Diodes DMP4013LFG-7 40v p-channel enhancement mode mosfet powerdiâ® Datasheet

DMP4013LFG
40V P-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI®
Features and Benefits
V(BR)DSS
RDS(ON) max
-40V
13mΩ @ VGS = -10V
18mΩ @ VGS = -4.5V
ID max
TA = +25°C
-10.3A
-8.8A
•
Low RDS(ON) – ensures on state losses are minimized.
•
Small form factor thermally efficient package enables higher
density end products.
•
Occupies 33% of the board area occupied by SO-8, enabling
smaller end product.
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(RDS(ON)) and yet maintain superior switching performance, making it
•
•
®
Case: POWERDI 3333-8 (Type B)
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
ideal for high efficiency power management applications.
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Backlighting
•
Terminal Connections Indicator: See Diagram
•
Power Management Functions
•
•
DC-DC Converters
Terminals: Finish ⎯ Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
•
Weight: 0.072 grams (Approximate)
POWERDI3333-8
S
D
Pin 1
S
S
G
G
D
D
D
D
Bottom View
S
Top View
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMP4013LFG-7
DMP4013LFG-13
Notes:
Case
POWERDI3333-8 (Type B)
POWERDI3333-8 (Type B)
Packaging
2,000/Tape & Reel
3,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
POWERDI3333-8
YYWW
ADVANCE INFORMATION
Product Summary
P13= Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 13 = 2013)
WW = Week Code (01 ~ 53)
P13
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DMP4013LFG
Document number: DS37205 Rev. 2 - 2
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DMP4013LFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE INFORMATION
Characteristic
Symbol
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -10V
VDSS
Value
-40
Units
V
VGSS
±20
V
Steady
State
TA = +25°C
TA = +70°C
ID
-10.3
-8.3
A
t<10s
TA = +25°C
TA = +70°C
ID
-13.7
-11
A
A
IDM
80
Maximum Continuous Body Diode Forward Current (Note 6)
IS
2.6
A
Avalanche Current, L = 0.1mH
IAS
34
A
Avalanche Energy, L = 0.1mH
EAS
58
mJ
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Total Power Dissipation (Note 5)
Units
W
RθJC
Value
1
123
69
2.1
60
34
3.3
TJ, TSTG
-55 to +150
°C
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
RθJA
Total Power Dissipation (Note 6)
PD
Steady State
t<10s
Thermal Resistance, Junction to Ambient (Note 6)
RθJA
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
°C/W
W
°C/W
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Symbol
Min
BVDSS
IDSS
IGSS
VGS(th)
RDS (ON)
VSD
Typ
Max
-40
—
—
V
VGS = 0V, ID = -250μA
—
—
-1
µA
VDS = -40V, VGS = 0V
—
—
±100
nA
VGS = ±20V, VDS = 0V
V
VDS = VGS, ID = -250μA
-1
—
-3
—
—
13
—
—
18
—
-0.7
-1.2
Unit
mΩ
V
Ciss
—
3426
—
pF
Output Capacitance
Coss
—
283
—
pF
Reverse Transfer Capacitance
Crss
—
pF
Gate Resistance
Rg
235
4.7
—
—
—
Ω
Total Gate Charge (VGS = -4.5V)
Qg
—
32.5
—
nC
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Qg
—
68.6
—
nC
Qgs
—
8.2
—
nC
Gate-Drain Charge
Qgd
—
9.9
—
nC
Turn-On Delay Time
tD(on)
—
5.3
—
ns
Turn-On Rise Time
tr
—
20
—
ns
Turn-Off Delay Time
tD(off)
—
126
—
ns
Turn-Off Fall Time
tf
—
83
—
ns
Body Diode Reverse Recovery Time
trr
—
19.5
—
nS
Body Diode Reverse Recovery Charge
Qrr
—
9.8
—
nC
Notes:
Test Condition
VGS = -10V, ID = -10A
VGS = -4.5V, ID = -8A
VGS = 0V, IS = -1A
VDS = -20V, VGS = 0V,
f = 1MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = -20V, ID = -10A
VDD = -20V, VGEN = -10V,
RG = 3Ω, ID = -10A
IF = -10A, di/dt = 100A/μs
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
POWERDI is a registered trademark of Diodes Incorporated.
