MB9AAA0N Series
32-bit ARM® Cortex®-M3
FM3 Microcontroller
The MB9AAA0N Series are highly integrated 32-bit microcontrollers that dedicated for embedded controllers with low-power
consumption mode and competitive cost.
The MB9AAA0N Series are based on the ARM® Cortex®-M3 Processor with on-chip Flash memory and SRAM, and has peripheral
functions such as LCD Controller, Motor Control Timers, ADCs, DACs and Communication Interfaces (UART, CSIO, I2C).
The products which are described in this data sheet are placed into TYPE7 product categories in FM3 Family Peripheral Manual.
Features
32-bit ARM® Cortex®-M3 Core
Multi-function Serial Interface (Max 8 channels)
Processor version: r2p1
Operation mode is selectable from the followings for each
channel.
Up to 20MHz Operation Frequency
UART
Integrated Nested Vectored Interrupt Controller (NVIC): 1
CSIO
channel NMI (non-maskable interrupt) and
32 channels' peripheral interrupts and 8 priority levels
24-bit System timer (Sys Tick): System timer for OS task
management
I2 C
[UART]
Full duplex double buffer
On-chip Memories
Selection with or without parity supported
[Flash memory]
Built-in dedicated baud rate generator
Up to 128 Kbytes
External clock available as a serial clock
Read cycle: 0 wait-cycle
Various error detection functions available (parity errors,
framing errors, and overrun errors)
Security function for code protection
[CSIO]
[SRAM]
This series contains a total of up to 16 Kbyte on-chip SRAM
that is connected to System bus of Cortex-M3 core.
Full duplex double buffer
Built-in dedicated baud rate generator
SRAM1: Up to 16 Kbytes
Overrun error detection function available
LCD controller (LCDC)
[I2C]
Selectable from 44 SEG × 4 COM (Max) or 40 SEG × 8 COM
Standard-mode (Max 100 kbps) / Fast-mode (Max 400 kbps)
supported
(Max)
Internal divide resistor is contained (selectable from 10 kΩ or
100 kΩ for the resistor value)
A/D Converter (Max 16 channels)
LCD drive power supply (bias) pin (VV4 to VV0)
[12-bit A/D Converter]
Interrupt function synchronized with the LCD module frame
Successive Approximation type
frequency
Conversion time: Min 1.0 s
With blinking function
Priority conversion available (priority at 2 levels)
Inverted display function
Scanning conversion mode
Built-in FIFO for conversion data storage (for SCAN
conversion: 16steps, for Priority conversion: 4 steps)
Cypress Semiconductor Corporation
Document Number: 002-05673 Rev.*C
•
198 Champion Court
•
San Jose , CA 95134-1709
•
408-943-2600
Revised June 12, 2017
MB9AAA0N Series
D/A Converter (Max 2 channels)
R-2R type
HDMI-CEC/Remote Control Receiver (Up to 2
channels)
10-bit resolution
HDMI- CEC receiver / Remote control receiver
Base Timer (Max 8 channels)
Operation mode is selectable from the followings for each
channel.
16-bit PWM timer
16-bit PPG timer
16-/32-bit reload timer
16-/32-bit PWC timer
General-Purpose I/O Port
This series can use its pins as general-purpose I/O ports when
they are not used for peripherals. Moreover, the port relocate
function is built in. It can set which I/O port the peripheral
function can be allocated to.
Capable of pull-up control per pin
Capable of reading pin level directly
Operating
modes supporting the following standards can
be selected
• SIRCS
• NEC/Association for Electric Home Appliances
• HDMI-CEC
Capable of adjusting detection timings for start bit and data
bit
Equipped with noise filter
HDMI-CEC transmitter
Header
block automatic transmission by judging Signal
free
Generating status interrupt by detecting Arbitration lost
Generating START, EOM, ACK automatically to output
CEC transmission by setting 1 byte data
Generating transmission status interrupt when transmitting
1 block (1 byte data and EOM/ACK)
Real-time clock (RTC)
Built-in the port relocate function
The Real-time clock can count
Year/Month/Day/Hour/Minute/Second/A day of the week from
00 to 99.
Up to 84 high-speed general-purpose I/O Ports@100 pin
The interrupt function with specifying date and time
Package
Some ports are 5V tolerant I/O
See List of Pin Functions and I/O Circuit Type to confirm the
corresponding pins.
(Year/Month/Day/Hour/Minute) is available. This function is
also available by specifying only Year, Month, Day, Hour or
Minute.
Timer interrupt function after set time or each set time.
Multi-function Timer
Capable of rewriting the time with continuing the time count.
The Multi-function timer is composed of the following blocks.
Leap year automatic count is available.
16-bit free-run timer × 3ch.
Input capture × 4ch.
Output compare × 6ch.
A/D activation compare × 1ch.
External Interrupt Controller Unit
Up to 16 external interrupt input pins
Include one non-maskable interrupt (NMI) input pin
Waveform generator × 3ch.
Watchdog Timer (2 channels)
16-bit PPG timer × 3ch.
A watchdog timer can generate interrupts or a reset when a
time-out value is reached.
IGBT mode is contained.
The following function can be used to achieve the motor
control.
PWM signal output function
DC chopper waveform output function
This series consists of two different watchdogs, a Hardware
watchdog and a Software watchdog.
The Hardware watchdog timer is clocked by the built-in
Low-speed CR oscillator. Therefore, the Hardware watchdog is
active in any low-power consumption mode except RTC, Stop,
Deep Standby RTC and Deep Standby Stop modes.
Dead time function
Input capture function
A/D convertor activate function
DTIF (Motor emergency stop) interrupt function
Document Number: 002-05673 Rev.*C
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MB9AAA0N Series
Clock and Reset
Low-Voltage Detector (LVD)
[Clocks]
This Series includes 2-stage monitoring of voltage on the VCC.
When the voltage falls below the voltage that has been set,
Low-Voltage Detector generates an interrupt or reset.
Selectable from five clock sources (2 external oscillators, 2
built-in CR oscillators, and Main PLL).
Main Clock:
4 MHz to 20 MHz
Sub Clock:
32.768 kHz
LVD1: error reporting via interrupt
LVD2: auto-reset operation
Built-in High-speed CR Clock: 4 MHz
Low-Power Consumption Mode
Built-in Low-speed CR Clock: 100 kHz
Sleep
Main PLL Clock
Timer
[Resets]
RTC
Reset requests from INITX pin
Stop
Power-on reset
Deep Standby RTC
Software reset
Deep Standby Stop
Watchdog timers reset
The back up register is 16 byte
Six low-power consumption modes supported.
Low-voltage detection reset
Clock Super Visor reset
Clock Super Visor (CSV)
Clocks generated by built-in CR oscillators are used to
supervise abnormality of the external clocks.
If external clock failure (clock stop) is detected, reset is
asserted.
Debug
Serial Wire JTAG Debug Port (SWJ-DP)
Power Supply
Wide range voltage:
VCC = 1.8 V to 5.5 V
VCC = 2.2 V to 5.5 V (when LCDC is used)
If external frequency anomaly is detected, interrupt or reset is
asserted.
Document Number: 002-05673 Rev.*C
Page 3 of 108
MB9AAA0N Series
Contents
1. Product Lineup .................................................................................................................................................................. 6
2. Packages ........................................................................................................................................................................... 7
3. Pin Assignment ................................................................................................................................................................. 8
4. List of Pin Functions....................................................................................................................................................... 12
5. I/O Circuit Type................................................................................................................................................................ 34
6. Handling Precautions ..................................................................................................................................................... 42
6.1
Precautions for Product Design ................................................................................................................................... 42
6.2
Precautions for Package Mounting .............................................................................................................................. 43
6.3
Precautions for Use Environment ................................................................................................................................ 44
7. Handling Devices ............................................................................................................................................................ 45
8. Block Diagram ................................................................................................................................................................. 47
9. Memory Size .................................................................................................................................................................... 48
10. Memory Map .................................................................................................................................................................... 48
11. Pin Status in Each CPU State ........................................................................................................................................ 51
12. Electrical Characteristics ............................................................................................................................................... 62
12.1 Absolute Maximum Ratings ......................................................................................................................................... 62
12.2 Recommended Operating Conditions.......................................................................................................................... 63
12.3 DC Characteristics....................................................................................................................................................... 64
12.3.1 Current Rating .............................................................................................................................................................. 64
12.3.2 Pin Characteristics ....................................................................................................................................................... 67
12.3.3 LCD Characteristics ..................................................................................................................................................... 68
12.4 AC Characteristics ....................................................................................................................................................... 69
12.4.1 Main Clock Input Characteristics .................................................................................................................................. 69
12.4.2 Sub Clock Input Characteristics ................................................................................................................................... 70
12.4.3 Built-in CR Oscillation Characteristics .......................................................................................................................... 70
12.4.4 Operating Conditions of Main PLL (In the case of using main clock for input of PLL) .................................................. 71
12.4.5 Operating Conditions of Main PLL (In the case of using the built-in High-speed CR for the input clock
of the Main PLL) ........................................................................................................................................................... 71
12.4.6 Reset Input Characteristics .......................................................................................................................................... 72
12.4.7 Power-on Reset Timing................................................................................................................................................ 72
12.4.8 Base Timer Input Timing .............................................................................................................................................. 73
12.4.9 CSIO/UART Timing ...................................................................................................................................................... 74
12.4.10 External Input Timing ................................................................................................................................................ 82
12.4.11 I2C Timing ................................................................................................................................................................. 83
12.4.12 JTAG Timing ............................................................................................................................................................. 84
12.5 12-bit A/D Converter .................................................................................................................................................... 85
12.6 10-bit D/A Converter .................................................................................................................................................... 88
12.7 Low-Voltage Detection Characteristics ........................................................................................................................ 89
12.7.1 Low-Voltage Detection Reset ....................................................................................................................................... 89
12.7.2 Interrupt of Low-Voltage Detection ............................................................................................................................... 90
12.8 Flash Memory Write/Erase Characteristics ................................................................................................................. 92
12.8.1 Write / Erase time......................................................................................................................................................... 92
12.8.2 Write cycles and data hold time ................................................................................................................................... 92
12.9 Return Time from Low-Power Consumption Mode ...................................................................................................... 93
12.9.1 Return Factor: Interrupt/WKUP .................................................................................................................................... 93
12.9.2 Return Factor: Reset .................................................................................................................................................... 95
13. Ordering Information ...................................................................................................................................................... 97
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MB9AAA0N Series
14. Package Dimensions ...................................................................................................................................................... 98
15. Errata.............................................................................................................................................................................. 104
15.1 Part Numbers Affected .............................................................................................................................................. 104
15.2 Qualification Status.................................................................................................................................................... 104
15.3 Errata Summary ........................................................................................................................................................ 104
15.4 Errata Detail .............................................................................................................................................................. 104
15.4.1 HDMI-CEC polling message issue ............................................................................................................................. 104
15.4.2 RTC delay issue ......................................................................................................................................................... 105
Major Changes .................................................................................................................................................................... 106
Document History ............................................................................................................................................................... 107
Sales, Solutions, and Legal Information........................................................................................................................... 108
Document Number: 002-05673 Rev.*C
Page 5 of 108
MB9AAA0N Series
1. Product Lineup
Memory size
Product name
MB9AFAA1L/M/N
MB9AFAA2L/M/N
64 Kbytes
12 Kbytes
128 Kbytes
16 Kbytes
On-chip Flash memory
On-chip SRAM
SRAM1
Function
Product name
Pin count
MB9AFAA1L
MB9AFAA2L
MB9AFAA1M
MB9AFAA2M
MB9AFAA1N
MB9AFAA2N
64
80
Cortex-M3
20 MHz
1.8 V to 5.5 V
37SEG×4COM (Max)
or
33SEG×8COM (Max)
100
CPU
Freq.
Power supply voltage range
LCD Controller (LCDC)
Multi-function Serial Interface
(UART/CSIO/I2C)
Base Timer
(PWC/ Reload timer/PWM/PPG)
A/D activation
1ch.
compare
Input capture
4ch.
Free-run timer
3ch.
MFOutput
6ch.
Timer
compare
Waveform
3ch.
generator
PPG
3ch.
(IGBT mode)
HDMI-CEC/ Remote Control
Receiver
Real-time clock (RTC)
Watchdog timer
External Interrupts
General-purpose I/O ports
12-bit A/D converter
10-bit D/A converter
CSV (Clock Super Visor)
LVD (Low-Voltage Detector)
High-speed
Built-in CR
Low-speed
Debug Function
24SEG×4COM (Max)
or
20SEG×8COM (Max)
44SEG×4COM (Max)
or
40SEG×8COM (Max)
8ch. (Max)
8ch. (Max)
1 unit (Max)
2ch. (Max)
8 pins (Max)+ NMI × 1
52 pins (Max)
9ch. (1 unit)
1 unit
1ch. (SW) + 1ch. (HW)
11 pins (Max)+ NMI × 1
67 pins (Max)
12ch. (1 unit)
2ch. (Max)
Yes
2ch.
