Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. ■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. ■ Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. ■ All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. ■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. ■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. 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Should you have any question or inquiry on this matter, please contact our sales staff. 13 MULTILAYER CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACIT�RS WAVE REFLOW ■PARTS NUMBER J M K ① ② ③ 3 1 6 ④ CERAMIC CAPACITORS ①Rated voltage Code P A J L E T G U H Q S ②Series name Code M V W △ ⑤ B J 1 ⑥ 0 6 ⑦ M L － T △ ⑧ ⑨ ⑩ ⑪ ⑫ ③End termination Code K R Rated voltage［VDC］ 2.5 4 6.3 10 16 25 35 50 100 250 630 A Dimensions （L×W）［mm］ 042 0.4×0.2 063 0.6×0.3 1.0×0.5 105 0.52×1.0 ※ 1.6×0.8 107 0.8×1.6 ※ 2.0×1.25 212 1.25×2.0 ※ 316 3.2×1.6 325 3.2×2.5 432 4.5×3.2 Note : ※LW reverse type（□WK） only Type L［mm］ Standard W［mm］ Standard 0.6±0.05 1.0±0.10 1.6＋0.15/－0.05 0.3±0.05 0.5±0.10 0.8＋0.15/－0.05 212 2.0＋0.15/－0.05 1.25＋0.15/－0.05 316 3.2±0.20 1.25±0.20 325 105 3.2±0.30 1.0＋0.15/－0.05 2.5±0.30 0.5＋0.15/－0.05 107 1.6＋0.20/－0 0.8＋0.20/－0 212 2.0＋0.20/－0 1.25＋0.20/－0 316 105 3.2±0.30 1.6±0.30 1.0＋0.20/－0 0.5＋0.20/－0 Note: P.6 Standard external dimensions ⑥Temperature characteristics code ■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAPTM）） Applicable Temperature Code Ref. Temp.［℃］ Capacitance change standard range［℃］ JIS B －25～＋ 85 20 ±10％ EIA X5R －55～＋ 85 25 ±15％ B7 EIA X7R －55～＋125 25 ±15％ C6 EIA X6S －55～＋105 25 ±22％ C7 EIA X7S －55～＋125 25 ±22％ LD(※) EIA X5R －55～＋ 85 25 ±15％ BJ JIS F －25～＋ 85 20 EIA Y5V －30～＋ 85 25 Note : ※.LD Low distortion high value multilayer ceramic capacitor △F EIA（inch） 01005 0201 0402 0204 0603 0306 0805 0508 1206 1210 1812 T［mm］ Standard 0.3±0.05 0.5±0.10 0.8＋0.15/－0.05 0.45±0.05 0.85±0.10 1.25＋0.15/－0.05 0.85±0.10 1.6±0.20 2.5±0.30 0.5＋0.15/－0.05 0.45±0.05 0.8＋0.20/－0 0.85±0.10 1.25＋0.20/－0 1.6±0.30 0.5＋0.20/－0 △= Blank space B C End termination Plated High Reliability Application ④Dimension（L×W） Series name Multilayer ceramic capacitor Multilayer ceramic capacitor for high frequency LW reverse type multilayer capacitor ⑤Dimension tolerance Code Type △ ALL 063 105 107 △＝Blank space ＋30/－80％ ＋22－82％ Capacitance Tolerance tolerance code ±10％ K ±20％ M ±10％ K ±20％ M ±10％ K ±20％ M ±10％ K ±20％ M ±10％ K ±20％ M ±10％ K ±20％ M ＋80/－20％ Z ＋80/－20％ Z △= Blank space ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 4 13 ■Temperature compensating type Applicable Code standard JIS CH CH CJ CK UK SL Ref. Temp.［℃］ C0H JIS EIA JIS EIA JIS CJ C0J CK C0J UJ EIA U2J JIS EIA JIS UK U2K S ⑧Capacitance tolerance Code B C D F J K M Z 0±120ppm/℃ ±0.25pF C 0±250ppm/℃ ±0.25pF C －750±120ppm/℃ ±0.25pF ±0.5pF ±5％ C D J －750±250ppm/℃ ±0.5pF C +350～－1000ppm/℃ ±5％ J 0±60ppm/℃ 25 －55～＋125 －55～＋125 －55～＋125 －55～＋125 －55～＋125 －55～＋125 20 25 20 25 20 25 20 25 20 ⑥Series code （Super low distortion multilayer ceramic capacitor（CFCAPTM）only） Code Series code SD Standard ⑦Nominal capacitance Code （example） 0R5 010 100 101 102 103 104 105 106 107 Note : R＝Decimal point Tolerance code B C D F J K 20 －55～＋125 EIA Capacitance tolerance ±0.1pF ±0.25pF ±0.5pF 1pF ±5％ ±10％ Capacitance change Nominal capacitance 0.5pF 1pF 10pF 100p 1,000pF 10,000pF 0.1μF 1.0μF 10μF 100μF Capacitance tolerance ±0.1pF ±0.25pF ±0.5pF ±1pF ±5％ ±10％ ±20％ ＋80/－20％ ⑨Thickness Code C D P T K V W A D F G H L N Y M Thickness［mm］ 0.2 0.2(Temperature compensating of 042type) 0.3 0.45 CERAMIC CAPACITORS UJ Temperature range［℃］ 0.5 0.8 0.85(212type or more) 1.15 1.25 1.5 1.6 1.9 2.0 max 2.5 ⑩Special code Code － H ⑪Packaging Code F T Special code Standard MLCC for Industrial, Automotive Comfort and Safety Packaging φ178mm Taping （2mm pitch） φ178mm Taping （4mm pitch） φ178mm Taping （4mm pitch, 1000 pcs/reel） 325 type（Thickness code M） φ178mm Taping（1mm pitch）042type only P W ⑫Internal code Code △ Internal code Standard ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 13 5 ■STANDARD EXTERNAL DIMENSIONS Type( EIA ) CERAMIC CAPACITORS e ※ LW reverse type Dimension [mm] T Ｌ Ｗ □MK042（01005） 0.4±0.02 0.2±0.02 0.2±0.02 □MK063（0201） 0.6±0.03 0.3±0.03 0.3±0.03 □MK105（0402） 1.0±0.05 0.5±0.05 □VK105（0402） □WK105（0204）※ 1.0±0.05 0.52±0.05 0.5±0.05 1.0±0.05 □MK107（0603） 1.6±0.10 0.8±0.10 □MR107（0603） □WK107（0306）※ 1.6±0.10 0.8±0.10 0.8±0.10 1.6±0.10 □MK212（0805） 2.0±0.10 1.25±0.10 □MR212（0805） □WK212（0508）※ 2.0±0.10 1.25±0.15 1.25±0.10 2.0±0.15 □MK316（1206） 3.2±0.15 1.6±0.15 □MR316（1206） 3.2±0.15 1.6±0.15 □MK325（1210） 3.2±0.30 2.5±0.20 □MR325（1210） 3.2±0.30 2.5±0.20 □MK432（1812） 4.5±0.40 Note : ※. LW reverse type, *1.Thickness code 3.2±0.30 0.2±0.02 0.3±0.03 0.5±0.05 0.5±0.05 0.3±0.05 0.45±0.05 0.8±0.10 0.8±0.10 0.5±0.05 0.45±0.05 0.85±0.10 1.25±0.10 1.25±0.10 0.85±0.1 0.85±0.10 1.15±0.10 1.25±0.10 1.6±0.20 1.6±0.20 0.85±0.10 1.15±0.10 1.5±0.10 1.9±0.20 1.9+0.1/-0.2 2.5±0.20 1.9±0.20 2.5±0.20 2.5±0.20 *1 C D P T C P V W P K A Ａ Ｖ K D G Ｇ Ｄ D Ｆ G L Ｌ D F H N Y M N M M e 0.1±0.03 0.15±0.05 0.25±0.10 0.25±0.10 0.18±0.08 0.35±0.25 0.1～0.6 0.25±0.15 0.5±0.25 0.25～0.75 0.3±0.2 0.5+0.35/-0.25 0.25～0.85 0.6±0.3 0.3～0.9 0.9±0.6 ■STANDARD QUANTITY Type EIA（inch） Dimension ［ｍｍ］ 042 01005 0.2 063 0201 0.3 105 0402 0.5 0204 ※ 107 0603 0306 ※ 212 0805 0508 ※ 316 325 0.2 0.3 1206 1210 432 1812 Note : ※.LW Reverse type（□WK） 0.30 0.45 0.8 0.50 0.45 0.85 1.25 0.85 0.85 1.15 1.25 1.6 0.85 1.15 1.5 1.9 2.0 max 2.5 2.5 Code C D P T C P V W P K A V K D G D D F G L D F H N Y M M Standard quantity［pcs］ Paper tape Embossed tape － 40000 15000 － 20000 15000 － － 10000 － 4000 － － 4000 4000 － － 4000 4000 3000 － － － 3000 － 2000 － 2000 － － 500（T），1000（P） 500 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 6 13 Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity ●Taped package Type(EIA) □MK042(01005) □MK063(0201) □WK105(0204) ※ □MK105(0402) □VK105(0402) ※ □MK107(0603) □WK107(0306) ※ □MR107(0603) □MK212(0805) □WK212(0508) ※ □MR212(0805) □MK316(1206) □MR316(1206) □MK325(1210) □MR325(1210) □MK432(1812) Note : ※ LW Reverse type. Thickness mm 0.2 0.3 0.3 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.45 0.85 1.25 0.85 1.15 1.25 1.6 0.85 1.15 1.5 1.9 2.0max. 2.5 2.5 code C, D P, T P C P V W K V A K D G D F G L D F H N Y M M Standard quantity [pcs] Paper tape Embossed tape － 40000 15000 10000 20000 － 15000 10000 4000 － 4000 4000 － － 4000 3000 － － 3000 2000 － － 500（T）, 1000（P） 500 ②Taping material ※No bottom tape for pressed carrier tape ●Card board carrier tape ●Embossed tape Chip filled ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack01_j-02 ③Representative taping dimensions ●Paper Tape（8mm wide） ●Pressed carrier tape（ 2mm pitch） Chip Cavity Type(EIA) Ａ 0.37 Ｂ 0.67 □MK063(0201) □WK105(0204) ※ □MK105(0402) （*1 