixed processor solution. The device combines high-performance ARM® processing with
a highly-integrated peripheral set.
The ARM® Cortex™-A8 32-bit RISC processor with NEON™ floating-point extension includes: 32K bytes
(KB) of instruction cache; 32KB of data cache; 256KB of L2 cache; and 64KB of RAM.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each of the peripherals, see the related sections in this document and
the associated peripheral reference guides. The peripheral set includes: HD Video Processing Subsystem
(HDVPSS), which provides output of simultaneous HD and SD analog video and dual HD video inputs; up
to two Gigabit Ethernet MACs (10/100/1000 Mbps) with GMII and MDIO interface; two USB ports with
integrated 2.0 PHY; PCIe® port x2 lanes GEN2 compliant interface, which allows the device to act as a
PCIe® root complex or device endpoint; one 6-channel McASP audio serial port (with DIT mode); two
dual-channel McASP audio serial ports (with DIT mode); one McBSP multichannel buffered serial port;
three UARTs with IrDA and CIR support; SPI serial interface; SD/SDIO serial interface; two I2C
master/slave interfaces; up to 64 General-Purpose I/O (GPIO); seven 32-bit timers; system watchdog
timer; dual DDR2/3 SDRAM interface; flexible 8/16-bit asynchronous memory interface; and up to two
SATA interfaces for external storage on two disk drives, or more with the use of a port multiplier.
The device also includes an SGX530 3D graphics engine (available only on the AM3894 device) to offload many video and imaging processing tasks from the core. Additionally, it has a complete set of
development tools for the ARM which include C compilers and a Microsoft ® Windows® debugger interface
for visibility into source code execution.
The device package has been specially engineered with Via Channel™ technology. This technology
allows 0.8-mm pitch PCB feature sizes to be used in this 0.65-mm pitch package, and substantially
reduces PCB costs. It also allows PCB routing in only two signal layers due to the increased layer
efficiency of the Via Channel™ BGA technology.
Device Summary
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1.4
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Functional Block Diagram
Figure 1-1 shows the functional block diagram of the device.
256KB L2 Cache
Boot ROM
48KB
RAM
64KB
ICECrusher™
Software
Video Capture
Media Controller
32KB
D-Cache
512KB On-Chip RAM
32KB
I-Cache
NEON
FPU
SGX530 3D Graphics Engine
Cortex™-A8
CPU
HD Video Processing
Subsystem (HDVPSS)
(A)
ARM Subsystem
Display Processing
HD OSD
SD OSD
HD VENC
SD VENC
HD DACs
SD DACs
HDMI Xmt
System Interconnect
System Control
Peripherals
Serial Interfaces
Real-Time
Clock
PRCM
GP Timer
(7)
JTAG
Watchdog
Timer
McASP
(3)
McBSP
SPI
I2C
(2)
Program/Data Storage
DDR3
32-bit
(2)
GPMC
and
ELM
SATA
3 Gbps
(2)
SD/SDIO
DMA
EDMA
Connectivity
EMAC
GMII/MII
(2)
MDIO
USB 2.0
Ctrl/PHY
(2)
PCIe 2.0
(One Port,
x2 Lanes)
UART
(3)
A. SGX530 is available only on the AM3894 device.
Figure 1-1. AM389x Functional Block Diagram
4
Device Summary
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
........................................ 1
............................................. 1
1.2
Applications .......................................... 3
1.3
Description ........................................... 3
1.4
Functional Block Diagram ........................... 4
Revision History .............................................. 6
2 Device Overview ........................................ 7
2.1
Device Comparison .................................. 7
2.2
Device Characteristics ............................... 8
2.3
ARM Subsystem ..................................... 9
2.4
Media Controller .................................... 11
2.5
Inter-Processor Communication .................... 11
1
Device Summary
1.1
2.6
4
5
6
7
8
Power, Reset and Clock Management (PRCM)
Module .............................................. 12
............................ 17
2.8
Memory Map Summary ............................. 18
Device Pins ............................................. 28
3.1
Pin Assignments .................................... 28
3.2
Terminal Functions ................................. 46
Device Configurations .............................. 107
4.1
Control Module .................................... 107
4.2
Debugging Considerations ........................ 110
4.3
Boot Sequence .................................... 111
4.4
Pin Multiplexing Control ........................... 112
4.5
How to Handle Unused Pins ...................... 119
System Interconnect ................................ 120
5.1
L3 Interconnect .................................... 120
5.2
L4 Interconnect .................................... 122
Device Operating Conditions ...................... 124
2.7
3
Features
SGX530 (AM3894 only)
6.1
Absolute Maximum Ratings (Unless Otherwise
Noted) ............................................. 124
6.2
6.3
Recommended Operating Conditions ............. 125
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted) .......... 127
.........
Power Supplies ....................................
Reset ..............................................
...........................................
..........................................
Peripheral Information and Timings .............
8.1
Parameter Information ............................
7.3
Clocking
7.4
Interrupts
155
Recommended Clock and Control Signal Transition
Behavior ........................................... 156
8.3
DDR2/3 Memory Controller
8.4
8.5
Emulation Features and Capability ............... 193
Enhanced Direct Memory Access (EDMA)
Controller .......................................... 197
8.6
Ethernet Media Access Controller (EMAC)
8.7
8.8
General-Purpose Input/Output (GPIO) ............ 212
General-Purpose Memory Controller (GPMC) and
Error Locator Module (ELM) ...................... 215
8.9
8.10
High-Definition Multimedia Interface (HDMI) ...... 236
High-Definition Video Processing Subsystem
(HDVPSS) ......................................... 245
8.11
Inter-Integrated Circuit (I2C)
252
8.12
Multichannel Audio Serial Port (McASP)
256
8.13
8.14
Peripheral Component Interconnect Express (PCIe)
.......................
157
.......
203
......................
..........
Multichannel Buffered Serial Port (McBSP) .......
.....................................................
264
268
8.15
8.16
Real-Time Clock (RTC) ........................... 272
Secure Digital/Secure Digital Input Output
(SD/SDIO) ......................................... 274
8.17
Serial ATA Controller (SATA)
8.19
8.20
8.21
.....................
Serial Peripheral Interface (SPI) ..................
Timers .............................................
277
281
288
Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 291
....................
.............
Device Support ....................................
Documentation Support ...........................
Community Resources ............................
Universal Serial Bus (USB2.0)
295
Device and Documentation Support
302
9.1
302
9.2
9.3
303
303
10 Mechanical Packaging and Orderable
Information ............................................ 304
Power, Reset, Clocking, and Interrupts
129
7.1
129
10.1
Thermal Data for CYG
132
10.2
Packaging Information
7.2
147
155
8.2
8.18
9
137
............................
............................
Contents
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This revision history highlights the technical changes made to the document in this revision.
AM389x Revisions
SEE
Section 1.1
ADDITIONS/MODIFICATIONS/DELETIONS
Features:
Changed ARM Cortex-A8 processor to 1.35 GHz
Table 2-2
Characteristics of the Processor:
Modified CPU Frequency and Cycle Time
Section 6.2
Recommended Operating Conditions:
Modified FSYSCLK MAX value
Table 7-13
PLL Clock Frequencies:
Modified Clock2, ARM @ 1.35 GHz
Table 7-15
SYSCLK Frequencies:
Modified SYSCLK2 and SYSCLK23 MAX FREQUENCY for DEVICE SPEED RANGE 135
Table 7-16
Module Clock Frequencies:
Modified Cortex-A8 and SGX530 MAX FREQUENCY for DEVICE SPEED RANGE 135
Figure 9-1
Device Nomenclature:
Modified DEVICE SPEED RANGE
6
Contents
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2 Device Overview
2.1
Device Comparison
There are variations in the availability of some functions of the AM389x devices. A comparison of the
devices, highlighting the differences, is shown in Table 2-1. For more detailed information on the
significant device features, see Section 2.2, Device Characteristics.
Table 2-1. Device Comparison
FEATURES
SGX530
DEVICES
AM3894
AM3892
Y
N
Device Overview
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2.2
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Device Characteristics
Table 2-2 provides an overview of the significant features of the AM389x devices, including the capacity of
on-chip RAM, peripherals, and the package type with pin count.
Table 2-2. Characteristics of the Processor
HARDWARE FEATURES
AM3894/AM3892
1 16-/24-bit HD Capture Channel or
2 8-bit SD Capture Channels
and
1 16-bit HD Capture Channel or
2 8-bit SD Capture Channels
and
1 16-/24-/32-bit HD Display Channel
and
1 16-bit HD Display Channel
and
3 HD and 4 SD Video DACs
and
1 HDMI 1.3 Transmitter
HD Video Processing Subsystem (HDVPSS)
DDR2/3 Memory Controller
GPMC and ELM
Peripherals
Not all peripherals pins are
available at the same time (for
more detail, see Section 4,
Device Configurations).
2 (32-bit Bus Widths)
Asynchronous (8-/16-bit bus width) RAM, NOR, NAND
EDMA
64 Independent Channels
8 QDMA Channels
10/100/1000 Ethernet MAC with Management
Data Input/Output (MDIO)
2 (with MII/GMII Interface)
2 (Supports High- and Full-Speed as a Device and
High-, Full-, and Low-Speed as a Host)
USB 2.0
PCI Express 2.0
1 Port (2 5.0GT/s lanes)
Timers
7 (32-bit General purpose)
and
1 (Watchdog)
UART
3 (with SIR, MIR, CIR support and RTS/CTS flow
control)
(UART0 Supports Modem Interface)
SPI
1 (Supports 4 slave devices)
SD/SDIO
1 (1-bit or 4-bit)
I2C
2 (Master/Slave)
McASP
3 (6/2/2 Serializers, Each with Transmit/Receive and
DIT capability)
McBSP
1 (2 Data Pins, Transmit/Receive)
Serial ATA (SATA)
On-Chip Memory
Supports 2 Interfaces
RTC
1
GPIO
Up to 64 pins
ARM
32KB I-cache
32KB D-cache
256KB L2 Cache
64KB RAM
48KB Boot ROM
Organization
MEDIA CONTROLLER
32KB Shared L1 Cache
256KB L2 RAM
ADDITIONAL SHARED MEMORY
512KB On-chip RAM
CPU ID + CPU Rev ID
Control Status Register (CSR.[31:16])
JTAG BSDL_ID
JTAGID Register
CPU Frequency
MHz
Cycle Time
ns
8
0x1003
0x2B81 E02F
Up to 1350 MHz
0.741 ns
Device Overview
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Table 2-2. Characteristics of the Processor (continued)
HARDWARE FEATURES
AM3894/AM3892
Core Logic (V)
1.0 V with Required AVS Capability
USB Logic (V)
0.9 V
Voltage
RAM (V)
1.0 V
I/O (V)
1.5 V, 1.8 V, 3.3 V
Package
25 x 25 mm
Process Technology
µm
Product Status (1)
Product Preview (PP),
Advance Information (AI),
or Production Data (PD)
(1)
2.3
1031-Pin BGA (CYG)
0.04 µm
PD
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
ARM Subsystem
The ARM subsystem is designed to give the ARM Cortex-A8 master control of the device. In general, the
ARM Cortex-A8 is responsible for configuration and control of the various subsystem, peripherals, and
external memories.
The ARM subsystem includes the following features:
• ARM Cortex-A8 RISC processor:
– ARMv7 ISA plus Thumb®-2, Jazelle-X, and media extensions
– NEON floating-point unit
– Enhanced memory management unit (MMU)
– Little Endian
– 32KB L1 instruction cache
– 32KB L1 data cache
– 256KB L2 cache
• Foresight embedded trace module (ETM)
• ARM Cortex-A8 interrupt controller (AINTC)
• 64KB internal RAM
• 48KB internal public ROM.
DEVOSC
L3
SYSCLK2
64
ARM Cortex™-A8
128
System Events
DMM
64
128
128
Arbiter
128
32KB L1I$ 32KB L1D$
128
32
32
ARM Cortex-A8
Interrupt Controller
(AINTC)
64
48KB ROM
64
64KB RAM
256KB L2$
Trace
ETM
NEON
Debug
ICECrusher
Figure 2-1. ARM Cortex-A8 Subsystem Block Diagram
Device Overview
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2.3.1
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ARM Cortex-A8 RISC Processor
The ARM Cortex-A8 subsystem integrates the ARM Cortex-A8 processor. The ARM Cortex-A8 processor
is a member of ARM Cortex family of general-purpose processors. This processor is targeted at multitasking applications where full memory management, high performance, low die size, and low power are
all important. The ARM Cortex-A8 processor supports the ARM debug architecture and includes logic to
assist in both hardware and software debug. The ARM Cortex-A8 processor has a Harvard architecture
and provides a complete high-performance subsystem, including:
• ARM Cortex-A8 integer core
• Superscalar ARMv7 instruction set
• Thumb-2 instruction set
• Jazelle RCT acceleration
• CP14 debug coprocessor
• CP15 system control coprocessor
• NEON 64-/128-bit hybrid SIMD engine for multimedia
• Enhanced memory management unit (MMU)
• Separate level-1 instruction and data caches
• Integrated level-2 cache
• 128-bit interconnect to system memories and peripherals
• Embedded trace module (ETM).
2.3.2
Embedded Trace Module (ETM)
To support real-time trace, the ARM Cortex-A8 processor provides an interface to enable connection of an
embedded trace module (ETM). The ETM consists of two parts:
• The Trace port provides real-time trace capability for the ARM Cortex-A8.
• Triggering facilities provide trigger resources, which include address and data comparators, counter,
and sequencers.
The ARM Cortex-A8 trace port is connected to the system-level embedded trace buffer (ETB). The ETB
has a 32KB buffer memory. ETB enabled debug tools are required to read/interpret the captured trace
data.
For more details on the ETB, see Section 8.4.2.
2.3.3
ARM Cortex-A8 Interrupt Controller (AINTC)
The ARM Cortex-A8 subsystem contains an interrupt controller (AINTC) that prioritizes all service requests
from the system peripherals and generates either IRQ or FIQ to the ARM Cortex-A8 processor. For more
details on the AINTC, see Section 7.4.
2.3.4
System Interconnect
The ARM Cortex-A8 processor in connected through the arbiter to both an L3 interconnect port and a
DMM port. The DMM port is 128-bits wide and provides the ARM Cortex-A8 direct access to the DDR
memories, while the L3 interconnect port is 64-bits wide and provides access to the remaining device
modules.
10
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2.4
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Media Controller
The Media Controller has the responsibility of managing the HDVPSS module.
2.5
Inter-Processor Communication
This device is a multi-core device that requires software to efficiently manage and communicate between
the cores. The following are the main features that need to be implemented by such software:
1. Device management of the slave processors from the host processor.
2. Inter-processor communication between the cores for transfer and exchange of information between
them.
For implementing efficient inter-processor communication between the multiple cores on the device, the
following hardware features are provided:
• Mailbox interrupts
• Hardware spinlocks
Mailboxes provide a mechanism for one processor to write a value to a register and send an interrupt to
another processor. Spinlocks facilitate access to shared resources in the system.
2.5.1
Mailbox Module
The device Mailbox module facilitates communication between the ARM Cortex-A8 and the Media
Controller. It consists of twelve mailboxes, each supporting communication between two of the above
processors. The sender sends information to the receiver by writing a message to the mailbox registers.
Interrupt signaling is used to notify the receiver that a message has been queued or to notify the sender
about an overflow situation.
The Mailbox module supports the following features (see Figure 2-2):
• 12 mailboxes
• Four-message FIFO depth for each message queue
• 32-bit message width
• Message reception and queue-not-full notification using interrupts
• Three interrupts (one to ARM Cortex-A8, two to Media Controller).
Mailbox Module
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
Mailbox
L4
Interconnect
Interrupt
ARM Cortex-A8
Interrupt
Interrupt
Media Controller
Figure 2-2. Mailbox Module Block Diagram
Device Overview
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Mailbox Registers
Table 2-3 lists the Mailboxes available on this device. The register set below is applicable to these
mailboxes. Table 2-4 lists the Mailbox registers.
Table 2-3. Mailboxes
MAILBOX TYPE
USER NUMBER (u)
MAILBOX NUMBER (m)
MESSAGES PER MAILBOX
System Mailbox
0 to 3
0 to 11
4
Table 2-4. Mailbox Registers Summary (1)
(1)
HEX ADDRESS
ACRONYM
0x480C 8000
MAILBOX_REVISION
REGISTER NAME
0x480C 8010
MAILBOX_SYSCONFIG
Mailbox System Configuration
0x480C 8040 + (0x4 * m)
MAILBOX_MESSAGE_m
Mailbox Message
0x480C 8080 + (0x4 * m)
MAILBOX_FIFOSTATUS_m
Mailbox FIFO Status
0x480C 80C0 + (0x4 * m)
MAILBOX_MSGSTATUS_m
Mailbox Message Status
Mailbox Revision
0x480C 8100 + (0x10 * u)
MAILBOX_IRQSTATUS_RAW_u Mailbox IRQ RAW Status
0x480C 8104 + (0x10 * u)
MAILBOX_IRQSTATUS_CLR_u
Mailbox IRQ Clear Status
0x480C 8108 + (0x10 * u)
MAILBOX_IRQENABLE_SET_u
Mailbox IRQ Enable Set
0x480C 810C + (0x10 * u)
MAILBOX_IRQENABLE_CLR_u
Mailbox IRQ Enable Clear
0x480C 8140
-
Reserved
For the range of m and u, see Table 2-3.
2.5.2
Spinlock Module
The Spinlock module provides hardware assistance for synchronizing the processes running on multiple
processors in the device:
• ARM Cortex-A8 processor
• Media Controller processors.
The Spinlock module implements 64 spinlocks (or hardware semaphores) that provide an efficient way to
perform a lock operation of a device resource using a single read-access, avoiding the need for a readmodify-write bus transfer of which the programmable cores are not capable.
2.5.2.1
Spinlock Registers
Table 2-5. Spinlock Registers Summary (1)
(1)
2.6
HEX ADDRESS
ACRONYM
0x480C A000
SPINLOCK_REV
REGISTER NAME
0x480C A010h
SPINLOCK_SYSCFG
System Configuration
0x480C A014h
SPINLOCK_SYSSTAT
System Status
0x480C A800 + (0x4*i)
SPINLOCK_LOCK_REG_i
Revision
Lock
i = 0 to 63
Power, Reset and Clock Management (PRCM) Module
The PRCM module is the centralized management module for the power, reset, and clock control signals
of the device. It interfaces with all the components on the device for power, clock, and reset management
through power-control signals. It integrates enhanced features to allow the device to adapt energy
consumption dynamically, according to changing application and performance requirements. The
innovative hardware architecture allows a substantial reduction in leakage current.
The PRCM module is composed of two main entities:
12
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Power reset manager (PRM): Handles the power, reset, wake-up management, and system clock
source control (oscillator)
Clock manager (CM): Handles the clock generation, distribution, and management.
Table 2-6 lists the physical addresses of the PRM and CM modules. Table 2-7 through Table 2-18 provide
register mapping summaries of the PRM and CM registers.
For more details on the PRCM, see Section 7 of this data sheet, Power, Reset, Clocking and Interrupts,
and the PRCM chapter of the AM389x Sitara ARM Processors Technical Reference Manual (literature
number SPRUGX7).
Table 2-6. PRCM Register Address Summary
ADDRESS OFFSET
MODULE NAME
SIZE
SEE
0x0000
PRM_DEVICE
256 Bytes
Table 2-7
0x0100
CM_DEVICE
256 Bytes
Table 2-8
0x0300
CM_DPLL
256 Bytes
Table 2-10
0x0400
CM_ACTIVE
256 Bytes
Table 2-11
0x0500
CM_DEFAULT
256 Bytes
Table 2-12
0x0900
CM_SGX
256 Bytes
Table 2-13
0x0A00
PRM_ACTIVE
256 Bytes
Table 2-14
0x0B00
PRM_DEFAULT
256 Bytes
Table 2-15
0x0F00
PRM_SGX
256 Bytes
Table 2-16
0x1400
CM_ALWON
1 KBytes
Table 2-17
0x1800
PRM_ALWON
1 KBytes
Table 2-18
Table 2-7. PRM_DEVICE Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 00A0
PRM_RSTCTRL
Global software cold and warm reset control
0x4818 00A4
PRM_RSTTIME
Reset duration control
0x4818 00A8
PRM_RSTST
Global reset sources log
Table 2-8. CM_DEVICE Register Summary
HEX ADDRESS
ACRONYM
0x4818 0100
CM_CLKOUT_CTRL
REGISTER NAME
SYS_CCCLKOUT output control
Table 2-9. OCP_SOCKET_PRM Register Summary
HEX ADDRESS
ACRONYM
0x4818 0200
REVISION_PRM
REGISTER NAME
PRCM IP revision code
Table 2-10. CM_DPLL Register Summary
HEX ADDRESS
ACRONYM
0x4818 0300
CM_SYSCLK1_CLKSEL
REGISTER NAME
SYSCLK1 clock divider value select
0x4818 0304
CM_SYSCLK2_CLKSEL
SYSCLK2 clock divider value select
0x4818 0308
CM_SYSCLK3_CLKSEL
SYSCLK3 clock divider value select
0x4818 030C
CM_SYSCLK4_CLKSEL
SYSCLK4 clock divider value select
0x4818 0310
CM_SYSCLK5_CLKSEL
SYSCLK5 clock divider value select
0x4818 0314
CM_SYSCLK6_CLKSEL
SYSCLK6 clock divider value select
0x4818 0318
CM_SYSCLK7_CLKSEL
SYSCLK7 clock divider value select
0x4818 0324
CM_SYSCLK10_CLKSEL
SYSCLK10 clock divider value select
0x4818 032C
CM_SYSCLK11_CLKSEL
SYSCLK11 clock divider value select
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Table 2-10. CM_DPLL Register Summary (continued)
HEX ADDRESS
ACRONYM
0x4818 0334
CM_SYSCLK13_CLKSEL
REGISTER NAME
SYSCLK13 clock divider value select
0x4818 0338
CM_SYSCLK15_CLKSEL
SYSCLK15 clock divider value select
0x4818 0340
CM_VPB3_CLKSEL
Video PLL B3 clock divider value select
0x4818 0344
CM_VPC1_CLKSEL
Video PLL C1 clock divider value select
Video PLL D1 clock divider value select
0x4818 0348
CM_VPD1_CLKSEL
0x4818 034C
CM_SYSCLK19_CLKSEL
SYSCLK19 clock divider value select
0x4818 0350
CM_SYSCLK20_CLKSEL
SYSCLK20 clock divider value select
0x4818 0354
CM_SYSCLK21_CLKSEL
SYSCLK21 clock divider value select
0x4818 0358
CM_SYSCLK22_CLKSEL
SYSCLK22 clock divider value select
0x4818 035C
CM_APA_CLKSEL
Audio PLL A clock divider value select
0x4818 0370
CM_SYSCLK14_CLKSEL
SYSCLK14 clock mux select line
0x4818 0374
CM_SYSCLK16_CLKSEL
SYSCLK16 clock mux select line
0x4818 0378
CM_SYSCLK18_CLKSEL
SYSCLK18 clock mux select line
0x4818 037C
CM_AUDIOCLK_MCASP0_CLKSEL
McASP0 audio clock mux select line
0x4818 0380
CM_AUDIOCLK_MCASP1_CLKSEL
McASP1 audio clock mux select line
0x4818 0384
CM_AUDIOCLK_MCASP2_CLKSEL
McASP2 audio clock mux select line
0x4818 0388
CM_AUDIOCLK_MCBSP_CLKSEL
McBSP audio clock mux select line
0x4818 0390
CM_TIMER1_CLKSEL
Timer1 clock mux select line
0x4818 0394
CM_TIMER2_CLKSEL
Timer2 clock mux select line
0x4818 0398
CM_TIMER3_CLKSEL
Timer3 clock mux select line
0x4818 039C
CM_TIMER4_CLKSEL
Timer4 clock mux select line
0x4818 03A0
CM_TIMER5_CLKSEL
Timer5 clock mux select line
0x4818 03A4
CM_TIMER6_CLKSEL
Timer6 clock mux select line
0x4818 03A8
CM_TIMER7_CLKSEL
Timer7 clock mux select line
0x4818 03B0
CM_SYSCLK23_CLKSEL
SYSCLK23 clock divider value select
0x4818 03B4
CM_SYSCLK24_CLKSEL
SYSCLK24 clock divider value select
Table 2-11. CM_ACTIVE Register Summary
HEX ADDRESS
ACRONYM
0x4818 0404
CM_HDDSS_CLKSTCTRL
0x4818 0408
CM_HDMI_CLKSTCTRL
0x4818 0424
0x4818 0428
REGISTER NAME
HDVPSS clock domain power state transition
HDMI clock domain power state transition
CM_ACTIVE_HDDSS_CLKCTRL HDVPSS clock management control
CM_ACTIVE_HDMI_CLKCTRL
HDMI clock management control
Table 2-12. CM_DEFAULT Register Summary
14
HEX ADDRESS
ACRONYM
0x4818 0504
CM_DEFAULT_L3_MED_CLKSTCTRL
REGISTER NAME
L3 clock domain power state transition
0x4818 0508
CM_DEFAULT_L3_FAST_CLKSTCTRL
L3 clock domain power state transition
0x4818 0510
CM_DEFAULT_PCI_CLKSTCTRL
PCI clock domain power state transition
0x4818 0514
CM_DEFAULT_L3_SLOW_CLKSTCTRL
L3 clock domain power state transition
0x4818 0520
CM_DEFAULT_EMIF_0_CLKCTRL
EMIF0 clock management control
0x4818 0524
CM_DEFAULT_EMIF_1_CLKCTRL
EMIF1 clock management control
0x4818 0528
CM_DEFAULT_DMM_CLKCTRL
DMM clock management control
0x4818 052C
CM_DEFAULT_FW_CLKCTRL
EMIF FW clock management control
0x4818 0558
CM_DEFAULT_USB_CLKCTRL
USB clock management control
0x4818 0560
CM_DEFAULT_SATA_CLKCTRL
SATA clock management control
0x4818 0578
CM_DEFAULT_PCI_CLKCTRL
PCI clock management control
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Table 2-13. CM_SGX Register Summary
HEX ADDRESS
ACRONYM
0x4818 0900
CM_SGX_CLKSTCTRL
0x4818 0920
CM_SGX_SGX_CLKCTRL
REGISTER NAME
SGX530 clock domain power state transition
SGX530 clock management control
Table 2-14. PRM_ACTIVE Register Summary
HEX ADDRESS
ACRONYM
0x4818 0A00
PM_ACTIVE_PWRSTCTRL
REGISTER NAME
0x4818 0A04
PM_ACTIVE_PWRSTST
Active power domain state status
0x4818 0A10
RM_ACTIVE_RSTCTRL
Active domain reset control release
0x4818 0A14
RM_ACTIVE_RSTST
Active power state control
Active domain reset source log
Table 2-15. PRM_DEFAULT Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 0B00
PM_DEFAULT_PWRSTCTRL
Default power state
0x4818 0B04
PM_DEFAULT_PWRSTST
Default power domain state 0 status
0x4818 0B10
RM_DEFAULT_RSTCTRL
Default subsystem reset control release
0x4818 0B14
RM_DEFAULT_RSTST
Default domain reset source log
Table 2-16. PRM_SGX Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 0F00
PM_SGX_PWRSTCTRL
0x4818 0F04
RM_SGX_RSTCTRL
SGX530 domain reset control release
0x4818 0F10
PM_SGX_PWRSTST
SGX530 power domain state status
0x4818 0F14
RM_SGX_RSTST
SGX530 power state control
SGX530 domain reset source log
Table 2-17. CM_ALWON Register Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4818 1400
CM_ALWON_L3_SLOW_CLKSTCTRL
0x4818 1404
CM_ETHERNET_CLKSTCTRL
0x4818 1408
CM_ALWON_L3_MED_CLKSTCTRL
L3 clock domain power state transition
0x4818 1414
CM_ALWON_OCMC_0_CLKSTCTRL
OCMC 0 clock domain power state transition
0x4818 1418
CM_ALWON_OCMC_1_CLKSTCTRL
OCMC 1 clock domain power state transition
0x4818 141C
CM_ALWON_MPU_CLKSTCTRL
Processor clock domain power state transition
0x4818 1420
CM_ALWON_SYSCLK4_CLKSTCTRL
SYSCLK4 clock domain power state transition
0x4818 1424
CM_ALWON_SYSCLK5_CLKSTCTRL
SYSCLK5 clock domain power state transition
0x4818 1428
CM_ALWON_SYSCLK6_CLKSTCTRL
SYSCLK6 clock domain power state transition
0x4818 142C
CM_ALWON_RTC_CLKSTCTRL
0x4818 1430
CM_ALWON_L3_FAST_CLKSTCTRL
0x4818 1540
CM_ALWON_MCASP0_CLKCTRL
McASP 0 clock management control
0x4818 1544
CM_ALWON_MCASP1_CLKCTRL
McASP 1 clock management control
L3 clock domain power state transition
EMAC clock domain power state transition
RTC clock domain power state transition
L3 clock domain power state transition
0x4818 1548
CM_ALWON_MCASP2_CLKCTRL
McASP 2 clock management control
0x4818 154C
CM_ALWON_MCBSP_CLKCTRL
McBSP clock management control
0x4818 1550
CM_ALWON_UART_0_CLKCTRL
UART 0 clock management control
0x4818 1554
CM_ALWON_UART_1_CLKCTRL
UART 1 clock management control
0x4818 1558
CM_ALWON_UART_2_CLKCTRL
UART 2 clock management control
0x4818 155C
CM_ALWON_GPIO_0_CLKCTRL
GPIO 0 clock management control
0x4818 1560
CM_ALWON_GPIO_1_CLKCTRL
GPIO 1 clock management control
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Table 2-17. CM_ALWON Register Summary (continued)
HEX ADDRESS
ACRONYM
0x4818 1564
CM_ALWON_I2C_0_CLKCTRL
REGISTER NAME
I2C 0 clock management control
0x4818 1568
CM_ALWON_I2C_1_CLKCTRL
I2C 1 clock management control
0x4818 1570
CM_ALWON_TIMER_1_CLKCTRL
Timer1 clock management control
0x4818 1574
CM_ALWON_TIMER_2_CLKCTRL
Timer2 clock management control
0x4818 1578
CM_ALWON_TIMER_3_CLKCTRL
Timer3 clock management control
0x4818 157C
CM_ALWON_TIMER_4_CLKCTRL
Timer4 clock management control
0x4818 1580
CM_ALWON_TIMER_5_CLKCTRL
Timer5 clock management control
0x4818 1584
CM_ALWON_TIMER_6_CLKCTRL
Timer6 clock management control
0x4818 1588
CM_ALWON_TIMER_7_CLKCTRL
Timer7 clock management control
0x4818 158C
CM_ALWON_WDTIMER_CLKCTRL
WDTIMER clock management control
0x4818 1590
CM_ALWON_SPI_CLKCTRL
0x4818 1594
CM_ALWON_MAILBOX_CLKCTRL
MAILBOX clock management control
0x4818 1598
CM_ALWON_SPINBOX_CLKCTRL
SPINBOX clock management control
0x4818 15B0
CM_ALWON_SDIO_CLKCTRL
0x4818 15B4
CM_ALWON_OCMC_0_CLKCTRL
OCMC 0 clock management control
0x4818 15B8
CM_ALWON_OCMC_1_CLKCTRL
OCMC 1 clock management control
0x4818 15C4
CM_ALWON_CONTROL_CLKCTRL
Control clock management control
0x4818 15D0
CM_ALWON_GPMC_CLKCTRL
GPMC clock management control
0x4818 15D4
CM_ALWON_ETHERNET_0_CLKCTRL
Ethernet 0 clock management control
0x4818 15D8
CM_ALWON_ETHERNET_1_CLKCTRL
Ethernet 1 clock management control
0x4818 15DC
CM_ALWON_MPU_CLKCTRL
Processor clock management control
0x4818 15E0
CM_ALWON_DEBUGSS_CLKCTRL
0x4818 15E4
CM_ALWON_L3_CLKCTRL
0x4818 15E8
CM_ALWON_L4HS_CLKCTRL
L4 high-speed clock management control
0x4818 15EC
CM_ALWON_L4LS_CLKCTRL
L4 standard-speed clock management control
0x4818 15F0
CM_ALWON_RTC_CLKCTRL
RTC clock management control
0x4818 15F4
CM_ALWON_TPCC_CLKCTRL
TPCC clock management control
SPI clock management control
SDIO clock management control
Debug clock management control
L3 clock management control
0x4818 15F8
CM_ALWON_TPTC0_CLKCTRL
TPTC0 clock management control
0x4818 15FC
CM_ALWON_TPTC1_CLKCTRL
TPTC1 clock management control
0x4818 1600
CM_ALWON_TPTC2_CLKCTRL
TPTC2 clock management control
0x4818 1604
CM_ALWON_TPTC3_CLKCTRL
TPTC3 clock management control
0x4818 1608
CM_ALWON_SR_0_CLKCTRL
SmartReflex 0 clock management control
0x4818 160C
CM_ALWON_SR_1_CLKCTRL
SmartReflex 1 clock management control
0x4818 1628
CM_ALWON_CUST_EFUSE_CLKCTRL
Customer e-Fuse clock management control
Table 2-18. PRM_ALWON Register Summary
16
HEX ADDRESS
ACRONYM
0x4818 1810
RM_ALWON_RSTCTRL
0x4818 1814
RM_ALWON_RSTST
REGISTER NAME
ALWAYS ON domain resets control
ALWAYS ON reset sources
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2.7
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
SGX530 (AM3894 only)
The SGX530 is a vector/3D graphics accelerator for vector and 3-dimensional (3D) graphics applications.
The SGX530 graphics accelerator efficiently processes a number of various multimedia data types
concurrently:
• Pixel data
• Vertex data
• Video data.
This is achieved using a multi-threaded architecture using two levels of scheduling and data partitioning
enabling zero overhead task switching.
The SGX530 has the following major features:
• Vector graphics and 3D graphics.
• Tile-based architecture.
• Universal Scalable Shader Engine (USSE™) - multi-threaded engine incorporating pixel and vertex
shader functionality. USSE™
• Advanced shader feature set - in excess of Microsoft® VS3.0, PS3.0, and OpenGL 2.0.
• Industry standard API support - OpenGL ES 1.1 and 2.0, OpenVG v1.1.
• Fine-grained task switching, load balancing, and power management.
• Advanced geometry direct memory access (DMA) driven operation for minimum CPU interaction.
• Programmable high-quality image anti-aliasing.
• POWERVR™ SGX core MMU for address translation from the core virtual address to the external
physical address (up to 4GB address range).
• Fully-virtualized memory addressing for OS operation in a unified memory architecture.
• Advanced and standard 2D operations [e.g., vector graphics, block level transfers (BLTs), raster
operations (ROPs)].
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Memory Map Summary
The device has multiple on-chip memories associated with its processors and various subsystems. To
help simplify software development a unified memory map is used where possible to maintain a consistent
view of device resources across all bus masters.
The device system memory mapping is broken into four 1-GB quadrants for target address spaces
allocation. The four quadrants are labeled Q0, Q1, Q2 and Q3 for a total of 4-GB 32-bit address space.
(HDVPSS includes a thirty-third address bit for an additional 4GB of address range; this is for virtual
addressing and not physical memory addressing.) Inside each quadrant, system targets are mapped on 4MB boundary (except EDMA targets which are decreased to 1-MB regions).
2.8.1
L3 Memory Map
The L3 high-performance interconnect is based on a Network-on-Chip (NoC) interconnect infrastructure.
The NoC uses an internal packet-based protocol for forward (read command, write command with data
payload) and backward (read response with data payload, write response) transactions. All exposed
interfaces of this NoC interconnect, both for targets and initiators, comply with the OCPIP2.2 reference
standard.
Table 2-19 shows the general device level-3 (L3) memory map. The table represents the physical
addresses used by the L3 infrastructure. Some processors within the device (such as Cortex™-A8 ARM)
may re-map these targets to different virtual addresses through an internal or external MMU. Processors
without MMUs and other bus masters use these physical addresses to access L3 regions. Note that not all
masters have access to all L3 regions, but only those with defined connectivity, as shown in Table 5-1.
For a list of the specific peripherals attached to each of the Level-4 (L4) peripheral ports see Section 5.2.
The L3 interconnect returns an address-hole error if any initiator attempts to access a target to which it
has no connection.
Table 2-19. L3 Memory Map
BLOCK NAME
START ADDRESS
(HEX)
END ADDRESS
(HEX)
SIZE
Q0
GPMC
0x0100 0000
0x1FFF FFFF
496MB
GPMC(1)
Q0
PCIe Gen2
0x2000 0000
0x2FFF FFFF
256MB
PCIe Gen2 Targets
Q0
Reserved
0x3000 0000
0x3FFF FFFF
256MB
Reserved
Q1
Reserved
0x4000 0000
0x402F FFFF
3MB
Reserved
Q1
L3 OCMC0
0x4030 0000
0x4033 FFFF
256KB
OCMC SRAM
Q1
Reserved
0x4034 0000
0x403F FFFF
768KB
Reserved (OCMC RAM0)
Q1
L3 OCMC1
0x4040 0000
0x4043 FFFF
256KB
OCMC SRAM
Q1
Reserved
0x4044 0000
0x404F FFFF
768KB
Reserved (OCMC RAM1)
Q1
Reserved
0x4050 0000
0x407F FFFF
3MB
Reserved
Q1
Reserved
0x4080 0000
0x4083 FFFF
256KB
Reserved
Q1
Reserved
0x4084 0000
0x40DF FFFF
5888KB
Reserved
Q1
Reserved
0x40E0 0000
0x40E0 7FFF
32KB
Reserved
Q1
Reserved
0x40E0 8000
0x40EF FFFF
992KB
Reserved
Q1
Reserved
0x40F0 0000
0x40F0 7FFF
32KB
Reserved
Q1
Reserved
0x40F0 8000
0x40FF FFFF
992KB
Reserved
Q1
Reserved
0x4100 0000
0x41FF FFFF
16MB
Reserved
Q1
Reserved
0x4200 0000
0x43FF FFFF
32MB
Reserved
Q1
L3 CFG Regs
0x4400 0000
0x44BF FFFF
12MB
L3 configuration registers
Q1
Reserved
0x44C0 0000
0x45FF FFFF
20MB
Reserved
QUAD
18
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Table 2-19. L3 Memory Map (continued)
QUAD
BLOCK NAME
START ADDRESS
(HEX)
END ADDRESS
(HEX)
SIZE
DESCRIPTION
Q1
McASP0
0x4600 0000
0x463F FFFF
4MB
McASP0
Q1
McASP1
0x4640 0000
0x467F FFFF
4MB
McASP1
Q1
McASP2
0x4680 0000
0x46BF FFFF
4MB
McASP2
Q1
HDMI 1.3 Tx
0x46C0 0000
0x46FF FFFF
4MB
HDMI 1.3 Tx
Q1
McBSP
0x4700 0000
0x473F FFFF
4MB
McBSP
Q1
USB2.0
0x4740 0000
0x477F FFFF
4MB
USB2.0 Registers / CPPI
Q1
Reserved
0x4780 0000
0x47BF FFFF
4MB
Reserved
Q1
Reserved
0x47C0 0000
0x47FF FFFF
4MB
Reserved
Q1
L4 Standard domain
0x4800 0000
0x48FF FFFF
16MB
Standard Peripheral domain (see Table 220)
Q1
EDMA TPCC
0x4900 0000
0x490F FFFF
1MB
EDMA TPCC Registers
Q1
Reserved
0x4910 0000
0x497F FFFF
7MB
Reserved
Q1
EDMA TPTC0
0x4980 0000
0x498F FFFF
1MB
EDMA TPTC0 Registers
Q1
EDMA TPTC1
0x4990 0000
0x499F FFFF
1MB
EDMA TPTC1 Registers
Q1
EDMA TPTC2
0x49A0 0000
0x49AF FFFF
1MB
EDMA TPTC2 Registers
Q1
EDMA TPTC3
0x49B0 0000
0x49BF FFFF
1MB
EDMA TPTC3 Registers
Q1
Reserved
0x49C0 0000
0x49FF FFFF
4MB
Reserved
Q1
L4 High-Speed
Domain
0x4A00 0000
0x4AFF FFFF
16MB
High-Speed Peripheral domain (see Table 221)
Q1
Instrumentation
0x4B00 0000
0x4BFF FFFF
16MB
EMU Subsystem region
Q1
DDR EMIF0
registers(2)
0x4C00 0000
0x4CFF FFFF
16MB
Configuration registers
Q1
DDR EMIF1
registers(2)
0x4D00 0000
0x4DFF FFFF
16MB
Configuration registers
Q1
DDR DMM
Registers(2)
0x4E00 0000
0x4FFF FFFF
32MB
Configuration registers
Q1
GPMC Registers
0x5000 0000
0x50FF FFFF
16MB
Configuration registers
Q1
PCIe Gen2 Registers
0x5100 0000
0x51FF FFFF
16MB
Configuration registers
Q1
Reserved
0x5200 0000
0x54FF FFFF
48MB
Reserved
Q1
Reserved
0x5500 0000
0x55FF FFFF
16MB
Reserved
Q1
SGX530
AM3894 only)
0x5600 0000
0x56FF FFFF
16MB
SGX530 Slave Port
Q1
Reserved
(AM3892 only)
0x5600 0000
0x56FF FFFF
16MB
Reserved
Q1
Reserved
0x5700 0000
0x57FF FFFF
16MB
Reserved
Q1
Reserved
0x5800 0000
0x5BFF FFFF
64MB
Reserved
Q1
Reserved
0x5C00 0000
0x5DFF FFFF
32MB
Reserved
Q1
Reserved
0x5E00 0000
0x5FFF FFFF
32MB
Reserved
Q1
Tiler
0x6000 0000
0x7FFF FFFF
512MB
Virtual Tiled Address Space
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Table 2-19. L3 Memory Map (continued)
START ADDRESS
(HEX)
END ADDRESS
(HEX)
SIZE
DESCRIPTION
DDR EMIF0/1
SDRAM(3)
0x8000 0000
0xBFFF FFFF
1GB
DDR
Q3
DDR EMIF0/1
SDRAM(3)
0xC000 0000
0xFFFF FFFF
1GB
DDR
Q4-7
DDR DMM
0x1 0000 0000
0x1 FFFF FFFF
4GB
DDR DMM Tiler Extended address map –
Virtual Views (HDVPSS only)
QUAD
BLOCK NAME
Q
(1) The first section of GPMC memory (0x0 - 0x00FF_FFFF) is reserved for BOOTROM. Accessible memory starts at location
0x0100_0000.
(2) These accesses occur through the DDR DMM Tiler Ports. The DMM will split address ranges internally to address DDR EMIF and DDR
DMM control registers.
(3) DDR EMIF0 and DDR EMIF1 addresses may be contiguous or bank interleaved depending on configuration of the DDR DMM; for more
details, see the DDR DMM documentation.
20
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2.8.2
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
L4 Memory Map
2.8.2.1
L4 Standard Peripheral
The L4 standard peripheral bus accesses standard peripherals and IP configuration registers. The
memory map is shown in Table 2-20.
Table 2-20. L4 Standard Peripheral Memory Map
DEVICE NAME
START ADDRESS
(HEX)
END ADDRESS (HEX)
SIZE
DESCRIPTION
0x4800 0000
0x4800 07FF
2KB
Address/Protection (AP)
0x4800 0800
0x4800 0FFF
2KB
Link Agent (LA)
0x4800 1000
0x4800 13FF
1KB
Initiator Port (IP0)
0x4800 1400
0x4800 17FF
1KB
Initiator Port (IP1)
0x4800 1800
0x4800 1FFF
2KB
Reserved (IP2 – IP3)
Reserved
0x4800 2000
0x4800 7FFF
24KB
Reserved
e-Fuse Controller
0x4800 8000
0x4800 8FFF
4KB
Peripheral Registers
0x4800 9000
0x4800 9FFF
4KB
Support Registers
Reserved
0x4800 A000
0x4800 FFFF
24KB
Reserved
Reserved
0x4801 2000
0x4801 FFFF
56KB
Reserved
UART0
0x4802 0000
0x4802 0FFF
4KB
Peripheral Registers
0x4802 1000
0x4802 1FFF
4KB
Support Registers
0x4802 2000
0x4802 2FFF
4KB
Peripheral Registers
0x4802 3000
0x4802 3FFF
4KB
Support Registers
0x4802 4000
0x4802 4FFF
4KB
Peripheral Registers
0x4802 5000
0x4802 5FFF
4KB
Support Registers
Reserved
0x4802 6000
0x4802 7FFF
8KB
Reserved
I2C0
0x4802 8000
0x4802 8FFF
4KB
Peripheral Registers
0x4802 9000
0x4802 9FFF
4KB
Support Registers
0x4802 A000
0x4802 AFFF
4KB
Peripheral Registers
0x4802 B000
0x4802 BFFF
4KB
Support Registers
Reserved
0x4802 C000
0x4802 DFFF
8KB
Reserved
TIMER1
0x4802 E000
0x4802 EFFF
4KB
Peripheral Registers
0x4802 F000
0x4802 FFFF
4KB
Support Registers
0x4803 0000
0x4803 0FFF
4KB
Peripheral Registers
0x4803 1000
0x4803 1FFF
4KB
Support Registers
0x4803 2000
0x4803 2FFF
4KB
Peripheral Registers
0x4803 3000
0x4803 3FFF
4KB
Support Registers
0x4803 4000
0x4803 7FFF
16KB
Reserved
L4 Standard
Configuration
UART1
UART2
I2C1
SPIOCP
GPIO0
Reserved
McASP0 CFG
0x4803 8000
0x4803 9FFF
8KB
Peripheral Registers
0x4803 A000
0x4803 AFFF
4KB
Support Registers
Reserved
0x4803 B000
0x4803 BFFF
4KB
Reserved
McASP1 CFG
0x4803 C000
0x4803 DFFF
8KB
Peripheral Registers
0x4803 E000
0x4803 EFFF
4KB
Support Registers
Reserved
0x4803 F000
0x4803 FFFF
4KB
Reserved
TIMER2
0x4804 0000
0x4804 0FFF
4KB
Peripheral Registers
0x4804 1000
0x4804 1FFF
4KB
Support Registers
0x4804 2000
0x4804 2FFF
4KB
Peripheral Registers
0x4804 3000
0x4804 3FFF
4KB
Support Registers
0x4804 4000
0x4804 4FFF
4KB
Peripheral Registers
0x4804 5000
0x4804 5FFF
4KB
Support Registers
TIMER3
TIMER4
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Table 2-20. L4 Standard Peripheral Memory Map (continued)
DEVICE NAME
START ADDRESS
(HEX)
END ADDRESS (HEX)
SIZE
DESCRIPTION
TIMER5
0x4804 6000
0x4804 6FFF
4KB
Peripheral Registers
0x4804 7000
0x4804 7FFF
4KB
Support Registers
TIMER6
0x4804 8000
0x4804 8FFF
4KB
Peripheral Registers
0x4804 9000
0x4804 9FFF
4KB
Support Registers
TIMER7
0x4804 A000
0x4804 AFFF
4KB
Peripheral Registers
0x4804 B000
0x4804 BFFF
4KB
Support Registers
0x4804 C000
0x4804 CFFF
4KB
Peripheral Registers
0x4804 D000
0x4804 DFFF
4KB
Support Registers
Reserved
0x4804 E000
0x4804 FFFF
8KB
Reserved
McASP2 CFG
0x4805 0000
0x4805 1FFF
8KB
Peripheral Registers
GPIO1
0x4805 2000
0x4805 2FFF
4KB
Support Registers
Reserved
0x4805 3000
0x4805 FFFF
52KB
Reserved
SD/SDIO
0x4806 0000
0x4806 FFFF
64KB
Registers
0x4807 0000
0x4807 0FFF
4KB
Support Registers
Reserved
0x4807 1000
0x4807 FFFF
60KB
Reserved
ELM
0x4808 0000
0x4808 FFFF
64KB
Error Location Module
Support Registers
0x4809 0000
0x4809 0FFF
4KB
Reserved
0x4809 1000
0x480B FFFF
188KB
RTC
0x480C 0000
0x480C 0FFF
4KB
Peripheral Registers
0x480C 1000
0x480C 1FFF
4KB
Support Registers
0x480C 2000
0x480C 2FFF
4KB
Peripheral Registers
0x480C 3000
0x480C 3FFF
4KB
Support Registers
Reserved
0x480C 4000
0x480C 7FFF
16KB
Reserved
Mailbox
0x480C 8000
0x480C 8FFF
4KB
Peripheral Registers
0x480C 9000
0x480C 9FFF
4KB
Support Registers
Spinlock
0x480C A000
0x480C AFFF
4KB
Peripheral Registers
0x480C B000
0x480C BFFF
4KB
Support Registers
Reserved
0x480C C000
0x480F FFFF
208KB
Reserved
HDVPSS
0x4810 0000
0x4811 FFFF
128KB
Peripheral Registers
0x4812 0000
0x4812 0FFF
4KB
Support Registers
Reserved
0x4812 1000
0x4812 1FFF
4KB
Reserved
HDMI 1.3 Tx
0x4812 2000
0x4812 2FFF
4KB
Peripheral Registers
0x4812 3000
0x4812 3FFF
4KB
Support Registers
Reserved
0x4812 4000
0x4813 FFFF
112KB
Reserved
Control Module
0x4814 0000
0x4815 FFFF
128KB
Peripheral Registers
0x4816 0000
0x4816 0FFF
4KB
Reserved
0x4816 1000
0x4817 FFFF
124KB
Reserved
PRCM
0x4818 0000
0x4818 2FFF
12KB
Peripheral Registers
0x4818 3000
0x4818 3FFF
4KB
Support Registers
Reserved
0x4818 4000
0x4818 7FFF
16KB
Reserved
SmartReflex0
0x4818 8000
0x4818 8FFF
4KB
Peripheral Registers
0x4818 9000
0x4818 9FFF
4KB
Support Registers
SmartReflex1
0x4818 A000
0x4818 AFFF
4KB
Peripheral Registers
0x4818 B000
0x4818 BFFF
4KB
Support Registers
OCP Watchpoint
0x4818 C000
0x4818 CFFF
4KB
Peripheral Registers
0x4818 D000
0x4818 DFFF
4KB
Support Registers
WDT1
22
Reserved
Support Registers
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Table 2-20. L4 Standard Peripheral Memory Map (continued)
DEVICE NAME
START ADDRESS
(HEX)
END ADDRESS (HEX)
SIZE
DESCRIPTION
Reserved
0x4818 E000
0x4818 EFFF
4KB
Reserved
0x4818 F000
0x4818 FFFF
4KB
Reserved
0x4819 0000
0x4819 0FFF
4KB
Reserved
0x4819 1000
0x4819 1FFF
4KB
Reserved
0x4819 2000
0x4819 2FFF
4KB
Reserved
0x4819 3000
0x4819 3FFF
4KB
Reserved
0x4819 4000
0x4819 4FFF
4KB
Reserved
0x4819 5000
0x4819 5FFF
4KB
Reserved
0x4819 6000
0x4819 6FFF
4KB
Reserved
0x4819 7000
0x4819 7FFF
4KB
Reserved
0x4819 8000
0x4819 8FFF
4KB
Peripheral Registers
0x4819 9000
0x4819 9FFF
4KB
Support Registers
DDR1 Phy Ctrl Regs
0x4819 A000
0x4819 AFFF
4KB
Peripheral Registers
0x4819 B000
0x4819 BFFF
4KB
Support Registers
Reserved
0x4819 C000
0x481F FFFF
400KB
Interrupt controller (1)
0x4820 0000
0x4820 0FFF
4KB
Cortex™-A8 Accessible Only
Reserved
Reserved
Reserved
Reserved
DDR0 Phy Ctrl Regs
Reserved
(1)
0x4820 1000
0x4823 FFFF
252KB
Cortex™-A8 Accessible Only
MPUSS config
register (1)
0x4824 0000
0x4824 0FFF
4KB
Cortex™-A8 Accessible Only
Reserved (1)
0x4824 1000
0x4827 FFFF
252KB
Cortex™-A8 Accessible Only
(1)
0x4828 1000
0x482F FFFF
508KB
Cortex™-A8 Accessible Only
0x4830 0000
0x48FF FFFF
13MB
Reserved
Reserved
Reserved
(1)
Reserved
These regions (highlighted in yellow) are decoded internally by the Cortex™-A8 Subsystem and are not physically part of the L4
standard. They are included here only for reference when considering the Cortex™-A8 memory map. For masters other than the
Cortex™-A8, these regions are reserved.
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2.8.2.2
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L4 High-Speed Peripheral
The L4 high-speed peripheral bus accesses the IP configuration registers of high-speed peripherals in L3.
The memory map is shown in Table 2-21.
Table 2-21. L4 High-Speed Peripheral Memory Map
DEVICE NAME
L4 High Speed
configuration
END ADDRESS (HEX)
SIZE
DESCRIPTION
0x4A00 0000
0x4A00 07FF
2KB
Address/Protection (AP)
0x4A00 0800
0x4A00 0FFF
2KB
Link Agent (LA)
0x4A00 1000
0x4A00 13FF
1KB
Initiator Port (IP0)
0x4A00 1400
0x4A00 17FF
1KB
Initiator Port (IP1)
0x4A00 1800
0x4A00 1FFF
2KB
Reserved (IP2 – IP3)
Reserved
0x4A00 2000
0x4A07 FFFF
504KB
Reserved
Reserved
0x4A08 0000
0x4A0A 0FFF
132KB
Reserved
Reserved
0x4A0A 1000
0x4A0F FFFF
380KB
Reserved
EMAC0
0x4A10 0000
0x4A10 3FFF
16KB
Peripheral Registers
Support Registers
0x4A10 4000
0x4A10 4FFF
4KB
Reserved
0x4A10 5000
0x4A11 FFFF
108KB
Reserved
EMAC1
0x4A12 0000
0x4A12 3FFF
16KB
Peripheral Registers
Support Registers
0x4A12 4000
0x4A12 4FFF
4KB
Reserved
0x4A12 5000
0x4A13 FFFF
108KB
Reserved
SATA
0x4A14 0000
0x4A14 FFFF
64KB
Peripheral Registers
Support Registers
0x4A15 0000
0x4A15 0FFF
4KB
Reserved
0x4A15 1000
0x4A17 FFFF
188KB
Reserved
Reserved
0x4A18 0000
0x4A19 FFFF
128KB
Reserved
0x4A1A 0000
0x4A1A 0FFF
4KB
Reserved
0x4A1A 1000
0x4AFF FFFF
14716KB
Reserved
Reserved
24
START ADDRESS
(HEX)
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2.8.3
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
TILER Extended Addressing Map
The Tiling and Isometric Lightweight Engines for Rotation (TILER) ports are mainly used for optimized 2-D
block accesses. The TILER also supports rotation of the image buffer at 0º, 90º, 180º, and 270º, with
vertical and horizontal mirroring.
The TILER includes an additional 4-GB addressing range to access the frame buffer in these rotated and
mirrored views. This range requires a thirty-third bit of address and is only accessible to peripherals that
require access to the multiple views. On the device, this is limited to the HD Video Processing Subsystem
(HDVPSS). (Other peripherals, based on ConnID, may access any one single view through the 512-MB
TILER window region located in the base 4-GB range.)
The HDVPSS may use the virtual address space of 4GB (0x1:0000:0000 – 0x1:FFFF:FFFF) since various
VPDMA clients of the HDVPSS may need to simultaneously access multiple 2-D images with different
orientations of the image buffers.
The top 4-GB address space is divided into eight sections of 512MB each. These eight sections
correspond to the eight different orientations as shown in Table 2-22.
Table 2-22. TILER Extended Address Memory Map
BLOCK NAME
START ADDRESS
(HEX)
END ADDRESS (HEX)
SIZE
DESCRIPTION
Tiler View 0
0x1 0000 0000
0x1 1FFF FFFF
512MB
Natural 0° View
Tiler View 1
0x1 2000 0000
0x1 3FFF FFFF
512MB
0° with Vertical Mirror View
Tiler View 2
0x1 4000 0000
0x1 5FFF FFFF
512MB
0° with Horizontal Mirror View
Tiler View 3
0x1 6000 0000
0x1 7FFF FFFF
512MB
180° View
Tiler View 4
0x1 8000 0000
0x1 9FFF FFFF
512MB
90° with Vertical Mirror View
Tiler View 5
0x1 A000 0000
0x1 BFFF FFFF
512MB
270° View
Tiler View 6
0x1 C000 0000
0x1 DFFF FFFF
512MB
90° View
Tiler View 7
0x1 E000 0000
0x1 FFFF FFFF
512MB
90° with Horizontal Mirror View
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2.8.4
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Cortex™-A8 Memory Map
The Cortex™-A8 includes an memory management unit (MMU) to translate virtual addresses to physical
addresses which are then decoded within the Host ARM Subsystem. The subsystem includes its own
ROM and RAM, as well as configuration registers for its interrupt controller. These addresses are hardcoded within the subsystem. In addition, the upper 2GB of address space is routed to a special port
(Master 0) intended for low-latency access to DDR memory. All other physical addresses are routed to the
L3 port (Master 1) where they are decoded by the device infrastructure. The Cortex™-A8 memory map is
shown in Table 2-23.
Table 2-23. Cortex™-A8 Memory Map
REGION NAME
START ADDRESS
(HEX)
END ADDRESS (HEX)
SIZE
DESCRIPTION
Boot Space
0x0000 0000
0x000F FFFF
1MB
Boot Space
L3 Target Space
0x0000 0000
0x1FFF FFFF
512MB
GPMC
0x2000 0000
0x2FFF FFFF
256MB
PCIe Gen2 Targets
0x3000 0000
0x3FFF FFFF
256MB
Reserved
0x4000 0000
0x4001 FFFF
128KB
Reserved
0x4002 0000
0x4002 BFFF
48KB
Public
0x4002 C000
0x400F FFFF
848KB
Reserved
0x4010 0000
0x401F FFFF
1MB
Reserved
(1)
ROM internal
Reserved(1)
(1)
Reserved
26
0x4020 0000
0x402E FFFF
960KB
Reserved
Reserved
0x402F 0000
0x402F FFFF
64KB
Reserved
L3 Target Space
0x4030 0000
0x4033 FFFF
256KB
OCMC SRAM
0x4034 0000
0x403F FFFF
768KB
Reserved
0x4040 0000
0x4043 FFFF
256KB
OCMC SRAM
0x4044 0000
0x404F FFFF
768KB
Reserved
0x4050 0000
0x407F FFFF
3MB
Reserved
0x4080 0000
0x4083 FFFF
256KB
Reserved
0x4084 0000
0x40DF FFFF
5888KB
Reserved
0x40E0 0000
0x40E0 7FFF
32KB
Reserved
0x40E0 8000
0x40EF FFFF
992KB
Reserved
0x40F0 0000
0x40F0 7FFF
32KB
Reserved
0x40F0 8000
0x40FF FFFF
992KB
Reserved
0x4100 0000
0x41FF FFFF
16MB
Reserved
0x4200 0000
0x43FF FFFF
32MB
Reserved
0x4400 0000
0x44BF FFFF
12MB
L3 configuration registers
0x44C0 0000
0x45FF FFFF
20MB
Reserved
0x4600 0000
0x463F FFFF
4MB
McASP0
0x4640 0000
0x467F FFFF
4MB
McASP1
0x4680 0000
0x46BF FFFF
4MB
McASP2
0x46C0 0000
0x46FF FFFF
4MB
HDMI 1.3 Tx
0x4700 0000
0x473F FFFF
4MB
McBSP
0x4740 0000
0x477F FFFF
4MB
USB2.0 Registers / CPPI
0x4780 0000
0x47BF FFFF
4MB
Reserved
0x47C0 0000
0x47FF FFFF
4MB
Reserved
0x4800 0000
0x481F FFFF
2MB
Standard Peripheral domain (see Table 2-20)
ARM Subsystem
INTC(1)
0x4820 0000
0x4820 0FFF
4KB
Cortex™-A8 Interrupt Controller
Reserved(1)
0x4820 1000
0x4823 FFFF
252KB
Reserved
Reserved(1)
0x4824 1000
0x4827 FFFF
252KB
Reserved
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Table 2-23. Cortex™-A8 Memory Map (continued)
REGION NAME
START ADDRESS
(HEX)
END ADDRESS (HEX)
SIZE
DESCRIPTION
L3 Target Space
0x4830 0000
0x48FF FFFF
13MB
Standard Peripheral domain (see Table 2-20)
0x4900 0000
0x490F FFFF
1MB
EDMA TPCC Registers
0x4910 0000
0x497F FFFF
7MB
Reserved
0x4980 0000
0x498F FFFF
1MB
EDMA TPTC0 Registers
0x4990 0000
0x499F FFFF
1MB
EDMA TPTC1 Registers
0x49A0 0000
0x49AF FFFF
1MB
EDMA TPTC2 Registers
0x49B0 0000
0x49BF FFFF
1MB
EDMA TPTC3 Registers
0x49C0 0000
0x49FF FFFF
4MB
Reserved
0x4A00 0000
0x4AFF FFFF
16MB
High Speed Peripheral domain (see Table 2-21)
0x4B00 0000
0x4BFF FFFF
16MB
EMU Subsystem region
0x4C00 0000
0x4CFF FFFF
16MB
DDR EMIF0(2) Configuration registers
0x4D00 0000
0x4DFF FFFF
16MB
DDR EMIF1(2) Configuration registers
0x4E00 0000
0x4FFF FFFF
32MB
DDR DMM(2) Configuration registers
0x5000 0000
0x50FF FFFF
16MB
GPMC Configuration registers
0x5100 0000
0x51FF FFFF
16MB
PCIE Configuration registers
0x5200 0000
0x55FF FFFF
64MB
Reserved
0x5600 0000
0x56FF FFFF
16MB
SGX530 Slave Port
(AM3894 only)
0x5600 0000
0x56FF FFFF
16MB
Reserved
(AM3892 only)
0x5700 0000
0x57FF FFFF
16MB
Reserved
0x5800 0000
0x5FFF FFFF
128MB
Reserved
0x6000 0000
0x7FFF FFFF
512MB
TILER Window
DDR EMIF0/1
SDRAM(3)(4)
0x8000 0000
0xBFFF FFFF
1GB
DDR
DDR EMIF0/1
SDRAM(3)(4)
0xC000 0000
0xFFFF FFFF
1GB
DDR
(1) These addresses are decoded within the Cortex™-A8 subsystem.
(2) These accesses occur through the DDR DMM TILER ports. The DDR DMM splits address ranges internally to address DDR EMIF and
DDR DMM control registers based on DDR DMM tie-offs.
(3) These addresses are routed to the Master 0 port for direct connection to the DDR DMM ELLA port.
(4) DDR EMIF0 and DDR EMIF1 addresses may be contiguous or bank interleaved, depending on configuration of the DDR DMM.
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3 Device Pins
3.1
Pin Assignments
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings. For more information on pin
muxing, see Section 4.4, Pin Multiplexing Control.
3.1.1
Pin Map (Bottom View)
Figure 3-1 through Figure 3-19 show the bottom view of the package pin assignments in 15 sections (A,
B, C, D, E, F, G, H, I, J, K, L, M, N, and O).
NOTE
Pin map sections D, E, K, and L show the different pin names for silicon revision 1.x devices
and silicon revision 2.x devices.