4 MHz
100 kHz
SWJ-DP
16 pins (Max)+ NMI × 1
84 pins (Max)
16ch. (1 unit)
Note:
−
All signals of the peripheral function in each product cannot be allocated by limiting the pins of package.
It is necessary to use the port relocate function of the I/O port according to your function use.
See Electrical Characteristics 12.4 AC Characteristics (12.4.3) Built-in CR Oscillation Characteristics for accuracy of built-in
CR.
Document Number: 002-05673 Rev.*C
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MB9AAA0N Series
2. Packages
Product name
Package
MB9AFAA1L
MB9AFAA2L
MB9AFAA1M
MB9AFAA2M
MB9AFAA1N
MB9AFAA2N
LQFP:
LQD064 (0.5mm pitch)
-
-
LQFP:
LQG064 (0.65mm pitch)
-
-
LQFP:
LQH080 (0.5mm pitch)
-
-
LQFP:
LQJ080 (0.65mm pitch)
-
-
LQFP:
LQI100 (0.5mm pitch)
-
-
QFP:
PQH100 (0.65mm pitch)
-
-
: Supported
Note:
−
See Package Dimensions for detailed information on each package.
Document Number: 002-05673 Rev.*C
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MB9AAA0N Series
3. Pin Assignment
LQD064/LQG064
VSS
P82 / SCK7_2
P81 / SOT7_2
P80 / SIN7_2
P60 / SIN5_0 / TIOA2_2 / INT15_1 / WKUP3 / CEC1
P61 / SOT5_0 / TIOB2_2 / DTTI0X_2 / SEG00
P62 / SCK5_0 / ADTG_3 / SEG01
P0F / NMIX / CROUT_1 / RTCCO_0 / SUBOUT_0 / WKUP0
P0C / SCK4_0 / TIOA6_1
P0B / SOT4_0 / TIOB6_1
P0A / SIN4_0 / INT00_2
P04 / TDO / SWO
P03 / TMS / SWDIO
P02 / TDI
P01 / TCK / SWCLK
P00 / TRSTX
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
(TOP VIEW)
VCC
1
48
P21 / SIN0_0 / INT06_1 / WKUP2 / SEG11
P50 / SIN3_1 / INT00_0 / VV4
2
47
P22 / SOT0_0 / TIOB7_1 / SEG12
P51 / SOT3_1 / INT01_0
3
46
P23 / SCK0_0 / TIOA7_1 / SEG13
P52 / SCK3_1 / INT02_0
4
45
P19 / AN09 / SCK2_2 / SEG19
P30 / TIOB0_1 / INT03_2 / COM7 / SEG43
5
44
P18 / AN08 / SOT2_2 / SEG20
P31 / SCK6_1 / TIOB1_1 / INT04_2 / COM6 / SEG42
6
43
AVSS
P32 / SOT6_1 / TIOB2_1 / INT05_2 / COM5 / SEG41
7
42
AVRH
P33 / SIN6_1 / TIOB3_1 / INT04_0 / ADTG_6 / COM4 / SEG40
8
41
AVCC
P39 / DTTI0X_0 / ADTG_2 / COM3
9
40
P17 / AN07 / SIN2_2 / INT04_1 / SEG21
P3A / TIOA0_1 / RTO00_0 / RTCCO_2 / SUBOUT_2 / COM2
10
39
P15 / AN05 / IC03_2 / SEG23
P3B / TIOA1_1 / RTO01_0 / COM1
11
38
P14 / AN04 / INT03_1 / IC02_2 / SEG24
P3C / TIOA2_1 / RTO02_0 / COM0
12
37
P13 / AN03 / SCK1_1 / IC01_2 / RTCCO_1 / SUBOUT_1 / SEG25
P3D / TIOA3_1 / RTO03_0 / SEG37
13
36
P12 / AN02 / SOT1_1 / IC00_2 / SEG26
P3E / TIOA4_1 / RTO04_0 / SEG36
14
35
P11 / AN01 / SIN1_1 / INT02_1 / FRCK0_2 / WKUP1 / SEG27
P3F / TIOA5_1 / RTO05_0 / SEG35
15
34
P10 / AN00 / SEG28
VSS
16
33
VCC
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
C
VCC
P46 / X0A
P47 / X1A
INITX
P49 / TIOB0_0 / SEG31
P4A / TIOB1_0 / SEG30
P4B / TIOB2_0 / IGTRG / SEG29
P4C / SCK7_1 / TIOB3_0 / CEC0
P4D / SOT7_1 / TIOB4_0 / DA0
P4E / SIN7_1 / TIOB5_0 / INT06_2 / DA1
PE0 / MD1
MD0
PE2 / X0
PE3 / X1
VSS
LQFP - 64
Note:
−
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these
pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register
(EPFR) to select the pin.
Document Number: 002-05673 Rev.*C
Page 8 of 108
MB9AAA0N Series
LQH080/LQJ080
VSS
P82 / SCK7_2
P81 / SOT7_2
P80 / SIN7_2
P60 / SIN5_0 / TIOA2_2 / INT15_1 / WKUP3 / CEC1
P61 / SOT5_0 / TIOB2_2 / DTTI0X_2 / SEG00
P62 / SCK5_0 / ADTG_3 / SEG01
P63 / INT03_0 / SEG02
P0F / NMIX / CROUT_1 / RTCCO_0 / SUBOUT_0 / WKUP0
P0E / CTS4_0 / TIOB3_2 / SEG03
P0D / RTS4_0 / TIOA3_2 / SEG04
P0C / SCK4_0 / TIOA6_1
P0B / SOT4_0 / TIOB6_1
P0A / SIN4_0 / INT00_2
P07 / ADTG_0 / SEG07
P04 / TDO / SWO
P03 / TMS / SWDIO
P02 / TDI
P01 / TCK / SWCLK
P00 / TRSTX
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
(TOP VIEW)
VCC
1
60
P20 / INT05_0 / CROUT_0 / SEG10
P50 / SIN3_1 / INT00_0 / VV4
2
59
P21 / SIN0_0 / INT06_1 / WKUP2 / SEG11
P51 / SOT3_1 / INT01_0 / VV3
3
58
P22 / SOT0_0 / TIOB7_1 / SEG12
P52 / SCK3_1 / INT02_0 / VV2
4
57
P23 / SCK0_0 / TIOA7_1 / SEG13
P53 / SIN6_0 / TIOA1_2 / INT07_2 / VV1
5
56
P1B / AN11 / SOT4_1 / IC01_1 / SEG17
P54 / SOT6_0 / TIOB1_2 / VV0
6
55
P1A / AN10 / SIN4_1 / INT05_1 / IC00_1 / SEG18
P55 / SCK6_0 / ADTG_1 / SEG39
7
54
P19 / AN09 / SCK2_2 / SEG19
P56 / INT08_2 / SEG38
8
53
P18 / AN08 / SOT2_2 / SEG20
P30 / TIOB0_1 / INT03_2 / COM7 / SEG43
9
52
AVSS
P31 / SCK6_1 / TIOB1_1 / INT04_2 / COM6 / SEG42
10
51
AVRH
P32 / SOT6_1 / TIOB2_1 / INT05_2 / COM5 / SEG41
11
50
AVCC
P33 / SIN6_1 / TIOB3_1 / INT04_0 / ADTG_6 / COM4 / SEG40
12
49
P17 / AN07 / SIN2_2 / INT04_1 / SEG21
P39 / DTTI0X_0 / ADTG_2 / COM3
13
48
P16 / AN06 / SCK0_1 / SEG22
P3A / TIOA0_1 / RTO00_0 / RTCCO_2 / SUBOUT_2 / COM2
14
47
P15 / AN05 / SOT0_1 / IC03_2 / SEG23
P3B / TIOA1_1 / RTO01_0 / COM1
15
46
P14 / AN04 / SIN0_1 / INT03_1 / IC02_2 / SEG24
LQFP - 80
27
28
29
30
31
32
33
34
35
36
37
38
39
40
INITX
P48 / SIN3_2 / INT14_1 / SEG32
P49 / SOT3_2 / TIOB0_0 / SEG31
P4A / SCK3_2 / TIOB1_0 / SEG30
P4B / TIOB2_0 / IGTRG / SEG29
P4C / SCK7_1 / TIOB3_0 / CEC0
P4D / SOT7_1 / TIOB4_0 / DA0
P4E / SIN7_1 / TIOB5_0 / INT06_2 / DA1
PE0 / MD1
MD0
PE2 / X0
PE3 / X1
VSS
VCC
P47 / X1A
41
26
20
P46 / X0A
P10 / AN00 / SEG28
VSS
25
42
VCC
19
24
P11 / AN01 / SIN1_1 / INT02_1 / FRCK0_2 / WKUP1 / SEG27
P3F / TIOA5_1 / RTO05_0 / SEG35
23
43
C
18
VSS
P12 / AN02 / SOT1_1 / IC00_2 / SEG26
P3E / TIOA4_1 / RTO04_0 / SEG36
22
P13 / AN03 / SCK1_1 / IC01_2 / RTCCO_1 / SUBOUT_1 / SEG25
44
21
45
17
P45 / TIOA5_0 / SEG33
16
P44 / TIOA4_0 / SEG34
P3C / TIOA2_1 / RTO02_0 / COM0
P3D / TIOA3_1 / RTO03_0 / SEG37
Note:
−
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these
pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register
(EPFR) to select the pin.