C） 0.65 1.15 □MK105(0402) （*1 P） Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. Insertion Pitch Ｆ 2.0±0.05 Tape Thicknes Ｔ T1 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. Unit：mm ●Punched carrier tape （2mm pitch） Type(EIA) □MK105 (0402) □VK105 (0402) Ａ Chip Cavity Ｂ Insertion Pitch Ｆ Tape Thickness Ｔ 0.65 1.15 2.0±0.05 0.8max. Unit：ｍｍ ●Punched carrier tape （4mm pitch） Type(EIA) Chip Cavity Ａ Ｂ Insertion Pich Ｆ □MK107(0603) □WK107(0306) ※ 1.0 1.8 □MR107(0603) 4.0±0.1 □MK212(0805) 1.65 2.4 □WK212(0508) ※ □MK316(1206) 2.0 3.6 Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. Tape Thickness Ｔ 1.1max. 1.1max. Unit：mm ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack01_j-02 ●Embossed tape（4mm wide） Type(EIA) □MK042(01005) Chp Cavity Ａ 0.23 Ｂ 0.43 Insertion Pitch Ｆ 1.0±0.02 Tape Thickness K 0.5max. T 0.25max. Unit：mm ●Embossed tape（8mm wide） Type(EIA) □WK107(0306) ※ □MK212(0805) □MR212(0805) □MK316(1206) □MR316(1206) □MK325(1210) □MR325(1210) Note： ※ LW Reverse type. Chip Cavity Ａ 1.0 Ｂ 1.8 1.65 2.4 2.0 3.6 2.8 3.6 Insertion Pitch Ｆ 4.0±0.1 Tape Thickness K 1.3max. T 0.25±0.1 3.4max. 0.6max. Unit：mm ●Embossed tape（12mm wide） Type(EIA) □MK432(1812) Chip Cavity Ａ 3.7 Ｂ 4.9 Insertion Pitch Ｆ 8.0±0.1 Tape Thickness K 4.0max. T 0.6max. Unit：mm ④Trailer and Leader ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack01_j-02 ⑤Reel size A φ178±2.0 B φ50min. C φ13.0±0.2 D φ21.0±0.8 4mm wide tape 8mm wide tape 12mm wide tape T 1.5max. 2.5max. 2.5max. W 5±1.0 10±1.5 14±1.5 Unit：mm E 2.0±0.5 R 1.0 ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. ⑦Bulk Cassette The exchange of individual specification is necessary. Please contact Taiyo Yuden sales channels. Unit：mm ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack01_j-02 Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Multilayer Ceramic Capacitors ■RELIABILITY DATA 1.Operating Temperature Range Temperature Compensating（Class1） Standard High Frequency Type －55 to ＋125℃ Specification Temperature Range B －25 to ＋85℃ BJ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ F －25 to ＋85℃ F Y5V －30 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity （Class2） 2. Storage Conditions Temperature Compensating（Class1） Standard High Frequency Type －55 to ＋125℃ Specification Temperature Range B －25 to ＋85℃ BJ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ F －25 to ＋85℃ F Y5V －30 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity （Class2） 3. Rated Voltage Specified Value Temperature Compensating（Class1） Standard 50VDC, 25VDC, 16VDC High Frequency Type High Permittivity （Class2） 50VDC, 16VDC 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage （Between terminals） Specified Value Temperature Compensating（Class1） Standard High Frequency Type No breakdown or damage High Permittivity （Class2） Test Methods and Remarks Class 1 Rated volta×3 Applied voltage Duration Charge/discharge current Class 2 Rated voltage×2.5 1 to 5 sec. 50mA max. 5. Insulation Resistance Specified Value Temperature Compensating（Class1） Standard High Frequency Type High Permittivity （Class2） Note 1 Test Methods and Remarks Applied voltage Duration Charge/discharge current 10000 MΩ min. C≦0.047μF : 10000 MΩ min. C＞0.047μF : 500MΩ・μF : Rated voltage : 60±5 sec. : 50mA max. