Shoulder HDF49AF11 This specification shall cover the characteristics of saw filter with f49a used for the e-amps/adc. Datasheet

规格书编号
SPEC NO :
产品 规 格书
SPECIFICATION
CUSTOMER 客 户:
PRODUCT 产 品:
SAW FILTER
MODEL NO 型 号:
HDF49A F11
PREPARED 编 制:
CHECKED 审 核:
APPROVED 批 准:
D A T E 日 期:
2004-9-26
客户确认 CUSTOMER RECEIVED:
审核 CHECKED
批准 APPROVED
日期 DATE
无锡市好达电子有限公司
Shoulder Electronics Limited
www.shoulder.cn
Tel:0755-82916880 Fax:0755-82916881
E-mail:[email protected]
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SAW FILTER
HDF49A F11
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Page 2 of 5
SAW FILTER
HDF49A F11
1. SCOPE
This specification shall cover the characteristics of SAW filter With F49A used for the
E-amps/adc.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
10V
10V50Hz/60Hz
-40℃ to +85℃
-45℃ to +85℃
0dBm
2.2Electronic Characteristics
3dB
passband
(MHz)
Type
HD
F49A
49.67~
49.99
Insertion-l
oss
MAX(dB)
Stop-band
Atten.
MIN(dB)
Loop-loss
MIN(dB)
Out-band
Atten.
(dB)
Impedance
(Ω)
4
30
42
30
50/50
3. DIMENSION
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Page 3 of 5
SAW FILTER
HDF49A F11
4.TEST CIRCUIT
5.Typical Frequency Response
6. ENVIRONMENTAL CHARACTERISTICS
6-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
6-2 Low temperature exposure
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SAW FILTER
HDF49A F11
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
6-3 Temperature cycling
Subject the device to a low temperature of -40℃ for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2.2.
6-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2.2.
6-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2.2.
6-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the
device shall fulfill the specifications in 2.2.
6-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of
1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2.
7. REMARK
7.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
7.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
7.3 Soldering
Only leads of component may be solded. Please avoid soldering another part of
component.
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Page 5 of 5
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