Document Number: 002-05673 Rev.*C
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MB9AAA0N Series
LQI100
P82 / SCK7_2
P81 / SOT7_2
P80 / SIN7_2
P60 / SIN5_0 / TIOA2_2 / INT15_1 / WKUP3 / CEC1
P61 / SOT5_0 / TIOB2_2 / DTTI0X_2 / SEG00
P62 / SCK5_0 / ADTG_3 / SEG01
P63 / INT03_0 / SEG02
P0F / NMIX / CROUT_1 / RTCCO_0 / SUBOUT_0 / WKUP0
P0E / CTS4_0 / TIOB3_2 / SEG03
P0D / RTS4_0 / TIOA3_2 / SEG04
P0C / SCK4_0 / TIOA6_1
P0B / SOT4_0 / TIOB6_1
P0A / SIN4_0 / INT00_2
P09 / RTS4_2 / TIOB0_2 / SEG05
P08 / CTS4_2 / TIOA0_2 / SEG06
P07 / SCK4_2 / ADTG_0 / SEG07
P06 / SOT4_2 / TIOB5_2 / INT01_1 / SEG08
P05 / SIN4_2 / TIOA5_2 / INT00_1 / SEG09
P04 / TDO / SWO
P03 / TMS / SWDIO
P02 / TDI
P01 / TCK / SWCLK
P00 / TRSTX
VCC
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
100 VSS
(TOP VIEW)
VCC
1
75
VSS
P50 / SIN3_1 / INT00_0 / VV4
2
74
P20 / INT05_0 / CROUT_0 / SEG10
P51 / SOT3_1 / INT01_0 / VV3
3
73
P21 / SIN0_0 / INT06_1 / WKUP2 / SEG11
P52 / SCK3_1 / INT02_0 / VV2
4
72
P22 / SOT0_0 / TIOB7_1 / SEG12
P53 / SIN6_0 / TIOA1_2 / INT07_2 / VV1
5
71
P23 / SCK0_0 / TIOA7_1 / RTO00_1 / SEG13
P54 / SOT6_0 / TIOB1_2 / VV0
6
70
P1F / AN15 / FRCK0_1 / ADTG_5
P55 / SCK6_0 / ADTG_1 / SEG39
7
69
P1E / AN14 / RTS4_1 / DTTI0X_1 / SEG14
P56 / INT08_2 / SEG38
8
68
P1D / AN13 / CTS4_1 / IC03_1 / SEG15
P30 / TIOB0_1 / INT03_2 / COM7 / SEG43
9
67
P1C / AN12 / SCK4_1 / IC02_1 / SEG16
P31 / SCK6_1 / TIOB1_1 / INT04_2 / COM6 / SEG42
10
66
P1B / AN11 / SOT4_1 / IC01_1 / SEG17
P32 / SOT6_1 / TIOB2_1 / INT05_2 / COM5 / SEG41
11
65
P1A / AN10 / SIN4_1 / INT05_1 / IC00_1 / SEG18
P33 / SIN6_1 / TIOB3_1 / INT04_0 / ADTG_6 / COM4 / SEG40
12
64
P19 / AN09 / SCK2_2 / SEG19
P34 / TIOB4_1 / FRCK0_0
13
63
P18 / AN08 / SOT2_2 / SEG20
P35 / TIOB5_1 / INT08_1 / IC03_0
14
62
AVSS
P36 / SIN5_2 / INT09_1 / IC02_0
15
61
AVRH
LQFP - 100
40
41
42
43
44
45
46
47
48
49
50
P4B / TIOB2_0 / IGTRG / SEG29
P4C / SCK7_1 / TIOB3_0 / CEC0
P4D / SOT7_1 / TIOB4_0 / DA0
P4E / SIN7_1 / TIOB5_0 / INT06_2 / DA1
PE0 / MD1
MD0
PE2 / X0
PE3 / X1
VSS
39
P48 / SIN3_2 / INT14_1 / SEG32
P49 / SOT3_2 / TIOB0_0 / SEG31
38
P4A / SCK3_2 / TIOB1_0 / SEG30
37
VCC
INITX
P10 / AN00 / SEG28
51
P47 / X1A
52
25
36
24
VSS
P46 / X0A
P11 / AN01 / SIN1_1 / INT02_1 / FRCK0_2 / WKUP1 / SEG27
P3F / TIOA5_1 / RTO05_0 / SEG35
35
53
34
23
VSS
P12 / AN02 / SOT1_1 / IC00_2 / SEG26
P3E / TIOA4_1 / RTO04_0 / SEG36
VCC
54
33
22
C
P13 / AN03 / SCK1_1 / IC01_2 / RTCCO_1 / SUBOUT_1 / SEG25
P3D / TIOA3_1 / RTO03_0 / SEG37
32
55
P45 / TIOA5_0 / SEG33
21
31
P14 / AN04 / SIN0_1 / INT03_1 / IC02_2 / SEG24
P3C / TIOA2_1 / RTO02_0 / COM0
P44 / TIOA4_0 / SEG34
P15 / AN05 / SOT0_1 / IC03_2 / SEG23
56
30
57
20
29
19
P3B / TIOA1_1 / RTO01_0 / COM1
P42 / TIOA2_0
P16 / AN06 / SCK0_1 / SEG22
P3A / TIOA0_1 / RTO00_0 / RTCCO_2 / SUBOUT_2 / COM2
P43 / TIOA3_0 / ADTG_7
58
28
18
27
P17 / AN07 / SIN2_2 / INT04_1 / SEG21
P39 / DTTI0X_0 / ADTG_2 / COM3
26
AVCC
59
VCC
60
17
P41 / TIOA1_0 / INT13_1
16
P40 / TIOA0_0 / INT12_1
P37 / SOT5_2 / INT10_1 / IC01_0
P38 / SCK5_2 / INT11_1 / IC00_0
Note:
−
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these
pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register
(EPFR) to select the pin.
Document Number: 002-05673 Rev.*C
Page 10 of 108
MB9AAA0N Series
PQH100
P50 / SIN3_1 / INT00_0 / VV4
VCC
VSS
P82 / SCK7_2
P81 / SOT7_2
P80 / SIN7_2
P60 / SIN5_0 / TIOA2_2 / INT15_1 / WKUP3 / CEC1
P61 / SOT5_0 / TIOB2_2 / DTTI0X_2 / SEG00
P62 / SCK5_0 / ADTG_3 / SEG01
P63 / INT03_0 / SEG02
P0F / NMIX / CROUT_1 / RTCCO_0 / SUBOUT_0 / WKUP0
P0E / CTS4_0 / TIOB3_2 / SEG03
P0D / RTS4_0 / TIOA3_2 / SEG04
P0C / SCK4_0 / TIOA6_1
P0B / SOT4_0 / TIOB6_1
P0A / SIN4_0 / INT00_2
P09 / RTS4_2 / TIOB0_2 / SEG05
P08 / CTS4_2 / TIOA0_2 / SEG06
P07 / SCK4_2 / ADTG_0 / SEG07
P06 / SOT4_2 / TIOB5_2 / INT01_1 / SEG08
P05 / SIN4_2 / TIOA5_2 / INT00_1 / SEG09
P04 / TDO / SWO
P03 / TMS / SWDIO
P02 / TDI
P01 / TCK / SWCLK
P00 / TRSTX
VCC
VSS
P20 / INT05_0 / CROUT_0 / SEG10
P21 / SIN0_0 / INT06_1 / WKUP2 / SEG11
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
(TOP VIEW)
P51 / SOT3_1 / INT01_0 / VV3
81
50
P22 / SOT0_0 / TIOB7_1 / SEG12
P52 / SCK3_1 / INT02_0 / VV2
82
49
P23 / SCK0_0 / TIOA7_1 / RTO00_1 / SEG13
P53 / SIN6_0 / TIOA1_2 / INT07_2 / VV1
83
48
P1F / AN15 / FRCK0_1 / ADTG_5
P54 / SOT6_0 / TIOB1_2 / VV0
84
47
P1E / AN14 / RTS4_1 / DTTI0X_1 / SEG14
P55 / SCK6_0 / ADTG_1 / SEG39
85
46
P1D / AN13 / CTS4_1 / IC03_1 / SEG15
P56 / INT08_2 / SEG38
86
45
P1C / AN12 / SCK4_1 / IC02_1 / SEG16
P30 / TIOB0_1 / INT03_2 / COM7 / SEG43
87
44
P1B / AN11 / SOT4_1 / IC01_1 / SEG17
P31 / SCK6_1 / TIOB1_1 / INT04_2 / COM6 / SEG42
88
43
P1A / AN10 / SIN4_1 / INT05_1 / IC00_1 / SEG18
P32 / SOT6_1 / TIOB2_1 / INT05_2 / COM5 / SEG41
89
42
P19 / AN09 / SCK2_2 / SEG19
P33 / SIN6_1 / TIOB3_1 / INT04_0 / ADTG_6 / COM4 / SEG40
90
41
P18 / AN08 / SOT2_2 / SEG20
P34 / TIOB4_1 / FRCK0_0
91
40
AVSS
P35 / TIOB5_1 / INT08_1 / IC03_0
92
39
AVRH
P36 / SIN5_2 / INT09_1 / IC02_0
93
38
AVCC
P37 / SOT5_2 / INT10_1 / IC01_0
94
37
P17 / AN07 / SIN2_2 / INT04_1 / SEG21
P38 / SCK5_2 / INT11_1 / IC00_0
95
36
P16 / AN06 / SCK0_1 / SEG22
P39 / DTTI0X_0 / ADTG_2 / COM3
96
35
P15 / AN05 / SOT0_1 / IC03_2 / SEG23
P3A / TIOA0_1 / RTO00_0 / RTCCO_2 / SUBOUT_2 / COM2
97
34
P14 / AN04 / SIN0_1 / INT03_1 / IC02_2 / SEG24
P3B / TIOA1_1 / RTO01_0 / COM1
98
33
P13 / AN03 / SCK1_1 / IC01_2 / RTCCO_1 / SUBOUT_1 / SEG25
P3C / TIOA2_1 / RTO02_0 / COM0
99
32
P12 / AN02 / SOT1_1 / IC00_2 / SEG26
P3D / TIOA3_1 / RTO03_0 / SEG37 100
31
P11 / AN01 / SIN1_1 / INT02_1 / FRCK0_2 / WKUP1 / SEG27
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
P3E / TIOA4_1 / RTO04_0 / SEG36
P3F / TIOA5_1 / RTO05_0 / SEG35
VSS
VCC
P40 / TIOA0_0 / INT12_1
P41 / TIOA1_0 / INT13_1
P42 / TIOA2_0
P43 / TIOA3_0 / ADTG_7
P44 / TIOA4_0 / SEG34
P45 / TIOA5_0 / SEG33
C
VSS
VCC
P46 / X0A
P47 / X1A
INITX
P48 / SIN3_2 / INT14_1 / SEG32
P49 / SOT3_2 / TIOB0_0 / SEG31
P4A / SCK3_2 / TIOB1_0 / SEG30
P4B / TIOB2_0 / IGTRG / SEG29
P4C / SCK7_1 / TIOB3_0 / CEC0
P4D / SOT7_1 / TIOB4_0 / DA0
P4E / SIN7_1 / TIOB5_0 / INT06_2 / DA1
PE0 / MD1
MD0
PE2 / X0
PE3 / X1
VSS
VCC
P10 / AN00 / SEG28
QFP - 100
Note:
−
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these
pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register
(EPFR) to select the pin.
Document Number: 002-05673 Rev.*C
Page 11 of 108
MB9AAA0N Series
4. List of Pin Functions
List of pin numbers
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins,
there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to
select the pin.
LQFP-64
1
Pin No
LQFP-80
LQFP-100
1
1
QFP-100
79
2
2
80
2
I/O circuit
type
Pin name
VCC
P50
INT00_0
SIN3_1
Pin state
type
-
R
W
R
W
E
F
R
W
E
F
R
W
R
V
J
U
J
S
VV4
P51
INT01_0
-
3
3
81
3
-
-
-
-
4
4
82
4
-
-
-
-
5
5
83
-
6
6
84
-
7
7
85
-
8
8
86
Document Number: 002-05673 Rev.*C
SOT3_1
(SDA3_1)
VV3
P51
INT01_0
SOT3_1
(SDA3_1)
P52
INT02_0
SCK3_1
(SCL3_1)
VV2
P52
INT02_0
SCK3_1
(SCL3_1)
P53
SIN6_0
TIOA1_2
INT07_2
VV1
P54
SOT6_0
(SDA6_0)
TIOB1_2
VV0
P55
SCK6_0
(SCL6_0)
ADTG_1
SEG39
P56
INT08_2
SEG38
Page 12 of 108
MB9AAA0N Series
Pin No
LQFP-80
LQFP-100
LQFP-64
I/O circuit
type
Pin name
QFP-100
Pin state
type
P30
TIOB0_1
5
9
9
87
INT03_2
K
S
K
S
K
S
K
S
E
H
E
F
E
F
E
F
COM7
SEG43
P31
TIOB1_1
6
10
10
88
SCK6_1
(SCL6_1)
INT04_2
COM6
SEG42
P32
TIOB2_1
7
11
11
89
SOT6_1
(SDA6_1)
INT05_2
COM5
SEG41
P33
INT04_0
TIOB3_1
8
12
12
90
SIN6_1
ADTG_6
COM4
SEG40
P34
-
-
13
91
FRCK0_0
TIOB4_1
P35
-
-
14
92
IC03_0
TIOB5_1
INT08_1
P36
-
-
15
93
IC02_0
SIN5_2
INT09_1
P37
IC01_0
-
-
16
94
SOT5_2
(SDA5_2)
INT10_1
Document Number: 002-05673 Rev.*C
Page 13 of 108
MB9AAA0N Series
Pin No
LQFP-80
LQFP-100
LQFP-64
I/O circuit
type
Pin name
QFP-100
Pin state
type
P38
IC00_0
-
-
17
95
SCK5_2
(SCL5_2)
E
F
L
U
L
U
L
U
L
U
J
U
J
U
J
U
INT11_1
P39
9
13
18
96
DTTI0X_0
ADTG_2
COM3
P3A
RTO00_0
(PPG00_0)
10
14
19
97
TIOA0_1
RTCCO_2
SUBOUT_2
COM2
P3B
11
15
20
98
RTO01_0
(PPG00_0)
TIOA1_1
COM1
P3C
12
16
21
99
RTO02_0
(PPG02_0)
TIOA2_1
COM0
P3D
13
17
22
100
RTO03_0
(PPG02_0)
TIOA3_1
SEG37
P3E
14
18
23
1
RTO04_0
(PPG04_0)
TIOA4_1
SEG36
P3F
15
19
24
2
RTO05_0
(PPG04_0)
TIOA5_1
SEG35
16
20
25
3
VSS
-
-
-
26
4
VCC
-
Document Number: 002-05673 Rev.*C
Page 14 of 108
MB9AAA0N Series
Pin No
LQFP-80
LQFP-100
LQFP-64
I/O circuit
type
Pin name
QFP-100
Pin state
type
P40
-
-
27
5
TIOA0_0
E
F
E
F
E
H
E
H
J
U
J
U
INT12_1
P41
-
-
28
6
TIOA1_0
INT13_1
-
-
29
7
-
-
30
8
P42
TIOA2_0
P43
TIOA3_0
ADTG_7
P44
-
21
31
9
TIOA4_0
SEG34
P45
-
22
32
10
TIOA5_0
17
23
33
11
C
-
-
24
34
12
VSS
-
18
25
35
13
VCC
-
SEG33
19
26
36
14
20
27
37
15
21
28
38
16
P46
X0A
P47
X1A
INITX
D
M
D
N
B
C
J
S
J
U
J
U
P48
-
29
39
17
INT14_1
SIN3_2
SEG32
P49
22
TIOB0_0
30
40
18
SEG31
SOT3_2
(SDA3_2)
-
P4A
23
TIOB1_0
31
41
-
Document Number: 002-05673 Rev.*C
19
SEG30
SCK3_2
(SCL3_2)
Page 15 of 108
MB9AAA0N Series
LQFP-64
Pin No
LQFP-80
LQFP-100
24
32
42
20
25
33
43
21
26
34
44
22
27
35
45
23
28
36
46
24
29
37
47
25
30
38
48
26
31
