HP HSMQC197 Agilent hsmx-c1xx high performance chip led Datasheet

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Agilent HSMx-C1xx
High Performance Chip LED
Data Sheet
HSMQ-C110/120/150/170/177/190/191/197/265,
HSMR-C110/120/130/150/170/177/190/191/197/265
Description
These small chip-type LEDs utilize
high efficient and high brightness
InGaN material to deliver
competitively priced high
performance blue and green. These
520 nm green and 470 nm blue are
unique hues which provide color
differentiation to a product.
These ChipLEDs come in either top
emitting packages (HSMx-C130,
C150, C170, C177, C190, C191,
C197), in side emitting packages
(HSMx-C110, C120) or in a reverse
mount package (C265). The side
emitting package is especially
suitable for LCD backlighting
application. The top emitting
packages, with their wide viewing
angle, are suitable for direct
backlighting application or being
used with light pipes. In order to
facilitate pick and place operation,
these ChipLEDs are shipped in
tape and reel with 4000 units per
reel for HSMx-C120, C130, C170,
C177, C190, C191 and C197
packages, and 3000 units per reel
for HSMx-C110, C150 and C265
packages. All packages are
compatible with IR soldering and
binned by both color and intensity.
Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Compatible with IR soldering
• Compatible for use with light
piping
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
CAUTION: HSMQ-C1xx and HSMR-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe
appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note
AN-1142 for additional details.
Package Dimensions
CATHODE
LINE
LED DIE
CATHODE
MARK
LED DIE
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
0.62 (0.024)
2.0 (0.079 )
3.2 (0.126 )
POLARITY
CLEAR
EPOXY
1.4
(0.055)
DIFFUSED
EPOXY
1.5 (0.059)
PC BOARD
POLARITY
0.3 (0.012)
PC BOARD
0.8 (0.031)
1.6 (0.063 )
0.5 (0.020)
CATHODE LINE
3.2 (0.126 )
0.8 (0.031)
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C110
HSMx-C170
CATHODE
MARK
LED DIE
CATHODE
MARK
LED DIE
0.8 (0.031)
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
POLARITY
0.3 (0.012)
0.3 (0.012)
DIFFUSED EPOXY
DIFFUSED EPOXY
POLARITY
PC BOARD
PC BOARD
0.6 (0.023)
0.3 (0.012)
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C190
HSMx-C191
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
0.7 (0.028) MIN.
Package Dimensions, continued
CATHODE MARK
CATHODE
MARK
LED DIE
LED DIE
1.25
(0.049)
1.6 (0.063)
0.8 (0.031)
2.00 (0.079)
0.62
(0.025)
3.2 (0.126 )
POLARITY
DIFFUSED EPOXY
DIFFUSED
EPOXY
0.40 (0.016)
POLARITY
2.0 (0.079)
0.6 (0.024)
1.1 (0.043)
PC BOARD
0.16 (0.006)
PC BOARD
CATHODE LINE
CATHODE LINE
0.5 (0.020)
0.50 ± 0.20
(0.020 ± 0.008)
0.50 ± 0.20
(0.020 ± 0.008)
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
1.10 (0.043) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C150
HSMx-C177
CATHODE MARK
LED DIE
CATHODE MARK
LED DIE
0.3 (0.012)
0.40
(0.016)
1.6 (0.063)
0.80
(0.031)
1.60
(0.063)
POLARITY
POLARITY
1.2 (0.047)
CLEAR EPOXY
DIFFUSED EPOXY
0.6 (0.024)
0.40 (0.016)
1.0 (0.039)
PC BOARD
PC BOARD
0.16 (0.006)
0.5 (0.020)
CATHODE LINE
