TDK C1608X5R1H105M080AB Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : May 02, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608X5R1H105M080AB
TDK item description C1608X5R1H105MT****
Commercial Grade
Applications
Please refer to Part No. CGA3E3X5R1H105M080AB for Automotive use.
Feature
General General (Up to 50V)
Series
C1608 [EIA 0603]
Status
Production (Not Recommended for New Design)
Size
Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
Thickness(T)
0.80mm ±0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PA)
0.60mm to 0.80mm(Reflow Soldering)
0.80mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PB)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
1μF ±20%
Rated Voltage
50VDC
Temperature Characteristic
X5R(±15%)
Dissipation Factor (Max.)
7.5%
Insulation Resistance (Min.)
500MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 02, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C1608X5R1H105M080AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C1608X5R1H105M080AB
ESR
C1608X5R1H105M080AB
Capacitance
C1608X5R1H105M080AB
C1608X5R1H105M080AB
Temperature Characteristic
C1608X5R1H105M080AB(No Bias)
DC Bias Characteristic
C1608X5R1H105M080AB(DC Bias =
25V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Ripple Temperature Rising
C1608X5R1H105M080AB(100kHz)
C1608X5R1H105M080AB(500kHz)
C1608X5R1H105M080AB(1MHz)
Multilayer Ceramic Chip Capacitors
C1608X5R1H105M080AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 02, 2017 (GMT)
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