39
49
27
32
33
40
41
50
51
28
29
34
42
52
30
35
43
53
31
36
44
54
32
I/O circuit
type
Pin name
QFP-100
P4B
TIOB2_0
SEG29
IGTRG
P4C
TIOB3_0
SCK7_1
(SCL7_1)
CEC0
P4D
TIOB4_0
SOT7_1
(SDA7_1)
DA0
P4E
TIOB5_0
INT06_2
SIN7_1
DA1
PE0
MD1
MD0
PE2
X0
PE3
X1
VSS
VCC
P10
AN00
SEG28
P11
AN01
SIN1_1
INT02_1
FRCK0_2
WKUP1
SEG27
P12
AN02
SOT1_1
(SDA1_1)
Pin state
type
J
U
G
Q
O
Z
O
Y
C
P
H
D
A
A
A
B
Q
J
Q
L
Q
J
IC00_2
SEG26
Document Number: 002-05673 Rev.*C
Page 16 of 108
MB9AAA0N Series
LQFP-64
Pin No
LQFP-80
LQFP-100
I/O circuit
type
Pin name
QFP-100
Pin state
type
P13
AN03
37
45
55
33
SCK1_1
(SCL1_1)
IC01_2
Q
J
Q
K
Q
J
Q
J
Q
K
RTCCO_1
SUBOUT_1
SEG25
P14
AN04
38
46
56
34
-
INT03_1
IC02_2
SEG24
SIN0_1
P15
AN05
39
47
57
35
IC03_2
SEG23
SOT0_1
(SDA0_1)
-
P16
AN06
-
48
58
36
SCK0_1
(SCL0_1)
SEG22
P17
AN07
40
49
59
37
SIN2_2
INT04_1
SEG21
41
50
60
38
AVCC
-
42
51
61
39
AVRH
-
43
52
62
40
AVSS
-
P18
AN08
44
53
63
41
SOT2_2
(SDA2_2)
Q
J
Q
J
SEG20
P19
45
54
64
42
AN09
SCK2_2
(SCL2_2)
SEG19
Document Number: 002-05673 Rev.*C
Page 17 of 108
MB9AAA0N Series
Pin No
LQFP-80
LQFP-100
LQFP-64
I/O circuit
type
Pin name
QFP-100
Pin state
type
P1A
AN10
-
55
65
43
SIN4_1
INT05_1
Q
K
Q
J
Q
J
Q
J
Q
J
F
X
J
U
J
U
IC00_1
SEG18
P1B
AN11
-
56
66
44
SOT4_1
(SDA4_1)
IC01_1
SEG17
P1C
AN12
-
-
67
45
SCK4_1
(SCL4_1)
IC02_1
SEG16
P1D
AN13
-
-
68
46
CTS4_1
IC03_1
SEG15
P1E
AN14
-
-
69
47
RTS4_1
DTTI0X_1
SEG14
P1F
-
-
70
48
AN15
ADTG_5
FRCK0_1
P23
46
57
SCK0_0
(SCL0_0)
71
49
TIOA7_1
SEG13
-
-
RTO00_1
P22
47
58
72
50
SOT0_0
(SDA0_0)
TIOB7_1
SEG12
Document Number: 002-05673 Rev.*C
Page 18 of 108
MB9AAA0N Series
Pin No
LQFP-80
LQFP-100
LQFP-64
I/O circuit
type
Pin name
QFP-100
Pin state
type
P21
48
59
73
51
SIN0_0
INT06_1
J
T
J
S
WKUP2
SEG11
P20
INT05_0
-
60
74
52
-
-
75
53
VSS
-
-
-
76
54
VCC
-
CROUT_0
SEG10
49
61
77
55
50
62
78
56
P00
TRSTX
P01
TCK
E
E
E
E
E
E
E
E
E
E
J
S
J
S
J
U
J
U
SWCLK
51
63
79
57
52
64
80
58
P02
TDI
P03
TMS
SWDIO
P04
53
65
81
59
TDO
SWO
P05
TIOA5_2
-
-
82
60
SIN4_2
INT00_1
SEG09
P06
TIOB5_2
-
-
83
61
SOT4_2
(SDA4_2)
INT01_1
SEG08
P07
66
-
ADTG_0
84
62
SEG07
SCK4_2
(SCL4_2)
-
P08
-
-
85
63
TIOA0_2
CTS4_2
SEG06
Document Number: 002-05673 Rev.*C
Page 19 of 108
MB9AAA0N Series
Pin No
LQFP-80
LQFP-100
LQFP-64
I/O circuit
type
Pin name
QFP-100
Pin state
type
P09
-
-
86
64
TIOB0_2
RTS4_2
J
U
G
F
G
H
G
H
J
U
J
U
E
I
J
S
J
U
J
U
SEG05
P0A
54
67
87
65
SIN4_0
INT00_2
P0B
55
68
88
66
SOT4_0
(SDA4_0)
TIOB6_1
P0C
56
69
89
67
SCK4_0
(SCL4_0)
TIOA6_1
P0D
-
70
90
68
RTS4_0
TIOA3_2
SEG04
P0E
-
71
91
69
CTS4_0
TIOB3_2
SEG03
P0F
NMIX
57
72
92
70
CROUT_1
RTCCO_0
SUBOUT_0
WKUP0
P63
-
73
93
71
INT03_0
SEG02
P62
58
74
94
72
SCK5_0
(SCL5_0)
ADTG_3
SEG01
P61
SOT5_0
(SDA5_0)
59
75
95
73
TIOB2_2
DTTI0X_2
SEG00
Document Number: 002-05673 Rev.*C
Page 20 of 108
MB9AAA0N Series
LQFP-64
Pin No
LQFP-80
LQFP-100
I/O circuit
type
Pin name
QFP-100
Pin state
type
P60
SIN5_0
60
76
96
74
TIOA2_2
INT15_1
G
R
G
H
G
H
H
WKUP3
CEC1
P80
61
77
97
75
62
78
98
76
63
79
99
77
SCK7_2
(SCL7_2)
G
64
80
100
78
VSS
-
SIN7_2
P81
SOT7_2
(SDA7_2)
P82
Document Number: 002-05673 Rev.*C
Page 21 of 108
MB9AAA0N Series
List of pin functions
The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins,
there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to
select the pin.
Pin
function
ADC
Pin name
ADTG_0
ADTG_1
ADTG_2
ADTG_3
ADTG_4
ADTG_5
ADTG_6
ADTG_7
ADTG_8
AN00
AN01
AN02
AN03
AN04
AN05
AN06
AN07
AN08
AN09
AN10
AN11
AN12
AN13
AN14
AN15
Function description
A/D converter external trigger input pin
A/D converter analog input pin.
ANxx describes ADC ch.xx.
Document Number: 002-05673 Rev.*C
LQFP-64
9
58
8
34
35
36
37
38
39
40
44
45
-
Pin No
LQFP-80
LQFP-100
66
84
7
7
13
18
74
94
70
12
12
30
42
52
43
53
44
54
45
55
46
56
47
57
48
58
49
59
53
63
54
64
55
65
56
66
67
68
69
70
QFP-100
62
85
96
72
48
90
8
30
31
32
33
34
35
36
37
41
42
43
44
45
46
47
48
Page 22 of 108
MB9AAA0N Series
Pin
function
Base Timer
0
Base Timer
1
Base Timer
2
Base Timer
3
Base Timer
4
Base Timer
5
Base Timer
6
Base Timer
7
Pin name
TIOA0_0
TIOA0_1
TIOA0_2
TIOB0_0
TIOB0_1
TIOB0_2
TIOA1_0
TIOA1_1
TIOA1_2
TIOB1_0
TIOB1_1
TIOB1_2
TIOA2_0
TIOA2_1
TIOA2_2
TIOB2_0
TIOB2_1
TIOB2_2
TIOA3_0
TIOA3_1
TIOA3_2
TIOB3_0
TIOB3_1
TIOB3_2
TIOA4_0
TIOA4_1
TIOA4_2
TIOB4_0
TIOB4_1
TIOB4_2
TIOA5_0
TIOA5_1
TIOA5_2
TIOB5_0
TIOB5_1
TIOB5_2
Function description
Base timer ch.0 TIOA pin
Base timer ch.0 TIOB pin
Base timer ch.1 TIOA pin
Base timer ch.1 TIOB pin
Base timer ch.2 TIOA pin
Base timer ch.2 TIOB pin
Base timer ch.3 TIOA pin
Base timer ch.3 TIOB pin
Base timer ch.4 TIOA pin
Base timer ch.4 TIOB pin
Base timer ch.5 TIOA pin
Base timer ch.5 TIOB pin
LQFP-64
10
22
5
11
23
6
12
60
24
7
59
13
25
8
14
26
15
27
-
Pin No
LQFP-80 LQFP-100
27
14
19
85
30
40
9
9
86
28
15
20
5
5
31
41
10
10
6
6
29
16
21
76
96
32
42
11
11
75
95
30
17
22
70
90
33
43
12
12
71
91
21
31
18
23
34
44
13
22
32
19
24
82
35
45
14
83
QFP-100
5
97
63
18
87
64
6
98
83
19
88
84
7
99
74
20
89
73
8
100
68
21
90
69
9
1
22
91
10
2
60
23
92
61
TIOA6_1
Base timer ch.6 TIOA pin
56
69
89
67
TIOB6_1
Base timer ch.6 TIOB pin
55
68
88
66
46
47
-
57
58
-
71
72
-
49
50
-
TIOA7_0
TIOA7_1
TIOA7_2
TIOB7_0
TIOB7_1
TIOB7_2
Base timer ch.7 TIOA pin
Base timer ch.7 TIOB pin
Document Number: 002-05673 Rev.*C
Page 23 of 108
MB9AAA0N Series
Pin
function
Debugger
Pin name
SWCLK
SWDIO
External
Interrupt
SWO
TRSTX
TCK
TDI
TMS
TDO
INT00_0
INT00_1
INT00_2
INT01_0
INT01_1
INT02_0
INT02_1
INT03_0
INT03_1
INT03_2
INT04_0
INT04_1
INT04_2
INT05_0
INT05_1
INT05_2
INT06_1
INT06_2
INT07_2
INT08_1
INT08_2
INT09_1
INT10_1
INT11_1
INT12_1
INT13_1
INT14_1
INT15_1
NMIX
Function description
Serial wire debug interface clock input pin
Serial wire debug interface data input /
output pin
Serial wire viewer output pin
JTAG reset input pin
JTAG test clock input pin
JTAG test data input pin
JTAG test mode state input/output pin
JTAG debug data output pin
External interrupt request 00 input pin
External interrupt request 01 input pin
External interrupt request 02 input pin
External interrupt request 03 input pin
External interrupt request 04 input pin
External interrupt request 05 input pin
External interrupt request 06 input pin
External interrupt request 07 input pin
External interrupt request 08 input pin
External interrupt request 09 input pin
External interrupt request 10 input pin
External interrupt request 11 input pin
External interrupt request 12 input pin
External interrupt request 13 input pin
External interrupt request 14 input pin
External interrupt request 15 input pin
Non-Maskable Interrupt input pin
Document Number: 002-05673 Rev.*C
LQFP-64
50
Pin No
LQFP-80 LQFP-100
62
78
QFP-100
56
52
64
80
58
53
49
50
51
52
53
2
54
3
4
35
38
5
8
40
6
7
48
27
60
57
65
61
62
63
64
65
2
67
3
4
43
73
46
9
12
49
10
60
55
11
59
35
5
8
29
76
72
81
77
78
79
80
81
2
82
87
3
83
4
53
93
56
9
12
59
10
74
65
11
73
45
5
14
8
15
16
17
27
28
39
96
92
59
55
56
57
58
59
80
60
65
81
61
82
31
71
34
87
90
37
88
52
43
89
51
23
83
92
86
93
94
95
5
6
17
74
70
Page 24 of 108
MB9AAA0N Series
Pin
function
GPIO
Pin name
P00
P01
P02
P03
P04
P05
P06
P07
P08
P09
P0A
P0B
P0C
P0D
P0E
P0F
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P1A
P1B
P1C
P1D
P1E
P1F
P20
P21
P22
P23
Function description
General-purpose I/O port 0
General-purpose I/O port 1
General-purpose I/O port 2
Document Number: 002-05673 Rev.*C
LQFP-64
49
50
51
52
53
54
55
56
57
34
35
36
37
38
39
40
44
45
48
47
46
Pin No
LQFP-80 LQFP-100
61
77
62
78
63
79
64
80
65
81
82
83
66
84
85
86
67
87
68
88
69
89
70
90
71
91
72
92
42
52
43
53
44
54
45
55
46
56
47
57
48
58
49
59
53
63
54
64
55
65
56
66
67
68
69
70
60
74
59
73
58
72
57
71
QFP-100
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
30
31
32
33
34
35
36
37
41
42
43
44
45
46
47
48
52
51
50
49
Page 25 of 108
MB9AAA0N Series
Pin
function
GPIO
Pin name
P30
P31
P32
P33
P34
P35
P36
P37
P38
P39
P3A
P3B
P3C
P3D
P3E
P3F
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P4A
P4B
P4C
P4D
P4E
P50
P51
P52
P53
P54
P55
P56
P60
P61
P62
P63
P80
P81
P82
PE0
PE2
PE3
Function description
General-purpose I/O port 3
General-purpose I/O port 4
General-purpose I/O port 5
General-purpose I/O port 6
General-purpose I/O port 8
General-purpose I/O port E
Document Number: 002-05673 Rev.*C
LQFP-64
5
6
7
8
9
10
11
12
13
14
15
19
20
22
23
24
25
26
27
2
3
4
60
59
58
61
62
63
28
30
31
Pin No
LQFP-80 LQFP-100
9
9
10
10
11
11
12
12
13
14
15
16
17
13
18
14
19
15
20
16
21
17
22
18
23
19
24
27
28
29
30
21
31
22
32
26
36
27
37
29
39
30
40
31
41
32
42
33
43
34
44
35
45
2
2
3
3
4
4
5
5
6
6
7
7
8
8
76
96
75
95
74
94
73
93
77
97
78
98
79
99
36
46
38
48
39
49
QFP-100
87
88
89
90
91
92
93
94
95
96
97
98
99
100
1
2
5
6
7
8
9
10
14
15
17
18
19
20
21
22
23
80
81
82
83
84
85
86
74
73
72
71
75
76
77
24
26
27
Page 26 of 108
MB9AAA0N Series
Pin
function
Multifunction
Serial
0
Pin name
SIN0_0
SIN0_1
Multi-function serial interface ch.0 input
pin
SOT0_0
(SDA0_0)
Multi-function serial interface ch.0 output
pin.