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 6. Capacitance （Tolerance） Specified Value Temperature Compensating（Class1） Standard C□ U□ SL 0.2pF≦C≦5pF 0.2pF≦C≦10pF C＞10pF : ±0.25pF : ±0.5pF : ±5% or ±10% High Frequency Type CH RH 0.3pF≦C≦2pF C＞2pF : ±0.1pF : ±5% BJ, B7, C6, C7, LD(※) : ±10% or ±20%, F : ＋80/－20% Note: ※LD Low distortion high value multilayer ceramic capacitor High Permittivity （Class2） Test Methods and Remarks Standard Preconditioning Measuring frequency Measuring voltage Note Bias application Class 1 High Frequency Type None 1ＭHz±10% 0.5 to 5Vrms Class 2 C≦10μF Thermal treatment （at 150℃ 1kHz±10% 1±0.2Vrms one C＞10μF for 1hr） Note 2 120±10Hz 0.5±0.1rms 7. Q or Dissipation Factor Specified Value Temperature Compensating（Class1） Standard High Frequency Type High Permittivity （Class2） Note 1 C＜30pF : Q≧400＋20C C≧30pF : Q≧1000 （C：Nominal capacitance） Refer to detailed specification BJ, B7, C6, C7：2.5% max., Class 1 High Frequency Type None 1ＭHz±10% 1GHz 0.5 to 5Vrms Standard Test Methods and Remarks Preconditioning Measuring frequey Measuring voltage Note 1 Bias application High Frequency Type Measuring equipment Measuring jig F：7% max. Class 2 C≦10μF C＞10μF Thermal treatment （at 150℃ for 1hr） Note 2 1ｋHz±10% 120±10Hz 1±0.2Vrms 0.5±0.1Vrms None : HP4291A : HP16192A 8. Temperature Characteristic （Without voltage application） Temperature Characteristic ［ppm/℃］ C□ : 0 CH, CJ, CK Standard Temperature Compensating（Class1） U□ : －750 SL High Frequency Type UJ, UK : ＋350 to －1000 Temperature Characteristic ［ppm/℃］ C□ : 0 CH R□ : －220 RH Specified Value Tolerance ［ppm/℃］ H : ±60 J : ±120 K : ±250 Tolerance ［ppm/℃］ H : ±60 Capacitance Reference Temperature Range change temperature ±10% 20℃ －25 to ＋85℃ ±15% 25℃ －55 to ＋85℃ ±15% 25℃ －55 to ＋125℃ ±22% 25℃ －55 to ＋105℃ ±22% 25℃ －55 to ＋125℃ ±15% 25℃ －55 to ＋85℃ ＋30/－80% 20℃ －25 to ＋85℃ ＋22/－82% 25℃ －30 to ＋85℃ distortion high value multilayer ceramic capacitor Specification B X5R B7 X7R C6 X6S C7 X7S LD(※) X5R F F Y5V Note : ※LD Low BJ High Permittivity （Class2） Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. （C85－C20） ×106（ppm/℃） △T＝65 C20×△T Test Methods and Remarks Class 2 Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. Step B、F X5R、X7R、X6S、X7S、Y5V 1 Minimum operating temperature 2 20℃ 25℃ 3 Maximum operating temperature ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 （C－C2） ×100（%） C2 C ：Capacitance in Step 1 or Step 3 C2 ：Capacitance in Step 2 9. Deflection Standard Temperature Compensating（Class1） High Frequency Type Specified Value Appearance Cpaitance change : No abnormality : Within±0.5 pF : No abnormality : Within ±12.5%（BJ, B7, C6, C7,LD(※)） Within ±30%（F） Note: ※LD Low distortion high value multilayer ceramic capacitor Multilayer Ceramic Capacitors 105 Type The other types Glass epoxy-resin substrate 0.8mm 1.6mm 1mm 10 sec. ※ 105 Type thickness, C： 0.2mm ,P： 0.3mm. 042, 063, Board Thickness Warp Duration : No abnormality : Within ±5% or ±0.5 pF, whichever is larger. Appearance Capacitance change High Permittivity （Class2） Test Methods and Remarks Appearance Capacitance change ※ Capacitance measurement shall be conducted with the board bent 10. Body Strength Specified Value Temperature Compensating（Class1） Standard High Frequency Type High Permittivity （Class2） Test Methods and Remarks － No mechanical damage. － High Frequency Type Applied force : 5N Duration : 10 sec. 11. Adhesive Strength of Terminal Electrodes Specified Value Temperature Compensating（Class1） Standard High Frequency Type No terminal separation or its indication. High Permittivity （Class2） Test Methods and Remarks Applied force Duration Multilayer Ceramic Capacitors 042, 063 Type 105 Type or more 2N 5N 30±5 sec. 12. Solderability Specified Value Temperature Compensating（Class1） Standard High Frequency Type At least 95% of terminal electrode is covered by new solder. High Permittivity （Class2） Test Methods and Remarks Solder type Solder temperature Duration Eutectic solder H60A or H63A 230±5℃ Lead-free solder Sn-3.0Ag-0.5Cu 245±3℃ 4±1 sec. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 13. Resistance to Soldering Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormlty : Within ±2.5% or ±0.25pF, whichever is larger. : Initial value : Initial value （between terminals） : No abnormality High Frequency Type Appearance Capacitancecange Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% : Initial value : Initial value （between terminals） : No abnormality Temperature Compensating（Class1） Specified Value Appearance Capactace change High Permittivity （Class2） : No abnormality : Within ±7.5%（BJ, B7, C6, C7, LD(※)） Within ±20%（F） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals）: No abnormality Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 lss 1 042, 063 Type 105 Type Preconditioning Preheating Test Methods and Remarks None Solder temp. Duration Recovery 270±5℃ 3±0.5 sec. 6 to 24 hrs （Standard condition） Noe 5 042、063 Type Preconditioning Preheating 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. 150℃, 1 to 2 min. 150℃, 1 to 2 min. Solder temp. Duration Recovery Class 2 105, 107, 212 Type 316, 325 Type Thermal treatment （at 150℃ for 1 hr） Note 2 80 to 100℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. 150 to 200℃, 2 to 5 min. 150 to 200℃, 5 to 10 min. 270±5℃ 3±0.5 sec. 24±2 hrs （Standard condition） Note 5 14. Temperature Cycle (Thermal Shock） Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±2.5% or ±0.25pF, whichever is larger. : Initial value : Initial value （between terminals） : No abnormality High Frequency Type Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within ±0.25pF : Initial value : Initial value （between terminals） : No abnormality Temperature Compensating（Class1） Specified Value Appearance Capacitance change High Permittivity （Class2） : No abnormality : Within ±7.5% （BJ, B7, C6, C7, LD(※)） Within ±20% （F） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 Class 1 Preconditioning Test Methods and Remarks 1 cycle Number of cycles Recovery Class 2 Thermal treatment （at 150℃ for 1 hr） Note 2 None Step 1 2 3 4 Temperature（℃） Minimum operating temperature Normal temperature Maximum operating temperature Normal temperature Time（min.） 30±3 2 to 3 30±3 2 to 3 5 times 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 15. Humidity （Steady State） Appearance Capacitance change Q Standard Temperature Compensating（Class1） Specified Value High Frequency Type Insulation resistance : No abnormality : Within ±5% or ±0.5pF, whichever is larger. : C＜10pF : Q≧200＋10C 10≦C＜30pF : Q≧275＋2.5C C≧30pF:Q≧350（C：Nominal capacitance） : 1000 MΩ min. Appearance Capacitance change Insulation resistance : No abnormality : Within ±0.5pF, : 1000 MΩ min. Appearance Capacitance change High Permittivity （Class2） : No abnormality : Within ±12.5% （BJ, B7, C6, C7, LD(※)） Within ±30% （F） Dissipation factor : 5.0% max.（BJ, B7, C6, C7, LD(※)） 11.0% max.