28
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
R
SPI_SCS[0]
SPI_SCLK
VSS
VSS
SD_SDWP/
GPMC_A[15]/
GP1[8]
VSS
VSS
VSS
P
SPI_SCS[3]/
GPMC_A[21]/
GP1[22]
SPI_SCS[1]/
GPMC_A[23]
SPI_SCS[2]/
GPMC_A[22]
VSS
VSS
VSS
VSS
DVDD_3P3
N
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
UART0_CTS
GP1[28]
UART0_TXD
M
UART2_RXD
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
L
DVDD_3P3
UART2_TXD
K
VSS
GPMC_A[22]/
GP1[10]
J
GPMC_A[15]/
GP0[22]
GPMC_A[16]/
GP0[21]
GPMC_A[24]/
GP1[15]
GPMC_A[23]/
GP1[14]
TIM6_OUT/
GPMC_A[24]/
GP0[30]
GPMC_A[12]/
GP0[27]
GPMC_A[21]/
GP0[26]
GP0[25]
G
TIM7_OUT/
GPMC_A[12]/
GP0[31]
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
F
CLKOUT
DDR[0]_D[1]
DDR[0]_D[6]
E
DVDD_DDR[0]
DDR[0]_D[2]
DDR[0]_DQS[0]
D
VSS
DDR[0]_D[4]
C
DDR[0]_D[7]
DDR[0]_DQM[0]
B
DDR[0]_D[0]
DDR[0]_D[5]
DDR[0]_D[15]
A
VSS
DVDD_DDR[0]
1
2
H
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
DVDD_3P3
L
M N
F
G H
I
J
A
B
D
E
C
O
VSS
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
DDR[0]_D[3]
K
GP1[13]
GPMC_A[26]/
GP1[11]
GPMC_A[14]/
GP0[23]
GPMC_A[13]/
GP0[24]
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
VSS
DDR[0]_DQS[0]
DDR[0]_D[11]
GPMC_A[27]/
GP1[9]
GPMC_A[25]/
GP1[12]
VSS
VSS
DDR[0]_D[20]
DDR[0]_D[23]
DDR[0]_D[27]
DDR[0]_D[9]
DDR[0]_D[21]
DDR[0]_D[8]
DDR[0]_D[10]
DDR[0]_D[16]
DDR[0]_DQS[1]
DDR[0]_DQM[1]
DDR[0]_D[13]
DDR[0]_D[19]
DDR[0]_DQS[2]
DDR[0]_D[14]
DDR[0]_DQS[1]
DDR[0]_D[12]
DDR[0]_VTP
DDR[0]_D[17]
DDR[0]_DQS[2]
3
4
5
6
7
8
Figure 3-1. Pin Map [Section A]
Device Pins
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R
DVDD_3P3
DVDD_3P3
DVDD_3P3
SD_SDCD/
GPMC_A[16]/
GP1[7]
CVDDC
CVDDC
CVDD
P
DVDD_3P3
DVDD_3P3
DVDD_3P3
SPI_D[1]
CVDDC
CVDDC
CVDD
N
UART0_RTS/
GP1[27]
UART0_RXD
SPI_D[0]
CVDDC
DDR[0]_A[8]
DDR[0]_BA[2]
DDR[0]_A[12]
DDR[0]_A[6]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DDR[0]_A[9]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DDR[0]_D[30]
DDR[0]_A[5]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
VSS
DDR0_A[4]
VSS
VSS
VSS
DDR[0]_A[3]
VSS
VSS
VSS
DDR[0]_BA[0]
VSS
VSS
VSS
DDR[0]_WE
VSS
DDR[0]_RAS
RSV20
DDR[0]_A[2]
DDR[0]_CAS
DDR[0]_A[10]
VSS
M
L
K
L
M N
F
G H
I
J
A
B
D
E
C
O
VSS
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
VSS
K
J
DDR0_D[18]
H
DDR[0]_D[28]
G
DDR[0]_DQM[2]
F
DDR0_D[22]
E
DDR[0]_D[24]
D
DDR[0]_DQM[3]
C
DDR[0]_D[31]
B
DDR[0]_DQS[3]
DDR[0]_D[26]
DDR[0]_D[25]
DDR[0]_CLK[0]
DDR[0]_A[11]
DDR[0]_BA[1]
DDR[0]_CLK[1]
DDR[0]_A[13]
A
DDR[0]_DQS[3]
VSS
DVDD_DDR[0]
DDR[0]_CLK[0]
DDR[0]_A[0]
DDR[0]_A[7]
DDR[0]_CLK[1]
DDR[0]_ODT[1]
9
10
11
12
13
14
15
16
DVDD_DDR[0]
DDR[0]_D[29]
Figure 3-2. Pin Map [Section B]
30
Device Pins
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R
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDDC
CVDDC
P
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDDC
CVDDC
N
DDR[0]_A[1]
VSS
RSV3
RSV4
DDR[1]_A[1]
DDR[1]_A[12]
DDR[1]_BA[2]
DDR[1]_A[8]
L
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
K
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
J
DVDD_DDR[0]
DVDD_DDR[0]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
DVDD_DDR[1]
H
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
G
VSS
VSS
VSS
VSS
VSS
VSS
VSS
F
VSS
DDR[0]_CS[1]
DDR[1]_CS[1]
VSS
VSS
VSS
VSS
K
L
M N
F
G H
I
J
A
B
D
E
C
O
M
DDR[0]_ODT[0]
E
DEVOSC_DVDD18
DDR[1]_ODT[0]
VSS
DDR[1]_RST
DDR[1]_A[14]
DDR[1]_A[2]
RSV8
DEV_MXO
DDR[1]_CKE
VSS
VSS
DDR[1]_A[10]
VDDA_PLL
DEVOSC_VSS
VSSA_PLL
DDR[1]_CS[0]
DDR[1]_CLK[1]
DDR[1]_BA[1]
VREFSSTL_DDR[0]
VDDA_PLL
DEV_MXI/
DEV_CLKIN
VSSA_PLL
DDR[1]_CLK[1]
DDR[1]_A[7]
17
18
19
20
23
24
D
DDR[0]_A[14]
DDR[0]_RST
C
VSS
DDR[0]_CKE
B
DDR[0]_CS[0]
A
DDR[1]_A[13]
VREFSSTL_DDR[1] DDR[1]_ODT[1]
21
22
Figure 3-3. Pin Map [Section C]
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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R
VDD_USB0_1P8
DVDD_3P3
DVDD_3P3
P
RSV2
DVDD_3P3
DVDD_3P3
DVDD_3P3
N
CVDDC
VDD_USB_0P9
RSV10
M
VDD_USB0_3P3 VDD_USB1_3P3
VSS
VSS
DVDD_3P3
VSS
RSV19
RSV11
TDO
TMS
I2C[0]_SCL
GP0[1]
DVDD_3P3
K
L
M N
F
G H
I
J
A
B
D
E
C
O
VSS
L
DDR[1]_A[6]
K
DDR[1]_A[9]
J
DDR[1]_A[5]
DDR[1]_D[30]
H
DDR[1]_A[4]
VSS
G
DDR[1]_A[3]
F
DDR[1]_BA[0]
E
DDR[1]_WE
D
DDR[1]_RAS
C
DDR[1]_CAS
B
DDR[1]_A[11]
DDR[1]_CLK[0]
DDR[1]_D[25]
A
DDR[1]_A[0]
DDR[1]_CLK[0]
25
26
VSS
GP0[2]
GP0[0]
GP0[3]/
TCLKIN
GP1[30]/
SATA_ACT0_LED
DDR[1]_D[18]
DDR[1]_D[28]
GP0[4]
DDR[1]_DQM[2]
VSS
VSS
DDR[1]_D[22]
DDR[1]_D[20]
VSS
DDR[1]_D[24]
DDR[1]_D[27]
DDR[1]_D[23]
DDR[1]_DQM[3]
DDR[1]_D[21]
DDR[1]_D[9]
DDR[1]_D[31]
DDR[1]_D[16]
DDR[1]_D[26]
DDR[1]_DQS[3]
DDR[1]_DQS[2]
DDR[1]_D[19]
DDR[1]_D[13]
DVDD_DDR[1]
VSS
DDR[1]_DQS[3]
DDR[1]_DQS[2]
DDR[1]_D[17]
DDR[1]_VTP
27
28
29
30
31
32
DVDD_DDR[1]
DDR[1]_D[29]
DDR[1]_D[11]
DDR[1]_D[10]
Figure 3-4. Pin Map [Section D] - Silicon Revision 1.x
32
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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R
VDD_USB0_1P8
DVDD_3P3
DVDD_3P3
P
RSV2
DVDD_3P3
DVDD_3P3
DVDD_3P3
N
CVDDC
VDD_USB_0P9
RSV10
M
VDD_USB0_3P3 VDD_USB1_3P3
VSS
VSS
DVDD_3P3
VSS
RSV19
RSV11
TDO
TMS
I2C[0]_SCL
GP0[1]
DVDD_3P3
K
L
F
G H
M N
I
J
A
B
D
E
C
O
VSS
L
DDR[1]_A[6]
K
DDR[1]_A[9]
J
DDR[1]_A[5]
DDR[1]_D[30]
H
DDR[1]_A[4]
VSS
G
DDR[1]_A[3]
F
DDR[1]_BA[0]
E
DDR[1]_WE
D
DDR[1]_RAS
C
DDR[1]_CAS
B
DDR[1]_A[11]
DDR[1]_CLK[0]
DDR[1]_D[25]
A
DDR[1]_A[0]
DDR[1]_CLK[0]
25
26
VSS
GP0[2]
GP0[0]
GP0[3]/
TCLKIN
GP1[30]/
SATA_ACT1_LED
DDR[1]_D[18]
DDR[1]_D[28]
GP0[4]
DDR[1]_DQM[2]
VSS
VSS
DDR[1]_D[22]
DDR[1]_D[20]
VSS
DDR[1]_D[24]
DDR[1]_D[27]
DDR[1]_D[23]
DDR[1]_DQM[3]
DDR[1]_D[21]
DDR[1]_D[9]
DDR[1]_D[31]
DDR[1]_D[16]
DDR[1]_D[26]
DDR[1]_DQS[3]
DDR[1]_DQS[2]
DDR[1]_D[19]
DDR[1]_D[13]
DVDD_DDR[1]
VSS
DDR[1]_DQS[3]
DDR[1]_DQS[2]
DDR[1]_D[17]
DDR[1]_VTP
27
28
29
30
31
32
DVDD_DDR[1]
DDR[1]_D[29]
DDR[1]_D[11]
DDR[1]_D[10]
Figure 3-5. Pin Map [Section D] - Silicon Revision 2.x
Device Pins
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R
VSS
RSV16
USB1_DRVVBUS
USB1_DN
USB1_DP
P
RSV18
RSV17
USB0_DRVVBUS
USB0_DN
USB0_DP
N
I2C[0]_SDA
I2C[1]_SCL
I2C[1]_SDA
VDD_USB0_VBUS
USB0_R1
EMU3
EMU4
EMU1
EMU2
TRST
VSS
M
L
DVDD_3P3
VSS
K
J
GP1[31]/
SATA_ACT1_LED
TDI
EMU0
RTCK
TCLK
H
TIM4_OUT/
GP0[28]
TIM5_OUT/
GP0[29]
GP0[7]/
MCA[0]_AMUTEIN
WD_OUT
CLKIN32
G
RESET
DDR[1]_D[3]
NMI
RSTOUT
DDR[1]_D[6]
DDR[1]_D[1]
POR
DDR[1]_DQS[0]
DDR[1]_D[2]
VSS
DDR[1]_D[4]
DVDD_DDR[1]
DDR[1]_DQM[0]
DDR[1]_D[7]
DDR[1]_DQS[0]
F
E
D
C
DDR[1]_D[8]
B
DDR[1]_DQM[1]
DDR[1]_DQS[1]
DDR[1]_D[15]
DDR[1]_D[5]
DDR[1]_D[0]
A
DDR[1]_D[12]
DDR[1]_DQS[1]
DDR[1]_D[14]
DVDD_DDR[1]
VSS
33
34
35
36
37
K
L
M N
F
G H
I
J
A
B
D
E
C
O
Figure 3-6. Pin Map [Section E] - Silicon Revision 1.x
34
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
R
VSS
RSV16
USB1_DRVVBUS
USB1_DN
USB1_DP
P
RSV18
RSV17
USB0_DRVVBUS
USB0_DN
USB0_DP
N
I2C[0]_SDA
I2C[1]_SCL
I2C[1]_SDA
VDD_USB0_VBUS
USB0_R1
EMU3
EMU4
EMU1
EMU2
TRST
VSS
M
L
DVDD_3P3
VSS
K
J
GP1[31]/
SATA_ACT0_LED
TDI
EMU0
RTCK
TCLK
H
TIM4_OUT/
GP0[28]
TIM5_OUT/
GP0[29]
GP0[7]/
MCA[0]_AMUTEIN
WD_OUT
CLKIN32
G
RESET
DDR[1]_D[3]
NMI
RSTOUT
DDR[1]_D[6]
DDR[1]_D[1]
POR
DDR[1]_DQS[0]
DDR[1]_D[2]
VSS
DDR[1]_D[4]
DVDD_DDR[1]
DDR[1]_DQM[0]
DDR[1]_D[7]
DDR[1]_DQS[0]
F
E
D
C
DDR[1]_D[8]
B
DDR[1]_DQM[1]
DDR[1]_DQS[1]
DDR[1]_D[15]
DDR[1]_D[5]
DDR[1]_D[0]
A
DDR[1]_D[12]
DDR[1]_DQS[1]
DDR[1]_D[14]
DVDD_DDR[1]
VSS
33
34
35
36
37
K
L
F
G H
M N
I
J
A
B
D
E
C
O
Figure 3-7. Pin Map [Section E] - Silicon Revision 2.x
Device Pins
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AK
RSV31
RSV43
RSV46
VIN[0]A_D[19]/
VIN[1]A_DE/
VOUT[1]_C[9]
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
VOUT[1]_C[2]/
VIN[1]A_D[8]
AJ
RSV42
RSV45
RSV47
RSV48
RSV49
RSV50
AH
GPMC_CS[1]
GPMC_CS[2]
AG
GPMC_CS[5]/
GPMC_A[12]
GPMC_WE
AF
GPMC_BE1
GPMC_OE_RE
AE
GPMC_A[4]/
GP0[12]/
BTMODE[3]
GPMC_A[5]/
GP0[13]/
BTMODE[4]
GPMC_A[3]/
GP0[11]/
BTMODE[2]
GPMC_A[2]/
GP0[10]/
BTMODE[1]
GPMC_A[1]/
GP0[9]/
BTMODE[0]
GPMC_A[0]/
GP0[8]
GPMC_DIR/
GP1[20]
GPMC_WAIT
AD
GPMC_A[10]/
GP0[18]
GPMC_A[9]/
GP0[17]/
CS0WAIT
GPMC_A[7]/
GP0[15]/
CS0MUX[1]
GPMC_A[8]/
GP0[16]/
CS0BW
VSS
VSS
VSS
GPMC_A[6]/
GP0[14]/
CS0MUX[0]
AC
GPMC_D[0]
GPMC_A[11]/
GP0[19]
VSS
VSS
GPMC_A[27]/
GP0[20]
VSS
VSS
VSS
AB
VSS
GPMC_D[2]
VSS
VSS
VSS
AA
DVDD_3P3
GPMC_D[5]
GPMC_D[3]
GPMC_D[1]
VSS
VSS
VSS
VSS
Y
GPMC_D[9]
GPMC_D[7]
GPMC_D[4]
VSS
VSS
VSS
VSS
VSS
W
GPMC_D[11]
GPMC_D[12]
GPMC_D[10]
GPMC_D[8]
VSS
VSS
VSS
V
GPMC_CLK/
GP1[29]
GPMC_D[15]
GPMC_D[14]
VSS
VSS
VSS
VSS
VSS
U
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
SD_CLK/
GPMC_A[13]/
GP1[1]
SD_CMD/
GPMC_A[21]/
GP1_[2]
SD_POW/
GPMC_A[14]/
GP1[0]
VSS
VSS
VSS
VSS
T
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
VSS
VSS
VSS
1
2
6
7
8
3
VSS
4
5
L
F
G H
M N
I
J
A
B
D
E
C
O
VOUT[1]_Y_YC[5]/
VIN[1]A_D[3]
GPMC_CS[0]
GPMC_CS[4]/
GP1[21]
K
RSV44
VSS
Figure 3-8. Pin Map [Section F]
36
Device Pins
Copyright © 2010–2012, Texas Instruments Incorporated
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VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
AK
AJ
VSS
VOUT[0]_B_CB_C[5]
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
VOUT[0]_B_CB_C[6]
AH
AG
GPMC_CS[3]
VSS
AF
VSS
VSS
DVDD_3P3
DVDD_3P3
DVDD_3P3
VOUT[0]_B_CB_C[8]
DVDD_3P3
DVDD_3P3
DVDD_3P3
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
DVDD_3P3
DVDD_3P3
DVDD_3P3
K
L
M N
F
G H
I
J
A
B
D
E
C
O
VSS
VIN[0]A_D[9]
AE
GPMC_WP
AD
DVDD_3P3
DVDD_3P3
DVDD_3P3
VOUT[1]_C[7]/
VIN[1]A_D[13]
CVDDC
CVDDC
CVDD
AC
DVDD_3P3
DVDD_3P3
DVDD_3P3
VOUT[1]_Y_YC[6]/
VIN[1]A_D[4]
CVDDC
CVDDC
CVDD
AB
DVDD_3P3
DVDD_3P3
DVDD_3P3
RSV51
CVDD
CVDD
CVDD
AA
DVDD_3P3
DVDD_3P3
DVDD_3P3
VSS
VSS
VSS
VSS
Y
DVDD_3P3
GPMC_D[6]
VSS
VSS
VSS
VSS
W
VSS
VSS
VSS
VSS
VSS
V
VSS
GPMC_D[13]
VSS
VSS
VSS
VSS
U
DVDD_3P3
DVDD_3P3
DVDD_3P3
VSS
VSS
VSS
VSS
T
DVDD_3P3
DVDD_3P3
DVDD_3P3
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
CVDD
CVDD
CVDD
9
10
11
13
14
15
16
GPMC_ADV_ALE GPMC_BE0_CLE
CVDDC
12
VOUT[0]_G_Y_YC[6] VOUT[0]_G_Y_YC[2]
Figure 3-9. Pin Map [Section G]
Device Pins
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AK
VSS
VSS
VSS
VSSA_HD
VSSA_HD
RSV57
VSS
VSS
AJ
DVDD_3P3
VSS
VIN[0]A_D[0]
DVDD1P8
VDDA_SD_1P8
VDDA_HD_1P8
RSV56
DVDD1P8
AH
DVDD_3P3
VIN[0]A_D[2]
VDAC_VREF
VDDA_SD_1P8
VDDA_SD_1P8
VDDA_HD_1P8
RSV55
RSV15
AG
DVDD_3P3
VDDA_SD_1P0
VDDA_HD_1P0
RSV53
RSV54
RSV13
K
L
M N
F
G H
I
J
A
B
D
E
C
O
AF
AE
VSS
VSS
VSS
VSS
RSV52
VDAC_RBIAS_HD
RSV7
HDMI_HPDET
AD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDDC
CVDDC
AC
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDDC
CVDDC
AB
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
AA
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
Y
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
W
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
V
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
U
VSS
VSS
VSSA_PLL
VSS
VSS
VSS
VSS
VSS
T
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
17
18
19
20
21
22
23
24
Figure 3-10. Pin Map [Section H]
38
Device Pins
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AK
HDMI_SDA
VSS
AJ
VSS
MCA[0]_AHCLKR
AH
RSV14
AG
RSV12
MCA[0]_ACLKR
K
L
M N
F
G H
I
J
A
B
D
E
C
O
MCA[1]_AXR[1]
MCA[0]_AFSX
MCA[0]_AXR[1]
MCA[0]_ACLKX MCA[0]_AHCLKX
VSS
AF
EMAC[0]_TXD[4]
MCA[0]_AFSR
VSS
VSS
AE
CVDDC
DVDD_3P3
DVDD_3P3
DVDD_3P3
AD
EMAC[0]_RXD[5]
DVDD_3P3
DVDD_3P3
DVDD_3P3
VSS
VSS
VSS
AC
EMAC[0]_RXD[6]
DVDD_3P3
DVDD_3P3
DVDD_3P3
VSS
VSS
VSS
AB
EMAC[0]_COL
VDDT_PCIE
PCIE_TXN1
VDDT_PCIE
PCIE_TXN0
PCIE_TXP0
VDDT_PCIE
AA
EMAC[0]_CRS
PCIE_TXP1
VDDT_PCIE
PCIE_RXP0
VDDT_PCIE
VSS
VSS
VSS
VSS
PCIE_RXN0
PCIE_RXN1
PCIE_RXP1
VDDT_SATA
RSV6
RSV5
SATA_TXN0
SATA_TXP0
27
28
31
32
Y
VDDR_PCIE
W
VDDR_PCIE
V
VDDR_SATA
U
VDDR_SATA
T
VDD_USB1_1P8
25
26
EMAC[0]_TXD[3] EMAC[0]_TXD[2] EMAC[0]_TXD[1]
VDD_USB0_3P3 VDD_USB1_3P3
29
30
Figure 3-11. Pin Map [Section I]
Device Pins
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AK
MCA[1]_AMUTE
MCA[1]_AFSX
MCA[1]_AFSR
MCA[1]_ACLKR
MCA[0]_AXR[0]
AJ
MCA[0]_AXR[2]/
MCB_FSX
MCA[0]_AXR[3]/
MCB_FSR
MCA[0]_AMUTE
MCA[0]_AXR[4]/
MCB_DX
MCA[0]_AXR[5]/
MCB_DR
MDIO_MDIO
MDIO_MCLK
AH
AG
DVDD_3P3
L
M N
F
G H
I
J
A
B
D
E
C
O
EMAC[0]_TXD[7] EMAC[0]_TXD[6] EMAC[0]_TXEN
EMAC[0]_TXD[5] EMAC[0]_TXCLK
AF
AE
K
EMAC[0]_TXD[0] EMAC[0]_RXER
EMAC[0]_RXDV EMAC[0]_RXD[7] EMAC[0]_RXCLK
AD
VSS
VSS
EMAC[0]_RXD[3] EMAC[0]_RXD[1] EMAC[0]_RXD[0]
AC
VSS
VSS
EMAC[0]_RXD[4] EMAC[0]_RXD[2] EMAC[0]_GMTCLK
AB
SERDES_CLKN
SERDES_CLKP
VDDT_SATA
VDDT_SATA
VSS
RSV1
VSS
VSS
VSS
AA
Y
SATA_RXP1
W
V
SATA_TXP1
VDDT_SATA
SATA_RXN1
SATA_RXP0
SATA_RXN0
U
SATA_TXN1
T
VSS
VSS
VSS
VDD_USB1_VBUS
USB1_R1
33
34
35
36
37
Figure 3-12. Pin Map [Section J]
40
Device Pins
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AU
VSS
DVDD_3P3
RSV24
VIN[0]A_D[21]/
VIN[0]B_FLD
VIN[0]A_HSYNC
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
AT
RSV26
VIN[0]A_D[23]/
VIN[0]B_HSYNC
VIN[0]A_DE
VOUT[1]_AVID/
VIN[1]B_CLK
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
VOUT[1]_CLK/
VIN[1]A_CLK
VOUT[0]_R_CR[1]
AR
RSV27
VIN[0]A_D[22]/
VIN[0]B_VSYNC
VOUT[1]_HSYNC/
VIN[1]A_D[15]
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
AP
RSV28
RSV23
AN
DVDD_3P3
RSV25
VIN[0]A_D[20]/
VIN[0]B_DE
AM
VSS
RSV29
VIN[1]A_D[14]
AL
RSV32
RSV30
1
2
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
3
VIN[0]A_VSYNC
K
L
M N
O
F
G H
I
J
A
B
C
D
E
K
L
M N
O
F
G H
I
J
A
B
D
E
VOUT[0]_AVID
VOUT[1]_Y_YC[3]/
VIN[1]A_D[1]
VOUT[1]_C[5]/
VIN[1]A_D[11]
VOUT[1]_C[4]/
VIN[1]A_D[10]
VOUT[1]_C[6]/
VIN[1]A_D[12]
VSS
VOUT[1]_C[3]/
VIN[1]A_D[9]
VIN[0]A_FLD
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
VSS
VSS
4
5
6
7
8
Figure 3-13. Pin Map [Section K] - Silicon Revision 1.x
AU
VSS
DVDD_3P3
RSV24
VIN[0]A_D[21]/
VIN[0]B_FLD
VIN[0]A_HSYNC
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
AT
RSV26
VIN[0]A_D[23]/
VIN[0]B_HSYNC
VIN[0]A_DE
VOUT[1]_AVID/
VIN[1]B_CLK
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
VOUT[1]_CLK/
VIN[1]A_CLK
VOUT[0]_R_CR[1]
AR
RSV27
VIN[0]A_D[22]/
VIN[0]B_VSYNC
DAC_VOUT[1]_
HSYNC/
VIN[1]A_D[15]
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
AP
RSV28
RSV23
AN
DVDD_3P3
RSV25
VIN[0]A_D[20]/
VIN[0]B_DE
AM
VSS
RSV29
VIN[1]A_D[14]
AL
RSV32
RSV30
1
2
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
3
VIN[0]A_VSYNC
C
DAC_HSYNC_
VOUT[0]_AVID
VOUT[1]_Y_YC[3]/
VIN[1]A_D[1]
VOUT[1]_C[5]/
VIN[1]A_D[11]
VOUT[1]_C[4]/
VIN[1]A_D[10]
VOUT[1]_C[6]/
VIN[1]A_D[12]
VSS
VOUT[1]_C[3]/
VIN[1]A_D[9]
VIN[0]A_FLD
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
DAC_VOUT[1]_
VSYNC
VSS
VSS
4
5
6
7
8
Figure 3-14. Pin Map [Section K] - Silicon Revision 2.x
Device Pins
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AU
VOUT[0]_R_CR[6]/
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/ VOUT[0]_G_Y_YC[0]/
VOUT[1]_Y_YC[6]
VOUT[1]_Y_YC[9]
DVDD_3P3
AT
VOUT[0]_B_CB_C[1]/ VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_HSYNC/
VOUT[1]_Y_YC[5]
VOUT[1]_AVID
AR
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
AP
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC/
VIN[1]B_VSYNC
AN
VOUT[0]_VSYNC
AM
VOUT[0]_HSYNC
AL
VOUT[0]_FLD
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
9
10
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VOUT[0]_G_Y_YC[8]
VIN[0]A_D[15]
VIN[0]A_D[14]
VIN[0]A_D[12]
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
VOUT[0]_B_CB_C[9] VOUT[0]_G_Y_YC[7]
VOUT[0]_CLK
VIN[0]A_D[13]
VIN[0]A_D[10]
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
VOUT[0]_G_Y_YC[9]
VIN[0]A_CLK
VSS
VSS
DVDD_3P3
11
12
VOUT[0]_B_CB_C[2] VOUT[0]_G_Y_YC[3]
VSS
VOUT[0]_B_CB_C[4]
VSS
VSS
VOUT[0]_B_CB_C[7] VOUT[0]_G_Y_YC[5]
VSS
VSS
VOUT[0]_B_CB_C[3] VOUT[0]_G_Y_YC[4]
VSS
VSS
15
16
13
14
K
L
M N
O
F
G H
I
J
A
B
C
D
E
K
L
M N
O
F
G H
I
J
A
B
D
E
Figure 3-15. Pin Map [Section L] - Silicon Revision 1.x
AU
VOUT[0]_R_CR[6]/
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/ VOUT[0]_G_Y_YC[0]/
VOUT[1]_Y_YC[6]
VOUT[1]_Y_YC[9]
AT
VOUT[0]_B_CB_C[1]/
DAC_VOUT[1]_
HSYNC/
VOUT[1]_AVID
AR
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
AP
VOUT[0]_G_Y_YC[0]/
DAC_VOUT[1]_
VSYNC/
VIN[1]B_VSYNC
AN
VOUT[0]_VSYNC
AM
VOUT[0]_HSYNC
AL
DAC_VSYNC_
VOUT[0]_FLD
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
9
10
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
DVDD_3P3
VOUT[0]_G_Y_YC[8]
VIN[0]A_D[15]
VIN[0]A_D[14]
VIN[0]A_D[12]
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
VOUT[0]_B_CB_C[9] VOUT[0]_G_Y_YC[7]
VOUT[0]_CLK
VIN[0]A_D[13]
VIN[0]A_D[10]
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
VOUT[0]_G_Y_YC[9]
VIN[0]A_CLK
VSS
VSS
DVDD_3P3
11
12
VOUT[0]_B_CB_C[2] VOUT[0]_G_Y_YC[3]
VSS
VOUT[0]_B_CB_C[4]
VSS
VSS
VOUT[0]_B_CB_C[7] VOUT[0]_G_Y_YC[5]
VSS
VSS
VOUT[0]_B_CB_C[3] VOUT[0]_G_Y_YC[4]
VSS
VSS
15
16
13
14
C
Figure 3-16. Pin Map [Section L] - Silicon Revision 2.x
42
Device Pins
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AU
VIN[0]A_D[11]
VIN[0]A_D[1]
VSSA_SD
IOUTG
RSV41
VSSA_REF_1P8
VSS
HDMI_TMDSCLKN
AT
VIN[0]A_D[5]
VIN[0]A_D[4]
IOUTE
IOUTF
IOUTA
VDDA_REF_1P8
VSS
HDMI_TMDSCLKP
AR
VIN[0]A_D[7]
VIN[0]A_D[3]
VIN[0]B_CLK
IOUTD
IOUTB
VSS
VSS
AP
VIN[0]A_D[8]
VIN[0]A_D[6]
VDAC_RBIAS_SD
IOUTC
VDDA_HDMI
VDDA_HDMI
RSV21
RSV22
VSSA_SD
RSV61
VDDA_HDMI
VDDA_HDMI
AN
AM
VSS
VSS
VSS
VSSA_SD
RSV60
RSV59
VSS
VSS
AL
VSS
VSS
VSS
VSSA_SD
VSSA_HD
RSV58
VSS
VSS
17
18
19
20
21
22
23
24
K
L
M N
F
G H
I
J
A
B
D
E
C
O
Figure 3-17. Pin Map [Section M]
Device Pins
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AU
HDMI_TMDSDN0 HDMI_TMDSDN1 HDMI_TMDSDN2
VSS
DVDD_3P3
EMAC[1]_TXEN EMAC[1]_TXD[4] EMAC[1]_TXD[3]
AT
HDMI_TMDSDP0 HDMI_TMDSDP1 HDMI_TMDSDP2
RSV40
RSV39
EMAC[1]_TXCLK EMAC[1]_TXD[5] EMAC[1]_TXD[2]
AR
VSS
AP
HDMI_CEC
AN
HDMI_EXTSWING
AM
VSS
AL
HDMI_SCL
25
VDDA_HDMI
RSV38
DVDD_3P3
26
27
EMAC[1]_COL
EMAC[1]_TXD[6] EMAC[1]_TXD[0] EMAC1_RXD[7]
RSV36
EMAC[1]_RXER
EMAC[1]_CRS
RSV33
EMAC[1]_TXD[7]
VSS
RSV35
28
29
L
M N
F
G H
I
J
A
B
D
E
C
O
EMAC[1]_TXD[1]
RSV37
RSV34
K
30
VSS
VSS
31
32
Figure 3-18. Pin Map [Section N]
44
Device Pins
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AU
EMAC[1]_GMTCLK
AT
EMAC[1]_RXDV
AR
EMAC[1]_RXD[5]
EMAC[1]_RXD[6] EMAC[1]_RXD[4] EMAC[1]_RXD[2]
EMAC1_RXD[3]
EMAC1_RXD[1]
AP
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
AN
MCA[2]_AHCLKR/
MCB_CLKS
AM
AL
MCA[1]_AXR[0]
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
33
34
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
K
L
F
G H
M N
I
J
A
B
D
E
C
O
RSV9
EMAC1_RXD[0] EMAC[1]_RXCLK
MCA[2]_AXR[0]
MCA[2]_AXR[1]/
MCB_DX
MCA[2]_AMUTE
VSS
MCA[2]_AHCLKX/
MCB_CLKR
DVDD_3P3
MCA[2]_ACLKX/
MCA[1]_AHCLKX
MCB_CLKX
MCA[1]_ACLKX MCA[1]_AHCLKR
35
36
37
Figure 3-19. Pin Map [Section O]
Device Pins
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3.2
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Terminal Functions
The terminal functions tables identify the external signal names, the associated pin (ball) numbers along
with the mechanical package designator, the pin type, whether the pin has any internal pullup or pulldown
resistors, and a functional pin description. Bolded pin names denote the muxed pin function being
described in each table. For more detailed information on device configurations, peripheral selection,
multiplexed/shared pin, and see Section 4, Device Configurations.
3.2.1
Boot Configuration
Table 3-1. Boot Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
BOOT
Boot Mode inputs. Select the peripheral over which the Host ARM Cortex™-A8 will boot.
GPMC_A[5]/GP0[13]/
BTMODE[4]
AE2
GPMC, GP0
PINCTRL226
GPMC_A[4]/GP0[12]/
BTMODE[3]
AE1
GPMC, GP0
PINCTRL225
GPMC_A[3]/GP0[11]/
BTMODE[2]
AE3
GPMC_A[2]/GP0[10]/
BTMODE[1]
AE4
GPMC, GP0
PINCTRL223
GPMC_A[1]/GP0[9]/
BTMODE[0]
AE5
GPMC, GP0
PINCTRL222
I
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, GP0
PINCTRL224
Boot Mode Selection pins. For boot mode information,
see Table 4-5.
DEVICE CONTROL
GPMC_A[8]/GP0[16]/
CS0BW
AD4
GPMC_A[7]/GP0[15]/
CS0MUX[1]
AD3
GPMC_A[6]/GP0[14]/
CS0MUX[0]
AD8
GPMC_A[9]/GP0[17]/
CS0WAIT
AD2
(1)
(2)
(3)
46
I
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
I
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC CS0 default Data Bus Width input
GPMC, GP0
PINCTRL229
0 = 8-bit data bus
1 = 16-bit data bus
GPMC, GP0
PINCTRL228
GPMC CS0 default Address/Data multiplexing mode
input
GPMC, GP0
PINCTRL227
00
01
10
11
= Not multiplexed
= A/A/D muxed
= A/D muxed
= Reserved
GPMC CS0 default GPMC_Wait enable input
GPMC, GP0
PINCTRL230
0 = Wait disabled
1 = Wait enabled
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.2
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
DDR2/3 Memory Controller Signals
Table 3-2. DDR2/3 Memory Controller 0 Terminal Functions
SIGNAL
TYPE (1)
OTHER (2)
B12
O
DVDD_DDR[0]
DDR[0] Clock 0
A12
O
DVDD_DDR[0]
DDR[0] Negative Clock 0
A15
O
DVDD_DDR[0]
DDR[0] Clock 1
DDR[0]_CLK[1]
B15
O
DVDD_DDR[0]
DDR[0] Negative Clock 1
DDR[0]_CKE
C18
O
DVDD_DDR[0]
DDR[0] Clock Enable
DDR[0]_WE
E13
O
DVDD_DDR[0]
DDR[0] Write Enable
DDR[0]_CS[0]
B17
O
DVDD_DDR[0]
DDR[0] Chip Select 0
DDR[0]_CS[1]
F18
O
DVDD_DDR[0]
DDR[0] Chip Select 1
DDR[0]_RAS
D13
O
DVDD_DDR[0]
DDR[0] Row Address Strobe output
DDR[0]_CAS
C13
O
DVDD_DDR[0]
DDR[0] Column Address Strobe output
DDR[0]_DQM[3]
D9
O
DVDD_DDR[0]
DDR[0]_DQM[2]
G9
O
DVDD_DDR[0]
DDR[0]_DQM[1]
B5
O
DVDD_DDR[0]
DDR[0]_DQM[0]
C2
O
DVDD_DDR[0]
DDR[0] Data Mask outputs
DDR[0]_DQM[3]: For upper byte data bus DDR[0]_D[31:24]
DDR[0]_DQM[2]: For DDR[0]_D[23:16]
DDR[0]_DQM[1]: For DDR[0]_D[15:8]
DDR[0]_DQM[0]: For lower byte data bus DDR[0]_D[7:0]
DDR[0]_DQS[3]
B9
I/O
DVDD_DDR[0]
DDR[0]_DQS[2]
B8
I/O
DVDD_DDR[0]
DDR[0]_DQS[1]
B4
I/O
DVDD_DDR[0]
DDR[0]_DQS[0]
F4
I/O
DVDD_DDR[0]
DDR[0]_DQS[3]
A9
I/O
DVDD_DDR[0]
DDR[0]_DQS[2]
A8
I/O
DVDD_DDR[0]
DDR[0]_DQS[1]
A4
I/O
DVDD_DDR[0]
DDR[0]_DQS[0]
E3
I/O
DVDD_DDR[0]
DDR[0]_ODT[0]
E18
O
DVDD_DDR[0]
DDR[0] On-Die Termination for Chip Select 0.
DDR[0]_ODT[1]
A16
O
DVDD_DDR[0]
DDR[0] On-Die Termination for Chip Select 1.
DDR[0]_RST
D18
O
DVDD_DDR[0]
DDR[0] Reset output
DDR[0]_BA[2]
N15
O
DVDD_DDR[0]
DDR[0]_BA[1]
B14
O
DVDD_DDR[0]
DDR[0]_BA[0]
F13
O
DVDD_DDR[0]
NAME
NO.
DDR[0]_CLK[0]
DDR[0]_CLK[0]
DDR[0]_CLK[1]
(1)
(2)
DESCRIPTION
Data strobe input/outputs for each byte of the 32-bit data bus. They are
outputs to the DDR[0] memory when writing and inputs when reading.
They are used to synchronize the data transfers.
DDR[0]_DQS[3]: For upper byte data bus DDR[0]_D[31:24]
DDR[0]_DQS[2]: For DDR[0]_D[23:16]
DDR[0]_DQS[1]: For DDR[0]_D[15:8]
DDR[0]_DQS[0]: For lower byte data bus DDR[0]_D[7:0]
Complimentary data strobe input/outputs for each byte of the 32-bit data
bus. They are outputs to the DDR[0] memory when writing and inputs
when reading. They are used to synchronize the data transfers.
DDR[0]_DQS[3]: For upper byte data bus DDR[0]_D[31:24]
DDR[0]_DQS[2]: For DDR[0]_D[23:16]
DDR[0]_DQS[1]: For DDR[0]_D[15:8]
DDR[0]_DQS[0]: For lower byte data bus DDR[0]_D[7:0]
DDR[0] Bank Address outputs
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-2. DDR2/3 Memory Controller 0 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
DDR[0]_A[14]
D17
O
DVDD_DDR[0]
DDR[0]_A[13]
B16
O
DVDD_DDR[0]
DDR[0]_A[12]
N16
O
DVDD_DDR[0]
DDR[0]_A[11]
B13
O
DVDD_DDR[0]
DDR[0]_A[10]
C14
O
DVDD_DDR[0]
DDR[0]_A[9]
K13
O
DVDD_DDR[0]
DDR[0]_A[8]
N14
O
DVDD_DDR[0]
DDR[0]_A[7]
A14
O
DVDD_DDR[0]
DDR[0]_A[6]
L13
O
DVDD_DDR[0]
DDR[0]_A[5]
J13
O
DVDD_DDR[0]
DDR[0]_A[4]
H13
O
DVDD_DDR[0]
DDR[0]_A[3]
G13
O
DVDD_DDR[0]
DDR[0]_A[2]
D15
O
DVDD_DDR[0]
DDR[0]_A[1]
N17
O
DVDD_DDR[0]
DDR[0]_A[0]
A13
O
DVDD_DDR[0]
DDR[0]_D[31]
C9
I/O
DVDD_DDR[0]
DDR[0]_D[30]
J11
I/O
DVDD_DDR[0]
DDR[0]_D[29]
C11
I/O
DVDD_DDR[0]
DDR[0]_D[28]
G10
I/O
DVDD_DDR[0]
DDR[0]_D[27]
E8
I/O
DVDD_DDR[0]
DDR[0]_D[26]
B10
I/O
DVDD_DDR[0]
DDR[0]_D[25]
B11
I/O
DVDD_DDR[0]
DDR[0]_D[24]
E9
I/O
DVDD_DDR[0]
DDR[0]_D[23]
E7
I/O
DVDD_DDR[0]
DDR[0]_D[22]
F9
I/O
DVDD_DDR[0]
DDR[0]_D[21]
D8
I/O
DVDD_DDR[0]
DDR[0]_D[20]
F8
I/O
DVDD_DDR[0]
DDR[0]_D[19]
B7
I/O
DVDD_DDR[0]
DDR[0]_D[18]
H10
I/O
DVDD_DDR[0]
DDR[0]_D[17]
A7
I/O
DVDD_DDR[0]
DDR[0]_D[16]
C8
I/O
DVDD_DDR[0]
48
DESCRIPTION
DDR[0] Address Bus
DDR[0] Data Bus
Device Pins
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Table 3-2. DDR2/3 Memory Controller 0 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
DDR[0]_D[15]
B3
I/O
DVDD_DDR[0]
DDR[0]_D[14]
A3
I/O
DVDD_DDR[0]
DDR[0]_D[13]
B6
I/O
DVDD_DDR[0]
DDR[0]_D[12]
A5
I/O
DVDD_DDR[0]
DDR[0]_D[11]
D6
I/O
DVDD_DDR[0]
DDR[0]_D[10]
C6
I/O
DVDD_DDR[0]
DDR[0]_D[9]
D7
I/O
DVDD_DDR[0]
DDR[0]_D[8]
C5
I/O
DVDD_DDR[0]
DDR[0]_D[7]
C1
I/O
DVDD_DDR[0]
DDR[0]_D[6]
F3
I/O
DVDD_DDR[0]
DDR[0]_D[5]
B2
I/O
DVDD_DDR[0]
DDR[0]_D[4]
D2
I/O
DVDD_DDR[0]
DDR[0]_D[3]
G4
I/O
DVDD_DDR[0]
DDR[0]_D[2]
E2
I/O
DVDD_DDR[0]
DDR[0]_D[1]
F2
I/O
DVDD_DDR[0]
DDR[0]_D[0]
B1
I/O
DVDD_DDR[0]
DDR[0]_VTP
A6
I
DVDD_DDR[0]
DESCRIPTION
DDR[0] Data Bus
DDR VTP Compensation Resistor Connection
Device Pins
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Table 3-3. DDR2/3 Memory Controller 1 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
DESCRIPTION
DDR[1]_CLK[0]
B26
O
DVDD_DDR[1] DDR[1] Clock 0
DDR[1]_CLK[0]
A26
O
DVDD_DDR[1] DDR[1] Negative Clock 0
DDR[1]_CLK[1]
A23
O
DVDD_DDR[1] DDR[1] Clock 1
DDR[1]_CLK[1]
B23
O
DVDD_DDR[1] DDR[1] Negative Clock 1
DDR[1]_CKE
C20
O
DVDD_DDR[1] DDR[1] Clock Enable
DDR[1]_WE
E25
O
DVDD_DDR[1] DDR[1] Write Enable
DDR[1]_CS[0]
B21
O
DVDD_DDR[1] DDR[1] Chip Select 0
DDR[1]_CS[1]
F20
O
DVDD_DDR[1] DDR[1] Chip Select 1
DDR[1]_RAS
D25
O
DVDD_DDR[1] DDR[1] Row Address Strobe output
DDR[1]_CAS
C25
O
DVDD_DDR[1] DDR[1] Column Address Strobe output
DDR[1]_DQM[3]
D29
O
DDR[1]_DQM[2]
G29
O
DDR[1]_DQM[1]
B33
O
DDR[1]_DQM[0]
C36
O
DVDD_DDR[1] DDR[1] Data Mask outputs
DVDD_DDR[1] DDR[1]_DQM[3]: For upper byte data bus DDR[1]_D[31:24]
DDR[1]_DQM[2]: For DDR[1]_D[23:16]
DVDD_DDR[1] DDR[1]_DQM[1]: For DDR[1]_D[15:8]
DVDD_DDR[1] DDR[1]_DQM[0]: For lower byte data bus DDR[1]_D[7:0]
DDR[1]_DQS[3]
B29
O
DDR[1]_DQS[2]
B30
I/O
DDR[1]_DQS[1]
B34
I/O
DDR[1]_DQS[0]
F34
I/O
DDR[1]_DQS[3]
A29
I/O
DDR[1]_DQS[2]
A30
I/O
DDR[1]_DQS[1]
A34
I/O
DDR[1]_DQS[0]
E35
I/O
DDR[1]_ODT[0]
E20
O
DVDD_DDR[1] DDR[1] On-Die Termination for Chip Select 0.
DDR[1]_ODT[1]
A22
O
DVDD_DDR[1] DDR[1] On-Die Termination for Chip Select 1.
DDR[1]_RST
D20
O
DVDD_DDR[1] DDR[1] Reset output
DDR[1]_BA[2]
N23
O
DVDD_DDR[1]
DDR[1]_BA[1]
B24
O
DVDD_DDR[1] DDR[1] Bank Address outputs
DDR[1]_BA[0]
F25
O
DVDD_DDR[1]
(1)
(2)
50
DVDD_DDR[1] Data strobe input/outputs for each byte of the 32-bit data bus. They are
outputs to the DDR[1] memory when writing and inputs when reading.
DVDD_DDR[1]
They are used to synchronize the data transfers.
DVDD_DDR[1] DDR[1]_DQS[3]: For upper byte data bus DDR[1]_D[31:24]
DDR[1]_DQS[2]: For DDR[1]_D[23:16]
DVDD_DDR[1] DDR[1]_DQS[1]: For DDR[1]_D[15:8]
DDR[1]_DQS[0]: For lower byte data bus DDR[1]_D[7:0]
DVDD_DDR[1] Complimentary data strobe input/outputs for each byte of the 32-bit
data bus. They are outputs to the DDR[1] memory when writing and
DVDD_DDR[1]
inputs when reading. They are used to synchronize the data transfers.
DVDD_DDR[1] DDR[1]_DQS[3]: For upper byte data bus DDR[1]_D[31:24]
DDR[1]_DQS[2]: For DDR[1]_D[23:16]
DVDD_DDR[1] DDR[1]_DQS[1]: For DDR[1]_D[15:8]
DDR[1]_DQS[0]: For lower byte data bus DDR[1]_D[7:0]
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-3. DDR2/3 Memory Controller 1 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
DESCRIPTION
DDR[1]_A[14]
D21
O
DVDD_DDR[1]
DDR[1]_A[13]
B22
O
DVDD_DDR[1]
DDR[1]_A[12]
N22
O
DVDD_DDR[1]
DDR[1]_A[11]
B25
O
DVDD_DDR[1]
DDR[1]_A[10]
C24
O
DVDD_DDR[1]
DDR[1]_A[9]
K25
O
DVDD_DDR[1]
DDR[1]_A[8]
N24
O
DVDD_DDR[1]
DDR[1]_A[7]
A24
O
DVDD_DDR[1] DDR[1] Address Bus
DDR[1]_A[6]
L25
O
DVDD_DDR[1]
DDR[1]_A[5]
J25
O
DVDD_DDR[1]
DDR[1]_A[4]
H25
O
DVDD_DDR[1]
DDR[1]_A[3]
G25
O
DVDD_DDR[1]
DDR[1]_A[2]
D23
O
DVDD_DDR[1]
DDR[1]_A[1]
N21
O
DVDD_DDR[1]
DDR[1]_A[0]
A25
O
DVDD_DDR[1]
DDR[1]_D[31]
C29
I/O
DVDD_DDR[1]
DDR[1]_D[30]
J27
I/O
DVDD_DDR[1]
DDR[1]_D[29]
C27
I/O
DVDD_DDR[1]
DDR[1]_D[28]
G28
I/O
DVDD_DDR[1]
DDR[1]_D[27]
E30
I/O
DVDD_DDR[1]
DDR[1]_D[26]
B28
I/O
DVDD_DDR[1]
DDR[1]_D[25]
B27
I/O
DVDD_DDR[1]
DDR[1]_D[24]
E29
I/O
DVDD_DDR[1]
DDR[1]_D[23]
E31
I/O
DVDD_DDR[1]
DDR[1]_D[22]
F29
I/O
DVDD_DDR[1]
DDR[1]_D[21]
D30
I/O
DVDD_DDR[1]
DDR[1]_D[20]
F30
I/O
DVDD_DDR[1]
DDR[1]_D[19]
B31
I/O
DVDD_DDR[1]
DDR[1]_D[18]
H28
I/O
DVDD_DDR[1]
DDR[1]_D[17]
A31
I/O
DVDD_DDR[1]
DDR[1]_D[16]
C30
I/O
DVDD_DDR[1]
DDR[1] Data Bus
Device Pins
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Table 3-3. DDR2/3 Memory Controller 1 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
DDR[1]_D[15]
B35
I/O
DVDD_DDR[1]
DDR[1]_D[14]
A35
I/O
DVDD_DDR[1]
DDR[1]_D[13]
B32
I/O
DVDD_DDR[1]
DDR[1]_D[12]
A33
I/O
DVDD_DDR[1]
DDR[1]_D[11]
D32
I/O
DVDD_DDR[1]
DDR[1]_D[10]
C32
I/O
DVDD_DDR[1]
DDR[1]_D[9]
D31
I/O
DVDD_DDR[1]
DDR[1]_D[8]
C33
I/O
DVDD_DDR[1]
DDR[1]_D[7]
C37
I/O
DVDD_DDR[1]
DDR[1]_D[6]
F35
I/O
DVDD_DDR[1]
DDR[1]_D[5]
B36
I/O
DVDD_DDR[1]
DDR[1]_D[4]
D36
I/O
DVDD_DDR[1]
DDR[1]_D[3]
G34
I/O
DVDD_DDR[1]
DDR[1]_D[2]
E36
I/O
DVDD_DDR[1]
DDR[1]_D[1]
F36
I/O
DVDD_DDR[1]
DDR[1]_D[0]
B37
I/O
DVDD_DDR[1]
DDR[1]_VTP
A32
I
52
DESCRIPTION
DDR[1] Data Bus
DVDD_DDR[1] DDR VTP Compensation Resistor Connection
Device Pins
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3.2.3
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Ethernet Media Access Controller (EMAC) Signals
Table 3-4. EMAC Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
MDIO_MCLK
AH37
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL275
Management Data Serial Clock output
MDIO_MDIO
AH36
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL276
Management Data I/O
EMAC0
EMAC[0]_COL
AB25
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL251
[G]MII Collision Detect (Sense) input
EMAC[0]_CRS
AA25
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL252
[G]MII Carrier Sense input
EMAC[0]_GMTCLK
AC37
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL253
GMII Source Asynchronous Transmit Clock
EMAC[0]_RXCLK
AE37
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL254
[G]MII Receive Clock
EMAC[0]_RXD[7]
AE36
PINCTRL262
EMAC[0]_RXD[6]
AC25
PINCTRL261
EMAC[0]_RXD[5]
AD25
PINCTRL260
EMAC[0]_RXD[4]
AC35
EMAC[0]_RXD[3]
AD35
EMAC[0]_RXD[2]
AC36
PINCTRL257
EMAC[0]_RXD[1]
AD36
PINCTRL256
EMAC[0]_RXD[0]
AD37
PINCTRL255
EMAC[0]_RXDV
AE35
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL263
[G]MII Receive Data Valid input
EMAC[0]_RXER
AE34
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL264
[G]MII Receive Data Error input
EMAC[0]_TXCLK
AF37
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL265
[G]MII Transmit Clock input
I
(1)
(2)
(3)
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL259
PINCTRL258
[G]MII Receive Data [7:0]. For 1000 EMAC GMII
operation, EMAC[0]_RXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[0]_RXD[3:0] are
used.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-4. EMAC Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
EMAC[0]_TXD[7]
AG35
PINCTRL273
EMAC[0]_TXD[6]
AG36
PINCTRL272
EMAC[0]_TXD[5]
AF36
PINCTRL271
EMAC[0]_TXD[4]
AG28
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL270
PINCTRL269
EMAC[0]_TXD[3]
AE30
EMAC[0]_TXD[2]
AE31
PINCTRL268
EMAC[0]_TXD[1]
AE32
PINCTRL267
EMAC[0]_TXD[0]
AE33
PINCTRL266
EMAC[0]_TXEN
AG37
DESCRIPTION
[G]MII Transmit Data [7:0]. For 1000 EMAC GMII
operation, EMAC[0]_TXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[0]_TXD[3:0] are
used.
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL72
[G]MII Collision Detect (Sense) input
PINCTRL274
[G]MII Transmit Data Enable output
EMAC1
EMAC[1]_COL
AR30
I
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
EMAC[1]_CRS
AN31
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL73
[G]MII Carrier Sense input
EMAC[1]_GMTCLK
AU33
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL61
GMII Source Asynchronous Transmit Clock
EMAC[1]_RXCLK
AT37
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL51
[G]MII Receive Clock
EMAC[1]_RXD[7]
AP32
PINCTRL59
EMAC[1]_RXD[6]
AU34
PINCTRL58
EMAC[1]_RXD[5]
AR33
PINCTRL57
EMAC[1]_RXD[4]
AU35
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL56
PINCTRL55
[G]MII Receive Data [7:0]. For 1000 EMAC GMII
operation, EMAC[1]_RXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[1]_RXD[3:0] are
used.
EMAC[1]_RXD[3]
AT34
EMAC[1]_RXD[2]
AU36
PINCTRL54
EMAC[1]_RXD[1]
AT35
PINCTRL53
EMAC[1]_RXD[0]
AT36
PINCTRL52
EMAC[1]_RXDV
AT33
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL60
[G]MII Receive Data Valid input
EMAC[1]_RXER
AN30
I
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL74
[G]MII Receive Data Error input
54
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 3-4. EMAC Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
I
OTHER (2)
(3)
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
MUXED
PINCTRL71
EMAC[1]_TXCLK
AT30
EMAC[1]_TXD[7]
AM30
PINCTRL69
EMAC[1]_TXD[6]
AP30
PINCTRL68
EMAC[1]_TXD[5]
AT31
PINCTRL67
EMAC[1]_TXD[4]
AU31
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL66
PINCTRL65
EMAC[1]_TXD[3]
AU32
EMAC[1]_TXD[2]
AT32
PINCTRL64
EMAC[1]_TXD[1]
AR32
PINCTRL63
EMAC[1]_TXD[0]
AP31
PINCTRL62
EMAC[1]_TXEN
AU30
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL70
DESCRIPTION
[G]MII Transmit Clock input
[G]MII Transmit Data [7:0]. For 1000 EMAC GMII
operation, EMAC[1]_TXD[7:0] are used. For 10/100
EMAC MII operation, only EMAC[1]_TXD[3:0] are
used.
[G]MII Transmit Data Enable output
Device Pins
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3.2.4
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General-Purpose Input/Output (GPIO) Signals
Table 3-5. GPIO Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
GPIO0
Note: General-Purpose Input/Output (I/O) pins can also serve as external interrupt inputs.
TIM7_OUT/
GPMC_A[12]/
GP0[31]
G1
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM7, GPMC
PINCTRL206
General-Purpose Input/Output (I/O) 0 [GP0] pin 31.
TIM6_OUT/
GPMC_A[24]/
GP0[30]
H1
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM6, GPMC
PINCTRL205
General-Purpose Input/Output (I/O) 0 [GP0] pin 30.
TIM5_OUT/
GP0[29]
H34
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM5
PINCTRL204
General-Purpose Input/Output (I/O) 0 [GP0] pin 29.
TIM4_OUT/
GP0[28]
H33
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM4
PINCTRL203
General-Purpose Input/Output (I/O) 0 [GP0] pin 28.
GPMC_A[12]/
GP0[27]
H2
I/O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL202
General-Purpose Input/Output (I/O) 0 [GP0] pin 27.
GPMC_A[21]/
GP0[26]
H3
I/O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL201
General-Purpose Input/Output (I/O) 0 [GP0] pin 26.
GP0[25]
H4
I/O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
PINCTRL200
General-Purpose Input/Output (I/O) 0 [GP0] pin 25.
GPMC_A[13]/
GP0[24]
H6
I/O
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GPMC
PINCTRL199
General-Purpose Input/Output (I/O) 0 [GP0] pin 24.
GPMC_A[14]/
GP0[23]
H5
I/O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC
PINCTRL198
General-Purpose Input/Output (I/O) 0 [GP0] pin 23.
GPMC_A[15]/
GP0[22]
J1
I/O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GPMC
PINCTRL197
General-Purpose Input/Output (I/O) 0 [GP0] pin 22.
GPMC_A[16]/
GP0[21]
J2
I/O
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL196
General-Purpose Input/Output (I/O) 0 [GP0] pin 21.
GPMC_A[27]/
GP0[20]
AC5
I/O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL233
General-Purpose Input/Output (I/O) 0 [GP0] pin 20.
GPMC_A[11]/
GP0[19]
AC2
I/O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL232
General-Purpose Input/Output (I/O) 0 [GP0] pin 19.
GPMC_A[10]/
GP0[18]
AD1
I/O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL231
General-Purpose Input/Output (I/O) 0 [GP0] pin 18.
(1)
(2)
(3)
56
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 3-5. GPIO Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
GPMC_A[9]/
GP0[17]/
CS0WAIT
AD2
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL230
General-Purpose Input/Output (I/O) 0 [GP0] pin 17.
GPMC_A[8]/
GP0[16]/
CS0BW
AD4
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL229
General-Purpose Input/Output (I/O) 0 [GP0] pin 16.
GPMC_A[7]/
GP0[15]/
CS0MUX[1]
AD3
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL228
General-Purpose Input/Output (I/O) 0 [GP0] pin 15.
GPMC_A[6]/
GP0[14]/
CS0MUX[0]
AD8
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL227
General-Purpose Input/Output (I/O) 0 [GP0] pin 14.
GPMC_A[5]/
GP0[13]/
BTMODE[4]
AE2
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL226
General-Purpose Input/Output (I/O) 0 [GP0] pin 13.
GPMC_A[4]/
GP0[12]/
BTMODE[3]
AE1
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL225
General-Purpose Input/Output (I/O) 0 [GP0] pin 12.
GPMC_A[3]/
GP0[11]/
BTMODE[2]
AE3
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL224
General-Purpose Input/Output (I/O) 0 [GP0] pin 11.
GPMC_A[2]/
GP0[10]/
BTMODE[1]
AE4
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL223
General-Purpose Input/Output (I/O) 0 [GP0] pin 10.
GPMC_A[1]/
GP0[9]/
BTMODE[0]
AE5
I/O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, BOOT
PINCTRL222
General-Purpose Input/Output (I/O) 0 [GP0] pin 9.
GPMC_A[0]/
GP0[8]
AE6
I/O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL221
General-Purpose Input/Output (I/O) 0 [GP0] pin 8.
GP0[7]/
MCA[0]_AMUTEIN
H35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]
PINCTRL298
General-Purpose Input/Output (I/O) 0 [GP0] pin 7.
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
G5
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[1], GPMC
PINCTRL297
General-Purpose Input/Output (I/O) 0 [GP0] pin 6.
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
G2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], GPMC
PINCTRL296
General-Purpose Input/Output (I/O) 0 [GP0] pin 5.
GP0[4]
H32
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL295
General-Purpose Input/Output (I/O) 0 [GP0] pin 4.
GP0[3]/
TCLKIN
J31
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
Timer CLKIN
PINCTRL294
General-Purpose Input/Output (I/O) 0 [GP0] pin 3.
GP0[2]
K30
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL293
General-Purpose Input/Output (I/O) 0 [GP0] pin 2.
GP0[1]
L29
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL292
General-Purpose Input/Output (I/O) 0 [GP0] pin 1.
GP0[0]
K31
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL291
General-Purpose Input/Output (I/O) 0 [GP0] pin 0.
Device Pins
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Table 3-5. GPIO Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
GPIO1
Note: General-Purpose Input/Output (I/O) pins can also serve as external interrupt inputs.
GP1[31]/
SATA_ACT1_LED
(silicon revision 1.x)
SATA_ACT0_LED
(silicon revision 2.x)
J33
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SATA
PINCTRL300
General-Purpose Input/Output (I/O) 1 [GP1] pin 31.
GP1[30]/
SATA_ACT0_LED
(silicon revision 1.x)
SATA_ACT1_LED
(silicon revision 2.x)
J32
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SATA
PINCTRL299
General-Purpose Input/Output (I/O) 1 [GP1] pin 30.
GPMC_CLK/
GP1[29]
V1
I/O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC
PINCTRL250
General-Purpose Input/Output (I/O) 1 [GP1] pin 29.
UART0_CTS/
GP1[28]
N7
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0
PINCTRL176
General-Purpose Input/Output (I/O) 1 [GP1] pin 28.
UART0_RTS/
GP1[27]
N9
I/O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART0
PINCTRL175
General-Purpose Input/Output (I/O) 1 [GP1] pin 27.
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
L3
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART1, GPMC
PINCTRL184
General-Purpose Input/Output (I/O) 1 [GP1] pin 26.
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
M2
I/O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART1, GPMC
PINCTRL183
General-Purpose Input/Output (I/O) 1 [GP1] pin 25.
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
K7
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART2, GPMC
PINCTRL188
General-Purpose Input/Output (I/O) 1 [GP1] pin 24.
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
L9
I/O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART2, GPMC
PINCTRL187
General-Purpose Input/Output (I/O) 1 [GP1] pin 23.
SPI_SCS[3]/
GPMC_A[21]/
GP1[22]
P1
I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI, GPMC
PINCTRL170
General-Purpose Input/Output (I/O) 1 [GP1] pin 22.
GPMC_CS[4]/
GP1[21]
AG3
I/O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC
PINCTRL211
General-Purpose Input/Output (I/O) 1 [GP1] pin 21.
GPMC_DIR/
GP1[20]
AE7
I/O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL218
General-Purpose Input/Output (I/O) 1 [GP1] pin 20.
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
N3
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC
PINCTRL180
General-Purpose Input/Output (I/O) 1 [GP1] pin 19.
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
N5
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC
PINCTRL179
General-Purpose Input/Output (I/O) 1 [GP1] pin 18.
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
N4
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC
PINCTRL178
General-Purpose Input/Output (I/O) 1 [GP1] pin 17.
58
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 3-5. GPIO Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
N6
I/O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART0, GPMC
PINCTRL177
General-Purpose Input/Output (I/O) 1 [GP1] pin 16.
GPMC_A[24]/
GP1[15]
J3
I/O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL195
General-Purpose Input/Output (I/O) 1 [GP1] pin 15.
GPMC_A[23]/
GP1[14]
J4
I/O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL194
General-Purpose Input/Output (I/O) 1 [GP1] pin 14.
GP1[13]
J5
I/O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
PINCTRL193
General-Purpose Input/Output (I/O) 1 [GP1] pin 13.
GPMC_A[25]/
GP1[12]
J7
I/O
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GPMC
PINCTRL192
General-Purpose Input/Output (I/O) 1 [GP1] pin 12.
GPMC_A[26]/
GP1[11]
J6
I/O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC
PINCTRL191
General-Purpose Input/Output (I/O) 1 [GP1] pin 11.
GPMC_A[22]/
GP1[10]
K2
I/O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GPMC
PINCTRL190
General-Purpose Input/Output (I/O) 1 [GP1] pin 10.
GPMC_A[27]/
GP1[9]
K8
I/O
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL189
General-Purpose Input/Output (I/O) 1 [GP1] pin 9.
SD_SDWP/
GPMC_A[15]/
GP1[8]
R5
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL165
General-Purpose Input/Output (I/O) 1 [GP1] pin 8.
SD_SDCD/
GPMC_A[16]/
GP1[7]
R13
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL164
General-Purpose Input/Output (I/O) 1 [GP1] pin 7.
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
T13
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL163
General-Purpose Input/Output (I/O) 1 [GP1] pin 6.
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
T2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL162
General-Purpose Input/Output (I/O) 1 [GP1] pin 5.
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
T1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL161
General-Purpose Input/Output (I/O) 1 [GP1] pin 4.
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
U1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL160
General-Purpose Input/Output (I/O) 1 [GP1] pin 3.
SD_CMD/
GPMC_A[21]/
GP1[2]
U3
I/O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
SD, GPMC
PINCTRL159
General-Purpose Input/Output (I/O) 1 [GP1] pin 2.
SD_CLK/
GPMC_A[13]/
GP1[1]
U2
I/O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GPMC
PINCTRL158
General-Purpose Input/Output (I/O) 1 [GP1] pin 1.
SD_POW/
GPMC_A[14]/
GP1[0]
U4
I/O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GPMC
PINCTRL157
General-Purpose Input/Output (I/O) 1 [GP1] pin 0.
Device Pins
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3.2.5
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General-Purpose Memory Controller (GPMC) Signals
Table 3-6. GPMC Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
V1
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GP1
GPMC Clock output
GPMC_CS[5] /
GPMC_A[12]
AG1
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC
PINCTRL212
GPMC Chip Select 5
GPMC_CS[4] /
GP1[21]
AG3
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GP1
PINCTRL211
GPMC Chip Select 4
GPMC_CS[3]
AG9
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL210
GPMC Chip Select 3
GPMC_CS[2]
AH2
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL209
GPMC Chip Select 2
GPMC_CS[1]
AH1
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL208
GPMC Chip Select 1
GPMC_CS[0]
AH7
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL207
GPMC Chip Select 0
GPMC_WE
AG2
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL213
GPMC Write Enable output
GPMC_OE_RE
AF2
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
PINCTRL214
GPMC Output Enable output
GPMC_BE1
AF1
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
PINCTRL216
GPMC Upper Byte Enable output
GPMC_BE0_CLE
AE11
O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
PINCTRL215
GPMC Lower Byte Enable output or Command Latch
Enable output
GPMC_ADV_ALE
AE10
O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
PINCTRL217
GPMC Address Valid output or Address Latch Enable
output
GPMC_DIR/
GP1[20]
AE7
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GP1
PINCTRL218
GPMC Direction Control for External Transceivers
GPMC_WP
AE9
O
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
PINCTRL219
GPMC Write Protect output
GPMC_WAIT
AE8
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL220
GPMC Wait input
GPMC_CLK/
GP1[29]
(1)
(2)
(3)
60
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
GPMC_A[27]/
GP0[20]
NO.
AC5
TYPE (1)
OTHER (2)
(3)
MUXED
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0
PINCTRL233
GP1
PINCTRL189
DESCRIPTION
GPMC Address 27
GPMC_A[27]/
GP1[9]
K8
O
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
N1
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART1, GPMC
PINCTRL181
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
L9
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART2, GPMC,
GP1
GPMC Address 26
PINCTRL187
GPMC_A[26]/
GP1[11]
J6
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GP1
PINCTRL191
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
N2
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
UART1, GPMC
PINCTRL182
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
K7
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART2, GPMC,
GP1
GPMC Address 25
PINCTRL188
GPMC_A[25]/
GP1[12]
J7
O
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
GP1
PINCTRL192
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
G2
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, MCA[2]
PINCTRL296
GPMC_A[24]/
GP1[15]
J3
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GP1
PINCTRL195
TIM6_OUT/
GPMC_A[24]/
GP0[30]
H1
O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
TIM6, GP0
PINCTRL205
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
N4
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC,
GP1
PINCTRL178
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
G5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, MCA[1]
PINCTRL297
SPI_SCS[1]/
GPMC_A[23]
P2
O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI
PINCTRL168
UART0, GPMC,
GP1
PINCTRL179
GP1
PINCTRL194
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
N5
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC_A[23]/
GP1[14]
J4
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC Address 24
GPMC Address 23
Device Pins
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
SPI_SCS[2]/
GPMC_A[22]
P3
O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI
PINCTRL169
GPMC_A[22]/
GP1[10]
K2
O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GP1
PINCTRL190
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
N3
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC,
GP1
PINCTRL180
SPI_SCS[3]/
GPMC_A[21]/
GP1[22]
P1
O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI, GP1
PINCTRL170
SD_CMD/
GPMC_A[21]/
GP1[2]
U3
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL159
GPMC_A[21]/
GP0[26]
H3
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GP0
PINCTRL201
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
U1
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL160
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
N6
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
N1
O
PULL: IPD / IPD
UART12, GPMC
DRIVE: Z / Z
PINCTRL181
DVDD_3P3
UART0_DSR/
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
N4
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC,
GP1
PINCTRL178
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
T1
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL161
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
N2
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
UART1, GPMC
PINCTRL182
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
T2
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL162
UART0_DCD/
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
N5
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC,
GP1
GPMC Address 18
PINCTRL179
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
M2
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART1, GPMC,
GP1
PINCTRL183
62
GPMC Address 22
GPMC Address 21
UART0, GPMC,
GP1
GPMC Address 20
PINCTRL177
GPMC Address 19
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
T13
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
N3
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART0, GPMC,
GP1
GPMC Address 17
PINCTRL180
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
L3
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
UART1, GPMC,
GP1
PINCTRL184
SD_SDCD/
GPMC_A[16]/
GP1[7]
R13
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL164
UART2_CTS/
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
K7
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC_A[16]/
GP0[21]
J2
O
PULL: DIS / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP0
PINCTRL196
SD_SDWP/
GPMC_A[15]/
GP1[8]
R5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
SD, GP1
PINCTRL165
UART2_RTS/
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
L9
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GPMC_A[15]/
GP0[22]
J1
O
PULL: IPU / DIS
DRIVE: H / L
DVDD_3P3
GP0
PINCTRL197
SD_POW/
GPMC_A[14]/
GP1[0]
U4
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GPMC,
GP1
PINCTRL157
UART1_RTS/
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
M2
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GPMC_A[14]/
GP0[23]
H5
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GP0
PINCTRL198
SD_CLK/
GPMC_A[13] /
GP1[1]
U2
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
SD, GP1
PINCTRL158
UART1_CTS/
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
L3
O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC_A[13]/
GP0[24]
H6
O
PULL: IPU / IPD
DRIVE: H / L
DVDD_3P3
DESCRIPTION
SD, GP1
PINCTRL163
UART2, GPMC,
GP1
GPMC Address 16
PINCTRL188
UART2, GPMC,
GP1
GPMC Address 15
PINCTRL187
UART1, GPMC,
GP1
GPMC Address 14
PINCTRL183
UART1, GPMC,
GP1
GPMC Address 13
PINCTRL184
GP0
PINCTRL199
Device Pins
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
UART0_DTR/
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
N6
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
UART0, GPMC,
GP1
PINCTRL177
GPMC_A[12]/
GP0[27]
H2
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GP0
PINCTRL202
TIM7, GP0
PINCTRL206
DESCRIPTION
GPMC Address 12
TIM7_OUT/
GPMC_A[12]/
GP0[31]
G1
O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
GPMC_CS[5]/
GPMC_A[12]
AG1
O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
GPMC
PINCTRL212
GPMC_A[11]/
GP0[19]
AC2
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0
PINCTRL232
GPMC Address 11
GPMC_A[10]/
GP0[18]
AD1
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0
PINCTRL231
GPMC Address 10
GPMC_A[9]/
GP0[17]/
CS0WAIT
AD2
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL230
GPMC Address 9
GPMC_A[8]/
GP0[16]/
CS0BW
AD4
O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL229
GPMC Address 8
GPMC_A[7]/
GP0[15]/
CS0MUX[1]
AD3
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL228
GPMC Address 7
GPMC_A[6]/
GP0[14]/
CS0MUX[0]
AD8
O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL227
GPMC Address 6
GPMC_A[5]/
GP0[13]/
BTMODE[4]
AE2
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL226
GPMC Address 5
GPMC_A[4]/
GP0[12]/
BTMODE[3]
AE1
O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL225
GPMC Address 4
GPMC_A[3]/
GP0[11]/
BTMODE[2]
AE3
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL224
GPMC Address 3
GPMC_A[2]/
GP0[10]/
BTMODE[1]
AE4
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL223
GPMC Address 2
GPMC_A[1]/
GP0[9]/
BTMODE[0]
AE5
O
PULL: IPU / DIS
DRIVE: Z / Z
DVDD_3P3
GP0, BOOT
PINCTRL222
GPMC Address 1
GPMC_A[0]/
GP0[8]
AE6
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GP0
PINCTRL221
GPMC Address 0
64
Device Pins
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Table 3-6. GPMC Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
GPMC_D[15]
V2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL249
GPMC_D[14]
V3
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL248
GPMC_D[13]
V10
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL247
GPMC_D[12]
W2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL246
GPMC_D[11]
W1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL245
GPMC_D[10]
W3
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL244
GPMC_D[9]
Y1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL243
GPMC_D[8]
W4
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL242
PINCTRL241
GPMC_D[7]
Y2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC_D[6]
Y10
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL240
GPMC_D[5]
AA2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL239
GPMC_D[4]
Y3
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL238
GPMC_D[3]
AA3
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL237
GPMC_D[2]
AB2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL236
GPMC_D[1]
AA4
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL235
GPMC_D[0]
AC1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL234
DESCRIPTION
GPMC Data I/Os. Only D[7:0] are used for 8-bit
interfaces
Device Pins
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3.2.6
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High-Definition Multimedia Interface (HDMI) Signals
Table 3-7. HDMI Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
HDMI_TMDSCLKP
AT24
O
VDDA_HDMI
-
HDMI Clock Output.
HDMI_TMDSCLKN
AU24
O
VDDA_HDMI
-
When the HDMI PHY is powered down, these pins
should be left unconnected.
HDMI_TMDSDN2
AU27
O
VDDA_HDMI
-
HDMI Data 2 output.
HDMI_TMDSDP2
AT27
O
VDDA_HDMI
-
When the HDMI PHY is powered down, these pins
should be left unconnected.
HDMI_TMDSDN1
AU26
O
VDDA_HDMI
-
HDMI Data 1 output.
HDMI_TMDSDP1
AT26
O
VDDA_HDMI
-
When the HDMI PHY is powered down, these pins
should be left unconnected.
HDMI_TMDSDN0
AU25
O
VDDA_HDMI
-
HDMI Data 0 output.
HDMI_TMDSDP0
AT25
O
VDDA_HDMI
-
When the HDMI PHY is powered down, these pins
should be left unconnected.
HDMI_SCL
AL25
O
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL301
HDMI I2C Serial Clock Output
HDMI_SDA
AK25
I/O
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL302
HDMI I2C Serial Data I/O
HDMI_CEC
AP25
I/O
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL303
HDMI Consumer Electronics Control I/O
HDMI_HPDET
AE24
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL304
HDMI Hot Plug Detect Input. Signals the
connection / removal of an HDMI cable at the
connector.
HDMI_EXTSWING
AN25
A
-
-
HDMI Voltage Reference. When HDMI is used,
this pin must be connected via an external 5.9K-Ω
(±1% tolerance) resistor to VSS.
When the HDMI PHY is powered down, this pin
should be left unconnected.
(1)
(2)
(3)
66
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.7
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Inter-Integrated Circuit (I2C) Signals
Table 3-8. I2C Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
I2C0
I2C[0]_SCL
N32
I/O
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
I2C[0]_SDA
N33
I/O
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL289
I2C1 Clock I/O
PINCTRL290
I2C1 Data I/O
PINCTRL287
I2C0 Clock I/O
PINCTRL288
I2C0 Data I/O
I2C1
I2C[1]_SCL
N34
I/O
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
I2C[1]_SDA
N35
I/O
PULL: DIS / DIS
DRIVE: Z / Z
DVDD_3P3
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.8
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Multichannel Audio Serial Port Signals
Table 3-9. McASP0 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
MCA[0]_ACLKR
AK28
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL126
McASP0 Receive Bit Clock I/O
MCA[0]_AHCLKR
AJ27
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL127
McASP0 Receive High-Frequency Master Clock I/O
MCA[0]_AFSR
AG29
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL128
McASP0 Receive Frame Sync I/O
H35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0
PINCTRL298
McASP0 Mute Input
MCA[0]_ACLKX
AH30
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL129
McASP0 Transmit Bit Clock I/O
MCA[0]_AHCLKX
AH31
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL130
McASP0 Transmit High-Frequency Master Clock I/O
MCA[0]_AFSX
AJ31
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL131
McASP0 Transmit Frame Sync I/O
MCA[0]_AMUTE
AJ35
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL132
McASP0 Mute Output
MCA[0]_AXR[5]/
MCB_DR
AJ37
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL138
MCA[0]_AXR[4]/
MCB_DX
AJ36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL137
MCA[0]_AXR[3]/
MCB_FSR
AJ34
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL136
MCB
PINCTRL135
GP0[7]/
MCA[0]_AMUTEIN
McASP0 Transmit/Receive Data I/Os
MCA[0]_AXR[2]/
MCB_FSX
AJ33
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[1]
AJ32
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL134
MCA[0]_AXR[0]
AK37
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL133
(1)
(2)
(3)
68
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-10. McASP1 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
MCA[1]_ACLKR
AK36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL139
McASP1 Receive Bit Clock I/O
MCA[1]_AHCLKR
AL37
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL140
McASP1 Receive High-Frequency Master Clock I/O
MCA[1]_AFSR
AK35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL141
McASP1 Receive Frame Sync I/O
G5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, GPMC
PINCTRL297
McASP1 Mute Input
MCA[1]_ACLKX
AL36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL142
McASP1 Transmit Bit Clock I/O
MCA[1]_AHCLKX
AM37
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL143
McASP1 Transmit High-Frequency Master Clock I/O
MCA[1]_AFSX
AK34
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL144
McASP1 Transmit Frame Sync I/O
MCA[1]_AMUTE
AK33
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL145
McASP1 Mute Output
MCA[1]_AXR[1]
AK32
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL147
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL146
GP0[6]/
MCA[1]_AMUTEIN/
GPMC_A[23]
MCA[1]_AXR[0]
(1)
(2)
(3)
AL33
McASP1 Transmit/Receive Data I/Os
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-11. McASP2 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
AL34
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL148
McASP2 Receive Bit Clock I/O
MCA[2]_AHCLKR/
MCB_CLKS
AM34
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL149
McASP2 Receive High-Frequency Master Clock I/O
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
AM35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL150
McASP2 Receive Frame Sync I/O
G2
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP0, GPMC
PINCTRL296
McASP2 Mute Input
MCA[2]_ACLKX/
MCB_CLKX
AM36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL151
McASP2 Transmit Bit Clock I/O
MCA[2]_AHCLKX/
MCB_CLKR
AN36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL152
McASP2 Transmit High-Frequency Master Clock I/O
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
AN35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL153
McASP2 Transmit Frame Sync I/O
MCA[2]_AMUTE
AP36
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL154
McASP2 Mute Output
MCA[2]_AXR[1]/
MCB_DX
AR37
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCB
PINCTRL156
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL155
GP0[5]/
MCA[2]_AMUTEIN/
GPMC_A[24]
MCA[2]_AXR[0]
(1)
(2)
(3)
70
AR36
McASP2 Transmit/Receive Data I/Os
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.9
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Multichannel Buffered Serial Port Signals
Table 3-12. McBSP Terminal Functions
SIGNAL
NAME
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
NO.
AL34
TYPE (1)
OTHER (2)
(3)
MUXED
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL148
MCA[2]
PINCTRL152
McBSP Receive Clock I/O
MCA[2]_AHCLKX/
MCB_CLKR
AN36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[3]/
MCB_FSR
AJ34
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]
PINCTRL136
MCA[2], MCB
PINCTRL150
McBSP Receive Frame Sync I/O
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
AM35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[5]/
MCB_DR
AJ37
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]
PINCTRL138
MCA[2], MCB
PINCTRL148
McBSP Receive Data Input
MCA[2]_ACLKR/
MCB_CLKR/
MCB_DR
AL34
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AFSR/
MCB_CLKX/
MCB_FSR
AM35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL150
MCA[2]
PINCTRL151
McBSP Transmit Clock I/O
MCA[2]_ACLKX/
MCB_CLKX
AM36
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[2]/
MCB_FSX
AJ33
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]
PINCTRL135
MCA[2], MCB
PINCTRL153
McBSP Transmit Frame Sync I/O
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
AN35
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]_AXR[4]/
MCB_DX
AJ36
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[0]
PINCTRL137
MCA[2]
PINCTRL156
McBSP Transmit Data Output
MCA[2]_AXR[1]/
MCB_DX
AR37
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]_AHCLKR/
MCB_CLKS
AM34
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2]
PINCTRL149
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
MCA[2], MCB
PINCTRL153
MCA[2]_AFSX/
MCB_CLKS/
MCB_FSX
(1)
(2)
(3)
AN35
DESCRIPTION
McBSP Source Clock Input
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.10 Oscillator/Phase-Locked Loop (PLL) Signals
Table 3-13. Oscillator/PLL and Clock Generator Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
CLOCK GENERATOR
CLKOUT
F1
O
PULL: IPU / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL320
Device Clock output. Can be used as a system clock
for other devices
OSCILLATOR/PLL
DEV_MXI/
DEV_CLKIN
A19
I
DIS
DEV_DVDD18
-
Device Crystal input. Crystal connection to internal
oscillator for system clock. Functions as CLKINDEV
clock input when an external oscillator is used.
DEV_MXO
C19
O
DIS
DEV_DVDD18
-
Device Crystal output. Crystal connection to internal
oscillator for system clock. When device oscillator is
BYPASSED, leave this pin unconnected.
DEVOSC_DVDD18
E19
S
-
-
1.8 V Power Supply for Device (DEV) Oscillator. If the
internal oscillator is bypassed, DEVOSC_DVDD18
should still be connected to the 1.8-V power supply.
DEVOSC_VSS
B19
GND
-
-
Supply Ground for DEV Oscillator. If the internal
oscillator is bypassed, DEVOSC_VSS should be
connected to ground (VSS).
CLKIN32
H37
I
PULL: IPU / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL321
(1)
(2)
(3)
72
RTC Clock input. Optional 32.768 kHz clock for RTC
reference. If this pin is not used, it should be held low.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
3.2.11 Peripheral Component Interconnect Express (PCIe) Signals
Table 3-14. PCIe Terminal Functions
SIGNAL
NAME
PCIE_TXP0
NO.
AB31
TYPE (1)
O
PCIE_TXN0
AB30
O
PCIE_RXP0
Y29
I
PCIE_RXN0
V29
I
PCIE_TXP1
Y27
O
PCIE_TXN1
AB28
O
PCIE_RXP1
V31
I
PCIE_RXN1
OTHER (2)
PCIE Transmit Data Lane 0.
VDDR_PCIE
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
PCIE Receive Data Lane 0.
VDDR_PCIE
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
PCIE Transmit Data Lane 1.
VDDR_PCIE
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
PCIE Receive Data Lane 1.
VDDR_PCIE
When the PCIe SERDES are powered down, or if this lane is not used,
these pins should be left unconnected.
PCIE Serdes Reference Clock Inputs. Shared between PCI Express and
Serial ATA. When neither PCI Express nor Serial ATA are used, these
pins should be left unconnected.
V30
I
SERDES_CLKP
AB34
I
VDD_LJCB
SERDES_CLKN
AB33
I
VDD_LJCB
(1)
(2)
DESCRIPTION
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.12 Reset, Interrupts, and JTAG Interface Signals
Table 3-15. RESET, Interrupts, and JTAG Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
RESET
RESET
G33
I
PULL: IPD / IPU
DRIVE: Z / Z
DVDD_3P3
POR
F37
I
IPU
DVDD_3P3
-
RSTOUT
G37
O
PULL: DIS / DIS
DVDD_3P3
PINCTRL318
PINCTRL316
Device Reset input
Power-On Reset input
Reset output
For more detailed information on RSTOUT pin
behavior, see Section 7.2.13
INTERRUPTS
NMI
G36
GP0[31:3]
see
Table 3-5
GP1[31:0]
see
Table 3-5
I
I/O
PULL: IPD / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL317
see NOTE
External active low maskable interrupt
-
Interrupt-capable general-purpose I/Os
NOTE: All pins are multiplexed with other pin
functions. For muxing and internal
pullup/pulldown/disable details, see Table 3-5, GPIO
Terminal Functions.
-
Interrupt-capable general-purpose I/Os
NOTE: All pins are multiplexed with other pin
functions. For muxing and internal
pullup/pulldown/disable details, see Table 3-5, GPIO
Terminal Functions.
I/O
see NOTE
PINCTRL305
JTAG test clock input
JTAG
TCLK
J37
I
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
RTCK
J36
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
PINCTRL306
JTAG return clock output
TDI
J34
I
PULL: IPU / IPU
DRIVE: H / H
DVDD_3P3
PINCTRL307
JTAG test data input
TDO
N30
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
PINCTRL308
JTAG test port data output
TMS
N31
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL309
JTAG test port mode select input. For proper
operation, do not oppose the IPU on this pin.
TRST
K36
I
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
PINCTRL310
JTAG test port reset input
EMU4
M37
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL315
Emulator pin 4
(1)
(2)
(3)
74
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-15. RESET, Interrupts, and JTAG Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
EMU3
M36
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL314
Emulator pin 3
EMU2
L37
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL313
Emulator pin 2
EMU1
L36
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL312
Emulator pin 1
EMU0
J35
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL311
Emulator pin 0
Device Pins
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3.2.13 Secure Digital/Secure Digital Input Output (SD/SDIO) Signals
Table 3-16. SD/SDIO Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
SD_CLK/
GPMC_A[13]/
GP1[1]
U2
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC, GP1
PINCTRL158
SD Clock output
SD_CMD/
GPMC_A[21]/
GP1_[2]
U3
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL159
SD Command output
SD_DAT[0]/
GPMC_A[20]/
GP1[3]
U1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL160
SD Data0 I/O. Functions as data bit 0 for 4-bit SD
mode and single data bit for 1-bit SD mode.
SD_DAT[1]_SDIRQ/
GPMC_A[19]/
GP1[4]
T1
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GMPC, GP1
PINCTRL161
SD Data1 I/O. Functions as data bit 1 for 4-bit SD
mode and as an IRQ input for 1-bit SD mode
SD_DAT[2]_SDRW/
GPMC_A[18]/
GP1[5]
T2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL162
SD Data2 I/O. Functions as data bit 2 for 4-bit SD
mode and as a Read Wait input for 1-bit SD mode.
SD_DAT[3]/
GPMC_A[17]/
GP1[6]
T13
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL163
SD Data3 I/O. Functions as data bit 3 for 4-bit SD
mode.
SD_POW/
GPMC_A[14]/
GP1[0]
U4
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
GPMC, GP1
PINCTRL157
SD Card Power Enable output
SD_SDCD/
GPMC_A[16]/
GP1[7]
R13
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL164
SD Card Detect input
SD_SDWP/
GPMC_A[15]/
GP1[8]
R5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GMC, GP1
PINCTRL165
SD Card Write Protect input
(1)
(2)
(3)
76
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.14 Serial ATA Signals
NOTE
Serial ATA pins J32 and J33 have a different naming convention and functionality for silicon
revision 1.x devices and silicon revision 2.x devices. These pins are listed separately in
Table 3-18.
Table 3-17. Serial ATA Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
SATA_TXN0
T31
O
VDDR_SATA
-
Serial ATA Data Transmit for disk 0.
SATA_TXP0
T32
O
VDDR_SATA
-
When the SATA SERDES are powered down, these
pins should be left unconnected.
SATA_TXN1
U33
O
VDDR_SATA
-
Serial ATA Data Transmit for disk 1.
SATA_TXP1
V33
O
VDDR_SATA
-
When the SATA SERDES are powered down, these
pins should be left unconnected.
SATA_RXN0
V37
I
VDDR_SATA
-
Serial ATA Data Receive for disk 0.
SATA_RXP0
V36
I
VDDR_SATA
-
When the SATA SERDES are powered down, these
pins should be left unconnected.
SATA_RXN1
V35
I
VDDR_SATA
-
Serial ATA Data Receive for disk 1.
SATA_RXP1
W35
I
VDDR_SATA
-
When the SATA SERDES are powered down, these
pins should be left unconnected.
SERDES_CLKP
AB34
I
VDD_LJCB
-
I
VDD_LJCB
-
SERDES_CLKN
(1)
(2)
(3)
AB33
PCIE Serdes Reference Clock Input. Shared between
PCI Express and Serial ATA.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-18. Serial ATA [Pins J32, J33] Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
Silicon Revision 1.x
GP1[30]/
SATA_ACT0_LED
J32
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL299
Serial ATA disk 0 Activity LED output
GP1[31]/
SATA_ACT1_LED
J33
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL300
Serial ATA disk 1 Activity LED output
GP1[30]/
SATA_ACT1_LED
J32
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL299
Serial ATA disk 1 Activity LED output
GP1[31]/
SATA_ACT0_LED
J33
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL300
Serial ATA disk 0 Activity LED output
Silicon Revision 2.x
(1)
(2)
(3)
78
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.15 Serial Peripheral Digital Interconnect Format (SPI) Signals
Table 3-19. SPI Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
SPI_SCLK
R2
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL166
SPI_SCS[3] /
GPMC_A[21]/
GP1[22]
P1
I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL170
SPI_SCS[2] /
GPMC_A[22]
P3
I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL169
GPMC
PINCTRL168
P2
I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
SPI_SCS[0]
R1
I/O
PULL: DIS / IPU
DRIVE: Z / Z
DVDD_3P3
PINCTRL167
SPI_D[1]
P13
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL172
I/O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL171
(1)
(2)
(3)
N11
SPI Clock I/O
SPI Chip Select I/O
SPI_SCS[1] /
GPMC_A[23]
SPI_D[0]
DESCRIPTION
SPI Data I/O. Can be configured as either MISO or
MOSI
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.16 Timer Signals
Table 3-20. Timer Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
General-Purpose Timers7-1 and Watchdog Timer
GP0[3]/
TCLKIN
J31
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
GP0
PINCTRL294
Timer external clock input
Timer7
TIM7_OUT/
GPMC_A[12]/
GP0[31]
G1
GPMC, GP0
PINCTRL206
Timer7 capture event input or PWM output
Timer6
TIM6_OUT/
GPMC_A[24]/
GP0[30]
H1
GPMC, GP0
PINCTRL205
Timer6 capture event input or PWM output
Timer5
TIM5_OUT/
GP0[29]
H34
GP0
PINCTRL204
Timer5 capture event input or PWM output
Timer4
TIM4_OUT/
GP0[28]
H33
I/O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
GP0
PINCTRL203
Timer4 capture event input or PWM output
Timer3-1
There are no external pins on these timers for this device.
Watchdog Timer
WD_OUT
(1)
(2)
(3)
80
H36
O
PULL: IPU / IPU
DRIVE: H / L
DVDD_3P3
PINCTRL319
Watchdog timer event output
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.17 Universal Asynchronous Receiver/Transmitter (UART) Signals
Table 3-21. UART0 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
UART0_RXD
N10
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL173
UART0 Receive Data Input. Functions as IrDA
receive input in IrDA modes and CIR receive input in
CIR mode.
UART0_TXD
N8
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
PINCTRL174
UART0 Transmit Data Output. Functions as transmit
output in CIR and IrDA modes.
UART0_RTS /
GP1[27]
N9
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GP1
PINCTRL175
UART0 Request to Send Output. Indicates module is
ready to receive data. Functions as SD output in IrDA
mode.
UART0_CTS /
GP1[28]
N7
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GP1
PINCTRL176
UART0 Clear to Send Input. Has no function in IrDA
and CIR modes.
UART0_DTR /
GPMC_A[20]/
GPMC_A[12]/
GP1[16]
N6
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GPMC, GP1
PINCTRL177
UART0 Data Terminal Ready Output
UART0_DSR /
GPMC_A[19]/
GPMC_A[24]/
GP1[17]
N4
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL178
UART0 Data Set Ready Input
UART0_DCD /
GPMC_A[18]/
GPMC_A[23]/
GP1[18]
N5
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL179
UART0 Data Carrier Detect Input
UART0_RIN/
GPMC_A[17]/
GPMC_A[22]/
GP1[19]
N3
I
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL180
UART0 Ring Indicator Input
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-22. UART1 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
UART1_RXD/
GPMC_A[26]/
GPMC_A[20]
N1
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
GPMC
PINCTRL181
UART1 Receive Data Input. Functions as IrDA
receive input in IrDA modes and CIR receive input in
CIR mode.
UART1_TXD/
GPMC_A[25]/
GPMC_A[19]
N2
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
GPMC
PINCTRL182
UART1 Transmit Data Output. Functions as transmit
output in CIR and IrDA modes.
UART1_RTS /
GPMC_A[14]/
GPMC_A[18]/
GP1[25]
M2
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GPMC, GP1
PINCTRL183
UART1 Request to Send Output. Indicates module is
ready to receive data. Functions as SD output in IrDA
mode.
UART1_CTS /
GPMC_A[13]/
GPMC_A[17]/
GP1[26]
L3
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL184
UART1 Clear to Send Input. Has no function in IrDA
and CIR modes.
(1)
(2)
(3)
82
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-23. UART2 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
UART2_RXD
M1
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL185
UART2 Receive Data Input. Functions as IrDA
receive input in IrDA modes and CIR receive input in
CIR mode.
UART2_TXD
L2
O
PULL: IPD / IPD
DRIVE: L / H
DVDD_3P3
PINCTRL186
UART2 Transmit Data Output. Functions as transmit
output in CIR and IrDA modes.
UART2_RTS /
GPMC_A[15]/
GPMC_A[26]/
GP1[23]
L9
O
PULL: IPU / DIS
DRIVE: H / H
DVDD_3P3
GPMC, GP1
PINCTRL187
UART2 Request to Send Output. Indicates module is
ready to receive data. Functions as SD output in IrDA
mode.
UART2_CTS /
GPMC_A[16]/
GPMC_A[25]/
GP1[24]
K7
I/O
PULL: IPU / IPU
DRIVE: Z / Z
DVDD_3P3
GPMC, GP1
PINCTRL188
UART2 Clear to Send Input. Has no function in IrDA
and CIR modes.
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.18 Universal Serial Bus (USB) Signals
Table 3-24. USB Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
USB0
USB0_DP
P37
A I/O
-
-
USB0 bidirectional Data Differential signal pair
[positive/negative].
USB0_DN
P36
A I/O
-
-
When the USB0 PHY is powered down, these pins
should be left unconnected.
USB0_R1
N37
AO
-
-
USB0 current reference output. When the USB0
peripheral is used, this pin must be connected via a
44.2-Ω ±1% resistor to VSS.
When the USB0 PHY is powered down, this pin
should be left unconnected.
USB0_DRVVBUS
P35
O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
PINCTRL322
When this pin is used as USB0_DRVVBUS and the
USB0 Controller is operating as a Host, this signal is
used by the USB0 Controller to enable the external
VBUS charge pump.
When the USB0 PHY is powered down, this pin
should be left unconnected.
VDD_USB0_VBUS
N36
I
-
-
USB0 VBUS input (5 V).
The voltage level on this pin is sampled to determine
session status.
When the USB0 PHY is powered down, this pin
should be left unconnected.
USB1
USB1_DP
R37
A I/O
-
-
USB1 bidirectional Data Differential signal pair
[positive/negative].
USB1_DN
R36
A I/O
-
-
When the USB1 PHY is powered down, these pins
should be left unconnected.
USB1_R1
T37
AO
-
-
USB1 current reference output. When the USB1
peripheral is used, this pin must be connected via a
44.2-Ω ±1% resistor to VSS.
When the USB1 PHY is powered down, this pin
should be left unconnected.
USB1_DRVVBUS
R35
O
PULL: IPD / IPD
DRIVE: L / L
DVDD_3P3
PINCTRL323
When this pin is used as USB1_DRVVBUS and the
USB1 Controller is operating as a Host, this signal is
used by the USB1 Controller to enable the external
VBUS charge pump.
When the USB1 PHY is powered down, this pin
should be left unconnected.
VDD_USB1_VBUS
T36
I
-
-
USB1 VBUS input (5 V).
The voltage level on this pin is sampled to determine
session status.
