Material Content Data Sheet Sales Product Name ITS42K5DLDF Issued MA# MA001230998 Package PG-TSON-10-2 14. August 2015 Weight* 31.78 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.156 3.64 0.003 0.01 0.013 0.04 417 0.265 0.83 8348 10.773 33.90 34.78 338982 347851 0.062 0.19 0.19 1946 1946 0.037 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.64 36386 36386 104 1172 1.917 6.03 16.661 52.44 58.59 524268 585775 0.370 1.16 1.16 11646 11646 0.064 0.20 0.20 2022 2022 0.114 0.36 0.343 1.08 60335 3594 1.44 10780 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 14374 1000000