（F） Insulation resistance : 50 MΩμF or 1000 MΩ whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 Class 1 Standard Test Methods and Remarks Preconditioning Temperature Humidity Duration Recovery Class 2 All items Thermal treatment（ at 150℃ for 1 hr） Note 2 40±2℃ 90 to 95%RH 500＋24/－0 hrs 24±2 hrs （Standard condition） Note 5 High Frequency Type None 40±2℃ 60±2℃ 90 to 95%RH 500＋24/－0 hrs 6 to 24 hrs （Standard condition） Note 5 16. Humidity Loading Appearance Capacitance change Q Standard Insulation resistance Temperature Compensating（Class1） Appearance Capacitance change High Frequency Type Specified Value : No abnormality : Within ±7.5% or ±0.75pF, whichever is larger. : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） : 500 MΩ min. Insulation resistance : No abnormality : C≦2pF：Within ±0.4 pF C＞2pF：Within ±0.75 pF （C：Nominal capacitance） : 500 MΩ min. Appearance Capacitance change High Permittivity （Class2） Note 1 90 to 95%RH 500＋24/－0 hrs Rated voltage Class 2 All items Voltage treatment （Rated voltage are applied for 1 hour at 40℃） Note 3 40±2℃ 90 to 95%RH 500＋24/－0 hrs Rated voltage 50mA max. 50mA max. 6 to 24 hrs （Standard condition） Note 5 24±2 hrs（Standard condition） Note 5 Standard Preconditioning Test Methods and Remarks Temperature Humidity Duration Applied voltage Charge/discharge current Recovery : No abnormality : Within ±12.5% （BJ, B7, C6, C7, LD(※)） Within ±30% （F） Dissipation factor : 5.0% max. （BJ, B7, C6, C7, LD(※)） 11.0% max. （F） Insulation resistance : 25 MΩμF or 500 MΩ, whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 High Frequency Type None 40±2℃ 60±2℃ ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 17. High Temperature Loading Appearance Capacitance change Q Standard Temperature Compensating（Class1） Specified Value High Frequency Type Insulation resistance : No abnormality : Within ±3% or ±0.3pF, whichever is larger. : C＜10pF： Q≧200＋10C 10≦C＜30pF：Q≧275＋2.5C C≧30pF： Q≧350（C：Nominal capacitance） : 1000 MΩ min. Appearance Capacitance change Insulation resistance : No abnormality : Within ±3% or ±0.3pF, whichever is larger. : 1000 MΩ min. Appearance Capacitance change High Permittivity （Class2） Note 1 Maximum operating temperature 1000＋48/－0 hrs Rated voltage×2 Class 2 BJ, LD(※), F C6 B7, C7 Voltage treatment（Twice the rated voltage shall be applied for 1 hour at 85℃, 105℃ or 125℃） Note 3, 4 Maximum operating temperature 1000＋48/－0 hrs Rated voltage×2 Note 4 50mA max. 50mA max. Standard Preconditioning Test Methods and Remarks Temperature Duration Applied voltage Charge/discharge current Recovery : No abnormality : Within ±12.5% （BJ, B7, C6, C7, LD(※)） Within ±30% （F） Dissipation factor : 5.0% max.（BJ, B7, C6, C7, LD(※)） 11.0% max.（F） Insulation resistance : 50 MΩμF or 1000 MΩ, whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 High Frequency Type None 6 to 24hr （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design Precautions ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. ◆Operating Voltage （Verification of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions ◆Pattern configurations （Design of Land-patterns） 1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: （1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. （2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. ◆Pattern configurations （Capacitor layout on PCBs） After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. ◆Pattern configurations （Design of Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors Land patterns for PCBs ●Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm） Wave-soldering Type 107 212 316 325 L 1.6 2.0 3.2 3.2 Size W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Technical considerations Reflow-soldering Type 042 063 105 L 0.4 0.6 1.0 Size W 0.2 0.3 0.5 A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 Note：Recommended land size might be different according 107 212 316 1.6 2.0 3.2 0.8 1.25 1.6 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 to the allowance of the size of the product. 325 3.2 2.5 1.8 to 2.5 1.0 to 1.5 1.8 to 3.2 432 4.5 3.2 2.5 to 3.5 1.5 to 1.8 2.3 to 3.5 ●LWDC: Recommended land dimensions for reflow-soldering （unit: mm） Type 105 107 212 L 0.52 0.8 1.25 Size W 1.0 1.6 2.0 A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7 B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5 C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 （2）Examples of good and bad solder application Items Not eommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded Components near mounted components Horizontal component placement ◆Pattern configurations （Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any stresses from board warp or deflection. Items Not recommended Recommended Deflection of board possible mechanical Place the product at a right angle to the direction of the anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. Technical considerations ◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. （1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. （2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads. （3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 Items Not recommended Recommended Single-sided mounting Double-sided mounting 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. （1）Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. （2）The recommended amount of adhesives is as follows; After capacitors are bonded Amount adhesive ［Recommended condition］ Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120μm c Adhesives shall not contact land 4. Soldering Precautions ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall not be applied. （2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. （3）When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. ◆Soldering ･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. ･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃. ･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 ［Reflow soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 Caution ①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the thickness of a capacitor. ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. ［Wave soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. ［Hand soldering］ 【Recommended conditions for eutectic 【Recommended condition for Pb-free soldering】 soldering】 316type or less ⊿T ⊿T≦150℃ 325type or more ⊿T ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. 5. Cleaning Precautions Technical considerations ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. （e.g. to remove soldering flux or other materials from the production process.） 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）. 2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ℓ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2）Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. ※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01