When the USB1 PHY is powered down, this pin
should be left unconnected.
(1)
(2)
(3)
84
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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3.2.19 Video Input Signals
Table 3-25. Video Input 0 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
VIN[0]A_CLK
AR14
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL83
Video Input 0 Port A Clock input. Input clock for 8-bit,
16-bit, or 24-bit Port A video capture.
VIN[0]B_CLK
AR19
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL84
Video Input 0 Port B Clock input. Input clock for 8-bit
Port B video capture. This signal is not used in 16-bit
and 24-bit capture modes.
VIN[0]A_D[23]/
VIN[0]B_HSYNC
AT2
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]B
PINCTRL15
VIN[0]A_D[22]/
VIN[0]B_VSYNC
AR2
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]B
PINCTRL14
VIN[0]A_D[21]/
VIN[0]B_FLD
AU4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]B
PINCTRL13
VIN[0]A_D[20]/
VIN[0]B_DE
AN3
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]B
PINCTRL12
VIN[0]A_D[19]/
VIN[1]A_DE[0]/
VOUT[1]_C[9]
AK4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL25
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
AK5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL24
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
AL5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL23
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
AT5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A,
VOUT[1]
PINCTRL22
(1)
(2)
(3)
Video Input 0 Port A Data inputs. For 16-bit capture,
D[7:0] are Cb/Cr and [15:8] are Y Port A inputs. For
8-bit capture, D[7:0] are Port A YCbCr data inputs
and D[15:8] are Port B YCbCr data inputs. For RGB
capture, D[23:16] are R, D[15:8] are G, and D[7:0] are
B data inputs.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-25. Video Input 0 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
VIN[0]A_D[15]
AU14
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL100
VIN[0]A_D[14]
AU15
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL99
VIN[0]A_D[13]
AT15
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL98
VIN[0]A_D[12]
AU16
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL97
VIN[0]A_D[11]
AU17
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL96
VIN[0]A_D[10]
AT16
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL95
VIN[0]A_D[9]
AE16
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL94
VIN[0]A_D[8]
AP17
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL93
VIN[0]A_D[7]
AR17
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL92
VIN[0]A_D[6]
AP18
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL91
VIN[0]A_D[5]
AT17
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL90
VIN[0]A_D[4]
AT18
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL89
VIN[0]A_D[3]
AR18
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL88
VIN[0]A_D[2]
AH18
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL87
VIN[0]A_D[1]
AU18
I
PULL: IPD / IPD
DRIVE: Z /Z
DVDD_3P3
PINCTRL86
VIN[0]A_D[0]
AJ19
I
IPD
DVDD_3P3
PINCTRL85
VIN[0]A
PINCTRL15
Video Input 0 Port B Horizontal Sync input. Discrete
horizontal synchronization signal for Port B 8-bit
YCbCr capture without embedded syncs ("BT.601"
modes). Not used in RGB or 16-bit YCbCr capture
modes
PINCTRL32
Video Input 0 Port A Horizontal Sync input. Discrete
horizontal synchronization signal for Port A RGB
capture mode or YCbCr capture without embedded
syncs ("BT.601" modes).
VIN[0]A_D[23]/
VIN[0]B_HSYNC
AT2
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_HSYNC
AU5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
86
Video Input 0 Port A Data inputs. For 16-bit capture,
D[7:0] are Cb/Cr and [15:8] are Y Port A inputs. For
8-bit capture, D[7:0] are Port A YCbCr data inputs
and D[15:8] are Port B YCbCr data inputs. For RGB
capture, D[23:16] are R, D[15:8] are G, and D[7:0] are
B data inputs.
Device Pins
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 3-25. Video Input 0 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
VIN[0]A_D[22]/
VIN[0]B_VSYNC
AR2
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A
PINCTRL14
Video Input 0 Port B Vertical Sync input. Discrete
vertical synchronization signal for Port B 8-bit YCbCr
capture without embedded syncs ("BT.601" modes).
Not used in RGB or 16-bit YCbCr capture modes.
VIN[0]A_VSYNC
AM4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL33
Video Input 0 Port A Vertical Sync input. Discrete
vertical synchronization signal for Port A RGB capture
mode or YCbCr capture without embedded syncs
("BT.601" modes).
VIN[0]A_D[21]/
VIN[0]B_FLD
AU4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A
PINCTRL13
Video Input 0 Port B Field ID input. Discrete field
identification signal for Port B 8-bit YCbCr capture
without embedded syncs ("BT.601" modes). Not used
in RGB or 16-bit YCbCr capture modes
VIN[0]A_FLD
AL4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL34
Video Input 0 Port A Field ID input. Discrete field
identification signal for Port A RGB capture mode or
YCbCr capture without embedded syncs ("BT.601"
modes).
VIN[0]A_D[20]/
VIN[0]B_DE
AN3
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A
PINCTRL12
Video Input 0 Port B Data Enable input. Discrete data
valid signal for Port B RGB capture mode or YCbCr
capture without embedded syncs ("BT.601" modes).
VIN[0]A_DE
AT3
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL35
Video Input 0 Port A Data Enable input. Discrete data
valid signal for Port A RGB capture mode or YCbCr
capture without embedded syncs ("BT.601" modes).
Device Pins
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Table 3-26. Video Input 1 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
VOUT[1]_CLK/
VIN[1]A_CLK
AT7
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL46
Video Input 1 Port A Clock input. Input clock for 8bit or 16-bit Port A video capture. Input data is
sampled on the CLK0 edge.
VOUT[1]_AVID/
VIN[1]B_CLK
AT4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL31
Video Input 1 Port B Clock input. Input clock for 8bit Port B video capture. Input data is sampled on
the CLK1 edge. This signal is not used in 16-bit
capture modes.
VOUT[1]_HSYNC
(silicon revision 1.x)
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)/
VIN[1]A_D[15]
AR5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL21
VIN[1]A_D[14]
AM3
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL11
VOUT[1]_C[7]/
VIN[1]A_D[13]
AD13
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL10
VOUT[1]_C[6]
VIN[1]A_D[12]
AN8
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL9
VOUT[1]_C[5]/
VIN[1]A_D[11]
AP8
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL8
VOUT[1]_C[4]/
VIN[1]A_D[10]
AN7
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL7
VOUT[1]_C[3]/
VIN[1]A_D[9]
AM8
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL6
VOUT[1]_C[2]/
VIN[1]A_D[8]
AK6
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL20
(1)
(2)
(3)
88
Video Input 1 Port A Data inputs. For 16-bit
capture, D[7:0] are Cb/Cr and [15:8] are Y Port A
inputs. For 8-bit capture, D[7:0] are Port A YCbCr
data inputs and D[15:8] are Port B YCbCr data
inputs. For VIN[1], only D[15:0] are available.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-26. Video Input 1 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
AP6
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL19
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
AT6
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL18
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
AR6
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL17
VOUT[1]_Y_YC[6]/
VIN[1]A_D[4]
AC13
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL16
VOUT[1]_Y_YC[5]/
VIN[1]A_D[3]
AJ7
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL50
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
AU6
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL49
VOUT[1]_Y_YC[3]/
VIN[1]A_D[1]
AP7
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL48
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
AU7
I
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL47
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL27
Video Input 1 Port B Horizontal Sync or Data Valid
signal input. Discrete horizontal synchronization
signal for Port B 8-bit YCbCr capture without
embedded syncs ("BT.601" modes). Not used in
16-bit YCbCr capture mode.
VIN[0]A,
VOUT[1]
PINCTRL22
Video Input 1 Port A Horizontal Sync input.
Discrete horizontal synchronization signal for Port
A YCbCr capture modes without embedded syncs
("BT.601" modes).
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
AR9
Video Input 1 Port A Data inputs. For 16-bit
capture, D[7:0] are Cb/Cr and [15:8] are Y Port A
inputs. For 8-bit capture, D[7:0] are Port A YCbCr
data inputs and D[15:8] are Port B YCbCr data
inputs. For VIN[1], only D[15:0] are available.
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
AT5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)/
VIN[1]B_VSYNC
AP9
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL29
Video Input 1 Port B Vertical Sync input. Discrete
vertical synchronization signal for Port B 8-bit
YCbCr capture without embedded syncs ("BT.601"
modes). Not used in 16-bit YCbCr capture mode.
VIN[0]A,
VOUT[1]
PINCTRL23
Video Input 1 Port A Vertical Sync input. Discrete
vertical synchronization signal for Port A YCbCr
capture modes without embedded syncs ("BT.601"
modes).
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
AL5
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A_D[19]/
VIN[1]A_DE/
VOUT[1]_C[9]
AK4
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VOUT[1]
PINCTRL25
Video Input 1 Port A Data Enable input. Discrete
data valid signal for Port A YCbCr capture modes
without embedded syncs ("BT.601" modes).
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VOUT[1]
PINCTRL24
Video Input 1Port A Field ID input. Discrete field
identification signal for Port A YCbCr capture
modes without embedded syncs ("BT.601"
modes).
I
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL30
Video Input 1 Port B Field ID input. Discrete field
identification signal for Port B 8-bit YCbCr capture
without embedded syncs ("BT.601" modes). Not
used in 16-bit YCbCr capture mode.
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
AK5
AU8
Device Pins
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3.2.20 Digital Video Output Signals
NOTE
Video output 0 pins AR8 and AL9 and video output 1 pins AT9, AR5, AP9, and AL5 have a
different naming convention and functionality for silicon revision 1.x devices and silicon
revision 2.x devices. These pins are listed separately in Table 3-28 and Table 3-30.
Table 3-27. Video Output 0 Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
VOUT[0]_CLK
AT14
O
PULL: IPD / DIS
DRIVE: L / H
DVDD_3P3
PINCTRL101
VOUT[0]_G_Y_YC[9]
AR13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL109
VOUT[0]_G_Y_YC[8]
AU13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL108
VOUT[0]_G_Y_YC[7]
AT13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL107
VOUT[0]_G_Y_YC[6]
AE14
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL106
VOUT[0]_G_Y_YC[5]
AM14
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL105
VOUT[0]_G_Y_YC[4]
AL14
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL104
VOUT[0]_G_Y_YC[3]
AP14
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL103
VOUT[0]_G_Y_YC[2]
AE15
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL102
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
AU8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT,[1]
VIN[1]B
PINCTRL30
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC
(silicon revision 1.x)
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)/
VIN[1]B_VSYNC
AP9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1],
VIN[1]B
PINCTRL29
(1)
(2)
(3)
90
DESCRIPTION
Video Output 0 Clock output.
Video Output 0 Data. These signals represent the
8 MSBs of G/Y/YC video data. For RGB mode
they are green data bits, for YUV444 mode they
are Y data bits, for Y/C mode they are Y (Luma)
data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits.
Video Output 0 Data. These signals represent the
2 LSBs of G/Y/YC video data for 10-bit, 20-bit and
30-bit video modes (VOUT0 only). For RGB mode
they are green data bits, for YUV444 mode they
are Y data bits, for Y/C mode they are Y (Luma)
data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits. These signals are not used in 8/16/24-bit
modes
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-27. Video Output 0 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
VOUT[0]_B_CB_C[9]
AT12
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL117
VOUT[0]_B_CB_C[8]
AH13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL116
VOUT[0]_B_CB_C[7]
AM13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL115
VOUT[0]_B_CB_C[6]
AJ13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL114
VOUT[0]_B_CB_C[5]
AK13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL113
VOUT[0]_B_CB_C[4]
AN13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL112
VOUT[0]_B_CB_C[3]
AL13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL111
VOUT[0]_B_CB_C[2]
AP13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
PINCTRL110
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC
(silicon revision 1.x)
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)/
VOUT[1]_AVID
AT9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL28
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/
VOUT[1]_Y_YC[9]
AU9
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL125
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
AR9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1],
VIN[1]B
PINCTRL27
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
AK10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL124
DESCRIPTION
Video Output 0 Data. These signals represent the
8 MSBs of B/CB/C video data. For RGB mode
they are blue data bits, for YUV444 mode they are
Cb (Chroma) data bits, for Y/C mode they are
multiplexed Cb/Cr (Chroma) data bits and for
BT.656 mode they are unused
Video Output 0 Data. These signals represent the
2 LSBs of B/CB/C video data for 20-bit and 30-bit
video modes (VOUT[0] only). For RGB mode they
are blue data bits, for YUV444 mode they are Cb
(Chroma) data bits, for Y/C mode they are
multiplexed Cb/Cr (Chroma) data bits and for
BT.656 mode they are unused. These signals are
not used in 16/24-bit modes.
Device Pins
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Table 3-27. Video Output 0 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/
VOUT[1]_Y_YC[9]
AU9
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL125
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
AK10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL124
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
AL10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL123
VOUT[0]_R_CR[6]/
VOUT[0]_G_Y_YC[0]/
VOUT[1]_Y_YC[6]
AU10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL122
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
AT10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL121
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
AG13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL120
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
AR11
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL119
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
AT11
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL118
VOUT[0]_R_CR[1]
AT8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL40
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
AJ11
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[1]
PINCTRL26
VOUT[0]_VSYNC
AN9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL37
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC/
VOUT[1]_Y_YC[3]
AR11
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL119
VOUT[0]_HSYNC
AM9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL36
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
AT11
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL118
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
AG13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL120
Video Output 0 Field ID output. This is the discrete
field identification output. This signal is not used
for embedded sync modes.
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
AT10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL121
Video Output 0 Active Video output. This is the
discrete active video indicator output. This signal
is not used for embedded sync modes.
92
Video Output 0 Data. These signals represent the
8 MSBs of R/CR video data. For RGB mode they
are red data bits, for YUV444 mode they are Cr
(Chroma) data bits, for Y/C mode and BT.656
modes they are unused.
Video Output 0 Data. These signals represent the
2 LSBs of R/CR video data for 30-bit video modes
(VOUT[0] only). For RGB mode they are red data
bits, for YUV444 mode they are Cr (Chroma) data
bits, for Y/C mode and BT.656 modes they are
unused. These signals are not used in 24-bit
mode.
Video Output 0 Vertical Sync output. This is the
discrete vertical synchronization output. This
signal is not used for embedded sync modes.
Video Output 0 Horizontal Sync output. This is the
discrete horizontal synchronization output. This
signal is not used for embedded sync modes.
Device Pins
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Table 3-28. Video Output 0 [Pins AR8, AL9] Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
Silicon Revision 1.x Devices
HSYNC_VOUT[0]_AVID
AR8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL39
Video Output 0 Active Video output. This is the
discrete active video indicator output. This signal
is not used for embedded sync modes.
VSYNC_VOUT[0]_FLD
AL9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL38
Video Output 0 Field ID output. This is the discrete
field identification output. This signal is not used
for embedded sync modes.
Silicon Revision 2.x Devices
DAC_HSYNC_
VOUT[0]_AVID
AR8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL39
Pin supports two functions in silicon revision 2.x
devices:
1. Video Output 0 Active Video output. This is
the discrete active video indicator output. This
signal is not used for embedded sync modes.
2. Discrete Horizontal Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
DAC_VSYNC_
VOUT[0]_FLD
AL9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
PINCTRL38
Pin supports two functions in silicon revision 2.x
devices:
1. Video Output 0 Field ID output. This is the
discrete field identification output. This signal
is not used for embedded sync modes.
2. Discrete Vertical Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-29. Video Output 1 Terminal Functions
SIGNAL
NAME
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
NO.
AJ11
TYPE (1)
OTHER (2)
(3)
MUXED
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL26
VIN[1]A
PINCTRL46
VOUT[1]_CLK/
VIN[1]A_CLK
AT7
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VOUT[0]_R_CR[9]/
VOUT[0]_B_CB_C[1]/
VOUT[1]_Y_YC[9]
AU9
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL125
VOUT[1]_Y_YC[9]/
VIN[1]A_D[7]
AP6
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL19
VOUT[0]_R_CR[8]/
VOUT[0]_B_CB_C[0]/
VOUT[1]_Y_YC[8]
AK10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL124
VOUT[1]_Y_YC[8]/
VIN[1]A_D[6]
AT6
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL18
VOUT[0]_R_CR[7]/
VOUT[0]_G_Y_YC[1]/
VOUT[1]_Y_YC[7]
AL10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL123
VOUT[1]_Y_YC[7]/
VIN[1]A_D[5]
AR6
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL17
VOUT[0]_R_CR[6]/
VOUT[0]_G_Y_YC[0]/
VOUT[1]_Y_YC[6]
AU10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL122
VOUT[1]_Y_YC[6]/
VIN[1]A_D[4]
AC13
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL16
(1)
(2)
(3)
94
DESCRIPTION
Video Output 1 Clock output
Video Output 1 Data. These signals represent the
8 bits of Y/YC video data. For Y/C mode they are
Y (Luma) data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-29. Video Output 1 Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
VOUT[0]_R_CR[5]/
VOUT[0]_AVID/
VOUT[1]_Y_YC[5]
AT10
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL121
VOUT[1]_Y_YC[5]/
VIN[1]A_D[3]
AJ7
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL50
VOUT[0]_R_CR[4]/
VOUT[0]_FLD/
VOUT[1]_Y_YC[4]
AG13
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL120
VOUT[1]_Y_YC[4]/
VIN[1]A_D[2]
AU6
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL49
VOUT[0]_R_CR[3]/
VOUT[0]_VSYNC /
VOUT[1]_Y_YC[3]
AR11
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL119
VOUT[1]_Y_YC[3]
VIN[1]A_D[1]
AP7
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL48
VOUT[0]_R_CR[2]/
VOUT[0]_HSYNC/
VOUT[1]_Y_YC[2]
AT11
O
PULL: IPD / DIS
DRIVE: L / L
DVDD_3P3
VOUT[0]
PINCTRL118
VOUT[1]_Y_YC[2]/
VIN[1]A_D[0]
AU7
O
PULL: IPD / DIS
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL47
VOUT[0]_B_CB_C[0]/
VOUT[1]_C[9]/
VIN[1]B_HSYNC_DE
AR9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL27
VIN[0]A_D[19]/
VIN[1]A_DE/
VOUT[1]_C[9]
AK4
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
VIN[0]A_D[18]/
VIN[1]A_FLD/
VOUT[1]_C[8]
AK5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL24
VOUT[0]_R_CR[0]/
VOUT[1]_C[8]/
VOUT[1]_CLK
AJ11
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL26
VOUT[1]_C[7]/
VIN[1]A_D[13]
AD13
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL10
VOUT[1]_C[6]/
VIN[1]A_D[12]
AN8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL9
VOUT[1]_C[5]/
VIN[1]A_D[11]
AP8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL8
VOUT[1]_C[4]/
VIN[1]A_D[10]
AN7
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL7
VOUT[1]_C[3]/
VIN[1]A_D[9]/
AM8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL6
VOUT[1]_C[2]/
VIN[1]A_D[8]
AK6
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL20
DESCRIPTION
Video Output 1 Data. These signals represent the
8 bits of Y/YC video data. For Y/C mode they are
Y (Luma) data bits and for BT.656 mode they are
multiplexed Y/Cb/Cr (Luma and Chroma) data
bits.
Video Output 1 Data. These signals represent the
8 bits of C video data. For Y/C mode they are
multiplexed Cb/Cr (Chroma) data bits, and for
BT.656 mode they are unused.
Device Pins
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Table 3-29. Video Output 1 Terminal Functions (continued)
SIGNAL
TYPE (1)
OTHER (2)
(3)
MUXED
NAME
NO.
VIN[0]A_D[16]/
VIN[1]A_HSYNC/
VOUT[1]_FLD
AT5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL22
VOUT[0]_G_Y_YC[1]/
VOUT[1]_FLD/
VIN[1]B_FLD
AU8
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL30
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC
(silicon revision 1.x)
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)/
VOUT[1]_AVID
AT9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL28
VOUT[1]_AVID/
VIN[1]B_CLK
AT4
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]B
PINCTRL31
DESCRIPTION
Video Output 1 Field ID output. This is the discrete
field identification output. This signal is not used
for embedded sync modes.
Video Output 1 Active Video output. This is the
discrete active video indicator output. This signal
is not used for embedded sync modes.
Table 3-30. Video Output 1 [Pins AT9, AR5, AP9, AL5] Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
DESCRIPTION
Silicon Revision 1.x Devices
VOUT[0]_B_CB_C[1]/
VOUT[1]_HSYNC/
VOUT[1]_AVID
AT9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL28
VOUT[1]_HSYNC/
VIN[1]A_D[15]
AR5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL21
VOUT[0]_G_Y_YC[0]/
VOUT[1]_VSYNC/
VIN[1]B_VSYNC
AP9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL29
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
VOUT[1]_VSYNC
AL5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL23
VOUT[0]_B_CB_C[1]/
DAC_VOUT[1]_HSYNC/
VOUT[1]_AVID
AT9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VOUT[1]
PINCTRL28
DAC_VOUT[1]_HSYNC/
VIN[1]A_D[15]
AR5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[1]A
PINCTRL21
Video Output 1 Horizontal Sync output. This is the
discrete horizontal synchronization output. This
signal is not used for embedded sync modes.
Video Output 1 Vertical Sync output. This is the
discrete vertical synchronization output. This
signal is not used for embedded sync modes.
Silicon Revision 2.x Devices
Pin supports two functions in silicon revision 2.x
devices:
1. Video Output 1 Horizontal Sync output. This is
the discrete horizontal synchronization output.
This signal is not used for embedded sync
modes.
2. Discrete Horizontal Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
(1)
(2)
(3)
96
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
PULL: A / B, where:
A is the state of the internal pull resistor during POR reset
B is the state of the internal pull resistor after POR and Warm reset are de-asserted and during Warm reset
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled
DRIVE: A / B, where;
A is the driving state of the pin during POR reset
B is the driving state of the pin after POR and Warm reset are de-asserted and during Warm reset
H = Driving High, L = Driving Low, Z = 3-State
For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see
Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
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Table 3-30. Video Output 1 [Pins AT9, AR5, AP9, AL5] Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
MUXED
VOUT[0]_G_Y_YC[0]/
DAC_VOUT[1]_VSYNC/
VIN[1]B_VSYNC
AP9
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VOUT[0],
VIN[1]B
PINCTRL29
VIN[0]A_D[17]/
VIN[1]A_VSYNC/
DAC_VOUT[1]_VSYNC
AL5
O
PULL: IPD / IPD
DRIVE: Z / Z
DVDD_3P3
VIN[0]A,
VIN[1]A
PINCTRL23
DESCRIPTION
Pin supports two functions in silicon revision 2.x
devices:
1. Video Output 1 Vertical Sync output. This is
the discrete vertical synchronization output.
This signal is not used for embedded sync
modes.
2. Discrete Vertical Sync for HD-DACs.
Functionality is set in SPARE_CTRL0 register as
defined in Section 8.10.
Device Pins
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3.2.21 Analog Video Output Signals
Table 3-31. Analog Video Output Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER
DESCRIPTION
When a specific Video DAC output [IOUTA - IOUTG] is powered down, the corresponding Analog Video Output terminal functions
should be left unconnected.
IOUTA
AT21
O
-
Video DAC A output. Analog HD Video DAC (G/Y)
IOUTB
AR21
O
-
Video DAC B output. Analog HD Video DAC (B/Pb)
IOUTC
AP21
O
-
Video DAC C output. Analog HD Video DAC (R/Pr)
IOUTD
AR20
O
-
Video DAC D output. Analog SD Video DAC
IOUTE
AT19
O
-
Video DAC E output. Analog SD Video DAC
IOUTF
AT20
O
-
Video DAC F output. Analog SD Video DAC
IOUTG
AU20
O
-
Video DAC G output. Analog SD Video DAC
DAC_VOUT[1]_HSYNC,
DAC_HSYNC_
VOUT[0]_AVID
AR5,
AT9,
AR8
O
-
Analog HD Video DAC Discrete HSYNC Output
DAC_VOUT[1]_VSYNC,
DAC_VSYNC_
VOUT[0]_FLD
AL5,
AP9, AL9
O
-
Analog HD Video DAC Discrete VSYNC Output
AH19
I
-
Video DAC reference voltage (0.5 V).
VDAC_VREF
When the video DACs are powered down, this pin should be left
unconnected.
Video DAC HD current bias connection. This pin must be connected
via an external 1.2-kΩ resistor to VSSA_HD.
VDAC_RBIAS_HD
AE22
I/O
When the HD DACs are powered down, this pin should be left
unconnected.
Video DAC SD current bias connection. This pin must be connected
via an external 1.2-kΩ resistor to VSSA_SD.
VDAC_RBIAS_SD
AP19
I/O
When the SD DACs are powered down, this pin should be left
unconnected.
(1)
98
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
Device Pins
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3.2.22 Reserved Pins
Table 3-32. Reserved Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
DESCRIPTION
RSV1
AB36
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV2
P25
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV3
N19
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV4
N20
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV5
T28
I/O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV6
T27
I/O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV7
AE23
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV8
D24
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV9
AU37
I
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV10
N28
I/O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV11
N29
I/O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV12
AG25
S
-
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
RSV13
AG24
S
-
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
RSV14
AH25
S
-
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
RSV15
AH24
S
-
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
RSV16
R34
I
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
RSV17
P34
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV18
P33
S
-
Reserved. For proper device operation, this pin must be tied directly to
the 1.8-V supply.
RSV19
P32
GND
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
RSV20
D14
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV21
AN18
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV22
AN19
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV23
AP2
I
IPD
DVDD_3P3
RSV24
AU3
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV25
AN2
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV26
AT1
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV27
AR1
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV28
AP1
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV29
AM2
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV30
AL2
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
IPD = Internal Pulldown Enabled, IPU = Internal Pullup Enabled, DIS = Internal Pull Disabled. This represents the default state of the
internal pull after reset. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown
resistors are required, see Section 4.2.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
Device Pins
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Table 3-32. Reserved Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER (2)
(3)
DESCRIPTION
RSV31
AK1
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV32
AL1
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV33
AM29
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV34
AL28
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV35
AL29
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV36
AN29
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV37
AP29
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV38
AR29
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV39
AT29
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV40
AT28
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV41
AU21
O
-
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV42
AJ1
I/O
IPU
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV43
AK2
I/O
IPU
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV44
AH8
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV45
AJ2
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV46
AK3
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV47
AJ3
O
DIS
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV48
AJ4
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV49
AJ5
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV50
AJ6
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV51
AB13
I
IPD
DVDD_3P3
Reserved. (Leave unconnected, do not connect to power or ground.)
RSV52
AE21
S
-
Reserved. For proper device operation, this pin should be connected to a
1.0-V power supply.
RSV53
AG22
S
-
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
RSV54
AG23
S
-
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
RSV55
AH23
S
-
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
RSV56
AJ23
S
-
Reserved. For proper device operation, this pin should be connected to a
1.8-V power supply.
GND
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
GND
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
AK22
RSV57
AL22
RSV58
100
Device Pins
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Table 3-32. Reserved Terminal Functions (continued)
SIGNAL
NAME
RSV59
RSV60
RSV61
NO.
AM22
AM21
AN21
TYPE (1)
OTHER (2)
(3)
DESCRIPTION
GND
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
GND
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
GND
-
Reserved. For proper device operation, this pin must be tied directly to
VSS.
Device Pins
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3.2.23 Supply Voltages
Table 3-33. Supply Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
OTHER
DESCRIPTION
VREFSSTL_DDR[0]
A17
S
-
Reference Power Supply DDR[0]:
•
0.75-V for DDR3 memory type
•
0.9-V for DDR2 memory type
VREFSSTL_DDR[1]
A21
S
-
Reference Power Supply DDR[1]
•
0.75-V for DDR3 memory type
•
0.9-V for DDR2 memory type
CVDD
AD22, AD21,
AD20, AD19,
AD18, AD17,
AD16, AC22,
AC21, AC20,
AC19, AC18,
AC17, AC16,
AB24, AB23,
AB22, AB21,
AB20, AB19,
AB18, AB17,
AB16, AB15,
AB14, T24,
T23, T22, T21,
T20, T19, T18,
T17, T16, T15,
T14, R22, R21,
R20, R19, R18,
R17, R16, P22,
P21, P20, P19,
P18, P17, P16
S
-
Variable Core Voltage Supply for the Always ON Domain
CVDDC
AE25, AE13,
AD24, AD23,
AD15, AD14,
AC24, AC23,
AC15, AC14,
R24, R23, R15,
R14, P24, P23,
P15, P14, N25,
N13
S
-
1.0-V Constant Power Supply for Memories and PLLs
N27
S
-
0.9-V Power Supply for USB PHYs.
Note: If the USB is not used, for proper device operation, this pin
must be connected to a power supply (0.9 V or CVDDC).
VDDT_SATA
Y34, Y33, V34,
V32
S
-
1.0-V Power Supply for SATA Termination and Analog Front End
Note: If the SATA is not used, for proper device operation, these
pins must be connected to a 1.0-V power supply.
VDDT_PCIE
Y30, Y28, AB32,
AB29, AB27
S
-
1.0-V Power Supply for PCIe Termination and Analog Front End
Note: If the PCIe is not used, these pins should be connected to
a 1.0-V power supply.
VDD_USB_0P9
VDDA_PLL
B18, A18
S
-
1.5-V Analog Power Supply for PLLs
AR27, AP24,
AP23,
AN24, AN23
S
-
1.0-V Analog Power Supply for HDMI
Note: If the HDMI is not used, these pins should be connected to
a 1.0-V power supply.
VDDA_HD_1P0
AG21
S
-
1.0-V Analog Power Supply for VDAC HD DAC
Note: If the HD DAC is not used, this pin should be connected to
a 1.0-V power supply.
VDDA_SD_1P0
AG20
S
-
1.0-V Analog Power Supply for VDAC SD DAC
Note: If the SD DAC is not used, this pin should be connected to
a 1.0-V power supply.
VDDA_HDMI
(1)
102
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
Device Pins
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Table 3-33. Supply Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
OTHER
DESCRIPTION
VDDR_SATA
V25, U25
S
-
1.5-V Regulator Power Supply for SATA
Note: If the SATA is not used, for proper device operation, these
pins must be connected to a 1.5-V power supply.
VDDR_PCIE
Y25, W25
S
-
1.5-V Regulator Power Supply for PCIe
Note: If the PCIe is not used, for proper device operation, these
pins must be connected to a 1.5-V power supply.
DVDD_DDR[0]
L19, L18, L17,
L16, L15, L14,
K19, K18, K17,
K16, K15, K14,
J18, J17, J16,
J15, J14, E11,
A11, E1, A2
S
-
Power Supply for DDR[0] I/Os:
•
1.5-V for DDR3 memory type
•
1.8-V for DDR2 memory type
DVDD_DDR[1]
L24, L23, L22,
L21, L20, K24,
K23, K22, K21,
K20, J24, J23,
J22, J21, J20,
J19, E27, D37,
A36, A27
S
-
1.5-V Power Supply for DDR[1] I/Os:
•
1.5-V for DDR3 memory type
•
1.8-V for DDR2 memory type
DEVOSC_DVDD18
E19
S
-
1.8-V Power Supply for Device Oscillator
Note: If the oscillator is not used, this pin should be connected to
the 1.8-V power supply (DVDD1P8).
VDD_USB0_1P8
R25
S
-
1.8-V Power Supply for USB0
Note: If the USB is not used, for proper device operation, this pin
must be connected to a 1.8-V power supply, or when the USB
PHY is not used, this pin can be optionally connected to CVDDC.
VDD_USB1_1P8
T25
S
-
1.8-V Power Supply for USB1
Note: If the USB is not used, for proper device operation, this pin
must be connected to a 1.8-V power supply, or when the USB
PHY is not used, this pin can be optionally connected to CVDDC.
AJ20, AJ24
S
-
1.8-V Power Supply
VDDA_REF_1P8
AT22
S
-
1.8-V Reference Power Supply for VDAC
Note: If the VDAC is not used, these pins should be connected
to a 1.8-V power supply.
VDDA_HD_1P8
AJ22, AH22
S
-
1.8-V Analog Power Supply for VDAC HD DAC
Note: If the HD DAC is not used, these pins should be
connected to a 1.8-V power supply.
VDDA_SD_1P8
AJ21, AH21,
AH20
S
-
1.8-V Analog Power Supply for VDAC SD DAC
Note: If the SD DAC is not used, these pins should be connected
to a 1.8-V power supply.
DVDD1P8
Device Pins
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Table 3-33. Supply Terminal Functions (continued)
SIGNAL
TYPE (1)
OTHER
AU29, AU11,
AU2,
AN37, AN27,
AN11,
AN1, AJ17,
AJ16,
AJ15, AJ14,
AH17,
AH16, AH15,
AH14,
AG33, AG17,
AG16,
AG15, AG14,
AE29,
AE28, AE27,
AD29,
AD28, AD27,
AD11,
AD10, AD9,
AC29,
AC28, AC27,
AC11,
AC10, AC9,
AB11,
AB10, AB9,
AA11,
AA10, AA9,
AA1,
Y9, U11, U10,
U9, T11, T10,
T9, R28, R27,
R11, R10, R9,
P30, P29, P28,
P27, P11, P10,
P9, P8, L35,
L30, L5, L1
S
-
3.3-V Power Supply
VDD_USB0_3P3
T29, R29
S
-
3.3-V Power Supply for USB0
VDD_USB1_3P3
T30, R30
S
-
3.3-V Power Supply for USB1
NAME
DVDD_3P3
104
NO.
DESCRIPTION
Device Pins
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3.2.24 Ground Pins (VSS)
Table 3-34. Ground Terminal Functions
SIGNAL
NAME
VSS
(1)
NO.
AU28, AU23, AU12,
AU1, AT23, AR25,
AR24, AR23, AR15,
AP37, AP15, AN15,
AN14, AM31, AM25,
AM24, AM23, AM19,
AM18, AM17, AM16,
AM15, AM7, AM1,
AL32, AL31, AL24,
AL23, AL19, AL18,
AL17, AL16, AL15,
AL7, AL6, AK27, AK24,
AK23, AK19, AK18,
AK17, AK16, AK15,
AK11, AJ25, AJ18,
AG30, AG26, AG12,
AG8, AG5, AF27,
AF11, AE20, AE19,
AE18, AE17, AD34,
AD33, AD32, AD31,
AD30, AD7, AD6, AD5,
AC34, AC33, AC32,
AC31, AC30, AC8,
AC7, AC6, AC4, AC3,
AB37, AB35, AB8, AB7,
AB6, AB1, AA24, AA23,
AA22, AA21, AA20,
AA19, AA18, AA17,
AA16, AA15, AA14,
AA13, AA8, AA7, AA6,
AA5, Y37, Y36, Y32,
Y31, Y24, Y23, Y22,
Y21, Y20, Y19, Y18,
Y17, Y16, Y15, Y14,
Y13, Y8, Y7, Y6, Y5,
Y4, W24, W23, W22,
W21, W20, W19, W18,
W17, W16
TYPE (1)
OTHER
GND
-
DESCRIPTION
Ground (GND)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal.
Device Pins
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Table 3-34. Ground Terminal Functions (continued)
SIGNAL
TYPE (1)
OTHER
VSS
W15, W14, W13, W9,
W8, W7, W6, V28, V27,
V24, V23, V22, V21,
V20, V19, V18, V17,
V16, V15, V14, V13,
V9, V8, V7, V6, V5, V4,
U24, U23, U22, U21,
U20, U18, U17, U16,
U15, U14, U13, U8, U7,
U6, U5, T35, T34, T33,
T8, T7, T6, R33, R32,
R31, R8, R7, R6, R4,
R3, P31, P7, P6, P5,
P4, N18, M27, M11,
L33, L26, L12, L8, K37,
K1, H27, H24, H23,
H22, H21, H20, H19,
H18, H17, H16, H15,
H14, H11, G32, G31,
G24, G23, G22, G21,
G20, G18, G17, G16,
G15, G14, G7, G6,
F31, F24, F23, F22,
F21, F17, F16, F15,
F14, F7, E37, E24,
E14, D1, C23, C21,
C17, C15, A37, A28,
A10, A1
GND
-
Ground (GND)
VSSA_PLL
U19, B20, A20
GND
-
Analog GND for PLLs
VSSA_HD
AK21, AK20, AL21
GND
-
Analog GND for VDAC HD DAC
VSSA_SD
AU19, AM20, AN20,
AL20
GND
-
Analog GND for VDAC SD DAC
VSSA_REF_1P8
AU22
GND
-
Reference GND for VDAC (1.8 V)
DEVOSC_VSS
B19
GND
-
Ground for Device Oscillator
NAME
106
NO.
DESCRIPTION
Device Pins
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4 Device Configurations
4.1
Control Module
The device control module includes status and control logic not addressed within the peripherals or the
remainder of the device infrastructure. This module is the primary point of control for the following areas of
the device:
• Functional I/O multiplexing
• Device status
• Static device configuration
• Open-core protocol (OCP) interface for standard and customer programmable e-Fuse bit shift
registers.
The control module primarily implements a bank of registers accessible (read/write) by the software along
with some read-only registers carrying status information. Most register bits are exported as control
signals for other logic blocks on the device. Certain control module registers have default values based
upon the device type as decoded from e-Fuse.
The read/write registers can be divided into the following classes:
• Static device configuration registers
• Status and configuration registers
• Boot registers
Table 4-1 shows the general register groupings and Table 4-2 through Table 4-4 provide register
summaries for each group.
Table 4-1. Control Module Register Map
ADDRESS OFFSET
REGISTER GROUP
0x0000 - 0x0020
OCP Configuration registers
0x0024 - 0x003C
Reserved
0x0040 – 0x00FC
Device Boot registers
0x0300 - 0x03FC
Reserved
0x0400 - 0x05FC
PLL Control registers
0x0600 - 0x07FC
Device Configuration registers
0x0800 - 0x0FFC
PAD Control registers
SEE
Table 4-2
Table 4-6
Table 4-3
Table 4-4
Section 4.4
Table 4-2. OCP Configuration Registers Summary
HEX ADDRESS
ACRONYM
0x4814 0000
CONTROL_REVISION
0x4814 0004 - 0x4814 000C
-
0x4814 0010
CONTROL_SYSCONFIG
0x4814 0014 - 0x4814 003C
-
REGISTER NAME
Control module Revision number
Reserved
Idle mode parameters
Reserved
Table 4-3. PLL Control Registers Summary
HEX ADDRESS
ACRONYM
0x4814 0400
MAINPLL_CTRL
Main PLL base frequency control
0x4814 0404
MAINPLL_PWD
Main PLL clock output powerdown
0x4814 0408
MAINPLL_FREQ1
0x4814 040C
MAINPLL_DIV1
0x4814 0410
MAINPLL_FREQ2
REGISTER NAME
Main Clock 1 fractional divider
Main Clock 1 post divider
Main Clock 2 fractional divider
Device Configurations
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Table 4-3. PLL Control Registers Summary (continued)
108
HEX ADDRESS
ACRONYM
0x4814 0414
MAINPLL_DIV2
0x4814 0418
MAINPLL_FREQ3
0x4814 041C
MAINPLL_DIV3
0x4814 0420
MAINPLL_FREQ4
0x4814 0424
MAINPLL_DIV4
0x4814 0428
MAINPLL_FREQ5
0x4814 042C
MAINPLL_DIV5
REGISTER NAME
Main Clock 2 post divider
Main Clock 3 fractional divider
Main Clock 3 post divider
Main Clock 4 fractional divider
Main Clock 4 post divider
Main Clock 5 fractional divider
Main Clock 5 post divider
0x4814 0430
-
0x4814 0434
MAINPLL_DIV6
Reserved
0x4814 0438
-
0x4814 043C
MAINPLL_DIV7
Main Clock 7 post divider
0x4814 0440
DDRPLL_CTRL
DDR PLL base frequency control
0x4814 0444
DDRPLL_PWD
DDR PLL clock output powerdown
0x4814 0448
-
Main Clock 6 post divider
Reserved
Reserved
0x4814 044C
DDR_PLL_DIV1
DDR Clock 1 post divider
0x4814 0450
DDRPLL_FREQ2
DDR Clock 2 fractional divider
0x4814 0454
DDR_PLL_DIV2
DDR Clock 2 post divider
0x4814 0458
DDRPLL_FREQ3
DDR Clock 3 fractional divider
0x4814 045C
DDR_PLL_DIV3
DDR Clock 3 post divider
0x4814 0460
DDRPLL_FREQ4
DDR Clock 4 fractional divider
0x4814 0464
DDR_PLL_DIV4
DDR Clock 4 post divider
0x4814 0468
DDRPLL_FREQ5
DDR Clock 5 fractional divider
0x4814 046C
DDR_PLL_DIV5
DDR Clock 5 post divider
0x4814 0470
VIDEOPLL_CTRL
Video PLL base frequency control
0x4814 0474
VIDEOPLL_PWD
Video PLL clock output powerdown
0x4814 0478
VIDEOPLL_FREQ1
0x4814 047C
VIDEOPLL_DIV1
0x4814 0480
VIDEOPLL_FREQ2
0x4814 0484
VIDEOPLL_DIV2
0x4814 0488
VIDEOPLL_FREQ3
0x4814 048C
VIDEOPLL_DIV3
Video Clock 1 fractional divider
Video Clock 1 post divider
Video Clock 2 fractional divider
Video Clock 2 post divider
Video Clock 3 fractional divider
Video Clock 3 post divider
0x4814 0490 - 0x4814 049C
-
0x4814 04A0
AUDIOPLL_CTRL
Reserved
Audio PLL base frequency control
0x4814 04A4
AUDIOPLL_PWD
Audio PLL clock output powerdown
0x4814 04A8
-
Reserved
0x4814 04AC
-
Reserved
0x4814 04B0
AUDIOPLL_FREQ2
0x4814 04B4
AUDIOPLL_DIV2
0x4814 04B8
AUDIOPLL_FREQ3
0x4814 04BC
AUDIOPLL_DIV3
0x4814 04C0
AUDIOPLL_FREQ4
0x4814 04C4
AUDIOPLL_DIV4
0x4814 04C8
AUDIOPLL_FREQ5
0x4814 04CC
AUDIOPLL_DIV5
0x4814 04D0 - 0x4814 05FC
-
Audio Clock 2 fractional divider
Audio Clock 2 post divider
Audio Clock 3 fractional divider
Audio Clock 3 post divider
Audio Clock 4 fractional divider
Audio Clock 4 post divider
Audio Clock 5 fractional divider
Audio Clock 5 post divider
Reserved
Device Configurations
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Table 4-4. Device Configuration Registers Summary
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4814 0600
DEVICE_ID
Device Identification
0x4814 0604
-
0x4814 0608
INIT_PRESSURE_0
L3 Initiator Pressure
0x4814 060C
INIT_PRESSURE_1
L3 Initiator Pressure
0x4814 0610
-
0x4814 0614
TPTC_CFG
Transfer Controller Configuration
DDR Interface Control
Reserved
Reserved
0x4814 0618
DDR_CTRL
0x4814 061C
-
0x4814 0620
USB_CTRL
0x4814 0624
USBPHY_CTRL0
0x4814 0628
-
0x4814 062C
USBPHY_CTRL1
0x4814 0630
MAC_ID0_LO
Ethernet MAC Address 0
0x4814 0634
MAC_ID0_HI
Ethernet MAC Address 0
0x4814 0638
MAC_ID1_LO
Ethernet MAC Address 1
0x4814 063C
MAC_ID1_HI
Ethernet MAC Address 1
0x4814 0640
PCIE_CFG
0x4814 0644
-
0x4814 0648
CLK_CTRL
0x4814 064C
AUDIO_CTRL
0x4814 0650
-
0x4814 0654
OCMEM_SLEEP
0x4814 0658 - 0x4814 065C
-
0x4814 0660
HD_DAC_CTRL
HD DAC Control
0x4814 0664
HD_DACA_CAL
HD DAC A Calibration
0x4814 0668
HD_DACB_CAL
HD DAC B Calibration
0x4814 066C
HD_DACC_CAL
HD DAC C Calibration
0x4814 0670
SD_DAC_CTRL
SD DAC Control
0x4814 0674
SD_DACA_CAL
SD DAC A Calibration
Reserved
USB Control
USB0 Phy Control
Reserved
USB1 Phy Control
PCIe Module Configuration
Reserved
Input Oscillator Control
Audio Control
Reserved
On-Chip Memory Sleep Mode Configuration
Reserved
0x4814 0678
SD_DACB_CAL
SD DAC B Calibration
0x4814 067C
SD_DACC_CAL
SD DAC C Calibration
0x4814 0680
SD_DACD_CAL
SD DAC D Calibration
0x4814 068C
BANDGAP_CTRL
DAC Band-gap Control
0x4814 0690
HW_EVT_SEL_GRP1
System Trace Hardware Event Select Group 1
0x4814 0694
HW_EVT_SEL_GRP2
System Trace Hardware Event Select Group 2
0x4814 0698
HW_EVT_SEL_GRP3
System Trace Hardware Event Select Group 3
System Trace Hardware Event Select Group 4
0x4814 069C
HW_EVT_SEL_GRP4
0x4814 06A0 - 0x4814 06F4
-
0x4814 06F8
HDMI_OBSCLK_CTRL
0x4814 06FC
SERDES_CTRL
Serdes Control
0x4814 0700
UCB_CLK_CTL
USB Clock Control
0x4814 0704
PLL_OBSCLK_CTRL
0x4814 0708
-
0x4814 070C
DDR_RCD
0x4814 0710 - 0x4814 07FC
-
Reserved
HDMI Observe Clock Control
PLL Observe Clock Control
Reserved
RCD Power Enable/Disable
Reserved
Device Configurations
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4.2
4.2.1
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Debugging Considerations
Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the device always be at a valid logic level and not
floating. This may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and
internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external
pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
• Boot and Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external
pullup/pulldown resistor is strongly recommended, even if the IPU/IPD matches the desired
value/state.
• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
For the boot and configuration pins (listed in Table 3-1, Boot Terminal Functions), if they are both routed
out and 3-stated (not driven), it is strongly recommended that an external pullup/pulldown resistor be
implemented. Although, internal pullup/pulldown resistors exist on these pins and they may match the
desired configuration value, providing external connectivity can help ensure that valid logic levels are
latched on these device boot and configuration pins. In addition, applying external pullup/pulldown
resistors on the boot and configuration pins adds convenience to the user in debugging and flexibility in
switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown resistors.
• Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of
the limiting device; which, by definition, have margin to the VIL and VIH levels.
• Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
• For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
• Remember to include tolerances when selecting the resistor value.
• For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the boot and configuration
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For most systems, a 20-kΩ resistor can also be used as an external PU/PD on the pins that have
IPUs/IPDs disabled and require an external PU/PD resistor while still meeting the above criteria. Users
should confirm this resistor value is correct for their specific application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH), see
Section 6.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Temperature.
110
Device Configurations
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For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal
functions tables in Section 3.2.
4.3
Boot Sequence
The boot sequence is a process by which the device's memory is loaded with program and data sections,
and by which some of the device's internal registers are programmed with predetermined values. The boot
sequence is started automatically after each device-level global reset. For more details on device-level
global resets, see Section 7.2. There are several methods by which the memory and register initialization
can take place. Each of these methods is referred to as a boot mode. The boot mode to be used is
selected at reset. The device is booted through multiple means—primary bootloaders within internal ROM
or EMIF4, and secondary user bootloaders from peripherals or external memories. The maximum size of
the boot image is 255KB (ROM uses 1KB internally). Boot modes, pin configurations, and register
configurations required for booting the device, are described in the following subsections.
The following boot modes are supported:
• NOR Flash boot (muxed and non-muxed, 8-bit or 16-bit)
• NAND Flash boot (SLC and MLC with BCH ECC, 8-bit or 16-bit)
• SPI boot (EEPROM or Flash, SPI mode 3, 24-bit)
• SD boot (SD cards)
• EMAC boot (TFTP client)
• UART boot (X-modem client)
• PCIe boot (client mode, PCIe 32 and PCIe 64).
The state of the device after boot is determined by sampling the input states of the BTMODE[4:0] pins
when device reset (POR or RESET) is deasserted. The sampled values are latched into the
CONTROL_STATUS register, which is part of the system configuration (SYSCFG) module.
The BTMODE [4:0] values determine the boot mode order according to Table 4-5. The first boot mode
listed for each BTMODE[4:0] configuration is executed as the primary boot mode. If the primary boot
mode fails, the second, third, and fourth boot modes are executed, in that order, until a successful boot is
completed.
Additional boot configuration pins determine the following system boot settings as shown in Table 3-1:
• GPMC CS0 Default Bus Width
• GPMC Wait Enable
• GPMC Address/Data Multiplexing.
The GPMC CS0 default operation is determined by the CS0BW, CS0WAIT, and CS0MUX[1:0] inputs.
For more detailed information on booting the device, see the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
Device Configurations
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Table 4-5. Boot Mode Order
BTMODE[4] = 1
MEMORY BOOTING PREFERRED
FIRST
XIP (1)
XIPWAIT
(1)
BTMODE[4] = 0
PERIPHERAL BOOTING PREFERRED
BTMODE[3:0]
SECOND
THIRD
FOURTH
FIRST
SECOND
THIRD
FOURTH
UART
EMAC
SD
RESERVED
RESERVED
RESERVED
RESERVED
0000
XIPWAIT
(1)
UART
EMAC
SD
UART
SD
SPI
0001
NAND
NANDI2C
SPI
UART
UART
SPI
NAND
NANDI2C
0010
NAND
NANDI2C
SD
UART
UART
SPI
XIP (1)
SD
0011
NAND
NANDI2C
SPI
EMAC
EMAC
SPI
NAND
NANDI2C
0100
NANDI2C
SD
EMAC
UART
RESERVED
RESERVED
RESERVED
RESERVED
0101
SPI
SD
UART
EMAC
RESERVED
RESERVED
RESERVED
RESERVED
0110
SD
SPI
UART
EMAC
EMAC
SD
SPI
XIP (1)
0111
SPI
SD
PCIE_32
RESERVED
PCIE_32
RESERVED
RESERVED
RESERVED
1000
SPI
SD
PCIE_64
RESERVED
PCIE_64
RESERVED
RESERVED
RESERVED
1001
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
1010
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
1011
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
1100
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
1101
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
1110
GP Fast
External Boot
EMAC
UART
PCIE_32
GP Fast
External Boot
UART
EMAC
PCIE_64
1111
(1)
GPMC CS0 eXecute In Place (XIP) and eXecute In Place with Wait Monitoring (XIPWAIT) boot for NOR/OneNAND/ROM. For details,
see the AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
4.3.1
Boot Mode Registers
For details on the boot mode registers, see the AM389x Sitara ARM Processors Technical Reference
Manual (literature number SPRUGX7).
Table 4-6. Device Boot Registers Summary
4.4
HEX ADDRESS
ACRONYM
0x4814 0040
CONTROL_STATUS
0x4814 0044
BOOTSTAT
0x4814 0048 - 0x4814 007C
-
REGISTER NAME
Device Status
Device Boot Status
Reserved
Pin Multiplexing Control
Device-level pin multiplexing is controlled on a pin-by-pin basis by the MUXMODE bits of the PINCTRL1 PINCTRL321 registers in the SYSCFG module. The default state for each multiplexed pin is MUXMODE =
0x000.
Pin multiplexing selects which of several peripheral pin functions control the pin's IO buffer output data
values.
The input from each pin is routed to all of the peripherals that share the pin, regardless of the MUXMODE
setting. For details, see the table below and the MUXED column in the each of the Terminal Functions
tables in Section 3.2.
112
Device Configurations
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
PINCTRLx Register Descriptions
Table 4-7. PINCTRLx Register Definition
Bit
31:5
4
3
2:0
Field
Value
Description
Reserved
Reserved; Read returns 0
PULLTYPESEL
Pad Pullup/Pulldown Type Selection
0
Pulldown selected
1
Pullup selected
PULLDIS
Pad Pullup/Pulldown Disable
MUXMODE
0
Pullup/Pulldown enabled
1
Pullup/Pulldown disabled
Pad Functional Signal Mux Select
Table 4-8. PINCTRLx Registers
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
0x4814 0800
PINCTRL1
0
0
0x4814 0804
PINCTRL2
0
0
0x4814 0808
PINCTRL3
0
0
0x4814 080C
PINCTRL4
0
0
0x4814 0810
PINCTRL5
0
0
0x4814 0814
PINCTRL6
0
0
VOUT[1]_C[3]
VIN[1]A_D[9]
0x4814 0818
PINCTRL7
0
0
VOUT[1]_C[4]
VIN[1]A_D[10]
0x4814 081C
PINCTRL8
0
0
VOUT[1]_C[5]
VIN[1]A_D[11]
0x4814 0820
PINCTRL9
0
0
VOUT[1]_C[6]
VIN[1]A_D[12]
0x4814 0824
PINCTRL10
0
0
VOUT[1]_C[7]
VIN[1]A_D[13]
0x4814 0828
PINCTRL11
0
0
VIN[1]A_D[14]
0x4814 082C
PINCTRL12
0
0
VIN[0]A_D[20]
VIN[0]B_DE
0x4814 0830
PINCTRL13
0
0
VIN[0]A_D[21]
VIN[0]B_FLD
0x4814 0834
PINCTRL14
0
0
VIN[0]A_D[22]
VIN[0]B_VSYNC
0x4814 0838
PINCTRL15
0
0
VIN[0]A_D[23]
VIN[0]B_HSYNC
0x4814 083C
PINCTRL16
0
0
VOUT[1]_Y_YC[6]
VIN[1]A_D[4]
0x4814 0840
PINCTRL17
0
0
VOUT[1]_Y_YC[7]
VIN[1]A_D[5]
0x4814 0844
PINCTRL18
0
0
VOUT[1]_Y_YC[8]
VIN[1]A_D[6]
0x4814 0848
PINCTRL19
0
0
VOUT[1]_Y_YC[9]
VIN[1]A_D[7]
0x4814 084C
PINCTRL20
0
0
VOUT[1]_C[2]
VIN[1]A_D[8]
011
VOUT[1]_HSYNC
(silicon revision 1.x)
0x4814 0850
PINCTRL21
0
0
VIN[1]A_D[15]
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)
0x4814 0854
PINCTRL22
0
0
VIN[0]A_D[16]
VIN[1]A_HSYNC
VOUT[1]_FLD
VOUT[1]_VSYNC
(silicon revision 1.x)
0x4814 0858
PINCTRL23
0
0
VIN[0]A_D[17]
VIN[1]A_VSYNC
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
0x4814 085C
PINCTRL24
0
0
VIN[0]A_D[18]
VIN[1]A_FLD
0x4814 0860
PINCTRL25
0
0
VIN[0]A_D[19]
VIN[1]A_DE
VOUT[1]_C[8]
VOUT[1]_C[9]
0x4814 0864
PINCTRL26
0
0
VOUT[0]_R_CR[0]
VOUT[1]_C[8]
VOUT[1]_CLK
0x4814 0868
PINCTRL27
0
0
VOUT[0]_B_CB_C[0]
VOUT[1]_C[9]
VIN[1]B_HSYNC_DE
VOUT[1]_HSYNC
(silicon revision 1.x)
0x4814 086C
PINCTRL28
0
0
VOUT[0]_B_CB_C[1]
VOUT[1]_AVID
DAC_VOUT[1]_HSYNC
(silicon revision 2.x)
VOUT[1]_VSYNC
(silicon revision 1.x)
0x4814 0870
PINCTRL29
0
0
VOUT[0]_G_Y_YC[0]
VIN[1]B_VSYNC
DAC_VOUT[1]_VSYNC
(silicon revision 2.x)
0x4814 0874
PINCTRL30
0
0
VOUT[0]_G_Y_YC[1]
VOUT[1]_FLD
VIN[1]B_FLD
Device Configurations
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Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
VIN[1]B_CLK
0x4814 0878
PINCTRL31
0
0
VOUT[1]_AVID
0x4814 087C
PINCTRL32
0
0
VIN[0]A_HSYNC
0x4814 0880
PINCTRL33
0
0
VIN[0]A_VSYNC
0x4814 0884
PINCTRL34
0
0
VIN[0]A_FLD
0x4814 0888
PINCTRL35
0
0
VIN[0]A_DE
0x4814 088C
PINCTRL36
0
0
VOUT[0]_HSYNC
0x4814 0890
PINCTRL37
0
0
VOUT[0]_VSYNC
011
VOUT[0]_FLD
(silicon revision 1.x)
0x4814 0894
PINCTRL38
0
0
DAC_VSYNC_VOUT[0]_
FLD
(silicon revision 2.x)
VOUT[0]_AVID
(silicon revision 1.x)
0x4814 0898
PINCTRL39
0
0
DAC_HSYNC_VOUT[0]_
AVID
(silicon revision 2.x)
0x4814 089C
PINCTRL40
0
0
VOUT[0]_R_CR[1]
0x4814 08A0
PINCTRL41
0
1
0x4814 08A4
PINCTRL42
0
1
0x4814 08A8
PINCTRL43
0
1
0x4814 08AC
PINCTRL44
0
1
0x4814 08B0
PINCTRL45
0
1
0x4814 08B4
PINCTRL46
0
1
VOUT[1]_CLK
VIN[1]A_CLK
0x4814 08B8
PINCTRL47
0
1
VOUT[1]_Y_YC[2]
VIN[1]A_D[0]
0x4814 08BC
PINCTRL48
0
1
VOUT[1]_Y_YC[3]
VIN[1]A_D[1]
0x4814 08C0
PINCTRL49
0
1
VOUT[1]_Y_YC[4]
VIN[1]A_D[2]
0x4814 08C4
PINCTRL50
0
1
VOUT[1]_Y_YC[5]
VIN[1]A_D[3]
0x4814 08C8
PINCTRL51
0
0
EMAC[1]_RXCLK
0x4814 08CC
PINCTRL52
0
0
EMAC[1]_RXD[0]
0x4814 08D0
PINCTRL53
0
0
EMAC[1]_RXD[1]
0x4814 08D4
PINCTRL54
0
0
EMAC[1]_RXD[2]
0x4814 08D8
PINCTRL55
0
0
EMAC[1]_RXD[3]
0x4814 08DC
PINCTRL56
0
0
EMAC[1]_RXD[4]
0x4814 08E0
PINCTRL57
0
0
EMAC[1]_RXD[5]
0x4814 08E4
PINCTRL58
0
0
EMAC[1]_RXD[6]
0x4814 08E8
PINCTRL59
0
0
EMAC[1]_RXD[7]
0x4814 08EC
PINCTRL60
0
0
EMAC[1]_RXDV
0x4814 08F0
PINCTRL61
0
1
EMAC[1]_GMTCLK
0x4814 08F4
PINCTRL62
0
1
EMAC[1]_TXD[0]
0x4814 08F8
PINCTRL63
0
1
EMAC[1]_TXD[1]
0x4814 08FC
PINCTRL64
0
1
EMAC[1]_TXD[2]
0x4814 0900
PINCTRL65
0
1
EMAC[1]_TXD[3]
0x4814 0904
PINCTRL66
0
1
EMAC[1]_TXD[4]
0x4814 0908
PINCTRL67
0
1
EMAC[1]_TXD[5]
0x4814 090C
PINCTRL68
0
1
EMAC[1]_TXD[6]
0x4814 0910
PINCTRL69
0
1
EMAC[1]_TXD[7]
0x4814 0914
PINCTRL70
0
1
EMAC[1]_TXEN
0x4814 0918
PINCTRL71
0
1
EMAC[1]_TXCLK
0x4814 091C
PINCTRL72
0
1
EMAC[1]_COL
0x4814 0920
PINCTRL73
0
0
EMAC[1]_CRS
0x4814 0924
PINCTRL74
0
1
EMAC[1]_RXER
0x4814 0928
PINCTRL75
0
0
0x4814 092C
PINCTRL76
0
0
0x4814 0930
PINCTRL77
0
0
0x4814 0934
PINCTRL78
0
0
0x4814 0938
PINCTRL79
0
0
114
Device Configurations
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
www.ti.com
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
0x4814 093C
PINCTRL80
0
1
0x4814 0940
PINCTRL81
0
1
0x4814 0944
PINCTRL82
0
1
0x4814 0948
PINCTRL83
0
0
VIN[0]A_CLK
0x4814 094C
PINCTRL84
0
0
VIN[0]B_CLK
0x4814 0950
PINCTRL85
0
0
VIN[0]A_D[0]
0x4814 0954
PINCTRL86
0
0
VIN[0]A_D[1]
0x4814 0958
PINCTRL87
0
0
VIN[0]A_D[2]
0x4814 095C
PINCTRL88
0
0
VIN[0]A_D[3]
0x4814 0960
PINCTRL89
0
0
VIN[0]A_D[4]
0x4814 0964
PINCTRL90
0
0
VIN[0]A_D[5]
0x4814 0968
PINCTRL91
0
0
VIN[0]A_D[6]
0x4814 096C
PINCTRL92
0
0
VIN[0]A_D[7]
0x4814 0970
PINCTRL93
0
0
VIN[0]A_D[8]
0x4814 0974
PINCTRL94
0
0
VIN[0]A_D[9]
0x4814 0978
PINCTRL95
0
0
VIN[0]A_D[10]
0x4814 097C
PINCTRL96
0
0
VIN[0]A_D[11]
0x4814 0980
PINCTRL97
0
0
VIN[0]A_D[12]
0x4814 0984
PINCTRL98
0
0
VIN[0]A_D[13]
0x4814 0988
PINCTRL99
0
0
VIN[0]A_D[14]
0x4814 098C
PINCTRL100
0
0
VIN[0]A_D[15]
0x4814 0990
PINCTRL101
0
1
VOUT[0]_CLK
0x4814 0994
PINCTRL102
0
1
VOUT[0]_G_Y_YC[2]
001
010
0x4814 0998
PINCTRL103
0
1
VOUT[0]_G_Y_YC[3]
0x4814 099C
PINCTRL104
0
1
VOUT[0]_G_Y_YC[4]
0x4814 09A0
PINCTRL105
0
1
VOUT[0]_G_Y_YC[5]
0x4814 09A4
PINCTRL106
0
1
VOUT[0]_G_Y_YC[6]
0x4814 09A8
PINCTRL107
0
1
VOUT[0]_G_Y_YC[7]
0x4814 09AC
PINCTRL108
0
1
VOUT[0]_G_Y_YC[8]
0x4814 09B0
PINCTRL109
0
1
VOUT[0]_G_Y_YC[9]
0x4814 09B4
PINCTRL110
0
1
VOUT[0]_B_CB_C[2]
0x4814 09B8
PINCTRL111
0
1
VOUT[0]_B_CB_C[3]
0x4814 09BC
PINCTRL112
0
1
VOUT[0]_B_CB_C[4]
0x4814 09C0
PINCTRL113
0
1
VOUT[0]_B_CB_C[5]
0x4814 09C4
PINCTRL114
0
1
VOUT[0]_B_CB_C[6]
0x4814 09C8
PINCTRL115
0
1
VOUT[0]_B_CB_C[7]
0x4814 09CC
PINCTRL116
0
1
VOUT[0]_B_CB_C[8]
0x4814 09D0
PINCTRL117
0
1
VOUT[0]_B_CB_C[9]
0x4814 09D4
PINCTRL118
0
1
VOUT[0]_R_CR[2]
VOUT[0]_HSYNC
VOUT[1]_Y_YC[2]
0x4814 09D8
PINCTRL119
0
1
VOUT[0]_R_CR[3]
VOUT[0]_VSYNC
VOUT[1]_Y_YC[3]
0x4814 09DC
PINCTRL120
0
1
VOUT[0]_R_CR[4]
VOUT[0]_FLD
VOUT[1]_Y_YC[4]
0x4814 09E0
PINCTRL121
0
1
VOUT[0]_R_CR[5]
VOUT[0]_AVID
VOUT[1]_Y_YC[5]
0x4814 09E4
PINCTRL122
0
1
VOUT[0]_R_CR[6]
VOUT[0]_G_Y_YC[0]
VOUT[1]_Y_YC[6]
0x4814 09E8
PINCTRL123
0
1
VOUT[0]_R_CR[7]
VOUT[0]_G_Y_YC[1]
VOUT[1]_Y_YC[7]
0x4814 09EC
PINCTRL124
0
1
VOUT[0]_R_CR[8]
VOUT[0]_B_CB_C[0]
VOUT[1]_Y_YC[8]
0x4814 09F0
PINCTRL125
0
1
VOUT[0]_R_CR[9]
VOUT[0]_B_CB_C[1]
VOUT[1]_Y_YC[9]
0x4814 09F4
PINCTRL126
0
0
MCA[0]_ACLKR
MCA[0]_AHCLKR
0x4814 09F8
PINCTRL127
0
0
0x4814 09FC
PINCTRL128
0
0
MCA[0]_AFSR
0x4814 0A00
PINCTRL129
0
0
MCA[0]_ACLKX
0x4814 0A04
PINCTRL130
0
0
MCA[0]_ACLKHX
0x4814 0A08
PINCTRL131
0
0
MCA[0]_AFSX
0x4814 0A0C
PINCTRL132
0
0
MCA[0]_AMUTE
0x4814 0A10
PINCTRL133
0
0
MCA[0]_AXR[0]
0x4814 0A14
PINCTRL134
0
0
MCA[0]_AXR[1]
011
Device Configurations
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
115
AM3894
AM3892
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
www.ti.com
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
0x4814 0A18
PINCTRL135
0
0
MCA[0]_AXR[2]
MCB_FSX
0x4814 0A1C
PINCTRL136
0
0
MCA[0]_AXR[3]
MCB_FSR
0x4814 0A20
PINCTRL137
0
0
MCA[0]_AXR[4]
MCB_DX
0x4814 0A24
PINCTRL138
0
0
MCA[0]_AXR[5]
MCB_DR
0x4814 0A28
PINCTRL139
0
0
MCA[1]_ACLKR
0x4814 0A2C
PINCTRL140
0
0
MCA[1]_AHCLKR
0x4814 0A30
PINCTRL141
0
0
MCA[1]_AFSR
0x4814 0A34
PINCTRL142
0
0
MCA[1]_ACLKX
MCA[1]_ACLKHX
0x4814 0A38
PINCTRL143
0
0
0x4814 0A3C
PINCTRL144
0
0
MCA[1]_AFSX
0x4814 0A40
PINCTRL145
0
0
MCA[1]_AMUTE
0x4814 0A44
PINCTRL146
0
0
MCA[1]_AXR[0]
0x4814 0A48
PINCTRL147
0
0
MCA[1]_AXR[1]
0x4814 0A4C
PINCTRL148
0
0
MCA[2]_ACLKR
MCB_CLKR
0x4814 0A50
PINCTRL149
0
0
MCA[2]_AHCLKR
MCB_CLKS
0x4814 0A54
PINCTRL150
0
0
MCA[2]_AFSR
MCB_CLKX
0x4814 0A58
PINCTRL151
0
0
MCA[2]_ACLKX
MCB_CLKX
0x4814 0A5C
PINCTRL152
0
0
MCA[2]_ACLKHX
MCB_CLKR
0x4814 0A60
PINCTRL153
0
0
MCA[2]_AFSX
MCB_CLKS
0x4814 0A64
PINCTRL154
0
0
MCA[2]_AMUTE
010
011
MCB_DR
MCB_FSR
MCB_FSX
0x4814 0A68
PINCTRL155
0
0
MCA[2]_AXR[0]
0x4814 0A6C
PINCTRL156
0
0
MCA[2]_AXR[1]
MCB_DX
0x4814 0A70
PINCTRL157
0
1
SD_POW
GPMC_A[14]
GP1[0]
0x4814 0A74
PINCTRL158
0
1
SD_CLK
GPMC_A[13]
GP1[1]
0x4814 0A78
PINCTRL159
0
1
SD_CMD
GPMC_A[21]
GP1[2]
0x4814 0A7C
PINCTRL160
0
0
SD_DAT[0]
GPMC_A[20]
GP1[3]
0x4814 0A80
PINCTRL161
0
0
SD_DAT[1]_SDIRQ
GPMC_A[19]
GP1[4]
0x4814 0A84
PINCTRL162
0
0
SD_DAT[2]_SDRW
GPMC_A[18]
GP1[5]
0x4814 0A88
PINCTRL163
0
0
SD_DAT[3]
GPMC_A[17]
GP1[6]
0x4814 0A8C
PINCTRL164
0
0
SD_SDCD
GPMC_A[16]
GP1[7]
0x4814 0A90
PINCTRL165
0
0
SD_SDWP
GPMC_A[15]
GP1[8]
0x4814 0A94
PINCTRL166
0
0
SPI_SCLK
0x4814 0A98
PINCTRL167
1
0
SPI_SCS[0]
0x4814 0A9C
PINCTRL168
1
0
SPI_SCS[1]
GPMC_A[23]
0x4814 0AA0
PINCTRL169
1
0
SPI_SCS[2]
GPMC_A[22]
0x4814 0AA4
PINCTRL170
1
0
SPI_SCS[3]
GPMC_A[21]
0x4814 0AA8
PINCTRL171
0
0
SPI_D[0]
0x4814 0AAC
PINCTRL172
0
0
SPI_D[1]
0x4814 0AB0
PINCTRL173
0
0
UART0_RXD
0x4814 0AB4
PINCTRL174
0
1
UART0_TXD
0x4814 0AB8
PINCTRL175
1
1
UART0_RTS
0x4814 0ABC
PINCTRL176
1
0
UART0_CTS
GP1[28]
0x4814 0AC0
PINCTRL177
1
1
UART0_DTR
GPMC_A[20]
GPMC_A[12]
GP1[16]
0x4814 0AC4
PINCTRL178
1
0
UART0_DSR
GPMC_A[19]
GPMC_A[24]
GP1[17]
0x4814 0AC8
PINCTRL179
1
0
UART0_DCD
GPMC_A[18]
GPMC_A[23]
GP1[18]
0x4814 0ACC
PINCTRL180
1
0
UART0_RIN
GPMC_A[17]
GPMC_A[22]
GP1[19]
0x4814 0AD0
PINCTRL181
0
0
UART1_RXD
GPMC_A[26]
GPMC_A[20]
0x4814 0AD4
PINCTRL182
0
1
UART1_TXD
GPMC_A[25]
GPMC_A[19]
0x4814 0AD8
PINCTRL183
1
1
UART1_RTS
GPMC_A[14]
GPMC_A[18]
GP1[25]
0x4814 0ADC
PINCTRL184
1
0
UART1_CTS
GPMC_A[13]
GPMC_A[17]
GP1[26]
0x4814 0AE0
PINCTRL185
0
0
UART2_RXD
0x4814 0AE4
PINCTRL186
0
0
UART2_TXD
0x4814 0AE8
PINCTRL187
1
1
UART2_RTS
GPMC_A[15]
GPMC_A[26]
GP1[23]
0x4814 0AEC
PINCTRL188
1
0
UART2_CTS
GPMC_A[16]
GPMC_A[25]
GP1[24]
0x4814 0AF0
PINCTRL189
0
0
GPMC_A[27]
GP1[9]
116
GP1[22]
GP1[27]
Device Configurations
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
AM3894
AM3892
www.ti.com
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
0x4814 0AF4
PINCTRL190
0
1
GPMC_A[22]
GP1[10]
0x4814 0AF8
PINCTRL191
0
1
GPMC_A[26]
GP1[11]
0x4814 0AFC
PINCTRL192
0
0
GPMC_A[25]
GP1[12]
0x4814 0B00
PINCTRL193
0
1
GP1[13]
0x4814 0B04
PINCTRL194
0
1
GPMC_A[23]
GP1[14]
0x4814 0B08
PINCTRL195
0
1
GPMC_A[24]
GP1[15]
0x4814 0B0C
PINCTRL196
0
0
GPMC_A[16]
GP0[21]
0x4814 0B10
PINCTRL197
0
1
GPMC_A[15]
GP0[22]
0x4814 0B14
PINCTRL198
0
1
GPMC_A[14]
GP0[23]
0x4814 0B18
PINCTRL199
0
0
GPMC_A[13]
GP0[24]
0x4814 0B1C
PINCTRL200
0
1
GP0[25]
0x4814 0B20
PINCTRL201
0
1
GPMC_A[21]
GP0[26]
0x4814 0B24
PINCTRL202
0
1
GPMC_A[12]
GP0[27]
0x4814 0B28
PINCTRL203
0
0
TIM4_OUT
0x4814 0B2C
PINCTRL204
0
0
TIM5_OUT
GP0[29]
0x4814 0B30
PINCTRL205
0
0
TIM6_OUT
GPMC_A[24]
GP0[30]
0x4814 0B34
PINCTRL206
0
0
TIM7_OUT
GPMC_A[12]
GP0[31]
0x4814 0B38
PINCTRL207
1
0
GPMC_CS[0]
0x4814 0B3C
PINCTRL208
1
0
GPMC_CS[1]
0x4814 0B40
PINCTRL209
1
0
GPMC_CS[2]
0x4814 0B44
PINCTRL210
1
0
GPMC_CS[3]
0x4814 0B48
PINCTRL211
1
0
GPMC_CS[4]
GP1[21]
0x4814 0B4C
PINCTRL212
1
0
GPMC_CS[5]
GPMC_A[12]
0x4814 0B50
PINCTRL213
1
0
GPMC_WE
0x4814 0B54
PINCTRL214
1
1
GPMC_OE_RE
GPMC_BE0_CLE
GP0[28]
0x4814 0B58
PINCTRL215
0
1
0x4814 0B5C
PINCTRL216
0
1
GPMC_BE1
0x4814 0B60
PINCTRL217
0
1
GPMC_ADV_ALE
0x4814 0B64
PINCTRL218
0
1
GPMC_DIR
0x4814 0B68
PINCTRL219
0
0
GPMC_WP
0x4814 0B6C
PINCTRL220
0
0
GPMC_WAIT
0x4814 0B70
PINCTRL221
0
1
GPMC_A[0]
0x4814 0B74
PINCTRL222
0
1
GPMC_A[1]
GP0[9]
0x4814 0B78
PINCTRL223
0
1
GPMC_A[2]
GP0[10]
0x4814 0B7C
PINCTRL224
0
1
GPMC_A[3]
GP0[11]
0x4814 0B80
PINCTRL225
0
1
GPMC_A[4]
GP0[12]
0x4814 0B84
PINCTRL226
0
1
GPMC_A[5]
GP0[13]
0x4814 0B88
PINCTRL227
0
1
GPMC_A[6]
GP0[14]
0x4814 0B8C
PINCTRL228
0
1
GPMC_A[7]
GP0[15]
0x4814 0B90
PINCTRL229
0
1
GPMC_A[8]
GP0[16]
0x4814 0B94
PINCTRL230
0
1
GPMC_A[9]
GP0[17]
0x4814 0B98
PINCTRL231
0
1
GPMC_A[10]
GP0[18]
0x4814 0B9C
PINCTRL232
0
1
GPMC_A[11]
GP0[19]
0x4814 0BA0
PINCTRL233
0
1
GPMC_A[27]
GP0[20]
0x4814 0BA4
PINCTRL234
0
0
GPMC_D[0]
0x4814 0BA8
PINCTRL235
0
0
GPMC_D[1]
0x4814 0BAC
PINCTRL236
0
0
GPMC_D[2]
0x4814 0BB0
PINCTRL237
0
0
GPMC_D[3]
0x4814 0BB4
PINCTRL238
0
0
GPMC_D[4]
0x4814 0BB8
PINCTRL239
0
0
GPMC_D[5]
0x4814 0BBC
PINCTRL240
0
0
GPMC_D[6]
0x4814 0BC0
PINCTRL241
0
0
GPMC_D[7]
0x4814 0BC4
PINCTRL242
0
0
GPMC_D[8]
0x4814 0BC8
PINCTRL243
0
0
GPMC_D[9]
0x4814 0BCC
PINCTRL244
0
0
GPMC_D[10]
011
GP1[20]
GP0[8]
Device Configurations
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Link(s): AM3894 AM3892
117
AM3894
AM3892
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
www.ti.com
Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
0x4814 0BD0
PINCTRL245
0
0
GPMC_D[11]
0x4814 0BD4
PINCTRL246
0
0
GPMC_D[12]
0x4814 0BD8
PINCTRL247
0
0
GPMC_D[13]
0x4814 0BDC
PINCTRL248
0
0
GPMC_D[14]
0x4814 0BE0
PINCTRL249
0
0
GPMC_D[15]
0x4814 0BE4
PINCTRL250
0
1
GPMC_CLK
0x4814 0BE8
PINCTRL251
0
0
EMAC[0]_COL
0x4814 0BEC
PINCTRL252
0
0
EMAC[0]_CRS
0x4814 0BF0
PINCTRL253
0
1
EMAC[0]_GMTCLK
0x4814 0BF4
PINCTRL254
1
0
EMAC[0]_RXCLK
0x4814 0BF8
PINCTRL255
1
0
EMAC[0]_RXD[0]
0x4814 0BFC
PINCTRL256
1
0
EMAC[0]_RXD[1]
0x4814 0C00
PINCTRL257
1
0
EMAC[0]_RXD[2]
0x4814 0C04
PINCTRL258
1
0
EMAC[0]_RXD[3]
0x4814 0C08
PINCTRL259
1
0
EMAC[0]_RXD[4]
0x4814 0C0C
PINCTRL260
1
0
EMAC[0]_RXD[5]
0x4814 0C10
PINCTRL261
1
0
EMAC[0]_RXD[6]
0x4814 0C14
PINCTRL262
1
0
EMAC[0]_RXD[7]
0x4814 0C18
PINCTRL263
1
0
EMAC[0]_RXDV
0x4814 0C1C
PINCTRL264
1
0
EMAC[0]_RXER
0x4814 0C20
PINCTRL265
0
1
EMAC[0]_TXCLK
0x4814 0C24
PINCTRL266
0
1
EMAC[0]_TXD[0]
0x4814 0C28
PINCTRL267
0
1
EMAC[0]_TXD[1]
0x4814 0C2C
PINCTRL268
0
1
EMAC[0]_TXD[2]
0x4814 0C30
PINCTRL269
0
1
EMAC[0]_TXD[3]
0x4814 0C34
PINCTRL270
0
1
EMAC[0]_TXD[4]
0x4814 0C38
PINCTRL271
0
1
EMAC[0]_TXD[5]
0x4814 0C3C
PINCTRL272
0
1
EMAC[0]_TXD[6]
0x4814 0C40
PINCTRL273
0
1
EMAC[0]_TXD[7]
0x4814 0C44
PINCTRL274
0
1
EMAC[0]_TXEN
0x4814 0C48
PINCTRL275
1
0
MDIO_MCLK
0x4814 0C4C
PINCTRL276
1
0
MDIO_MDIO
0x4814 0C50
PINCTRL277
1
0
0x4814 0C54
PINCTRL278
1
0
0x4814 0C58
PINCTRL279
0
1
0x4814 0C5C
PINCTRL280
0
1
0x4814 0C60
PINCTRL281
0
1
0x4814 0C64
PINCTRL282
0
1
0x4814 0C68
PINCTRL283
0
0
0x4814 0C6C
PINCTRL284
0
0
0x4814 0C70
PINCTRL285
0
0
0x4814 0C74
PINCTRL286
0
0
0x4814 0C78
PINCTRL287
1
1
I2C[0]_SCL
0x4814 0C7C
PINCTRL288
1
1
I2C[0]_SDA
0x4814 0C80
PINCTRL289
1
1
I2C[1]_SCL
0x4814 0C84
PINCTRL290
1
1
I2C[1]_SDA
001
010
GP1[29]
0x4814 0C88
PINCTRL291
0
0
GP0[0]
0x4814 0C8C
PINCTRL292
0
0
GP0[1]
0x4814 0C90
PINCTRL293
0
0
GP0[2]
0x4814 0C94
PINCTRL294
0
0
GP0[3]
0x4814 0C98
PINCTRL295
0
0
GP0[4]
0x4814 0C9C
PINCTRL296
0
0
GP0[5]
MCA[2]_AMUTEIN
GPMC_A[24]
0x4814 0CA0
PINCTRL297
0
0
GP0[6]
MCA[1]_AMUTEIN
GPMC_A[23]
0x4814 0CA4
PINCTRL298
0
0
GP0[7]
MCA[0]_AMUTEIN
118
011
TCLKIN
Device Configurations
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Table 4-8. PINCTRLx Registers (continued)
MUXMODE[2:0]
HEX ADDRESS
REGISTER NAME
PULLTYPESEL
PULLDIS
000
001
010
011
SATA_ACT0_LED
(silicon revision 1.x)
0x4814 0CA8
PINCTRL299
0
0
GP1[30]
SATA_ACT1_LED
(silicon revision 2.x)
SATA_ACT1_LED
(silicon revision 1.x)
0x4814 0CAC
PINCTRL300
0
0
GP1[31]
SATA_ACT0_LED
(silicon revision 2.x)
0x4814 0CB0
PINCTRL301
0
1
HDMI_SCL
0x4814 0CB4
PINCTRL302
0
1
HDMI_SDA
0x4814 0CB8
PINCTRL303
1
0
HDMI_CEC
0x4814 0CBC
PINCTRL304
0
0
HDMI_HPDET
0x4814 0CC0
PINCTRL305
1
0
TCLK
0x4814 0CC4
PINCTRL306
0
1
RTCK
0x4814 0CC8
PINCTRL307
1
0
TDI
0x4814 0CCC
PINCTRL308
0
1
TDO
0x4814 0CD0
PINCTRL309
1
0
TMS
0x4814 0CD4
PINCTRL310
0
0
TRST
0x4814 0CD8
PINCTRL311
1
0
EMU0
0x4814 0CDC
PINCTRL312
1
0
EMU1
0x4814 0CE0
PINCTRL313
1
0
EMU2
0x4814 0CE4
PINCTRL314
1
0
EMU3
0x4814 0CE8
PINCTRL315
1
0
EMU4
0x4814 0CEC
PINCTRL316
1
0
RESET
0x4814 0CF0
PINCTRL317
1
0
NMI
0x4814 0CF4
PINCTRL318
1
0
RSTOUT
0x4814 0CF8
PINCTRL319
1
0
WD_OUT
0x4814 0CFC
PINCTRL320
0
1
CLKOUT
0x4814 0D00
PINCTRL321
0
0
CLKIN32
0x4814 0D04
PINCTRL322
0
0
USB0_DRVVBUS
0x4814 0D08
PINCTRL323
0
0
USB1_DRVVBUS
0x4814 0D0C 0x4814 0FFF
Reserved
4.5
How to Handle Unused Pins
When device signal pins are unused in the system, they can be left unconnected unless otherwise
instructed in the Terminal Functions tables. For unused input pins, the internal pull resistor should be
enabled, or an external pull resistor should be used, to prevent floating inputs. All supply pins must always
be connected to the correct voltage, even when their associated signal pins are unused, as instructed in
the Terminal Functions tables in Section 3.2.