This pin operates as SOT0 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA0 when it is used in
an I2C (operation mode 4).
SOT0_1
(SDA0_1)
SCK0_0
(SCL0_0)
SCK0_1
(SCL0_1)
Multifunction
Serial
1
SIN1_1
SOT1_1
(SDA1_1)
SCK1_1
(SCL1_1)
Multifunction
Serial
2
Function description
SIN2_2
SOT2_2
(SDA2_2)
SCK2_2
(SCL2_2)
Multi-function serial interface ch.0 clock
I/O pin.
This pin operates as SCK0 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL0 when it is used in an
I2C (operation mode 4).
Multi-function serial interface ch.1 input
pin
Multi-function serial interface ch.1 output
pin.
This pin operates as SOT1 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA1 when it is used in
an I2C (operation mode 4).
Multi-function serial interface ch.1 clock
I/O pin.
This pin operates as SCK1 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL1 when it is used in an
I2C (operation mode 4).
Multi-function serial interface ch.2 input
pin
Multi-function serial interface ch.2 output
pin.
This pin operates as SOT2 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA2 when it is used in
an I2C (operation mode 4).
Multi-function serial interface ch.2 clock
I/O pin.
This pin operates as SCK2 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL2 when it is used in an
I2C (operation mode 4).
Document Number: 002-05673 Rev.*C
LQFP-64
48
-
Pin No
LQFP-80
LQFP-100
59
73
46
56
QFP-100
51
34
47
58
72
50
-
47
57
35
46
57
71
49
-
48
58
36
35
43
53
31
36
44
54
32
37
45
55
33
40
49
59
37
44
53
63
41
45
54
64
42
Page 27 of 108
MB9AAA0N Series
Pin
function
Multifunction
Serial
3
Pin No
LQFP-80 LQFP-100
2
2
29
39
QFP-100
80
17
3
3
3
81
-
30
40
18
4
4
4
82
-
31
41
19
54
-
67
55
-
87
65
82
65
43
60
Multi-function serial interface ch.4 output
pin.
This pin operates as SOT4 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA4 when it is used in
an I2C (operation mode 4).
55
68
88
66
-
56
66
44
-
-
83
61
Multi-function serial interface ch.4 clock
I/O pin.
This pin operates as SCK4 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL4 when it is used in an
I2C (operation mode 4).
56
69
89
67
-
-
67
45
-
-
84
62
-
70
71
-
90
69
86
91
68
85
68
47
64
69
46
63
Function description
SIN3_1
SIN3_2
Multi-function serial interface ch.3 input
pin
SOT3_1
(SDA3_1)
Multi-function serial interface ch.3 output
pin.
This pin operates as SOT3 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA3 when it is used in
an I2C (operation mode 4).
SOT3_2
(SDA3_2)
SCK3_1
(SCL3_1)
SCK3_2
(SCL3_2)
Multifunction
Serial
4
LQFP-64
2
-
Pin name
SIN4_0
SIN4_1
SIN4_2
SOT4_0
(SDA4_0)
SOT4_1
(SDA4_1)
SOT4_2
(SDA4_2)
SCK4_0
(SCL4_0)
SCK4_1
(SCL4_1)
SCK4_2
(SCL4_2)
RTS4_0
RTS4_1
RTS4_2
CTS4_0
CTS4_1
CTS4_2
Multi-function serial interface ch.3 clock
I/O pin.
This pin operates as SCK3 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL3 when it is used in an
I2C (operation mode 4).
Multi-function serial interface ch.4 input
pin
Multi-function serial interface ch.4 RTS
output pin
Multi-function serial interface ch.4 CTS
input pin
Document Number: 002-05673 Rev.*C
Page 28 of 108
MB9AAA0N Series
Pin
function
Multifunction
Serial
5
Pin name
SIN5_0
SIN5_2
Multi-function serial interface ch.5 input
pin
SOT5_0
(SDA5_0)
Multi-function serial interface ch.5 output
pin.
This pin operates as SOT5 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA5 when it is used in
an I2C (operation mode 4).
SOT5_2
(SDA5_2)
SCK5_0
(SCL5_0)
SCK5_2
(SCL5_2)
Multifunction
Serial
6
SIN6_0
SIN6_1
SOT6_0
(SDA6_0)
SOT6_1
(SDA6_1)
SCK6_0
(SCL6_0)
SCK6_1
(SCL6_1)
Multifunction
Serial
7
Function description
SIN7_1
SIN7_2
SOT7_1
(SDA7_1)
SOT7_2
(SDA7_2)
SCK7_1
(SCL7_1)
SCK7_2
(SCL7_2)
Multi-function serial interface ch.5 clock
I/O pin.
This pin operates as SCK5 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL5 when it is used in
an I2C (operation mode 4).
Multi-function serial interface ch.6 input
pin
Multi-function serial interface ch.6 output
pin.
This pin operates as SOT6 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA6 when it is used in
an I2C (operation mode 4).
Multi-function serial interface ch.6 clock
I/O pin.
This pin operates as SCK6 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL6 when it is used in
an I2C (operation mode 4).
Multi-function serial interface ch.7 input
pin
Multi-function serial interface ch.7 output
pin.
This pin operates as SOT7 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SDA7 when it is used in
an I2C (operation mode 4).
Multi-function serial interface ch.7 clock
I/O pin.
This pin operates as SCK7 when it is
used in a UART/CSIO (operation modes
0 to 2) and as SCL7 when it is used in
an I2C (operation mode 4).
Document Number: 002-05673 Rev.*C
LQFP-64
60
-
Pin No
LQFP-80
LQFP-100
76
96
15
QFP-100
74
93
59
75
95
73
-
-
16
94
58
74
94
72
-
-
17
95
-
5
5
83
8
12
12
90
-
6
6
84
7
11
11
89
-
7
7
85
6
10
10
88
27
35
45
23
61
77
97
75
26
34
44
22
62
78
98
76
25
33
43
21
63
79
99
77
Page 29 of 108
MB9AAA0N Series
Pin
function
Multifunction
Timer
0
Pin name
DTTI0X_0
DTTI0X_1
DTTI0X_2
FRCK0_0
FRCK0_1
FRCK0_2
IC00_0
IC00_1
IC00_2
IC01_0
IC01_1
IC01_2
IC02_0
IC02_1
IC02_2
IC03_0
IC03_1
IC03_2
RTO00_0
(PPG00_0)
RTO00_1
(PPG00_1)
RTO01_0
(PPG00_0)
RTO02_0
(PPG02_0)
RTO03_0
(PPG02_0)
RTO04_0
(PPG04_0)
9
59
35
36
37
38
39
Pin No
LQFP-80 LQFP-100
13
18
69
75
95
13
70
43
53
17
55
65
44
54
16
56
66
45
55
15
67
46
56
14
68
47
57
QFP-100
96
47
73
91
48
31
95
43
32
94
44
33
93
45
34
92
46
35
10
14
19
97
-
-
71
49
11
15
20
98
12
16
21
99
13
17
22
100
14
18
23
1
Function description
Input signal of waveform generator to
control outputs RTO00 to RTO05 of
Multi-function timer 0
16-bit free-run timer ch.0 external clock
input pin
16-bit input capture input pin of
Multi-function timer 0.
ICxx describes a channel number.
Waveform generator output pin of
Multi-function timer 0.
This pin operates as PPG00 when it is
used in PPG0 output mode.
Waveform generator output pin of
Multi-function timer 0.
This pin operates as PPG00 when it is
used in PPG0 output mode.
Waveform generator output pin of
Multi-function timer 0.
This pin operates as PPG02 when it is
used in PPG0 output mode.
Waveform generator output pin of
Multi-function timer 0.
This pin operates as PPG02 when it is
used in PPG0 output mode.
Waveform generator output pin of
Multi-function timer 0.
This pin operates as PPG04 when it is
used in PPG0 output mode.
LQFP-64
RTO05_0
(PPG04_0)
Waveform generator output pin of
Multi-function timer 0.
This pin operates as PPG04 when it is
used in PPG0 output mode.
