HX316C10FBK2/16 16GB (8GB 1G x 64-Bit x 2 pcs.) DDR3-1600 CL10 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 10 cycles Row Cycle Time (tRCmin) 48.125ns (min.) Refresh to Active/Refresh Command Time (tRFCmin) 260ns (min.) Row Active Time (tRASmin) 37.5ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX316C10FBK2/16 is a kit of two 1G x 64-bit (8GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 2Rx8 memory • JEDEC standard 1.5V (1.425V ~1.575V) Power Supply • VDDQ = 1.5V (1.425V ~ 1.575V) modules, based on sixteen 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 16GB. Each module kit • 800MHz fCK for 1600Mb/sec/pin has been tested to run at DDR3-1600 at a low latency timing of 10-10-10 at 1.5V. Additional timing parameters are shown in • 8 independent internal bank the PnP Timing Parameters section below. The JEDEC standard electrical and mechanical specifications are as follows: • Programmable CAS Latency: 11, 10, 9, 8, 7, 6 • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock • 8-bit pre-fetch • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] • Bi-directional Differential Data Strobe • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) • On Die Termination using ODT pin • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C • Asynchronous Reset Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS. PnP JEDEC TIMING PARAMETERS: • • • DDR3-1600 CL10-10-10 @1.5V DDR3-1333 CL9-9-9 @1.5V DDR3-1066 CL7-7-7 @1.5V • Height 1.291” (32.80mm) w/heatsink, double sided component Continued >> kingston.com/hyperx Document No. 4807008-001.B00 04/23/15 Page 1 continued HyperX MODULE WITH HEAT SPREADER 7.08 mm 32.8 mm 133.35 mm MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. kingston.com/hyperx Document No. 4807008-001.B00 Page 2