Device Configurations
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5 System Interconnect
The L3 interconnect allows the sharing of resources, such as peripherals and external or on-chip
memories, between all the initiators of the platform. The L4 interconnects control access to the
peripherals.
Transfers between initiators and targets across the platform are physically conditioned by the chip
interconnect.
5.1
L3 Interconnect
The L3 topology is driven by performance requirements, bus types, and clocking structure. Figure 5-1
shows the interconnect of the device and the main modules and subsystems in the platform. Arrows
indicate the master/slave relationship, not data flow. Master/slave connectivity is shown in Table 5-1.
Initiator Ports
Debug
DAP
Target Ports
L4 Periph
High Speed
USB 2.0
0/1
L4 Periph
Standard
SATA
Debug
USB 2.0
EMAC0
HDMI 1.3
Tx
EMAC1
PCIe
Gen2
McBSP
Media
Ctrl
McASP0
(A)
HDVPSS
EDMA
4 Channels
L3 Interconnect
SGX530
McASP1
McASP2
GPMC
OCMC
RAM0
OCMC
RAM1
PCIe
Gen2
Media
Ctrl
SGX530
(A)
EDMA
Config
Cortex™A8
A.
DMM
DDR
SGX530 is available only on the AM3894 device.
Figure 5-1. Interconnect Overview
120
System Interconnect
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Table 5-1. L3 Master/Slave Connectivity (1) (2)
USB2.0 CFG
X
OCMC RAM0 / RAM1
L4 HS PERIPH PORT 0
X
EDMA TPCC
HDMI 1.3 TX AUDIO
X
EDMA TPTC0 - 3 CFG
McBSP
X
L4 STD PERIPH PORT 1
McASPs
X
L4 STD PERIPH PORT 0
PCIe GEN2 SLAVE
X
L4 HS PERIPH PORT 1
SGX530
X
X
X
X
X
X
ARM Cortex-A8 M2
(64-bit)
HDVPSS Mstr0
GPMC
ARM Cortex-A8 M1
(128-bit)
DMM ELLA
DMM TILER1
MASTERS
DMM TILER0
SLAVES
X
X
X
X
HDVPSS Mstr1
X
SGX530 BIF
X
X
SATA
X
X
EMAC0 Rx/Tx
X
X
EMAC1 Rx/Tx
X
X
USB2.0 DMA
X
USB2.0 Queue Mgr
X
PCIe Gen2
X
EDMA TPTC0
EDMA TPTC1
(1)
(2)
X
X
X
EDMA TPTC2
EDMA TPTC3
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X = Connection exists.
SGX530 is available only on the AM3894 device.
System Interconnect
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5.2
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L4 Interconnect
The L4 interconnect is a non-blocking peripheral interconnect that provides low-latency access to a large
number of low-bandwidth, physically-dispersed target cores. The L4 can handle incoming traffic from up to
four initiators and can distribute those communication requests to and collect related responses from up to
63 targets.
The device provides three interfaces with L3 interconnect for high-speed peripheral and standard
peripheral. Figure 5-2 and Table 5-2 show the L4 bus architecture and memory-mapped peripherals.
L3 Interconnect
L4 High Speed
EMAC0
EMAC1
SATA
250-MHz CLK domain
125-MHz CLK domain
A.
L4 Standard
I2C0
I2C1
SPI
UART0
UART1
Timer1
Timer2
Timer3
Timer4
Timer5
Timer6
Timer7
GPIO0
GPIO1
SD/SDIO
WDT
RTC
SmartReflex0
SmartReflex1
DDR_CFG0
DDR_CFG1
Spinlock
PRCM
Control
ELM
HDMIphy
OCPWP
McASP0
McASP1
McASP2
Mailbox
SGX530 is available only on the AM3894 device.
Figure 5-2. L4 Architecture
122
System Interconnect
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Table 5-2. L4 Peripheral Connectivity (1)
MASTERS
L4 PERIPHERALS
Cortex-A8 M2
(64-bit)
EDMA TPTC0
EDMA TPTC1
EDMA TPTC2
EDMA TPTC3
EMAC0
Port0
Port1
Port0
Port1
Port0
EMAC1
Port0
Port1
Port0
Port1
Port0
SATA
Port0
Port1
Port0
Port1
Port0
I2C0
Port0
Port1
Port0
Port1
Port0
I2C1
Port0
Port1
Port0
Port1
Port0
SPI
Port0
Port1
Port0
Port1
Port0
UART0
Port0
Port1
Port0
Port1
Port0
UART1
Port0
Port1
Port0
Port1
Port0
Timer1
Port0
Port1
Port0
Port1
Port0
Timer2
Port0
Port1
Port0
Port1
Port0
Timer3
Port0
Port1
Port0
Port1
Port0
Timer4
Port0
Port1
Port0
Port1
Port0
Timer5
Port0
Port1
Port0
Port1
Port0
Timer6
Port0
Port1
Port0
Port1
Port0
Timer7
Port0
Port1
Port0
Port1
Port0
GPIO0
Port0
Port1
Port0
Port1
Port0
GPIO1
Port0
Port1
Port0
Port1
Port0
SD/SDIO
Port0
Port1
Port0
Port1
Port0
WDT
Port0
Port1
Port0
Port1
Port0
RTC
Port0
Port1
Port0
Port1
Port0
SmartReflex0
Port0
SmartReflex1
Port0
DDR_CFG0
Port0
DDR_CFG1
Port0
Spinlock
Port0
PRCM
Port0
Control/Top Regs
Port0
ELM
Port0
HDMIphy
Port0
OCPWP
Port0
McASP0
Port0
Port1
Port0
Port1
Port0
McASP1
Port0
Port1
Port0
Port1
Port0
McASP2
Port0
Port1
Port0
Port1
Port0
Mailbox
Port0
Port1
Port0
Port1
Port0
L4 High-Speed Peripherals Port 0/1
L4 Standard-Speed Peripherals Port 0/1
(1)
X, Port0, Port1 = Connection exists.
System Interconnect
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6 Device Operating Conditions
6.1
Absolute Maximum Ratings (Unless Otherwise Noted) (1) (2)
Steady State Supply voltage
ranges:
MIN
MAX
UNIT
USB PHYs, 0.9 V (VDD_USB_0P9)
-0.3
1.35
V
Core (CVDD, CVDDC, VDDT_SATA,
VDDT_PCIE, VDDA_HDMI,
VDDA_HD_1P0, VDDA_SD_1P0)
-0.3
1.2
V
I/O, 1.5 V (VDDA_PLL, VDDR_SATA,
VDDR_PCIE, DVDD_DDR0,
DVDD_DDR1) (3)
-0.3
2.45
V
I/O, 1.8 V (DVDD1P8,
DEVOSC_DVDD18, VDD_USB0_1P8,
VDD_USB1_1P8, VDDA_REF_1P8,
VDDA_HD_1P8, VDDA_SD_1P8,
DVDD_DDR0, DVDD_DDR1) (3)
-0.3
2.45
V
0
3.8
V
V I/O, 1.5-V pins
-0.3
2.45
-0.3 DVDD_DDRx + 0.3 (3)
V
V I/O, 1.8-V pins
-0.3
2.45
-0.3
DVDD1P8 + 0.3
-0.3 DVDD_DDRx + 0.3 (3)
V
V I/O, 3.3-V pins
(Steady State)
-0.3
-0.3
V
I/O, 3.3 V (DVDD_3P3,
VDD_USB0_3P3, VDD_USB1_3P3)
Input and Output voltage ranges:
V I/O, 3.3-V pins
(Transient Overshoot/Undershoot)
3.8
DVDD_3P3 + 0.3
20% of DVDD_3P3 for up to 20% of the
signal period
V
Operating junction temperature
range, TJ: (4)
(default)
0
95
extended temperature
-40
105
Storage temperature range, Tstg:
(default)
-55
ESD stress voltage, VESD: (5)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
124
HBM (Human Body Model) (6)
CDM (Charged-Device Model) (7)
°C
150
°C
±1000
V
±250
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
For supply voltage pins, DVDD_DDRx:
• 1.5 V is used for DDR3 SDRAM.
• 1.8 V is used for DDR2 SDRAM.
A heat dissipation solution is required for proper device operation. Thermal performance of the overall system must be carefully
considered to ensure conformance with the recommended operating conditions. Heat generated by this device must be removed with
the help of heat sinks, heat spreaders, and/or airflow. SmartReflex can significantly lower the power consumption of this device and its
use is required for proper device operation. A thermal model can be provided for thermal simulation to estimate the system thermal
environment. Contact your local TI representative for availability.
Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500 V HBM allows
safe manufacturing with a standard ESD control process, and manufacturing with less than 500 V HBM is possible if necessary
precautions are taken. Pins listed as 1000 V may actually have higher performance.
Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe
manufacturing with a standard ESD control process. Pins listed as 250 V may actually have higher performance.
Device Operating Conditions
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6.2
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Recommended Operating Conditions
MIN
NOM
MAX
UNIT
1.05
V
CVDD
Supply voltage, Variable Core, Adaptive Voltage
Scaling (CVDD) (1)
CVDDC
Supply voltage, Constant Core (CVDDC,
VDDT_SATA, VDDT_PCIE, VDDA_HDMI,
VDDA_HD_1P0, VDDA_SD_1P0)
0.95
1
1.05
V
Supply voltage, I/O, 3.3 V (DVDD_3P3,
VDD_USB0_3P3, VDD_USB1_3P3)
(except I2C pins)
3.13
3.3
3.47
V
Supply voltage, I/O, I2C (DVDD_3P3)
3.13
3.3
3.47
V
Supply voltage, I/O, 1.8 V (DVDD1P8,
DEVOSC_DVDD18, VDD_USB0_1P8,
VDD_USB1_1P8, VDDA_REF_1P8,
VDDA_HD_1P8, VDDA_SD_1P8, DVDD_DDR0,
DVDD_DDR1) (2)
1.71
1.8
1.89
V
Supply voltage, I/O, 1.5 V (VDDA_PLL,
VDDR_SATA, VDDR_PCIE, DVDD_DDR0,
DVDD_DDR1) (2)
1.43
1.5
1.58
V
Supply voltage, I/O, 0.9 V (VDD_USB_0P9)
0.85
0.9
0.95
V
0
0
0
V
0.48DVDD_DDRx
0.5DVDD_DDRx
0.52DVDD_DDRx
V
DVDD
VSS
Supply ground (VSS, VSSA_PLL, VSSA_HD,
VSSA_SD, VSSA_REF_1P8, DEVOSC_VSS) (3)
DDR_VREF
DDR2/3 reference voltage (4)
High-level input voltage, 3.3 V (except I2C pins)
VIH
0.8
2
High-level input voltage, I2C
0.7DVDD_3P3
High-level input voltage, 1.8 V
0.65DVDD1P8
Low-level input voltage, 3.3 V (except I2C pins)
VIL
0.8
Low-level input voltage, I2C
0.3DVDD_3P3
Low-level input voltage, 1.8 V
High-level output current
IOH
Low-level output current
IOL
-6
DDR[0], DDR[1]
buffers @ 50-Ω
impedance setting
-8
6-mA I/O buffers
6
DDR[0], DDR[1]
buffers @ 50-Ω
impedance setting
8
Differential input voltage (SERDES_CLKN/P),
[AC coupled]
tt
Transition time, 10%-90%, All Inputs (unless
otherwise specified in the electrical data sections)
(2)
(3)
(4)
(5)
V
0.35DVDD1P8
6-mA I/O buffers
VID
(1)
V
0.25
mA
mA
2.0
V
Lesser of 0.25P or
10 (5)
ns
This device supports, and requires the use of, SmartReflex technology with Adaptive Voltage Scaling based on die temperature and
performance. The SmartReflex codes output from the device correspond to up to 32 linear voltage steps within the specified voltage
range, with the option to use fewer steps if desired, with a minimum of eight steps. TI requires that users design a supply that can
handle multiple voltage steps within this range with ± 5% tolerances. Not incorporating a flexible supply may limit the system's ability to
use the power saving capabilities of the SmartReflex technology. TI recommends using a fault-tolerant power supply design to protect
against over-current conditions. For AVS Disable data to aid in design of robust power supplies that may withstand momentary AVS
control failure, see the device Power Estimation Spreadsheet (literature number SPRABK3).
For supply voltage pins, DVDD_DDRx:
• 1.5 V is used for DDR3 SDRAM.
• 1.8 V is used for DDR2 SDRAM.
Oscillator ground (DEVOSC_VSS) must be kept separate from other grounds and connected directly to the crystal load capacitor
ground.
DDR_VREF is expected to equal 0.5DVDD_DDRx of the transmitting device and to track variations in the DVDD_DDRx.
P = the period of the applied signal. Maintaining transition times as fast as possible is recommended to improve noise immunity on input
signals.
Device Operating Conditions
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Recommended Operating Conditions (continued)
MIN
Operating junction temperature range (6)
TJ
Extended operating junction temperature range
FSYSCLK
(6)
126
ARM Operating Frequency (SYSCLK2)
NOM
MAX
0
95
-40
105
20
1.35
UNIT
°C
GHz
A heat dissipation solution is required for proper device operation. Thermal performance of the overall system must be carefully
considered to ensure conformance with the recommended operating conditions. Heat generated by this device must be removed with
the help of heat sinks, heat spreaders, and/or airflow. SmartReflex can significantly lower the power consumption of this device and its
use is required for proper device operation. A thermal model can be provided for thermal simulation to estimate the system thermal
environment. Contact your local TI representative for availability.
Device Operating Conditions
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6.3
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Temperature (Unless Otherwise Noted)
PARAMETER
VOH
High speed: USB_DN and
USB_DP
360
440
DVDD_3P3 = MIN, IOH = MAX
V
V
High speed: USB_DN and
USB_DP
-10
10
mV
Low-level output voltage (3.3- DVDD_3P3 = MIN, IOL = MAX
V I/O except I2C pins)
0.4
V
Low-level output voltage
(3.3-V I/O I2C pins)
IO = 3 mA
0.4
V
VI = VSS to DVDD_3P3 without
opposing internal resistor
±1
µA
I/O Off-state output current
VI = VSS to DVDD_3P3 with
opposing internal pullup
resistor (3)
100
µA
VI = VSS to DVDD_3P3 with
opposing internal pulldown
resistor (3)
-100
µA
VI = VSS to DVDD_3P3
VO = DVDD_3P3 or VSS; internal
pull disabled
VO = DVDD_3P3 or VSS; internal
pull enabled
•
•
•
•
•
3.3-V I/O (DVDD_3P3,
USB_VDDA3P3) supply
current (5)
1.8-V I/O (DVDD1P8,
DVDD_DDRx) supply
current (5) (6)
1.5-V I/O (DVDD_DDRx)
supply current (5) (6)
(6)
mV
0.3
Variable Core (CVDD) supply
•
current (5)
•
(3)
(4)
(5)
2.4
V
0.0
ICDD
(1)
(2)
UNIT
Low/full speed: USB_DN and
USB_DP
Constant Core (CVDDC)
supply current (5)
IDDD
MAX
VDD_USBx_3P3
Input current [DC] (I2C)
IOZ (4)
TYP
2.8
Input current [DC]
(except I2C pins)
II (2)
MIN
Low/full speed: USB_DN and
USB_DP
High-level output voltage
(3.3-V I/O)
VOL
TEST CONDITIONS (1)
•
•
•
•
•
•
•
Case Temp = 60ºC
ARM at 1.2 GHz, 70%
utilization
HDMI display
SGX530 at 150 MHz, 15 fps
EMIF0/1 at 200 MHz, 1120
MBps
USB 1x, EMAC 1x
AVS Variable Core voltage =
0.8 V
Case Temp = 60ºC
ARM at 1.2 GHz, 70%
utilization
HDMI display
SGX530 at 150 MHz, 15 fps
EMIF0/1 at 200 MHz, 1120
MBps
USB 1x, EMAC 1x
AVS Variable Core voltage =
0.8 V
±20
µA
±5
µA
±100
µA
mA
1093
4099
mA
19
11
235
For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II
indicates the input leakage current and off-state (Hi-Z) output leakage current.
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
The actual current draw varies across manufacturing processes and is highly application-dependent. For use-case specific power
estimates, see the device Power Estimation Spreadsheet (literature number SPRABK3).
For supply voltage pins, DVDD_DDRx:
• 1.5 V is used for DDR3 SDRAM.
• 1.8 V is used for DDR2 SDRAM.
Device Operating Conditions
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature
(Unless Otherwise Noted) (continued)
PARAMETER
TEST CONDITIONS (1)
MIN
TYP
MAX
UNIT
CI
Input capacitance
2.8
pF
Co
Output capacitance
2.8
pF
128
Device Operating Conditions
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7 Power, Reset, Clocking, and Interrupts
7.1
Power Supplies
7.1.1
Voltage and Power Domains
The device has the following voltage domains:
• 1-V adaptive voltage scaling (AVS) domain - Main voltage domain for all modules
• 1-V constant domain - Memories, PLLs, DACs, DDR IOs, HDMI, and USB PHYs
• 1.8-V constant domain - PLLs, DACs, HDMI, and USB PHYs
• 3.3-V constant domain - IOs and USB PHY
• 1.5-V constant domain - DDR IOs, PCIe, and SATA SERDES
• 0.9-V constant domain - USB PHY
These domains define groups of modules that share the same supply voltage for their core logic. Each
voltage domain is powered by dedicated supply voltage rails. For the mapping between voltage domains
and the supply pins associated with each, see Table 3-33.
Note: A regulated supply voltage must be supplied to each voltage domain at all times, regardless of the
power domain states.
7.1.2
Power Domains
The device's 1-V AVS and 1-V constant voltage domains have seven power domains that supply power to
both the core logic and SRAM within their associated modules. All other voltage domains have only
always-on power domain.
Within the 1-V AVS and 1-V constant voltage domains, each power domain, except for the always-on
domain, has an internal power switch that can completely remove power from that domain. At power-up,
all domains, except always-on, come-up as power gated. Since there is an always-on domain in each
voltage domain, all power supplies are expected to be ON all the time (as long as the device is in use).
For details on powering up/down the device power domains, see the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
Note: All modules within a power domain are unavailable when the domain is powered OFF. For
instructions on powering ON/OFF the domains, see the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
7.1.3
1-V AVS and 1-V Constant Power Domains
•
•
•
•
Graphics Domain
This domain contains the SGX530 (available only on the AM8394 device).
Active Domain
The active domain has all modules that are only needed when the system is in "active" state. In any of
the standby states, these modules are not needed. This domain contains the HDVPSS peripheral.
Default Domain
The default domain contains modules that might be required even in standby mode. Having them in a
separate power domain allows customers to power gate these modules when in standby mode. This
domain has the DDR, SATA, PCIe, Media Controller and USB peripherals.
Always-On Domain
The always-on domain contains all modules that are required even when the system goes to standby
mode. This includes the host ARM and modules that generate wake-up interrupts (e.g., UART, RTC,
GPIO, EMAC) as well as other low-power I/Os.
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SmartReflex™
The device contains SmartReflex modules that are required to minimize power consumption on the
voltage domains using external variable-voltage power supplies. Based on the device process,
temperature, and desired performance, the SmartReflex modules advise the host processor to raise or
lower the supply voltage to each domain for minimal power consumption. The communication link between
the host processor and the external regulators is a system-level decision and can be accomplished using
GPIOs or I2C.
The major technique employed by SmartReflex in the device is adaptive voltage scaling (AVS). Based on
the silicon process and temperature, the SmartReflex modules guide software in adjusting the core 1-V
supply voltage within the desired range. This technique is called adaptive voltage scaling (AVS). AVS
occurs continuously and in real time, helping to minimize power consumption in response to changing
operating conditions.
NOTE
Implementation of SmartReflex AVS is required for proper device operation.
7.1.5
Memory Power Management
The device memories offer three different modes to save power when memories are not being used;
Table 7-1 provides the details.
Table 7-1. Memory Power Management Modes
MODE
POWER SAVING
WAKE-UP LATENCY
MEMORY CONTENTS
Light Sleep (LS)
~60%
Low
Preserved
Deep Sleep (DS)
~75%
Medium
Preserved
Shut Down (SD)
~95%
High
Lost
The device provides a feature that allows the software to put the chip-level memories (OCMC RAMs) in
any of the three (LS, DS, and SD) modes. There are control registers in the control module to control the
power-down state of OCMC RAM0 and OCMC RAM1. There are also status registers that can be used
during power-up to check if memories are powered-up. For detailed instructions on entering and exiting
from light sleep and deep sleep modes, see the AM389x Sitara ARM Processors Technical Reference
Manual (literature number SPRUGX7).
Memories inside switchable domains go to the shut down (SD) state whenever the power domain goes to
the OFF state. Memories come back to functional state along with the domain power-up.
In order to reduce SRAM leakage, many SRAM blocks can be switched from active mode to shut-down
mode. When SRAM is put in shut-down mode, the voltage supplied to it is automatically removed and all
data in that SRAM is lost.
All SRAM located in a switchable power domain (all domains except always-on) automatically enters shutdown mode whenever its assigned associated power domain goes to the OFF state. The SRAM returns to
the active state when the corresponding power domain returns to the ON state.
For detailed instructions on powering up/down the various device SRAM, see the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
7.1.6
I/O Power-Down Modes
The DDR3 I/Os are put into power-down mode automatically when the default power domain is turned
OFF.
The HDMI PHY controller is in the always-on power domain, so software must configure the PHY into
power-down mode.
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There is no power-down mode for the other 3.3-V I/Os.
7.1.7
Supply Sequencing
The device power supplies must be sequenced in the following order:
1. 3.3 V
2. 1-V AVS
3. 1-V Constant
4. 1.8 V
5. 1.5 V
6. 0.9 V
Each supply (represented by VDDB in Figure 7-1) must begin actively ramping between 0 ms and 50 ms
after the previous supply (represented by VDDA in Figure 7-1) in the sequence has reached 80% of its
nominal value, as shown in Figure 7-1.
80%
VDDA
VDDB
td = 0-50 ms
Figure 7-1. Power Sequencing Requirements
NOTE
The device pins are not fail-safe. They should not be externally driven before their
corresponding supply rail has been powered up. The corresponding supply rail for each pin
can be found in Section 3.2, Terminal Functions.
7.1.8
Power-Supply Decoupling
Recommended capacitors for power supply decoupling are all 0.1 µF in the smallest body size that can be
used. Capacitors are more effective in the smallest physical size to limit lead inductance. For example,
0402 sized capacitors are better than 0603 sized capacitors, and so on.
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Table 7-2. Recommended Power-Supply Decoupling
Capacitors
SUPPLY
MINIMUM CAPACITOR NO.
2 (1)
VDDA_PLL
DVDD1P8
2
VDDT_SATA
2 (1)
VDDT_PCIE
3 (1)
CVDDC
20 (2)
DVDD_3p3
64 (2)
CVDD
28 (2)
(1)
(2)
PLL supplies benefit from filters or ferrite beads to keep the noise
from causing clock jitter. The minimum recommendation is a ferrite
bead with a resonance at 100 MHz along with at least one capacitor
on the device side of the bead. Additional recommendation is to add
one capacitor just before the bead to form a Pi filter. The filter needs
to be as close as possible to the device pin, with the device-side
capacitor being the most important component to be close to the
device pin. PLL pins close together can be combined on the same
supply. PLL pins farther away from each other may need their own
filtered supply.
It is recommended to have one bulk (15 µF or larger) capacitor for
every 10 smaller capacitors placed as closely as possible to the
device.
DDR-related supply capacitor numbers are provided in Section 8.3.
7.2
7.2.1
Reset
System-Level Reset Sources
The device has several types of system-level resets. Table 7-3 lists these reset types, along with the reset
initiator and the effects of each reset on the device.
Table 7-3. System-Level Reset Types
RESETS ALL
MODULES,
EXCLUDING
EMULATION
RESETS
EMULATION
LATCHES BOOT
PINS
ASSERTS
RSTOUT PIN
TYPE
INITIATOR
Power-On Reset (POR)
POR pin
Yes
Yes
Yes
Yes
External Warm Reset
RESET pin
Yes
No
Yes
Yes
Emulation Warm Reset
On-Chip Emulation
Logic
Yes
No
No
Yes
Watchdog Reset
Watchdog Timer
Yes
No
No
Yes
Software Global Cold Reset
Software
Yes
Yes
No
Yes
Software Global Warm
Reset
Software
Yes
No
No
Yes
Test Reset
TRST pin
No
Yes
No
No
7.2.2
Power-On Reset (POR pin)
Power-on reset (POR) is initiated by the POR pin and is used to reset the entire chip, including the test
and emulation logic. POR is also referred to as a cold reset since it is required to be asserted when the
devices goes through a power-up cycle. However, a device power-up cycle is not required to initiate a
power-on reset.
The following sequence must be followed during a power-on reset:
1. Wait for the power supplies to reach normal operating conditions while keeping the POR pin asserted.
2. Wait for the input clock sources SERDES_CLKN/P to be stable (if used by the system) while keeping
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the POR pin asserted (low).
3. Once the power supplies and the input clock source are stable, the POR pin must remain asserted
(low) for a minimum of 32 DEV_MXI cycles. Within the low period of the POR pin, the following
happens:
(a) All pins enter a Hi-Z mode.
(b) The PRCM asserts reset to all modules within the device.
(c) The PRCM begins propagating these clocks to the chip with the PLLs in bypass mode.
4. The POR pin may now be deasserted (driven high). When the POR pin is deasserted (high):
(a) The BOOT pins are latched.
(b) Reset to the ARM Cortex-A8 is de-asserted, provided the processor clock is running.
(c) All other domain resets are released, provided the domain clocks are running.
(d) The clock, reset, and power-down state of each peripheral is determined by the default settings of
the PRCM.
(e) The ARM Cortex-A8 begins executing from the default address (Boot ROM).
7.2.3
External Warm Reset (RESET pin)
An external warm reset is activated by driving the RESET pin active-low. This resets everything in the
device, except the ARM Cortex-A8 interrupt controller, test, and emulation. An emulator session stays
alive during warm reset.
The following sequence must be followed during a warm reset:
1. Power supplies and input clock sources should already be stable.
2. The RESET pin must be asserted (low) for a minimum of 32 DEV_MXI cycles. Within the low period of
the RESET pin, the following happens:
(a) All pins, except test and emulation pins, enter a Hi-Z mode.
(b) The PRCM asserts reset to all modules within the device, except for the ARM Cortex-A8 interrupt
controller, test, and emulation.
(c) RSTOUT is asserted.
3. The RESET pin may now be de-asserted (driven high). When the RESET pin is de-asserted (high):
(a) The BOOT pins are latched.
(b) Reset to the ARM Cortex-A8 and modules without a local processor is de-asserted, with the
exception of the ARM Cortex-A8 interrupt controller, test, and emulation.
(c) RSTOUT is de-asserted.
(d) The clock, reset, and power-down state of each peripheral is determined by the default settings of
the PRCM.
(e) The ARM Cortex-A8 begins executing from the default address (Boot ROM).
(f) Since the ARM Cortex-A8 interrupt controller is not impacted by warm reset, application software
needs to explicitly clear all pending interrupts in the ARM Cortex-A8 interrupt controller.
7.2.4
Emulation Warm Reset
An emulation warm reset is activated by the on-chip emulation module. It has the same effect and
requirements as an external warm reset (RESET), with the exception that it does not re-latch the BOOT
pins.
The emulator initiates an emulation warm reset via the ICEPick module. To invoke the emulation warm
reset via the ICEPick module, the user can perform the following from the Code Composer Studio™ IDE
menu:
Debug → Advanced Resets → System Reset.
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Watchdog Reset
A watchdog reset is initiated when the watchdog timer counter reaches zero. It has the same effect and
requirements as an external warm reset (RESET), with the exception that it does not re-latch the BOOT
pins. In addition, a watchdog reset always results in RSTOUT being asserted.
7.2.6
Software Global Cold Reset
A software global cold reset is initiated under software control. It has the same effect and requirements as
a power-on reset (POR), with the exception that it does not re-latch the BOOT pins.
Software initiates a software global cold reset by writing to RST_GLOBAL_COLD_SW in the
PRM_RST_CTRL register.
7.2.7
Software Global Warm Reset
A software global warm reset is initiated under software control. It has the same effect and requirements
as a external warm reset (RESET), with the exception that it does not re-latch the BOOT pins.
Software initiates a software global warm reset by writing to RST_GLOBAL_WARM_SW in the
PRM_RST_CTRL register.
7.2.8
Test Reset (TRST pin)
A test reset is activated by the emulator asserting the TRST pin. The only effect of a test reset is to reset
the emulation logic.
7.2.9
Local Reset
The local reset for various modules within the device is controlled by programming the PRCM and/or the
module's internal registers. Only the associated module is reset when a local reset is asserted, leaving the
rest of the device unaffected.
For details on local reset, see the PRCM chapter of the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7) and individual subsystem and peripheral user's guides.
7.2.10 Reset Priority
If any of the above reset sources occur simultaneously, the device only processes the highest-priority
reset request. The reset request priorities, from high to low, are as follows:
1. Power-on reset (POR)
2. Test reset (TRST)
3. External warm reset (RESET)
4. Emulation warm resets
5. Watchdog reset
6. Software global cold/warm resets.
7.2.11 Reset Status Register
The Reset Status Register (PRM_RSTST) contains information about the last reset that occurred in the
system. For more information on this register, see the PRCM chapter of the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
7.2.12 PCIe Reset Isolation
The device supports reset isolation for the PCI Express (PCIe) module. This means that the PCI Express
subsystem can be reset without resetting the rest of the device.
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When the device is a PCI Express Root Complex (RC), the PCIe subsystem can be reset by software
through the PRCM. Software should ensure that there are no ongoing PCIe transactions before asserting
this reset by first taking the PCIe subsystem into the IDLE state by programming the register
CM_DEFAULT_PCI_CLKCTRL inside the PRCM. After bringing the PCIe subsystem out of reset, bus
enumeration should be performed again and should treat all endpoints (EP) as if they had just been
connected.
When the device is a PCI Express Endpoint (EP), the PCIe subsystem generates an interrupt when an inband reset is received. Software should process this interrupt by putting the PCIe subsystem in the IDLE
state and then asserting the PCIe local reset through the PRCM.
All device-level resets mentioned in the previous sections, except Test Reset, also reset the PCIe
subsystem. Therefore, the device should issue a Hot Reset to all downstream devices and re-enumerate
the bus upon coming out of reset.
7.2.13 RSTOUT
The RSTOUT pin on the device reflects device reset status and is de-asserted (high) when the device is
out of reset. In addition, this output is always 3-stated and the internal pull resistor is disabled on this pin
while POR and/or RESET is asserted; therefore, an external pullup/pulldown can be used to set the state
of this pin (high/low) while POR and/or RESET is asserted. For more detailed information on external
pullups/pulldowns, see Section 4.2.1. This output is always asserted low when any of the following resets
occur:
• Power-on reset (POR)
• External warm reset
• Emulation warm reset (RESET)
• Software global cold/warm reset
• Watchdog timer reset.
The RSTOUT pin remains asserted until PRCM releases the host ARM Cortex-A8 processor for reset.
7.2.14 Effect of Reset on Emulation and Trace
The device emulation and trace is only reset by the following sources:
• Power-on reset (POR)
• Software global cold reset
• Test reset (TRST).
Other than these three, none of the other resets affect emulation and trace functionality.
7.2.15 Reset During Power Domain Switching
Each power domain has a dedicated warm reset and cold reset. Warm reset for a power domain is
asserted under either of the following two conditions:
1. A power-on reset, external warm reset, emulation warm reset, or software global cold/warm reset
occurs.
2. When that power domain switches from the ON state to the OFF state.
Cold reset for a power domain is asserted under either of the following two conditions:
1. A power-on reset or software global cold reset occurs.
2. When that power domain switches from the ON state to the OFF state.
7.2.16 Pin Behaviors at Reset
When any reset (other than test reset) described in Section 7.2.1 is asserted, all device pins are put into a
Hi-Z state except for:
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•
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Emulation pins. These pins are only put into a Hi-Z state when POR or global software cold reset is
asserted.
RSTOUT pin.
In addition, the PINCNTL registers, which control pin multiplexing, slew control, enabling the
pullup/pulldown, and enabling the receiver, are reset to their default state. For a description of the
RESET_ISO register, see the AM389x Sitara ARM Processors Technical Reference Manual (literature
number SPRUGX7).
Internal pullup/pulldown (IPU/IPD) resistors are enabled during and immediately after reset as described in
the OTHER column in the tables in Section 3.2, Terminal Functions.
7.2.17 Reset Electrical Data/Timing
NOTE
If a configuration pin must be routed out from the device, the internal pullup/pulldown
(IPU/IPD) resistor should not be relied upon; TI recommends the use of an external
pullup/pulldown resistor.
Table 7-4. Timing Requirements for Reset
(see Figure 7-2 and Figure 7-3)
NO.
MIN
MAX
UNIT
1
tw(RESET)
Pulse duration, POR low or RESET low
12C (1)
ns
2
tsu(CONFIG)
Setup time, boot and configuration pins valid before POR high or RESET
high (2)
12C (1)
ns
3
th(CONFIG)
Hold time, boot and configuration pins valid after POR high or RESET
high (2)
0
ns
(1)
C = 1/DEV_MXI clock frequency, in ns. The device clock source must be stable and at a valid frequency prior to meeting the tw(RESET)
requirement.
For the list of boot and configuration pins, see , Boot Terminal Functions.
(2)
Table 7-5. Switching Characteristics Over Recommended Operating Conditions During Reset
(see Figure 7-2)
NO.
4
5
(1)
136
PARAMETER
MIN
MAX
10C (1)
UNIT
tw(RSTL)
Pulse width, RESET low
td(RSTL_IORST)
Delay time, RESET falling to all IO entering their reset state
0
14
ns
ns
td(RSTL_IOFUNC)
Delay time, RESET rising to IO exiting their reset state
0
14
ns
C = 1/DEV_CLKIN clock frequency, in ns.
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Power
Supplies
Ramping
Power Supplies Stable
Clock Source Stable
DEV_CLKIN
1
POR
RESET
5
3
2
BTMODE[4:0]
Hi-Z
Config
5
(A)
Other I/O Pins
A.
RESET STATE
For more detailed information on the reset state of each pin, see Section 7.2.16, Pin Behaviors at Reset. For the
IPU/IPD settings during reset, see Section 3.2, Terminal Functions.
Figure 7-2. Power-Up Timing
Power Supplies Stable
DEV_CLKIN
POR
1
RESET
5
4
3
2
Hi-Z
BTMODE[4:0]
Config
5
4
(A)
Other I/O Pins
A.
RESET STATE
For more detailed information on the reset state of each pin, see Section 7.2.16, Pin Behaviors at Reset. For the
IPU/IPD settings during reset, see Section 3.2, Terminal Functions.
Figure 7-3. Warm Reset (RESET) Timing
7.3
Clocking
The device clocks are generated from several external reference clocks that are fed to on-chip PLLs and
dividers (both inside and outside of the PRCM Module). Figure 7-4 shows a high-level overview of the
device clocking structure. Note that to reduce complexity, all clocking connections are not shown. For
detailed information on the device clocks, see the Device Clocking and Flying Adder PLL section of the
AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
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PCIe SS
To USB
To ARM Cortex-A8
27-MHz
XTAL
OSC 27
DEVCLKIN
Main
PLL
Clocks
To L3, HDVPSS
To EMAC
To SGX530
(A)
432 MHz
Audio Clock1
Audio Clock2
Audio
PLL
Clocks
Audio Clock3
To RTC
32.768-kHz
Clock
Video
PLL
Clocks
HD, SD, TMDS Clocks
To DDR PHYs
To CEC, UART, etc.
To L3P, EMIF and DMM
DDR
PLL
Clocks
A.
DDR Clock4 (Spare)
DDR Clock5 (Spare)
SGX530 is available only on the AM3894 device.
Figure 7-4. System Clocking Overview
7.3.1
Device Clock Inputs
The device has four on-chip PLLs and one reference clock which are generated by on-chip oscillators. In
addition to the 27-MHz reference clock, a 100-MHz differential clock input is required for SATA and PCIe.
A third clock input is an optional 32.768-kHz clock input (no on-chip oscillator) for the RTC.
The device clock input (DEV_MXI/DEV_CLKIN) is used to generate the majority of the internal reference
clocks. An external square-wave clock can be supplied to DEV_CLKIN instead of using a crystal input.
The device clock should be 27 MHz.
Section 7.3.1.1 provides details on using the on-chip oscillators with external crystals for the 27-MHz
system oscillator.
7.3.1.1
Using the Internal Oscillators
When the internal oscillators are used to generate the device clock, external crystals are required to be
connected across the MXI and MXO pins, along with two load capacitors, as shown in Figure 7-5. The
external crystal load capacitors should also be connected to the associated oscillator ground pin
(DEVOSC_VSS). The capacitors should not be connected to board ground (VSS).
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DEV_MXI/
DEV_CLKIN
DEV_MXO
Crystal
27 MHz
C1
DEVOSC_VSS
DEVOSC_DVDD18
DEVOSC_VSS
Rd
(Optional)
C2
1.8 V
Figure 7-5. 27-MHz System Oscillator
The load capacitors, C1 and C2 in Figure 7-5, should be chosen such that the equation below is satisfied.
CL in the equation is the load specified by the crystal manufacturer. Rd is an optional damping resistor. All
discrete components used to implement the oscillator circuit should be placed as close as possible to the
associated oscillator MXI, MXO, and VSS pins.
C1C2
CL = (C + C )
1
2
Table 7-6. Input Requirements for Crystal Circuit on the Device Oscillator
PARAMETER
MIN
NOM
Start-up time (from power up until oscillating at stable frequency of 27 MHz)
MAX
Crystal Oscillation frequency
27
Parallel Load Capacitance (C1 and C2)
12
Crystal ESR
Crystal Shunt Capacitance
Crystal Oscillation Mode
UNIT
4
ms
MHz
24
pF
60
Ohm
5
pF
Fundamental Only
Crystal Frequency stability
±50
ppm
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Table 7-7. DEV_CLKIN Clock Source Requirements (1) (2) (3)
(see Figure 7-6)
NO.
MIN
NOM
MAX
UNIT
1
tc(DCK)
Cycle time, DEV_CLKIN
37.037
ns
2
tw(DCKH)
Pulse duration, DEV_CLKIN high
0.45C
0.55C
ns
3
tw(DCKL)
Pulse duration, DEV_CLKIN low
0.45C
0.55C
ns
4
tt(DCK)
Transition time, DEV_CLKIN
7
ns
5
tJ(DCK)
Period jitter, DEV_CLKIN (VDACs not used)
150
ps
Period jitter, DEV_CLKIN (VDACs used)
Sf
(1)
(2)
(3)
A
Frequency stability, DEV_CLKIN
s
±50
ppm
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
C = DEV_CLKIN cycle time in ns.
-S N R
10 20
Α = 10 *
*
2 * p * BW
BW
(s )
27 M H z
Where SNR is the desired signal-to-noise ratio and BW is the highest DAC signal bandwidth used in the system (SD = 6 MHz,
720p/1080i = 30 MHz, 1080p = 60 MHz).
1
5
1
4
2
DEV_CLKIN
3
4
Figure 7-6. DEV_CLKIN Timing
7.3.2
SERDES_CLKN/P Input Clock
A high-quality, low-jitter differential clock source is required for the PCIe and SATA PHYs. The clock is
required to be AC coupled to the device's SERDES_CLKP and SERDES_CLKN pins according to the
specifications in Table 7-11. Both the clock source and the coupling capacitors should be placed
physically as close as possible to the processor.
When the PCIe interface is used, the SERDES_CLKN/P clock is required to meet the REFCLK AC
specifications outlined in the PCI Express Card Electromechanical Specification (Gen.1 and Gen.2). When
the SATA interface is used, the SERDES_CLKN/P clock is required to meet the specifications in Table 78. When both the PCIe and SATA interfaces are used, both sets of specifications must be met
simultaneously.
Table 7-8. SERDES_CLKN/P Clock Source Requirements for SATA
PARAMETER
MIN
Clock Frequency
TYP
MAX
100
Jitter
MHz
50
Duty Cycle
40
Rise/Fall Time
60
700
UNIT
Ps pk-pk
%
ps
An HCSL differential clock source is required to meet the REFCLK AC specifications outlined in the PCI
Express Card Electromechanical Specification, Rev. 2.0, at the input to the AC coupling capacitors. In
addition, LVDS clock sources that are compliant to the above specification, but with the exceptions shown
in Table 7-9, are also acceptable.
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Table 7-9. Exceptions to REFCLK AC Specification for LVDS Clock Sources
SYMBOL
MIN
MAX
UNIT
VIH
Differential input high voltage (VIH)
PARAMETER
125
1000
mV
VIL
Differential input high voltage (VIL)
-1000
-125
mV
TYP
MAX
UNIT
0
Stubs
Table 7-10. SERDES_CLKN/P Routing Specifications
PARAMETER
MIN
Number of stubs allowed on SERDES_CLKN/P traces
24000 (1)
SERDES_CLKN/P trace length from oscillator to device
SERDES_CLKN/P pair differential impedance
100
Number of vias on each SERDES_CLKN/P trace (2)
Ohms
3
Vias
2*DS (3)
SERDES_CLKN/P differential pair to any other trace spacing
(1)
(2)
(3)
Mils
Keep trace length as short as possible.
Vias must be used in pairs with their distance minimized.
DS is the differential spacing of the SERDES_CLKN/P traces.
AC coupling capacitors are required on the SERDES_CLKN/P pair. Table 7-11 shows the requirements
for these capacitors.
Table 7-11. SERDES_CLKN/P AC Coupling Capacitors Requirements
PARAMETER
MIN
SERDES_CLKN/P AC coupling capacitor value
5
TYP
SERDES_CLKN/P AC coupling capacitor package size
(1)
(2)
MAX
UNIT
100
nF
0402
10
Mils (1) (2)
LxW, 10 mil units, i.e., a 0402 is a 40x20 mil surface mount capacitor.
The physical size of the capacitor should be as small as possible
7.3.3
CLKIN32 Input Clock
An external 32.768-kHz clock input can optionally be provided at the CLKIN32 pin to serve as a reference
clock in place of the RTCDIVIDER clock for the RTC and Timer modules. If the CLKIN32 pin is not
connected to a 32.768-kHz clock input, this pin should be pulled low. The CLKIN32 source must meet the
timing requirements shown in Table 7-12.
Table 7-12. Timing Requirements for CLKIN32 (1) (2)
(see Figure 7-7)
NO.
(1)
(2)
MIN
1
tc(CLKIN32)
Cycle time, CLKIN32
2
tw(CLKIN32H)
Pulse duration, CLKIN32 high
3
tw(CKIN32L)
Pulse duration, CLKIN32 low
4
tt(CLKIN32)
Transition time, CLKIN32
5
tJ(CLKIN32)
Period jitter, CLKIN32
NOM
MAX
UNIT
0.45C
0.55C
ns
0.45C
0.55C
ns
7
ns
0.02C
ns
1/32768
s
The reference points for the rise and fall transitions are measured at V IL MAX and V IH MIN.
C = CLKIN32 cycle time, in ns. For example, when CLKIN32 frequency is 32768 Hz, use C = 1/32768 s.
5
1
4
1
2
CLKIN32
3
4
Figure 7-7. CLKIN32 Timing
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PLLs
The device contains four embedded PLLs (Main, Audio, Video and DDR) that provide clocks to different
parts of the system. For a high-level view of the device clock architecture, including the PLL reference
clock sources and connections, see Figure 7-4.
The reference clock for most of the PLLs comes from the DEV_CLKIN input clock. Also, each PLL
supports a bypass mode in which the reference clock can be directly passed to the PLL CLKOUT. All
device PLLs (except the DDR PLL) come-up in bypass mode after reset.
Flying-adder PLLs are used for all the on-chip PLLs. Figure 7-8 shows the basic structure of the flyingadder PLL.
Flying-Adder
Synthesizer
FREQ
fs
/M
fo
K
fr
fp
/P
PFD
CP
VCO
fvco
/N
Figure 7-8. Flying-Adder PLL
The flying-adder PLL has two main components: a multi-phase PLL and the flying-adder synthesizer. The
multi-phase PLL takes an input reference clock (fr), multiplies it with factor, N, and provides a K-phase
output to the flying-adder synthesizer. The flying-adder synthesizer takes this multi-phase clock input and
produces a variable frequency clock (fs). There can be a post divider on this clock which takes in clock fs
and drives out clock fo. The frequency of the clock driven out is given by:
é
(Ν * Κ ) ù * fr
fo = ê
(
FREQ
* P * M )úû
ë
There can be multiple flying-adder synthesizers attached to one multi-phase PLL to generate different
frequencies. In this case, FREQ (4 bits of integer and 24 bits of fractional value) and M (1 to 255) values
can be adjusted for each clock separately, based on the frequency needed. A multi-phase PLL used in
this device has a value of K = 8.
For details on programming the device PLLs, see the PLL chapter of the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
7.3.4.1
PLL Programming Limits
When programming the PLLs, the result of the following equation must be greater than the value shown in
the corresponding PLL table (this determines if the chosen PLL frequency is a valid one).
æ Floor(M * FREQ) * P * 10 6
ç
ç
PLL_CLKIN * 8 * N
è
ö
÷÷
ø
A * M * FREQ
-Η
8
Where:
•
•
•
•
142
PLL_CLKIN is the input clock frequency (in MHz) to the PLL before the P divider
Floor( ) = round down
M = PLL divider
FREQ = PLL frequency setting
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•
•
•
•
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
A = 169 for all PLLs with the following exception: A = 218 for the audio PLL when its input is sourced
from the main PLL output
H = 10 if M * FREQ is a multiple of 8; otherwise, H = 0
800 MHz ≤ PLL_CLKIN * N / P ≤ 1600 MHz
10 MHz ≤ PLL_CLKIN / P ≤ 60 MHz
Table 7-13. PLL Clock Frequencies
CLOCK
MIN CYCLE
MAX FREQUENCY
Clock1
985
987
Clock2, ARM @ 720 MHz
1389
720
Clock2, ARM @ 1.0 GHz
1000
1000
Clock2, ARM @ 1.2 GHz
833
1200
Clock2, ARM @ 1.35 GHz
741
1350
Clock3
1847
532
Clock4
1991
494
Clock 2
18447
54
Clock 3
2443
405
Clock 1
1485
660
Clock 2
1485
660
Clock 3
1485
660
6290
158
Clock 3
5041
197
Clock 4
10000
100
Clock 5
10000
100
Main PLL
DDR PLL
Video PLL
Audio PLL
Clock 2
7.3.4.2
PLL Power Supply Filtering
The device PLLs are supplied externally via the VDDA_PLL power-supply pins. External filtering must be
added on the PLL supply pins to ensure that the requirements in Table 7-14 are met.
Table 7-14. Power Supply Requirements
PARAMETER
MIN
Dynamic noise at VDDA_PLL pins
7.3.4.3
MAX
50
UNIT
mV p-p
PLL Locking Sequence
All of the flying-adder PLLs (except the DDR PLL) come-up in bypass mode at reset. All of the registers
(P, N, FREQ, and M) need to be programmed appropriately and then wait approximately 8 µs for
PLL_Audio and 5 µs for the other PLLS to be locked. Verification that the PLL is locked can be checked
by accessing the lock status bit in the PLL control register for each PLL (bit = 1 when the PLL is locked).
Once the PLL is locked, then the FA-PLL can be taken out of bypass mode. Control for bypass mode is
through chip-level registers. For more details on the PLL registers and bypass logic, see the PLL chapter
of the AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
7.3.4.4
PLL Registers
The PLL control registers reside in the control module and are listed in Table 4-3.
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SYSCLKs
In some cases, the system clock inputs and PLL outputs are sent to the PRCM module for division and
multiplexing before being routed to the various device modules. These clock outputs from the PRCM
module are called SYSCLKs. Table 7-15 lists the main device SYSCLKs along with their maximum
supported clock frequencies. In addition, limits shown in the table may be further restricted by the clock
frequency limitations of the device modules using these clocks. For more details on module clock
frequency limits, see Section 7.3.6.
Table 7-15. SYSCLK Frequencies
SYSCLK
DEVICE SPEED
RANGE
SYSCLK2
Blank
1.0 GHz
120
1.2 GHz
135
1.35 GHz
To ARM Cortex-A8
SYSCLK4
~500 MHz
L3, OCP clock for HDVPSS, TPTCs, TPCC, DMM, Unicache
clock for Media Controller, EDMA
SYSCLK5
~250 MHz
L3, L4_HS, OCP clock for EMAC, SATA, PCIe, Media
Controller, OCMC RAM
SYSCLK6
~125 MHz
L3, L4_STD, UART, I2C, SPI, SD/SDIO, TIMER, GPIO,
PRCM, McASP, McBSP, GPMC, ELM, HDMI, WDT, Mailbox,
RTC, Spinlock, SmartReflex and USB
400 MHz
DMM, DDR OCP clock
SYSCLK8
SYSCLK23
Blank
333 MHz
120
300 MHz
135
337.5 MHz
SYSCLK24
144
MAXIMUM FREQUENCY DESTINATION
125 MHz
SGX530 OCP clock
GMII clock
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7.3.6
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Module Clocks
Device modules receive their clock directly from an external clock input, directly from a PLL, or from a
PRCM SYSCLK output. Table 7-16 lists the clock source options for each module, along with the
maximum frequency that module can accept. The device PLLs and dividers must be programmed not to
exceed the maximum frequencies listed in this table to ensure proper module functionality.
Table 7-16. Module Clock Frequencies
MODULE
CLOCK SOURCE(S)
DEVICE SPEED
RANGE
MAX. FREQUENCY (MHz)
Cortex-A8
PLL_MAIN, SYSCLK2
Blank
1000
120
1200
135
1350
DMM
PLL_DDR, SYSCLK4
500
DMM, DDR OCP clock
PLL_DDR, SYSCLK8
400
EDMA
SYSCLK4
500
ELM
SYSCLK6
125
EMAC
SYSCLK5
250
GPIO0/1
SYSCLK6
SYSCLK18
125
32.768
GPMC
SYSCLK6
125
HDMI
PLL_VIDEO, SYSCLK6
125
HDMI I2S
PLL_AUDIO
50
HDMI CEC
SYSCLK9
48
HDVPSS VPDMA
PLL_MAIN, SYSCLK4
500
HDVPSS
SYSCLK5
250
HDVPSS Interface
SYSCLK6
125
HDVPSS HD VENCD
PLL_VIDEO, SYSCLK13
165
HDVPSS HD VENCA
PLL_VIDEO, SYSCLK15
165
HDVPSS SD VENC
PLL_VIDEO, SYSCLK17
54
I2C0/1
SYSCLK6
SYSCLK10
125
48
L3
PLL_MAIN, SYSCLK4
500
L3
PLL_MAIN, SYSCLK5
250
L3
PLL_MAIN, SYSCLK6
125
L4 HS
PLL_MAIN, SYSCLK5
250
L4 STD
PLL_MAIN, SYSCLK6
125
Mailbox
SYSCLK6
125
McASP0/1/2
PLL_AUDIO, SYSCLK6
125
McBSP
PLL_AUDIO, SYSCLK6
125
Media Controller
SYSCLK4
500
OCMC RAM
SYSCLK5
250
PCIe
SYSCLK5
250
RTC
SYSCLK6
SYSCLK18
125
32.768
SATA
SYSCLK5
250
SD/SDIO
SYSCLK6
SYSCLK10
125
48
SGX530
SYSCLK23
SmartReflex
Blank
SYSCLK6
333
120
300
135
337.5
125
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Table 7-16. Module Clock Frequencies (continued)
DEVICE SPEED
RANGE
MODULE
CLOCK SOURCE(S)
SPI
SYSCLK6
SYSCLK10
125
48
Spinlock
SYSCLK6
125
Timers, WDT
SYSCLK6
SYSCLK18
125
32.768
UART0/1/2
SYSCLK6
SYSCLK10
125
48
USB0/1
SYSCLK6
125
7.3.7
MAX. FREQUENCY (MHz)
Output Clock Select Logic
Main PLL Clock5
0
DDR PLL Clock1
1
Video PLL Clock1
2
Audio PLL Clock1
3
CLKOUT_MUX
The device includes one selectable general-purpose clock output (CLKOUT). The source for these output
clocks is controlled by the CLKOUT_MUX register in the control module and shown in Figure 7-9.
/n
(n=1...8)
CLKOUT
Figure 7-9. CLKOUT Source Selection Logic
As shown in the figure, there are four possible sources for CLKOUT, one clock from each of the four
PLLs. The selected clock can be further divided by any ratio from 1 to 1/8 before going out on the
CLKOUT pin. The default selection is to select main PLL clock5, divider set to 1/1, and clock disabled.
Table 7-17. Switching Characteristics Over Recommended Operating Conditions for CLKOUT (1) (2)
(see Figure 7-10)
NO
.
PARAMETER
MIN
tc(CLKOUT)
2
tw(CLKOUTH) Pulse duration, CLKOUT high
0.45P
0.55P
ns
3
tw(CLKOUTL) Pulse duration, CLKOUT low
0.45P
0.55P
ns
0.05P
ns
4
tt(CLKOUT)
10
UNIT
1
(1)
(2)
Cycle time, CLKOUT
MAX
ns
Transition time, CLKOUT
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
P = 1/CLKOUT clock frequency in nanoseconds (ns). For example, when CLKOUT frequency is 100 MHz, use P = 10 ns.
2
4
1
CLKOUT
(Divide-by-1)
3
4
Figure 7-10. CLKOUT Timing
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7.4
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Interrupts
The device has a large number of interrupts. It also has the ARM Cortex™-A8 master capable of servicing
interrupts. Specific details, such as the processing flow, configuration steps, and interrupt controller
registers, for each of these masters are found in their respective subsystem documentation.
7.4.1
Interrupt Summary List
Table 7-18 lists all the device interrupts by module and indicates the interrupt destination: ARM Cortex™A8.
Table 7-18. Interrupts By Module
MODULE
Serial ATA
DESTINATION
INTERRUPT
Cortex™-A8
INTRQ
INTRQ_PEND_N
X
C0_RX_THRESH_INTR_REQ
C0_RX_THRESH_INTR_PEND
X
C0_RX_INTR_REQ
EMAC SS0
C0_RX_INTR_PEND
X
C0_TX_INTR_REQ
C0_TX_INTR_PEND
X
C0_MISC_INTR_REQ
C0_MISC_INTR_PEND
X
C0_RX_THRESH_INTR_REQ
C0_RX_THRESH_INTR_PEND
X
C0_RX_INTR_REQ
EMAC SS1
C0_RX_INTR_PEND
X
C0_TX_INTR_REQ
C0_TX_INTR_PEND
X
C0_MISC_INTR_REQ
C0_MISC_INTR_PEND
X
USBSS_INTR_REQ
USBSS_INTR_PEND
X
DESCRIPTION
SATA Module interrupt
Receive threshold (non paced)
Receive pending interrupt (paced)
Transmit pending interrupt (paced)
Stat, Host, MDIO LINKINT or MDIO USERINT
Receive threshold (non paced)
Receive pending interrupt (paced)
Transmit pending interrupt (paced)
Stat, Host, MDIO LINKINT or MDIO USERINT
Queue MGR or CPPI Completion interrupt
USB0_INTR_REQ
USB2.0 SS
USB0_INTR_PEND
X
USB1_INTR_REQ
USB1_INTR_PEND
X
SLV0P_SWAKEUP
X
RX/TX DMA, Endpoint ready/error, or USB2.0
interrupt
USB wakeup
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Table 7-18. Interrupts By Module (continued)
MODULE
DESTINATION
INTERRUPT
Cortex™-A8
PCIE_INT_I_INTR0
PCIE_INT_I_INTR_PEND_N0
X
PCIE_INT_I_INTR1
PCIE_INT_I_INTR_PEND_N1
X
PCIE_INT_I_INTR2
PCIE_INT_I_INTR_PEND_N2
X
PCIE_INT_I_INTR3
PCIE_INT_I_INTR_PEND_N3
X
DESCRIPTION
Legacy interrupt (RC mode only)
MSI interrupt (RC mode only)
Error interrupt
Power Management interrupt
PCIE_INT_I_INTR4
PCIE_INT_I_INTR_PEND_N4
PCIE_INT_I_INTR5
PCIE_INT_I_INTR_PEND_N5
PCIE_INT_I_INTR6
PCIE_INT_I_INTR_PEND_N6
PCIE_INT_I_INTR7
PCIE_INT_I_INTR_PEND_N7
PCIe Gen2
PCIE_INT_I_INTR8
PCIE_INT_I_INTR_PEND_N8
PCIE_INT_I_INTR9
PCIE_INT_I_INTR_PEND_N9
Reserved
PCIE_INT_I_INTR10
PCIE_INT_I_INTR_PEND_N10
PCIE_INT_I_INTR11
PCIE_INT_I_INTR_PEND_N11
X
PCIE_INT_I_INTR12
PCIE_INT_I_INTR_PEND_N12
X
PCIE_INT_I_INTR13
PCIE_INT_I_INTR_PEND_N13
X
PCIE_INT_I_INTR14
PCIE_INT_I_INTR_PEND_N14
X
PCIE_INT_I_INTR15
148
PCIE_INT_I_INTR_PEND_N15
X
SLE_IDLEP_SWAKEPUP
X
PCIe wakeup
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Table 7-18. Interrupts By Module (continued)
MODULE
INTERRUPT
DESTINATION
Cortex™-A8
TPCC_INT_PO[0]
TPCC_INT_PEND_N[0]
X
TPCC_INT_PO[1]
TPCC_INT_PO[2]
Region 2 DMA completion
TPCC_INT_PEND_N[2]
TPCC_INT_PO[3]
Region 3 DMA completion
TPCC_INT_PEND_N[3]
TPCC_INT_PO[4]
Region 4 DMA completion
TPCC_INT_PEND_N[4]
TPCC_INT_PO[5]
Region 5 DMA completion
TPCC_INT_PEND_N[5]
TPCC_INT_PO[6]
Region 6 DMA completion
TPCC_INT_PEND_N[6]
TPCC_INT_PO[7]
Region 7 DMA completion
TPCC_INT_PEND_N[7]
TPCC_MPINT_PO
TPCC_MPINT_PEND_N
X
TPCC_ERRINT_PO
TPCC_ERRINT_PEND_N
X
TPCC_INTG_PO
TPTC_ERRINT_PO
TPTC_LERRINT_PO
X
TPTC_INT_PO
TPTC_ERRINT_PO
TPTC 1
X
TPTC_INT_PO
TPTC_ERRINT_PO
TPTC 2
X
TPTC_INT_PO
TPTC_ERRINT_PO
TPTC_LERRINT_PO
X
TPTC_INT_PO
DDR EMIF4d 1
TPTC2 error
TPTC3 error
TPTC3 completion
TPTC_LINT_PO
DDR EMIF4d 0
TPTC1 error
TPTC2 completion
TPTC_LINT_PO
TPTC 3
TPTC0 error
TPTC1 completion
TPTC_LINT_PO
TPTC_LERRINT_PO
TPCC error
TPTC0 completion
TPTC_LINT_PO
TPTC_LERRINT_PO
Memory protection error
DMA Global completion
TPCC_INTG_PEND_N
TPTC 0
Region 0 DMA completion
Region 1 DMA completion
TPCC_INT_PEND_N[1]
TPCC
DESCRIPTION
SYS_ERR_INTR
SYS_ERR_INTR_PEND_N
X
SYS_ERR_INTR
EMIF error
SYS_ERR_INTR_PEND_N
X
GPMC
GPMC_SINTERRUPT
X
GPMC interrupt
UART 0
NIRQ
X
UART/IrDA 0 interrupt
UART 1
NIRQ
X
UART/IrDA 1 interrupt
UART 2
NIRQ
X
UART/IrDA 2 interrupt
Power, Reset, Clocking, and Interrupts
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Table 7-18. Interrupts By Module (continued)
MODULE
INTERRUPT
DESTINATION
Cortex™-A8
POINTR_REQ
Timer1
POINTR_PEND
X
POINTR_REQ
Timer2
POINTR_PEND
X
POINTR_REQ
Timer3
POINTR_PEND
X
POINTR_REQ
Timer4
POINTR_PEND
X
POINTR_REQ
Timer5
POINTR_PEND
X
POINTR_REQ
Timer6
POINTR_PEND
X
POINTR_REQ
Timer7
WDTimer1
POINTR_PEND
X
PO_INT_REQ
X
DESCRIPTION
32-bit Timer1 interrupt
32-bit Timer2 interrupt
32-bit Timer3 interrupt
32-bit Timer4 interrupt
32-bit Timer5 interrupt
32-bit Timer6 interrupt
32-bit Timer7 interrupt
Watchdog Timer
POINTRREQ
I2C0
POINTRPEND
X
POINTRREQ
I2C1
I2C Bus interrupt
POINTRPEND
X
SPI
SINTERRUPTN
X
SPI Interrupt
SDIO
IRQOQN
X
SDIO interrupt
MCASP_X_INTR_REQ
McASP 0
MCASP_X_INTR_PEND
X
MCASP_R_INTR_REQ
MCASP_R_INTR_PEND
X
MCASP_X_INTR_REQ
McASP 1
MCASP_X_INTR_PEND
X
MCASP_R_INTR_REQ
MCASP_R_INTR_PEND
X
MCASP_X_INTR_REQ
McASP 2
MCASP_X_INTR_PEND
MCASP_R_INTR_REQ
MCASP_R_INTR_PEND
McBSP
X
X
McASP 1 Receive interrupt
McASP 2 Transmit interrupt
McASP 2 Receive interrupt
McBSP Receive Int (legacy mode)
McBSP Transmit Int (legacy mode)
PORROVFLINTERRUPT
McBSP Receive Overflow Int (legacy mode)
TIMER_INTR_PEND
X
X
ALARM_INTR_REQ
ALARM_INTR_PEND
X
POINTRREQ1
POINTRPEND1
X
POINTRREQ2
POINTRPEND2
150
McASP 1 Transmit interrupt
PORXINTERRUPT
TIMER_INTR_REQ
GPIO 0
McASP 0 Receive interrupt
PORRINTERRUPT
PORCOMMONIRQ
RTC
McASP 0 Transmit interrupt
X
McBSP Common Int
Timer interrupt
Alarm interrupt
GPIO 0 interrupt 1
GPIO 0 interrupt 2
Power, Reset, Clocking, and Interrupts
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Table 7-18. Interrupts By Module (continued)
MODULE
INTERRUPT
DESTINATION
Cortex™-A8
POINTRREQ1
GPIO 1
POINTRPEND1
X
POINTRREQ2
POINTRPEND2
X
PRCM
INTR0_INTR_PEND_N
HDMI 1.3
Transmit
SmartReflex0
SmartReflex1
Intr0 pulse version
X
Intr0 level version
Intr1 pulse version
INTR1_INTR_PEND_N
Intr1 level version
INTR2_INTR
Intr2 pulse version
INTR2_INTR_PEND_N
Intr2 level version
INTR3_INTR
Intr3 pulse version
INTR3_INTR_PEND_N
Intr3 level version
X
Error in the IMG bus
TARGETSINTERRUPT
Target slave error interrupt
INITMINTERRUPT
Initiator master error interrupt
INTR0_INTR
INTR0_INTR_PEND_N
Intr0 pulse version
X
INTRREQ
INTRPEND
INTRREQ
INTRPEND
Intr0 level version
SVT SmartReflex interrupt pulse version
X
SVT SmartReflex interrupt level version
HVT SmartReflex interrupt pulse version
X
PBIST
HVT SmartReflex interrupt level version
Reserved
MAIL_U0_IRQ
Mailbox
GPIO 1 interrupt 2
INTR1_INTR
THALIAIRQ
SGX530
(AM3894 only)
GPIO 1 interrupt 1
Reserved
INTR0_INTR
HDVPSS
DESCRIPTION
X
MAIL_U1_IRQ
Mailbox interrupt
MAIL_U2_IRQ
MAIL_U3_IRQ
NMI
Infrastructure
DMM
Cortex™-A8 SS
NMI_INT
X
NMI Interrupt
L3_DBG_IRQ
X
L3 debug error
L3_APP_IRQ
X
L3 application error
DMM_HIGH_INTRPEND
X
PAT fault
COMMTX
X
COMMRX
X
BENCH
X
ARM NPMUIRQ
ELM_IRQ
X
Error Location process completion
EMUINT
X
E2ICE interrupt
ARM ICECrusher interrupt
Power, Reset, Clocking, and Interrupts
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Cortex™-A8 Interrupts
The Cortex™-A8 Interrupt Controller (AINTC) takes ARM device interrupts and maps them to either the
interrupt request (IRQ) or fast interrupt request (FIQ) of the ARM with an individual priority level. The
AINTC interrupts must be active low-level interrupts.
The AINTC is responsible for prioritizing all service requests from the system peripherals directed to the
Cortex™-A8 SS and generating either nIRQ or nFIQ to the host. The type of the interrupt (nIRQ or nFIQ)
and the priority of the interrupt inputs are programmable. It has the capability to handle up to 128 requests
which can be steered/prioritized as nFIQ or nIRQ interrupt requests.
The general features of the AINTC are:
• Up to 128 level-sensitive interrupts inputs
• Individual priority for each interrupt input
• Each interrupt can be steered to nFIQ or nIRQ
• Independent priority sorting for nFIQ and nIRQ.
Table 7-19. Cortex™-A8 Interrupt Controller Connections
INTERRUPT
NUMBER
152
ACRONYM
SOURCE
0
EMUINT
Internal
1
COMMTX
Internal
2
COMMRX
Internal
3
BENCH
Internal
4
ELM_IRQ
5-6
-
7
NMI
8
-
ELM
External Pin
9
L3DEBUG
L3
10
L3APPINT
L3
11
-
12
EDMACOMPINT
TPCC
13
EDMAMPERR
TPCC
14
EDMAERRINT
TPCC
15
-
16
SATAINT
17
USBSSINT
USBSS
18
USBINT0
USBSS
19
USBINT1
USBSS
20-33
-
SATA
34
USBWAKEUP
USBSS
35
PCIeWAKEUP
PCIe
36
DSSINT
HDVPSS
37
GFXINT
SGX530
(AM8394 only)
38
HDMIINT
HDMI
39
-
40
MACRXTHR0
EMAC0
41
MACRXINT0
EMAC0
42
MACTXINT0
EMAC0
43
MACMISC0
EMAC0
Power, Reset, Clocking, and Interrupts
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Table 7-19. Cortex™-A8 Interrupt Controller Connections (continued)
INTERRUPT
NUMBER
ACRONYM
44
MACRXTHR1
EMAC1
45
MACRXINT1
EMAC1
46
MACTXINT1
EMAC1
47
MACMISC1
EMAC1
48
PCIINT0
PCIe
49
PCIINT1
PCIe
50
PCIINT2
PCIe
51
PCIINT3
PCIe
52-63
-
64
SDINT
SD/SDIO
65
SPIINT
SPI
66
-
67
TINT1
Timer1
68
TINT2
Timer2
69
TINT3
Timer3
70
I2CINT0
I2C0
71
I2CINT1
I2C1
72
UARTINT0
UART0
73
UARTINT1
UART1
74
UARTINT2
UART2
SOURCE
75
RTCINT
RTC
76
RTCALARMINT
RTC
77
MBINT
Mailbox
78-79
-
80
MCATXINT0
McASP0
81
MCARXINT0
McASP0
82
MCATXINT1
McASP1
83
MCARXINT1
McASP1
84
MCATXINT2
McASP2
85
MCARXINT2
McASP2
McBSP
86
MCBSPINT
87-90
-
91
WDTINT
92
TINT4
Timer4
93
TINT5
Timer5
94
TINT6
Timer6
95
TINT7
Timer7
96
GPIOINT0A
GPIO 0
97
GPIOINT0B
GPIO 0
98
GPIOINT1A
GPIO 1
WDTIMER1
99
GPIOINT1B
GPIO 1
100
GPMCINT
GPMC
101
DDRERR0
DDR EMIF0
DDR EMIF1
102
DDRERR1
103-111
-
112
TCERRINT0
TPTC0
113
TCERRINT1
TPTC1
Power, Reset, Clocking, and Interrupts
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Table 7-19. Cortex™-A8 Interrupt Controller Connections (continued)
154
INTERRUPT
NUMBER
ACRONYM
SOURCE
114
TCERRINT2
TPTC2
115
TCERRINT3
TPTC3
116-119
-
120
SMRFLX0
SmartReflex0
121
SMRFLX1
SmartReflex1
123
-
124
DMMINT
125-127
-
DMM
Power, Reset, Clocking, and Interrupts
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8 Peripheral Information and Timings
8.1
Parameter Information
Tester Pin Electronics
42 Ω
3.5 nH
Transmission Line
Z0 = 50 Ω
(see Note)
4.0 pF
1.85 pF
Data Sheet Timing Reference Point
Output
Under
Test
Device Pin
(see Note)
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be
taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission line is
intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 8-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
8.1.1
1.8-V and 3.3-V Signal Transition Levels
All input and output timing parameters are referenced to Vref for both "0" and "1" logic levels. For 3.3-V I/O,
Vref = 1.5 V. For 1.8-V I/O, Vref = 0.9 V.
Vref
Figure 8-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL
MAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 8-3. Rise and Fall Transition Time Voltage Reference Levels
8.1.2
3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
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Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data manual do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
For the DDR2/3, PCIe, SATA, USB, and HDMI interfaces, IBIS models are not used for timing
specification. TI provides, in this document, a PCB routing rule solution for each interface that describes
the routing rules used to ensure the interface timings are met. Video DAC guidelines (Section 8.10.2) are
also included to discuss important layout considerations.
8.2
Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
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8.3
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DDR2/3 Memory Controller
The device has a dedicated interface to DDR3 and DDR2 SDRAM. It supports JEDEC standard-compliant
DDR2 and DDR3 SDRAM devices with the following features:
• 16-bit or 32-bit data path to external SDRAM memory
• Memory device capacity: 64Mb, 128Mb, 256Mb, 512Mb, 1Gb, 2Gb and 4Gb (x16-bit only) devices
• Support for two independent chip selects, with their corresponding register sets, and independent page
tracking
• Two interfaces with associated DDR2/3 PHYs
• Dynamic memory manager allows for interleaving of data between the two DDR interfaces.
For details on the DDR2/3 Memory Controller, see the DDR2/3 Memory Controller chapter in the AM389x
Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
8.3.1
DDR2 Routing Specifications
CAUTION
The DDR2 Routing Specifications are preliminary and are being verified by design
simulations.
8.3.1.1
Board Designs
TI only supports board designs that follow the specifications outlined in this document. The switching
characteristics and the timing diagram for the DDR2 memory controller are shown in Table 8-1 and
Figure 8-4.
Table 8-1. Switching Characteristics Over Recommended Operating Conditions for DDR2 Memory
Controller
NO.
1
-1G
PARAMETER
tc(DDR_CLK)
Cycle time, DDR_CLK
MIN
MAX
2.5
8
UNIT
ns
1
DDR_CLK
Figure 8-4. DDR2 Memory Controller Clock Timing
8.3.1.2
DDR2 Interface
This section provides the timing specification for the DDR2 interface as a PCB design and manufacturing
specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk,
and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need
for a complex timing closure process. For more information regarding the guidelines for using this DDR2
specification, see Understanding TI’s PCB Routing Rule-Based DDR2 Timing Specification Application
Report (SPRAAV0).
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8.3.1.2.1 DDR2 Interface Schematic
Figure 8-5 shows the DDR2 interface schematic for a x32 DDR2 memory system. In Figure 8-6 the x16
DDR2 system schematic is identical except that the high-word DDR2 device is deleted.
When not using a DDR2 interface, the proper method of handling the unused pins is to tie off the DQS
pins by pulling the non-inverting DQS pin to the DDR_1V8 supply via a 1k-Ω resistor and pulling the
inverting DQS pin to ground via a 1k-Ω resistor. This needs to be done for each byte not used. Also,
include the 50-Ω pulldown for DDR[x]_VTP. All other DDR interface pins can be left unconnected. Note
that the supported modes for use of the DDR EMIF are 32 bits wide, 16 bits wide, or not used.
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DDR2
DDR[x]_D[0]
DQ0
DDR[x]_D[7]
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DQ7
LDM
LDQS
DDR[x]_DQS[0]
DDR[x]_D[8]
LDQS
DQ8
DDR[x]_D[15]
DDR[x]_DQM[1]
DDR[x]_DQS[1]
DQ15
UDM
UDQS
DDR[x]_DQS[1]
DDR[x]_ODT[0]
UDQS
ODT
T0
DDR2
DDR_ODT1
NC
ODT
DDR_D16
DQ0
DDR[x]_D[23
DDR[x]_DQM[2]
DDR[x]_DQS[2]
DDR[x]_DQS[2]
DDR[x]_D[24]
DQ7
LDM
LDQS
LDQS
DQ8
DDR[x]_D[31]
DDR[x]_DQM[3]
DDR[x]_DQS[3]
DDR[x]_DQS[3]
DQ15
UDM
UDQS
UDQS
DDR[x]_BA[0]
T0
BA0
BA0
DDR[x]_BA[2]
DDR[x]_A[0]
T0
T0
BA2
A0
BA2
A0
DDR[x]_A[14]
DDR[x]_CS[0]
T0
T0
NC
T0
T0
A14
CS
A14
CS
CAS
RAS
CAS
T0
T0
T0
T0
WE
CKE
CK
CK
VREF
WE
CKE
CK
CK
VREF
DDR[x]_CS[1]
DDR[x]_CAS
DDR[x]_RAS
DDR[x]_WE
DDR[x]_CKE
DDR[x]_CLK[x]
DDR[x]_CLK[x]
VREFSSTL_DDR[x]
0.1 µF
DDR[x]_RST
(B)
(B)
0.1 µF
(A)
Vio 1.8
RAS
VREF
0.1 µF
0.1 µF
VREF
1 K Ω 1%
VREF
(B)
0.1 µF
1 K Ω 1%
NC
DDR[x]_VTP
50 Ω (±2%)
T0
A.
B.
Termination is required. See terminator comments.
Vio1.8 is the power supply for the DDR2 memories and the AM389x DDR2 interface.
One of these capacitors can be eliminated if the divider and its capacitors are placed near a VREF pin.
Figure 8-5. 32-Bit DDR2 High-Level Schematic
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DDR2
DDR[x]_D[0]
DQ0
DDR[x]_D[7]
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DQ7
LDM
LDQS
DDR[x]_DQS[0]
DDR[x]_D[8]
LDQS
DQ8
DDR[x]_D[15]
DDR[x]_DQM[1]
DDR[x]_DQS[1]
DDR[x]_DQS[1]
DQ15
UDM
UDQS
UDQS
DDR[x]_ODT[0]
DDR[x]_ODT[1]
DDR[x]_D[16]
T0
NC
NC
DDR[x]_D[23]
DDR[x]_DQM[2]
NC
NC
1 KΩ
DDR[x]_D[24]
NC
1 KΩ
DDR[x]_D[31]
DDR[x]_DQM[3]
DDR[x]_DQS[3]
DDR[x]_DQS[3]
NC
NC
ODT
(A)
Vio 1.8
DDR[x]_DQS[2]
DDR[x]_DQS[2]
(A)
Vio 1.8
1 KΩ
1 KΩ
DDR[x]_BA[0]
T0
BA0
DDR[x]_BA[2]
DDR[x]_A[0]
T0
T0
BA2
A0
DDR[x]_A[14]
DDR[x]_CS[0]
DDR[x]_CS[1]
DDR[x]_CAS
T0
T0
NC
T0
T0
T0
T0
T0
T0
A14
CS
DDR[x]_RAS
DDR[x]_WE
DDR[x]_CKE
DDR[x]_CLK[x]
DDR[x]_CLK[x]
CAS
VREFSSTL_DDR[x]
VREF
0.1 µF
DDR[x]_RST
(A)
Vio 1.8
RAS
WE
CKE
CK
CK
(B)
0.1 µF
0.1 µF
VREF
1 K Ω 1%
VREF
(B)
0.1 µF
1 K Ω 1%
NC
DDR[x]_VTP
50 Ω (±2%)
T0
A.
B.
Termination is required. See terminator comments.
Vio1.8 is the power supply for the DDR2 memories and the AM389x DDR2 interface.
One of these capacitors can be eliminated if the divider and its capacitors are placed near a VREF pin.
Figure 8-6. 16-Bit DDR2 High-Level Schematic
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8.3.1.2.2 Compatible JEDEC DDR2 Devices
Table 8-2 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface.
Generally, the DDR2 interface is compatible with x16 DDR2-800 speed grade DDR2 devices.
Table 8-2. Compatible JEDEC DDR2 Devices
NO.