15
19
24
2
IGTRG
PPG IGBT mode external trigger input
pin
24
32
42
20
Document Number: 002-05673 Rev.*C
Page 30 of 108
MB9AAA0N Series
Pin
function
LCD
Controller
Pin name
VV0
VV1
VV2
VV3
VV4
COM0
COM1
COM2
COM3
COM4
COM5
COM6
COM7
SEG00
SEG01
SEG02
SEG03
SEG04
SEG05
SEG06
SEG07
SEG08
SEG09
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
-
Pin No
LQFP-80 LQFP-100
6
6
QFP-100
84
-
5
5
83
2
12
11
10
9
8
7
6
5
59
58
48
47
46
45
44
40
39
38
37
36
35
34
24
23
22
15
4
3
2
16
15
14
13
12
11
10
9
75
74
73
71
70
66
60
59
58
57
56
55
54
53
49
48
47
46
45
44
43
42
32
31
30
29
22
21
19
4
3
2
21
20
19
18
12
11
10
9
95
94
93
91
90
86
85
84
83
82
74
73
72
71
69
68
67
66
65
64
63
59
58
57
56
55
54
53
52
42
41
40
39
32
31
24
82
81
80
99
98
97
96
90
89
88
87
73
72
71
69
68
64
63
62
61
60
52
51
50
49
47
46
45
44
43
42
41
37
36
35
34
33
32
31
30
20
19
18
17
10
9
2
Function description
LCD controller power supply I/O pin
LCD controller common output pin
LCD controller segment output pin
Document Number: 002-05673 Rev.*C
LQFP-64
Page 31 of 108
MB9AAA0N Series
Pin
function
LCD
Controller
Real-time
clock
Pin name
SEG36
SEG37
SEG38
SEG39
SEG40
SEG41
SEG42
SEG43
RTCCO_0
RTCCO_1
RTCCO_2
SUBOUT_0
SUBOUT_1
SUBOUT_2
LowWKUP0
Power
Consumption
WKUP1
Mode
WKUP2
WKUP3
DAC
HDMICEC/
Remote
Control
Reception
DA0
DA1
CEC0
CEC1
Function description
LCD controller segment output pin
Pulse output pin of Real-time clock
Sub clock output pin
Deep standby mode return signal input
pin 0
Deep standby mode return signal input
pin 1
Deep standby mode return signal input
pin 2
Deep standby mode return signal input
pin 3
D/A converter ch.0 analog output pin
D/A converter ch.1 analog output pin
HDMI-CEC/Remote Control Reception
ch.0 input/output pin
HDMI-CEC/Remote Control Reception
ch.1 input/output pin
Document Number: 002-05673 Rev.*C
LQFP-64
14
13
8
7
6
5
57
37
10
57
37
10
Pin No
LQFP-80
LQFP-100
18
23
17
22
8
8
7
7
12
12
11
11
10
10
9
9
72
92
45
55
14
19
72
92
45
55
14
19
QFP-100
1
100
86
85
90
89
88
87
70
33
97
70
33
97
57
72
92
70
35
43
53
31
48
59
73
51
60
76
96
74
26
27
34
35
44
45
22
23
25
33
43
21
60
76
96
74
Page 32 of 108
MB9AAA0N Series
Pin
function
Reset
Pin name
INITX
Mode
MD0
MD1
Power
GND
Clock
Analog
Power
VCC
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
X0
X0A
X1
X1A
CROUT_0
CROUT_1
AVCC
AVRH
Analog
GND
C pin
AVSS
C
Function description
External Reset Input Pin.
A reset is valid when INITX = L.
Mode 0 pin.
During normal operation, MD0 = L must
be input.
During serial programming to Flash
memory, MD0 = H must be input.
Mode 1 pin.
During normal operation, input is not
needed.
During serial programming to Flash
memory, MD1 = L must be input.
Power supply pin
GND pin
Main clock (oscillation) input pin
Sub clock (oscillation) input pin
Main clock (oscillation) I/O pin
Sub clock (oscillation) I/O pin
Built-in High-speed CR-osc clock output
port
A/D converter and D/A converter
analog power supply pin
A/D converter analog reference voltage
input pin
A/D converter and D/A converter
GND pin
Power supply stabilization capacity pin
LQFP-64
Pin No
LQFP-80
LQFP-100
QFP-100
21
28
38
16
29
37
47
25
28
36
46
24
1
18
33
16
32
64
30
19
31
20
57
1
25
41
20
24
40
80
38
26
39
27
60
72
1
26
35
51
76
25
34
50
75
100
48
36
49
37
74
92
79
4
13
29
54
3
12
28
53
78
26
14
27
15
52
70
41
50
60
38
42
51
61
39
43
52
62
40
17
23
33
11
Note:
−
While this device contains a Test Access Port (TAP) based on the IEEE 1149.1-2001 JTAG standard, it is not fully compliant to
all requirements of that standard. This device may contain a 32-bit device ID that is the same as the 32-bit device ID in other
devices with different functionality. The TAP pins may also be configurable for purposes other than access to the TAP
controller.
Document Number: 002-05673 Rev.*C
Page 33 of 108
MB9AAA0N Series
5. I/O Circuit Type
Type
Circuit
Remarks
A
It is possible to select the main oscillation /
GPIO function.
Pull-up
resistor
When the main oscillation is selected.
P-ch
P-ch
Digital output
X1
• Oscillation feedback resistor
: Approximately 1 MΩ
• With standby mode control
When the GPIO is selected.
N-ch
Digital output
R
Pull-up resistor control
Digital input
•
•
•
•
•
CMOS level output.
CMOS level hysteresis input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
Standby mode control
Clock input
Feedback
resistor
Standby mode control
Digital input
Standby mode control
Pull-up
resistor
R
P-ch
P-ch
Digital output
N-ch
Digital output
X0
Pull-up resistor control
• CMOS level hysteresis input
• Pull-up resistor
: Approximately 50 kΩ
B
Pull-up resistor
Digital input
Document Number: 002-05673 Rev.*C
Page 34 of 108
MB9AAA0N Series
Type
Circuit
Remarks
C
Digital input
• Open drain output
• CMOS level hysteresis input
Digital output
N-ch
D
It is possible to select the sub oscillation /
GPIO function
Pull-up
resistor
When the sub oscillation is selected.
P-ch
P-ch
Digital output
X1A
• Oscillation feedback resistor
: Approximately 5 MΩ
• With standby mode control
When the GPIO is selected.
N-ch
Digital output
R
Pull-up resistor control
Digital input
•
•
•
•
•
CMOS level output.
CMOS level hysteresis input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
Standby mode control
Clock input
Feedback
resistor
Standby mode control
Digital input
Standby mode control
Pull-up
resistor
R
P-ch
P-ch
Digital output
N-ch
Digital output
X0A
Pull-up resistor control
Document Number: 002-05673 Rev.*C
Page 35 of 108
MB9AAA0N Series
Type
Circuit
Remarks
•
•
•
•
•
E
P-ch
P-ch
N-ch
Digital output
CMOS level output
CMOS level hysteresis input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Digital output
R
Pull-up resistor control
Digital input
Standby mode control
F
P-ch
P-ch
N-ch
R
Digital output
•
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With input control
Analog input
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
Digital output
Pull-up resistor control
Digital input
Standby mode control
Analog input
Input control
Document Number: 002-05673 Rev.*C
Page 36 of 108
MB9AAA0N Series
Type
Circuit
Remarks
G
P-ch
N-ch
Digital output
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With standby mode control
5 V tolerant input
IOH = -4 mA, IOL = 4 mA
Available to control PZR registers. P0B,
P0C, P4C, P60, P81, P82 only.
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Digital output
R
Digital input
Standby mode control
H
Mode input
J
P-ch
P-ch
N-ch
R
Digital output
Digital output
CMOS level hysteresis input
•
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With input control
LCD segment output
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Pull-up resistor control
Digital input
Standby mode control
LCD output
LCD control
Document Number: 002-05673 Rev.*C
Page 37 of 108
MB9AAA0N Series
Type
Circuit
Remarks
K
P-ch
P-ch
N-ch
R
Digital output
Digital output
•
•
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With input control
LCD common output
LCD segment output
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Pull-up resistor control
Digital input
Standby mode control
LCD output
LCD control
LCD output
LCD control
Document Number: 002-05673 Rev.*C
Page 38 of 108
MB9AAA0N Series
Type
Circuit
Remarks
L
P-ch
P-ch
N-ch
Digital output
•
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With input control
LCD common output
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
Digital output
Pull-up resistor control
R
Digital input
Standby mode control
LCD output
LCD control
O
P-ch
P-ch
N-ch
R
Digital output
Digital output
•
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With input control
Analog output
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Pull-up resistor control
Digital input
Standby mode control
Analog output
Document Number: 002-05673 Rev.*C
Page 39 of 108
MB9AAA0N Series
Type
Circuit
Remarks
Q
P-ch
P-ch
N-ch
R
Digital output
Digital output
•
•
•
•
•
•
•
•
CMOS level output
CMOS level hysteresis input
With input control
Analog input
LCD segment output
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Pull-up resistor control
Digital input
Standby mode control
Analog input
Input control
LCD output
LCD control
Document Number: 002-05673 Rev.*C
Page 40 of 108
MB9AAA0N Series
Type
Circuit
Remarks
•
•
•
•
•
•
•
R
P-ch
P-ch
N-ch
R
CMOS level output
CMOS level hysteresis input
With input control
LCD VV input/output
With pull-up resistor control
With standby mode control
Pull-up resistor
: Approximately 50 kΩ
• IOH = -4 mA, IOL = 4 mA
• When this pin is used as an I2C pin, the
digital output P-ch transistor is always off
Digital output
Digital output
Pull-up resistor control
Digital input
Standby mode control
LCD
VV
input/output
LCD VV control
Document Number: 002-05673 Rev.*C
Page 41 of 108
MB9AAA0N Series
6. Handling Precautions
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in
which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to
minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices.
6.1
Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of
certain established limits, called absolute maximum ratings. Do not exceed these ratings.
Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical
characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely
affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users
considering application outside the listed conditions are advised to contact their sales representative beforehand.
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output
functions.
1. Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device,
and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at
the design stage.
2. Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows.
Such conditions if present for extended periods of time can damage the device.
Therefore, avoid this type of connection.
3. Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be
connected through an appropriate resistance to a power supply pin or ground pin.
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally
high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of
several hundred mA to flow continuously at the power supply pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or
damage from high heat, smoke or flame. To prevent this from happening, do the following:
1. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal
noise, surge levels, etc.
2. Be sure that abnormal current flows do not occur during the power-on sequence.
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic
interference, etc. Customers are requested to observe applicable regulations and standards in the design of products.
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions.
Document Number: 002-05673 Rev.*C
Page 42 of 108
MB9AAA0N Series
Precautions Related to Usage of Devices
Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office
equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.)
are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from
such use without prior approval.
6.2
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you
should only mount under Cypress' recommended conditions. For detailed information about mount conditions, contact your sales
representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or
mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow
soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected
to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress
recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact
deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be
verified before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed
or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections
caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Cypress Inc. recommends the solder reflow method, and has established a ranking
of mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of
recommended conditions.
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength
may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of
moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing
moisture resistance and causing packages to crack. To prevent, do the following:
1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in
locations where temperature changes are slight.
2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C
and 30°C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
3. When necessary, Cypress Inc. packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a
silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.
4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended
conditions for baking.
Condition: 125°C/24 h
Document Number: 002-05673 Rev.*C
Page 43 of 108
MB9AAA0N Series
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions:
1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be
needed to remove electricity.
2. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
3. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1
MΩ).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is
recommended.
4. Ground all fixtures and instruments, or protect with anti-static measures.
5. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.
6.3
Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described above.
For reliable performance, do the following:
1. Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are
anticipated, consider anti-humidity processing.
2. Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases,
use anti-static measures or processing to prevent discharges.
3. Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If
you use devices in such conditions, consider ways to prevent such exposure or to protect the devices.
4. Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide
shielding as appropriate.
5. Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices
begin to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of Cypress products in other special environmental conditions should consult with sales
representatives.
Document Number: 002-05673 Rev.*C
Page 44 of 108
MB9AAA0N Series
7. Handling Devices
Power supply pins
In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected within the device in order to
prevent malfunctions such as latch-up. However, all of these pins should be connected externally to the power supply or ground
lines in order to reduce electromagnetic emission levels, to prevent abnormal operation of strobe signals caused by the rise in the
ground level, and to conform to the total output current rating.
Moreover, connect the current supply source with each Power supply pins and GND pins of this device at low impedance. It is also
advisable that a ceramic capacitor of approximately 0.1 µF be connected as a bypass capacitor between each Power supply pin and
GND pin, between AVCC pin and AVSS pin near this device.
Stabilizing power supply voltage
A malfunction may occur when the power supply voltage fluctuates rapidly even though the fluctuation is within the recommended
operating conditions of the VCC power supply voltage. As a rule, with voltage stabilization, suppress the voltage fluctuation so that
the fluctuation in VCC ripple (peak-to-peak value) at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the VCC
value in the recommended operating conditions, and the transient fluctuation rate does not exceed 0.1 V/μs when there is a
momentary fluctuation on switching the power supply.
Crystal oscillator circuit
Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit board so that X0/X1,
X0A/X1A pins, the crystal oscillator, and the bypass capacitor to ground are located as close to the device as possible.
It is strongly recommended that the PC board artwork be designed such that the X0/X1 and X0A/X1A pins are surrounded by
ground plane as this is expected to produce stable operation.
Evaluate oscillation of your using crystal oscillator by your mount board.
Using an external clock
To use the external clock, set general-purpose I/O ports to input the clock to X0/PE2 and X0A/P46 pin.
Example of Using an External Clock
Device
X0/PE2 (X0A/P46)
Can be used as
general-purpose I/O
ports.
X1/PE3 (X1A/P47)
Set as
general-purpose I/O
ports.
Handling when using Multi-function serial pin as I2C pin
If it is using the multi-function serial pin as I2C pins, P-ch transistor of digital output is always disabled. However, I2C pins need to
keep the electrical characteristic like other pins and not to connect to the external I2C bus system with power OFF.
