NTS1545MFS, NRVTS1545MFS Exceptionally Low Forward Voltage Trench-based Schottky Rectifier http://onsemi.com Features • Fine Lithography Trench−based Schottky Technology for Very Low • • • • • • • Forward Voltage and Low Leakage Fast Switching with Exceptional Temperature Stability Low Power Loss and Lower Operating Temperature Higher Efficiency for Achieving Regulatory Compliance Low Thermal Resistance High Surge Capability NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free and Halide−Free Devices 5,6 1,2,3 MARKING DIAGRAM A 1 Typical Applications • Switching Power Supplies including Wireless, Smartphone and • • • • SCHOTTKY BARRIER RECTIFIERS 15 AMPERES 45 VOLTS Notebook Adapters High Frequency and DC−DC Converters Freewheeling and OR−ing diodes Reverse Battery Protection Instrumentation A SO−8 FLAT LEAD CASE 488AA STYLE 2 TH1545 A Y W ZZ A C TH1545 AYWWZZ C Not Used = Specific Device Code = Assembly Location = Year = Work Week = Lot Traceability Mechanical Characteristics: • • • • • Case: Epoxy, Molded Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in. Lead Finish: 100% Matte Sn (Tin) Lead and Mounting SurfaceTemperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL 1 Requirements ORDERING INFORMATION Device Package Shipping† NTS1545MFST1G SO−8 FL (Pb−Free) 1500 / Tape & Reel NTS1545MFST3G SO−8 FL (Pb−Free) 5000 / Tape & Reel NRVTS1545MFST1G SO−8 FL (Pb−Free) 1500 / Tape & Reel NRVTS1545MFST3G SO−8 FL (Pb−Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 July, 2014 − Rev. 0 1 Publication Order Number: NTS1545MFS/D NTS1545MFS, NRVTS1545MFS MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 45 Average Rectified Forward Current (Rated VR, TC = 142°C) IF(AV) 15 A Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 140°C) IFRM 30 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 210 A Storage Temperature Range Tstg −65 to +150 °C Operating Junction Temperature TJ −55 to +150 °C EAS 100 mJ Unclamped Inductive Switching Energy (10 mH Inductor, Non−repetitive) V ESD Rating (Human Body Model) 3B ESD Rating (Machine Model) M4 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Case, Steady State (Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board) Symbol Typ Max Unit RθJC 1.3 − °C/W 0.42 0.45 0.48 − − 0.57 0.31 0.34 0.40 − − 0.51 − 15 120 45 ELECTRICAL CHARACTERISTICS Instantaneous Forward Voltage (Note 1) (iF = 5.0 Amps, TJ = 25°C) (iF = 7.5 Amps, TJ = 25°C) (iF = 15 Amps, TJ = 25°C) vF (iF = 5.0 Amps, TJ = 125°C) (iF = 7.5 Amps, TJ = 125°C) (iF = 15 Amps, TJ = 125°C) Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 125°C) V iR mA mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. http://onsemi.com 2 NTS1545MFS, NRVTS1545MFS TYPICAL CHARACTERISTICS iF, INSTANTANEOUS FORWARD CURRENT (A) 100 TA = 150°C 10 TA = 125°C TA = 25°C 1 TA = −55°C 0.1 IR, INSTANTANEOUS REVERSE CURRENT (A) 0 0.1 0.2 0.3 0.4 0.5 TA = 150°C TA = 125°C TA = 25°C 1 TA = −55°C 0.1 0.6 0.7 0.8 0.9 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Instantaneous Forward Characteristics Figure 2. Maximum Instantaneous Forward Characteristics 0.9 1.E+00 1.E+00 1.E−01 TA = 150°C 1.E−02 TA = 125°C 1.E−03 1.E−01 TA = 150°C 1.E−02 TA = 125°C 1.E−03 1.E−04 1.E−05 1.E−04 TA = 25°C 5 10 15 20 25 35 30 40 45 0 5 10 15 20 25 30 35 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V) Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics IF(AV), AVERAGE FORWARD CURRENT (A) 0 10,000 TJ = 25°C 1000 100 1 TA = 25°C 1.E−05 1.E−06 C, JUNCTION CAPACITANCE (pF) 10 IR, INSTANTANEOUS REVERSE CURRENT (A) iF, INSTANTANEOUS FORWARD CURRENT (A) 100 10 50 30 25 DC 20 Square Wave 15 10 5 RqJC = 1.3°C/W 0 80 90 100 110 120 130 VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE (°C) Figure 5. Typical Junction Capacitance Figure 6. Current Derating http://onsemi.com 3 45 140 150 NTS1545MFS, NRVTS1545MFS TYPICAL CHARACTERISTICS PF(AV), AVERAGE FORWARD POWER DISSIPATION (W) 22 IPK/IAV = 20 20 IPK/IAV = 5 IPK/IAV = 10 18 16 TJ = 150°C 14 12 10 Square Wave 8 6 dc 4 2 0 0 4 2 6 8 12 10 14 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Forward Power Dissipation 100 50% (DUTY CYCLE) R(t) (C/W) 10 1 20% 10% 5.0% 2.0% Assumes 25°C ambient and soldered to a 600 mm2 − oz copper pad on PCB 1.0% 0.1 SINGLE PULSE 0.01 0.000001 0.00001 0.0001 0.001 0.01 1.0 0.1 10 100 1000 PULSE TIME (s) Figure 8. Typical Thermal Characteristics R(t) (C/W) 10 1 50% (DUTY CYCLE) 20% 10% 0.1 Assumes 25°C ambient and soldered to a 600 mm2 − oz copper pad on PCB 5.0% 2.0% 1.0% SINGLE PULSE 0.000001 0.00001 0.01 0.0001 0.001 0.01 0.1 1.0 10 PULSE TIME (s) Figure 9. Typical Transient Thermal Response Characteristics, Junction−to−Case http://onsemi.com 4 100 1000 NTS1545MFS, NRVTS1545MFS PACKAGE DIMENSIONS DFN5 5x6, 1.27P (SO−8FL) CASE 488AA ISSUE H 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION D1 AND E1 DO NOT INCLUDE MOLD FLASH PROTRUSIONS OR GATE BURRS. 0.20 C D A 2 B D1 2X 0.20 C 4X E1 2 q E c 1 2 3 DIM A A1 b c D D1 D2 E E1 E2 e G K L L1 M q A1 4 TOP VIEW 0.10 C 3X C e SEATING PLANE DETAIL A A 0.10 C SOLDERING FOOTPRINT* SIDE VIEW 8X DETAIL A 3X 4X 1.270 0.750 4X b 0.10 C A B 0.05 c MILLIMETERS MIN NOM MAX 0.90 1.00 1.10 0.00 −−− 0.05 0.33 0.41 0.51 0.23 0.28 0.33 5.15 BSC 4.70 4.90 5.10 3.80 4.00 4.20 6.15 BSC 5.70 5.90 6.10 3.45 3.65 3.85 1.27 BSC 0.51 0.61 0.71 1.20 1.35 1.50 0.51 0.61 0.71 0.05 0.17 0.20 3.00 3.40 3.80 0_ −−− 12 _ STYLE 2: PIN 1. ANODE 2. ANODE 3. ANODE 4. NO CONNECT 5. CATHODE 1.000 e/2 L 0.965 1 4 1.330 K 2X 0.905 2X 0.495 E2 PIN 5 (EXPOSED PAD) G L1 M 4.530 3.200 0.475 2X D2 1.530 BOTTOM VIEW 4.560 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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