(1)
(2)
(3)
PARAMETER
MIN
MAX
UNIT
1
JEDEC DDR2 device speed grade (1)
2
JEDEC DDR2 device bit width
x16
x16
3
JEDEC DDR2 device count (2)
1
2
Devices
4
JEDEC DDR2 device ball count (3)
84
92
Balls
DDR2-800
Bits
Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backwards compatibility.
One DDR2 device is used for a 16-bit DDR2 memory system. Two DDR2 devices are used for a 32-bit DDR2 memory system.
The 92-ball devices are retained for legacy support. New designs will migrate to 84-ball DDR2 devices. Electrically, the 92- and 84-ball
DDR2 devices are the same.
8.3.1.2.3 PCB Stackup
The minimum stackup required for routing the AM389x device is a six-layer stackup as shown in Table 83. Additional layers may be added to the PCB stackup to accommodate other circuitry or to reduce the
size of the PCB footprint.
Table 8-3. Minimum PCB Stackup
LAYER
TYPE
DESCRIPTION
1
Signal
Top routing mostly horizontal
2
Plane
Ground
3
Plane
Power
4
Signal
Internal routing
5
Plane
Ground
6
Signal
Bottom routing mostly vertical
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Complete stackup specifications are provided in Table 8-4.
Table 8-4. PCB Stackup Specifications
NO.
PARAMETER
MIN
TYP
1
PCB routing/plane layers
6
2
Signal routing layers
3
3
Full ground layers under DDR2 routing region
2
4
Number of ground plane cuts allowed within DDR routing region
5
Number of ground reference planes required for each DDR2 routing layer
6
Number of layers between DDR2 routing layer and reference ground plane
7
PCB routing feature size
4
8
PCB trace width, w
4
9
PCB BGA escape via pad size (1)
10
PCB BGA escape via hole size
11
Processor BGA pad size
12
DDR2 device BGA pad size (2)
13
Single-ended impedance, Zo
14
(1)
(2)
(3)
162
Impedance control
UNIT
0
1
0
18
(1)
Z-5
Mils
Mils
20
Mils
10
Mils
0.3
mm
50
(3)
MAX
Z
75
Ω
Z+5
Ω
A 20/10 via may be used if enough power routing resources are available. An 18/10 via allows for more flexible power routing to the
processor.
For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
Z is the nominal singled-ended impedance selected for the PCB specified by item 13.
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8.3.1.2.4 Placement
Figure 8-7 shows the required placement for the processor as well as the DDR2 devices. The dimensions
for this figure are defined in Table 8-5. The placement does not restrict the side of the PCB on which the
devices are mounted. The ultimate purpose of the placement is to limit the maximum trace lengths and
allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR2 device is omitted
from the placement.
Recommended DDR2 Device
Orientation
X
X1
A1
X1
X1
OFFSET OFFSET
DDR2
Controller
Y
A1
Figure 8-7. AM389x Device and DDR2 Device Placement
Table 8-5. Placement Specifications
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
MIN
(1) (2)
1
X+Y
2
X' (1) (2)
3
X' Offset (1) (2)
4
DDR2 keepout region (4)
5
Clearance from non-DDR2 signal to DDR2 keepout region (5)
(3)
MAX
UNIT
1660
Mils
1280
Mils
650
Mils
4
w
For dimension definitions, see Figure 8-5.
Measurements from center of processor to center of DDR2 device.
For 16-bit memory systems, it is recommended that X' offset be as small as possible.
DDR2 keepout region to encompass entire DDR2 routing area.
Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
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8.3.1.2.5 DDR2 Keepout Region
The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2
keepout region is defined for this purpose and is shown in Figure 8-8. The size of this region varies with
the placement and DDR routing. Additional clearances required for the keepout region are shown in
Table 8-5.
A1
DDR2 Device
A1
A1
DDR2 Controller
A1
Figure 8-8. DDR2 Keepout Region
NOTE
The region shown in should encompass all the DDR2 circuitry and varies depending on
placement. Non-DDR2 signals should not be routed on the DDR signal layers within the
DDR2 keepout region. Non-DDR2 signals may be routed in the region, provided t hey are
routed on layers separated from DDR2 signal layers by a ground layer. No breaks should be
allowed in the reference ground layers in this region. In addition, the 1.8V power plane
should cover the entire keepout region. Routes for the two DDR interfaces must be
separated by at least 4x; the more separation, the better.
8.3.1.2.6 Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry.
Table 8-6 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the DDR2 interfaces and DDR2 device. Additional bulk
bypass capacitance may be needed for other circuitry.
Table 8-6. Bulk Bypass Capacitors
No.
Parameter
Min
Max
Unit
1
DVDD18 bulk bypass capacitor count (1)
6
Devices
2
DVDD18 bulk bypass total capacitance
60
μF
1
Devices
(1)
3
DDR#1 bulk bypass capacitor count
4
DDR#1 bulk bypass total capacitance (1)
5
DDR#2 bulk bypass capacitor count (2)
6
DDR#2 bulk bypass total capacitance (1) (2)
(1)
(2)
164
10
μF
1
Devices
10
μF
These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed
(HS) bypass capacitors. Use half of these capacitors for DDR[0] and half for DDR[1].
Only used on 32-bit wide DDR2 memory systems.
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8.3.1.2.7 High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critical for proper DDR2 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, processor/DDR power,
and processor/DDR ground connections. Table 8-7 contains the specification for the HS bypass capacitors
as well as for the power connections on the PCB.
Table 8-7. High-Speed Bypass Capacitors
NO.
PARAMETER
MIN
1
HS bypass capacitor package size (1)
2
Distance from HS bypass capacitor to device being bypassed
3
Number of connection vias for each HS bypass capacitor (2)
2
4
Trace length from bypass capacitor contact to connection via
1
5
Number of connection vias for each processor power/ground ball
1
6
Trace length from processor power/ground ball to connection via
7
Number of connection vias for each DDR2 device power/ground ball
8
Trace length from DDR2 device power/ground ball to connection via
9
DVDD18 HS bypass capacitor count (3) (4)
40
10
DVDD18 HS bypass capacitor total capacitance (5)
2.4
11
DDR device HS bypass capacitor count (6) (7)
12
DDR device HS bypass capacitor total capacitance (7)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
MAX
UNIT
0402
10 Mils
250
Mils
Vias
30
Mils
Vias
35
Mils
1
Vias
35
8
Mils
Devices
μF
Devices
0.4
μF
LxW, 10-mil units; for example, a 0402 is a 40x20-mil surface-mount capacitor.
An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
These devices should be placed as close as possible to the device being bypassed.
Use half of these capacitors for DDR[0] and half for DDR[1].
Use half of these capacitors for DDR[0] and half for DDR[1].
These devices should be placed as close as possible to the device being bypassed.
Per DDR device.
8.3.1.2.8 Net Classes
Table 8-8 lists the clock net classes for the DDR2 interface. Table 8-9 lists the signal net classes, and
associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the
termination and routing rules that follow.
Table 8-8. Clock Net Class Definitions
CLOCK NET CLASS
CK
DDR[x]_CLK[x]/DDR[x]_CLK[x]
DQS0
DDR[x]_DQS[0]/DDR[x]_DQS[0]
DQS1
DDR[x]_DQS[1]/DDR[x]_DQS[1]
DQS2 (1)
DDR[x]_DQS[2]/DDR[x]_DQS[2]
(1)
DDR[x]_DQS[3]/DDR[x]_DQS[3]
DQS3
(1)
PROCESSOR PIN NAMES
Only used on 32-bit wide DDR2 memory systems.
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Table 8-9. Signal Net Class Definitions
SIGNAL NET CLASS
ASSOCIATED CLOCK
NET CLASS
ADDR_CTRL
CK
DQ0
DQS0
DDR[x]_D[7:0], DDR[x]_DQM[0]
DQ1
DQS1
DDR[x]_D[15:8], DDR[x]_DQM[1]
DQ2 (1)
DQS2
DDR[x]_D[23:16], DDR[x]_DQM[2]
(1)
DQS3
DDR[x]_D[31:24], DDR[x]_DQM[3]
DQ3
(1)
PROCESSOR PIN NAMES
DDR[x]_BA[2:0], DDR[x]_A[14:0], DDR[x]_CS[x], DDR[x]_CAS, DDR[x]_RAS,
DDR[x]_WE, DDR[x]_CKE, DDR[x]_ODT[x]
Only used on 32-bit wide DDR2 memory systems.
8.3.1.2.9 DDR2 Signal Termination
Signal terminators are required in CK and ADDR_CTRL net classes. Serial terminators may be used on
data lines to reduce EMI risk; however, serial terminations are the only type permitted. ODT's are
integrated on the data byte net classes. They should be enabled to ensure signal integrity.Table 8-10
shows the specifications for the series terminators.
Table 8-10. DDR2 Signal Terminations
NO.
1
PARAMETER
MIN
CK net class (1) (2)
(1) (3) (4) (2)
2
ADDR_CTRL net class
3
Data byte net classes (DQS0-DQS3, DQ0-DQ3) (5)
(1)
(2)
(3)
(4)
(5)
TYP
0
0
0
22
MAX
UNIT
10
Ω
Zo
Ω
0
Ω
Only series termination is permitted, parallel or SST specifically disallowed on board.
Only required for EMI reduction.
Terminator values larger than typical only recommended to address EMI issues.
Termination value should be uniform across net class.
No external terminations allowed for data byte net classes. ODT is to be used.
8.3.1.2.10 VREFSSTL_DDR Routing
VREFSSTL_DDR is used as a reference by the input buffers of the DDR2 memories as well as the
processor. VREF is intended to be half the DDR2 power supply voltage and should be created using a
resistive divider as shown in Figure 8-6. Other methods of creating VREF are not recommended. Figure 89 shows the layout guidelines for VREF.
VREF Nominal Max Trace
width is 20 mils
VREF Bypass Capacitor
A1
+
DDR2 Device
A1
+
DDR2 Controller
Neck down to minimum in BGA escape
regions is acceptable. Narrowing to
accomodate via congestion for short
distances is also acceptable. Best
performance is obtained if the width
of VREF is maximized.
Figure 8-9. VREF Routing and Topology
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DDR2 CK and ADDR_CTRL Routing
Figure 8-10 shows the topology of the routing for the CK and ADDR_CTRL net classes. The route is a
balanced T as it is intended that the length of segments B and C be equal. In addition, the length of A
(A'+A'') should be maximized.
A1
A1
C
B
DDR2
Controller
A´´
T
A´
A = A´ + A´´
Figure 8-10. CK and ADDR_CTRL Routing and Topology
Table 8-11. CK and ADDR_CTRL Routing Specification
NO.
PARAMETER
MIN
(1)
TYP
MAX
UNIT
1
Center-to-center CK-CK spacing
2w
2
CK/CK skew (1)
25
Mils
3
CK B-to-C skew length mismatch
25
Mils
4
Center-to-center CK to other DDR2 trace spacing (2)
5
CK/ADDR_CTRL nominal trace length (3)
CACLM+50
Mils
6
ADDR_CTRL-to-CK skew length mismatch
100
Mils
7
ADDR_CTRL-to-ADDR_CTRL skew length mismatch
100
Mils
8
Center-to-center ADDR_CTRL to other DDR2 trace spacing (2)
4w
9
Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing (2)
3w
10
ADDR_CTRL B-to-C skew length mismatch
100
Mils
(1)
(2)
(3)
4w
CACLM-50
CACLM
The length of segment A=A'+A′′ as shown in Figure 8-10.
Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes.
Figure 8-11 shows the topology and routing for the DQS and DQ net classes; the routes are point to point.
Skew matching across bytes is not needed nor recommended.
A1
T
A1
T
E0
E2
T
T
E1
DDR2
Controller
E3
Figure 8-11. DQS and DQ Routing and Toplogy
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Table 8-12. DQS and DQ Routing Specification
NO.
PARAMETER
1
Center-to-center DQS-DQSn spacing in E0|E1|E2|E3
2
DQS-DQSn skew in E0|E1|E2|E3
3
Center-to-center DQS to other DDR2 trace spacing (1)
4
DQS/DQ nominal trace length
5
DQ-to-DQS skew length mismatch (2) (3) (4)
6
DQ-to-DQ skew length mismatch (2) (3) (4)
MIN
(2) (3) (4)
DQLM-50
25
Mils
DQLM
DQLM+50
Mils
100
Mils
100
Mils
1
Vias
100
Mils
(2) (3) (4)
DQ-to-DQ/DQS via count mismatch
Center-to-center DQ to other DDR2 trace spacing (1) (5)
4w
9
Center-to-center DQ to other DQ trace spacing (1) (6) (7)
3w
DQ/DQS E skew length mismatch
UNIT
4w
8
10
MAX
2w
7
(1)
TYP
(2) (3) (4)
Center-to-center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
A 16-bit DDR memory system has two sets of data net classes; one for data byte 0, and one for data byte 1, each with an associated
DQS (2 DQSs) per DDR EMIF used.
A 32-bit DDR memory system has four sets of data net classes; one each for data bytes 0 through 3, and each associated with a DQS
(4 DQSs) per DDR EMIF used.
There is no need, and it is not recommended, to skew match across data bytes; that is, from DQS0 and data byte 0 to DQS1 and data
byte 1.
DQs from other DQS domains are considered other DDR2 trace.
DQs from other data bytes are considered other DDR2 trace.
DQLM is the longest Manhattan distance of each of the DQS and DQ net classes.
(2)
(3)
(4)
(5)
(6)
(7)
8.3.2
DDR3 Routing Specifications
CAUTION
The DDR3 Routing Specifications are preliminary and are being verified by design
simulations.
8.3.2.1
Board Designs
TI only supports board designs utilizing DDR3 memory that follow the specifications in this document. The
switching characteristics and timing diagram for the DDR3 memory controller are shown in Table 8-13 and
Figure 8-12.
Table 8-13. Switching Characteristics Over Recommended Operating Conditions for DDR3 Memory
Controller
NO.
1
(1)
-1G
PARAMETER
tc(DDR_CLK)
Cycle time, DDR_CLK
MIN
MAX
1.25
3.3 (1)
UNIT
ns
This is the absolute maximum the clock period can be. Actual maximum clock period may be limited by DDR3 speed grade and
operating frequency (see the DDR3 memory device data sheet).
1
DDR_CLK
Figure 8-12. DDR3 Memory Controller Clock Timing
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8.3.2.1.1 DDR3 versus DDR2
This specification only covers AM389x processor PCB designs that utilize DDR3 memory. Designs using
DDR2 memory should use the PCB design specifications for DDR2 memory in Section 8.3.1. While
similar, the two memory systems have different requirements. It is currently not possible to design one
PCB that covers both DDR2 and DDR3.
8.3.2.2
DDR3 Device Combinations
Since there are several possible combinations of device counts and single- or dual-side mounting,
Table 8-14 summarizes the supported device configurations.
Table 8-14. Supported DDR3 Device Combinations (1)
NUMBER OF DDR3 DEVICES
DDR3 DEVICE WIDTH (BITS)
MIRRORED?
DDR3 EMIF WIDTH (BITS)
1
16
N
16
2
8
Y (2)
16
2
16
N
32
(1)
(2)
(3)
Y
(2)
2
16
4
8
N
32
32
4
8
Y (3)
32
This table is per EMIF.
Two DDR3 devices are mirrored when one device is placed on the top of the board and the second device is placed on the bottom of
the board.
This is two mirrored pairs of DDR3 devices.
8.3.2.2.1 DDR3 EMIFs
The processor contains two separate DDR3 EMIFs. This specification covers one of these EMIFs
(DDR[0]) and, thus, needs to be implemented twice, once for each EMIF. The PCB layout generally turns
out to be a semi-mirror with DDR[1] being a flipped version of DDR[0]; the only exception being the DDR3
devices themselves are not flipped unless mounted on opposite sides of the PCB. Requirements are
identical between the two EMIFs.
8.3.2.3
DDR3 Interface Schematic
8.3.2.3.1 32-Bit DDR3 Interface
The DDR3 interface schematic varies, depending upon the width of the DDR3 devices used and the width
of the bus used (16 or 32 bits). General connectivity is straightforward and very similar. 16-bit DDR
devices look like two 8-bit devices. Figure 8-13 and Figure 8-14 show the schematic connections for 32-bit
interfaces using x16 devices.
8.3.2.3.2 16-Bit DDR3 Interface
Note that the 16-bit wide interface schematic is practically identical to the 32-bit interface (see Figure 8-13
and Figure 8-14); only the high-word DDR memories are removed and the unused DQS inputs are tied off.
The processor DDR[x]_DQS[2] and DDR[x]_DQS[3] pins should be pulled to the DDR supply via 1-kΩ
resistors. Similarly, the DDR[x]_DQS[2] and DDR[x]_DQS[3] pins should be pulled to ground via 1-kΩ
resistors.
When not using a DDR interface, the proper method of handling the unused pins is to tie off the DQS pins
by pulling the non-inverting DQS pin to the DDR_1V5 supply via a 1k-Ω resistor and pulling the inverting
DQSn pin to ground via a 1k-Ω resistor. This needs to be done for each byte not used. Also, include the
50-Ω pulldown for DDR[x]_VTP. All other DDR interface pins can be left unconnected. Note that the
supported modes for use of the DDR EMIF are 32 bits wide, 16 bits wide, or not used.
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32-bit DDR3 EMIF
DDR[0] or DDR[1]
DDR[x]_CLK[1]
DDR[x]_CLK[1]
DDR[x]_ODT[1]
DDR[x]_CS[1]
NC
NC
NC
NC
16-Bit DDR3
Devices
DDR[x]_D[31]
DQ15
8
DDR[x]_D[24]
DQ8
DDR[x]_DQM[3]
DDR[x]_DQS[3]
DDR[x]_DQS[3]
UDM
UDQS
UDQS
DDR[x]_D[23]
DQ7
8
DDR[x]_D[16]
D08
DDR[x]_DQM[2]
DDR[x]_DQS[2]
DDR[x]_DQS[2]
LDM
LDQS
LDQS
DDR[x]_D[15]
DQ15
8
DDR[x]_D[8]
DQ8
DDR[x]_DQM[1]
DDR[x]_DQS[1]
DDR[x]_DQS[1]
UDM
UDQS
UDQS
DDR[x]_D[7]
DQ7
8
DDR[x]_D[0]
DQ0
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DDR[x]_DQS[0]
LDM
LDQS
LDQS
DDR[x]_CLK[0]
DDR[x]_CLK[0]
CK
CK
CK
CK
ODT
CS
BA0
BA1
BA2
ODT
CS
BA0
BA1
BA2
A0
A0
Zo
A14
A14
Zo
CAS
RAS
WE
CKE
RST
ZQ
VREFDQ
VREFCA
CAS
RAS
WE
CKE
RST
DDR[x]_ODT[0]
DDR[x]_CS[0]
DDR[x]_BA[0]
DDR[x]_BA[1]
DDR[x]_BA[2]
DDR[x]_A[0]
Zo
0.1 µF
DDR_1V5
Zo
DDR_VTT
15
DDR[x]_A[14]
DDR[x]_CAS
DDR[x]_RAS
DDR[x]_WE
DDR[x]_CKE
DDR[x]_RST
ZQ
VREFSSTL_DDR[x]
0.1 µF
0.1 µF
DDR_VREF
ZQ
VREFDQ
VREFCA
ZQ
0.1 µF
DDR[x]_VTP
50 Ω (±2%)
Zo
ZQ
Termination is required. See terminator comments.
Value determined according to the DDR memory device data sheet.
Figure 8-13. 32-Bit, One-Bank DDR3 Interface Schematic Using Two 16-Bit DDR3 Devices
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32-bit DDR3 EMIF
DDR[0] or DDR[1]
DDR[x]_CLK[1]
DDR[x]_CLK[1]
DDR[x]_ODT[1]
DDR[x]_CS[1]
NC
NC
NC
NC
8-Bit DDR3
Devices
8-Bit DDR3
Devices
DDR[x]_D[31]
DQ7
8
DDR[x]_D[24]
DQ0
DDR[x]_DQM[3]
NC
DDR[x]_DQS[3]
DDR[x]_DQS[3]
DDR[x]_D[23]
DM/TQS
TDQS
DQS
DQS
DQ7
8
DDR[x]_D[16]
DQ0
DDR[x]_DQM[2]
NC
DDR[x]_DQS[2]
DDR[x]_DQS[2]
DDR[x]_D[15]
DM/TQS
TDQS
DQS
DQS
DQ7
8
DDR[x]_D[8]
DQ0
DDR[x]_DQM[1]
NC
DDR[x]_DQS[1]
DDR[x]_DQS[1]
DDR[x]_D[7]
DM/TQS
TDQS
DQS
DQS
DQ7
8
DDR[x]_D[0]
DQ0
DDR[x]_DQM[0]
DDR[x]_DQS[0]
DDR[x]_DQS[0]
DM/TQS
TDQS
DQS
DQS
DDR[x]_CLK[0]
DDR[x]_CLK[0]
CK
CK
NC
DDR[x]_ODT[0]
DDR[x]_CS[0]
DDR[x]_BA[0]
DDR[x]_BA[1]
DDR[x]_BA[2]
DDR[x]_A[0]
Zo
CK
CK
CK
CK
0.1 µF
CK
CK
DDR_1V5
Zo
ODT
CS
BA0
BA1
BA2
ODT
CS
BA0
BA1
BA2
ODT
CS
BA0
BA1
BA2
ODT
CS
BA0
BA1
BA2
A0
A0
A0
A0
Zo
A14
A14
A14
A14
Zo
CAS
RAS
WE
CKE
RST
ZQ
VREFDQ
VREFCA
CAS
RAS
WE
CKE
RST
CAS
RAS
WE
CKE
RST
ZQ
VREFDQ
VREFCA
CAS
RAS
WE
CKE
RST
DDR_VTT
15
DDR[x]_A[14]
DDR[x]_CAS
DDR[x]_RAS
DDR[x]_WE
DDR[x]_CKE
DDR[x]_RST
ZQ
VREFSSTL_DDR[x]
0.1 µF
0.1 µF
ZQ
VREFDQ
VREFCA
0.1 µF
ZQ
ZQ
0.1 µF
ZQ
VREFDQ
VREFCA
DDR_VREF
ZQ
0.1 µF
DDR[x]_VTP
50 Ω (±2%)
Zo
ZQ
Termination is required. See terminator comments.
Value determined according to the DDR memory device data sheet.
Figure 8-14. 32-Bit, One-Bank DDR3 Interface Schematic Using Four 8-Bit DDR3 Devices
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Compatible JEDEC DDR3 Devices
Table 8-15 shows the parameters of the JEDEC DDR3 devices that are compatible with this interface.
Generally, the DDR3 interface is compatible with DDR3-1600 devices in the x8 or x16 widths.
Table 8-15. Compatible JEDEC DDR3 Devices
NO.
PARAMETER
MIN
MAX
DDR3-800
DDR3-1600
JEDEC DDR3 device bit width
x8
x16
JEDEC DDR3 device count (2)
2
8
1
JEDEC DDR3 device speed grade (1)
2
3
(1)
(2)
UNIT
Bits
Devices
DDR3 speed grade depends on desired clock rate. Data rate is 2x the clock rate. For DDR3-1600, the clock rate is 800 MHz.
For valid DDR3 device configurations and device counts, see Section 8.3.2.3, Figure 8-13, and Figure 8-14.
8.3.2.5
PCB Stackup
The minimum stackup for routing the DDR3 interface is a four-layer stack up as shown in Table 8-16.
Additional layers may be added to the PCB stackup to accommodate other circuitry, enhance SI/EMI
performance, or to reduce the size of the PCB footprint. A six-layer stackup is shown in Table 8-17.
Complete stackup specifications are provided in Table 8-18.
Table 8-16. Minimum PCB Stackup
LAYER
TYPE
DESCRIPTION
1
Signal
Top routing mostly vertical
2
Plane
Split power plane
3
Plane
Full ground plane
4
Signal
Bottom routing mostly horizontal
Table 8-17. Six-Layer PCB Stackup Suggestion
172
LAYER
TYPE
DESCRIPTION
1
Signal
Top routing mostly vertical
2
Plane
Ground
3
Plane
Split power plane
4
Plane
Split power plane or Internal routing
5
Plane
Ground
6
Signal
Bottom routing mostly horizontal
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Table 8-18. PCB Stackup Specifications
NO.
MIN
TYP
1
PCB routing/plane layers
PARAMETER
4
6
2
Signal routing layers
2
3
Full ground reference layers under DDR3 routing region (1)
MAX
UNIT
1
(1)
4
Full 1.5-V power reference layers under the DDR3 routing region
5
Number of reference plane cuts allowed within DDR routing region (2)
0
6
Number of layers between DDR3 routing layer and reference plane (3)
0
7
PCB routing feature size
4
8
PCB trace width, w
4
9
PCB BGA escape via pad size (4)
10
PCB BGA escape via hole size
10
Mils
11
Processor BGA pad size
0.3
mm
12
DDR3 device BGA pad size (5)
13
Single-ended impedance, Zo
14
(1)
(2)
(3)
(4)
(5)
(6)
Impedance control
1
18
50
(6)
Z-5
Z
Mils
Mils
20
Mils
75
Ω
Z+5
Ω
Ground reference layers are preferred over power reference layers. Be sure to include bypass caps to accommodate reference layer
return current as the trace routes switch routing layers.
No traces should cross reference plane cuts within the DDR routing region. High-speed signal traces crossing reference plane cuts
create large return current paths which can lead to excessive crosstalk and EMI radiation.
Reference planes are to be directly adjacent to the signal plane to minimize the size of the return current loop.
An 18-mil pad assumes Via Channel is the most economical BGA escape. A 20-mil pad may be used if additional layers are available
for power routing. An 18-mil pad is required for minimum layer count escape.
For the DDR3 device BGA pad size, see the DDR3 device manufacturer documentation.
Z is the nominal singled-ended impedance selected for the PCB specified by item 13.
8.3.2.6
Placement
Figure 8-15 shows the required placement for the processor as well as the DDR3 devices. The
dimensions for this figure are defined in Table 8-19. The placement does not restrict the side of the PCB
on which the devices are mounted. The ultimate purpose of the placement is to limit the maximum trace
lengths and allow for proper routing space. For a 16-bit DDR memory system, the high-word DDR3
device(s) are omitted from the placement.
X1
X2
X2
X2
DDR3
Controller
Y
Figure 8-15. Placement Specifications
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Table 8-19. Placement Specifications
NO.
PARAMETER
MIN
1
X1 (1) (2) (3)
2
X2 (1) (2)
3
Y Offset (1) (2) (3)
4
DDR3 keepout region
5
Clearance from non-DDR3 signal to DDR3 keepout region (4) (5) (6)
(1)
(2)
(3)
(4)
(5)
(6)
4
MAX
UNIT
1000
Mils
600
Mils
1500
Mils
w
For dimension definitions, see Figure 8-15.
Measurements from center of processor to center of DDR3 device.
Minimizing X1 and Y improves timing margins.
w is defined as the signal trace width.
Non-DDR3 signals allowed within DDR3 keepout region provided they are separated from DDR3 routing layers by a ground plane.
Note that DDR3 signals from one DDR3 controller are considered non-DDR3 to the other controller. In other words, keep the two DDR3
interfaces separated by this specification.
8.3.2.7
DDR3 Keepout Region
The region of the PCB used for DDR3 circutry must be isolated from other signals. The DDR3 keepout
region is defined for this purpose and is shown in Figure 8-16. The size of this region varies with the
placement and DDR routing. Additional clearances required for the keepout region are shown in Table 819. Non-DDR3 signals should not be routed on the DDR signal layers within the DDR3 keepout region.
Non-DDR3 signals may be routed in the region, provided they are routed on layers separated from the
DDR signal layers by a ground layer. No breaks should be allowed in the reference ground layers in this
region. In addition, the 1.5-V DDR3 power plane should cover the entire keepout region. Also note that the
two DDR3 controller's signals should be separated from each other by the specification in Table 8-19,
item 5.
DDR3 Controllers
DDR[1] Keep Out Region
DDR[0] Keep Out Region
Encompasses Entire DDR[1] Routing Area
Encompasses Entire DDR[0] Routing Area
Figure 8-16. DDR3 Keepout Region
8.3.2.8
Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR3 and other circuitry.
Table 8-20 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note
that this table only covers the bypass needs of the DDR3 controllers and DDR3 device(s). Additional bulk
bypass capacitance may be needed for other circuitry. Also note that Table 8-20 is per DDR3 controller;
thus, systems using both controllers have to meet the needs of Table 8-20 twice, once for each controller.
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Table 8-20. Bulk Bypass Capacitors
NO.
PARAMETER
MIN
1
DDR_1V5 bulk bypass capacitor count (1)
6
2
DDR_1V5 bulk bypass total capacitance
140
(1)
MAX
UNIT
Devices
μF
These devices should be placed near the devices they are bypassing, but preference should be given to the placement of the highspeed (HS) bypass capacitors and DDR3 signal routing.
8.3.2.9
High-Speed Bypass Capacitors
High-speed (HS) bypass capacitors are critcal for proper DDR3 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass capacitors, processor/DDR power,
and processor/DDR ground connections. Table 8-21 contains the specification for the HS bypass
capacitors as well as for the power connections on the PCB. Generally speaking, it is good to:
1. Fit as many HS bypass capacitors as possible.
2. Minimize the distance from the bypass cap to the pins/balls being bypassed.
3. Use the smallest physical sized capacitors possible with the highest capacitance readily available.
4. Connect the bypass capacitor pads to their vias using the widest traces possible and using the largest
hole size via possible.
5. Minimize via sharing. Note the limites on via sharing shown in Table 8-21.
Table 8-21. High-Speed Bypass Capacitors
NO.
PARAMETER
MIN
1
HS bypass capacitor package size (1)
2
Distance, HS bypass capacitor to processor being bypassed (2) (3) (4)
3
Processor DDR_1V5 HS bypass capacitor count
4
Processor DDR_1V5 HS bypass capacitor total capacitance
5
Number of connection vias for each device power/ground ball (5)
6
Trace length from device power/ground ball to connection via (2)
7
Distance, HS bypass capacitor to DDR device being bypassed (6)
8
DDR3 device HS bypass capacitor count (7)
9
DDR3 device HS bypass capacitor total capacitance (7)
TYP
MAX
UNIT
201
402
10 Mils
400
Mils
70
Devices
μF
5
Vias
35
70
12
(8) (9)
10
Number of connection vias for each HS capacitor
11
Trace length from bypass capacitor connect to connection via (2) (9)
12
Number of connection vias for each DDR3 device power/ground ball (10)
13
Trace length from DDR3 device power/ground ball to connection via (2) (8)
Mils
150
Mils
Devices
μF
0.85
2
Vias
35
100
1
Mils
Vias
35
60
Mils
(1)
(2)
(3)
(4)
LxW, 10-mil units, for example, a 0402 is a 40x20-mil surface-mount capacitor.
Closer/shorter is better.
Measured from the nearest processor power/ground ball to the center of the capacitor package.
Three of these capacitors should be located underneath the processor, between the cluster of DDR_1V5 balls and ground balls,
between the DDR interfaces on the package.
(5) See the Via Channel™ escape for the processor package.
(6) Measured from the DDR3 device power/ground ball to the center of the capacitor package.
(7) Per DDR3 device.
(8) An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board. No sharing of
vias is permitted on the same side of the board.
(9) An HS bypass capacitor may share a via with a DDR device mounted on the same side of the PCB. A wide trace should be used for the
connection and the length from the capacitor pad to the DDR device pad should be less than 150 mils.
(10) Up to a total of two pairs of DDR power/ground balls may share a via.
8.3.2.9.1 Return Current Bypass Capacitors
Use additional bypass capacitors if the return current reference plane changes due to DDR3 signals
hopping from one signal layer to another. The bypass capacitor here provides a path for the return current
to hop planes along with the signal. As many of these return current bypass capacitors should be used as
possible. Since these are returns for signal current, the signal via size may be used for these capacitors.
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8.3.2.10 Net Classes
Table 8-22 lists the clock net classes for the DDR3 interface. Table 8-23 lists the signal net classes, and
associated clock net classes, for signals in the DDR3 interface. These net classes are used for the
termination and routing rules that follow.
Table 8-22. Clock Net Class Definitions
CLOCK NET CLASS
DDR[x]_CLK[x]/DDR[x]_CLK[x]
DQS0
DDR[x]_DQS[0]/DDR[x]_DQS[0]
DQS1
DDR[x]_DQS[1]/DDR[x]_DQS[1]
(1)
DDR[x]_DQS[2]/DDR[x]_DQS[2]
DQS3 (1)
DDR[x]_DQS[3]/DDR[x]_DQS[3]
DQS2
(1)
PROCESSOR PIN NAMES
CK
Only used on 32-bit wide DDR3 memory systems.
Table 8-23. Signal Net Class Definitions
SIGNAL NET CLASS
ASSOCIATED CLOCK
NET CLASS
ADDR_CTRL
CK
DQ0
DQS0
DDR[x]_D[7:0], DDR[x]_DQM[0]
DQ1
DQS1
DDR[x]_D[15:8], DDR[x]_DQM[1]
DQ2 (1)
DQS2
DDR[x]_D[23:16], DDR[x]_DQM[2]
(1)
DQS3
DDR[x]_D[31:24], DDR[x]_DQM[3]
DQ3
(1)
PROCESSOR PIN NAMES
DDR[x]_BA[2:0], DDR[x]_A[14:0], DDR[x]_CS[x], DDR[x]_CAS, DDR[x]_RAS,
DDR[x]_WE, DDR[x]_CKE, DDR[x]_ODT[x]
Only used on 32-bit wide DDR3 memory systems.
8.3.2.11 DDR3 Signal Termination
Signal terminators are required for the CK and ADDR_CTRL net classes. The data lines are terminated by
ODT and, thus, the PCB traces should be unterminated. Detailed termination specifications are covered in
the routing rules in the following sections.
8.3.2.12 VREFSSTL_DDR Routing
VREFSSTL_DDR (VREF) is used as a reference by the input buffers of the DDR3 memories as well as
the processor. VREF is intended to be half the DDR3 power supply voltage and is typically generated with
the DDR3 1.5-V and VTT power supply. It should be routed as a nominal 20-mil wide trace with 0.1 µF
bypass capacitors near each device connection. Narrowing of VREF is allowed to accommodate routing
congestion.
8.3.2.13 VTT
Like VREF, the nominal value of the VTT supply is half the DDR3 supply voltage. Unlike VREF, VTT is
expected to source and sink current, specifically the termination current for the ADDR_CTRL net class
Thevinen terminators. VTT is needed at the end of the address bus and it should be routed as a power
sub-plane. VTT should be bypassed near the terminator resistors.
8.3.2.14 CK and ADDR_CTRL Topologies and Routing Definition
The CK and ADDR_CTRL net classes are routed similarly and are length matched to minimize skew
between them. CK is a bit more complicated because it runs at a higher transition rate and is differiential.
The following subsections show the topology and routing for various DDR3 configurations for CK and
ADDR_CTRL. The figures in the following subsections define the terms for the routing specification
detailed in Table 8-24.
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8.3.2.14.1 Four DDR3 Devices
Four DDR3 devices are supported on the DDR EMIF consisting of four x8 DDR3 devices arranged as one
bank (CS). These four devices may be mounted on a single side of the PCB, or may be mirrored in two
pairs to save board space at a cost of increased routing complexity and parts on the backside of the PCB.
8.3.2.14.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
Figure 8-17 shows the topology of the CK net classes and Figure 8-18 shows the topology for the
corresponding ADDR_CTRL net classes.
+ –
+ –
+ –
+ –
AS+
AS-
AS+
AS-
AS+
AS-
AS+
AS-
DDR Differential CK Input Buffers
Clock Parallel
Terminator
DDR_1V5
Rcp
A1
Processor
Differential Clock
Output Buffer
A3
A2
A3
A4
AT
Cac
+
–
Rcp
A1
A3
A2
A3
A4
0.1 µF
AT
Routed as Differential Pair
Figure 8-17. CK Topology for Four x8 DDR3 Devices
Processor
Address/Control
Output Buffer
A1
A2
A3
A4
AS
AS
AS
AS
DDR Address/Control Input Buffers
A3
Address/Control
Terminator
Rtt
Vtt
AT
Figure 8-18. ADDR_CTRL Topology for Four x8 DDR3 Devices
8.3.2.14.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
Figure 8-19 shows the CK routing for four DDR3 devices placed on the same side of the PCB. Figure 8-20
shows the corresponding ADDR_CTRL routing.
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A1
A1
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DDR_1V5
A3
A3
=
A3
A3
A4
A4
Rcp
Cac
Rcp
0.1 µF
AT
AT
AS+
AS-
A2
A2
A1
Figure 8-19. CK Routing for Four Single-Side DDR3 Devices
Rtt
A3
=
A4
A3
AT
Vtt
AS
A2
Figure 8-20. ADDR_CTRL Routing for Four Single-Side DDR3 Devices
To save PCB space, the four DDR3 memories may be mounted as two mirrored pairs at a cost of
increased routing and assembly complexity. Figure 8-21 and Figure 8-22 show the routing for CK and
ADDR_CTRL, respectively, for four DDR3 devices mirrored in a two-pair configuration.
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A1
A1
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DDR_1V5
A3
A3
=
A3
A3
A4
A4
Rcp
Cac
Rcp
0.1 µF
AT
AT
AS+
AS-
A2
A2
A1
Figure 8-21. CK Routing for Four Mirrored DDR3 Devices
Rtt
=
A4
A3
AT
Vtt
AS
A3
A2
Figure 8-22. ADDR_CTRL Routing for Four Mirrored DDR3 Devices
8.3.2.14.2 Two DDR3 Devices
Two DDR3 devices are supported on the DDR EMIF consisting of two x8 DDR3 devices arranged as one
bank (CS), 16 bits wide, or two x16 DDR3 devices arranged as one bank (CS), 32 bits wide. These two
devices may be mounted on a single side of the PCB, or may be mirrored in a pair to save board space at
a cost of increased routing complexity and parts on the backside of the PCB.
8.3.2.14.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
Figure 8-23 shows the topology of the CK net classes and Figure 8-24 shows the topology for the
corresponding ADDR_CTRL net classes.
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+ –
+ –
AS+
AS-
AS+
AS-
DDR Differential CK Input Buffers
Clock Parallel
Terminator
DDR_1V5
Rcp
A1
Processor
Differential Clock
Output Buffer
A3
A2
AT
Cac
+
–
Rcp
A1
A3
A2
0.1 µF
AT
Routed as Differential Pair
Figure 8-23. CK Topology for Two DDR3 Devices
Processor
Address/Control
Output Buffer
A1
A2
AS
AS
DDR Address/Control Input Buffers
A3
Address/Control
Terminator
Rtt
Vtt
AT
Figure 8-24. ADDR_CTRL Topology for Two DDR3 Devices
8.3.2.14.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
Figure 8-25 shows the CK routing for two DDR3 devices placed on the same side of the PCB. Figure 8-26
shows the corresponding ADDR_CTRL routing.
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A1
A1
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DDR_1V5
A3
A3
=
Rcp
Cac
Rcp
0.1 µF
AT
AT
AS+
AS-
A2
A2
A1
Figure 8-25. CK Routing for Two Single-Side DDR3 Devices
Rtt
A3
=
AT
Vtt
AS
A2
Figure 8-26. ADDR_CTRL Routing for Two Single-Side DDR3 Devices
To save PCB space, the two DDR3 memories may be mounted as a mirrored pair at a cost of increased
routing and assembly complexity. Figure 8-27 and Figure 8-28 show the routing for CK and ADDR_CTRL,
respectively, for two DDR3 devices mirrored in a single-pair configuration.
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A1
A1
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DDR_1V5
A3
A3
=
Rcp
Cac
Rcp
0.1 µF
AT
AT
AS+
AS-
A2
A2
A1
Figure 8-27. CK Routing for Two Mirrored DDR3 Devices
Rtt
=
AT
Vtt
AS
A3
A2
Figure 8-28. ADDR_CTRL Routing for Two Mirrored DDR3 Devices
8.3.2.14.3 One DDR3 Device
A single DDR3 device is supported on the DDR EMIF consisting of one x16 DDR3 device arranged as
one bank (CS), 16 bits wide.
8.3.2.14.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
Figure 8-29 shows the topology of the CK net classes and Figure 8-30 shows the topology for the
corresponding ADDR_CTRL net classes.
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DDR Differential CK Input Buffer
AS+
AS-
+ –
Clock Parallel
Terminator
DDR_1V5
Rcp
A1
Processor
Differential Clock
Output Buffer
AT
A2
Cac
+
–
Rcp
A1
0.1 µF
AT
A2
Routed as Differential Pair
Figure 8-29. CK Topology for One DDR3 Device
AS
DDR Address/Control Input Buffers
Processor
Address/Control
Output Buffer
A1
A2
Address/Control
Terminator
Rtt
AT
Vtt
Figure 8-30. ADDR_CTRL Topology for One DDR3 Device
8.3.2.14.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
Figure 8-31 shows the CK routing for one DDR3 device placed on the same side of the PCB. Figure 8-32
shows the corresponding ADDR_CTRL routing.
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A1
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DDR_1V5
Rcp
Cac
Rcp
0.1 µF
AT
AT
=
AS+
AS-
A2
A2
A1
Figure 8-31. CK Routing for One DDR3 Device
Rtt
AT
=
Vtt
AS
A2
Figure 8-32. ADDR_CTRL Routing for One DDR3 Device
8.3.2.15 Data Topologies and Routing Definition
No matter the number of DDR3 devices used, the data line topology is always point to point, so its
definition is simple.
8.3.2.15.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
DQS lines are point-to-point differential, and DQ/DM lines are point-to-point singled ended. Figure 8-33
and Figure 8-34 show these topologies.
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Processor
DQS
I/O Buffer
DDR
DQS
I/O Buffer
DQSn+
DQSnRouted Differentially
n = 0, 1, 2, 3
Figure 8-33. DQS Topology
Processor
DQ/DM
I/O Buffer
DDR
DQ/DM
I/O Buffer
Dn
n = 0, 1, 2, 3
Figure 8-34. DQ/DM Topology
8.3.2.15.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
Figure 8-35 and Figure 8-36 show the DQS and DQ/DM routing.
DQS
DQSn+
DQSn-
Routed Differentially
n = 0, 1, 2, 3
Figure 8-35. DQS Routing With Any Number of Allowed DDR3 Devices
Dn
DQ/DM
n = 0, 1, 2, 3
Figure 8-36. DQ/DM Routing With Any Number of Allowed DDR3 Devices
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8.3.2.16 Routing Specification
8.3.2.16.1 CK and ADDR_CTRL Routing Specification
Skew within the CK and ADDR_CTRL net classes directly reduces setup and hold margin and, thus, this
skew must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter
traces up to the length of the longest net in the net class and its associated clock. A metric to establish
this maximum length is Manhattan distance. The Manhattan distance between two points on a PCB is the
length between the points when connecting them only with horizontal or vertical segments. A reasonable
trace route length is to within a percentage of its Manhattan distance. CACLM is defined as Clock Address
Control Longest Manhattan distance.
Given the clock and address pin locations on the processor and the DDR3 memories, the maximum
possible Manhattan distance can be determined given the placement. Figure 8-37 and Figure 8-38 show
this distance for four loads and two loads, respectively. It is from this distance that the specifications on
the lengths of the transmission lines for the address bus are determined. CACLM is determined similarly
for other address bus configurations; that is, it is based on the longest net of the CK/ADDR_CTRL net
class. For CK and ADDR_CTRL routing, these specifications are contained in Table 8-24.
(A)
A1
A8
CACLMY
CACLMX
A8
(A)
A8
(A)
A8
(A)
A8
(A)
Rtt
A3
=
A.
A4
A3
AT
Vtt
AS
A2
It is very likely that the longest CK/ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the DDR3
memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net class that
satisfies this criteria and use as the baseline for CK/ADDR_CTRL skew matching and length control.
The length of shorter CK/ADDR_CTRL stubs as well as the length of the terminator stub are not included in this
length caculation. Non-included lengths are grayed out in the figure.
Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 8-37. CACLM for Four Address Loads on One Side of PCB
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(A)
A1
A8
CACLMY
CACLMX
A8
(A)
A8
(A)
Rtt
A3
=
A.
AT
Vtt
AS
A2
It is very likely that the longest CK/ADDR_CTRL Manhattan distance will be for Address Input 8 (A8) on the DDR3
memories. CACLM is based on the longest Manhattan distance due to the device placement. Verify the net class that
satisfies this criteria and use as the baseline for CK/ADDR_CTRL skew matching and length control.
The length of shorter CK/ADDR_CTRL stubs as well as the length of the terminator stub are not included in this
length caculation. Non-included lengths are grayed out in the figure.
Assuming A8 is the longest, CALM = CACLMY + CACLMX + 300 mils.
The extra 300 mils allows for routing down lower than the DDR3 memories and returning up to reach A8.
Figure 8-38. CACLM for Two Address Loads on One Side of PCB
Table 8-24. CK and ADDR_CTRL Routing Specification (1) (2)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
2500
mils
25
mils
660
mils
1
A1+A2 length
2
A1+A2 skew
3
A3 length
4
A3 skew (3)
25
mils
5
A3 skew
(4)
125
mils
6
A4 length
660
mils
7
A4 skew
25
mils
8
AS length
100
mils
9
AS skew
100
mils
10
AS+/AS- length
70
mils
11
AS+/AS- skew
5
mils
(5)
12
AT length
13
AT skew (6)
14
AT skew (7)
15
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
CK/ADDR_CTRL nominal trace length
500
mils
100
(8)
CACLM-50
CACLM
mils
5
mils
CACLM+50
mils
The use of vias should be minimized.
Additional bypass capacitors are required when using the DDR_1V5 plane as the reference plane to allow the return current to jump
between the DDR_1V5 plane and the ground plane when the net class swtiches layers at a via.
Non-mirrored configuration (all DDR3 memories on same side of PCB).
Mirrored configuration (one DDR3 device on top of the board and one DDR3 device on the bottom).
While this length can be increased for convienience, its length should be minimized.
ADDR_CTRL net class only (not CK net class). Minimizing this skew is recommended, but not required.
CK net class only.
CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes + 300 mils. For definition, see Section 8.3.2.16.1,
Figure 8-37, and Figure 8-38.
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Table 8-24. CK and ADDR_CTRL Routing Specification(1)(2) (continued)
NO.
PARAMETER
MIN
16
Center-to-center CK to other DDR3 trace spacing (9)
4w
17
Center-to-center ADDR_CTRL to other DDR3 trace spacing (9) (10)
4w
18
Center-to-center ADDR_CTRL to other ADDR_CTRL trace spacing (9)
3w
19
CK center-to-center spacing (11)
20
CK spacing to other net (9)
21
Rcp (12)
Zo-1
22
Rtt (12) (13)
Zo-5
(9)
(10)
(11)
(12)
(13)
TYP
MAX
UNIT
Zo
Zo+
Ω
Zo
Zo+5
Ω
4w
Center-to-center spacing is allowed to fall to minimum (w) for up to 1250 mils of routed length.
The ADDR_CTRL net class of the other DDR EMIF is considered other DDR3 trace spacing.
CK spacing set to ensure proper differential impedance.
Source termination (series resistor at driver) is specifically not allowed.
Termination values should be uniform across the net class.
8.3.2.16.2 DQS and DQ Routing Specification
Skew within the DQS and DQ/DM net classes directly reduces setup and hold margin and thus this skew
must be controlled. The only way to practically match lengths on a PCB is to lengthen the shorter traces
up to the length of the longest net in the net class and its associated clock. As with CK and ADDR_CTRL,
a reasonable trace route length is to within a percentage of its Manhattan distance. DQLMn is defined as
DQ Longest Manhattan distance n, where n is the byte number. For a 32-bit interface, there are four
DQLMs, DQLM0-DQLM3. Likewise, for a 16-bit interface, there are two DQLMs, DQLM0-DQLM1.
NOTE
It is not required, nor is it recommended, to match the lengths across all bytes. Length
matching is only required within each byte.
Given the DQS and DQ/DM pin locations on the processor and the DDR3 memories, the maximum
possible Manhattan distance can be determined given the placement. Figure 8-39 shows this distance for
four loads. It is from this distance that the specifications on the lengths of the transmission lines for the
data bus are determined. For DQS and DQ/DM routing, these specifications are contained in Table 8-25.
DQLMX0
DB0
DB1
DQ[0:7]/DM0/DQS0
DQ[8:15]/DM1/DQS1
DQLMX1
DQ[16:23]/DM2/DQS2
DB2
DQLMY0
DQLMX2
DQLMY3
DQLMY2
DB3
DQLMY1
DQ[23:31]/DM3/DQS3
DQLMX3
3
2
1
0
DB0 - DB3 represent data bytes 0 - 3.
There are four DQLMs, one for each byte (32-bit interface). Each DQLM is the longest Manhattan distance of the
byte; therefore:
DQLM0 = DQLMX0 + DQLMY0
DQLM1 = DQLMX1 + DQLMY1
DQLM2 = DQLMX2 + DQLMY2
DQLM3 = DQLMX3 + DQLMY3
Figure 8-39. DQLM for Any Number of Allowed DDR3 Devices
188
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Table 8-25. Data Routing Specification (1)
NO.
MAX
UNIT
1
DB0 nominal length (2) (3)
PARAMETER
MIN
DQLM0
mils
2
DB1 nominal length (2) (4)
DQLM1
mils
3
DB2 nominal length (2) (5)
DQLM2
mils
4
DB3 nominal length
(2) (6)
DQLM3
mils
5
DBn skew (7)
25
mils
6
DQSn+ to DQSn- skew
5
mils
25
mils
(7) (8)
7
DQSn to DBn skew
8
Center-to-center DBn to other DDR3 trace spacing (9) (10)
4w
9
Center-to-center DBn to other DBn trace spacing (9) (11)
3w
(12)
10
DQSn center-to-center spacing
11
DQSn center-to-center spacing to other net(9)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
TYP
4w
External termination disallowed. Data termination should use built-in ODT functionality.
DQLMn is the longest Manhattan distance of a byte. For definition, see Section 8.3.2.16.2 and Figure 8-39.
DQLM0 is the longest Manhattan length for the net classes of Byte 0.
DQLM1 is the longest Manhattan length for the net classes of Byte 1.
DQLM2 is the longest Manhattan length for the net classes of Byte 2.
DQLM3 is the longest Manhattan length for the net slasses of Byte 3.
Length matching is only done within a byte. Length matching across bytes is neither required nor recommended.
Each DQS pair is length matched to its associated byte.
Center-to-center spacing is allowed to fall to minimum (w) for up to 1250 mils of routed length.
Other DDR3 trace spacing means other DDR3 net classes not within the byte.
This applies to spacing within the net classes of a byte.
DQS pair spacing is set to ensure proper differential impedance.
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8.3.3
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DDR2/3 Memory Controller Register Descriptions
Table 8-26. DDR2/3 Memory Controller Registers
DDR0 HEX ADDRESS
DDR1 HEX ADDRESS
ACRONYM
REGISTER NAME
0x4C00 0004
0x4D00 0004
SDRSTAT
SDRAM Status
0x4C00 0008
0x4D00 0008
SDRCR
SDRAM Config
0x4C00 000C
0x4D00 000C
SDRCR2
SDRAM Config 2
0x4C00 0010
0x4D00 0010
SDRRCR
SDRAM Refresh Control
0x4C00 0014
0x4D00 0014
SDRRCSR
SDRAM Refresh Control Shadow
0x4C00 0018
0x4D00 0018
SDRTIM1
SDRAM Timing 1
0x4C00 001C
0x4D00 001C
SDRTIM1SR
0x4C00 0020
0x4D00 0020
SDRTIM2
0x4C00 0024
0x4D00 0024
SDRTIM2SR
0x4C00 0028
0x4D00 0028
SDRTIM3
0x4C00 002C
0x4D00 002C
SDRTIM3SR
0x4C00 0038
0x4D00 0038
PMCR
0x4C00 003C
0x4D00 003C
PMCSR
Power Management Control Shadow
0x4C00 0054
0x4D00 0054
PBBPR
Peripheral Bus Burst Priority
0x4C00 00A0
0x4D00 00A0
EOI
0x4C00 00A4
0x4D00 00A4
SOIRSR
0x4C00 00AC
0x4D00 00AC
SOISR
8.3.4
SDRAM Timing 1 Shadow
SDRAM Timing 2
SDRAM Timing 2 Shadow
SDRAM Timing 3
SDRAM Timing 3 Shadow
Power Management Control
End of Interrupt
System OCP Interrupt Raw Status
System OCP Interrupt Status
0x4C00 00B4
0x4D00 00B4
SOIESR
System OCP Interrupt Enable Set
0x4C00 00BC
0x4D00 00BC
SOIECR
System OCP Interrupt Enable Clear
0x4C00 00C8
0x4D00 00C8
ZQCR
0x4C00 00DC
0x4D00 00DC
RWLCR
0x4C00 00E4
0x4D00 00E4
DDRPHYCR
0x4C00 00E8
0x4D00 00E8
DDRPHYCSR
SDRAM output Impedance Calibration Config
Read-Write Leveling Control
DDR PHY Control
DDR PHY Control Shadow
DDR2/3 PHY Register Descriptions
Table 8-27. DDR2/3 PHY Registers
DDR0 HEX
ADDRESS
DDR1 HEX
ADDRESS
ACRONYM
0x4819 800C
0x4819 A00C
CMD0_IO_CONFIG_I_0
Command 0 Address/Command Pad
Configuration
0x4819 8010
0x4819 A010
CMD0_IO_CONFIG_I_CLK_0
Command 0 Clock Pad Configuration
0x4819 8014
0x4819 A014
CMD0_IO_CONFIG_SR_0
0x4819 8018
0x4819 A018
CMD0_IO_CONFIG_SR_CLK_0
0x4819 801C
0x4819 A01C
CMD0_REG_PHY_CTRL_SLAVE_RATIO_0
0x4819 802C
0x4819 A02C
CMD0_REG_PHY_INVERT_CLKOUT_0
Command 0 Invert Clockout Selection
0x4819 8040
0x4819 A040
CMD1_IO_CONFIG_I_0
Command 1 Address/Command Pad
Configuration
0x4819 8044
0x4819 A044
CMD1_IO_CONFIG_I_CLK_0
Command 1 Clock Pad Configuration
0x4819 8048
0x4819 A048
CMD1_IO_CONFIG_SR_0
0x4819 804C
0x4819 A04C
CMD1_IO_CONFIG_SR_CLK_0
0x4819 8050
0x4819 A050
CMD1_REG_PHY_CTRL_SLAVE_RATIO_0
0x4819 8060
0x4819 A060
CMD1_REG_PHY_INVERT_CLKOUT_0
190
Peripheral Information and Timings
REGISTER NAME
Command 0 Address/Command Slew Rate
Configuration
Command 0 Clock Pad Slew Rate
Configuration
Command 0 Address/Command Slave Ratio
Command 1 Address/Command Slew Rate
Configuration
Command 1 Clock Pad Slew Rate
Configuration
Command 1 Address/Command Slave Ratio
Command 1 Invert Clockout Selection
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Table 8-27. DDR2/3 PHY Registers (continued)
DDR0 HEX
ADDRESS
DDR1 HEX
ADDRESS
ACRONYM
0x4819 8074
0x4819 A074
CMD2_IO_CONFIG_I_0
Command 2 Address/Command Pad
Configuration
0x4819 8078
0x4819 A078
CMD2_IO_CONFIG_I_CLK_0
Command 2 Clock Pad Configuration
0x4819 807C
0x4819 A07C
CMD2_IO_CONFIG_SR_0
0x4819 8080
0x4819 A080
CMD2_IO_CONFIG_SR_CLK_0
0x4819 8084
0x4819 A084
CMD2_REG_PHY_CTRL_SLAVE_RATIO_0
0x4819 8094
0x4819 A094
CMD2_REG_PHY_INVERT_CLKOUT_0
Command 2 Invert Clockout Selection
0x4819 80A8
0x4819 A0A8
DATA0_IO_CONFIG_I_0
Data Macro 0 Data Pad Configuration
0x4819 80AC
0x4819 A0AC
DATA0_IO_CONFIG_I_CLK_0
Data Macro 0 Data Strobe Pad Configuration
0x4819 80B0
0x4819 A0B0
DATA0_IO_CONFIG_SR_0
Data Macro 0 Data Slew Rate Configuration
0x4819 80B4
0x4819 A0B4
DATA0_IO_CONFIG_SR_CLK_0
Data Macro 0 Data Strobe Slew Rate
Configuration
REGISTER NAME
Command 2 Address/Command Slew Rate
Configuration
Command 2 Clock Pad Slew Rate
Configuration
Command 2 Address/Command Slave Ratio
0x4819 80C8
0x4819 A0C8
DATA0_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 0 Read DQS Slave Ratio
0x4819 80DC
0x4819 A0DC
DATA0_REG_PHY_WR_DQS_SLAVE_RATIO_0
Data Macro 0 Write DQS Slave Ratio
0x4819 80F0
0x4819 A0F0
DATA0_REG_PHY_WRLVL_INIT_RATIO_0
Data Macro 0 Write Leveling Init Ratio
0x4819 80F8
0x4819 A0F8
DATA0_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 0 Write Leveling Init Mode Ratio
Selection
0x4819 80FC
0x4819 A0FC
DATA0_REG_PHY_GATELVL_INIT_RATIO_0
Data Macro 0 DQS Gate Training Init Ratio
0x4819 8104
0x4819 A104
DATA0_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 0 DQS Gate Training Init Mode
Ratio Selection
0x4819 8108
0x4819 A108
DATA0_REG_PHY_FIFO_WE_SLAVE_RATIO_0
Data Macro 0 DQS Gate Slave Ratio
0x4819 8120
0x4819 A120
DATA0_REG_PHY_WR_DATA_SLAVE_RATIO_0
Data Macro 0 Write Data Slave Ratio
0x4819 8134
0x4819 A134
DATA0_REG_PHY_USE_RANK0_DELAYS
0x4819 814C
0x4819 A14C
DATA1_IO_CONFIG_I_0
Data Macro 0 Delay Selection
0x4819 8150
0x4819 A150
DATA1_IO_CONFIG_I_CLK_0
Data Macro 1 Data Strobe Pad Configuration
0x4819 8154
0x4819 A154
DATA1_IO_CONFIG_SR_0
Data Macro 1 Data Slew Rate Configuration
0x4819 8158
0x4819 A158
DATA1_IO_CONFIG_SR_CLK_0
Data Macro 1 Data Strobe Slew Rate
Configuration
0x4819 816C
0x4819 A16C
DATA1_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 1 Read DQS Slave Ratio
0x4819 8180
0x4819 A180
DATA1_REG_PHY_WR_DQS_SLAVE_RATIO_0
Data Macro 1 Write DQS Slave Ratio
0x4819 8194
0x4819 A194
DATA1_REG_PHY_WRLVL_INIT_RATIO_0
Data Macro 1 Write Leveling Init Ratio
0x4819 819C
0x4819 A19C
DATA1_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 1 Write Leveling Init Mode Ratio
Selection
0x4819 81A0
0x4819 A1A0
DATA1_REG_PHY_GATELVL_INIT_RATIO_0
Data Macro 1 DQS Gate Training Init Ratio
0x4819 81A8
0x4819 A1A8
DATA1_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 1 DQS Gate Training Init Mode
Ratio Selection
0x4819 81AC
0x4819 A1AC
DATA1_REG_PHY_FIFO_WE_SLAVE_RATIO_0
Data Macro 1 DQS Gate Slave Ratio
0x4819 81C4
0x4819 A1C4
DATA1_REG_PHY_WR_DATA_SLAVE_RATIO_0
Data Macro 1 Write Data Slave Ratio
0x4819 81D8
0x4819 A1D8
DATA1_REG_PHY_USE_RANK0_DELAYS
0x4819 81F0
0x4819 A1F0
DATA2_IO_CONFIG_I_0
0x4819 81F4
0x4819 A1F4
DATA2_IO_CONFIG_I_CLK_0
Data Macro 2 Data Strobe Pad Configuration
0x4819 81F8
0x4819 A1F8
DATA2_IO_CONFIG_SR_0
Data Macro 2 Data Slew Rate Configuration
0x4819 81FC
0x4819 A1FC
DATA2_IO_CONFIG_SR_CLK_0
Data Macro 2 Data Strobe Slew Rate
Configuration
0x4819 8210
0x4819 A210
DATA2_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 2 Read DQS Slave Ratio
0x4819 8224
0x4819 A224
DATA2_REG_PHY_WR_DQS_SLAVE_RATIO_0
Data Macro 2 Write DQS Slave Ratio
0x4819 8238
0x4819 A238
DATA2_REG_PHY_WRLVL_INIT_RATIO_0
Data Macro 2 Write Leveling Init Ratio
Data Macro 1 Data Pad Configuration
Data Macro 1 Delay Selection
Data Macro 2 Data Pad Configuration
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Table 8-27. DDR2/3 PHY Registers (continued)
DDR0 HEX
ADDRESS
DDR1 HEX
ADDRESS
ACRONYM
0x4819 8240
0x4819 A240
DATA2_REG_PHY_WRLVL_INIT_MODE_0
0x4819 8244
0x4819 A244
DATA2_REG_PHY_GATELVL_INIT_RATIO_0
Data Macro 2 DQS Gate Training Init Ratio
0x4819 824C
0x4819 A24C
DATA2_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 2 DQS Gate Training Init Mode
Ratio Selection
0x4819 8250
0x4819 A250
DATA2_REG_PHY_FIFO_WE_SLAVE_RATIO_0
Data Macro 2 DQS Gate Slave Ratio
0x4819 8268
0x4819 A268
DATA2_REG_PHY_WR_DATA_SLAVE_RATIO_0
Data Macro 2 Write Data Slave Ratio
0x4819 827C
0x4819 A27C
DATA2_REG_PHY_USE_RANK0_DELAYS
0x4819 8294
0x4819 A294
DATA3_IO_CONFIG_I_0
0x4819 8298
0x4819 A298
DATA3_IO_CONFIG_I_CLK_0
Data Macro 3 Data Strobe Pad Configuration
0x4819 829C
0x4819 A29C
DATA3_IO_CONFIG_SR_0
Data Macro 3 Data Slew Rate Configuration
0x4819 82A0
0x4819 A2A0
DATA3_IO_CONFIG_SR_CLK_0
Data Macro 3 Data Strobe Slew Rate
Configuration
0x4819 82B4
0x4819 A2B4
DATA3_REG_PHY_RD_DQS_SLAVE_RATIO_0
Data Macro 3 Read DQS Slave Ratio
REGISTER NAME
Data Macro 2 Write Leveling Init Mode Ratio
Selection
Data Macro 2 Delay Selection
Data Macro 3 Data Pad Configuration
0x4819 82C8
0x4819 A2C8
DATA3_REG_PHY_WR_DQS_SLAVE_RATIO_0
Data Macro 3 Write DQS Slave Ratio
0x4819 82DC
0x4819 A2DC
DATA3_REG_PHY_WRLVL_INIT_RATIO_0
Data Macro 3 Write Leveling Init Ratio
0x4819 82E4
0x4819 A2E4
DATA3_REG_PHY_WRLVL_INIT_MODE_0
Data Macro 3 Write Leveling Init Mode Ratio
Selection
0x4819 82E8
0x4819 A2E8
DATA3_REG_PHY_GATELVL_INIT_RATIO_0
Data Macro 3 DQS Gate Training Init Ratio
0x4819 82F0
0x4819 A2F0
DATA3_REG_PHY_GATELVL_INIT_MODE_0
Data Macro 3 DQS Gate Training Init Mode
Ratio Selection
0x4819 82F4
0x4819 A2F4
DATA3_REG_PHY_FIFO_WE_SLAVE_RATIO_0
Data Macro 3 DQS Gate Slave Ratio
0x4819 830C
0x4819 A30C
DATA3_REG_PHY_WR_DATA_SLAVE_RATIO_0
Data Macro 3 Write Data Slave Ratio
0x4819 8320
0x4819 A320
DATA3_REG_PHY_USE_RANK0_DELAYS
0x4819 8358
0x4819 A358
DDR_VTP_CTRL_0
8.3.5
Data Macro 3 Delay Selection
DDR VTP Control
DDR2/3 Memory Controller Electrical Data/Timing
Section 8.3.1, DDR2 Routing Specifications and Section 8.3.2, DDR3 Routing Specifications specify a
complete DDR2/3 interface solution for the device. TI has performed the simulation and system
characterization to ensure all DDR2/3 interface timings in this solution are met.
TI only supports board designs that follow the specifications outlined in the DDR2 Routing Specifications
and DDR3 Routing Specifications sections of this data sheet.
192
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8.4
8.4.1
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Emulation Features and Capability
Advanced Event Triggering (AET)
The device supports Advanced Event Triggering (AET). This capability can be used to debug complex
problems as well as understand performance characteristics of user applications. AET provides the
following capabilities:
• Hardware Program Breakpoints: specify addresses or address ranges that can generate events such
as halting the processor or triggering the trace capture.
• Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate
events such as halting the processor or triggering the trace capture.
• Counters: count the occurrence of an event or cycles for performance monitoring.
• State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to
precisely generate events for complex sequences.
For more information on AET, see the following documents:
• Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report
(literature number SPRA753)
• Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded
Microprocessor Systems application report (literature number SPRA387)
8.4.2
Trace
The device supports Trace at the Cortex™-A8 and System levels. Trace is a debug technology that
provides a detailed, historical account of application code execution, timing, and data accesses. Trace
collects, compresses, and exports debug information for analysis. The debug information can be exported
to the Embedded Trace Buffer (ETB), or to the 5-pin Trace Interface (system trace only). Trace works in
real-time and does not impact the execution of the system.
For more information on board design guidelines for Trace Advanced Emulation, see the Emulation and
Trace Headers Technical Reference Manual (literature number SPRU655).
8.4.3
IEEE 1149.1 JTAG
The JTAG (IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture)
interface is used for BSDL testing and emulation of the device. The TRST pin only needs to be released
when it is necessary to use a JTAG controller to debug the device or exercise the device's boundary scan
functionality. For maximum reliability, the device includes an internal pulldown (IPD) on the TRST pin to
ensure that TRST is always asserted upon power up and the device's internal emulation logic is always
properly initialized. JTAG controllers from Texas Instruments actively drive TRST high. However, some
third-party JTAG controllers may not drive TRST high but expect the use of a pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally
drive TRST high before attempting any emulation or boundary-scan operations.
The main JTAG features include:
• 32KB embedded trace buffer (ETB)
• 5-pin system trace interface for debug
• Supports Advanced Event Triggering (AET)
• All processors can be emulated via JTAG ports
• All functions on EMU pins of the device:
– EMU[1:0] - cross-triggering, boot mode (WIR), STM trace
– EMU[4:2] - STM trace only (single direction)
– EMU[2] - only valid pin to use as clock
Peripheral Information and Timings
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JTAG ID (JTAGID) Register Description
Table 8-28. JTAG ID Register (1)
(1)
(2)
HEX ADDRESS
ACRONYM
0x4814 0600
JTAGID
REGISTER NAME
JTAG Identification Register (2)
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Read-only. Provides the device 32-bit JTAG ID.
The JTAG ID register is a read-only register that identifies to the customer the JTAG/device ID. For this
device, the JTAG ID register resides at address location 0x4814 0600. The register hex value for the
device depends on the silicon revision being used. For more information, see the AM389x Sitara ARM
Processors Silicon Errata (literature number SPRZ327). For the actual register bit names and their
associated bit field descriptions, see Figure 8-40 and Table 8-29.
31
28 27
12 11
1
0
VARIANT (4bit)
PART NUMBER (16-bit)
MANUFACTURER (11-bit)
LSB
R-x
R-1011 1000 0001 1110
R-0000 0010 111
R-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 8-40. JTAG ID Register Description - 0x4814 0600
Table 8-29. JTAG ID Register Selection Bit Descriptions
Bit
Field
Description
31:28
VARIANT
Variant (4-bit) value. Device value: The value of this field depends on the silicon revision being used. For
more information, see the AM389x Sitara ARM Processors Silicon Errata (literature number SPRZ327).
27:12
PART NUMBER
Part Number (16-bit) value. Device value: 0xB81E
11:1
MANUFACTURER
Manufacturer (11-bit) value. Device value: 0x017
LSB
LSB. This bit is read as a 1 for this device.
0
8.4.3.2
JTAG Electrical Data/Timing
Table 8-30. Timing Requirements for IEEE 1149.1 JTAG
(see Figure 8-41)
NO.
MIN
MAX
UNIT
1
tc(TCK)
Cycle time, TCK
51.15
ns
1a
tw(TCKH)
Pulse duration, TCK high (40% of tc)
20.46
ns
1b
tw(TCKL)
Pulse duration, TCK low (40% of tc)
20.46
ns
3
tsu(TDI-TCK)
Input setup time, TDI valid to TCK high (20% of (tc * 0.5))
5.115
ns
3
tsu(TMS-TCK)
Input setup time, TMS valid to TCK high (20% of (tc * 0.5))
5.115
ns
th(TCK-TDI)
Input hold time, TDI valid from TCK high
10
ns
th(TCK-TMS)
Input hold time, TMS valid from TCK high
10
ns
4
Table 8-31. Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
(see Figure 8-41)
NO.
2
(1)
194
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
MIN
MAX
0
23.575 (1)
UNIT
ns
(0.5 * tc) - 2
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1
1a
1b
TCK
2
TDO
3
4
TDI/TMS
Figure 8-41. JTAG Timing
Table 8-32. Timing Requirements for IEEE 1149.1 JTAG With RTCK
(see Figure 8-41)
NO.
MIN
MAX
UNIT
1
tc(TCK)
Cycle time, TCK
51.15
ns
1a
tw(TCKH)
Pulse duration, TCK high (40% of tc)
20.46
ns
1b
tw(TCKL)
Pulse duration, TCK low (40% of tc)
20.46
ns
3
tsu(TDI-TCK)
Input setup time, TDI valid to TCK high (20% of (tc * 0.5))
5.115
ns
3
tsu(TMS-TCK)
Input setup time, TMS valid to TCK high (20% of (tc * 0.5))
5.115
ns
th(TCK-TDI)
Input hold time, TDI valid from TCK high
10
ns
th(TCK-TMS)
Input hold time, TMS valid from TCK high
10
ns
4
Table 8-33. Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
With RTCK
(see Figure 8-42)
NO.
PARAMETER
MIN
MAX
0
21
UNIT
5
td(TCK-RTCK)
Delay time, TCK to RTCK with no selected subpaths (that is,
ICEPick module is the only tap selected - when the ARM is in the
scan chain, the delay time is a function of the ARM functional
clock.)
6
tc(RTCK)
Cycle time, RTCK
51.15
ns
7
tw(RTCKH)
Pulse duration, RTCK high (40% of tc)
20.46
ns
8
tw(RTCKL)
Pulse duration, RTCK low (40% of tc)
20.46
ns
ns
5
TCK
6
7
8
RTCK
Figure 8-42. JTAG With RTCK Timing
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8.4.4
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IEEE 1149.7 cJTAG
Besides the standard (legacy) JTAG mode of operation, the target debug interface can also be switched to
a compressed JTAG (cJTAG) mode of operation, commonly referred to as IEEE1149.7 standard. An
IEEE1149.7 adapter module runs a 2-pin communication protocol on top of an IEEE1149.1 JTAG TAP.
The debug-IP logic serializes the IEEE1149.1 transactions, using a variety of compression formats, to
reduce the number of pins needed to implement a JTAG debug port. This device implements only a
subset of the IEEE1149.7 protocol; it supports Class 0/1 operation. On this device the cJTAG ID[7:0] is
tied to 0x00.
NOTE
The default setting of the scan port is IEEE 1149.1. A cJTAG emulator connected only to
TCLK and TMS can re-configure the port to cJTAG by scanning in a special command
sequence. For the scan sequence required to switch modes, see the IEEE1149.7
specification.
196
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8.5
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Enhanced Direct Memory Access (EDMA) Controller
The EDMA controller handles all data transfers between memories and the device slave peripherals on
the device. These data transfers include cache servicing, non-cacheable memory accesses, userprogrammed data transfers, and host accesses.
8.5.1
EDMA Channel Synchronization Events
The EDMA channel controller supports up to 64 channels that service peripherals and memory. Each
EDMA channel is mapped to a default EDMA synchronization event as shown in Table 8-34. By default,
each event uses the parameter entry that matches its event number. However, because the device
includes a channel mapping feature, each event may be mapped to any of 512 parameter table entries.
For more detailed information on the EDMA module and how EDMA events are enabled, captured,
processed, linked, chained, and cleared, etc., see the EDMA chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Table 8-34. EDMA Default Synchronization Events
EVENT NUMBER
DEFAULT EVENT NAME
0-7
-
DEFAULT EVENT DESCRIPTION
Unused
8
AXEVT0
McASP0 Transmit
9
AREVT0
McASP0 Receive
10
AXEVT1
McASP1 Transmit
11
AREVT1
McASP1 Receive
12
AXEVT2
McASP2 Transmit
13
AREVT2
McASP2 Receive
14
BXEVT
McBSP Transmit
15
BREVT
McBSP Receive
16
SPIXEVT0
SPI0 Transmit 0
17
SPIREVT0
SPI0 Receive 0
18
SPIXEVT1
SPI0 Transmit 1
19
SPIREVT1
SPI0 Receive 1
20
SPIXEVT2
SPI0 Transmit 2
21
SPIREVT2
SPI0 Receive 2
22
SPIXEVT3
SPI0 Transmit 3
23
SPIREVT3
SPI0 Receive 3
24
SDTXEVT
SD0 Transmit
25
SDRXEVT
SD0 Receive
26
UTXEVT0
UART0 Transmit
27
URXEVT0
UART0 Receive
28
UTXEVT1
UART1 Transmit
29
URXEVT1
UART1 Receive
30
UTXEVT2
UART2 Transmit
UART2 Receive
31
URXEVT2
32 - 47
-
Unused
48
TINT4
TIMER4
49
TINT5
TIMER5
50
TINT6
TIMER6
51
TINT7
TIMER7
52
GPMCEVT
GPMC
HDMI
53
HDMIEVT
54 - 57
-
58
I2CTXEVT0
Unused
I2C0 Transmit
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Table 8-34. EDMA Default Synchronization Events (continued)
8.5.2
EVENT NUMBER
DEFAULT EVENT NAME
59
I2CRXEVT0
DEFAULT EVENT DESCRIPTION
I2C0 Receive
60
I2CTXEVT1
I2C1 Transmit
61
I2CRXEVT1
I2C1 Receive
62 - 63
-
Unused
EDMA Peripheral Register Descriptions
Table 8-35. EDMA Channel Controller (EDMA TPCC) Control Registers
198
HEX ADDRESS
ACRONYM
0x4900 0000
PID
REGISTER NAME
Peripheral Identification
0x4900 0004
CCCFG
0x4900 0100 - 0x4900 01FC
DCHMAP0-63
0x4900 0200
QCHMAP0
QDMA Channel 0 Mapping
0x4900 0204
QCHMAP1
QDMA Channel 1 Mapping
0x4900 0208
QCHMAP2
QDMA Channel 2 Mapping
0x4900 020C
QCHMAP3
QDMA Channel 3 Mapping
0x4900 0210
QCHMAP4
QDMA Channel 4 Mapping
0x4900 0214
QCHMAP5
QDMA Channel 5 Mapping
0x4900 0218
QCHMAP6
QDMA Channel 6 Mapping
0x4900 021C
QCHMAP7
QDMA Channel 7 Mapping
0x4900 0240
DMAQNUM0
DMA Queue Number 0
0x4900 0244
DMAQNUM1
DMA Queue Number 1
0x4900 0248
DMAQNUM2
DMA Queue Number 2
0x4900 024C
DMAQNUM3
DMA Queue Number 3
0x4900 0250
DMAQNUM4
DMA Queue Number 4
0x4900 0254
DMAQNUM5
DMA Queue Number 5
0x4900 0258
DMAQNUM6
DMA Queue Number 6
0x4900 025C
DMAQNUM7
DMA Queue Number 7
0x4900 0260
QDMAQNUM
QDMA Queue Number
0x4900 0284
QUEPRI
Queue Priority
0x4900 0300
EMR
Event Missed
0x4900 0304
EMRH
Event Missed High
0x4900 0308
EMCR
Event Missed Clear
0x4900 030C
EMCRH
0x4900 0310
QEMR
0x4900 0314
QEMCR
QDMA Event Missed Clear
0x4900 0318
CCERR
EDMA3CC Error
0x4900 031C
CCERRCLR
0x4900 0320
EEVAL
Error Evaluate
0x4900 0340
DRAE0
DMA Region Access Enable for Region 0
0x4900 0344
DRAEH0
0x4900 0348
DRAE1
0x4900 034C
DRAEH1
0x4900 0350
DRAE2
0x4900 0354
DRAEH2
0x4900 0358
DRAE3
0x4900 035C
DRAEH3
EDMA3CC Configuration
DMA Channel 0-63 Mappings
Event Missed Clear High
QDMA Event Missed
EDMA3CC Error Clear
DMA Region Access Enable High for Region 0
DMA Region Access Enable for Region 1
DMA Region Access Enable High for Region 1
DMA Region Access Enable for Region 2
DMA Region Access Enable High for Region 2
DMA Region Access Enable for Region 3
DMA Region Access Enable High for Region 3
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Table 8-35. EDMA Channel Controller (EDMA TPCC) Control Registers (continued)
HEX ADDRESS
ACRONYM
0x4900 0360
DRAE4
0x4900 0364
DRAEH4
0x4900 0368
DRAE5
0x4900 036C
DRAEH5
0x4900 0370
DRAE6
0x4900 0374
DRAEH6
0x4900 0378
DRAE7
REGISTER NAME
DMA Region Access Enable for Region 4
DMA Region Access Enable High for Region 4
DMA Region Access Enable for Region 5
DMA Region Access Enable High for Region 5
DMA Region Access Enable for Region 6
DMA Region Access Enable High for Region 6
DMA Region Access Enable for Region 7
0x4900 037C
DRAEH7
DMA Region Access Enable High for Region 7
0x4900 0380 - 0x4900 039C
QRAE0-7
QDMA Region Access Enable for Region 0-7
0x4900 0400 - 0x4900 04FC
Q0E0-Q3E15
0x4900 0600 - 0x4900 060C
QSTAT0-3
Queue Status 0-3
0x4900 0620
QWMTHRA
Queue Watermark Threshold A
0x4900 0640
CCSTAT
EDMA3CC Status
0x4900 0800
MPFAR
Memory Protection Fault Address
0x4900 0804
MPFSR
Memory Protection Fault Status
0x4900 0808
MPFCR
Memory Protection Fault Command
0x4900 080C
MPPAG
Memory Protection Page Attribute Global
0x4900 0810 - 0x4900 082C
MPPA0-7
0x4900 1000
ER
0x4900 1004
ERH
Event High
0x4900 1008
ECR
Event Clear
0x4900 100C
ECRH
0x4900 1010
ESR
0x4900 1014
ESRH
Event Set High
Chained Event
Event Queue Entry Q0E0-Q3E15
Memory Protection Page Attribute 0-7
Event
Event Clear High
Event Set
0x4900 1018
CER
0x4900 101C
CERH
0x4900 1020
EER
0x4900 1024
EERH
Event Enable High
0x4900 1028
EECR
Event Enable Clear
0x4900 102C
EECRH
0x4900 1030
EESR
0x4900 1034
EESRH
0x4900 1038
SER
0x4900 103C
SERH
Secondary Event High
0x4900 1040
SECR
Secondary Event Clear
0x4900 1044
SECRH
0x4900 1050
IER
0x4900 1054
IERH
Interrupt Enable High
0x4900 1058
IECR
Interrupt Enable Clear
0x4900 105C
IECRH
0x4900 1060
IESR
0x4900 1064
IESRH
0x4900 1068
IPR
0x4900 106C
IPRH
Chained Event High
Event Enable
Event Enable Clear High
Event Enable Set
Event Enable Set High
Secondary Event
Secondary Event Clear High
Interrupt Enable
Interrupt Enable Clear High
Interrupt Enable Set
Interrupt Enable Set High
Interrupt Pending
Interrupt Pending High
0x4900 1070
ICR
0x4900 1074
ICRH
Interrupt Clear
Interrupt Clear High
0x4900 1078
IEVAL
Interrupt Evaluate
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Table 8-35. EDMA Channel Controller (EDMA TPCC) Control Registers (continued)
HEX ADDRESS
ACRONYM
0x4900 1080
QER
REGISTER NAME
QDMA Event
0x4900 1084
QEER
0x4900 1088
QEECR
QDMA Event Enable
QDMA Event Enable Clear
0x4900 108C
QEESR
QDMA Event Enable Set
0x4900 1090
QSER
QDMA Secondary Event
0x4900 1094
QSECR
QDMA Secondary Event Clear
Shadow Region 0 Channel Registers
0x4900 2000
ER
0x4900 2004
ERH
Event High
0x4900 2008
ECR
Event Clear
0x4900 200C
ECRH
Event Clear High
0x4900 2010
ESR
0x4900 2014
ESRH
Event Set High
0x4900 2018
CER
Chained Event
0x4900 201C
CERH
0x4900 2020
EER
0x4900 2024
EERH
Event Enable High
Event Enable Clear
0x4900 2028
EECR
0x4900 202C
EECRH
0x4900 2030
EESR
0x4900 2034
EESRH
Event Set
Chained Event High
Event Enable
Event Enable Clear High
Event Enable Set
Event Enable Set High
0x4900 2038
SER
0x4900 203C
SERH
Secondary Event High
0x4900 2040
SECR
Secondary Event Clear
0x4900 2044
SECRH
0x4900 2050
IER
0x4900 2054
IERH
Interrupt Enable High
Interrupt Enable Clear
0x4900 2058
IECR
0x4900 205C
IECRH
0x4900 2060
IESR
0x4900 2064
IESRH
0x4900 2068
IPR
0x4900 206C
IPRH
0x4900 2070
ICR
Secondary Event
Secondary Event Clear High
Interrupt Enable
Interrupt Enable Clear High
Interrupt Enable Set
Interrupt Enable Set High
Interrupt Pending
Interrupt Pending High
Interrupt Clear
0x4900 2074
ICRH
Interrupt Clear High
0x4900 2078
IEVAL
Interrupt Evaluate
0x4900 2080
QER
QDMA Event
0x4900 2084
QEER
0x4900 2088
QEECR
QDMA Event Enable Clear
0x4900 208C
QEESR
QDMA Event Enable Set
0x4900 2090
QSER
QDMA Secondary Event
QDMA Event Enable
0x4900 2094
QSECR
0x4900 2200 - 0x4900 2294
-
Shadow Region 1 Channels
0x4900 2400 - 0x4900 2494
-
Shadow Region 2 Channels
...