Document Number: 002-05673 Rev.*C
Page 45 of 108
MB9AAA0N Series
C Pin
This series contains the regulator. Be sure to connect a smoothing capacitor (C S) for the regulator between the C pin and the GND
pin. Please use a ceramic capacitor or a capacitor of equivalent frequency characteristics as a smoothing capacitor.
However, some laminated ceramic capacitors have the characteristics of capacitance variation due to thermal fluctuation (F
characteristics and Y5V characteristics). Please select the capacitor that meets the specifications in the operating conditions to use
by evaluating the temperature characteristics of a capacitor.
A smoothing capacitor of about 4.7μF would be recommended for this series.
C
Device
Cs
VSS
GND
Mode pins (MD0, MD1)
Connect the MD pin (MD0, MD1) directly to VCC or VSS pins. Design the printed circuit board such that the pull-up/down resistance
stays low, as well as the distance between the mode pins and VCC pins or VSS pins is as short as possible and the connection
impedance is low, when the pins are pulled-up/down such as for switching the pin level and rewriting the Flash memory data. It is
because of preventing the device erroneously switching to test mode due to noise.
Notes on power-on
Turn power on/off in the following order or at the same time.
If not using the A/D converter, connect AVCC = VCC and AVSS = VSS.
Turning on: VCC AVCC AVRH
Turning off: AVRH AVCC VCC
Serial Communication
There is a possibility to receive wrong data due to the noise or other causes on the serial communication.
Therefore, design a printed circuit board so as to avoid noise.
Consider the case of receiving wrong data due to noise, perform error detection such as by applying a checksum of data at the end.
If an error is detected, retransmit the data.
Differences in features among the products with different memory sizes and between Flash memory
products and MASK products
The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and oscillation characteristics among
the products with different memory sizes and between Flash memory products and MASK products are different because chip
layout and memory structures are different.
If you are switching to use a different product of the same series, please make sure to evaluate the electric characteristics.
Document Number: 002-05673 Rev.*C
Page 46 of 108
MB9AAA0N Series
8. Block Diagram
MB9AFAA1/AA2
ROM
Table
SWJ-DP
Cortex-M3 Core
@20MHz(Max)
Flash I/F
I
Multi-layer AHB (Max 20MHz)
TRSTX,TCK,
TDI,TMS
TDO
D
Sys
AHB-APB Bridge: APB0
(Max 20MHz)
NVIC
Watchdog Timer
(Software)
Clock Reset
Generator
INITX
Watchdog Timer
(Hardware)
Security
On-Chip
Flash
64/128Kbyte
SRAM1
12/16Kbyte
CSV
CLK
X0
X1
X0A
X1A
Main
Osc
Sub
Osc
PLL
Source Clock
CR
4MHz
CR
100kHz
CROUT
AVCC,
AVSS,AVRH
ANxx
Deep Standby Ctrl
WKUPx
12-bit A/D Converter
Power On
Reset
Unit 0
LVD Ctrl
ADTGx
LVD
Regulator
TIOBx
Base Timer
16-bit 8ch./
32-bit 4ch.
A/D Activation
Compare
1ch.
IC0x
FRCK0
16-bit Input Capture
4ch.
16-bit FreeRun Timer
3ch.
16-bit Output
Compare
6ch.
DTTI0X
RTO0x
IGTRG
AHB-APB Bridge : APB2 (Max 20MHz)
TIOAx
AHB-APB Bridge : APB1 (Max 20MHz)
DAx
Multi-Function Timer ×1
VVx
LCDC
COMx,
SEGxx
HDMI-CEC/
Remote Receiver
Control
CECx
RTCCO
SUBOUT
Real Time Clock
External Interrupt
Controller
16-pin + NMI
INTxx
NMIX
MODE-Ctrl
MD1,
MD0
P0x,
P1x,
GPIO
Waveform Generator
3ch.
16-bit PPG
3ch.
C
IRQ-Monitor
10-bit D/A Converter
2ch.
PIN-Function-Ctrl
.
.
.
Pxx
Multi-Function
Serial IF
8ch.
HW flow control(ch.4)*
SCKx
SINx
SOTx
CTS4
RTS4
*: For the MB9AFAA1L and MB9AFAA2L, Multi-function Serial Interface does not support hardware flow control in these products.
Document Number: 002-05673 Rev.*C
Page 47 of 108
MB9AAA0N Series
9. Memory Size
See Memory size in Product Lineup to confirm the memory size.
10. Memory Map
Memory Map (1)
Peripherals Area
0x41FF_FFFF
0xFFFF_FFFF
Reserved
0xE010_0000
0xE000_0000
Cortex-M3 Private
Peripherals
Reserved
Reserved
0x4003_C000
0x4003_B000
0x4003_9000
0x4003_8000
0x4400_0000
0x4200_0000
32Mbytes
Bit band alias
0x4003_6000
0x4003_5000
Peripherals
0x4003_4000
0x4003_3000
0x4003_2000
0x4003_1000
0x4003_0000
0x4002_F000
0x4002_E000
0x4000_0000
Reserved
0x2400_0000
0x2200_0000
32Mbytes
Bit band alias
Reserved
0x2008_0000
0x2000_0000
SRAM1
Reserved
See " Memory Map (2)"
for the memory size
details.
0x0010_0008
0x0010_0000
0x4002_9000
0x4002_8000
0x4002_7000
0x4002_6000
0x4002_5000
0x4002_4000
Reserved
MFS
Reserved
LVD/DS mode
HDMI-CEC/
Remote Control Receiver
GPIO
LCDC
Int-Req.Read
EXTI
Reserved
CR Trim
Reserved
D/AC
A/DC
Reserved
Base Timer
PPG
Security/CR Trim
Reserved
Flash
0x4002_1000
0x4002_0000
MFT unit0
Reserved
0x0000_0000
0x4001_3000
0x4001_2000
0x4001_1000
0x4001_0000
0x4000_1000
0x4000_0000
Document Number: 002-05673 Rev.*C
RTC
SW WDT
HW WDT
Clock/Reset
Reserved
Flash I/F
Page 48 of 108
MB9AAA0N Series
Memory Map (2)
MB9AFAA2L/M/N
MB9AFAA1L/M/N
0x2008_0000
0x2008_0000
Reserved
Reserved
0x2000_4000
0x2000_3000
SRAM1
16 Kbytes
0x2000_0000
0x2000_0000
Reserved
Reserved
0x0010_0008
0x0010_0004
0x0010_0000
SRAM1
12 Kbytes
0x0010_0008
CR trimming
Security
0x0010_0004
0x0010_0000
CR trimming
Security
Reserved
Reserved
SA2 (60 KB)
0x0000_0000
SA1 (4 KB)
0x0001_0000
SA2 (60 KB)
0x0000_0000
Flash 64 Kbytes
SA3 (64 KB)
Flash 128 Kbytes
0x0002_0000
SA1 (4 KB)
*: See MB9AAA0N/1A0N/A30N/130N/130L Series Flash Programming Manual to confirm the detail of Flash memory.
Document Number: 002-05673 Rev.*C
Page 49 of 108
MB9AAA0N Series
Peripheral Address Map
Start address
End address
Bus
Peripherals
0x4000_0000
0x4000_0FFF
0x4000_1000
0x4000_FFFF
0x4001_0000
0x4001_0FFF
Clock/Reset Control
0x4001_1000
0x4001_1FFF
Hardware Watchdog timer
0x4001_2000
0x4001_2FFF
0x4001_3000
0x4001_4FFF
0x4001_5000
0x4001_5FFF
Reserved
0x4001_6000
0x4001_FFFF
Reserved
0x4002_0000
0x4002_0FFF
Multi-function timer unit0
0x4002_1000
0x4002_1FFF
Reserved
0x4002_2000
0x4002_3FFF
Reserved
0x4002_4000
0x4002_4FFF
PPG
0x4002_5000
0x4002_5FFF
0x4002_6000
0x4002_6FFF
0x4002_7000
0x4002_7FFF
A/D Converter
0x4002_8000
0x4002_8FFF
D/A Converter
0x4002_9000
0x4002_DFFF
Reserved
0x4002_E000
0x4002_EFFF
Built-in CR trimming
0x4002_F000
0x4002_FFFF
Reserved
0x4003_0000
0x4003_0FFF
External Interrupt
0x4003_1000
0x4003_1FFF
Interrupt Source Check Register
0x4003_2000
0x4003_2FFF
LCD Controller
0x4003_3000
0x4003_3FFF
GPIO
0x4003_4000
0x4003_4FFF
HDMI-CEC/ Remote Control Receiver
0x4003_5000
0x4003_50FF
Low-Voltage Detector
0x4003_5100
0x4003_5FFF
0x4003_6000
0x4003_6FFF
0x4003_7000
0x4003_7FFF
Reserved
0x4003_8000
0x4003_8FFF
Multi-function serial
0x4003_9000
0x4003_9FFF
Reserved
0x4003_A000
0x4003_AFFF
Reserved
0x4003_B000
0x4003_BFFF
Real-time clock
0x4003_C000
0x4003_FFFF
Reserved
0x4004_0000
0x4004_FFFF
Reserved
0x4005_0000
0x4005_FFFF
Reserved
0x4006_0000
0x4006_0FFF
0x4006_1000
0x4006_1FFF
0x4006_2000
0x4006_2FFF
Reserved
0x4006_3000
0x4006_3FFF
Reserved
0x4006_4000
0x41FF_FFFF
Reserved
Document Number: 002-05673 Rev.*C
AHB
APB0
Flash memory I/F register
Reserved
Software Watchdog timer
Reserved
Base Timer
APB1
APB2
Reserved
Deep standby mode Controller
Reserved
Reserved
AHB
Reserved
Page 50 of 108
MB9AAA0N Series
11. Pin Status in Each CPU State
The terms used for pin status have the following meanings.
INITX = 0
This is the period when the INITX pin is the L level.
INITX = 1
This is the period when the INITX pin is the H level.
SPL = 0
This is the status that the standby pin level setting bit (SPL) in the standby mode control register (STB_CTL) is set to 0.
SPL = 1
This is the status that the standby pin level setting bit (SPL) in the standby mode control register (STB_CTL) is set to 1.
Input enabled
Indicates that the input function can be used.
Internal input fixed at 0
This is the status that the input function cannot be used. Internal input is fixed at L.
Hi-Z
Indicates that the pin drive transistor is disabled and the pin is put in the Hi-Z state.
Setting disabled
Indicates that the setting is disabled.
Maintain previous state
Maintains the state that was immediately prior to entering the current mode.
If a built-in peripheral function is operating, the output follows the peripheral function.
If the pin is being used as a port, that output is maintained.
Analog input is enabled
Indicates that the analog input is enabled.
Trace output
Indicates that the trace function can be used.
GPIO selected
In Deep Standby mode, pins switch to the general-purpose I/O port.
