TDK CGA4J3C0G2E562J125AE Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : November 16, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA4J3C0G2E562J125AE
新製品
TDK item description CGA4J3C0G2E562JT***S
Applications
Automotive Grade
Mid Mid Voltage (100 to 630V)
Feature
Soft Soft Termination
AEC-Q200 AEC-Q200
Series
CGA4(2012) [EIA 0805]
Status
Production
Size
Length(L)
2.00mm +0.45,-0.20mm
Width(W)
1.25mm +0.25,-0.20mm
Thickness(T)
1.25mm +0.25,-0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PA)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
Recommended Land Pattern (PB)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
Recommended Land Pattern (PC)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
5.6nF ±5%
Rated Voltage
250VDC
Temperature Characteristic
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
Yes
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : November 16, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
CGA4J3C0G2E562J125AE
新製品
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
CGA4J3C0G2E562J125AE
DC Bias Characteristic
CGA4J3C0G2E562J125AE
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Capacitance
CGA4J3C0G2E562J125AE
Temperature Characteristic
CGA4J3C0G2E562J125AE(No Bias)
CGA4J3C0G2E562J125AE(DC Bias =
125V)
Multilayer Ceramic Chip Capacitors
CGA4J3C0G2E562J125AE
新製品
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : November 16, 2017 (GMT)
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