0x4900 2E00 - 0x4900 2E94
200
Event
QDMA Secondary Event Clear
...
-
Shadow Channels for MP Space 7
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Table 8-36. EDMA Transfer Controller (EDMA TPTC) Control Registers
TPTC0 HEX
ADDRESS
TPTC1 HEX
ADDRESS
TPTC2 HEX
ADDRESS
TPTC3 HEX
ADDRESS
0x4980 0000
0x4990 0000
0x49A0 0000
0x49B0 0000
PID
Peripheral Identification
0x4980 0004
0x4990 0004
0x49A0 0004
0x49B0 0004
TCCFG
EDMA3TC Configuration
0x4980 0100
0x4990 0100
0x49A0 0100
0x49B0 0100
TCSTAT
EDMA3TC Channel Status
0x4980 0120
0x4990 0120
0x49A0 0120
0x49B0 0120
ERRSTAT
Error Status
0x4980 0124
0x4990 0124
0x49A0 0124
0x49B0 0124
ERREN
Error Enable
ACRONYM
REGISTER NAME
0x4980 0128
0x4990 0128
0x49A0 0128
0x49B0 0128
ERRCLR
Error Clear
0x4980 012C
0x4990 012C
0x49A0 012C
0x49B0 012C
ERRDET
Error Details
0x4980 0130
0x4990 0130
0x49A0 0130
0x49B0 0130
ERRCMD
Error Interrupt Command
0x4980 0140
0x4990 0140
0x49A0 0140
0x49B0 0140
RDRATE
Read Rate Register
0x4980 0240
0x4990 0240
0x49A0 0240
0x49B0 0240
SAOPT
Source Active Options
0x4980 0244
0x4990 0244
0x49A0 0244
0x49B0 0244
SASRC
Source Active Source Address
0x4980 0248
0x4990 0248
0x49A0 0248
0x49B0 0248
SACNT
Source Active Count
0x4980 024C
0x4990 024C
0x49A0 024C
0x49B0 024C
SADST
Source Active Destination
Address
0x4980 0250
0x4990 0250
0x49A0 0250
0x49B0 0250
SABIDX
Source Active Source B-Index
0x4980 0254
0x4990 0254
0x49A0 0254
0x49B0 0254
SAMPPRXY
Source Active Memory
Protection Proxy
Source Active Count Reload
0x4980 0258
0x4990 0258
0x49A0 0258
0x49B0 0258
SACNTRLD
0x4980 025C
0x4990 025C
0x49A0 025C
0x49B0 025C
SASRCBREF
Source Active Source Address
B-Reference
0x4980 0260
0x4990 0260
0x49A0 0260
0x49B0 0260
SADSTBREF
Source Active Destination
Address B-Reference
0x4980 0280
0x4990 0280
0x49A0 0280
0x49B0 0280
DFCNTRLD
0x4980 0284
0x4990 0284
0x49A0 0284
0x49B0 0284
DFSRCBREF
Destination FIFO Set
Destination Address B
Reference
0x4980 0288
0x4990 0288
0x49A0 0288
0x49B0 0288
DFDSTBREF
Destination FIFO Set
Destination Address B
Reference
0x4980 0300
0x4990 0300
0x49A0 0300
0x49B0 0300
DFOPT0
Destination FIFO Options 0
0x4980 0304
0x4990 0304
0x49A0 0304
0x49B0 0304
DFSRC0
Destination FIFO Source
Address 0
0x4980 0308
0x4990 0308
0x49A0 0308
0x49B0 0308
DFCNT0
Destination FIFO Count 0
0x4980 030C
0x4990 030C
0x49A0 030C
0x49B0 030C
DFDST0
Destination FIFO Destination
Address 0
0x4980 0310
0x4990 0310
0x49A0 0310
0x49B0 0310
DFBIDX0
Destination FIFO BIDX 0
0x4980 0314
0x4990 0314
0x49A0 0314
0x49B0 0314
DFMPPRXY0
Destination FIFO Memory
Protection Proxy 0
0x4980 0340
0x4990 0340
0x49A0 0340
0x49B0 0340
DFOPT1
Destination FIFO Options 1
0x4980 0344
0x4990 0344
0x49A0 0344
0x49B0 0344
DFSRC1
Destination FIFO Source
Address 1
Destination FIFO Set Count
Reload
0x4980 0348
0x4990 0348
0x49A0 0348
0x49B0 0348
DFCNT1
Destination FIFO Count 1
0x4980 034C
0x4990 034C
0x49A0 034C
0x49B0 034C
DFDST1
Destination FIFO Destination
Address 1
0x4980 0350
0x4990 0350
0x49A0 0350
0x49B0 0350
DFBIDX1
Destination FIFO BIDX 1
0x4980 0354
0x4990 0354
0x49A0 0354
0x49B0 0354
DFMPPRXY1
Destination FIFO Memory
Protection Proxy 1
0x4980 0380
0x4990 0380
0x49A0 0380
0x49B0 0380
DFOPT2
Destination FIFO Options 2
0x4980 0384
0x4990 0384
0x49A0 0384
0x49B0 0384
DFSRC2
Destination FIFO Source
Address 2
0x4980 0388
0x4990 0388
0x49A0 0388
0x49B0 0388
DFCNT2
Destination FIFO Count 2
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Table 8-36. EDMA Transfer Controller (EDMA TPTC) Control Registers (continued)
202
TPTC0 HEX
ADDRESS
TPTC1 HEX
ADDRESS
TPTC2 HEX
ADDRESS
TPTC3 HEX
ADDRESS
ACRONYM
0x4980 038C
0x4990 038C
0x49A0 038C
0x49B0 038C
DFDST2
Destination FIFO Destination
Address 2
0x4980 0390
0x4990 0390
0x49A0 0390
0x49B0 0390
DFBIDX2
Destination FIFO BIDX 2
0x4980 0394
0x4990 0394
0x49A0 0394
0x49B0 0394
DFMPPRXY2
Destination FIFO Memory
Protection Proxy 2
0x4980 03C0
0x4990 03C0
0x49A0 03C0
0x49B0 03C0
DFOPT3
Destination FIFO Options 3
0x4980 03C4
0x4990 03C4
0x49A0 03C4
0x49B0 03C4
DFSRC3
Destination FIFO Source
Address 3
REGISTER NAME
0x4980 03C8
0x4990 03C8
0x49A0 03C8
0x49B0 03C8
DFCNT3
Destination FIFO Count 3
0x4980 03CC
0x4990 03CC
0x49A0 03CC
0x49B0 03CC
DFDST3
Destination FIFO Destination
Address 3
0x4980 03D0
0x4990 03D0
0x49A0 03D0
0x49B0 03D0
DFBIDX3
Destination FIFO BIDX 3
0x4980 03D4
0x4990 03D4
0x49A0 03D4
0x49B0 03D4
DFMPPRXY3
Destination FIFO Memory
Protection Proxy 3
Peripheral Information and Timings
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8.6
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Ethernet Media Access Controller (EMAC)
The device includes two Ethernet Media Access Controller (EMAC) modules which provide an efficient
interface between the device and the networked community. The EMAC supports 10Base-T (10
Mbits/second [Mbps]) and 100Base-TX (100 Mbps) in either half- or full-duplex mode, and 1000Base-T
(1000 Mbps) in full-duplex mode, with hardware flow control and quality-of-service (QOS) support. The
EMAC controls the flow of packet data from the device to an external PHY. A single MDIO interface is
pinned out to control the PHY configuration and status monitoring. Multiple external PHYs can be
controlled by the MDIO interface.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).
Deviating from this standard, the EMAC module does not use the transmit coding error signal, MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC
intentionally generates an incorrect checksum by inverting the frame CRC so that the transmitted frame is
detected as an error by the network. In addition, the EMAC I/Os operate at 3.3 V and are not compatible
with 2.5-V I/O signaling; therefore, only Ethernet PHYs with 3.3-V I/O interface should be used. The
EMAC module incorporates 8K bytes of internal RAM to hold EMAC buffer descriptors and contains the
necessary components to enable the EMAC to make efficient use of device memory and control device
interrupts.
The EMAC module on the device supports two interface modes: Media Independent Interface (MII) and
Gigabit Media Independent Interface (GMII). The MII and GMII interface modes are defined in the IEEE
802.3-2002 standard. The EMAC uses the same pins for the MII and GMII modes of operation. Only one
mode can be used at a time.
The MII and GMII modes-of-operation pins are as follows:
• MII:
EMAC[1:0]_TXCLK,
EMAC[1:0]_RXCLK,
EMAC[1:0]_TXD[3:0],
EMAC[1:0]_RXD[3:0],
EMAC[1:0]_TXEN, EMAC[1:0]_RXDV, EMAC[1:0]_RXER, EMAC[1:0]_COL, EMAC[1:0]_CRS,
MDIO_MCLK, and MDIO_MDIO.
• GMII:
EMAC[1:0]_GMTCLK,
EMAC[1:0]_TXCLK,
EMAC[1:0]_RXCLK,
EMAC[1:0]_TXD[7:0],
EMAC[1:0]_RXD[7:0], EMAC[1:0]_TXEN, EMAC[1:0]_RXDV, EMAC[1:0]_RXER, EMAC[1:0]_COL,
EMAC[1:0]_CRS, MDIO_MCLK, and MDIO_MDIO.
For more detailed information on the EMAC module, see the EMAC/MDIO chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7).
8.6.1
EMAC Peripheral Register Descriptions
Table 8-37. EMAC Control Registers
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
0x4A10 0000
0x4A12 0000
TXIDVER
REGISTER NAME
0x4A10 0004
0x4A12 0004
TXCONTROL
0x4A10 0008
0x4A12 0008
TXTEARDOWN
0x4A10 0010
0x4A12 0010
RXIDVER
0x4A10 0014
0x4A12 0014
RXCONTROL
0x4A10 0018
0x4A12 0018
RXTEARDOWN
Receive Teardown
0x4A10 0080
0x4A12 0080
TXINTSTATRAW
Transmit Interrupt Status (Unmasked)
0x4A10 0084
0x4A12 0084
TXINTSTATMASKED
0x4A10 0088
0x4A12 0088
TXINTMASKSET
0x4A10 008C
0x4A12 008C
TXINTMASKCLEAR
0x4A10 0090
0x4A12 0090
MACINVECTOR
0x4A10 0094
0x4A12 0094
MACEOIVECTOR
MAC End of Interrupt Vector
0x4A10 00A0
0x4A12 00A0
RXINTSTATRAW
Receive Interrupt Status (Unmasked)
Transmit Identification and Version
Transmit Control
Transmit Teardown
Receive Identification and Version
Receive Control
Transmit Interrupt Status (Masked)
Transmit Interrupt Mask Set
Transmit Interrupt Clear
MAC Input Vector
Peripheral Information and Timings
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Table 8-37. EMAC Control Registers (continued)
204
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
0x4A10 00A4
0x4A12 00A4
RXINTSTATMASKED
REGISTER NAME
Receive Interrupt Status (Masked)
0x4A10 00A8
0x4A12 00A8
RXINTMASKSET
0x4A10 00AC
0x4A12 00AC
RXINTMASKCLEAR
Receive Interrupt Mask Set
Receive Interrupt Mask Clear
0x4A10 00B0
0x4A12 00B0
MACINTSTATRAW
MAC Interrupt Status (Unmasked)
0x4A10 00B4
0x4A12 00B4
MACINTSTATMASKED
0x4A10 00B8
0x4A12 00B8
MACINTMASKSET
0x4A10 00BC
0x4A12 00BC
MACINTMASKCLEAR
0x4A10 0100
0x4A12 0100
RXMBPENABLE
Receive
Multicast/Broadcast/Promiscuous
Channel Enable
0x4A10 0104
0x4A12 0104
RXUNICASTSET
Receive Unicast Enable Set
MAC Interrupt Status (Masked)
MAC Interrupt Mask Set
MAC Interrupt Mask Clear
0x4A10 0108
0x4A12 0108
RXUNICASTCLEAR
0x4A10 010C
0x4A12 010C
RXMAXLEN
Receive Unicast Clear
0x4A10 0110
0x4A12 0110
RXBUFFEROFFSET
0x4A10 0114
0x4A12 0114
RXFILTERLOWTHRESH
Receive Filter Low Priority Frame
Threshold
0x4A10 0120
0x4A12 0120
RX0FLOWTHRESH
Receive Channel 0 Flow Control
Threshold
0x4A10 0124
0x4A12 0124
RX1FLOWTHRESH
Receive Channel 1 Flow Control
Threshold
0x4A10 0128
0x4A12 0128
RX2FLOWTHRESH
Receive Channel 2 Flow Control
Threshold
0x4A10 012C
0x4A12 012C
RX3FLOWTHRESH
Receive Channel 3 Flow Control
Threshold
0x4A10 0130
0x4A12 0130
RX4FLOWTHRESH
Receive Channel 4 Flow Control
Threshold
0x4A10 0134
0x4A12 0134
RX5FLOWTHRESH
Receive Channel 5 Flow Control
Threshold
0x4A10 0138
0x4A12 0138
RX6FLOWTHRESH
Receive Channel 6 Flow Control
Threshold
0x4A10 013C
0x4A12 013C
RX7FLOWTHRESH
Receive Channel 7 Flow Control
Threshold
0x4A10 0140
0x4A12 0140
RX0FREEBUFFER
Receive Channel 0 Free Buffer Count
0x4A10 0144
0x4A12 0144
RX1FREEBUFFER
Receive Channel 1 Free Buffer Count
0x4A10 0148
0x4A12 0148
RX2FREEBUFFER
Receive Channel 2 Free Buffer Count
0x4A10 014C
0x4A12 014C
RX3FREEBUFFER
Receive Channel 3 Free Buffer Count
0x4A10 0150
0x4A12 0150
RX4FREEBUFFER
Receive Channel 4 Free Buffer Count
0x4A10 0154
0x4A12 0154
RX5FREEBUFFER
Receive Channel 5 Free Buffer Count
0x4A10 0158
0x4A12 0158
RX6FREEBUFFER
Receive Channel 6 Free Buffer Count
0x4A10 015C
0x4A12 015C
RX7FREEBUFFER
Receive Channel 7 Free Buffer Count
0x4A10 0160
0x4A12 0160
MACCONTROL
MAC Control
0x4A10 0164
0x4A12 0164
MACSTATUS
MAC Status
Emulation Control
Receive Maximum Length
Receive Buffer Offset
0x4A10 0168
0x4A12 0168
EMCONTROL
0x4A10 016C
0x4A12 016C
FIFOCONTROL
0x4A10 0170
0x4A12 0170
MACCONFIG
MAC Configuration
0x4A10 0174
0x4A12 0174
SOFTRESET
Soft Reset
0x4A10 01D0
0x4A12 01D0
MACSRCADDRLO
MAC Source Address Low Bytes
0x4A10 01D4
0x4A12 01D4
MACSRCADDRHI
MAC Source Address High Bytes
0x4A10 01D8
0x4A12 01D8
MACHASH1
MAC Hash Address 1
0x4A10 01DC
0x4A12 01DC
MACHASH2
MAC Hash Address 2
0x4A10 01E0
0x4A12 01E0
BOFFTEST
Back Off Test
Peripheral Information and Timings
FIFO Control
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Table 8-37. EMAC Control Registers (continued)
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
0x4A10 01E4
0x4A12 01E4
TPACETEST
REGISTER NAME
Transmit Pacing Algorithm Test
0x4A10 01E8
0x4A12 01E8
RXPAUSE
Receive Pause Timer
0x4A10 01EC
0x4A12 01EC
TXPAUSE
Transmit Pause Timer
0x4A10 0200 - 0x4A10 02FC
0x4A12 0200 - 0x4A12 02FC
(see Table 8-38)
EMAC Network Statistics Registers
0x4A10 0500
0x4A12 0500
MACADDRLO
MAC Address Low Bytes, Used in
Receive Address Matching
0x4A10 0504
0x4A12 0504
MACADDRHI
MAC Address High Bytes, Used in
Receive Address Matching
0x4A10 0508
0x4A12 0508
MACINDEX
0x4A10 0600
0x4A12 0600
TX0HDP
Transmit Channel 0 DMA Head
Descriptor Pointer
0x4A10 0604
0x4A12 0604
TX1HDP
Transmit Channel 1 DMA Head
Descriptor Pointer
0x4A10 0608
0x4A12 0608
TX2HDP
Transmit Channel 2 DMA Head
Descriptor Pointer
0x4A10 060C
0x4A12 060C
TX3HDP
Transmit Channel 3 DMA Head
Descriptor Pointer
0x4A10 0610
0x4A12 0610
TX4HDP
Transmit Channel 4 DMA Head
Descriptor Pointer
0x4A10 0614
0x4A12 0614
TX5HDP
Transmit Channel 5 DMA Head
Descriptor Pointer
0x4A10 0618
0x4A12 0618
TX6HDP
Transmit Channel 6 DMA Head
Descriptor Pointer
0x4A10 061C
0x4A12 061C
TX7HDP
Transmit Channel 7 DMA Head
Descriptor Pointer
0x4A10 0620
0x4A12 0620
RX0HDP
Receive Channel 0 DMA Head
Descriptor Pointer
0x4A10 0624
0x4A12 0624
RX1HDP
Receive Channel 1 DMA Head
Descriptor Pointer
0x4A10 0628
0x4A12 0628
RX2HDP
Receive Channel 2 DMA Head
Descriptor Pointer
0x4A10 062C
0x4A12 062C
RX3HDP
Receive Channel 3 DMA Head
Descriptor Pointer
0x4A10 0630
0x4A12 0630
RX4HDP
Receive Channel 4 DMA Head
Descriptor Pointer
0x4A10 0634
0x4A12 0634
RX5HDP
Receive Channel 5 DMA Head
Descriptor Pointer
0x4A10 0638
0x4A12 0638
RX6HDP
Receive Channel 6 DMA Head
Descriptor Pointer
0x4A10 063C
0x4A12 063C
RX7HDP
Receive Channel 7 DMA Head
Descriptor Pointer
0x4A10 0640
0x4A12 0640
TX0CP
Transmit Channel 0 Completion
Pointer
0x4A10 0644
0x4A12 0644
TX1CP
Transmit Channel 1 Completion
Pointer
0x4A10 0648
0x4A12 0648
TX2CP
Transmit Channel 2 Completion
Pointer
0x4A10 064C
0x4A12 064C
TX3CP
Transmit Channel 3 Completion
Pointer
0x4A10 0650
0x4A12 0650
TX4CP
Transmit Channel 4 Completion
Pointer
0x4A10 0654
0x4A12 0654
TX5CP
Transmit Channel 5 Completion
Pointer
0x4A10 0658
0x4A12 0658
TX6CP
Transmit Channel 6 Completion
Pointer
MAC Index
Peripheral Information and Timings
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Table 8-37. EMAC Control Registers (continued)
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
0x4A10 065C
0x4A12 065C
TX7CP
REGISTER NAME
Transmit Channel 7 Completion
Pointer
0x4A10 0660
0x4A12 0660
RX0CP
Receive Channel 0 Completion Pointer
0x4A10 0664
0x4A12 0664
RX1CP
Receive Channel 1 Completion Pointer
0x4A10 0668
0x4A12 0668
RX2CP
Receive Channel 2 Completion Pointer
0x4A10 066C
0x4A12 066C
RX3CP
Receive Channel 3 Completion Pointer
0x4A10 0670
0x4A12 0670
RX4CP
Receive Channel 4 Completion Pointer
0x4A10 0674
0x4A12 0674
RX5CP
Receive Channel 5 Completion Pointer
0x4A10 0678
0x4A12 0678
RX6CP
Receive Channel 6 Completion Pointer
0x4A10 067C
0x4A12 067C
RX7CP
Receive Channel 7 Completion Pointer
Table 8-38. EMAC Network Statistics Registers
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
0x4A10 0200
0x4A12 0200
RXGOODFRAMES
Good Receive Frames
0x4A10 0204
0x4A12 0204
RXBCASTFRAMES
Broadcast Receive Frames
0x4A10 0208
0x4A12 0208
RXMCASTFRAMES
Multicast Receive Frames
0x4A10 020C
0x4A12 020C
RXPAUSEFRAMES
Pause Receive Frames
0x4A10 0210
0x4A12 0210
0x4A10 0214
0x4A12 0214
206
RXCRCERRORS
REGISTER NAME
Receive CRC Errors
RXALIGNCODEERRORS Receive Alignment/Code Errors
0x4A10 0218
0x4A12 0218
RXOVERSIZED
0x4A10 021C
0x4A12 021C
RXJABBER
Receive Oversized Frames
0x4A10 0220
0x4A12 0220
RXUNDERSIZED
Receive Undersized Frames
0x4A10 0224
0x4A12 0224
RXFRAGMENTS
Receive Frame Fragments
0x4A10 0228
0x4A12 0228
RXFILTERED
0x4A10 022C
0x4A12 022C
RXQOSFILTERED
0x4A10 0230
0x4A12 0230
RXOCTETS
Receive Octet Frames
0x4A10 0234
0x4A12 0234
TXGOODFRAMES
Good Transmit Frames
Receive Jabber Frames
Filtered Receive Frames
Receive QOS Filtered Frames
0x4A10 0238
0x4A12 0238
TXBCASTFRAMES
Broadcast Transmit Frames
0x4A10 023C
0x4A12 023C
TXMCASTFRAMES
Multicast Transmit Frames
0x4A10 0240
0x4A12 0240
TXPAUSEFRAMES
Pause Transmit Frames
0x4A10 0244
0x4A12 0244
TXDEFERRED
Deferred Transmit Frames
Transmit Collision Frames
0x4A10 0248
0x4A12 0248
TXCOLLISION
0x4A10 024C
0x4A12 024C
TXSINGLECOLL
0x4A10 0250
0x4A12 0250
TXMULTICOLL
0x4A10 0254
0x4A12 0254
TXEXCESSIVECOLL
0x4A10 0258
0x4A12 0258
TXLATECOLL
Transmit Late Collision Frames
0x4A10 025C
0x4A12 025C
TXUNDERRUN
Transmit Underrun Error
0x4A10 0260
0x4A12 0260
TXCARRIERSENSE
0x4A10 0264
0x4A12 0264
TXOCTETS
0x4A10 0268
0x4A12 0268
FRAME64
0x4A10 026C
0x4A12 026C
FRAME65T127
Transmit and Receive 65 to 127 Octet Frames
0x4A10 0270
0x4A12 0270
FRAME128T255
Transmit and Receive 128 to 255 Octet Frames
0x4A10 0274
0x4A12 0274
FRAME256T511
Transmit and Receive 256 to 511 Octet Frames
0x4A10 0278
0x4A12 0278
FRAME512T1023
Transmit and Receive 512 to 1023 Octet Frames
0x4A10 027C
0x4A12 027C
FRAME1024TUP
Transmit and Receive 1024 to RXMAXLEN Octet
Frames
0x4A10 0280
0x4A12 0280
NETOCTETS
0x4A10 0284
0x4A12 0284
RXSOFOVERRUNS
Transmit Single Collision Frames
Transmit Multiple Collision Frames
Transmit Excessive Collision Frames
Transmit Carrier Sense Errors
Transmit Octet Frames
Transmit and Receive 64 Octet Frames
Network Octet Frames
Receive FIFO or DMA Start of Frame Overruns
Peripheral Information and Timings
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Table 8-38. EMAC Network Statistics Registers (continued)
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
0x4A10 0288
0x4A12 0288
RXMOFOVERRUNS
REGISTER NAME
Receive FIFO or DMA Middle of Frame Overruns
0x4A10 028C
0x4A12 028C
RXDMAOVERRUNS
Receive DMA Overruns
Table 8-39. EMAC Control Module Registers
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
ACRONYM
REGISTER NAME
0x4A10 0900
0x4A12 0900
CMIDVER
Identification and Version
0x4A10 0904
0x4A12 0904
CMSOFTRESET
Software Reset
Emulation Control
0x4A10 0908
0x4A12 0908
CMEMCONTROL
0x4A10 090C
0x4A12 090C
CMINTCTRL
0x4A10 0910
0x4A12 0910
CMRXTHRESHINTEN
0x4A10 0914
0x4A12 0914
CMRXINTEN
Receive Interrupt Enable
Transmit Interrupt Enable
Interrupt Control
Receive Threshold Interrupt Enable
0x4A10 0918
0x4A12 0918
CMTXINTEN
0x4A10 091C
0x4A12 091C
CMMISCINTEN
0x4A10 0940
0x4A12 0940
CMRXTHRESHINTSTAT
0x4A10 0944
0x4A12 0944
CMRXINTSTAT
Receive Interrupt Status
0x4A10 0948
0x4A12 0948
CMTXINTSTAT
Transmit Interrupt Status
0x4A10 094C
0x4A12 094C
CMMISCINTSTAT
0x4A10 0970
0x4A12 0970
CMRXINTMAX
Receive Interrupts Per Millisecond
0x4A10 0974
0x4A12 0974
CMTXINTMAX
Transmit Interrupts Per Millisecond
Miscellaneous Interrupt Enable
Receive Threshold Interrupt Status
Miscellaneous Interrupt Status
Table 8-40. EMAC Descriptor Memory RAM
EMAC0 HEX ADDRESS
EMAC1 HEX ADDRESS
0x4A10 2000 - 0x4A10 3FFF
0x4A12 2000 - 0x4A12 3FFF
DESCRIPTION
EMAC Control Module Descriptor Memory
Peripheral Information and Timings
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EMAC Electrical Data/Timing
Table 8-41. Timing Requirements for EMAC[1:0]_RXCLK - [G]MII Operation
(see Figure 8-43)
1000 Mbps (1 Gbps)
(GMII Only)
NO.
MIN
1
tc(RXCLK)
Cycle time,
EMAC[1:0]_RXCLK
2
tw(RXCLKH)
3
4
MAX
100 Mbps
10 Mbps
UNIT
MIN
MAX
MIN
MAX
8
40
400
ns
Pulse duration,
EMAC1:0]_RXCLK high
2.8
14
140
ns
tw(RXCLKL)
Pulse duration,
EMAC[1:0]_RXCLK low
2.8
14
140
ns
tt(RXCLK)
Transition time,
EMAC[1:0]_RXCLK
1
3
3
ns
4
1
3
2
EMAC[1:0]_RXCLK
4
Figure 8-43. EMAC[1:0]_RXCLK Timing
Table 8-42. Timing Requirements for EMAC[1:0]_TXCLK - [G]MII Operation
(see Figure 8-44)
1000 Mbps (1 Gbps)
(GMII Only)
NO.
MIN
1
tc(TXCLK)
Cycle time,
EMAC[1:0]_TXCLK
2
tw(TXCLKH)
3
4
MAX
100 Mbps
10 Mbps
UNIT
MIN
MAX
MIN
MAX
8
40
400
ns
Pulse duration,
EMAC[1:0]_TXCLK high
2.8
14
140
ns
tw(TXCLKL)
Pulse duration,
EMAC[1:0]_TXCLK low
2.8
14
140
ns
tt(TXCLK)
Transition time,
EMAC[1:0]_TXCLK
1
3
3
ns
4
1
3
2
EMAC[1:0]_TXCLK
4
Figure 8-44. EMAC[1:0]_TXCLK Timing
208
Peripheral Information and Timings
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Table 8-43. Timing Requirements for EMAC [G]MII Receive 10/100/1000 Mbit/s
(see Figure 8-45)
1000 Mbps (1
Gbps)
NO.
MIN
100/10 Mbps
UNIT
MAX
MIN
MAX
tsu(RXD-RXCLK)
1
tsu(RXDV-RXCLK)
Setup time, receive selected signals valid before
EMAC[1:0]_RXCLK
2
8
ns
Hold time, receive selected signals valid after
EMAC[1:0]_RXCLK
0
8
ns
tsu(RXER-RXCLK)
th(RXCLK-RXD)
2
th(RXCLK-RXDV)
th(RXCLK-RXER)
1
2
EMAC[1:0]_RXCLK (input)
EMAC[1:0]_RXD7−EMAC[1:0]_RXD0,
EMAC[1:0]_RXDV, EMAC[1:0]_RXER (inputs)
Figure 8-45. EMAC Receive Timing
Table 8-44. Switching Characteristics Over Recommended Operating Conditions for EMAC [G]MII
Transmit 10/100 Mbits/s
(see Figure 8-46)
NO.
1
100/10 Mbps
PARAMETER
td(TXCLK-TXD)
td(TXCLK-TXEN)
Delay time, EMAC[1:0]_TXCLK to transmit selected signals valid
MIN
MAX
5
25
UNIT
ns
Table 8-45. Switching Characteristics Over Recommended Operating Conditions for EMAC [G]MII
Transmit 1000 Mbits/s
(see Figure 8-46)
NO.
1
1000 Mbps (1 Gbps)
PARAMETER
td(GMTCLK-TXD)
td(GMTCLK-TXEN)
Delay time, EMAC[1:0]_GMTCLK to transmit selected signals valid
MIN
MAX
0.5
5
UNIT
ns
1
EMAC[1:0]_TXCLK (input)
EMAC[1:0]_TXD7−EMAC[1:0]_TXD0,
EMAC[1:0]_TXEN (outputs)
Figure 8-46. EMAC Transmit Timing
Peripheral Information and Timings
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Management Data Input/Output (MDIO)
The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system.
The MDIO module implements the 802.3 serial management interface to interrogate and control Ethernet
PHY(s) using a shared two-wire bus. Host software uses the MDIO module to configure the autonegotiation parameters of each PHY attached to the EMAC, retrieve the negotiation results, and configure
required parameters in the EMAC module for correct operation. The module is designed to allow almost
transparent operation of the MDIO interface, with very little maintenance from the core processor. A single
MDIO interface is pinned out to control the PHY configuration and status monitoring. Multiple external
PHYs can be controlled by the MDIO interface.
For more detailed information on the MDIO peripheral, see the EMAC/MDIO chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7).
8.6.3.1
MDIO Peripheral Register Descriptions
Table 8-46. MDIO Registers
HEX ADDRESS
8.6.3.2
ACRONYM
REGISTER NAME
0x4A10 0800
VERSION
MDIO Version
0x4A10 0804
CONTROL
MDIO Control
0x4A10 0808
ALIVE
PHY Alive Status
0x4A10 080C
LINK
PHY Link Status
0x4A10 0810
LINKINTRAW
0x4A10 0814
LINKINTMASKED
0x4A10 0818
-
MDIO Link Status Change Interrupt (Unmasked)
MDIO Link Status Change Interrupt (Masked)
Reserved
0x4A10 081C
USERINTRAW
0x4A10 0820
USERINTMASKED
MDIO User Command Complete Interrupt (Unmasked)
MDIO User Command Complete Interrupt (Masked)
0x4A10 0824
USERINTMASKSET
MDIO User Command Complete Interrupt Mask Set
0x4A10 0828
USERINTMASKCLEAR
0x4A10 082C
-
MDIO User Command Complete Interrupt Mask Clear
0x4A10 0830 - 0x4A10 087C
USERACCESS0
MDIO User Access 0
0x4A10 0880
USERPHYSEL0
MDIO User PHY Select 0
0x4A10 0884
USERACCESS1
MDIO User Access 1
0x4A10 0888
USERPHYSEL1
MDIO User PHY Select 1
Reserved
MDIO Electrical Data/Timing
Table 8-47. Timing Requirements for MDIO Input
(see Figure 8-47)
NO.
1
MIN
MAX
UNIT
tc(MCLK)
Cycle time, MDIO_MCLK
400
ns
tw(MCLK)
Pulse duration, MDIO_MCLK high or low
180
ns
4
tsu(MDIO-MCLKH)
Setup time, MDIO_MDIO data input valid before MDIO_MCLK high
20
ns
5
th(MCLKH-MDIO)
Hold time, MDIO_MDIO data input valid after MDIO_MCLK high
0
ns
210
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1
MDIO_MCLK
4
5
MDIO_MDIO
(input)
Figure 8-47. MDIO Input Timing
Table 8-48. Switching Characteristics Over Recommended Operating Conditions for MDIO Output
(see Figure 8-48)
NO.
7
PARAMETER
td(MCLKL-MDIO)
MIN
Delay time, MDIO_MCLK low to MDIO_MDIO data output valid
MAX
UNIT
100
ns
1
MDIO_MCLK
7
MDIO_MDIO
(output)
Figure 8-48. MDIO Output Timing
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General-Purpose Input/Output (GPIO)
The GPIO peripheral provides general-purpose pins that can be configured as either inputs
When configured as an output, a write to an internal register controls the state driven on the
When configured as an input, the state of the input is detectable by reading the state of
register. In addition, the GPIO peripheral can produce CPU interrupts in different interrupt
modes. The GPIO peripheral provides generic connections to external devices.
or outputs.
output pin.
an internal
generation
The device contains two GPIO modules and each GPIO module is made up of 32 identical channels.
The device GPIO peripheral supports the following:
• Up to 64 3.3-V GPIO pins, GP0[31:0] and GP1[31:0] (the exact number available varies as a function
of the device configuration). Each channel can be configured to be used in the following applications:
– Data input/output
– Keyboard interface with a de-bouncing cell
– Synchronous interrupt generation (in active mode) upon the detection of external events (signal
transition(s) and/or signal level(s)).
• Synchronous interrupt requests from each channel are processed by two identical interrupt generation
sub-modules to be used independently by the ARM. Interrupts can be triggered by rising and/or falling
edge, specified for each interrupt-capable GPIO signal.
• Shared registers can be accessed through "Set & Clear" protocol. Software writes 1 to corresponding
bit position(s) to set or to clear GPIO signal(s). This allows multiple software processes to toggle GPIO
output signals without critical section protection (disable interrupts, program GPIO, re-enable interrupts,
to prevent context switching to another process during GPIO programming).
• Separate input/output registers.
• Output register in addition to set/clear so that, if preferred by software, some GPIO output signals can
be toggled by direct write to the output register(s).
• Output register, when read, reflects output drive status. This, in addition to the input register reflecting
pin status and open-drain I/O cell, allows wired logic to be implemented.
For more detailed information on GPIOs, see the GPIO chapter in the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
8.7.1
GPIO Peripheral Register Descriptions
Table 8-49. GPIO Registers
GPIO0 HEX ADDRESS
GPIO1 HEX ADDRESS
ACRONYM
0x4803 2000
0x4804 C000
GPIO_REVISION
0x4803 2010
0x4804 C010
GPIO_SYSCONFIG
0x4803 2020
0x4804 C020
GPIO_EOI
0x4803 2024
0x4804 C024
GPIO_IRQSTATUS_RAW_0
Status Raw for Interrupt 1
0x4803 2028
0x4804 C028
GPIO_IRQSTATUS_RAW_1
Status Raw for Interrupt 2
0x4803 202C
0x4804 C02C
GPIO_IRQSTATUS_0
Status for Interrupt 1
0x4803 2030
0x4804 C030
GPIO_IRQSTATUS_1
Status for Interrupt 2
0x4803 2034
0x4804 C034
GPIO_IRQSTATUS_SET_0
Enable Set for Interrupt 1
212
REGISTER NAME
GPIO Revision
System Configuration
End of Interrupt
0x4803 2038
0x4804 C038
GPIO_IRQSTATUS_SET_1
Enable Set for Interrupt 2
0x4803 203C
0x4804 C03C
GPIO_IRQSTATUS_CLR_0
Enable Clear for Interrupt 1
0x4803 2040
0x4804 C040
GPIO_IRQSTATUS_CLR_1
Enable Clear for Interrupt 2
0x4803 2044
0x4804 C044
GPIO_IRQWAKEN_0
Wakeup Enable for Interrupt 1
0x4803 2048
0x4804 C048
GPIO_IRQWAKEN_1
Wakeup Enable for Interrupt 2
0x4803 2114
0x4804 C114
GPIO_SYSSTATUS
System Status
0x4803 2130
0x4804 C130
GPIO_CTRL
Module Control
0x4803 2134
0x4804 C134
GPIO_OE
Output Enable
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Table 8-49. GPIO Registers (continued)
GPIO0 HEX ADDRESS
GPIO1 HEX ADDRESS
ACRONYM
0x4803 2138
0x4804 C138
GPIO_DATAIN
REGISTER NAME
0x4803 213C
0x4804 C13C
GPIO_DATAOUT
0x4803 2140
0x4804 C140
GPIO_LEVELDETECT0
Detect Low Level
0x4803 2144
0x4804 C144
GPIO_LEVELDETECT1
Detect High Level
Data Input
Data Output
0x4803 2148
0x4804 C148
GPIO_RISINGDETECT
Detect Rising Edge
0x4803 214C
0x4804 C14C
GPIO_FALLINGDETECT
Detect Falling Edge
0x4803 2150
0x4804 C150
GPIO_DEBOUNCENABLE
Debouncing Enable
0x4803 2154
0x4804 C154
GPIO_DEBOUNCINGTIME
Debouncing Value
0x4803 2190
0x4804 C190
GPIO_CLEARDATAOUT
Clear Data Output
0x4803 2194
0x4804 C194
GPIO_SETDATAOUT
Set Data Output
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GPIO Electrical Data/Timing
Table 8-50. Timing Requirements for GPIO Inputs
(see Figure 8-49)
NO.
MIN
MAX
UNIT
1
tw(GPIH)
Pulse duration, GP[x] input high
12P (1)
ns
2
tw(GPIL)
Pulse duration, GP[x] input low
12P (1)
ns
(1)
P = Module clock.
Table 8-51. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs
(see Figure 8-49)
NO.
PARAMETER
MIN
UNIT
ns
ns
3
tw(GPOH)
Pulse duration, GP[x] output high
36P-8
4
tw(GPOL)
Pulse duration, GP[x] output low
36P-8 (1)
(1)
MAX
(1)
P = Module clock.
2
GP[1:0][x]
input
1
4
GP[1:0][x]
output
3
Figure 8-49. GPIO Port Timing
214
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8.8
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
General-Purpose Memory Controller (GPMC) and Error Locator Module (ELM)
The GPMC is a device memory controller used to provide a glueless interface to external memory devices
such as NOR Flash, NAND Flash (with BCH and Hamming Error Code Detection for 8-bit or 16-bit NAND
Flash), SRAM, and Pseudo-SRAM. It includes flexible asynchronous protocol control for interface to
SRAM-like memories and custom logic (FPGA, CPLD, ASICs, etc.).
The first section of GPMC memory (0x0 - 0x00FF_FFFF) is reserved for BOOTROM. Accessible memory
starts at location 0x0100_0000.
Other supported features include:
• 8-/16-bit wide multiplexed address/data bus
• Up to 6 chip selects with up to 256M-byte address space per chip select pin
• Non-multiplexed address/data mode
• Pre-fetch and write posting engine associated with system DMA to get full performance from NAND
device with minimum impact on NOR/SRAM concurrent access.
The device also contains an Error Locator Module (ELM) which is used to extract error addresses from
syndrome polynomials generated using a BCH algorithm. Each of these polynomials gives a status of the
read operations for a 512 bytes block from a NAND flash and its associated BCH parity bits, plus
optionally spare area information. The ELM has the following features:
• 4-bit, 8-bit, and 16-bit per 512-byte block error location based on BCH algorithms
• Eight simultaneous processing contexts
• Page-based and continuous modes
• Interrupt generation on error location process completion
– When the full page has been processed in page mode
– For each syndrome polynomial in continuous mode.
For more detailed information on the GPMC, see the GPMC chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
8.8.1
GPMC and ELM Peripheral Register Descriptions
Table 8-52. GPMC Registers (1) (2)
HEX ADDRESS
(1)
(2)
ACRONYM
REGISTER NAME
0x5000 0000
GPMC_REVISION
0x5000 0010
GPMC_SYSCONFIG
GPIO Revision
System Configuration
0x5000 0014
GPMC_SYSSTATUS
System Status
0x5000 0018
GPMC_IRQSTATUS
Status for Interrupt
0x5000 001C
GPMC_IRQENABLE
Interrupt Enable
0x5000 0040
GPMC_TIMEOUT_CONTROL
0x5000 0044
GPMC_ERR_ADDRESS
0x5000 0048
GPMC_ERR_TYPE
0x5000 0050
GPMC_CONFIG
GPMC Global Configuration
0x5000 0054
GPMC_STATUS
GPMC Global Status
0x5000 0060 + (0x0000 0030 * i)
GPMC_CONFIG1_0 GPMC_CONFIG1_5
Parameter Configuration 1_0-5
0x5000 0064 + (0x0000 0030 * i)
GPMC_CONFIG2_0 GPMC_CONFIG2_5
Parameter Configuration 2_0-5
0x5000 0068 + (0x0000 0030 * i)
GPMC_CONFIG3_0 GPMC_CONFIG3_5
Parameter Configuration 3_0-5
0x5000 006C + (0x0000 0030 * i)
GPMC_CONFIG4_0 GPMC_CONFIG4_5
Parameter Configuration 4_0-5
Timeout Counter Start Value
Error Address
Error Type
i = 0 to 5.
j = 0 to 8.
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Table 8-52. GPMC Registers(1)(2) (continued)
HEX ADDRESS
ACRONYM
0x5000 0070 + (0x0000 0030 * i)
GPMC_CONFIG5_0 GPMC_CONFIG5_5
REGISTER NAME
Parameter Configuration 5_0-5
0x5000 0074 + (0x0000 0030 * i)
GPMC_CONFIG6_0 GPMC_CONFIG6_5
Parameter Configuration 6_0-5
0x5000 0078 + (0x0000 0030 * i)
GPMC_CONFIG7_0 GPMC_CONFIG7_5
Parameter Configuration 7_0-5
0x5000 007C + (0x0000 0030 * i)
GPMC_NAND_COMMAND_0 GPMC_NAND_COMMAND_5
NAND Command 0-5
0x5000 0080 + (0x0000 0030 * i)
GPMC_NAND_ADDRESS_0 GPMC_NAND_ADDRESS_5
NAND Address 0-5
0x5000 0084 + (0x0000 0030 * i)
GPMC_NAND_DATA_0 GPMC_NAND_DATA_5
0x5000 01E0
GPMC_PREFETCH_CONFIG1
Prefetch Configuration 1
0x5000 01E4
GPMC_PREFETCH_CONFIG2
Prefetch Configuration 2
0x5000 01EC
GPMC_PREFETCH_CONTROL
Prefetch Control
0x5000 01F0
GPMC_PREFETCH_STATUS
Prefetch Status
0x5000 01F4
GPMC_ECC_CONFIG
0x5000 01F8
GPMC_ECC_CONTROL
NAND Data 0-5
ECC Configuration
ECC Control
0x5000 01FC
GPMC_ECC_SIZE_CONFIG
0x5000 0200 + (0x0000 0004 * j)
GPMC_ECC0_RESULT GPMC_ECC8_RESULT
ECC Size Configuration
0x5000 0240 + (0x0000 0010 * i)
GPMC_BCH_RESULT0_0 GPMC_BCH_RESULT0_5
BCH Result 0_0-5
0x5000 0244 + (0x0000 0010 * i)
GPMC_BCH_RESULT1_0 GPMC_BCH_RESULT1_5
BCH Result 1_0-5
0x5000 0248 + (0x0000 0010 * i)
GPMC_BCH_RESULT2_0 GPMC_BCH_RESULT2_5
BCH Result 2_0-5
0x5000 024C + (0x0000 0010 * i)
GPMC_BCH_RESULT3_0 GPMC_BCH_RESULT3_5
BCH Result 3_0-5
0x5000 0300 + (0x0000 0010 * i)
GPMC_BCH_RESULT4_0 GPMC_BCH_RESULT4_5
BCH Result 4_0-5
0x5000 0304 + (0x0000 0010 * i)
GPMC_BCH_RESULT5_0 GPMC_BCH_RESULT5_5
BCH Result 5_0-5
0x5000 0308 + (0x0000 0010 * i)
GPMC_BCH_RESULT6_0 GPMC_BCH_RESULT6_5
BCH Result 6_0-5
0x5000 02D0
GPMC_BCH_SWDATA
ECC0-8 Result
BCH Data
Table 8-53. ELM Registers (1)
(1)
216
HEX ADDRESS
ACRONYM
0x4808 0000
ELM_REVISION
REGISTER NAME
Revision
0x4808 0010
ELM_SYSCONFIG
Configuration
0x4808 0014
ELM_SYSSTATUS
Status
0x4808 0018
ELM_IRQSTATUS
Interrupt status
0x4808 001C
ELM_IRQENABLE
Interrupt enable
0x4808 0020
ELM_LOCATION_CONFIG
0x4808 0080
ELM_PAGE_CTRL
0x4808 0400 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_0_i
Input syndrome polynomial bits 0 to 31
0x4808 0404 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_1_i
Input syndrome polynomial bits 32 to 63
0x4808 0408 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_2_i
Input syndrome polynomial bits 64 to 95
0x4808 040C + (0x40 * i)
ELM_SYNDROME_FRAGMENT_3_i
Input syndrome polynomial bits 96 to 127
0x4808 0410 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_4_i
Input syndrome polynomial bits 128 to 159
ECC algorithm parameters
Page definition
i = 0 to 7.
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Table 8-53. ELM Registers(1) (continued)
HEX ADDRESS
ACRONYM
0x4808 0414 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_5_i
REGISTER NAME
Input syndrome polynomial bits 160 to 191
Input syndrome polynomial bits 192 to 207
0x4808 0418 + (0x40 * i)
ELM_SYNDROME_FRAGMENT_6_i
0x4808 0800 + (0x100 * i)
ELM_LOCATION_STATUS_i
0x4808 0880 + (0x100 * i)
ELM_ERROR_LOCATION_0_i
Error location
0x4808 0884 + (0x100 * i)
ELM_ERROR_LOCATION_1_i
Error location
0x4808 0888 + (0x100 * i)
ELM_ERROR_LOCATION_2_i
Error location
0x4808 088C + (0x100 * i)
ELM_ERROR_LOCATION_3_i
Error location
0x4808 0890 + (0x100 * i)
ELM_ERROR_LOCATION_4_i
Error location
0x4808 0894 + (0x100 * i)
ELM_ERROR_LOCATION_5_i
Error location
0x4808 0898 + (0x100 * i)
ELM_ERROR_LOCATION_6_i
Error location
0x4808 089C + (0x100 * i)
ELM_ERROR_LOCATION_7_i
Error location
0x4808 08A0 + (0x100 * i)
ELM_ERROR_LOCATION_8_i
Error location
0x4808 08A4 + (0x100 * i)
ELM_ERROR_LOCATION_9_i
Error location
0x4808 08A8 + (0x100 * i)
ELM_ERROR_LOCATION_10_i
Error location
0x4808 08AC + (0x100 * i)
ELM_ERROR_LOCATION_11_i
Error location
0x4808 08B0 + (0x100 * i)
ELM_ERROR_LOCATION_12_i
Error location
0x4808 08B4 + (0x100 * i)
ELM_ERROR_LOCATION_13_i
Error location
0x4808 08B8 + (0x100 * i)
ELM_ERROR_LOCATION_14_i
Error location
0x4808 08BC + (0x100 * i)
ELM_ERROR_LOCATION_15_i
Error location
Exit status
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GPMC Electrical Data/Timing
8.8.2.1
GPMC/NOR Flash Interface Synchronous Mode Timing
Table 8-54. Timing Requirements for GPMC/NOR Flash Interface - Synchronous Mode
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
MIN
MAX
UNIT
13
tsu(DV-CLKH)
Setup time, read GPMC_D[15:0] valid before GPMC_CLK high
3.2
ns
14
th(CLKH-DV)
Hold time, read GPMC_D[15:0] valid after GPMC_CLK high
2.5
ns
22
tsu(WAITV-CLKH)
Setup time, GPMC_WAIT valid before GPMC_CLK high
3.2
ns
23
th(CLKH-WAITV)
Hold time, GPMC_WAIT valid after GPMC_CLK high
2.5
ns
Table 8-55. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Synchronous Mode
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
1
2
3
4
tc(CLK)
PARAMETER
MIN
Cycle time, output clock GPMC_CLK period
16 (1)
MAX
UNIT
ns
(2)
tw(CLKH)
Pulse duration, output clock GPMC_CLK high
0.5P
tw(CLKL)
Pulse duration, output clock GPMC_CLK low
0.5P (2)
td(CLKH-nCSV)
Delay time, GPMC_CLK rising edge to GPMC_CS[x] transition
ns
F - 2.2 (3)
F + 4.5 (3)
ns
E - 2.2
(4)
E + 4.5
(4)
ns
B - 4.5
(5)
B + 2.3
(5)
ns
td(CLKH-nCSIV)
Delay time, GPMC_CLK rising edge to GPMC_CS[x] invalid
5
td(ADDV-CLK)
Delay time, GPMC_A[27:0] address bus valid to GPMC_CLK first
edge
6
td(CLKH-ADDIV)
Delay time, GPMC_CLK rising edge to GPMC_A[27:0] GPMC
address bus invalid
7
td(nBEV-CLK)
Delay time, GPMC_BE0_CLE, GPMC_BE1 valid to GPMC_CLK
first edge
B - 1.9 (5)
B + 2.3 (5)
ns
8
td(CLKH-nBEIV)
Delay time, GPMC_CLK rising edge to GPMC_BE0_CLE,
GPMC_BE1 invalid
D - 2.3 (6)
D + 1.9 (6)
ns
(1)
(2)
(3)
(4)
(5)
(6)
218
-2.3
ns
Sync mode = 62.5 MHz; Async mode = 125 MHz.
P = GPMC_CLK period.
For nCS falling edge (CS activated):
• For GpmcFCLKDivider = 0:
F = 0.5 * CSExtraDelay * GPMC_FCLK
• For GpmcFCLKDivider = 1:
F = 0.5 * CSExtraDelay * GPMC_FCLK if (ClkActivationTime and CSOnTime are odd) or (ClkActivationTime and CSOnTime are
even)
F = (1 + 0.5 * CSExtraDelay) * GPMC_FCLK otherwise
• For GpmcFCLKDivider = 2:
F = 0.5 * CSExtraDelay * GPMC_FCLK if ((CSOnTime - ClkActivationTime) is a multiple of 3)
F = (1 + 0.5 * CSExtraDelay) * GPMC_FCLK if ((CSOnTime - ClkActivationTime - 1) is a multiple of 3)
F = (2 + 0.5 * CSExtraDelay) * GPMC_FCLK if ((CSOnTime - ClkActivationTime - 2) is a multiple of 3)
For single read: E = (CSRdOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: E = (CSRdOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: E = (CSWrOffTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
B = ClkActivationTime * GPMC_FCLK
For single read: D = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: D = (RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: D = (WrCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
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Table 8-55. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Synchronous Mode (continued)
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
PARAMETER
MIN
MAX
(7)
(7)
ns
9
td(CLKH-nADV)
Delay time, GPMC_CLK rising edge to GPMC_ADV_ALE transition
G - 2.3
10
td(CLKH-nADVIV)
Delay time, GPMC_CLK rising edge to GPMC_ADV_ALE invalid
D - 2.3 (6)
D + 4.5 (6)
ns
11
td(CLKH-nOE)
Delay time, GPMC_CLK rising edge to GPMC_OE_RE transition
H - 2.3 (8)
H + 3.5 (8)
ns
(4)
(4)
ns
12
(7)
(8)
td(CLKH-nOEIV)
Delay time, GPMC_CLK rising edge to GPMC_OE_RE invalid
E - 2.3
G + 4.5
UNIT
E + 3.5
For ADV falling edge (ADV activated):
• Case GpmcFCLKDivider = 0:
G = 0.5 * ADVExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVOnTime are odd) or (ClkActivationTime and ADVOnTime are
even)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVOnTime - ClkActivationTime) is a multiple of 3)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVOnTime - ClkActivationTime - 1) is a multiple of 3)
G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVOnTime - ClkActivationTime - 2) is a multiple of 3)
For ADV rising edge (ADV deactivated) in Reading mode:
• Case GpmcFCLKDivider = 0:
G = 0.5 * ADVExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVRdOffTime are odd) or (ClkActivationTime and
ADVRdOffTime are even)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime) is a multiple of 3)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime - 1) is a multiple of 3)
G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVRdOffTime - ClkActivationTime - 2) is a multiple of 3)
For ADV rising edge (ADV deactivated) in Writing mode:
• Case GpmcFCLKDivider = 0:
G = 0.5 * ADVExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if (ClkActivationTime and ADVWrOffTime are odd) or (ClkActivationTime and
ADVWrOffTime are even)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
G = 0.5 * ADVExtraDelay * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime) is a multiple of 3)
G = (1 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime - 1) is a multiple of 3)
G = (2 + 0.5 * ADVExtraDelay) * GPMC_FCLK if ((ADVWrOffTime - ClkActivationTime - 2) is a multiple of 3)
For OE falling edge (OE activated) / IO DIR rising edge (IN direction) :
• Case GpmcFCLKDivider = 0:
H = 0.5 * OEExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
H = 0.5 * OEExtraDelay * GPMC_FCLK if (ClkActivationTime and OEOnTime are odd) or (ClkActivationTime and OEOnTime are
even)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
H = 0.5 * OEExtraDelay * GPMC_FCLK if ((OEOnTime - ClkActivationTime) is a multiple of 3)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOnTime - ClkActivationTime - 1) is a multiple of 3)
H = (2 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOnTime - ClkActivationTime - 2) is a multiple of 3)
For OE rising edge (OE deactivated):
• Case GpmcFCLKDivider = 0:
H = 0.5 * OEExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
H = 0.5 * OEExtraDelay * GPMC_FCLK if (ClkActivationTime and OEOffTime are odd) or (ClkActivationTime and OEOffTime are
even)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
H = 0.5 * OEExtraDelay * GPMC_FCLK if ((OEOffTime - ClkActivationTime) is a multiple of 3)
H = (1 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOffTime - ClkActivationTime - 1) is a multiple of 3)
H = (2 + 0.5 * OEExtraDelay) * GPMC_FCLK if ((OEOffTime - ClkActivationTime - 2) is a multiple of 3)
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Table 8-55. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Synchronous Mode (continued)
(see Figure 8-50, Figure 8-51, Figure 8-52, Figure 8-53, Figure 8-54, Figure 8-55)
NO.
15
PARAMETER
MIN
MAX
(9)
(9)
ns
(10)
ns
J + 1.9 (10)
ns
td(CLKH-nWE)
Delay time, GPMC_CLK rising edge to GPMC_WE transition
16
td(CLKH-Data)
Delay time, GPMC_CLK rising edge to GPMC_D[15:0] data bus
transition
I - 2.3
J - 2.3
18
td(CLKH-nBE)
Delay time, GPMC_CLK rising edge to GPMC_BE0_CLE,
GPMC_BE1 transition
J - 2.3 (10)
(10)
ns
ns
tw(nCSV)
Pulse duration, GPMC_CS[x] low
A
20
tw(nBEV)
Pulse duration, GPMC_BE0_CLE, GPMC_BE1 low
C (12)
tw(nADVV)
Pulse duration, GPMC_ADV_ALE low
24
td(CLKH-DIR)
Delay time, GPMC_CLK rising edge to GPMC_DIR high (IN
direction)
25
td(CLKH-DIRIV)
Delay time, GPCM_CLK rising edge to GPMC_DIR low (OUT
direction)
(9)
(10)
(11)
(12)
(13)
(14)
220
K
J + 1.9
(11)
19
21
I + 4.5
UNIT
(13)
H - 2.3
(8)
M - 2.3 (14)
ns
(8)
ns
M + 4.5 (14)
ns
H + 4.5
For WE falling edge (WE activated):
• Case GpmcFCLKDivider = 0:
I = 0.5 * WEExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
I = 0.5 * WEExtraDelay * GPMC_FCLK if (ClkActivationTime and WEOnTime are odd) or (ClkActivationTime and WEOnTime are
even)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
I = 0.5 * WEExtraDelay * GPMC_FCLK if ((WEOnTime - ClkActivationTime) is a multiple of 3)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOnTime - ClkActivationTime - 1) is a multiple of 3)
I = (2 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOnTime - ClkActivationTime - 2) is a multiple of 3)
For WE rising edge (WE deactivated):
• Case GpmcFCLKDivider = 0:
I = 0.5 * WEExtraDelay * GPMC_FCLK
• Case GpmcFCLKDivider = 1:
I = 0.5 * WEExtraDelay * GPMC_FCLK if (ClkActivationTime and WEOffTime are odd) or (ClkActivationTime and WEOffTime are
even)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK otherwise
• Case GpmcFCLKDivider = 2:
I = 0.5 * WEExtraDelay * GPMC_FCLK if ((WEOffTime - ClkActivationTime) is a multiple of 3)
I = (1 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOffTime - ClkActivationTime - 1) is a multiple of 3)
I = (2 + 0.5 * WEExtraDelay) * GPMC_FCLK if ((WEOffTime - ClkActivationTime - 2) is a multiple of 3)
J = GPMC_FCLK period.
For single read: A = (CSRdOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK period
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK period [n
= page burst access number]
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK period [n
= page burst access number]
For single read: C = RdCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: C = (RdCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK [n = page burst access
number]
For Burst write: C = (WrCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK [n = page burst
access number]
For read: K = (ADVRdOffTime - ADVOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For write: K = (ADVWrOffTime - ADVOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
M = ( RdCycleTime - AccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK.
Parameter M expression is given as one example of GPMC programming. The IO DIR signal goes from IN to OUT after both
RdCycleTime and BusTurnAround completion. Behavior of the IO direction signal depends on the kind of successive read/write
accesses performed to the memory and multiplexed or non-multiplexed memory addressing scheme, whether the bus keeping feature is
enabled or not. The IO DIR behavior is automatically handled by the GPMC controller.
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2
2
1
GPMC_CLK
3
4
19
GPMC_CS[x]
5
GPMC_A[27:0]
Address
7
8
20
GPMC_BE1
7
8
20
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
11
12
GPMC_OE
14
13
GPMC_D[15:0]
D0
23
22
GPMC_WAIT
24
GPMC_DIR
OUT
25
IN
OUT
Figure 8-50. GPMC Non-Multiplexed NOR Flash - Synchronous Single Read (GPMCFCLKDIVIDER = 0)
Peripheral Information and Timings
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2
1
2
GPMC_CLK
3
4
19
GPMC_CS[x]
5
GPMC_A[27:0]
Address
8
7
20
Valid
GPMC_BE1
8
7
20
Valid
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
11
12
GPMC_OE
13
14
D0
GPMC_D[15:0]
23
13
D1
D3
D2
22
GPMC_WAIT
24
25
OUT
GPMC_DIR
OUT
IN
Figure 8-51. GPMC Non-Multiplexed NOR Flash - 4x16-bit Synchronous Burst Read
(GPMCFCLKDIVIDER = 0)
2
2
1
GPMC_CLK
3
4
19
GPMC_CS[x]
5
GPMC_A[27:0]
Address
7
18
18
18
GPMC_BE1
7
18
18
18
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
15
15
GPMC_WE
16
16
GPMC_D[15:0]
D1
D0
23
16
D2
D3
22
GPMC_WAIT
GPMC_DIR
OUT
Figure 8-52. GPMC Non-Multiplexed NOR Flash - Synchronous Burst Write (GPMCFCLKDIVIDER = 0)
222
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2
2
1
GPMC_CLK
4
3
19
GPMC_CS[x]
5
GPMC_A[27:16]
Address (MSB)
8
7
20
GPMC_BE1
8
7
20
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
11
12
GPMC_OE
14
6
5
GPMC_D[15:0]
13
Address (LSB)
D0
23
22
GPMC_WAIT
24
GPMC_DIR
OUT
25
IN
OUT
Figure 8-53. GPMC Multiplexed NOR Flash - Synchronous Single Read (GPMCFCLKDIVIDER = 0)
Peripheral Information and Timings
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2
1
2
GPMC_CLK
3
4
19
GPMC_CS[x]
5
Address (MSB)
GPMC_A[27:16]
8
7
20
Valid
GPMC_BE1
8
7
20
Valid
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
11
12
GPMC_OE
13
6
5
14
D0
Address (LSB)
GPMC_D[15:0]
23
13
D1
D3
D2
22
GPMC_WAIT
24
25
OUT
GPMC_DIR
OUT
IN
Figure 8-54. GPMC Multiplexed NOR Flash - 4x16-bit Synchronous Burst Read (GPMCFCLKDIVIDER = 0)
2
2
1
GPMC_CLK
3
4
19
GPMC_CS[x]
5
Address (MSB)
GPMC_A[27:16]
7
18
18
18
GPMC_BE1
7
18
18
18
GPMC_BE0_CLE
9
9
10
21
GPMC_ADV_ALE
15
15
GPMC_WE
16
16
GPMC_D[15:0]
Address (LSB)
D1
D0
23
16
D2
D3
22
GPMC_WAIT
GPMC_DIR
OUT
Figure 8-55. GPMC Multiplexed NOR Flash - Synchronous Burst Write (GPMCFCLKDIVIDER = 0)
224
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8.8.2.2
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
GPMC/NOR Flash Interface Asynchronous Mode Timing
Table 8-56. GPMC/NOR Flash Interface Asynchronous Mode Timing - Internal Parameters
NO.
MIN
1
Max. output data generation delay from internal functional clock
2
Max. input data capture delay by internal functional clock
3
MAX
UNIT
6.5
ns
4
ns
Max. chip select generation delay from internal functional clock
6.5
ns
4
Max. address generation delay from internal functional clock
6.5
ns
5
Max. address valid generation delay from internal functional clock
6.5
ns
6
Max. byte enable generation delay from internal functional clock
6.5
ns
7
Max. output enable generation delay from internal functional clock
6.5
ns
8
Max. write enable generation delay from internal functional clock
6.5
ns
9
Max. functional clock skew
100
ps
Table 8-57. Timing Requirements for GPMC/NOR Flash Interface - Asynchronous Mode
(see Figure 8-56, Figure 8-57, Figure 8-58, Figure 8-60)
NO.
MIN
MAX
UNIT
cycles
tacc(DAT)
Data maximum access time (GPMC_FCLK cycles)
H
(1)
21
tacc1-pgmode(DAT)
Page mode successive data maximum access time (GPMC_FCLK
cycles)
P
(2)
cycles
22
tacc2-pgmode(DAT)
Page mode first data maximum access time (GPMC_FCLK cycles)
H (1)
cycles
6
(1)
(2)
H = AccessTime * (TimeParaGranularity + 1)
P = PageBurstAccessTime * (TimeParaGranularity + 1).
Table 8-58. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Asynchronous Mode
(see Figure 8-56, Figure 8-57, Figure 8-58, Figure 8-59, Figure 8-60, Figure 8-61)
NO.
PARAMETER
MIN
Pulse duration, GPMC_BE0_CLE, GPMC_BE1 valid time
N
tw(nCSV)
Pulse duration, GPMC_CS[x] low
A (2)
ns
4
td(nCSV-nADVIV)
Delay time, GPMC_CS[x] valid to GPMC_NADV_ALE invalid
B - 0.2 (3)
B + 2.0 (3)
ns
5
td(nCSV-nOEIV)
Delay time, GPMC_CS[x] valid to GPMC_OE_RE invalid (single
read)
C - 0.2 (4)
C + 2.0 (4)
ns
(5)
(5)
ns
td(AV-nCSV)
Delay time, address bus valid to GPMC_CS[x] valid
J - 0.2
td(nBEV-nCSV)
Delay time, GPMC_BE0_CLE, GPMC_BE1 valid to GPMC_CS[x]
valid
J - 0.2 (5)
J + 2.0 (5)
ns
(6)
(6)
ns
L + 2.0 (7)
ns
13
td(nCSV-nADVV)
Delay time, GPMC_CS[x] valid to GPMC_ADV_ALE valid
K - 0.2
14
td(nCSV-nOEV)
Delay time, GPMC_CS[x] valid to GPMC_OE_RE valid
L - 0.2 (7)
(3)
(4)
(5)
(6)
(7)
ns
tw(nBEV)
2
11
(2)
UNIT
(1)
1
10
(1)
MAX
J + 2.0
K + 2.0
For single read: N = RdCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK
For single write: N = WrCycleTime * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: N = (RdCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: N = (WrCycleTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For single read: A = (CSRdOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For single write: A = (CSWrOffTime - CSOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) * PageBurstAccessTime) * (TimeParaGranularity + 1) * GPMC_FCLK
= B - nCS Max Delay + nADV Min Delay
For reading: B = ((ADVRdOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - CSExtraDelay)) * GPMC_FCLK
For writing: B = ((ADVWrOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - CSExtraDelay)) * GPMC_FCLK
= C - nCS Max Delay + nOE Min Delay
C = ((OEOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) * GPMC_FCLK
= J - Address Max Delay + nCS Min Delay
J = (CSOnTime * (TimeParaGranularity + 1) + 0.5 * CSExtraDelay) * GPMC_FCLK
= K - nCS Max Delay + nADV Min Delay
K = ((ADVOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - CSExtraDelay)) * GPMC_FCLK
= L - nCS Max Delay + nOE Min Delay
L = ((OEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) * GPMC_FCLK
Peripheral Information and Timings
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Table 8-58. Switching Characteristics Over Recommended Operating Conditions for GPMC/NOR Flash
Interface - Asynchronous Mode (continued)
(see Figure 8-56, Figure 8-57, Figure 8-58, Figure 8-59, Figure 8-60, Figure 8-61)
NO.
PARAMETER
MIN
MAX
(7)
(7)
ns
M + 2.0 (8)
ns
15
td(nCSV-DIR)
Delay time, GPMC_CS[x] valid to GPMC_DIR high
L - 0.2
16
td(nCSV-DIR)
Delay time, GPMC_CS[x] valid to GPMC_DIR low
M - 0.2 (8)
17
tw(AIV)
Address invalid duration between 2 successive R/W accesses
19
td(nCSV-nOEIV)
Delay time, GPMC_CS[x] valid to GPMC_OE_RE invalid (burst
read)
21
tw(AV)
Pulse duration, address valid: second, third and fourth accesses
26
td(nCSV-nWEV)
Delay time, GPMC_CS[x] valid to GPMC_WE valid
28
td(nCSV-nWEIV)
Delay time, GPMC_CS[x] valid to GPMC_WE invalid
29
td(nWEV-DV)
Delay time, GPMC_WE valid to data bus valid
30
td(DV-nCSV)
Delay time, data bus valid to GPMC_CS[x] valid
38
td(nOEV-AIV)
Delay time, GPMC_OE_RE valid to GPMC_A[16:1]_D[15:0]
address phase end
(8)
(9)
(10)
(11)
(12)
(13)
226
L + 2.0
G (9)
I - 0.2 (10)
D
UNIT
ns
I + 2.0 (10)
(11)
ns
ns
E - 0.2 (12)
E + 2.0 (12)
ns
(13)
(13)
ns
2.0
ns
J + 2.0 (5)
ns
2.0
ns
F - 0.2
J - 0.2 (5)
F + 2.0
= M - nCS Max Delay + nOE Min Delay
M = ((RdCycleTime - CSOnTime) * (TimeParaGranularity + 1) - 0.5 * CSExtraDelay) * GPMC_FCLK.
Parameter M expression is given as one example of GPMC programming. The IO DIR signal goes from IN to OUT after both
RdCycleTime and BusTurnAround completion. Behavior of the IO direction signal depends on the kind of successive read/write
accesses performed to the memory and multiplexed or non-multiplexed memory addressing scheme, whether the bus keeping feature is
enabled or not. The IO DIR behavior is automatically handled by the GPMC controller.
G = Cycle2CycleDelay * GPMC_FCLK
= I - nCS Max Delay + nOE Min Delay
I = ((OEOffTime + (n - 1) * PageBurstAccessTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) *
GPMC_FCLK
D = PageBurstAccessTime * (TimeParaGranularity + 1) * GPMC_FCLK
= E - nCS Max Delay + nWE Min Delay
E = ((WEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - CSExtraDelay)) * GPMC_FCLK
= F - nCS Max Delay + nWE Min Delay
F = ((WEOffTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - CSExtraDelay)) * GPMC_FCLK
Peripheral Information and Timings
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GPMC_FCLK
GPMC_CLK
6
2
GPMC_CS[x]
10
GPMC_A[27:0]
Valid Address
11
1
GPMC_BE1
11
1
GPMC_BE0_CLE
4
13
GPMC_ADV_ALE
5
14
GPMC_OE
GPMC_D[15:0]
Data In 0
Data In 0
GPMC_WAIT
16
15
GPMC_DIR
OUT
IN
OUT
Figure 8-56. GPMC Non-Multiplexed NOR Flash - Asynchronous Read - Single Word Timing
Peripheral Information and Timings
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GPMC_FCLK
GPMC_CLK
6
6
2
2
GPMC_CS[x]
17
10
10
GPMC_A[27:0]
Address 1
Address 2
11
11
1
1
GPMC_BE1
11
11
1
1
GPMC_BE0_CLE
4
4
13
13
GPMC_ADV_ALE
5
5
14
14
GPMC_OE
GPMC_D[15:0]
Data Upper
GPMC_WAIT
16
16
15
GPMC_DIR
OUT
15
IN
OUT
IN
OUT
Figure 8-57. GPMC Non-Multiplexed NOR Flash - Asynchronous Read - 32-Bit Timing
228
Peripheral Information and Timings
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GPMC_FCLK
GPMC_CLK
22
21
21
21
2
GPMC_CS[x]
10
GPMC_A[27:0]
Add0
Add1
Add2
Add3
D0
D1
D2
Add4
11
1
GPMC_BE1
11
1
GPMC_BE0_CLE
13
GPMC_ADV_ALE
19
14
GPMC_OE
GPMC_D[15:0]
D3
D3
GPMC_WAIT
16
15
GPMC_DIR
IN
OUT
OUT
Figure 8-58. GPMC Non-Multiplexed Only NOR Flash - Asynchronous Read - Page Mode 4x16-Bit Timing
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GPMC_FCLK
GPMC_CLK
2
GPMC_CS[x]
10
GPMC_A[27:0]
Valid Address
11
1
GPMC_BE1
11
1
GPMC_BE0_CLE
4
13
GPMC_ADV_ALE
28
26
GPMC_WE
30
GPMC_D[15:0]
Data OUT
GPMC_WAIT
GPMC_DIR
OUT
Figure 8-59. GPMC Non-Multiplexed NOR Flash - Asynchronous Write - Single Word Timing
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GPMC_FCLK
GPMC_CLK
2
6
GPMC_CS[x]
10
Address (MSB)
GPMC_A[26:17]
11
1
GPMC_BE1
11
1
GPMC_BE0_CLE
13
4
GPMC_ADV_ALE
5
14
GPMC_OE
30
GPMC_A[16:1]
GPMC_D[15:0]
Address (LSB)
Data IN
Data IN
GPMC_WAIT
16
15
GPMC_DIR
OUT
OUT
IN
Figure 8-60. GPMC Multiplexed NOR Flash - Asynchronous Read - Single Word Timing
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GPMC_FCLK
GPMC_CLK
2
GPMC_CS[x]
10
Address (MSB)
GPMC_A[26:17]
11
1
GPMC_BE1
11
1
GPMC_BE0_CLE
13
4
GPMC_ADV_ALE
28
26
GPMC_WE
30
GPMCA[16:1]
GPMC_D[15:0]
29
Valid Address (LSB)
Data OUT
GPMC_WAIT
GPMC_DIR
OUT
Figure 8-61. GPMC Multiplexed NOR Flash - Asynchronous Write - Single Word Timing
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8.8.2.3
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
GPMC/NAND Flash Interface Asynchronous Mode Timing
Table 8-59. GPMC/NAND Flash Interface Asynchronous Mode Timing - Internal Parameters
NO.
MIN
MAX
UNIT
1
Max. output data generation delay from internal functional clock
6.5
ns
2
Max. input data capture delay by internal functional clock
4.0
ns
3
Max. chip select generation delay from internal functional clock
6.5
ns
4
Max. address latch enable generation delay from internal functional clock
6.5
ns
5
Max. command latch enable generation delay from internal functional clock
6.5
ns
6
Max. output enable generation delay from internal functional clock
6.5
ns
7
Max. write enable generation delay from internal functional clock
6.5
ns
8
Max. functional clock skew
100.0
ps
Table 8-60. Timing Requirements for GPMC/NAND Flash Interface
(see Figure 8-64)
NO.
13
(1)
MIN
tacc(DAT)
Data maximum access time (GPMC_FCLK cycles)
MAX
UNIT
J (1)
cycles
J = AccessTime * (TimeParaGranularity + 1)
Table 8-61. Switching Characteristics Over Recommended Operating Conditions for GPMC/NAND Flash
Interface
(see Figure 8-62, Figure 8-63, Figure 8-64, Figure 8-65)
NO.
1
PARAMETER
tw(nWEV)
MIN
Pulse duration, GPMC_WE valid time
(2)
MAX
UNIT
A (1)
ns
(2)
ns
2
td(nCSV-nWEV)
Delay time, GPMC_CS[x] valid to GPMC_WE valid
B - 0.2
3
td(CLEH-nWEV)
Delay time, GPMC_BE0_CLE high to GPMC_WE valid
C - 0.2 (3)
C + 2.0 (3)
B + 2.0
ns
4
td(nWEV-DV)
Delay time, GPMC_D[15:0] valid to GPMC_WE valid
D - 0.2 (4)
D + 2.0 (4)
ns
5
td(nWEIV-DIV)
Delay time, GPMC_WE invalid to GPMC_D[15:0] invalid
E - 0.2 (5)
E + 2.0 (5)
ns
(6)
(6)
ns
6
td(nWEIV-CLEIV)
Delay time, GPMC_WE invalid to GPMC_BE0_CLE invalid
F - 0.2
7
td(nWEIV-nCSIV)
Delay time, GPMC_WE invalid to GPMC_CS[x] invalid
G - 0.2 (7)
G + 2.0 (7)
ns
8
td(ALEH-nWEV)
Delay time, GPMC_ADV_ALE High to GPMC_WE valid
C - 0.2 (3)
C + 2.0 (3)
ns
(6)
(6)
ns
H (8)
ns
I + 2.0 (9)
ns
(10)
ns
ns
9
td(nWEIV-ALEIV)
Delay time, GPMC_WE invalid to GPMC_ADV_ALE invalid
10
tc(nWE)
Cycle time, write cycle time
11
td(nCSV-nOEV)
Delay time, GPMC_CS[x] valid to GPMC_OE_RE valid
F - 0.2
I - 0.2 (9)
F + 2.0
F + 2.0
12
tw(nOEV)
Pulse duration, GPMC_OE_RE valid time
K
13
tc(nOE)
Cycle time, read cycle time
L (11)
(1)
(2)
A = (WEOffTime - WEOnTime) * (TimeParaGranularity + 1) * GPMC_FCLK
= B + nWE Min Delay - nCS Max Delay
B = ((WEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - CSExtraDelay)) * GPMC_FCLK
(3) = C + nWE Min Delay - CLE Max Delay
C = ((WEOnTime - ADVOnTime) * (TimeParaGranularity + 1) + 0.5 * (WEExtraDelay - ADVExtraDelay)) * GPMC_FCLK
(4) = D + nWE Min Delay - Data Max Delay
D = (WEOnTime * (TimeParaGranularity + 1) + 0.5 * WEExtraDelay ) * GPMC_FCLK
(5) =E + Data Min Delay - nWE Max Delay
E = ((WrCycleTime - WEOffTime) * (TimeParaGranularity + 1) - 0.5 * WEExtraDelay ) * GPMC_FCLK
(6) = F + CLE Min Delay - nWE Max Delay
F = ((ADVWrOffTime - WEOffTime) * (TimeParaGranularity + 1) + 0.5 * (ADVExtraDelay - WEExtraDelay )) * GPMC_FCLK
(7) =G + nCS Min Delay - nWE Max Delay
G = ((CSWrOffTime - WEOffTime) * (TimeParaGranularity + 1) + 0.5 * (CSExtraDelay - WEExtraDelay )) * GPMC_FCLK
(8) H = WrCycleTime * (1 + TimeParaGranularity) * GPMC_FCLK
(9) = I + nOE Min Delay - nCS Max Delay
I = ((OEOnTime - CSOnTime) * (TimeParaGranularity + 1) + 0.5 * (OEExtraDelay - CSExtraDelay)) * GPMC_FCLK
(10) K = (OEOffTime - OEOnTime) * (1 + TimeParaGranularity) * GPMC_FCLK
(11) L = RdCycleTime * (1 + TimeParaGranularity) * GPMC_FCLK
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Table 8-61. Switching Characteristics Over Recommended Operating Conditions for GPMC/NAND Flash
Interface (continued)
(see Figure 8-62, Figure 8-63, Figure 8-64, Figure 8-65)
NO.
