Material Content Data Sheet Sales Product Name TLE7244SL Issued MA# MA000982072 Package PG-SSOP-24-7 28. August 2013 Weight* 147.14 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 5.128 3.49 0.016 0.01 0.062 0.04 423 1.245 0.85 8464 50.568 34.37 35.27 343671 352664 0.769 0.52 0.52 5224 5224 0.171 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.49 34853 34853 106 1160 7.854 5.34 77.344 52.55 58.01 525648 580185 1.680 1.14 1.14 11416 11416 0.365 0.25 0.25 2482 2482 0.426 0.29 1.512 1.03 53377 2899 1.32 10277 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13176 1000000