DMP4013LFG
Document number: DS37205 Rev. 2 - 2
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January 2015
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DMP4013LFG
30.0
25
VGS = -4.0V
VGS = -2.5V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = -5.0V
VGS = -4.5V
25.0
VGS = -3.5V
20.0
VGS = -3.0V
15.0
10.0
5.0
20
15
10
TA = 150°C
5
VGS = -2.0V
TA = 125°C
T A = 85°C
TA = 25°C
TA = -55°C
0
1
2
3
4
VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.016
0.014
VGS = -4.5V
0.012
VGS = -10V
0.01
0.008
0.006
0
5
10
15
20
25
ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0
0.5
5
3
ID = 10A
0.05
ID = 8A
0.04
0.03
0.02
0.01
30
0.02
0
0
2
4
6
8 10 12 14 16 18
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristics
20
1.8
VGS = -10V
0.018
TA = 150°C
T A = 125 °C
0.016
0.014
TA = 85°C
0.012
TA = 25°C
0.01
0.008
TA = -55°C
0.006
0.004
1
1.5
2
2.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
0.06
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ADVANCE INFORMATION
30
VGS = -10V
0
5
10
15
20
25
ID, DRAIN SOURCE CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
30
VGS = -10V
ID = -10A
1.6
1.4
VGS = -4.5V
ID = -8A
1.2
1
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
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1.8
0.02
VGS = -4.5V
ID = -8A
0.018
0.016
0.014
VGS = -10V
ID = -10A
0.012
0.01
0.008
0.006
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.022
1.6
-ID = 250µA
1.2
1
0.8
0.6
0.4
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 On-Resistance Variation with Temperature
30
-I D = 1mA
1.4
0.004
-50
10000
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
IS, SOURCE CURRENT (A)
25
20
15
TA= 150°C
TA= 85°C
10
TA= 125°C
5
0
TA= 25°C
TA= -55°C
0
Ciss
1000
Coss
Crss
100
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10 Typical Junction Capacitance
40
100
10
RDS(on)
Limited
8
ID, DRAIN CURRENT (A)
VGS, GATE-SOURCE VOLTAGE (V)
ADVANCE INFORMATION
DMP4013LFG
6
VDS = -20V
ID = -10A
4
2
0
10
DC
PW = 10s
1
PW = 1s
PW = 100ms
PW = 10ms
0.1 TJ(max) = 150°C
TA = 25°C
VGS = -10V
Single Pulse
DUT on 1 * MRP Board
0
10
20
30
40
50
60
Qg, TOTAL GATE CHARGE (nC)
Figure 11 Gate-Charge Characteristics
70
0.01
0.1
PW = 1ms
PW = 100µs
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 12 SOA, Safe Operation Area
100
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DMP4013LFG
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 119°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
1E-04
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIMES (sec)
Figure 13 Transient Thermal Resistance
100
1000
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Package Outline Dimensions
ADVANCE INFORMATION
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
®
A
POWERDI 3333-8
Type B
Dim Min Max Typ
A
0.75 0.85 0.80
A1
0
0.05 0.02
A3
0.203
−
−
b
0.27 0.37 0.32
b2
0.20
−
−
D
3.25 3.35 3.30
D1 2.55 2.66 2.61
D2 1.74 1.84 1.79
e
0.65
−
−
E
3.25 3.35 3.30
E1 1.14 1.24 1.19
E2 0.61 0.71 0.66
K1
0.41
−
−
K2
0.38
−
−
L
0.35 0.45 0.40
L1
0.25
−
−
Z
0.515
−
−
All Dimensions in mm
A3
A1
D
D1
L (5x)
K1
E1
E
b2 (4x)
K2
D2
E2
L1 (2x)
Z (4x) e
b (8x)
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
G
X2 (3x)
Dimensions
C
G
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Y5
Y6
Y1
Y2
X3
Y3
Y4
X4
Y5
Y6
Y
(5x)
X (5x)
C
Value (in mm)
0.650
0.230
0.420
2.370
0.420
1.890
2.710
0.700
0.400
1.160
1.850
0.405
1.295
3.700
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DMP4013LFG
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ADVANCE INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for
use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMP4013LFG
Document number: DS37205 Rev. 2 - 2
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January 2015
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