14
PARAMETER
td(nOEIV-nCSIV)
Delay time, GPMC_OE_RE invalid to GPMC_CS[x] invalid
MIN
MAX
(12)
(12)
M - 0.2
M + 2.0
UNIT
ns
(12) =M + nCS Min Delay - nOE Max Delay
M = ((CSRdOffTime - OEOffTime) * (TimeParaGranularity + 1) + 0.5 * (CSExtraDelay - OEExtraDelay ))* GPMC_FCLK
GPMC_FCLK
2
7
GPMC_CS[x]
3
6
GPMC_BE0_CLE
GPMC_ADV_ALE
GPMC_OE
1
GPMC_WE
5
4
GPMC_A[16:1]
GPMC_D[15:0]
Command
Figure 8-62. GPMC/NAND Flash - Command Latch Cycle Timing
GPMC_FCLK
2
7
GPMC_CS[x]
GPMC_BE0_CLE
8
9
GPMC_ADV_ALE
GPMC_OE
10
1
GPMC_WE
5
4
GPMC_A[16:1]
GPMC_D[15:0]
Address
Figure 8-63. GPMC/NAND Flash - Address Latch Cycle Timing
234
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GPMC_FCLK
13
16
11
GPMC_CS[x]
GPMC_BE0_CLE
GPMC_ADV_ALE
15
14
GPMC_OE
GPMC_A[16:1]
GPMC_D[15:0]
Data
GPMC_WAIT
Figure 8-64. GPMC/NAND Flash - Data Read Cycle Timing
GPMC_FCLK
2
7
GPMC_CS[x]
GPMC_BE0_CLE
GPMC_ADV_ALE
GPMC_OE
10
1
GPMC_WE
5
4
GPMC_A[16:1]
GPMC_D[15:0]
Data
Figure 8-65. GPMC/NAND Flash - Data Write Cycle Timing
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8.9
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High-Definition Multimedia Interface (HDMI)
The device includes an HDMI 1.3a-compliant transmitter for digital video and audio data to display
devices. The HDMI interface consists of a digital HDMI transmitter core with TMDS encoder, a core
wrapper with interface logic and control registers, and a transmit PHY, with the following features:
• Hot-plug detection
• Consumer electronics control (CEC) messages
• DVI 1.0 compliant (only RGB pixel format)
• CEA 861-D and VESA DMT formats
• Supports up to 165-MHz pixel clock:
– 1920 x 1080p @75 Hz with 8-bit/component color depth
– 1600 x 1200 @60 Hz with 8-bit/component color depth
• Support for deep-color mode:
– 10-bit/component color depth up to 1080p @60 Hz (maximum pixel clock = 148.5 MHz)
– 12-bit/component color depth at 720p/1080i @60 Hz (maximum pixel clock = 123.75 MHz)
• Uncompressed multichannel (up to eight channels) audio (L-PCM) support
• Master I2C interface for display data channel (DDC) connection
• TMDS clock to the HDMI-PHY is up to 185.625 MHz
• Maximum supported pixel clock:
– 165 MHz for 8-bit color depth
– 148.5 MHz for 10-bit color depth
– 123.75 MHz for 12-bit color depth
• Options available to support HDCP encryption engine for transmitting protected audio and video
(contact local TI sales representative for information).
For more details on the HDMI, see the HDMI chapter in the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
8.9.1
HDMI Interface Design Specifications
This section provides PCB design and layout specifications for the HDMI interface. The design rules
constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. Simulation and
system design work has been done to ensure the HDMI interface requirements are met.
8.9.1.1
HDMI Interface Schematic
The HDMI bus is separated into three main sections:
1. Transition Minimized Differential Signaling (TMDS) high-speed digital video interface
2. Display Data Channel (I2C bus for configuration and status exchange between two devices)
3. Consumer Electronics Control (optional) for remote control of connected devices.
The DDC and CEC are low-speed interfaces, so nothing special is required for PCB layout of these
signals. Their connection is shown in Figure 8-66.
The TMDS channels are high-speed differential pairs and, therefore, require the most care in layout.
Specifications for TMDS layout are below.
Figure 8-66 shows the HDMI interface schematic. The specific pin numbers can be obtained from Table 37, HDMI Terminal Functions.
236
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Device
HDMI Connector
HDMI_TMDSDP0
HDMI_TMDSDN0
TD0+
TD0-
HDMI_TMDSDP1
HDMI_TMDSDN1
TD1+
TD1TPD12S521
or other
ESD Protection
w/I2C-Level
Translation
HDMI_TMDSDP2
HDMI_TMDSDN2
HDMI_TMDSCLKP
HDMI_TMDSCLKN
HDMI_CEC
HDMI_SDA
HDMI_SCL
HDMI_HPDET
A.
TD2+
TD2TCLK
TCLK+
TD0
Shld
TD1
Shld
TD2
Shld
TCLK
Shld
CEC
DVDD_3P3
(A)
Rpullup
DDC
Gnd
SDA
SCL
HPDET
5K-10K Ω pullup resistors are required if not integrated in the ESD protection chip.
Figure 8-66. HDMI Interface High-Level Schematic
8.9.1.2
TMDS Routing
The TMDS signals are high-speed differential pairs. Care must be taken in the PCB layout of these signals
to ensure good signal integrity.
The TMDS differential signal traces must be routed to achieve 100 Ω (±10%) differential impedance and
60 Ω (±10%) single-ended impedance. Single-ended impedance control is required because differential
signals are extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes
important.
These impedances are impacted by trace width, trace spacing, distance to reference planes, and dielectric
material. Verify with a PCB design tool that the trace geometry for both data signal pairs results in as
close to 60 Ω impedance traces as possible. For best accuracy, work with your PCB fabricator to ensure
this impedance is met.
In general, closely coupled differential signal traces are not an advantage on PCBs. When differential
signals are closely coupled, tight spacing and width control is necessary. Very small width and spacing
variations affect impedance dramatically, so tight impedance control can be more problematic to maintain
in production.
Loosely coupled PCB differential signals make impedance control much easier. Wider traces and spacing
make obstacle avoidance easier, and trace width variations do not affect impedance as much; therefore, it
is easier to maintain an accurate impedance over the length of the signal. The wider traces also show
reduced skin effect and, therefore, often result in better signal integrity.
Table 8-62 shows the routing specifications for the TMDS signals.
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Table 8-62. TMDS Routing Specifications
PARAMETER
MIN
TYP
Processor-to-HDMI header trace length
MAX
7000
Number of stubs allowed on TMDS traces
0
UNIT
Mils
Stubs
Ω
TX/RX pair differential impedance
90
100
110
TX/RX single ended impedance
54
60
66
Ω
2
Vias (1)
Number of vias on each TMDS trace
2*DS (2)
TMDS differential pair to any other trace spacing
(1)
(2)
Vias must be used in pairs with their distance minimized.
DS = differential spacing of the HDMI traces.
8.9.1.3
DDC Signals
As shown in Figure 8-66, the DDC connects just like a standard I2C bus. As such, resistor pullups must
be used to pull up the open drain buffer signals unless they are integrated into the ESD protection chip
used. If used, these pullup resistors should be connected to a 3.3-V supply.
8.9.1.4
HDMI ESD Protection Device (Required)
Interfaces that connect to a cable such as HDMI generally require more ESD protection than can be built
into the processor's outputs. Therefore, this HDMI interface requires the use of an ESD protection chip to
provide adequate ESD protection and to translate I2C voltage levels from the 3.3 V supplied by the device
to the 5 volts required by the HDMI specification.
When selecting an ESD protection chip, choose the lowest capacitance ESD protection available to
minimize signal degradation. In no case should the ESD protection circuit capacitance be more than 5 pF.
TI manufactures devices that provide ESD protection for HDMI signals such as the TPD12S521. For more
information see the www.ti.com website.
8.9.1.5
PCB Stackup Specifications
Table 8-63 shows the stackup and feature sizes required for HDMI.
Table 8-63. HDMI PCB Stackup Specifications
PARAMETER
MIN
TYP
MAX
PCB routing/plane layers
4
6
-
Layers
Signal routing layers
2
3
-
Layers
Number of ground plane cuts allowed within HDMI routing region
-
-
0
Cuts
Number of layers between HDMI routing region and reference ground plane
-
-
0
Layers
PCB trace width
-
4
-
Mils
PCB BGA escape via pad size
-
20
-
Mils
PCB BGA escape via hole size
-
10
Mils
0.3
mm
Processor device BGA pad size
(1)
(2)
238
(1) (2)
UNIT
Non-solder mask defined pad.
Per IPC-7351A BGA pad size guideline.
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8.9.1.6
SPRS681E – OCTOBER 2010 – REVISED JULY 2012
Grounding
Each TMDS channel has its own shield pin which should be grounded to provide a return current path for
the TMDS signal.
8.9.2
HDMI Peripheral Register Descriptions
Table 8-64. HDMI Wrapper Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
0x46C0 0000
HDMI_WP_REVISION
0x46C0 0010
HDMI_WP_SYSCONFIG
IP Revision Identifier
0x46C0 0024
HDMI_WP_IRQSTATUS_RAW
0x46C0 0028
HDMI_WP_IRQSTATUS
Interrupt Status
0x46C0 002C
HDMI_WP_IRQENABLE_SET
Interrupt Enable
0x46C0 0030
HDMI_WP_IRQENABLE_CLR
Interrupt Disable
0x46C0 0034
HDMI_WP_IRQWAKEEN
IRQ Wakeup
0x46C0 0050
HDMI_WP_VIDEO_CFG
Configuration of HDMI Wrapper Video
0x46C0 0070
HDMI_WP_CLK
0x46C0 0080
HDMI_WP_AUDIO_CFG
Audio Configuration in FIFO
0x46C0 0084
HDMI_WP_AUDIO_CFG2
Audio Configuration of DMA
0x46C0 0088
HDMI_WP_AUDIO_CTRL
Audio FIFO Control
0x46C0 008C
HDMI_WP_AUDIO_DATA
TX Data of FIFO
Clock Management Configuration
Raw Interrupt Status
Configuration of Clocks
Table 8-65. HDMI Core System Registers
HEX ADDRESS
ACRONYM
0x46C0 0400
VND_IDL
REGISTER NAME
Vendor ID
0x46C0 0404
VND_IDH
Vendor ID
0x46C0 0408
DEV_IDL
Device ID
0x46C0 040C
DEV_IDH
Device ID
0x46C0 0410
DEV_REV
Device Revision
0x46C0 0414
SRST
Software Reset
0x46C0 0420
SYS_CTRL1
0x46C0 0424
SYS_STAT
0x46C0 0428
SYS_CTRL3
0x46C0 0434
DCTL
0x46C0 043C - 0x46C0 0494
-
Reserved
System Control 1
System Status
Legacy
Data Control
0x46C0 0498
RI_STAT
Ri Status
0x46C0 049C
RI_CMD
Ri Command
0x46C0 04A0
RI_START
Ri Line Start
0x46C0 04A4
RI_RX_L
Ri From RX
0x46C0 04A8
RI_RX_H
Ri From RX
0x46C0 04AC
RI_DEBUG
0x46C0 04C8
DE_DLY
VIDEO DE Delay
VIDEO DE Delay
Ri Debug
0x46C0 04C8
DE_DLY
0x46C0 04CC
DE_CTRL
VIDEO DE Control
0x46C0 04D0
DE_TOP
VIDEO DE Top
0x46C0 04D8
DE_CNTL
VIDEO DE Count
0x46C0 04DC
DE_CNTH
VIDEO DE Count
0x46C0 04E0
DE_LINL
VIDEO DE Line
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Table 8-65. HDMI Core System Registers (continued)
240
HEX ADDRESS
ACRONYM
REGISTER NAME
0x46C0 04E4
DE_LINH_1
VIDEO DE Line
0x46C0 04E8
HRES_L
Video H Resolution
0x46C0 04EC
HRES_H
Video H Resolution
0x46C0 04F0
VRES_L
Video V Resolution
0x46C0 04F4
VRES_H
Video V Resolution
0x46C0 04F8
IADJUST
Video Interlace Adjustment
0x46C0 04FC
POL_DETECT
0x46C0 0500
HBIT_2HSYNC1
Video Hbit to HSYNC
0x46C0 0504
HBIT_2HSYNC2
Video Hbit to HSYNC
0x46C0 0508
FLD2_HS_OFSTL
Video Field2 HSYNC Offset
0x46C0 050C
FLD2_HS_OFSTH
Video Field2 HSYNC Offset
0x46C0 0510
HWIDTH1
Video HSYNC Length
0x46C0 0514
HWIDTH2
Video HSYNC Length
0x46C0 0518
VBIT_TO_VSYNC
Video Vbit to VSYNC
0x46C0 051C
VWIDTH
Video VSYNC Length
0x46C0 0520
VID_CTRL
Video Control
0x46C0 0524
VID_ACEN
Video Action Enable
Video Mode1
Video SYNC Polarity Detection
0x46C0 0528
VID_MODE
0x46C0 052C
VID_BLANK1
Video Blanking
0x46C0 0530
VID_BLANK2
Video Blanking
0x46C0 0534
VID_BLANK3
Video Blanking
0x46C0 0538
DC_HEADER
Deep Color Header
0x46C0 053C
VID_DITHER
Video Mode2
0x46C0 0540
RGB2XVYCC_CT
0x46C0 0544
R2Y_COEFF_LOW
RGB_2_xvYCC Conversion R_2_Y
0x46C0 0548
R2Y_COEFF_UP
RGB_2_xvYCC Conversion R_2_Y
0x46C0 054C
G2Y_COEFF_LOW
RGB_2_xvYCC Conversion G_2_Y
0x46C0 0550
G2Y_COEFF_UP
RGB_2_xvYCC Conversion G_2_Y
0x46C0 0554
B2Y_COEFF_LOW
RGB_2_xvYCC Conversion B_2_Y
0x46C0 0558
B2Y_COEFF_UP
RGB_2_xvYCC Conversion B_2_Y
0x46C0 055C
R2CB_COEFF_LOW
RGB_2_xvYCC Conversion R_2_Cb
0x46C0 0560
R2CB_COEFF_UP
RGB_2_xvYCC Conversion R_2_Cb
0x46C0 0564
G2CB_COEFF_LOW
RGB_2_xvYCC Conversion G_2_Cb
0x46C0 0568
G2CB_COEFF_UP
RGB_2_xvYCC Conversion G_2_Cb
0x46C0 056C
B2CB_COEFF_LOW
RGB_2_xvYCC Conversion B_2_Cb
0x46C0 0570
B2CB_COEFF_UP
RGB_2_xvYCC Conversion B_2_Cb
0x46C0 0574
R2CR_COEFF_LOW
RGB_2_xvYCC Conversion R_2_Cr
RGB_2_xvYCC control
0x46C0 0578
R2CR_COEFF_UP
RGB_2_xvYCC Conversion R_2_Cr
0x46C0 057C
G2CR_COEFF_LOW
RGB_2_xvYCC Conversion G_2_Cr
0x46C0 0580
G2CR_COEFF_UP
RGB_2_xvYCC Conversion G_2_Cr
0x46C0 0584
B2CR_COEFF_LOW
RGB_2_xvYCC Conversion B_2_Cr
RGB_2_xvYCC Conversion B_2_Cr
0x46C0 0588
B2CR_COEFF_UP
0x46C0 058C
RGB_OFFSET_LOW
RGB_2_xvYCC RGB Input Offset
0x46C0 0590
RGB_OFFSET_UP
RGB_2_xvYCC RGB Input Offset
0x46C0 0594
Y_OFFSET_LOW
RGB_2_xvYCC Conversion Y Output Offset
0x46C0 0598
Y_OFFSET_UP
RGB_2_xvYCC Conversion Y Output Offset
0x46C0 059C
CBCR_OFFSET_LOW
RGB_2_xvYCC Conversion CbCr Output Offset
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Table 8-65. HDMI Core System Registers (continued)
HEX ADDRESS
ACRONYM
0x46C0 05A0
CBCR_OFFSET_UP
REGISTER NAME
0x46C0 05C0
INTR_STATE
0x46C0 05C4
INTR1
Interrupt Source
0x46C0 05C8
INTR2
Interrupt Source
0x46C0 05CC
INTR3
Interrupt Source
0x46C0 05D0
INTR4
Interrupt Source
0x46C0 05D4
INT_UNMASK1
Interrupt Unmask
RGB_2_xvYCC Conversion CbCr Output Offset
Interrupt State
0x46C0 05D8
INT_UNMASK2
Interrupt Unmask
0x46C0 05DC
INT_UNMASK3
Interrupt Unmask
0x46C0 05E0
INT_UNMASK4
Interrupt Unmask
0x46C0 05E4
INT_CTRL
Interrupt Control
0x46C0 0640
XVYCC2RGB_CTL
xvYCC_2_RGB Control
0x46C0 0644
Y2R_COEFF_LOW
xvYCC_2_RGB Conversion Y_2_R
0x46C0 0648
Y2R_COEFF_UP
xvYCC_2_RGB Conversion Y_2_R
0x46C0 064C
CR2R_COEFF_LOW
xvYCC_2_RGB Conversion Cr_2_R
0x46C0 0650
CR2R_COEFF_UP
xvYCC_2_RGB Conversion Cr_2_R
0x46C0 0654
CB2B_COEFF_LOW
xvYCC_2_RGB Conversion Cb_2_B
0x46C0 0658
CB2B_COEFF_UP
xvYCC_2_RGB Conversion Cb_2_B
0x46C0 065C
CR2G_COEFF_LOW
xvYCC_2_RGB Conversion Cr_2_G
0x46C0 0660
CR2G_COEFF_UP
xvYCC_2_RGB Conversion Cr_2_G
0x46C0 0664
CB2G_COEFF_LOW
xvYCC_2_RGB Conversion Cb_2_G
0x46C0 0668
CB2G_COEFF_UP
xvYCC_2_RGB Conversion Cb_2_G
0x46C0 066C
YOFFSET1_LOW
xvYCC_2_RGB Conversion Y Offset
0x46C0 0670
YOFFSET1_UP
xvYCC_2_RGB Conversion Y Offset
0x46C0 0674
OFFSET1_LOW
xvYCC_2_RGB Conversion Offset1
0x46C0 0678
OFFSET1_MID
xvYCC_2_RGB Conversion Offset1
0x46C0 067C
OFFSET1_UP
xvYCC_2_RGB Conversion Offset1
0x46C0 0680
OFFSET2_LOW
xvYCC_2_RGB Conversion Offset2
0x46C0 0684
OFFSET2_UP
xvYCC_2_RGB Conversion Offset2
0x46C0 0688
DCLEVEL_LOW
xvYCC_2_RGB Conversion DC Level
0x46C0 068C
DCLEVEL_UP
xvYCC_2_RGB Conversion DC Level
0x46C0 07B0
DDC_MAN
0x46C0 07B4
DDC_ADDR
DDC I2C Manual
DDC I2C Target Slave Address
0x46C0 07B8
DDC_SEGM
DDC I2C Target Segment Address
0x46C0 07BC
DDC_OFFSET
DDC I2C Target Offset Address
0x46C0 07C0
DDC_COUNT1
DDC I2C Data Count
0x46C0 07C4
DDC_COUNT2
DDC I2C Data Count
DDC I2C Status
0x46C0 07C8
DDC_STATUS
0x46C0 07CC
DDC_CMD
DDC I2C Command
0x46C0 07D0
DDC_DATA
DDC I2C Data
0x46C0 07D4
DDC_FIFOCNT
DDC I2C FIFO Count
0x46C0 07E4
EPST
ROM Status
0x46C0 07E8
EPCM
ROM Command
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Table 8-66. HDMI IP Core Gamut Registers
HEX ADDRESS
ACRONYM
0x46C0 0800
GAMUT_HEADER1
REGISTER NAME
Gamut Metadata
0x46C0 0804
GAMUT_HEADER2
Gamut Metadata
0x46C0 0808
GAMUT_HEADER3
Gamut Metadata
0x46C0 080C - 0x46C0 0878
(0x4 byte increments)
GAMUT_DBYTE__0 GAMUT_DBYTE__27
Gamut Metadata
Table 8-67. HDMI IP Core Audio Video Registers
242
HEX ADDRESS
ACRONYM
REGISTER NAME
0x46C0 0904
ACR_CTRL
ACR Control
0x46C0 0908
FREQ_SVAL
ACR Audio Frequency
0x46C0 090C
N_SVAL1
ACR N Software Value
0x46C0 0910
N_SVAL2
ACR N Software Value
0x46C0 0914
N_SVAL3
ACR N Software Value
0x46C0 0918
CTS_SVAL1
ACR CTS Software Value
0x46C0 091C
CTS_SVAL2
ACR CTS Software Value
0x46C0 0920
CTS_SVAL3
ACR CTS Software Value
0x46C0 0924
CTS_HVAL1
ACR CTS Hardware Value
0x46C0 0928
CTS_HVAL2
ACR CTS Hardware Value
0x46C0 092C
CTS_HVAL3
ACR CTS Hardware Value
0x46C0 0950
AUD_MODE
Audio In Mode
0x46C0 0954
SPDIF_CTRL
Audio In S/PDIF Control
0x46C0 0960
HW_SPDIF_FS
0x46C0 0964
SWAP_I2S
0x46C0 096C
SPDIF_ERTH
Audio Error Threshold
0x46C0 0970
I2S_IN_MAP
Audio In I2S Data In Map
0x46C0 0974
I2S_IN_CTRL
Audio In I2S Control
Audio In S/PDIF Extracted Fs and Length
Audio In I2S Channel Swap
0x46C0 0978
I2S_CHST0
Audio In I2S Channel Status
0x46C0 097C
I2S_CHST1
Audio In I2S Channel Status
0x46C0 0980
I2S_CHST2
Audio In I2S Channel Status
0x46C0 0984
I2S_CHST4
Audio In I2S Channel Status
Audio In I2S Channel Status
0x46C0 0988
I2S_CHST5
0x46C0 098C
ASRC
0x46C0 0990
I2S_IN_LEN
Audio I2S Input Length
0x46C0 09BC
HDMI_CTRL
HDMI Control
0x46C0 09C0
AUDO_TXSTAT
0x46C0 09CC
AUD_PAR_BUSCLK_1
Audio Input Data Rate Adjustment
0x46C0 09D0
AUD_PAR_BUSCLK_2
Audio Input Data Rate Adjustment
0x46C0 09D4
AUD_PAR_BUSCLK_3
Audio Input Data Rate Adjustment
0x46C0 09F0
TEST_TXCTRL
0x46C0 09F4
DPD
Diagnostic Power Down
Audio Sample Rate Conversion
Audio Path Status
Test Control
0x46C0 09F8
PB_CTRL1
Packet Buffer Control 1
0x46C0 09FC
PB_CTRL2
Packet Buffer Control 2
0x46C0 0A00
AVI_TYPE
Packet
0x46C0 0A04
AVI_VERS
Packet
0x46C0 0A08
AVI_LEN
Packet
0x46C0 0A0C
AVI_CHSUM
Packet
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Table 8-67. HDMI IP Core Audio Video Registers (continued)
HEX ADDRESS
ACRONYM
0x46C0 0A10 - 0x46C0 0A48
(0x4 byte increments)
AVI_DBYTE__0 AVI_DBYTE__14
REGISTER NAME
Packet
0x46C0 0A80
SPD_TYPE
SPD InfoFrame
0x46C0 0A84
SPD_VERS
SPD InfoFrame
0x46C0 0A88
SPD_LEN
SPD InfoFrame
0x46C0 0A8C
SPD_CHSUM
SPD InfoFrame
0x46C0 0A90 - 0x46C0 0AF8
(0x4 byte increments)
SPD_DBYTE__0 SPD_DBYTE__26
SPD InfoFrame
0x46C0 0B00
AUDIO_TYPE
Audio InfoFrame
0x46C0 0B04
AUDIO_VERS
Audio InfoFrame
0x46C0 0B08
AUDIO_LEN
Audio InfoFrame
0x46C0 0B0C
AUDIO_CHSUM
Audio InfoFrame
0x46C0 0B10 - 0x46C0 0B34
(0x4 byte increments)
AUDIO_DBYTE__0 AUDIO_DBYTE__9
Audio InfoFrame
0x46C0 0B80
MPEG_TYPE
MPEG InfoFrame
0x46C0 0B84
MPEG_VERS
MPEG InfoFrame
0x46C0 0B88
MPEG_LEN
MPEG InfoFrame
0x46C0 0B8C
MPEG_CHSUM
MPEG InfoFrame
0x46C0 0B90 - 0x46C0 0BF8
(0x4 byte increments)
MPEG_DBYTE__0 MPEG_DBYTE__26
MPEG InfoFrame
0x46C0 0C00 - 0x46C0 0C78
(0x4 byte increments)
GEN_DBYTE__0 GEN_DBYTE__30
0x46C0 0C7C
CP_BYTE1
0x46C0 0C80 - 0x46C0 0CF8
(0x4 byte increments)
GEN2_DBYTE__0 GEN2_DBYTE__30
0x46C0 0CFC
CEC_ADDR_ID
Generic Packet
General Control Packet
Generic Packet 2
CEC Slave ID
Table 8-68. HDMI IP Core CEC Registers
HEX ADDRESS
ACRONYM
0x46C0 0D00
CEC_DEV_ID
REGISTER NAME
0x46C0 0D04
CEC_SPEC
CEC Specification
0x46C0 0D08
CEC_SUFF
CEC Specification Suffix
0x46C0 0D0C
CEC_FW
CEC Firmware Revision
0x46C0 0D10
CEC_DBG_0
CEC Debug 0
0x46C0 0D14
CEC_DBG_1
CEC Debug 1
CEC Device ID
0x46C0 0D18
CEC_DBG_2
CEC Debug 2
0x46C0 0D1C
CEC_DBG_3
CEC Debug 3
0x46C0 0D20
CEC_TX_INIT
CEC Tx Initialization
0x46C0 0D24
CEC_TX_DEST
CEC Tx Destination
0x46C0 0D38
CEC_SETUP
0x46C0 0D3C
CEC_TX_COMMAND
0x46C0 0D40 - 0x46C0 0D78
(0x4 byte increments)
CEC_TX_OPERAND__0 CEC_TX_OPERAND__14
0x46C0 0D7C
CEC_TRANSMIT_DATA
0x46C0 0D88
CEC_CA_7_0
CEC Capture ID0
0x46C0 0D8C
CEC_CA_15_8
CEC Capture ID0
0x46C0 0D90
CEC_INT_ENABLE_0
CEC Interrupt Enable 0
0x46C0 0D94
CEC_INT_ENABLE_1
CEC Interrupt Enable 1
0x46C0 0D98
CEC_INT_STATUS_0
CEC Interrupt Status 0
CEC Set Up
CEC Tx Command
CEC Tx Operand
CEC Transmit Data
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Table 8-68. HDMI IP Core CEC Registers (continued)
HEX ADDRESS
ACRONYM
0x46C0 0D9C
CEC_INT_STATUS_1
REGISTER NAME
CEC Interrupt Status 1
0x46C0 0DB0
CEC_RX_CONTROL
CEC RX Control
0x46C0 0DB4
CEC_RX_COUNT
0x46C0 0DB8
CEC_RX_CMD_HEADER
0x46C0 0DBC
CEC_RX_COMMAND
0x46C0 0DC0 - 0x46C0 0DF8
(0x4 byte increments)
CEC_RX_OPERAND__0 CEC_RX_OPERAND__14
CEC Rx Count
CEC Rx Command Header
CEC Rx Command
CEC Rx Operand
Table 8-69. HDMI PHY Registers
244
HEX ADDRESS
ACRONYM
0x4812 2004
TMDS_CNTL2
TMDS Control
TMDS Control
0x4812 2008
TMDS_CNTL3
0x4812 200C
BIST_CNTL
0x4812 2020
TMDS_CNTL9
REGISTER NAME
BIST Control
TMDS Control
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8.10 High-Definition Video Processing Subsystem (HDVPSS)
The device High-Definition Video Processing Subsystem (HDVPSS) provides a video input interface for
external imaging peripherals (that is, image sensors, video decoders, etc.) and a video output interface for
display devices, such as analog SDTV displays, analog/digital HDTV displays, digital LCD panels, etc. It
includes HD and SD video encoders, and an HDMI transmitter interface.
The device HDVPSS features include:
• High quality (HD) and medium quality (SD) display processing pipelines with de-interlacing, scaling,
noise reduction, alpha blending, chroma keying, color space conversion, flicker filtering, and pixel
format conversion.
• HD/SD compositor features for PIP support.
• Format conversions (up to 1080p 60 Hz) include scan format conversion, scan rate conversion, aspectratio conversion, and frame size conversion.
• Supports additional video processing capabilities by using the subsystem's memory-to-memory feature.
• Two parallel video processing pipelines support HD (up to 1080p60) and SD (NTSC/PAL)
simultaneous outputs.
– HD analog component output with OSD and embedded timing codes (BT.1120)
• 3-channel HD-DAC with 12-bit resolution.
• External HSYNC and VSYNC signals available on silicon revision 2.x devices. For more details,
see below.
– SD analog output with OSD with embedded timing codes (BT.656)
• Simultaneous component, S-video and composite
• 4-channel SD-DAC with 10-bit resolution
• Options available to support MacroVision and CGMS-A (contact local TI Sales rep for
information).
– Digital HDMI 1.3a compliant transmitter (for details, see Section 8.9, High-Definition Multimedia
Interface (HDMI)).
• Up to two (one 16/24/30-bit and one 16-bit) digital video outputs (up to 165 MHz).
– VOUT[0] can output up to 30-bit video and supports RGB, YUV444, Y/C and BT.656 modes.
– VOUT[1] can output up to 16-bit video and supports Y/C and BT.656 modes.
• Two (one 16/24-bit and one 16-bit) independently configurable external video input capture ports (up to
165 MHz).
– 16/24-bitHD digital video input or dual clock independent 8-bit SD inputs on each capture port.
• VIN[0] can accept single-channel 16/24-bit (YCbCr/RGB) video or dual-channel 8-bit (YCbCr)
video.
• VIN[1] can accept single-channel 16-bit (YCbCr) video or dual-channel 8-bit (YCbCr) video.
– Embedded sync and external sync modes are supported for all input configurations.
– De-multiplexing of both pixel-to-pixel and line-to-line multiplexed streams, effectively supporting up
to 16 simultaneous SD inputs with a glueless interface to an external multiplexer such as the
TVP5158.
– Additional features include: programmable color space conversion, scaler and chroma
downsampler, ancillary VANC/VBI data capture (decoded by software), noise reduction.
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•
•
•
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Availability of a combination of these digital video input/output port configurations, control signals for
multiple 8-bit ports, as well as separate synchronization signals is limited by the device pin multiplexing
(for details, see Section 4.4). The following video inputs/outputs are not multiplexed and are always
available:
– SD DAC composite, S-video, component out
– HD DAC component out
– HDMI output (same as VOUT[1])
– 16-bit VOUT[0] (embedded sync)
– Single 16-bit/dual 8-bit VIN[0] (embedded sync).
Graphics features:
– Three independently-generated graphics layers.
– Each supports full-screen resolution graphics in HD, SD or both.
– Up/down scaler optimized for graphics.
– Global and pixel-level alpha blending supported.
Discrete external HSYNC and VSYNC signals for the HD-DAC are available on silicon revision 2.x
devices. These signals are mapped to the following pins (for details, see Section 3.2.20):
– HSYNC - AR5/AT9/AR8
– VSYNC - AL5/AP9/AL9
The functionality of these pins is set using the SPARE_CTRL0 register (address: 0x4814 0724).
Figure 8-67 and Table 8-70 describe the SPARE_CTRL0 register.
Note: When changing this register, read original value and write back same value in Reserved
fields.
For example, these are the steps required to use the pins AR8 and AL9 as the
DAC_HSYNC/VSYNC signals:
1. Set the PINCTRLx registers for AR8 and AL9 as follows:
• 0x4814 0894 = 0x00000001
• 0x4814 0898 = 0x00000001
2. Select analog VENC sync out option as follows:
• 0x4814 0724 = 0x00000004
31
3
Reserved
2
1
0
SPR_CTL0_2
SPR_CTL0_1
Rsvd
Figure 8-67. SPARE_CTRL0 Register
Table 8-70. SPARE_CTRL0 Register Field Descriptions
Bit
31:3
Field
Reserved
Value
0
2
Reserved
To Select DAC or VOUT[0] Source Signals
0
Selects VOUT[0]_AVID/FLD
1
Selects DAC_HSYNC/VSYNC
1
0
Description
To Select DAC or VOUT[1] Source Signals
Reserved
0
Selects VOUT[1]_HSYNC/VSYNC
1
Selects DAC_HSYNC/VSYNC
0
Reserved
For more detailed information on specific features, see the HDVPSS chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
246
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8.10.1 HDVPSS Electrical Data/Timing
Table 8-71. Timing Requirements for HDVPSS Input
(see Figure 8-68 and Figure 8-69)
NO.
MIN
MAX
UNIT
VIN[x]A_CLK
6.06 (1)
ns
Pulse duration, VIN[x]A_CLK high (45% of tc)
2.73
ns
Pulse duration, VIN[x]A_CLK low (45% of tc)
2.73
1
tc(CLK)
Cycle time, VIN[x]A_CLK
2
tw(CLKH)
3
tw(CLKH)
7
tt(CLK)
Transition time, VIN[x]A_CLK (10%-90%)
ns
2.64
ns
tsu(DE-CLK)
tsu(VSYNC-CLK)
4
tsu(FLD-CLK)
Input setup time, control valid to VIN[x]A_CLK high
3.75
Input setup time, data valid to VIN[x]A_CLK high
3.75
Input hold time, control valid from VIN[x]A_CLK high
0
(2)
Input hold time, data valid from VIN[x]A_CLK high
0
(2)
ns
tsu(HSYNC-CLK)
tsu(D-CLK)
th(CLK-DE)
th(CLK-VSYNC)
5
th(CLK-FLD)
ns
th(CLK-HSYNC)
th(CLK-D)
VIN[x]B_CLK
6.06 (1)
ns
Pulse duration, VIN[x]B_CLK high (45% of tc)
2.73
ns
tw(CLKH)
Pulse duration, VIN[x]B_CLK low (45% of tc)
2.73
ns
tt(CLK)
Transition time, VIN[x]B_CLK (10%-90%)
1
tc(CLK)
Cycle time, VIN[x]B_CLK
2
tw(CLKH)
3
7
2.64
ns
tsu(DE-CLK)
tsu(VSYNC-CLK)
4
tsu(FLD-CLK)
Input setup time, control valid to VIN[x]B_CLK high
3.75
Input setup time, data valid to VIN[x]B_CLK high
3.75
Input hold time, control valid from VIN[x]B_CLK high
0
(2)
Input hold time, data valid from VIN[x]B_CLK high
0
(2)
ns
tsu(HSYNC-CLK)
tsu(D-CLK)
th(CLK-DE)
th(CLK-VSYNC)
5
th(CLK-FLD)
ns
th(CLK-HSYNC)
th(CLK-D)
(1)
(2)
For maximum frequency of 165 MHz.
When interfacing to a device with a minimum delay time of 0 ns, propagation delay of the data traces must be bigger than that of the
clock traces.
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Table 8-72. Switching Characteristics Over Recommended Operating Conditions for HDVPSS Output
(see Figure 8-68 and Figure 8-70)
NO.
PARAMETER
MIN
1
tc(CLK)
Cycle time, VOUT[x]_CLK
6.06 (1)
MAX
UNIT
ns
2
tw(CLKH)
Pulse duration, VOUT[x]_CLK high (45% of tc)
2.73
ns
3
tw(CLKL)
Pulse duration, VOUT[x]_CLK low (45% of tc)
2.73
7
tt(CLK)
Transition time, VOUT[x]_CLK (10%-90%)
ns
2.64
ns
1.64 (2)
4.85 (3)
ns
1.64 (2)
4.85 (3)
ns
td(CLK-AVID)
td(CLK-FLD)
Delay time, VOUT[x]_CLK to control valid
td(CLK-VSYNC)
td(CLK-HSYNC)
6
td(CLK-RCR)
td(CLK-GYYC)
Delay time, VOUT[0]_CLK to data valid
td(CLK-BCBC)
td(CLK-YYC)
Delay time, VOUT[1]_CLK to data valid
td(CLK-C)
(1)
(2)
(3)
For maximum frequency of 165 MHz.
Min Delay Time = Tc * 0.27, where Tc is the clock cycle time. Note: When interfacing to devices where setup/hold margins are minimal,
care must be taken to match board trace length delay for clock and data signals.
Max Delay Time = Tc * 0.80, where Tc is the clock cycle time. Note: When interfacing to devices where setup/hold margins are minimal,
care must be taken to match board trace length delay for clock and data signals.
3
2
1
VIN[x]A_CLK/
VIN[x]B_CLK/
VOUT[x]_CLK
7
7
Figure 8-68. HDVPSS Clock Timing
248
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VIN[x]A_CLK/
VIN[x]B_CLK
(positive-edge clocking)
VIN[x]A_CLK/
VIN[x]B_CLK
(negative-edge clocking)
5
4
VIN[x]A/
VIN[x]B
Figure 8-69. HDVPSS Input Timing
VOUT[x]_CLK
6
VOUT[x]
Figure 8-70. HDVPSS Output Timing
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8.10.2 Video DAC Guidelines and Electrical Data/Timing
The device's analog video DAC outputs are designed to drive a 37.5-Ω load. Figure 8-71 describes a
typical circuit that permits connecting the analog video output from the device to standard 75-Ω impedance
video systems. The device requires the use of a buffer to drive the actual video outputs, so one solution is
to use a video amplifier with integrated buffer and internal filter, such as the Texas Instruments THS7360,
which provides a complete solution for the typical output circuit shown in Figure 8-71.
Reconstruction
Filter
IOUTx
RLOAD
SD:
ED:
HD:
1080p:
9.5 MHZ
18 MHZ
36 MHz
72 MHz
75 W
Amplifier
SD: 5.6 V/V
HD: 4.5 V/V
Figure 8-71. Typical Output Circuits for Analog Video from DACs
During board design, the onboard traces and parasitics must be matched for the channel. The video DAC
output pin (IOUTx) is a very high-frequency analog signal and must be routed with extreme care. As a
result, the path of this signal must be as short as possible, and as isolated as possible from other
interfering signals. The load resistor and amplifier/buffer should be placed close together and as close as
possible to the device pins. Other layout guidelines include:
• Take special care to bypass the DAC power supply pin with a capacitor.
• Place the 75-Ω resistor as close as possible (<0.5") to the amplifier/buffer (THS7360) output pin.
• To maintain a high quality video signal, 75-Ω (±10%) characteristic impedance traces should be used
after the 75-Ω series resistor.
• Minimize input trace lengths to the device to reduce parasitic capacitance.
• Include solid ground return paths.
• Match trace lengths as close as possible within a video format group (that is, Y, Pb, and Pr for
component output, and Y and C for s-video output should match each other).
For additional video DAC design guidelines, see the HDVPSS chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Table 8-73. DAC Specifications
PARAMETER
Resolution
CONDITIONS
MIN
TYP
MAX
UNIT
HD DACs
12
Bits
SD DACs
10
Bits
DC Accuracy - HD DACs
Integral Non-Linearity (INL), best fit
Differential Non-Linearity (DNL)
HD DACs
1.5
LSB
SD DACs
1.0
LSB
HD DACs
1.0
LSB
SD DACs
0.5
LSB
Analog Output
250
Output Resistor (RLOAD)
HD and SD DACs
Full-Scale Output Current (IFS)
HD and SD DACs
RLOAD
Output Compliance Range
HD and SD DACs
IFS = 13.3 mA,
RLOAD = 37.5 Ω
Zero Scale Offset Error (ZSET)
HD and SD DACs
Gain Error
HD and SD DACs
Peripheral Information and Timings
-1%
37.5
+1%
13.3
0
mA
Vref
0.5
-10
Ω
V
LSB
10
%
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Table 8-73. DAC Specifications (continued)
PARAMETER
CONDITIONS
MIN
TYP
MAX
2
UNIT
Channel matching
HD and SD DACs
%
Recommended External Amplification
HD DACs
4.5
V/V
SD DACs
5.6
V/V
Reference
Reference Voltage Range (VREF)
Input with External
Reference
-5%
0.5
+5%
V
Full-Scale Current Adjust Resistors
RBIAS_HD and RBIAS_SD
-1%
1.2
+1%
kΩ
Dynamic Specifications
Output Update Rate (FCLK)
Signal Bandwidth
HD DACs at 1080i60
74.25
HD DACs at 1080p60
148.5
MHz
SD DACs
27
HD DACs at 1080i60
30
MHz
HD DACs at 1080p60
60
MHz
6
MHz
HD DACs at 1080i60
FCLK = 74.25 MHz,
FOUT = 30 MHz
60
dB
HD DACs at 1080p60
FCLK = 148.5 MHz,
FOUT = 60 MHz
60
dB
SD DACs
FCLK = 27 MHz / 54 MHz,
FOUT = 6 MHz
60
dB
SD DACs
Spurious - Free Dynamic Range (SFDR)
MHz
54
Peripheral Information and Timings
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8.11 Inter-Integrated Circuit (I2C)
The device includes two inter-integrated circuit (I2C) modules which provide an interface to other devices
compliant with Philips Semiconductors Inter-IC bus (I2C-bus™) specification version 2.1. External
components attached to this 2-wire serial bus can transmit/receive 8-bit data to/from the device through
the I2C module. The I2C port does not support CBUS compatible devices.
The I2C port supports the following features:
• Compatible with Philips I2C Specification Revision 2.1 (January 2000)
• Standard and fast modes from 10 - 400 Kbps (no fail-safe I/O buffers)
• Noise filter to remove noise 50 ns or less
• Seven- and ten-bit device addressing modes
• Multimaster transmitter/slave receiver mode
• Multimaster receiver/slave transmitter mode
• Combined master transmit/receive and receive/transmit modes
• Two DMA channels, one interrupt line
• Built-in FIFO (32 byte) for buffered read or write.
For more detailed information on the I2C peripheral, see the I2C chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
8.11.1 I2C Peripheral Register Descriptions
Table 8-74. I2C Registers
I2C0 HEX ADDRESS
I2C1 HEX ADDRESS
ACRONYM
0x4802 8000
0x4802 A000
I2C_REVNB_LO
Module Revision (LOW BYTES)
0x4802 8004
0x4802 A004
I2C_REVNB_HI
Module Revision (HIGH BYTES)
0x4802 8010
0x4802 A010
I2C_SYSC
System configuration
0x4802 8020
0x4802 A020
I2C_EOI
I2C End of Interrupt
0x4802 8024
0x4802 A024
I2C_IRQSTATUS_RAW
252
REGISTER NAME
I2C Status Raw
0x4802 8028
0x4802 A028
I2C_IRQSTATUS
0x4802 802C
0x4802 A02C
I2C_IRQENABLE_SET
I2C Interrupt Enable Set
0x4802 8030
0x4802 A030
I2C_IRQENABLE_CLR
I2C Interrupt Enable Clear
0x4802 8034
0x4802 A034
I2C_WE
0x4802 8038
0x4802 A038
I2C_DMARXENABLE_SET
Receive DMA Enable Set
0x4802 803C
0x4802 A03C
I2C_DMATXENABLE_SET
Transmit DMA Enable Set
0x4802 8040
0x4802 A040
I2C_DMARXENABLE_CLR
Receive DMA Enable Clear
0x4802 8044
0x4802 A044
I2C_DMATXENABLE_CLR
Transmit DMA Enable Clear
0x4802 8048
0x4802 A048
I2C_DMARXWAKE_EN
Receive DMA Wakeup
0x4802 804C
0x4802 A04C
I2C_DMATXWAKE_EN
Transmit DMA Wakeup
0x4802 8090
0x4802 A090
I2C_SYSS
0x4802 8094
0x4802 A094
I2C_BUF
Buffer Configuration
0x4802 8098
0x4802 A098
I2C_CNT
Data Counter
0x4802 809C
0x4802 A09C
I2C_DATA
Data Access
0x4802 80A4
0x4802 A0A4
I2C_CON
I2C Configuration
0x4802 80A8
0x4802 A0A8
I2C_OA
I2C Own Address
0x4802 80AC
0x4802 A0AC
I2C_SA
I2C Slave Address
0x4802 80B0
0x4802 A0B0
I2C_PSC
I2C Clock Prescaler
0x4802 80B4
0x4802 A0B4
I2C_SCLL
I2C SCL Low Time
0x4802 80B8
0x4802 A0B8
I2C_SCLH
I2C SCL High Time
0x4802 80BC
0x4802 A0BC
I2C_SYSTEST
Peripheral Information and Timings
I2C Status
I2C Wakeup Enable
System Status
System Test
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Table 8-74. I2C Registers (continued)
I2C0 HEX ADDRESS
I2C1 HEX ADDRESS
ACRONYM
0x4802 80C0
0x4802 A0C0
I2C_BUFSTAT
REGISTER NAME
0x4802 80C4
0x4802 A0C4
I2C_OA1
I2C Own Address 1
0x4802 80C8
0x4802 A0C8
I2C_OA2
I2C Own Address 2
0x4802 80CC
0x4802 A0CC
I2C_OA3
I2C Own Address 3
0x4802 80D0
0x4802 A0D0
I2C_ACTOA
Active Own Address
0x4802 80D4
0x4802 A0D4
I2C_SBLOCK
I2C Buffer Status
I2C Clock Blocking Enable
Peripheral Information and Timings
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8.11.2 I2C Electrical Data/Timing
Table 8-75. Timing Requirements for I2C Input
(see Figure 8-72)
NO.
MIN
Standard_IC
10
Fast_IC
2.5
MAX
1
tc(SCL)
Cycle time, SCL
2
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a
repeated Start condition)
Standard_IC
4.7
Fast_IC
0.6
3
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a Start
and a repeated Start condition)
Standard_IC
4
tw(SCLL)
Pulse duration, SCL low
5
tw(SCLH)
Pulse duration, SCL high
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
7
th(SCLL-SDA)
Hold time, SDA valid after SCL low (for I2C
bus devices)
Standard_IC
0
3.45
Fast_IC
0
0.9
8
tw(SDAH)
Pulse duration, SDA high between Stop and
Start conditions
Standard_IC
4.7
Fast_IC
1.3
13
tsu(SCLH-SDAH)
Setup time, high before SDA high (for Stop
condition)
Standard_IC
14
tw(SDA)
tw(SCL)
0.6
Standard_IC
4.7
Fast_IC
1.3
Standard_IC
Pulse duration, spike (must be suppressed)
µs
µs
4
Fast_IC
µs
µs
4
Fast_IC
0.6
Standard_IC
250
Fast_IC
100
UNIT
µs
ns
µs
µs
4
µs
Fast_IC
0.6
Fast_IC
0
50
Fast_IC
0
50
ns
9
11
I2C[x]_SDA
6
8
14
4
13
5
10
I2C[x]_SCL
1
12
3
7
2
3
Stop
Start
Repeated
Start
Stop
Figure 8-72. I2C Receive Timing
254
Peripheral Information and Timings
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Table 8-76. Switching Characteristics Over Recommended Operating Conditions for I2C Output
(see Figure 8-73)
NO.
PARAMETER
MIN
Standard_OC
10
Fast_OC
2.5
16
tc(SCL)
Cycle time, SCL
17
tsu(SCLH-SDAL)
Setup Time, SCL high before SDA low (for a
repeated START condition)
Standard_OC
4.7
Fast_OC
0.6
18
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a
START and a repeated START condition
Standard_OC
19
tw(SCLL)
Pulse duration, SCL low
20
tw(SCLH)
Pulse duration, SCL high
21
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
22
th(SCLL-SDA)
Hold time, SDA valid after SCL low (For IIC
bus devices)
23
tw(SDAH)
Pulse duration, SDA high between STOP and Standard_OC
START conditions
Fast_OC
28
tsu(SCLH-SDAH)
Setup time, high before SDA high (for STOP
condition)
MAX
UNIT
µs
µs
4
Fast_OC
0.6
Standard_OC
4.7
Fast_OC
1.3
Standard_OC
µs
µs
4
Fast_OC
0.6
Standard_OC
250
Fast_OC
100
µs
ns
Standard_OC
0
3.45
Fast_OC
0
0.9
µs
4.7
µs
1.3
Standard_OC
4
Fast_OC
µs
0.6
24
26
I2C[x]_SDA
21
23
19
28
20
25
I2C[x]_SCL
27
16
18
22
17
18
Stop
Start
Repeated
Start
Stop
Figure 8-73. I2C Transmit Timing
Peripheral Information and Timings
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8.12 Multichannel Audio Serial Port (McASP)
The multichannel audio serial port (McASP) functions as a general-purpose audio serial port optimized for
the needs of multichannel audio applications. The McASP is useful for time-division multiplexed (TDM)
stream, Inter-Integrated Sound (I2S) protocols, and intercomponent digital audio interface transmission
(DIT).
8.12.1 McASP Device-Specific Information
The device includes three multichannel audio serial port (McASP) interface peripherals (McASP0,
McASP1, and McASP2). The McASP module consists of a transmit and receive section. These sections
can operate completely independently with different data formats, separate master clocks, bit clocks, and
frame syncs or, alternatively, the transmit and receive sections may be synchronized. The McASP module
also includes shift registers that may be configured to operate as either transmit data or receive data. The
transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM) synchronous
serial format or in a digital audio interface (DIT) format where the bit stream is encoded for S/PDIF, AES3, IEC-60958, CP-430 transmission. The receive section of the McASP peripheral supports the TDM
synchronous serial format.
The McASP module can support one transmit data format (either a TDM format or DIT format) and one
receive format at a time. All transmit shift registers use the same format and all receive shift registers use
the same format; however, the transmit and receive formats need not be the same. Both the transmit and
receive sections of the McASP also support burst mode, which is useful for non-audio data (for example,
passing control information between two devices).
The McASP peripheral has additional capability for flexible clock generation and error detection/handling,
as well as error management.
The device McASP0 module has six serial data pins, while McASP1 and McASP2 are limited to two serial
data pins each.
The McASP FIFO size is 256 bytes and two DMA and two interrupt requests are supported. Buffers are
used transparently to better manage DMA, which can be leveraged to manage data flow more efficiently.
For more detailed information on and the functionality of the McASP peripheral, see the McASP chapter in
the AM389x Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
256
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8.12.2 McASP0, McASP1, and McASP2 Peripheral Register Descriptions
Table 8-77. McASP0/1/2 Registers
MCASP0 ADDRESS
MCASP1 ADDRESS
MCASP2 ADDRESS
ACRONYM
0x4803 8000
0x4803 C000
0x4805 0000
PID
0x4803 8004
0x4803 C004
0x4805 0004
PWRIDLE
SYSCONFIG
0x4803 8010
0x4803 C010
0x4805 0010
PFUNC
Pin Function
0x4803 8014
0x4803 C014
0x4805 0014
PDIR
Pin Direction
0x4803 8018
0x4803 C018
0x4805 0018
PDOUT
Pin Data Out
PDIN
REGISTER NAME
Peripheral ID
Power Idle SYSCONFIG
Pin Data Input (Read)
Read returns pin data input
PDSET
Pin Data Set (Write)
Writes effect pin data set
(alternate write address
PDOUT)
0x4805 0020
PDCLR
Pin Data Clear
0x4805 0044
GBLCTL
Global Control
0x4803 801C
0x4803 C01C
0x4805 001C
0x4803 8020
0x4803 C020
0x4803 8044
0x4803 C044
0x4803 8048
0x4803 C048
0x4805 0048
AMUTE
Mute Control
0x4803 804C
0x4803 C04C
0x4805 004C
LBCTL
Loop-Back Test Control
0x4803 8050
0x4803 C050
0x4805 0050
TXDITCTL
Transmit DIT Mode Control
0x4803 8060
0x4803 C060
0x4805 0060
GBLCTLR
Alias of GBLCTL containing
only receiver reset bits;
allows transmit to be reset
independently from receive
0x4803 8064
0x4803 C064
0x4805 0064
RXMASK
Receiver Bit Mask
0x4803 8068
0x4803 C068
0x4805 0068
RXFMT
0x4803 806C
0x4803 C06C
0x4805 006C
RXFMCTL
Receive Frame Sync
Control
0x4803 8070
0x4803 C070
0x4805 0070
ACLKRCTL
Receive Clock Control
0x4803 8074
0x4803 C074
0x4805 0074
AHCLKRCTL
High Frequency Receive
Clock Control
0x4803 8078
0x4803 C078
0x4805 0078
RXTDM
Receive TDM Slot 0-31
0x4803 807C
0x4803 C07C
0x4805 007C
EVTCTLR
0x4803 8080
0x4803 C080
0x4805 0080
RXSTAT
0x4803 8084
0x4803 C084
0x4805 0084
RXTDMSLOT
0x4803 8088
0x4803 C088
0x4805 0088
RXCLKCHK
Receiver Clock Check
Control
0x4803 808C
0x4803 C08C
0x4805 008C
REVTCTL
Receiver DMA Event
Control
0x4803 80A0
0x4803 C0A0
0x4805 00A0
GBLCTLX
Alias of GBLCTL containing
only transmit reset bits;
allows transmit to be reset
independently from receive
0x4803 80A4
0x4803 C0A4
0x4805 00A4
TXMASK
Transmit Format Unit Bit
Mask
0x4803 80A8
0x4803 C0A8
0x4805 00A8
TXFMT
0x4803 80AC
0x4803 C0AC
0x4805 00AC
TXFMCTL
Transmit Frame Sync
Control
0x4803 80B0
0x4803 C0B0
0x4805 00B0
ACLKXCTL
Transmit Clock Control
0x4803 80B4
0x4803 C0B4
0x4805 00B4
AHCLKXCTL
High Frequency Transmit
Clock Control
Transmit TDM Slot 0-31
0x4803 80B8
0x4803 C0B8
0x4805 00B8
TXTDM
0x4803 80BC
0x4803 C0BC
0x4805 00BC
EVTCTLX
0x4803 80C0
0x4803 C0C0
0x4805 00C0
TXSTAT
Receive Bitstream Format
Receiver Interrupt Control
Status Receiver
Current Receive TDM Slot
Transmit Bitstream Format
Transmitter Interrupt Control
Status Transmitter
Peripheral Information and Timings
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Table 8-77. McASP0/1/2 Registers (continued)
258
MCASP0 ADDRESS
MCASP1 ADDRESS
MCASP2 ADDRESS
ACRONYM
0x4803 80C4
0x4803 C0C4
0x4805 00C4
TXTDMSLOT
0x4803 80C8
0x4803 C0C8
0x4805 00C8
TXCLKCHK
0x4803 80CC
0x4803 C0CC
0x4805 00CC
XEVTCTL
0x4803 80D0
0x4803 C0D0
0x4805 00D0
CLKADJEN
One-shot Clock Adjust
Enable
0x4803 8100
0x4803 C100
0x4805 0100
DITCSRA0
Left (Even TDM Slot)
Channel Status Register
File
0x4803 8104
0x4803 C104
0x4805 0104
DITCSRA1
Left (Even TDM Slot)
Channel Status Register
File
0x4803 8108
0x4803 C108
0x4805 0108
DITCSRA2
Left (Even TDM Slot)
Channel Status Register
File
0x4803 810C
0x4803 C10C
0x4805 010C
DITCSRA3
Left (Even TDM Slot)
Channel Status Register
File
0x4803 8110
0x4803 C110
0x4805 0110
DITCSRA4
Left (Even TDM Slot)
Channel Status Register
File
0x4803 8114
0x4803 C114
0x4805 0114
DITCSRA5
Left (Even TDM Slot)
Channel Status Register
File
0x4803 8118
0x4803 C118
0x4805 0118
DITCSRB0
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 811C
0x4803 C11C
0x4805 011C
DITCSRB1
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 8120
0x4803 C120
0x4805 0120
DITCSRB2
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 8124
0x4803 C124
0x4805 0124
DITCSRB3
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 8128
0x4803 C128
0x4805 0128
DITCSRB4
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 812C
0x4803 C12C
0x4805 012C
DITCSRB5
Right (Odd TDM Slot)
Channel Status Register
File
0x4803 8130
0x4803 C130
0x4805 0130
DITUDRA0
Left (Even TDM Slot) User
Data Register File
0x4803 8134
0x4803 C134
0x4805 0134
DITUDRA1
Left (Even TDM Slot) User
Data Register File
0x4803 8138
0x4803 C138
0x4805 0138
DITUDRA2
Left (Even TDM Slot) User
Data Register File
0x4803 813C
0x4803 C13C
0x4805 013C
DITUDRA3
Left (Even TDM Slot) User
Data Register File
0x4803 8140
0x4803 C140
0x4805 0140
DITUDRA4
Left (Even TDM Slot) User
Data Register File
0x4803 8144
0x4803 C144
0x4805 0144
DITUDRA5
Left (Even TDM Slot) User
Data Register File
0x4803 8148
0x4803 C148
0x4805 0148
DITUDRB0
Right (Odd TDM Slot) User
Data Register File
0x4803 814C
0x4803 C14C
0x4805 014C
DITUDRB1
Right (Odd TDM Slot) User
Data Register File
Peripheral Information and Timings
REGISTER NAME
Current Transmit TDM Slot
Transmit Clock Check
Control
Transmitter DMA Control
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Table 8-77. McASP0/1/2 Registers (continued)
MCASP0 ADDRESS
MCASP1 ADDRESS
MCASP2 ADDRESS
ACRONYM
REGISTER NAME
0x4803 8150
0x4803 C150
0x4805 0150
DITUDRB2
Right (Odd TDM Slot) User
Data Register File
0x4803 8154
0x4803 C154
0x4805 0154
DITUDRB3
Right (Odd TDM Slot) User
Data Register File
0x4803 8158
0x4803 C158
0x4805 0158
DITUDRB4
Right (Odd TDM Slot) User
Data Register File
0x4803 815C
0x4803 C15C
0x4805 015C
DITUDRB5
Right (Odd TDM Slot) User
Data Register File
0x4803 8180 0x4803 81BC
0x4803 C180 0x4803 C1BC
0x4805 0180 - 0x4805
01BC
XRSRCTL0 XRSRCTL15
0x4803 8200 0x4803 8 23C
0x4803 C200 0x4803 C23C
0x4805 0200 - 0x4805 023C
TXBUF0 TXBUF15
Transmit Buffer for
Serializer 0 - Transmit
Buffer for Serializer 15
0x4803 8280 0x4803 82BC
0x4803 C280 0x4803 C2BC
0x4805 0280 - 0x4805
02BC
RXBUF0 RXBUF15
Receive Buffer for Serializer
0 - Receive Buffer for
Serializer 15
0x4803 9000
0x4803 D000
0x4805 1000
BUFFER_CFGRD Write FIFO Control
_WFIFOCTL
0x4803 9004
0x4803 D004
0x4805 1004
BUFFER_CFGRD Write FIFO Status
_WFIFOSTS
0x4803 9008
0x4803 D008
0x4805 1008
BUFFER_CFGRD Read FIFO Control
_RFIFOCTL
0x4803 900C
0x4803 D00C
0x4805 100C
BUFFER_CFGRD Read FIFO Status
_RFIFOSTS
Serializer 0 Control Serializer 15 Control
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8.12.3 McASP Electrical Data/Timing
Table 8-78. Timing Requirements for McASP (1)
(see Figure 8-74)
NO.
MIN
MAX
UNIT
1
tc(AHCLKRX)
Cycle time, MCA[x]_AHCLKR/X
20
ns
2
tw(AHCLKRX)
Pulse duration, MCA[x]_AHCLKR/X high or low
10
ns
3
tc(ACLKRX)
Cycle time, MCA[x]_ACLKR/X
20
ns
4
tw(ACLKRX)
Pulse duration, MCA[x]_ACLKR/X high or low
10
ns
ACLKR/X int
5
tsu(AFSRX-ACLKRX)
Setup time, MCA[x]_AFSR/X input valid before
MCA[x]_ACLKR/X
ACLKR/X ext in
ACLKR/X ext out
ACLKR/X int
6
th(ACLKRX-AFSRX)
Hold time, MCA[x]_AFSR/X input valid after
MCA[x]_ACLKR/X
ACLKR/X ext in
ACLKR/X ext out
ACLKR/X int
7
tsu(AXR-ACLKRX)
Setup time, MCA[x]_AXR input valid before
MCA[x]_ACLKR/X
ACLKR/X ext in
ACLKR/X ext out
ACLKR/X int
8
(1)
260
th(ACLKRX-AXR)
Hold time, MCA[x]_AXR input valid after
MCA[x]_ACLKR/X
11.5
4
ns
4
-1
0.5
ns
0.5
11.5
4
ns
4
-1
ACLKR/X ext in
0.5
ACLKR/X ext out
0.5
ns
ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
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2
1
2
MCA[x]_ACLKR/X (Falling Edge Polarity)
MCA[x]_AHCLKR/X (Rising Edge Polarity)
4
4
3
MCA[x]_ACLKR/X (CLKRP = CLKXP = 0)
MCA[x]_ACLKR/X (CLKRP = CLKXP = 1)
(A)
(B)
6
5
MCA[x]_AFSR/X (Bit Width, 0 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 1 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 2 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 0 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 1 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 2 Bit Delay)
8
7
MCA[x]_AXR[x] (Data In/Receive)
A.
B.
For CLKRP = CLKXP =
receiver is configured for
For CLKRP = CLKXP =
receiver is configured for
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
falling edge (to shift data in).
1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
rising edge (to shift data in).
C31
Figure 8-74. McASP Input Timing
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Table 8-79. Switching Characteristics Over Recommended Operating Conditions for McASP (1)
(see Figure 8-75)
NO.
PARAMETER
9
tc(AHCLKRX)
Cycle time, MCA[x]_AHCLKR/X
10
tw(AHCLKRX)
Pulse duration, MCA[x]_AHCLKR/X high or low
11
tc(ACLKRX)
Cycle time, MCA[x]_ACLKR/X
12
13
tw(ACLKRX)
td(ACLKRX-AFSRX)
Pulse duration, MCA[x]_ACLKR/X high or low
Delay time, MCA[x]_ACLKR/X transmit edge to
MCA[x]_AFSR/X output valid
Delay time, MCA[x]_ACLKR/X transmit edge to
MCA[x]_AFSR/X output valid with Pad Loopback
14
td(ACLKX-AXR)
Delay time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output valid
Delay time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output valid with Pad Loopback
Disable time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output high impedance
15
(1)
(2)
(3)
262
tdis(ACLKX-AXR)
MIN
Disable time, MCA[x]_ACLKX transmit edge to
MCA[x]_AXR output high impedance with Pad
Loopback
MAX
ns
0.5P 2.5 (3)
ns
20
ns
0.5P 2.5 (3)
ns
ACLKR/X int
0
6
ACLKR/X ext in
2
13.5
ACLKR/X ext out
2
13.5
ACLKX int
-1
5
ACLKX ext in
2
13.5
ACLKX ext out
2
13.5
-1
5
ACLKX ext in
2
13.5
ACLKX ext out
2
13.5
ACLKX int
UNIT
20 (2)
ns
ns
ns
ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
50 MHz
P = AHCLKR/X period.
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10
10
9
MCA[x]_ACLKR/X (Falling Edge Polarity)
MCA[x]_AHCLKR/X (Rising Edge Polarity)
11
MCA[x]_ACLKR/X (CLKRP = CLKXP = 1)
MCA[x]_ACLKR/X (CLKRP = CLKXP = 0)
12
12
(A)
(B)
13
13
13
13
MCA[x]_AFSR/X (Bit Width, 0 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 1 Bit Delay)
MCA[x]_AFSR/X (Bit Width, 2 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 0 Bit Delay)
13
13
13
MCA[x]_AFSR/X (Slot Width, 1 Bit Delay)
MCA[x]_AFSR/X (Slot Width, 2 Bit Delay)
MCA[x]_AXR[x] (Data Out/Transmit)
14
15
A.
B.
For CLKRP = CLKXP =
receiver is configured for
For CLKRP = CLKXP =
receiver is configured for
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
rising edge (to shift data in).
0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
falling edge (to shift data in).
Figure 8-75. McASP Output Timing
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8.13 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
• Full-duplex communication
• Double-buffered data registers, which allow a continuous data stream
• Independent framing and clocking for receive and transmit
• Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices
• Supports TDM, I2S, and similar formats
• External shift clock or an internal, programmable frequency shift clock for data transfer
• 5KB Tx and Rx buffer
• Supports three interrupt and two DMA requests.
The McBSP module may support two types of data transfer at the system level:
• The full-cycle mode, for which one clock period is used to transfer the data, generated on one edge
and captured on the same edge (one clock period later).
• The half-cycle mode, for which one half clock period is used to transfer the data, generated on one
edge and captured on the opposite edge (one half clock period later). Note that a new data is
generated only every clock period, which secures the required hold time. The interface clock
(CLKX/CLKR) activation edge (data/frame sync capture and generation) has to be configured
accordingly with the external peripheral (activation edge capability) and the type of data transfer
required at the system level.
For more detailed information on the McBSP peripheral, see the McBSP chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7).
The following sections describe the timing characteristics for applications in normal mode (that is, the
McBSP connected to one peripheral) and TDM applications in multipoint mode.
8.13.1 McBSP Peripheral Register Descriptions
Table 8-80. McBSP Registers (1)
(1)
264
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4700 0000
DRR_REG
McBSP data receive
0x4700 0008
DXR_REG
McBSP data transmit
0x4700 0010
SPCR2_REG
McBSP serial port control 2
0x4700 0014
SPCR1_REG
McBSP serial port control 1
0x4700 0018
RCR2_REG
McBSP receive control 2
0x4700 001C
RCR1_REG
McBSP receive control 1
0x4700 0020
XCR2_REG
McBSP transmit control 2
0x4700 0024
XCR1_REG
McBSP transmit control 1
0x4700 0028
SRGR2_REG
McBSP sample rate generator 2
0x4700 002C
SRGR1_REG
McBSP sample rate generator 1
0x4700 0030
MCR2_REG
McBSP multichannel 2
0x4700 0034
MCR1_REG
McBSP multichannel 1
0x4700 0038
RCERA_REG
McBSP receive channel enable partition A
0x4700 003C
RCERB_REG
McBSP receive channel enable partition B
0x4700 0040
XCERA_REG
McBSP transmit channel enable partition A
0x4700 0044
XCERB_REG
McBSP transmit channel enable partition B
0x4700 0048
PCR_REG
0x4700 004C
RCERC_REG
McBSP pin control
McBSP receive channel enable partition C
Note that the McBSP registers are 32-bit aligned.
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Table 8-80. McBSP Registers(1) (continued)
HEX ADDRESS
ACRONYM
0x4700 0050
RCERD_REG
REGISTER NAME
McBSP receive channel enable partition D
0x4700 0054
XCERC_REG
McBSP transmit channel enable partition C
0x4700 0058
XCERD_REG
McBSP transmit channel enable partition D
0x4700 005C
RCERE_REG
McBSP receive channel enable partition E
0x4700 0060
RCERF_REG
McBSP receive channel enable partition F
0x4700 0064
XCERE_REG
McBSP transmit channel enable partition E
0x4700 0068
XCERF_REG
McBSP transmit channel enable partition F
0x4700 006C
RCERG_REG
McBSP receive channel enable partition G
0x4700 0070
RCERH_REG
McBSP receive channel enable partition H
0x4700 0074
XCERG_REG
McBSP transmit channel enable partition G
0x4700 0078
XCERH_REG
McBSP transmit channel enable partition H
0x4700 007C
REV_REG
0x4700 0080
RINTCLR_REG
McBSP revision number
McBSP receive interrupt clear
0x4700 0084
XINTCLR_REG
McBSP transmit interrupt clear
0x4700 0088
ROVFLCLR_REG
McBSP receive overflow interrupt clear
0x4700 008C
SYSCONFIG_REG
McBSP system configuration
0x4700 0090
THRSH2_REG
McBSP transmit buffer threshold (DMA or IRQ trigger)
0x4700 0094
THRSH1_REG
McBSP receive buffer threshold (DMA or IRQ trigger)
0x4700 00A0
IRQSTATATUS
McBSP interrupt status (OCP compliant IRQ line)
0x4700 00A4
IRQENABLE
McBSP interrupt enable (OCP compliant IRQ line)
0x4700 00A8
WAKEUPEN
McBSP wakeup enable
0x4700 00AC
XCCR_REG
McBSP transmit configuration control
0x4700 00B0
RCCR_REG
McBSP receive configuration control
0x4700 00B4
XBUFFSTAT_REG
McBSP transmit buffer status
0x4700 00B8
RBUFFSTAT_REG
McBSP receive buffer status
0x4700 00C0
STATUS_REG
McBSP status
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8.13.2 McBSP Electrical Data/Timing
Table 8-81. Timing Requirements for McBSP - Master Mode (1)
(see Figure 8-76)
NO.
MIN
MAX
UNIT
6
tsu(DRV-CLKAE)
Setup time, MCB_DR valid before MCB_CLK active edge (2)
3.5
ns
7
th(CLKAE-DRV)
Hold time, MCB_DR valid after MCB_CLK active edge (2)
0.1
ns
(1)
The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
MCB_CLK corresponds to either MCB_CLKX or MCB_CLKR.
(2)
Table 8-82. Switching Characteristics Over Recommended Operating Conditions for McBSP - Master
Mode (1)
(see Figure 8-76)
NO.
PARAMETER
MIN
(2)
MAX
UNIT
1
tc(CLK)
Cycle time, output MCB_CLK period
20.83
ns
2
tw(CLKL)
Pulse duration, output MCB_CLK low (2)
0.5*P - 1 (3)
ns
3
tw(CLKH)
Pulse duration, output MCB_CLK high (2)
0.5*P - 1 (3)
ns
4
td(CLKAE-FSV)
Delay time, output MCB_CLK active edge to output MCB_FS
valid (2) (4)
0.7
9.4
ns
5
td(CLKXAE-DXV)
Delay time, output MCB_CLKX active edge to output MCB_DX
valid
0.7
9.4
ns
(1)
(2)
(3)
(4)
The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
MCB_CLK corresponds to either MCB_CLKX or MCB_CLKR.
P = MCB_CLKX/MCB_CLKR output CLK period, in ns; use whichever value is greater. This parameter applies to the maximum McBSP
frequency. Operate serial clocks (CLKX/R) in the reasonable range of 40/60 duty cycle.
MCB_FS corresponds to either MCB_FSX or MCB_FSR.
2
1
3
MCB_CLK
4
4
MCB_FS
5
MCB_DX
5
MCB_DX7
5
MCB_DX6
MCB_DX0
MCB_DR6
MCB_DR0
7
6
MCB_DR
A.
B.
C.
D.
E.
F.
MCB_DR7
The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive
output data and capture input data.
MCBSP_CLK corresponds to either MCBSP_CLKX or MCBSP_CLKR; MCBSP_FS corresponds to either
MCBSP_FSX
or
MCBSP_FSR.
McBSP in 6-pin mode: DX and DR as data pins; CLKX, CLKR, FSX and FSR as control pins.
McBSP in 4-pin mode: DX and DR as data pins; CLKX and FSX pins as control pins. The CLKX and FSX pins are
internally looped back via software configuration, respectively to the CLKR and FSR internal signals for data receive.
The polarity of McBSP frame synchronization is software configurable.
The active clock edge selection of MCBSP_CLK (rising or falling) on which MCBSP_DX data is latched and
MCBSP_DR data is sampled is software configurable.
Timing diagrams are for data delay set to 1.
For further details about the registers used to configure McBSP, see the McBSP chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Figure 8-76. McBSP Master Mode Timing
266
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Table 8-83. Timing Requirements for McBSP - Slave Mode (1)
(see Figure 8-77)
NO.
1
MIN
tc(CLK)
Cycle time, MCB_CLK period (2)
(2)
2
tw(CLKL)
Pulse duration, MCB_CLK low
3
tw(CLKH)
Pulse duration, MCB_CLK high (2)
4
tsu(FSV-CLKAE)
Setup time, MCB_FS valid before MCB_CLK active edge (2) (4)
5
th(CLKAE-FSV)
Hold time, MCB_FS valid after MCB_CLK active edge (2) (4)
7
tsu(DRV-CLKAE)
Setup time, MCB_DR valid before MCB_CLK active edge
8
th(CLKAE-DRV)
Hold time, MCB_DR valid after MCB_CLK active edge (2)
(1)
UNIT
ns
(3)
ns
0.5*P - 1 (3)
ns
3.8
ns
0
ns
3.8
ns
0
ns
0.5*P - 1
(2)
MAX
20.83
The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
MCB_CLK corresponds to either MCB_CLKX or MCB_CLKR.
P = MCB_CLKX/MCB_CLKR output CLK period, in ns; use whichever value is greater. This parameter applies to the maximum McBSP
frequency. Operate serial clocks (CLKX/R) in the reasonable range of 40/60 duty cycle.
MCB_FS corresponds to either MCB_FSX or MCB_FSR.
(2)
(3)
(4)
Table 8-84. Switching Characteristics Over Recommended Operating Conditions for McBSP - Slave
Mode (1)
(see Figure 8-77)
NO.
6
(1)
PARAMETER
td(CLKXAE-DXV)
Delay time, input MCB_CLKx active edge to output MCB_DX valid
MIN
MAX
UNIT
0.5
12.5
ns
The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive output data and capture
input data.
2
1
3
MCB_CLK
4
5
MCB_FS
6
6
MCB_DX
MCB_DX7
6
MCB_DX6
MCB_DX0
MCB_DR6
MCB_DR0
8
7
MCB_DR
A.
B.
C.
D.
E.
F.
MCB_DR7
The timings apply to all configurations regardless of MCB_CLK polarity and which clock edges are used to drive
output data and capture input data.
MCBSP_CLK corresponds to either MCBSP_CLKX or MCBSP_CLKR; MCBSP_FS corresponds to either
MCBSP_FSX
or
MCBSP_FSR.
McBSP in 6-pin mode: DX and DR as data pins; CLKX, CLKR, FSX and FSR as control pins.
McBSP in 4-pin mode: DX and DR as data pins; CLKX and FSX pins as control pins. The CLKX and FSX pins are
internally looped back via software configuration, respectively to the CLKR and FSR internal signals for data receive.
The polarity of McBSP frame synchronization is software configurable.
The active clock edge selection of MCBSP_CLK (rising or falling) on which MCBSP_DX data is latched and
MCBSP_DR data is sampled is software configurable.
Timing diagrams are for data delay set to 1.
For further details about the registers used to configure McBSP, see the McBSP chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
Figure 8-77. McBSP Slave Mode Timing
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8.14 Peripheral Component Interconnect Express (PCIe)
The device supports connections to PCIe-compliant devices via the integrated PCIe master/slave bus
interface. The PCIe module is comprised of a dual-mode PCIe core and a SerDes PHY. The device
implements a single two-lane PCIe 2.0 (5.0 GT/s) endpoint/root complex port.
The device PCIe supports the following features:
• Supports Gen1/Gen2 in x1 or x2 mode
• One port with up to 2 x 5 GT/s lanes
• Single virtual channel (VC), single traffic class (TC)
• Single function in end-point mode
• Automatic width and speed negotiation and lane reversal
• Max payload: 128 byte outbound, 256 byte inbound
• Automatic credit management
• ECRC generation and checking
• Configurable BAR filtering
• Supports PCIe messages
• Legacy interrupt reception (RC) and generation (EP)
• MSI generation and reception
• PCI device power management, except D3 cold with vaux
• Active state power management state L0 and L1.
For more detailed information on the PCIe port peripheral module, see the PCIe chapter in the AM389x
Sitara ARM Processors Technical Reference Manual (literature number SPRUGX7).
The PCIe peripheral on the device conforms to the PCI Express Base 2.0 Specification.
8.14.1 PCIe Design and Layout Specifications
8.14.1.1 Clock Source
A standard 100-MHz PCIe differential clock source must be used for PCIe operation (for details, see
Section 7.3.2).
8.14.1.2 PCIe Connections and Interface Compliance
The PCIe interface on the device is compliant with the PCI Express Base 2.0 Specification. Refer to the
PCIe specifications for all connections that are described in it. For coupling capacitor selection, see
Section 8.14.1.2.1.
The use of PCIe-compatible bridges and switches is allowed for interfacing with more than one other
processor or PCIe device.
8.14.1.2.1 Coupling Capacitors
AC coupling capacitors are required on the transmit data pair. Table 8-85 shows the requirements for
these capacitors.
Table 8-85. AC Coupling Capacitors Requirements
PARAMETER
PCIe AC coupling capacitor value
PCIe AC coupling capacitor package size
(1)
(2)
268
MIN
TYP
75
(1)
0402
MAX
UNIT
200
nF
0603
EIA (2)
The physical size of the capacitor should be as small as practical. Use the same size on both lines in each pair, placed side by side.
EIA LxW units; for example, a 0402 is a 40x20 mil (thousandths of an inch) surface-mount capacitor.
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8.14.1.2.2 Polarity Inversion
The PCIe specification requires polarity inversion support. This means, for layout purposes, polarity is
unimportant since each signal can change its polarity on-die inside the chip. This means polarity within a
lane is unimportant for layout.
8.14.1.2.3 Lane Reversal
The device supports lane reversal. Since there are two lanes, this means the lanes can be switched in
layout for better PCB routing.
8.14.1.3 Non-Standard PCIe Connections
The following sections contain suggestions for any PCIe connection that is not described in the official
PCIe specification, such as an on-board device-to-device connection, or device-to-other PCIe-compliant
processor connection.
8.14.1.3.1 PCB Stackup Specifications
Table 8-86 shows the stackup and feature sizes required for these types of PCIe connections.
Table 8-86. PCIe PCB Stackup Specifications
MIN
TYP
MAX
PCB Routing/Plane Layers
PARAMETER
4
6
-
Layers
Signal Routing Layers
2
3
-
Layers
Number of ground plane cuts allowed within PCIe routing region
-
-
0
Cuts
Number of layers between PCIe routing area and reference plane
(1)
UNIT
-
-
0
Layers
PCB Routing clearance
-
4
-
Mils
PCB Trace width (2)
-
4
-
Mils
PCB BGA escape via pad size
-
20
-
Mils
PCB BGA escape via hole size
-
10
Mils
0.3
mm
Processor BGA pad size (3) (4)
(1)
(2)
(3)
(4)
A reference plane may be a ground plane or the power plane referencing the PCIe signals.
In breakout area.
Non-solder mask defined pad.
Per IPC-7351A BGA pad size guideline.
8.14.1.3.2 Routing Specifications
The PCIe data signal traces must be routed to achieve 100 Ω (±20%) differential impedance and 60 Ω
(±15%) single-ended impedance. The single-ended impedance is required because differential signals are
extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes important.
These requirements are the same as those recommended in the PCIe Motherboard Checklist 1.0
document, available from PCI-SIG.
These impedances are impacted by trace width, trace spacing, distance between signals and referencing
planes, and dielectric material. Verify with a PCB design tool that the trace geometry for both data signal
pairs result in as close to 100 Ω differential impedance and 60 Ω single-ended impedance as possible. For
best accuracy, work with your PCB fabricator to ensure this impedance is met.
In general, closely coupled differential signal traces are not an advantage on PCBs. When differential
signals are closely coupled, tight spacing and width control is necessary. Very small width and spacing
variations affect impedance dramatically, so tight impedance control can be more problematic to maintain
in production.
Loosely coupled PCB differential signals make impedance control much easier. Wider traces and spacing
make obstacle avoidance easier, and trace width variations do not affect impedance as much; therefore, it
is easier to maintain an accurate impedance over the length of the signal. The wider traces also show
reduced skin effect and, therefore, often result in better signal integrity.
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Table 8-87 shows the routing specifications for the PCIe data signals.