3 – 0.3 (0.012)
0.30 ± 0.15
(0.012 ± 0.006)
CATHODE LINE
0.70 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C197
HSMx-C120
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
Package Dimensions, continued
3.4 (0.134)
CATHODE
MARK (ETCHED)
CATHODE
MARK
LED DIE
LED DIE
0.8 (0.031)
1.25 (0.049)
(0.625)
1.6
(0.063)
GREEN SOLDER MASK
POLARITY
UNDIFFUSED
EPOXY
POLARITY
1.15
(0.045)
1.2
(0.047)
0.23 (0.009)
DIFFUSED EPOXY
1.1 (0.043)
1.1 (0.043)
0.35 (0.014)
PCB BOARD
PC BOARD
0.12 (0.005)
0.3 (0.012)
CATHODE LINE
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C265
HSMx-C130
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Device Selection Guide
Package Dimension (mm) [1], [2]
InGaN Green
InGaN Blue
Package Description
3.2(L) x 1.0(W) x 1.5(H)
1.6(L) x 0.6(W) x 1.0(H)
1.6(L) x 0.8(W) x 0.35(H)
3.2(L) x 1.6(W) x 1.1(H)
2.0(L) x 1.25(W) x 0.8(H)
2.0(L) x 1.25(W) x 0.4(H)
1.6(L) x 0.8(W) x 0.8(H)
1.6(L) x 0.8(W) x 0.6(H)
1.6(L) x 0.8(W) x 0.4(H)
3.4(L) x 1.25(W) x 1.1(H)
HSMQ-C110
HSMQ-C120
–
HSMQ-C150
HSMQ-C170
HSMQ-C177
HSMQ-C190
HSMQ-C191
HSMQ-C197
HSMQ-C265
HSMR-C110
HSMR-C120
HSMR-C130
HSMR-C150
HSMR-C170
HSMR-C177
HSMR-C190
HSMR-C191
HSMR-C197
HSMR-C265
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-diffused
Notes: 1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at TA = 25˚C
Parameter
DC Forward Current [1]
Power Dissipation
Reverse Voltage (IR = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note: 1. Derate linearly as shown in Figure 4.
4
HSMQ-Cxxx
HSMR-Cxxx
20
78
5
95
–30 to +85
–40 to +85
See reflow soldering profile (Figures 11 & 12)
Units
mA
mW
V
˚C
˚C
˚C
Electrical Characteristics at TA = 25˚C
Part Number
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ.
Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ–PIN (˚C/W)
Typ.
HSMQ-C110/C150
HSMR-C110/C150
HSMQ-C120
HSMR-C120/C130
HSMQ-C170/C190/C191
HSMR-C170/C190/C191
HSMQ-C177/C197
HSMR-C177/C197
HSMQ-C265
HSMR-C265
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
3.4
5
5
5
5
5
5
5
5
5
5
140
140
100
100
110
110
110
110
65
65
450
450
450
450
300
300
350
350
300
300
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
3.9
VF Tolerance: ±0.1 V
Optical Characteristics at TA = 25˚C
Part Number
Color
Luminous
Intensity
IV (mcd)
@ 20 mA[1]
Min.
Typ.
HSMQ-C110
HSMQ-C120
HSMQ-C150/170/190/191
HSMQ-C177/197
HSMQ-C265
HSMR-C110
HSMR-C120
HSMR-C130
HSMR-C150/170/190/191
HSMR-C177/197
HSMR-C265
Green
Green
Green
Green
Green
Blue
Blue
Blue
Blue
Blue
Blue
45
45
45
45
45
18
18
18
18
18
18
150
145
145
145
140
60
55
55
55
55
45
Peak
Wavelength
λpeak (nm)
Typ.
Color,
Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing
Angle
2 θ1/2
Degrees[3]
Typ.
Luminous
Efficacy
ηV
(lm/w)
Typ.
520
520
520
520
520
469
469
469
469
469
469
527
527
527
527
527
473
473
473
473
473
473
130
155
140
130
150
130
155
145
140
130
150
500
500
500
500
500
88
88
88
88
88
88
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits[1]
Blue Color Bins[1]
Bin ID
A
B
C
D
Tolerance: ±1 nm
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
460.0
465.0
465.0
470.0
470.0
475.0
475.0
480.0
Bin ID
A
B
C
D
Dom. Wavelength (nm)
Min.
Max.