Table 8-87. PCIe Routing Specifications
MAX
UNIT
PCIe signal trace length
PARAMETER
MIN
TYP
10 (1)
Inches
Differential pair trace matching
10 (2)
Number of stubs allowed on PCIe traces (3)
0
TX/RX pair differential impedance
80
100
120
TX/RX single ended impedance
51
60
69
Mils
Stubs
Ω
Ω
Pad size of vias on PCIe trace
25 (4)
Hole size of vias on PCIe trace
14
Mils
3
Vias (5)
Number of vias on each PCIe trace
2*DS (6)
PCIe differential pair to any other trace spacing
(1)
(2)
(3)
(4)
(5)
(6)
Mils
Beyond this, signal integrity may suffer.
For example, RXP0 within 10 Mils of RXN0.
In-line pads may be used for probing.
35-Mil antipad max recommended.
Vias must be used in pairs with their distance minimized.
DS = differential spacing of the PCIe traces.
8.14.2 PCIe Peripheral Register Descriptions
Table 8-88. PCIe Registers
270
HEX ADDRESS
ACRONYM
0x5100 0000
PID
0x5100 0004
CMD_STATUS
REGISTER NAME
Peripheral Version and ID
Command Status
0x5100 0008
CFG_SETUP
0x5100 000C
IOBASE
Config Transaction Setup
IO TLP Base
0x5100 0010
TLPCFG
TLP Attribute Configuration
0x5100 0014
RSTCMD
Reset Command and Status
0x5100 0020
PMCMD
Power Management Command
0x5100 0024
PMCFG
Power Management Configuration
0x5100 0028
ACT_STATUS
Activity Status
0x5100 0030
OB_SIZE
Outbound Size
0x5100 0034
DIAG_CTRL
0x5100 0038
ENDIAN
0x5100 003C
PRIORITY
0x5100 0050
IRQ_EOI
End of Interrupt
0x5100 0054
MSI_IRQ
MSI Interrupt IRQ
Diagnostic Control
Endian Mode
CBA Transaction Priority
0x5100 0064
EP_IRQ_SET
Endpoint Interrupt Request Set
0x5100 0068
EP_IRQ_CLR
Endpoint Interrupt Request Clear
0x5100 006C
EP_IRQ_STATUS
0x5100 0070
GPRO
General Purpose 0
0x5100 0074
GPR1
General Purpose 1
0x5100 0078
GPR2
General Purpose 2
0x5100 007C
GPR3
General Purpose 3
0x5100 0100
MSI0_IRQ_STATUS_RAW
0x5100 0104
MSI0_IRQ_STATUS
0x5100 0108
MSI0_IRQ_ENABLE_SET
MSI 0 Interrupt Enable Set
0x5100 010C
MSI0_IRQ_ENABLE_CLR
MSI 0 Interrupt Enable Clear
0x5100 0180
IRQ_STATUS_RAW
Endpoint Interrupt Status
MSI 0 Interrupt Raw Status
MSI 0 Interrupt Enabled Status
Raw Interrupt Status
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Table 8-88. PCIe Registers (continued)
HEX ADDRESS
ACRONYM
0x5100 0184
IRQ_STATUS
REGISTER NAME
Interrupt Enabled Status
0x5100 0188
IRQ_ENABLE_SET
Interrupt Enable Set
0x5100 018C
IRQ_ENABLE_CLR
Interrupt Enable Clear
0x5100 01C0
ERR_IRQ_STATUS_RAW
Raw ERR Interrupt Status
0x5100 01C4
ERR_IRQ_STATUS
0x5100 01C8
ERR_IRQ_ENABLE_SET
ERR Interrupt Enabled Status
ERR Interrupt Enable Set
0x5100 01CC
ERR_IRQ_ENABLE_CLR
ERR Interrupt Enable Clear
0x5100 01D0
PMRST_IRQ_STATUS_RAW
0x5100 01D4
PMRST_IRQ_STATUS
Power Management and Reset Interrupt Enabled Status
0x5100 01D8
PMRST_ENABLE_SET
Power Management and Reset Interrupt Enable Set
0x5100 01DC
PMRST_ENABLE_CLR
Power Management and Reset Interrupt Enable Clear
0x5100 0200
OB_OFFSET_INDEXn
Outbound Translation Region N Offset Low and Index
0x5100 0204
OB_OFFSETn_HI
0x5100 0300
IB_BAR0
0x5100 0304
IB_START0_LO
Inbound Translation 0 Start Address Low
0x5100 0308
IB_START0_HI
Inbound Translation 0 Start Address High
0x5100 030C
IB_OFFSET0
Power Management and Reset Interrupt Status
Outbound Translation Region N Offset High
Inbound Translation Bar Match 0
Inbound Translation 0 Address Offset
0x5100 0310
IB_BAR1
0x5100 0314
IB_START1_LO
Inbound Translation Bar Match 1
Inbound Translation 1 Start Address Low
0x5100 0318
IB_START1_HI
Inbound Translation 1 Start Address High
0x5100 031C
IB_OFFSET1
Inbound Translation 1 Address Offset
0x5100 0320
IB_BAR2
0x5100 0324
IB_START2_LO
Inbound Translation Bar Match 2
Inbound Translation 2 Start Address Low
0x5100 0328
IB_START2_HI
Inbound Translation 2 Start Address High
0x5100 032C
IB_OFFSET2
0x5100 0330
IB_BAR3
0x5100 0334
IB_START3_LO
Inbound Translation 3 Start Address Low
Inbound Translation 3 Start Address High
Inbound Translation 2 Address Offset
Inbound Translation Bar Match 3
0x5100 0338
IB_START3_HI
0x5100 033C
IB_OFFSET3
0x5100 0380
PCS_CFG0
PCS Configuration 0
0x5100 0384
PCS_CFG1
PCS Configuration 1
Inbound Translation 3 Address Offset
0x5100 0388
PCS_STATUS
0x5100 0390
SERDES_CFG0
PCS Status
SerDes Configuration for Lane 0
0x5100 0394
SERDES_CFG1
SerDes Configuration for Lane 1
8.14.3 PCIe Electrical Data/Timing
Texas Instruments (TI) has performed the simulation and system characterization to ensure that the PCIe
peripheral meets all AC timing specifications as required by the PCI Express Base 2.0 Specification.
Therefore, the AC timing specifications are not reproduced here. For more information on the AC timing
specifications, see Sections 4.3.3.5 and 4.3.4.4 of the PCI Express Base 2.0 Specification.
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8.15 Real-Time Clock (RTC)
The real-time clock is a precise timer that can generate interrupts on intervals specified by the user.
Interrupts can occur every second, minute, hour, or day. The clock, itself, can track the passage of real
time for durations of several years, provided it has a sufficient power source the whole time.
The basic purpose for the RTC is to keep time of day. The other equally important purpose of the RTC is
for Digital Rights management. Some degree of tamper-proofing is needed to ensure that simply stopping,
resetting, or corrupting the RTC does not go unnoticed; so, if this occurs, the application can re-acquire
the time of day from a trusted source. The final purpose of RTC is to wake up the rest of the device from a
power-down state. The RTC features include:
• Time information (hours/minutes/seconds) directly in binary coded decimal (BCD), for easy decoding.
• Calendar information (day/month/year/day of week) directly in BCD code up to year 2099.
• Shadow time and calendar access; ease of reading time.
• Interrupt generation, periodically (1d/1h/1m/1s) or at a precise time of day and/or date.
• 30-second time correction (crystal frequency compensation).
• OCP slave port for register access.
• Supports power idle protocol with SWakeUp capable on alarm or timer events.
The RTC is driven by SYSCLK18 (32.768 kHz) or an optional 32.768-kHz clock can be input on the
CLKIN32 clock input pin for RTC reference.
Figure 8-78 shows the major components of the RTC.
32.768 kHz
Counter
32 kHz
Seconds
Compensation
Minutes
Week Days
Hours
Days
Control
Month
Years
IRQ_ALARM
Interrupt
Alarm
NIRQ_TIMER
Figure 8-78. Real-Time Clock Block Diagram
8.15.1 RTC Register Descriptions
Table 8-89. RTC Registers
272
HEX ADDRESS
ACRONYM
0x480C 0000
SECONDS_REG
REGISTER NAME
Seconds
0x480C 0004
MINUTES_REG
Minutes
0x480C 0008
HOURS_REG
0x480C 000C
DAYS_REG
0x480C 0010
MONTHS_REG
0x480C 0014
YEARS_REG
Hours
Day of the Month
Month
Year
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Table 8-89. RTC Registers (continued)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x480C 0018
WEEK_REG
Day of the Week
0x480C 0020
ALARM_SECONDS_REG
Alarm Seconds
0x480C 0024
ALARM_MINUTES_REG
Alarm Minutes
0x480C 0028
ALARM_HOURS_REG
Alarm Hours
0x480C 002C
ALARM_DAYS_REG
Alarm Days
0x480C 0030
ALARM_MONTHS_REG
0x480C 0034
ALARM_YEARS_REG
Alarm Months
Alarm Years
0x480C 0040
RTC_CTRL_REG
Control
0x480C 0044
RTC_STATUS_REG
Status
0x480C 0048
RTC_INTERRUPTS_REG
0x480C 004C
RTC_COMP_LSB_REG
Compensation (LSB)
0x480C 0050
RTC_COMP_MSB_REG
Compensation (MSB)
0x480C 0054
RTC_OSC_REG
0x480C 0060
RTC_SCRATCH0_REG
Scratch 0 (general-purpose)
0x480C 0064
RTC_SCRATCH1_REG
Scratch 1 (general-purpose)
0x480C 0068
RTC_SCRATCH2_REG
Scratch 2 (general-purpose)
0x480C 006C
KICK0
Kick 0 (write protect)
0x480C 0070
KICK1
Kick 1 (write protect)
0x480C 0074
RTC_REVISION
0x480C 0078
RTC_SYSCONFIG
0x480C 007A
RTC_IRQWAKEEN_0
Interrupt Enable
Oscillator
Revision
Clock Management Configuration
Wakeup Generation
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8.16 Secure Digital/Secure Digital Input Output (SD/SDIO)
The device SD/SDIO Controller has following features:
• Secure Digital (SD) memory card with Secure Data I/O (SDIO)
• Supports SDHC (SD high capacity)
• SD/SDIO protocol support
• Programmable clock frequency
• 1024 byte read/write FIFO to lower system overhead
• Slave DMA transfer capability
• Full compliance with SD command/response sets, as defined in the SD physical layer specification
v2.00
• Full compliance with SDIO command/response sets and interrupt/read-wait suspend-resume
operations, as defined in the SD part E1 specification v 2 .00
• Full compliance with SD host controller standard specification sets as defined in the SD card
specification part A2 v2.00.
For more detailed information on SD/SDIO, see the SD/SDIO chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
8.16.1 SD/SDIO Peripheral Register Descriptions
Table 8-90. SD/SDIO Registers (1)
HEX ADDRESS
(1)
274
ACRONYM
0x4806 0000
SD_HL_REV
0x4806 0004
SD_HL_HWINFO
0x4806 0010
SD_HL_SYSCONFIG
REGISTER NAME
IP Revision Identifier
Hardware Configuration
Clock Management Configuration
0x4806 0110
SD_SYSCONFIG
System Configuration
0x4806 0114
SD_SYSSTATUS
System Status
0x4806 0124
SD_CSRE
Card status response error
0x4806 0128
SD_SYSTEST
System Test
0x4806 012C
SD_CON
Configuration
0x4806 0130
SD_PWCNT
Power counter
0x4806 0200
SD_SDMASA
SDMA System address:
0x4806 0204
SD_BLK
Transfer Length Configuration
0x4806 0208
SD_ARG
Command argument
0x4806 020C
SD_CMD
Command and transfer mode
0x4806 0210
SD_RSP10
Command Response 0 and 1
0x4806 0214
SD_RSP32
Command Response 2 and 3
0x4806 0218
SD_RSP54
Command Response 4 and 5
0x4806 021C
SD_RSP76
Command Response 6 and 7
0x4806 0220
SD_DATA
Data
0x4806 0224
SD_PSTATE
Present state
0x4806 0228
SD_HCTL
Host Control
0x4806 022C
SD_SYSCTL
0x4806 0230
SD_STAT
0x4806 0234
SD_IE
SD system control
Interrupt status
Interrupt SD enable
0x4806 0238
SD_ISE
0x4806 023C
SD_AC12
Auto CMD12 Error Status
0x4806 0240
SD_CAPA
Capabilities
0x4806 0248
SD_CUR_CAPA
Maximum current capabilities
SD/SDIO registers are limited to 32-bit data accesses; 16-bit and 8-bit accesses are not allowed and can corrupt register content.
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Table 8-90. SD/SDIO Registers(1) (continued)
HEX ADDRESS
ACRONYM
0x4806 0250
SD_FE
REGISTER NAME
Force Event
0x4806 0254
SD_ADMAES
ADMA Error Status
0x4806 0258
SD_ADMASAL
ADMA System address Low bits
0x4806 025C
SD_ADMASAH
ADMA System address High bits
0x4806 02FC
SD_REV
Versions
8.16.2 SD/SDIO Electrical Data/Timing
Table 8-91. Timing Requirements for SD/SDIO
(see Figure 8-80, Figure 8-82)
NO.
MIN
MAX
UNIT
1
tsu(CMDV-CLKH)
Setup time, SD_CMD valid before SD_CLK rising clock edge
4.1
ns
2
th(CLKH-CMDV)
Hold time, SD_CMD valid after SD_CLK rising clock edge
1.9
ns
3
tsu(DATV-CLKH)
Setup time, SD_DATx valid before SD_CLK rising clock edge
4.1
ns
4
th(CLKH-DATV)
Hold time, SD_DATx valid after SD_CLK rising clock edge
1.9
ns
Table 8-92. Switching Characteristics Over Recommended Operating Conditions for SD/SDIO
(see Figure 8-79, Figure 8-80, Figure 8-81, Figure 8-82)
NO.
7
8
PARAMETER
MIN
fop(CLK)
Operating frequency, SD_CLK
tc(CLK)
Operating period: SD_CLK
fop(CLKID)
Identification mode frequency, SD_CLK
tc(CLKID)
Identification mode period: SD_CLK
MAX
UNIT
48
MHz
400
kHz
20.8
ns
2500.0
ns
(1)
ns
9
tw(CLKL)
Pulse duration, SD_CLK low
0.5*P
10
tw(CLKH)
Pulse duration, SD_CLK high
0.5*P (1)
11
tr(CLK)
Rise time, All Signals (10% to 90%)
12
tf(CLK)
Fall time, All Signals (10% to 90%)
13
td(CLKL-CMD)
Delay time, SD_CLK rising clock edge to SD_CMD transition
2.5
14
td(CLKL-DAT)
Delay time, SD_CLK rising clock edge to SD_DATx transition
2.5
13.9
ns
(1)
ns
2.2
ns
2.2
ns
13.9
ns
P = SD_CLK period.
10
7
9
SD_CLK
13
13
START
SD_CMD
13
XMIT
Valid
Valid
13
Valid
END
Figure 8-79. SD Host Command Timing
9
7
10
SD_CLK
1
2
SD_CMD
START
XMIT
Valid
Valid
Valid
END
Figure 8-80. SD Card Response Timing
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10
9
7
SD_CLK
14
14
START
SD_DATx
14
D0
D1
14
Dx
END
Figure 8-81. SD Host Write Timing
9
10
7
SD_CLK
4
4
3
3
SD_DATx
Start
D0
D1
Dx
End
Figure 8-82. SD Host Read and Card CRC Status Timing
276
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8.17 Serial ATA Controller (SATA)
The Serial ATA (SATA) peripheral provides a direct interface for up to two hard disk drives (SATA) and
supports the following features:
• Serial ATA 1.5 Gbps and 3 Gbps speeds
• Integrated PHY
• Integrated Rx and Tx data buffers
• Supports all SATA power management features
• Hardware-assisted native command queuing (NCQ) for up to 32 entries
• Supports port multiplier with command-based switching for connection to multiple hard disk drives
• Activity LED support.
For more detailed information on the SATA, see the SATA chapter in the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
8.17.1 SATA Interface Design Specifications
This section provides PCB design and layout specifications for the SATA interface. The design rules
constrain PCB trace length, PCB trace skew, signal integrity, cross-talk, and signal timing. Simulation and
system design work has been done to ensure the SATA interface requirements are met.
A standard 100-MHz differential clock source must be used for SATA operation (for details, see
Section 7.3.2).
8.17.1.1 SATA Interface Schematic
Figure 8-83 shows the data portion of the SATA interface schematic. The specific pin numbers can be
obtained from Table 3-17, Serial ATA Terminal Functions.
SATA Interface (Processor)
SATA Connector
10 nF
SATA_TXN
SATA_TXP
TXTX+
10 nF
10 nF
SATA_RXN
SATA_RXP
RXRX+
10 nF
Figure 8-83. SATA Interface High-Level Schematic
8.17.1.2 Compatible SATA Components and Modes
Table 8-93 shows the compatible SATA components and supported modes. Note that the only supported
configuration is an internal cable from the processor host to the SATA device.
Table 8-93. SATA Supported Modes
PARAMETER
Transfer Rates
MIN
MAX
UNIT
Gbps
SUPPORTED
1.5
3.0
eSATA
-
-
-
No
xSATA
-
-
-
No
Backplane
-
-
-
No
Internal Cable
-
-
-
Yes
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8.17.1.3 PCB Stackup Specifications
Table 8-94 shows the PCB stackup and feature sizes required for SATA.
Table 8-94. SATA PCB Stackup Specifications
MIN
TYP
MAX
PCB routing/plane layers
PARAMETER
4
6
-
Layers
Signal routing layers
2
3
-
Layers
Number of ground plane cuts allowed within SATA routing region
-
-
0
Cuts
Number of layers between SATA routing region and reference ground plane
-
-
0
Layers
PCB trace width, w
-
4
-
Mils
PCB BGA escape via pad size
-
20
-
Mils
PCB BGA escape via hole size
-
Processor BGA pad size (1)
(1)
UNIT
10
Mils
0.3
mm
NSMD pad, per IPC-7351A BGA pad size guideline.
8.17.1.4 Routing Specifications
The SATA data signal traces must be routed to achieve 100 Ω (±20%) differential impedance and 60 Ω
(±15%) single-ended impedance. The single-ended impedance is required because differential signals are
extremely difficult to closely couple on PCBs and, therefore, single-ended impedance becomes important.
60 Ω is chosen for the single-ended impedance to minimize problems caused by too low an impedance.
These impedances are impacted by trace width, trace spacing, distance to reference planes, and dielectric
material. Verify with a PCB design tool that the trace geometry for both data signal pairs results in as
close to 100 Ω differential impedance and 60 Ω single-ended impedance traces as possible. For best
accuracy, work with your PCB fabricator to ensure this impedance is met.
Table 8-95 shows the routing specifications for the SATA data signals.
Table 8-95. SATA Routing Specifications
PARAMETER
MIN
TYP
Processor-to-SATA header trace length
Number of stubs allowed on SATA traces (2)
MAX
UNIT
10 (1)
Inches
0
Stubs
Ω
TX/RX pair differential impedance
80
100
120
TX/RX single ended impedance
51
60
69
Ω
3
Vias (3)
Number of vias on each SATA trace
2*DS (4)
SATA differential pair to any other trace spacing
(1)
(2)
(3)
(4)
Beyond this, signal integrity may suffer.
In-line pads may be used for probing.
Vias must be used in pairs with their distance minimized.
DS = differential spacing of the SATA traces.
8.17.1.5 Coupling Capacitors
AC coupling capacitors are required on the receive data pair. Table 8-96 shows the requirements for these
capacitors.
Table 8-96. SATA AC Coupling Capacitors Requirements
PARAMETER
SATA AC coupling capacitor value
SATA AC coupling capacitor package size (1)
(1)
(2)
278
MIN
TYP
MAX
1
10
12
0402
0603
UNIT
nF
EIA (2)
The physical size of the capacitor should be as small as practical. Use the same size on both lines in each pair, placed side by side.
EIA LxW units; for example, a 0402 is a 40x20 mil surface-mount capacitor.
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8.17.2 SATA Peripheral Register Descriptions
Table 8-97. SATA Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4A14 0000
CAP
HBA Capabilities
0x4A14 0004
GHC
Global HBA Control
0x4A14 0008
IS
Interrupt Status
0x4A14 000C
PI
Ports Implemented
0x4A14 0010
VS
AHCI Version
0x4A14 0014
CCC_CTL
0x4A14 0018
CCC_PORTS
Command Completion Coalescing Control
Command Completion Coalescing Ports
0x4A14 001C - 0x4A14 009C
-
0x4A14 00A0
BISTAFR
Reserved
BIST Active FIS
0x4A14 00A4
BISTCR
BIST Control
0x4A14 00A8
BISTFCTR
0x4A14 00AC
BISTSR
0x4A14 00B0
BISTDECR
0x4A14 00B4 - 0x4A14 00DF
-
0x4A14 00E0
TIMER1MS
0x4A14 00E4
-
0x4A14 00E8
GPARAM1R
Global Parameter 1
0x4A14 00EC
GPARAM2R
Global Parameter 2
0x4A14 00F0
PPARAMR
0x4A14 00F4
TESTR
0x4A14 00F8
VERSIONR
0x4A14 00FC
IDR (PID)
0x4A14 0100
P0CLB
0x4A14 0104
-
BIST FIS Count
BIST Status
BIST DWORD Error Count
Reserved
BIST DWORD Error Count
Reserved
Port Parameter
Test
Version
ID
Port 0 Command List Base Address
Reserved
0x4A14 0108
P0FB
0x4A14 010C
-
0x4A14 0110
P0IS
Port 0 Interrupt Status
0x4A14 0114
P0IE
Port 0 Interrupt Enable
0x4A14 0118
P0CMD
0x4A14 011C
-
0x4A14 0120
P0TFD
Port 0 Task File Data
0x4A14 0124
P0SIG
Port 0 Signature
0x4A14 0128
P0SSTS
Port 0 Serial ATA Status (SStatus)
0x4A14 012C
P0SCTL
Port 0 Serial ATA Control (SControl)
0x4A14 0130
P0SERR
Port 0 Serial ATA Error (SError)
0x4A14 0134
P0SACT
Port 0 Serial ATA Active (SActive)
0x4A14 0138
P0CI
0x4A14 013C
P0SNTF
0x4A14 0140 - 0x4A14 016C
-
0x4A14 0170
P0DMACR
Port 0 FIS Base Address
Reserved
Port 0 Command
Reserved
Port 0 Command Issue
Port 0 Serial ATA Notification
Reserved
Port 0 DMA Control
0x4A14 0174
-
0x4A14 0178
P0PHYCR
Reserved
Port 0 PHY Control
0x4A14 017C
P0PHYSR
Port 0 PHY Status
0x4A14 0180
P1CLB
0x4A14 0184
-
Port 1 Command List Base Address
Reserved
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Table 8-97. SATA Registers (continued)
280
HEX ADDRESS
ACRONYM
0x4A14 0188
P1FB
REGISTER NAME
Port 1 FIS Base Address
0x4A14 018C
-
0x4A14 0190
P1IS
Reserved
Port 1 Interrupt Status
0x4A14 0194
P1IE
Port 1 Interrupt Enable
0x4A14 0198
P1CMD
0x4A14 019C
-
0x4A14 01A0
P1TFD
Port 1 Task File Data
0x4A14 01A4
P1SIG
Port 1 Signature
0x4A14 01A8
P1SSTS
Port 1 Serial ATA Status (SStatus)
0x4A14 01AC
P1SCTL
Port 1 Serial ATA Control (SControl)
0x4A14 01B0
P1SERR
Port 1 Serial ATA Error (SError)
0x4A14 01B4
P1SACT
Port 1 Serial ATA Active (SActive)
0x4A14 01B8
P1CI
0x4A14 01BC
P1SNTF
0x4A14 01C0 - 0x4A14 01EC
-
0x4A14 01F0
P1DMACR
0x4A14 01F4
-
Port 1 Command
Reserved
Port 1 Command Issue
Port 1 Serial ATA Notification
Reserved
Port 1 DMA Control
Reserved
0x4A14 01F8
P1PHYCR
Port 1 PHY Control
0x4A14 01FC
P1PHYSR
Port 1 PHY Status
0x4A14 1100
IDLE
0x4A14 1104
PHYCFGR2
Idle and Standby Modes
PHY Configuration 2
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8.18 Serial Peripheral Interface (SPI)
The SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed
length (4 to 32 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI is
normally used for communication between the device and external peripherals. Typical applications
include an interface-to-external I/O or peripheral expansion via devices such as shift registers, display
drivers, SPI EEPROMs, and analog-to-digital converters (ADCs).
The SPI supports the following features:
• Master/slave operation
• Four chip selects for interfacing/control to up to four SPI slave devices and connection to a single
external master
• 32-bit shift register
• Buffered receive/transmit data register per channel (1 word deep), FIFO size is 64 bytes
• Programmable SPI configuration per channel (clock definition, enable polarity and word width)
• Supports one interrupt request and two DMA requests per channel.
For more detailed information on the SPI, see the SPI chapter in the AM389x Sitara ARM Processors
Technical Reference Manual (literature number SPRUGX7).
8.18.1 SPI Peripheral Register Descriptions
Table 8-98. SPI Registers
HEX ADDRESS
ACRONYM
0x4803 0000 - 0x4803 010C
-
REGISTER NAME
RESERVED
0x4803 0110
MCSPI_SYSCONFIG
SYSTEM CONFIGURATION
0x4803 0114
MCSPI_SYSSTATUS
SYSTEM STATUS
0x4803 0118
MCSPI_IRQSTATUS
INTERRUPT STATUS
0x4803 011C
MCSPI_IRQENABLE
INTERRUPT ENABLE
0x4803 0120
-
0x4803 0124
MCSPI_SYST
RESERVED
SYSTEM TEST
0x4803 0128
MCSPI_MODULCTRL
0x4803 012C
MCSPI_CH0CONF
MODULE CONTROL
CHANNEL 0 CONFIGURATION
0x4803 0130
MCSPI_CH0STAT
CHANNEL 0 STATUS
0x4803 0134
MCSPI_CH0CTRL
CHANNEL 0 CONTROL
0x4803 0138
MCSPI_TX0
CHANNEL 0 TRANSMITTER
0x4803 013C
MCSPI_RX0
CHANNEL 0 RECEIVER
0x4803 0140
MCSPI_CH1CONF
CHANNEL 1 CONFIGURATION
0x4803 0144
MCSPI_CH1STAT
CHANNEL 1 STATUS
0x4803 0148
MCSPI_CH1CTRL
CHANNEL 1 CONTROL
0x4803 014C
MCSPI_TX1
CHANNEL 1 TRANSMITTER
0x4803 0150
MCSPI_RX1
CHANNEL 1 RECEIVER
0x4803 0154
MCSPI_CH2CONF
CHANNEL 2 CONFIGURATION
0x4803 0158
MCSPI_CH2STAT
CHANNEL 2 STATUS
0x4803 015C
MCSPI_CH2CTRL
CHANNEL 2 CONTROL
0x4803 0160
MCSPI_TX2
CHANNEL 2 TRANSMITTER
0x4803 0164
MCSPI_RX2
CHANNEL 2 RECEIVER
0x4803 0168
MCSPI_CH3CONF
CHANNEL 3 CONFIGURATION
0x4803 016C
MCSPI_CH3STAT
CHANNEL 3 STATUS
0x4803 0170
MCSPI_CH3CTRL
CHANNEL 3 CONTROL
0x4803 0174
MCSPI_TX3
CHANNEL 3 TRANSMITTER
0x4803 0178
MCSPI_RX3
CHANNEL 3 RECEIVER
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Table 8-98. SPI Registers (continued)
282
HEX ADDRESS
ACRONYM
0x4803 017C
MCSPI_XFERLEVEL
0x4803 0180 - 0x4803 01FF
-
REGISTER NAME
TRANSFER LEVELS
RESERVED
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8.18.2 SPI Electrical/Data Timing
Table 8-99. Timing Requirements for SPI - Master Mode
(see Figure 8-84 and Figure 8-85)
NO.
MIN
MAX
UNIT
MASTER: 1 LOAD AT A MAXIMUM OF 5 pF
1
tc(SPICLK)
Cycle time, SPI_CLK (1) (2)
(1)
20.8 (3)
ns
(4)
ns
0.5*P - 1 (4)
ns
2
tw(SPICLKL)
Pulse duration, SPI_CLK low
3
tw(SPICLKH)
Pulse duration, SPI_CLK high (1)
0.5*P - 1
4
tsu(MISO-SPICLK)
Setup time, SPI_D[x] valid before SPI_CLK active edge (1)
2.29
ns
5
th(SPICLK-MISO)
Hold time, SPI_D[x] valid after SPI_CLK active edge (1)
2.67
ns
(1)
6
td(SPICLK-MOSI)
Delay time, SPI_CLK active edge to SPI_D[x] transition
7
td(SCS-MOSI)
Delay time, SPI_SCS[x] active edge to SPI_D[x] transition
-3.57
3.57
ns
3.57
ns
td(SCS-SPICLK)
Delay time, SPI_SCS[x] active to SPI_CLK
first edge (1)
MASTER_PHA0 (5)
9
td(SPICLK-SCS)
Delay time, SPI_CLK last edge to SPI_SCS[x]
inactive (1)
MASTER_PHA0 (5)
A-4.2 (7)
ns
MASTER_PHA1 (5)
B-4.2 (6)
ns
1
tc(SPICLK)
Cycle time, SPI_CLK (1) (2)
41.7 (8)
ns
0.5*P - 2 (4)
ns
0.5*P - 2 (4)
ns
3.02
ns
8
MASTER_PHA1
B-4.2 (6)
ns
(5)
(7)
ns
A-4.2
MASTER: UP TO 4 LOADS AT A MAXIMUM TOTAL OF 25 pF
(1)
2
tw(SPICLKL)
Pulse duration, SPI_CLK low
3
tw(SPICLKH)
Pulse duration, SPI_CLK high (1)
(1)
4
tsu(MISO-SPICLK)
Setup time, SPI_D[x] valid before SPI_CLK active edge
5
th(SPICLK-MISO)
Hold time, SPI_D[x] valid after SPI_CLK active edge (1)
6
td(SPICLK-MOSI)
Delay time, SPI_CLK active edge to SPI_D[x] transition (1)
7
td(SCS-MOSI)
Delay time, SPI_SCS[x] active edge to SPI_D[x] transition
td(SCS-SPICLK)
Delay time, SPI_SCS[x] active to SPI_CLK
first edge (1)
8
9
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
td(SPICLK-SCS)
Delay time, SPI_CLK last edge to SPI_SCS[x]
inactive (1)
2.76
-4.62
ns
4.62
ns
4.62
ns
MASTER_PHA0 (5)
B-2.54 (6)
ns
MASTER_PHA1 (5)
A-2.54 (7)
ns
(5)
(7)
ns
B-2.54 (6)
ns
MASTER_PHA0
MASTER_PHA1 (5)
A-2.54
This timing applies to all configurations regardless of SPI_CLK polarity and which clock edges are used to drive output data and capture
input data.
Related to the SPI_CLK maximum frequency.
Maximum frequency = 48 MHz
P = SPICLK period.
SPI_CLK phase is programmable with the PHA bit of the SPI_CH(i)CONF register.
B = (TCS + 0.5) * TSPICLKREF * Fratio, where TCS is a bit field of the SPI_CH(i)CONF register and Fratio = Even ≥2.
When P = 20.8 ns, A = (TCS + 1) * TSPICLKREF, where TCS is a bit field of the SPI_CH(i)CONF register. When P > 20.8 ns, A = (TCS
+ 0.5) * Fratio * TSPICLKREF, where TCS is a bit field of the SPI_CH(i)CONF register.
Maximum frequency = 24 MHz
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PHA=0
EPOL=1
SPI_SCS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
6
7
SPI_D[x] (Out)
Bit n-1
6
Bit n-3
Bit n-2
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_SCS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
6
SPI_D[x] (Out)
Bit n-1
6
Bit n-2
6
Bit n-3
6
Bit 1
Bit 0
Figure 8-84. SPI Master Mode Transmit Timing
284
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PHA=0
EPOL=1
SPI_SCS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
4
4
5
SPI_D[x] (In)
5
Bit n-1
Bit n-3
Bit n-2
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_SCS[x] (Out)
1
3
8
SPI_SCLK (Out)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (Out)
4
4
5
SPI_D[x] (In)
Bit n-1
5
Bit n-2
Bit n-3
Bit 0
Bit 1
Figure 8-85. SPI Master Mode Receive Timing
Table 8-100. Timing Requirements for SPI - Slave Mode
(see Figure 8-86 and Figure 8-87)
NO.
tc(SPICLK)
Cycle time, SPI_CLK (1) (2)
2
tw(SPICLKL)
Pulse duration, SPI_CLK low (1)
(2)
(3)
(4)
(5)
(1)
MAX
UNIT
62.5 (3)
ns
0.5*P - 3 (4)
ns
(4)
ns
3
tw(SPICLKH)
Pulse duration, SPI_CLK high
4
tsu(MOSI-SPICLK)
Setup time, SPI_D[x] valid before SPI_CLK active edge (1)
12.92
ns
5
th(SPICLK-MOSI)
Hold time, SPI_D[x] valid after SPI_CLK active edge (1)
12.92
ns
6
(1)
MIN
1
0.5*P - 3
(1)
td(SPICLK-MISO)
Delay time, SPI_CLK active edge to SPI_D[x] transition
7
td(SCS-MISO)
Delay time, SPI_SCS[x] active edge to SPI_D[x]
transition (5)
-4.00
17.1
ns
17.1
ns
8
tsu(SCS-SPICLK)
Setup time, SPI_SCS[x] valid before SPI_CLK first edge (1)
12.92
ns
9
th(SPICLK-SCS)
Hold time, SPI_SCS[x] valid after SPI_CLK last edge (1)
12.92
ns
This timing applies to all configurations regardless of SPI_CLK polarity and which clock edges are used to drive output data and capture
input data.
Related to the input maximum frequency supported by the SPI module.
Maximum frequency = 16 MHz
P = SPICLK period.
PHA = 0; SPI_CLK phase is programmable with the PHA bit of the SPI_CH(i)CONF register.
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PHA=0
EPOL=1
SPI_SCS[x] (In)
1
3
8
SPI_SCLK (In)
2
9
POL=0
1
3
2
POL=1
SPI_SCLK (In)
SPI_D[x] (Out)
6
7
6
Bit n-1
Bit n-2
Bit n-3
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_SCS[x] (In)
1
3
8
SPI_SCLK (In)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (In)
6
SPI_D[x] (Out)
Bit n-1
6
6
Bit n-2
Bit n-3
6
Bit 1
Bit 0
Figure 8-86. SPI Slave Mode Transmit Timing
286
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PHA=0
EPOL=1
SPI_SCS[x] (In)
1
3
8
SPI_SCLK (In)
2
9
POL=0
1
3
2
POL=1
SPI_SCLK (In)
4
4
5
SPI_D[x] (In)
5
Bit n-1
Bit n-3
Bit n-2
Bit 0
Bit n-4
PHA=1
EPOL=1
SPI_SCS[x] (In)
1
3
8
SPI_SCLK (In)
9
2
POL=0
1
2
3
POL=1
SPI_SCLK (In)
4
5
SPI_D[x] (In)
Bit n-1
4
5
Bit n-2
Bit n-3
Bit 1
Bit 0
Figure 8-87. SPI Slave Mode Receive Timing
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8.19 Timers
The device has seven 32-bit general-purpose (GP) timers that have the following features:
• Timers 1-3 are for software use and do not have an external connection
• Dedicated input trigger for capture mode and dedicated output trigger/pulse width modulation (PWM)
signal
• Interrupts generated on overflow, compare, and capture
• Free-running 32-bit upward counter
• Supported modes:
– Compare and capture modes
– Auto-reload mode
– Start-stop mode
• Timer[7:1] functional clock is sourced from either the 27-MHz system clock, 32.768-kHz RTC clock or
the TCLKIN external timer input clock, as selected within the PRCM
• On-the-fly read/write register (while counting)
• Generates interrupts to the ARM CPUs.
The device has one system watchdog timer that has the following features:
• Free-running 32-bit upward counter
• On-the-fly read/write register (while counting)
• Reset upon occurrence of a timer overflow condition
• Two possible clock sources:
– Internal 32.768-kHz clock derived from 27-MHz system clock.
– External clock input on the CLKIN32 input pin.
The watchdog timer is used to provide a recovery mechanism for the device in the event of a fault
condition, such as a non-exiting code loop.
For more detailed information, see the Timers chapter in the AM389x Sitara ARM Processors Technical
Reference Manual (literature number SPRUGX7).
8.19.1 Timer Peripheral Register Descriptions
Table 8-101. Timer1-7 Registers (1)
TIMER1 HEX
ADDRESS
TIMER2 HEX
ADDRESS
TIMER3 HEX
ADDRESS
TIMER4 HEX
ADDRESS
TIMER5 HEX
ADDRESS
TIMER6 HEX
ADDRESS
TIMER7 HEX
ADDRESS
0x4802 E000
0x4804 0000
0x4804 2000
0x4804 4000
0x4804 6000
0x4804 8000
0x4804 A000
TIDR
Identification
0x4802 E010
0x4804 0010
0x4804 2010
0x4804 4010
0x4804 6010
0x4804 8010
0x4804 A010
TIOCP_CFG
Timer OCP
Configuration
0x4802 E020
0x4804 0020
0x4804 2020
0x4804 4020
0x4804 6020
0x4804 8020
0x4804 A020
IRQ_EOI
Timer IRQ End-OfInterrupt
0x4802 E024
0x4804 0024
0x4804 2024
0x4804 4024
0x4804 6024
0x4804 8024
0x4804 A024
IRQSTATUS_
RAW
Timer IRQSTATUS
Raw
0x4802 E028
0x4804 0028
0x4804 2028
0x4804 4028
0x4804 6028
0x4804 8028
0x4804 A028
IRQSTATUS
Timer IRQSTATUS
0x4802 E02C
0x4804 002C
0x4804 202C
0x4804 402C
0x4804 602C
0x4804 802C
0x4804 A02C
IRQSTATUS_
SET
Timer IRQENABLE
Set
0x4802 E030
0x4804 0030
0x4804 2030
0x4804 4030
0x4804 6030
0x4804 8030
0x4804 A030
IRQSTATUS_
CLR
Timer IRQENABLE
Clear
0x4802 E034
0x4804 0034
0x4804 2034
0x4804 4034
0x4804 6034
0x4804 8034
0x4804 A034
IRQWAKEEN
Timer IRQ Wakeup
Enable
ACRONYM
REGISTER NAME
0x4802 E038
0x4804 0038
0x4804 2038
0x4804 4038
0x4804 6038
0x4804 8038
0x4804 A038
TCLR
Timer Control
0x4802 E03C
0x4804 003C
0x4804 203C
0x4804 403C
0x4804 603C
0x4804 803C
0x4804 A03C
TCRR
Timer Counter
0x4802 E040
0x4804 0040
0x4804 2040
0x4804 4040
0x4804 6040
0x4804 8040
0x4804 A040
TLDR
Timer Load
0x4802 E044
0x4804 0044
0x4804 2044
0x4804 4044
0x4804 6044
0x4804 8044
0x4804 A044
TTGR
Timer Trigger
(1)
288
All Timer registers are: 32-bit register accessible in 16-bit mode and use little-endian addressing.
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Table 8-101. Timer1-7 Registers(1) (continued)
TIMER1 HEX
ADDRESS
TIMER2 HEX
ADDRESS
TIMER3 HEX
ADDRESS
TIMER4 HEX
ADDRESS
TIMER5 HEX
ADDRESS
TIMER6 HEX
ADDRESS
TIMER7 HEX
ADDRESS
ACRONYM
REGISTER NAME
0x4802 E048
0x4804 0048
0x4804 2048
0x4804 4048
0x4804 6048
0x4804 8048
0x4804 A048
TWPS
Timer Write Posted
Status
0x4802 E04C
0x4804 004C
0x4804 204C
0x4804 404C
0x4804 604C
0x4804 804C
0x4804 A04C
TMAR
Timer Match
0x4802 E050
0x4804 0050
0x4804 2050
0x4804 4050
0x4804 6050
0x4804 8050
0x4804 A050
TCAR1
Timer Capture
0x4802 E054
0x4804 0054
0x4804 2054
0x4804 4054
0x4804 6054
0x4804 8054
0x4804 A054
TSICR
Timer Synchronous
Interface Control
0x4802 E058
0x4804 0058
0x4804 2058
0x4804 4058
0x4804 6058
0x4804 8058
0x4804 A058
TCAR2
Timer Capture
Table 8-102. Watchdog Timer Registers
HEX ADDRESS
ACRONYM
0x480C 2000
WIDR
REGISTER NAME
IP Revision Identifier
0x480C 2010
WDSC
OCP interface parameters
0x480C 2014
WDST
Status information
0x480C 2018
WISR
Interrupt events pending
0x480C 201C
WIER
Interrupt events control
0x480C 2020
WWER
Wakeup events control
0x480C 2024
WCLR
Counter prescaler control
0x480C 2028
WCRR
Internal counter value
0x480C 202C
WLDR
Timer load value
0x480C 2030
WTGR
Watchdog counter reload
0x480C 2034
WWPS
Write posting bits
0x480C 2044
WDLY
Event detection delay value
0x480C 2048
WSPR
Start-stop value
0x480C 2050
WIRQEOI
0x480C 2054
WIRQSTATRAW
0x480C 2058
WIRQSTAT
0x480C 205C
WIRQENSET
IRQ enable
0x480C 2060
WIRQENCLR
IRQ enable clear
0x480C 2064
WIRQWAKEEN
Software End Of Interrupt
IRQ unmasked status
IRQ masked status
IRQ wakeup events control
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8.19.2 Timer Electrical/Data Timing
Table 8-103. Timing Requirements for Timer
(see Figure 8-88)
NO.
MIN
MAX
UNIT
1
tw(EVTIH)
Pulse duration, high
4P (1)
ns
2
tw(EVTIL)
Pulse duration, low
4P (1)
ns
(1)
P = module clock.
Table 8-104. Switching Characteristics Over Recommended Operating Conditions for Timer
(see Figure 8-88)
NO.
PARAMETER
MIN
UNIT
ns
ns
3
tw(EVTOH)
Pulse duration, high
4P-3
4
tw(EVTOL)
Pulse duration, low
4P-3 (1)
(1)
MAX
(1)
P = module clock.
1
2
TCLKIN
3
4
TIMx_OUT
Figure 8-88. Timer Timing
290
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8.20 Universal Asynchronous Receiver/Transmitter (UART)
The UART performs serial-to-parallel conversions on data received from a peripheral device and parallelto-serial conversion on data received from the CPU. The device provides up to three UART peripheral
interfaces, depending on the selected pin multiplexing.
Each UART has the following features:
• Selectable UART/IrDA (SIR/MIR)/CIR modes
• Dual 64-entry FIFOs for received and transmitted data payload
• Programmable and selectable transmit and receive FIFO trigger levels for DMA and interrupt
generation
• Baud-rate generation based upon programmable divisors N (N=1…16384)
• Two DMA requests and one interrupt request to the system
• Can connect to any RS-232 compliant device.
UART functions include:
• Baud-rate up to 3.6 Mbit/s
• Programmable serial interfaces characteristics
– 5, 6, 7, or 8-bit characters
– Even, odd, or no parity-bit generation and detection
– 1, 1.5, or 2 stop-bit generation
– Flow control: hardware (RTS/CTS) or software (XON/XOFF)
• Additional modem control functions (UART0_DTR, UART0_DSR, UART0_DCD, and UART0_RIN) for
UART0 only; UART1 and UART2 do not support full-flow control signaling.
IR-IrDA functions include:
• Support of IrDA 1.4 slow infrared (SIR, baud-rate up to 115.2 Kbits/s), medium infrared (MIR, baudrate up to 1.152 Mbits/s) and fast infrared (FIR baud-rate up to 4.0 Mbits/s) communications
• Supports framing error, cyclic redundancy check (CRC) error, illegal symbol (FIR), and abort pattern
(SIR, MIR) detection
• 8-entry status FIFO (with selectable trigger levels) available to monitor frame length and frame errors.
IR-CIR functions include:
• Consumer infrared (CIR) remote control mode with programmable data encoding
• Free data format (supports any remote control private standards)
• Selectable bit rate and configurable carrier frequency.
For more detailed information on the UART peripheral, see the UART chapter in the AM389x Sitara ARM
Processors Technical Reference Manual (literature number SPRUGX7).
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8.20.1 UART Peripheral Register Descriptions
Table 8-105 lists the UART register name summary. Table 8-106 shows the UART registers along with
their configuration requirements.
Table 8-105. UART Register Summary
ACRONYM
REGISTER NAME
ACRONYM
REGISTER NAME
RHR
Receive Holding
RXFLH
THR
Transmit Holding
BLR
Receive Frame Length High
IER
Interrupt Enable
ACREG
IIR
Interrupt Identification
SCR
Supplementary Control
FCR
FIFO Control
SSR
Supplementary Status
BOF Control
Auxilliary Control
LCR
Line Control
EBLR
BOF Length
MCR
Modem Control
MVR
Module Version
LSR
Line Status
SYSC
System Configuration
MSR
Modem Status
SYSS
System Status
SPR
Scratchpad
WER
Wake-up Enable
TCR
Transmission Control
CFPS
Carrier Frequency Prescaler
TLR
Trigger Level
DLL
Divisor Latch Low
Divisor Latch High
MDR1
Mode Definition 1
DLH
MDR2
Mode Definition 2
UASR
SFLSR
Status FIFO Line Status
UART Autobauding Status
EFR
Enhanced Feature
RESUME
Resume
XON1
UART XON1 Character
SFREGL
Status FIFO Low
XON2
UART XON2 Character
SFREGH
Status FIFO High
XOFF1
UART XOFF1 Character
TXFLL
Transmit Frame Length Low
XOFF2
UART XOFF2 Character
TXFLH
Transmit Frame Length High
ADDR1
IrDA Address 1
RXFLL
Receive Frame Length Low
ADDR2
IrDA Address 2
Table 8-106. UART Registers Configuration Requirements (1) (2) (3)
REGISTER
UART0 HEX
ADDRESS
UART1 HEX
ADDRESS
UART2 HEX
ADDRESS
LCR[7] = 1 and LCR[7:0]
≠ 0xBF
READ
WRITE
READ
WRITE
READ
0x4802 0000
0x4802 2000
0x4802 4000
RHR
THR
DLL
DLL
DLL
DLL
0x4802 0004
0x4802 2004
0x4802 4004
IER
IER
DLH
DLH
DLH
DLH
EFR
LCR[7] = 0
LCR[7:0] = 0xBF
WRITE
0x4802 0008
0x4802 2008
0x4802 4008
IIR
FCR
IIR
FCR
EFR
0x4802 000C
0x4802 200C
0x4802 400C
LCR
LCR
LCR
LCR
LCR
LCR
0x4802 0010
0x4802 2010
0x4802 4010
MCR
MCR
MCR
MCR
XON1/
ADDR1
XON1/
ADDR1
0x4802 0014
0x4802 2014
0x4802 4014
LSR
-
LSR
-
XON2/
ADDR2
XON2/
ADDR2
0x4802 0018
0x4802 2018
0x4802 4018
MSR/TCR
TCR
MSR/TCR
TCR
XOFF1/
TCR
XOFF1/
TCR
0x4802 001C
0x4802 201C
0x4802 401C
SPR/TLR
SPR/TLR
SPR/TLR
SPR/TLR
XOFF2/
TLR
XOFF2/
TLR
0x4802 0020
0x4802 2020
0x4802 4020
MDR1
MDR1
MDR1
MDR1
MDR1
MDR1
0x4802 0024
0x4802 2024
0x4802 4024
MDR2
MDR2
MDR2
MDR2
MDR2
MDR2
0x4802 0028
0x4802 2028
0x4802 4028
SFLSR
TXFLL
SFLSR
TXFLL
SFLSR
TXFLL
(1)
(2)
(3)
292
The transmission control register (TCR) and the trigger level register (TLR) are accessible only when EFR[4]=1 and MCR[6]=1.
MCR[7:5] and FCR[5:4] can only be written when EFR[4]=1.
In UART modes, IER[7:4] can only be written when EFR[4]=1. In IrDA/CIR modes, EFR[4] has no impact on the access to IER[7:4].
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Table 8-106. UART Registers Configuration Requirements(1)(2)(3) (continued)
REGISTER
UART0 HEX
ADDRESS
UART1 HEX
ADDRESS
UART2 HEX
ADDRESS
LCR[7] = 1 and LCR[7:0]
≠ 0xBF
0x4802 002C
0x4802 202C
0x4802 402C
0x4802 0030
0x4802 2030
0x4802 4030
SFREGL
RXFLL
SFREGL
RXFLL
SFREGL
RXFLL
0x4802 0034
0x4802 2034
0x4802 4034
SFREGH
RXFLH
SFREGH
RXFLH
SFREGH
RXFLH
0x4802 0038
0x4802 2038
0x4802 4038
BLR
BLR
UASR
-
UASR
-
0x4802 003C
0x4802 203C
0x4802 403C
ACREG
ACREG
-
-
-
-
0x4802 0040
0x4802 2040
0x4802 4040
SCR
SCR
SCR
SCR
SCR
SCR
0x4802 0044
0x4802 2044
0x4802 4044
SSR
SSR[2]
SSR
SSR[2]
SSR
SSR[2]
0x4802 0048
0x4802 2048
0x4802 4048
EBLR
EBLR
-
-
-
-
0x4802 004C
0x4802 204C
0x4802 404C
-
-
-
-
-
-
0x4802 0050
0x4802 2050
0x4802 4050
MVR
-
MVR
-
MVR
-
0x4802 0054
0x4802 2054
0x4802 4054
SYSC
SYSC
SYSC
SYSC
SYSC
SYSC
LCR[7] = 0
LCR[7:0] = 0xBF
READ
WRITE
READ
WRITE
READ
WRITE
RESUME
TXFLH
RESUME
TXFLH
RESUME
TXFLH
0x4802 0058
0x4802 2058
0x4802 4058
SYSS
0x4802 005C
0x4802 205C
0x4802 405C
WER
WER
SYSS
WER
WER
SYSS
WER
WER
0x4802 0060
0x4802 2060
0x4802 4060
CFPS
CFPS
CFPS
CFPS
CFPS
CFPS
0x4802 0064 0x4802 00C4
0x4802 2064 0x4802 20C4
0x4802 4064 0x4802 40C4
-
-
-
-
-
-
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8.20.2 UART Electrical/Data Timing
Table 8-107. Timing Requirements for UART
(see Figure 8-89)
NO.
MIN
MAX
4
tw(RX)
Pulse width, receive data bit, 15/30/100pF high or low
0.96U (1)
1.05U (1)
ns
5
tw(CTS)
Pulse width, receive start bit, 15/30/100pF high or low
0.96U (1)
1.05U (1)
ns
(1)
(2)
UNIT
(2)
ns
ns
td(RTS-TX)
Delay time, transmit start bit to transmit data
P
td(CTS-TX)
Delay time, receive start bit to transmit data
P (2)
U = UART baud time = 1/programmed baud rate
P = clock period of the reference clock (FCLK, usually 48 MHz).
Table 8-108. Switching Characteristics Over Recommended Operating Conditions for UART
(see Figure 8-89)
NO.
PARAMETER
MIN
MAX
15 pF
f(baud)
2
3
(1)
tw(TX)
tw(RTS)
Maximum programmable baud rate
UNIT
5
30 pF
0.23
100 pF
0.115
MHz
Pulse width, transmit data bit, 15/30/100 pF high or low
U - 2 (1)
U + 2 (1)
ns
Pulse width, transmit start bit, 15/30/100 pF high or low
(1)
(1)
ns
U-2
U+2
U = UART baud time = 1/programmed baud rate
3
2
UARTx_TXD
Start
Bit
Data Bits
5
4
UARTx_RXD
Start
Bit
Data Bits
Figure 8-89. UART Timing
294
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SPRS681E – OCTOBER 2010 – REVISED JULY 2012
8.21 Universal Serial Bus (USB2.0)
The device includes two USB2.0 modules which support the Universal Serial Bus Specification Revision
2.0. The following are some of the major USB features that are supported:
• USB 2.0 peripheral at high speed (HS: 480 Mbps) and full speed (FS: 12 Mbps)
• USB 2.0 host at HS, FS, and low speed (LS: 1.5 Mbps)
• Each endpoint (other than endpoint 0, control only) can support all transfer modes (control, bulk,
interrupt, and isochronous)
• Supports high-bandwidth ISO mode
• Supports 16 Transmit (TX) and 16 Receive (RX) endpoints including endpoint 0
• FIFO RAM - 32K endpoint - Programmable size
• Includes two integrated PHYs; requires a low-jitter 24-MHz source clock for its PLL
• RNDIS-like mode for terminating RNDIS-type protocols without using short-packet termination for
support of MSC applications.
The USB2.0 modules do not support the following features:
• On-chip charge pump (VBUS power must be generated external to the device)
• RNDIS mode acceleration for USB sizes that are not multiples of 64 bytes
• Endpoint max USB packet sizes that do not conform to the USB2.0 spec (for FS/LS: 8, 16, 32, 64, and
1023 are defined; for HS: 64, 128, 512, and 1024 are defined).
For more detailed information on the USB2.0 peripheral, see the USB2.0 chapter in the AM389x Sitara
ARM Processors Technical Reference Manual (literature number SPRUGX7). For detailed information on
USB board design and layout guidelines, see the USB 2.0 Board Design and Layout Guidelines
application report (literature number SPRAAR7)
8.21.1 USB2.0 Peripheral Register Descriptions
Table 8-109. USB2.0 Submodules
SUBMODULE
ADDRESS OFFSET
SUBMODULE NAME
0x0000
USBSS registers
0x1000
USB0 controller registers
0x1800
USB1 controller registers
0x2000
CPPI DMA controller registers
0x3000
CPPI DMA scheduler registers
0x4000
CPPI DMA Queue Manager registers
Table 8-110. USB Subsystem (USBSS) Registers (1)
(1)
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4740 0000
REVREG
USBSS REVISION
0x4740 0004 - 0x4740 000C
-
0x4740 0010
SYSCONFIG
Reserved
0x4740 0014 - 0x4740 001C
-
0x4740 0020
EOI
0x4740 0024
IRQSTATRAW
0x4740 0028
IRQSTAT
0x4740 002C
IRQENABLER
USBSS IRQ_ENABLE_SET
0x4740 0030
IRQCLEARR
USBSS IRQ_ENABLE_CLR
USBSS SYSCONFIG
Reserved
USBSS IRQ_EOI
USBSS IRQ_STATUS_RAW
USBSS IRQ_STATUS
USBSS registers contain the registers that are used to control at the global level and apply to all submodules.
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Table 8-110. USB Subsystem (USBSS) Registers(1) (continued)
HEX ADDRESS
ACRONYM
0x4740 0034 - 0x4740 00FC
-
REGISTER NAME
0x4740 0100
IRQDMATHOLDTX00
USBSS IRQ_DMA_THRESHOLD_TX0_0
0x4740 0104
IRQDMATHOLDTX01
USBSS IRQ_DMA_THRESHOLD_TX0_1
0x4740 0108
IRQDMATHOLDTX02
USBSS IRQ_DMA_THRESHOLD_TX0_2
0x4740 010C
IRQDMATHOLDTX03
USBSS IRQ_DMA_THRESHOLD_TX0_3
0x4740 0110
IRQDMATHOLDRX00
USBSS IRQ_DMA_THRESHOLD_RX0_0
0x4740 0114
IRQDMATHOLDRX01
USBSS IRQ_DMA_THRESHOLD_RX0_1
Reserved
0x4740 0118
IRQDMATHOLDRX02
USBSS IRQ_DMA_THRESHOLD_RX0_2
0x4740 011C
IRQDMATHOLDRX03
USBSS IRQ_DMA_THRESHOLD_RX0_3
0x4740 0120
IRQDMATHOLDTX10
USBSS IRQ_DMA_THRESHOLD_TX1_0
0x4740 0124
IRQDMATHOLDTX11
USBSS IRQ_DMA_THRESHOLD_TX1_1
0x4740 0128
IRQDMATHOLDTX12
USBSS IRQ_DMA_THRESHOLD_TX1_2
0x4740 012C
IRQDMATHOLDTX13
USBSS IRQ_DMA_THRESHOLD_TX1_3
0x4740 0130
IRQDMATHOLDRX10
USBSS IRQ_DMA_THRESHOLD_RX1_0
0x4740 0134
IRQDMATHOLDRX11
USBSS IRQ_DMA_THRESHOLD_RX1_1
0x4740 0138
IRQDMATHOLDRX12
USBSS IRQ_DMA_THRESHOLD_RX1_2
0x4740 013C
IRQDMATHOLDRX13
USBSS IRQ_DMA_THRESHOLD_RX1_3
0x4740 0140
IRQDMAENABLE0
USBSS IRQ_DMA_ENABLE_0
0x4740 0144
IRQDMAENABLE1
USBSS IRQ_DMA_ENABLE_1
0x4740 0148 - 0x4740 01FC
-
0x4740 0200
IRQFRAMETHOLDTX00
USBSS IRQ_FRAME_THRESHOLD_TX0_0
0x4740 0204
IRQFRAMETHOLDTX01
USBSS IRQ_FRAME_THRESHOLD_TX0_1
0x4740 0208
IRQFRAMETHOLDTX02
USBSS IRQ_FRAME_THRESHOLD_TX0_2
0x4740 020C
IRQFRAMETHOLDTX03
USBSS IRQ_FRAME_THRESHOLD_TX0_3
0x4740 0210
IRQFRAMETHOLDRX00
USBSS IRQ_FRAME_THRESHOLD_RX0_0
0x4740 0214
IRQFRAMETHOLDRX01
USBSS IRQ_FRAME_THRESHOLD_RX0_1
0x4740 0218
IRQFRAMETHOLDRX02
USBSS IRQ_FRAME_THRESHOLD_RX0_2
0x4740 021C
IRQFRAMETHOLDRX03
USBSS IRQ_FRAME_THRESHOLD_RX0_3
0x4740 0220
IRQFRAMETHOLDTX10
USBSS IRQ_FRAME_THRESHOLD_TX1_0
0x4740 0224
IRQFRAMETHOLDTX11
USBSS IRQ_FRAME_THRESHOLD_TX1_1
0x4740 0228
IRQFRAMETHOLDTX12
USBSS IRQ_FRAME_THRESHOLD_TX1_2
0x4740 022C
IRQFRAMETHOLDTX13
USBSS IRQ_FRAME_THRESHOLD_TX1_3
0x4740 0230
IRQFRAMETHOLDRX10
USBSS IRQ_FRAME_THRESHOLD_RX1_0
0x4740 0234
IRQFRAMETHOLDRX11
USBSS IRQ_FRAME_THRESHOLD_RX1_1
Reserved
0x4740 0238
IRQFRAMETHOLDRX12
USBSS IRQ_FRAME_THRESHOLD_RX1_2
0x4740 023C
IRQFRAMETHOLDRX13
USBSS IRQ_FRAME_THRESHOLD_RX1_3
0x4740 0240
IRQFRAMEENABLE0
USBSS IRQ_FRAME_ENABLE_0
0x4740 0244
IRQFRAMEENABLE1
USBSS IRQ_FRAME_ENABLE_1
0x4740 0248 - 0x4740 0FFC
-
Reserved
Table 8-111. USB0 Controller Registers
296
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4740 1000
USB0REV
USB0 REVISION
0x4740 1004 - 0x4740 1010
-
0x4740 1014
USB0CTRL
USB0 Control
0x4740 1018
USB0STAT
USB0 Status
0x4740 101C
-
Reserved
Reserved
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Table 8-111. USB0 Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x4740 1020
USB0IRQMSTAT
REGISTER NAME
USB0 IRQ_MERGED_STATUS
0x4740 1024
USB0IRQEOI
0x4740 1028
USB0IRQSTATRAW0
USB0 IRQ_EOI
USB0 IRQ_STATUS_RAW_0
0x4740 102C
USB0IRQSTATRAW1
USB0 IRQ_STATUS_RAW_1
0x4740 1030
USB0IRQSTAT0
USB0 IRQ_STATUS_0
0x4740 1034
USB0IRQSTAT1
USB0 IRQ_STATUS_1
0x4740 1038
USB0IRQENABLESET0
USB0 IRQ_ENABLE_SET_0
0x4740 103C
USB0IRQENABLESET1
USB0 IRQ_ENABLE_SET_1
0x4740 1040
USB0IRQENABLECLR0
USB0 IRQ_ENABLE_CLR_0
0x4740 1044
USB0IRQENABLECLR1
USB0 IRQ_ENABLE_CLR_1
0x4740 1048 - 0x4740 106C
-
Reserved
0x4740 1070
USB0TXMODE
USB0 Tx Mode
0x4740 1074
USB0RXMODE
USB0 Rx Mode
0x4740 1078 - 0x4740 107C
-
0x4740 1080
USB0GENRNDISEP1
USB0 Generic RNDIS Size EP1
0x4740 1084
USB0GENRNDISEP2
USB0 Generic RNDIS Size EP2
0x4740 1088
USB0GENRNDISEP3
USB0 Generic RNDIS Size EP3
0x4740 108C
USB0GENRNDISEP4
USB0 Generic RNDIS Size EP4
0x4740 1090
USB0GENRNDISEP5
USB0 Generic RNDIS Size EP5
0x4740 1094
USB0GENRNDISEP6
USB0 Generic RNDIS Size EP6
0x4740 1098
USB0GENRNDISEP7
USB0 Generic RNDIS Size EP7
0x4740 109C
USB0GENRNDISEP8
USB0 Generic RNDIS Size EP8
0x4740 10A0
USB0GENRNDISEP9
USB0 Generic RNDIS Size EP9
0x4740 10A4
USB0GENRNDISEP10
USB0 Generic RNDIS Size EP10
Reserved
0x4740 10A8
USB0GENRNDISEP11
USB0 Generic RNDIS Size EP11
0x4740 10AC
USB0GENRNDISEP12
USB0 Generic RNDIS Size EP12
0x4740 10B0
USB0GENRNDISEP13
USB0 Generic RNDIS Size EP13
0x4740 10B4
USB0GENRNDISEP14
USB0 Generic RNDIS Size EP14
0x4740 10B8
USB0GENRNDISEP15
USB0 Generic RNDIS Size EP15
0x4740 10BC - 0x4740 10CC
-
0x4740 10D0
USB0AUTOREQ
0x4740 10D4
USB0SRPFIXTIME
0x4740 10D8
USB0TDOWN
0x4740 10DC
-
Reserved
USB0 Auto Req
USB0 SRP Fix Time
USB0 Teardown
Reserved
0x4740 10E0
USB0UTMI
0x4740 10E4
USB0UTMILB
USB0 PHY UTMI
0x4740 10E8
USB0MODE
0x4740 10E8 - 0x4740 13FF
-
Reserved
0x4740 1400 - 0x4740 159C
-
USB0 Mentor Core Registers
0x4740 15A0 - 0x4740 17FC
-
Reserved
USB0 MGC UTMI Loopback
USB0 Mode
Table 8-112. USB1 Controller Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4740 1800
USB1REV
USB1 Revision
0x4740 1804 - 0x4740 1810
-
0x4740 1814
USB1CTRL
Reserved
USB1 Control
0x4740 1818
USB1STAT
USB1 Status
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Table 8-112. USB1 Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x4740 181C
-
REGISTER NAME
0x4740 1820
USB1IRQMSTAT
0x4740 1824
USB1IRQEOI
0x4740 1828
USB1IRQSTATRAW0
USB1 IRQ_STATUS_RAW_0
0x4740 182C
USB1IRQSTATRAW1
USB1 IRQ_STATUS_RAW_1
0x4740 1830
USB1IRQSTAT0
USB1 IRQ_STATUS_0
0x4740 1834
USB1IRQSTAT1
USB1 IRQ_STATUS_1
Reserved
USB1 IRQ_MERGED_STATUS
USB1 IRQ_EOI
0x4740 1838
USB1IRQENABLESET0
USB1 IRQ_ENABLE_SET_0
0x4740 183C
USB1IRQENABLESET1
USB1 IRQ_ENABLE_SET_1
0x4740 1840
USB1IRQENABLECLR0
USB1 IRQ_ENABLE_CLR_0
0x4740 1844
USB1IRQENABLECLR1
USB1 IRQ_ENABLE_CLR_1
0x4740 1848 - 0x4740 186C
-
0x4740 1870
USB1TXMODE
Reserved
USB1 Tx Mode
0x4740 1874
USB1RXMODE
USB1 Rx Mode
0x4740 1878 - 0x4740 187C
-
0x4740 1880
USB1GENRNDISEP1
Reserved
USB1 Generic RNDIS Size EP1
0x4740 1884
USB1GENRNDISEP2
USB1 Generic RNDIS Size EP2
0x4740 1888
USB1GENRNDISEP3
USB1 Generic RNDIS Size EP3
0x4740 188C
USB1GENRNDISEP4
USB1 Generic RNDIS Size EP4
0x4740 1890
USB1GENRNDISEP5
USB1 Generic RNDIS Size EP5
0x4740 1894
USB1GENRNDISEP6
USB1 Generic RNDIS Size EP6
0x4740 1898
USB1GENRNDISEP7
USB1 Generic RNDIS Size EP7
0x4740 189C
USB1GENRNDISEP8
USB1 Generic RNDIS Size EP8
0x4740 18A0
USB1GENRNDISEP9
USB1 Generic RNDIS Size EP9
0x4740 18A4
USB1GENRNDISEP10
USB1 Generic RNDIS Size EP10
0x4740 18A8
USB1GENRNDISEP11
USB1 Generic RNDIS Size EP11
0x4740 18AC
USB1GENRNDISEP12
USB1 Generic RNDIS Size EP12
0x4740 18B0
USB1GENRNDISEP13
USB1 Generic RNDIS Size EP13
0x4740 18B4
USB1GENRNDISEP14
USB1 Generic RNDIS Size EP14
0x4740 18B8
USB1GENRNDISEP15
USB1 Generic RNDIS Size EP15
0x4740 18BC - 0x4740 18CC
-
0x4740 18D0
USB1AUTOREQ
0x4740 18D4
USB1SRPFIXTIME
0x4740 18D8
USB1TDOWN
0x4740 18DC
-
0x4740 18E0
USB1UTMI
0x4740 18E4
USB1UTMILB
Reserved
USB1 Auto Req
USB1 SRP Fix Time
USB1 Teardown
Reserved
USB1 PHY UTMI
USB1 MGC UTMI Loopback
0x4740 18E8
USB1MODE
0x4740 18E8 - 0x4740 1BFF
-
USB1 Mode
Reserved
0x4740 1C00 - 0x4740 1D9C
-
USB1 Mentor Core Registers
0x4740 1DA0 - 0x4740 1FFC
-
Reserved
Table 8-113. CPPI DMA Controller Registers
298
HEX ADDRESS
ACRONYM
REGISTER NAME
0x4740 2000
DMAREVID
Revision
0x4740 2004
TDFDQ
0x4740 2008
DMAEMU
Teardown Free Descriptor Queue Control
Emulation Control
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Table 8-113. CPPI DMA Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x4740 2010
DMAMEM1BA
CPPI Mem1 Base Address
CPPI Mem1 Mask Address
0x4740 2014
DMAMEM1MASK
0x4740 200C - 0x4740 27FF
-
0x4740 2800
TXGCR0
REGISTER NAME
Reserved
Tx Channel 0 Global Configuration
0x4740 2804
-
0x4740 2808
RXGCR0
0x4740 280C
RXHPCRA0
Rx Channel 0 Host Packet Configuration A
Rx Channel 0 Host Packet Configuration B
0x4740 2810
RXHPCRB0
0x4740 2814 - 0x4740 281C
-
0x4740 2820
TXGCR1
0x4740 2824
-
Reserved
Rx Channel 0 Global Configuration
Reserved
Tx Channel 1 Global Configuration
Reserved
0x4740 2828
RXGCR1
0x4740 282C
RXHPCRA1
Rx Channel 1 Host Packet Configuration A
0x4740 2830
RXHPCRB1
Rx Channel 1 Host Packet Configuration B
0x4740 2834 - 0x4740 283C
-
0x4740 2840
TXGCR2
0x4740 2844
-
Rx Channel 1 Global Configuration
Reserved
Tx Channel 2 Global Configuration
Reserved
0x4740 2848
RXGCR2
0x4740 284C
RXHPCRA2
Rx Channel 2 Global Configuration
Rx Channel 2 Host Packet Configuration A
0x4740 2850
RXHPCRB2
Rx Channel 2 Host Packet Configuration B
0x4740 2854 - 0x4740 285F
-
0x4740 2860
TXGCR3
0x4740 2864
-
0x4740 2868
RXGCR3
0x4740 286C
RXHPCRA3
Rx Channel 3 Host Packet Configuration A
0x4740 2870
RXHPCRB3
Rx Channel 3 Host Packet Configuration B
0x4740 2880 - 0x4740 2B9F
-
0x4740 2BA0
TXGCR29
0x4740 2BA4
-
0x4740 2BA8
RXGCR29
0x4740 2BAC
RXHPCRA29
Rx Channel 29 Host Packet Configuration A
0x4740 2BB0
RXHPCRB29
Rx Channel 29 Host Packet Configuration B
0x4740 2BB4 - 0x4740 2FFF
-
Reserved
Tx Channel 3 Global Configuration
Reserved
Rx Channel 3 Global Configuration
...
Tx Channel 29 Global Configuration
Reserved
Rx Channel 29 Global Configuration
Reserved
Table 8-114. CPPI DMA Scheduler Registers
HEX ADDRESS
ACRONYM
0x4740 3000
DMA_SCHED_CTRL
REGISTER NAME
CPPI DMA Scheduler Control Register
0x4740 3804 - 0x4740 38FF
-
0x4740 3800
WORD0
Reserved
CPPI DMA Scheduler Table Word 0
0x4740 3804
WORD1
CPPI DMA Scheduler Table Word 1
…
…
…
0x4740 38F8
WORD62
CPPI DMA Scheduler Table Word 62
0x4740 38FC
WORD63
CPPI DMA Scheduler Table Word 63
0x4740 38FF - 0x4740 3FFF
-
Reserved
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Table 8-115. CPPI DMA Queue Manager Registers
300
HEX ADDRESS
ACRONYM
0x4740 4000
QMGRREVID
REGISTER NAME
0x4740 4004
-
0x4740 4008
DIVERSION
0x4740 4020
FDBSC0
Queue Manager Free Descriptor/Buffer Starvation Count 0
0x4740 4024
FDBSC1
Queue Manager Free Descriptor/Buffer Starvation Count 1
0x4740 4028
FDBSC2
Queue Manager Free Descriptor/Buffer Starvation Count 2
0x4740 402C
FDBSC3
Queue Manager Free Descriptor/Buffer Starvation Count 3
0x4740 4030
FDBSC4
Queue Manager Free Descriptor/Buffer Starvation Count 4
0x4740 4034
FDBSC5
Queue Manager Free Descriptor/Buffer Starvation Count 5
Queue Manager Revision
Reserved
Queue Manager Queue Diversion
0x4740 4038
FDBSC6
Queue Manager Free Descriptor/Buffer Starvation Count 6
0x4740 403C
FDBSC7
Queue Manager Free Descriptor/Buffer Starvation Count 7
0x4740 4030 - 0x4740 407C
-
0x4740 4080
LRAM0BASE
Queue Manager Linking RAM Region 0 Base Address
0x4740 4084
LRAM0SIZE
Queue Manager Linking RAM Region 0 Size
0x4740 4088
LRAM1BASE
Queue Manager Linking RAM Region 1 Base Address
0x4740 408C
-
0x4740 4090
PEND0
Queue Manager Queue Pending 0
0x4740 4094
PEND1
Queue Manager Queue Pending 1
0x4740 4098
PEND2
Queue Manager Queue Pending 2
0x4740 409C
PEND3
Queue Manager Queue Pending 3
0x4740 40A0
PEND4
Queue Manager Queue Pending 4
0x4740 40A4 - 0x4740 4FFF
-
0x4740 5000 + 16xR
QMEMRBASEr
Memory Region R Base Address (R ranges from 0 to 15)
Memory Region R Control (R ranges from 0 to 15)
Reserved
Reserved
Reserved
0x4740 5000 + 16xR + 4
QMEMRCTRLr
0x4740 50F8 - 0x4740 5FFF
-
0x4740 6000 + 16xN
CTRLAn
Queue N Register A (N ranges from 0 to 155)
0x4740 6004 + 16xN
CTRLBn
Queue N Register B (N ranges from 0 to 155)
0x4740 6008 + 16xN
CTRLCn
Queue N Register C (N ranges from 0 to 155)
0x4740 600C + 16xN
CTRLDn
Queue N Register D (N ranges from 0 to 155)
Reserved
0x4740 69C0 - 0x4740 6FFF
-
0x4740 7000 + 16xN
QSTATAn
Reserved
Queue N Status A (N ranges from 0 to 155)
0x4740 7004 + 16xN
QSTATBn
Queue N Status B (N ranges from 0 to 155)
0x4740 7008 + 16xN
QSTATCn
Queue N Status C (N ranges from 0 to 155)
0x4740 700C + 16xN
-
Reserved
0x4740 79C0 - 0x4740 7FFF
-
Reserved
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8.21.2 USB2.0 Electrical Data/Timing
Table 8-116. Switching Characteristics Over Recommended Operating Conditions for USB2.0
(see Figure 8-90)
NO.
FULL SPEED
12 Mbps
HIGH SPEED
480 Mbps
MIN
MAX
MIN
MAX
MIN
UNIT
MAX
1
tr(D)
Rise time, USB_DP and USB_DN signals (1)
75
300
4
20
0.5
2
tf(D)
Fall time, USB_DP and USB_DN signals (1)
75
300
4
20
0.5
3
trfM
Rise/Fall time, matching (2)
80
125
90
111.11
–
–
%
4
VCRS
Output signal cross-over voltage (1)
1.3
2
1.3
2
–
–
V
ns
5
6
tjr(source)NT
Source (Host) Driver jitter, next transition
tjr(FUNC)NT
Function Driver jitter, next transition
tjr(source)PT
Source (Host) Driver jitter, paired transition (4)
tjr(FUNC)PT
Function Driver jitter, paired transition
7
tw(EOPT)
Pulse duration, EOP transmitter
8
tw(EOPR)
Pulse duration, EOP receiver
9
t(DRATE)
Data Rate
10
ZDRV
Driver Output Resistance
11
USB_R1
USB reference resistor
(1)
(2)
(3)
(4)
LOW SPEED
1.5 Mbps
PARAMETER
ns
2
2
(3)
25
2
(3)
ns
1
1
(3)
ns
1
(3)
ns
–
ns
10
1250
ns
1500
160
670
175
82
–
–
1.5
12
ns
480 Mb/s
–
–
28
49.5
40.5
49.5
Ω
43.8
44.6
43.8
44.6
43.8
44.6
Ω
Low Speed: CL = 200 pF, Full Speed: CL = 50 pF, High Speed: CL = 50 pF
tRFM = (tr/tf) x 100. [Excluding the first transaction from the Idle state.]
For more detailed information, see the Universal Serial Bus Specification Revision 2.0, Chapter 7, Electrical.
tjr = tpx(1) - tpx(0)
USB_DN
VCRS
USB_DP
tper − tjr
90% VOH
10% VOL
tf
tr
Figure 8-90. USB2.0 Integrated Transceiver Interface Timing
USB
USB_VSSREF
USB_R1
44.2-Ω ±1%
A.
(A)
Place the 44.2-Ω ± 1% as close to the device as possible.
Figure 8-91. USB Reference Resistor Routing
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9 Device and Documentation Support
9.1
9.1.1
Device Support
Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of AM389x processor applications:
Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE):
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any Sitara ARM Processor application. DSP/BIOS™
Hardware Development Tools: Extended Development System (XDS™) Emulator XDS™
For a complete listing of development-support tools for the AM389x Sitara™ ARM Processor platform, visit
the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the
nearest TI field sales office or authorized distributor.
9.1.2
Device and Development Support-Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
processors and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (e.g.,
AM3894CYG). Texas Instruments recommends two of three possible prefix designators for its support
tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMDX) through fully qualified production devices/tools (TMDS).
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality
and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
302
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, CYG), the temperature range (for example, blank is the default commercial
operating junction temperature range), and the device speed range (for example, blank is the default [1.0GHz ARM]). Figure 9-1 provides a legend for reading the complete device name for any AM389x device.
For device part numbers and further ordering information of AM389x devices in the CYG package type,
see the TI website (www.ti.com) or contact your TI sales representative.
For additional description of the device nomenclature markings on the die, see the AM389x Sitara ARM
Processors Silicon Errata (literature number SPRZ327).
(
) AM3894
B
CYG
(
)
(
)
PREFIX
X = Experimental device
Blank = Qualified device
DEVICE SPEED RANGE
Blank = 1.0-GHz ARM (default)
120 = 1.2-GHz ARM
135 = 1.35-GHz ARM
DEVICE
ARM Cortex-A8 processor:
AM3894
AM3892
TEMPERATURE RANGE
Blank = 0°C to 95°C (default commercial operating junction temperature)
A = -40°C to 105°C (extended operating junction temperature)
(A)
PACKAGE TYPE
CYG = 1031-pin plastic BGA, with Pb-Free solder balls
SILICON REVISION
Blank = silicon revision 1.0
A = silicon revision 1.1
B = silicon revision 2.0
A.
BGA = Ball-Grid Array.
Figure 9-1. Device Nomenclature
9.2
Documentation Support
The following documents describe the AM389x Sitara™ ARM Processors. Copies of these documents are
available on the Internet at www.ti.com. Tip: Enter the literature number in the search box.
SPRUGX7
9.3
AM389x Sitara ARM Processors Technical Reference Manual.
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and
help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
Device and Documentation Support
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10 Mechanical Packaging and Orderable Information
Table 10-1 shows the thermal resistance characteristics for the PBGA–CYG mechanical package.
10.1 Thermal Data for CYG
Table 10-1. Thermal Resistance Characteristics (PBGA Package) [CYG]
°C/W (1)
NO.
(1)
1
RΘJC
Junction-to-case
0.21
2
RΘJB
Junction-to-board
3.93
For proper device operation, a heatsink is required.
A thermal model can be provided for thermal simulation to estimate the system thermal environment.
Contact your local TI representative for availability.
10.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
304
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AM3892BCYG120
ACTIVE
FCBGA
CYG
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3892BCYG
120
AM3892BCYG150
ACTIVE
FCBGA
CYG
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3892BCYG
150
AM3892CCYG120
ACTIVE
FCBGA
CYG
1031
44
TBD
Call TI
Call TI
0 to 95
AM3892CCYG135
ACTIVE
FCBGA
CYG
1031
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3892CCYG
135
AM3894ACYG120
ACTIVE
FCBGA
CYG
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3894ACYG
120
AM3894BCYG120
ACTIVE
FCBGA
CYG
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3894BCYG
120
AM3894BCYG150
ACTIVE
FCBGA
CYG
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3894BCYG
150
AM3894BCYGA120
ACTIVE
FCBGA
CYG
1031
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 105
AM3894BCYG
A120
AM3894CCYG120
ACTIVE
FCBGA
CYG
1031
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3894CCYG
120
AM3894CCYG135
ACTIVE
FCBGA
CYG
1031
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 95
AM3894CCYG
135
AM3894CCYGA120
ACTIVE
FCBGA
CYG
1031
1
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 105
AM3894CCYG
A120
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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