515.0
520.0
520.0
525.0
525.0
530.0
530.0
535.0
Tolerance: ±1 nm
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent
representative for information on currently available bins.
5
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID
Min.
Max.
A
0.11
0.18
B
0.18
0.29
C
0.29
0.45
D
0.45
0.72
E
0.72
1.10
F
1.10
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
Intensity (mcd)
Min.
Max.
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
28.50
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
100
RELATIVE INTENSITY – %
90
BLUE
80
GREEN
70
60
50
40
30
20
10
0
400
600
500
700
WAVELENGTH – nm
1.2
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
10
BLUE
1
0.1
GREEN
0.8
0.6
BLUE
0.4
GREEN
0.2
0
2.0
2.5
3.0
3.5
4.0
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
6
1.0
0
5
10
15
20
IF – FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
25
IF MAX – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
25
20
15
RθJ-A = 500°C/W
10
RθJ-A = 600°C/W
5
0
0
10 20 30 40 50 60 70 80 90
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature.
RELATIVE INTENSITY – %
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
30
50
70
90
30
50
70
90
ANGLE
RELATIVE INTENSITY – %
100
80
60
40
20
0
-90
-70
-50
-30
-10
10
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C120.
7
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative intensity vs. angle for HSMx-C130.
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 10. Relative intensity vs. angle for HSMx-C265.
8
10 to 20 SEC.
255 °C (+5/-0)
TEMPERATURE
217 °C
10 SEC. MAX.
TEMPERATURE
230°C MAX.
4°C/SEC. MAX.
140-160°C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
100 - 150 °C
60 to 150 SEC.
MAX. 120 SEC.
3°C/SEC. MAX.
4°C/SEC.
MAX.
TIME
OVER 2 MIN.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 11. Recommended reflow soldering profile.
Figure 12. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
1.2 (0.047)
0.2 (0.008)
CENTERING
BOARD
2.0
(0.079)
1.5
(0.059)
1.2
(0.047)
1.5
(0.059)
1.2
(0.047)
0.9
(0.035)
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.5
(0.059)
Figure 15. Recommended soldering pattern
for HSMx-C130/190/191/197.
2.0
(0.079)
1.5
(0.059)
Figure 16. Recommended soldering pattern for HSMx-C150.
0.4 (0.016)
2.2 (0.087) DIA. PCB HOLE
0.4 (0.016)
0.7 (0.028)
1.25 (0.049)
0.15 (0.006)
CENTERING
BOARD
0.8
(0.031)
1.2
(0.047)
0.8
(0.031)
Figure 17. Recommended soldering pattern for HSMx-C120.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
Figure 18. Recommended soldering pattern for HSMx-C265.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 19. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 20. Reel dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
0.23 ± 0.05
(0.009 ± 0.002)
FOR HSMR-C130
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
HSMx-C110/120
POSITION IN
CARRIER TAPE
PART NUMBER
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
DIM. A
(SEE TABLE 1)
DIM. B
(SEE TABLE 1)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (0.004)
3.40 (0.134)
1.90 (0.075)
3.50 (0.138)
2.30 (0.091)
2.25 (0.089)
1.80 (0.071)
1.85 (0.073)
1.75 (0.069)
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004)
1.20 (0.047)
1.70 (0.067)
0.80 (0.031)
1.15 (0.045)
1.27 (0.050)
1.88 (0.074)
0.95 (0.037)
1.45 (0.057)
0.70 (0.028)
1.32 (0.052)
0.87 (0.034)
0.95 (0.037)
0.85 (0.033)
0.88 (0.035)
0.60 (0.024)
0.95 (0.037)
R 1.0 ± 0.05
(0.039 ± 0.002)
FOR HSMx-C110
R 0.5 ± 0.05
(0.020 ± 0.002)
FOR HSMx-C120
4.00 (0.157)
CATHODE
1.50 (0.059)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057)
Figure 21. Tape dimensions.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
11
COVER TAPE
1.30 (0.051)
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 22. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
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Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-4832EN
April 22, 2004
5989-0493EN
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.