Document Number: 002-05673 Rev.*C
Page 51 of 108
MB9AAA0N Series
Pin status type
List of Pin Status
A
B
Power-on
Device
reset or
INITX
Timer mode,
internal Run mode or
low-voltage
input
Sleep mode
RTC mode, or
reset
detection
state
state
Stop mode state
state
state
Function
Power
Power
group
Power supply
supply
supply
Power supply stable
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
INITX = 1
SPL = 0
SPL = 1
Main
crystal
Input
Input
Input
Input
Input
Input enabled
oscillator enabled
enabled
enabled
enabled
enabled
input pin
Maintain
previous
Hi-Z /
state /
Input
When
enabled /
External
oscillation
When
main
stops*1,
Setting
Setting
Setting
Maintain
oscillation
clock
output
disabled
disabled disabled previous state
stops*1,
input
maintains
Hi-Z /
selected
previous
Internal
state /
input fixed
Internal
at 0
input fixed
at 0
Output
maintains
Hi-Z /
previous
GPIO
Setting
Setting
Setting
Maintain
Internal
state /
selected disabled
disabled disabled previous state
input fixed
Internal
at 0
input fixed
at 0
Maintain
Maintain
Maintain
previous
previous
previous state
state /
state /
/
When
Main
Hi-Z /
Hi-Z /
Hi-Z /
When
When
oscillation
crystal
Internal
Internal
Internal
oscillation
oscillation
stops*1,
1
oscillator input fixed input fixed input
stops* ,
stops*1, Hi-Z
Hi-Z output
output pin at 0
at 0
fixed at 0
Hi-Z output /
output /
/
Internal
Internal input
Internal
input fixed
fixed at 0
input fixed
at 0
at 0
Return
Deep Standby RTC
from Deep
mode or Deep Standby Standby
Stop mode state
mode state
INITX = 1
SPL = 0
SPL = 1
Input
enabled
Input
enabled
Output
maintains
previous
state /
Internal
input fixed
at 0
Hi-Z /
Internal
GPIO
input fixed selected
at 0
Output
maintains
previous
state /
Internal
input fixed
at 0
Hi-Z /
Maintain
Internal
previous
input fixed
state
at 0
Maintain
previous
state /
When
oscillation
stops*1,
Hi-Z output /
Internal
input fixed
at 0
Maintain
previous
state /
When
oscillation
stops*1,
Hi-Z output
/
Internal
input fixed
at 0
Output
maintains
Hi-Z /
previous
Internal
state /
input fixed
Internal
at 0
input fixed
at 0
Pull-up /
Pull-up /
Input
Input
enabled
enabled
Input
enabled
Maintain
previous
state /
When
oscillation
stops*1,
Hi-Z output /
Internal
input fixed
at 0
Hi-Z /
Maintain
Internal
previous
input fixed
state
at 0
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
Maintain
previous
previous state
state
C
INITX
input pin
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Pull-up /
Pull-up / Input
Input
enabled
enabled
D
Mode
input pin
Input
enabled
Input
enabled
Input
enabled
Input enabled
Input
enabled
Input
enabled
Input
enabled
Input
enabled
E
JTAG
selected
Hi-Z
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Maintain
Maintain
previous
previous state
state
Maintain
previous
state
Maintain
previous
state
Maintain
previous
state
Document Number: 002-05673 Rev.*C
Power
supply
stable
INITX = 1
-
Power supply stable
Pull-up /
Input
enabled
Pull-up /
Input
enabled
Input
enabled
Maintain
previous
state
Page 52 of 108
Pin status type
MB9AAA0N Series
Power-on
Device Run mode or
reset or
INITX
internal Sleep mode
low-voltage
input
reset
detection
state
state
state
state
Function
Power
Power
group
Power supply
supply
supply
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
-
GPIO
selected
F
Setting
disabled
External
interrupt Setting
enabled disabled
selected
Resource
other than
above
selected
Hi-Z
GPIO
selected
WKUP
enabled
Setting
disabled
External
interrupt Setting
enabled disabled
selected
Resource
other than
above
selected
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
GPIO
selected
Power supply stable
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Output
maintain
Hi-Z /
Hi-Z /
previous
Internal
Internal
state /
input fixed
input fixed
Internal
at 0
at 0
input fixed
at 0
Maintain
previous
state
Maintain
Maintain
previous
previous state
state
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
maintains
input fixed
previous
at 0
state /
Internal
input fixed
at 0
Hi-Z /
Internal
WKUP input
input fixed enabled
at 0
Maintain
previous
state
GPIO
selected
Internal
input fixed
at 0
Maintain
Maintain
previous
previous state
state
G
Hi-Z
Timer mode,
RTC mode, or
Stop mode state
Hi-Z /
Input
enabled
Document Number: 002-05673 Rev.*C
Hi-Z /
Input
enabled
Hi-Z /
Output
Internal
input fixed maintains
previous
at 0
state /
Internal
input fixed
at 0
Power
supply
stable
INITX = 1
-
GPIO
selected
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
Hi-Z /
WKUP
input
enabled
GPIO
selected
GPIO
selected
Hi-Z /
Internal
input fixed
Maintain
at 0
previous
state
Page 53 of 108
Pin status type
MB9AAA0N Series
Power-on
Device Run mode or
reset or
INITX
internal Sleep mode
low-voltage
input
reset
detection
state
state
state
state
Function
Power
Power
group
Power supply
supply
supply
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
-
Timer mode,
RTC mode, or
Stop mode state
Power supply stable
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Setting
disabled
Setting
disabled
Maintain
Maintain
previous
previous state
state
GPIO
selected
NMIX
selected
I
Setting
disabled
Resource
other than
above
selected Hi-Z
GPIO
selected
Analog
input
selected
J
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
Internal
input
fixed at 0
/
Analog
input
enabled
Maintain
Maintain
previous
previous state
state
Hi-Z /
Internal input
fixed at 0 /
Analog input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
Resource
other than
above
selected
Setting
disabled
Setting
disabled
GPIO
selected
Document Number: 002-05673 Rev.*C
Setting
disabled
Power supply stable
INITX = 1
SPL = 0
SPL = 1
Resource
selected
H
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
Maintain
Maintain
previous
previous state
state
INITX = 1
SPL = 0
SPL = 1
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Hi-Z /
Internal
Internal
Output
input fixed maintains
input fixed
at 0
at 0
previous
state /
Internal
input fixed
at 0
Maintain
previous
state
Hi-Z /
WKUP input WKUP
Hi-Z /
enabled
input
Internal
enabled
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Power
supply
stable
INITX = 1
GPIO
selected
Maintain
previous
state
GPIO
selected
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
GPIO
selected
Internal
input fixed
at 0
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed Output
maintains
at 0
previous
state /
Internal
input fixed
at 0
Hi-Z /
Internal
Output
input fixed maintains
at 0
previous
state /
Internal
input fixed
at 0
Page 54 of 108
Pin status type
MB9AAA0N Series
K
Power-on
Device
reset or
INITX
internal
low-voltage
input
reset
detection
state
state
state
Function
Power
group
Power supply
supply
stable
unstable
INITX = 0 INITX = 1
Hi-Z /
Hi-Z /
Internal
Internal
input
Analog
input fixed
fixed at 0
input
Hi-Z
at 0 /
/
selected
Analog
Analog
input
input
enabled
enabled
External
interrupt
enabled
selected
Resource
other than
above
Setting
Setting
Setting
selected
disabled
disabled disabled
Run mode or
Sleep mode
state
Power
supply
stable
INITX = 1
Hi-Z /
Internal input
fixed at 0 /
Analog input
enabled
Timer mode,
RTC mode, or
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
Analog
input
selected
Hi-Z
Hi-Z /
Internal
input
fixed at 0
/
Analog
input
enabled
Maintain
Maintain
previous
previous state
state
Hi-Z /
Internal input
fixed at 0 /
Analog input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
L
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
GPIO
selected
Internal
input fixed
at 0
GPIO
selected
Document Number: 002-05673 Rev.*C
Setting
disabled
Maintain
Maintain
previous
previous state
state
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
maintains
input fixed
previous
at 0
state /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Maintain
previous
state
Setting
disabled
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Power
supply
stable
INITX = 1
-
Hi-Z /
Internal
input fixed
Output
at 0
maintains
previous
state /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
Hi-Z /
Internal
WKUP input
input fixed enabled
at 0
WKUP
enabled
External
interrupt
enabled
selected
Resource
other than Setting
disabled
above
selected
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Maintain
previous
state
GPIO
selected
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
input fixed maintains
previous
at 0
state /
Internal
input fixed
at 0
Hi-Z /
WKUP
input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed Output
at 0
maintains
previous
state /
Internal
input fixed
at 0
Page 55 of 108
Pin status type
MB9AAA0N Series
M
Power-on
Device Run mode or
reset or
INITX
Timer mode,
internal Sleep mode
low-voltage
input
RTC mode, or
reset
detection
state
state
Stop mode state
state
state
Function
Power
Power
group
Power supply
supply
supply
Power supply stable
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
INITX = 1
SPL = 0
SPL = 1
Sub
crystal
Input
Input
Input
Input
Input
Input enabled
oscillator enabled
enabled
enabled
enabled
enabled
input pin
Maintain
previous
state /
Hi-Z / Input
When
enabled /
oscillation
When
External
stops*2,
oscillation
sub clock Setting
Setting
Setting
Maintain
output
stops*2,
input
disabled
disabled disabled previous state
maintains
Hi-Z /
selected
previous
Internal
state /
input fixed
Internal
at 0
input fixed
at 0
Output
maintains
Hi-Z /
previous
GPIO
Setting
Setting
Setting
Maintain
Internal
state /
selected disabled
disabled disabled previous state
input fixed
Internal
at 0
input fixed
at 0
Maintain
Maintain
previous
previous
state /
state /
Sub
Hi-Z /
Hi-Z /
Hi-Z /
When
When
crystal
Internal
Internal
Internal Maintain
oscillation
oscillation
oscillator input fixed input fixed input
previous state stops*2,
stops*2,
output pin at 0
at 0
fixed at 0
Hi-Z /
Hi-Z /
Internal
Internal
input fixed input fixed
at 0
at 0
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
INITX = 1
SPL = 0
SPL = 1
Input
enabled
Maintain
previous
state /
When
oscillation
stops*2,
output
maintains
previous
state /
Internal
input fixed
at 0
Output
maintains
previous
state /
Internal
input fixed
at 0
Maintain
previous
state /
When
oscillation
stops*2,
Hi-Z /
Internal
input fixed
at 0
Input
enabled
Input
enabled
Hi-Z / Input
enabled /
When
oscillation
stops*2,
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state /
When
Return from
Deep
Standby
STOP
mode, GPIO
is selected
Hi-Z /
Maintain
Internal
previous
input fixed
state
at 0
Maintain
previous
state /
When
oscillation
stops*2,
Hi-Z /
Internal
input fixed
at 0
N
GPIO
selected
Setting
disabled
Setting
disabled
Document Number: 002-05673 Rev.*C
Setting
disabled
Maintain
Maintain
previous
previous state
state
Power
supply
stable
INITX = 1
-
Power supply stable
Output
maintains
Hi-Z /
previous
Internal
state /
input fixed
Internal
at 0
input fixed
at 0
Maintain
previous
state /
When
oscillation
stops*2,
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
Hi-Z /
Internal
input fixed
at 0
Page 56 of 108
Pin status type
MB9AAA0N Series
Power-on
Device Run mode or
reset or
INITX
internal Sleep mode
low-voltage
input
reset
detection
state
state
state
state
Function
Power
Power
group
Power supply
supply
supply
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
External
interrupt
enabled
selected
Setting
disabled
Setting
disabled
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Maintain
previous
state
Setting
disabled
Maintain
Maintain
previous
previous state
state
O
P
Timer mode,
RTC mode, or
Stop mode state
GPIO
selected /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed at
0
Output
maintains
previous state
/ Internal
input fixed at
0
Input
enabled
Input enabled
Power
supply
stable
INITX = 1
-
GPIO
selected
Hi-Z /
Internal
input fixed Maintain
previous state
at 0
GPIO
selected
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Mode
input pin
Input enabled
Input
enabled
Input
enabled
Input enabled
Input enabled
GPIO
selected
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous state
Maintain
Hi-Z / Input
previous state enabled
Maintain
Hi-Z / Input
previous state enabled
Maintain
previous state
CEC
enabled
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous state
Maintain
Maintain
previous
previous state
state
Maintain
Maintain
previous
previous state
state
Maintain
previous state
GPIO
selected
Internal input
fixed at 0
GPIO
selected
Resource
other than
above
selected
Q
Hi-Z
Hi-Z /
Input
enabled
GPIO
selected
Document Number: 002-05673 Rev.*C
Hi-Z /
Input
enabled
Maintain
previous state
Hi-Z /
Maintain
Internal
previous state input fixed at Output
maintains
0
previous state
/ Internal
input fixed at
0
Input
enabled
Input enabled
Hi-Z /
Internal
Maintain
input fixed at previous state
0
Page 57 of 108
Pin status type
MB9AAA0N Series
Power-on
Device Run mode or
reset or
INITX
internal Sleep mode
low-voltage
input
reset
detection
state
state
state
state
Function
Power
Power
group
Power supply
supply
supply
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
CEC
enabled
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
previous state
Timer mode,
RTC mode, or
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Maintain
Maintain
previous
previous state
state
R
Setting
disabled
Setting
disabled
GPIO
selected
External
interrupt Setting
enabled disabled
selected
Resource
other than
above
selected
S
Hi-Z
Hi-Z /
Input
enabled
Hi-Z /
Input
enabled
Setting
disabled
Setting
disabled
Hi-Z /
Internal
input fixed
at 0
Document Number: 002-05673 Rev.*C
Hi-Z /
Internal
input
fixed at 0
Maintain
previous state
Hi-Z /
WKUP input
enabled
Maintain
previous
state
Maintain
previous state
Hi-Z
GPIO
selected
Setting
disabled
Power
supply
stable
INITX = 1
-
Maintain
Maintain
previous
previous state
state
Hi-Z /
Internal
WKUP input
input fixed at enabled
0
WKUP
enabled
External
interrupt
enabled
selected
Resource
other than
above
selected
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
GPIO
selected
GPIO
selected
Maintain
Internal input
previous state
fixed at 0
Hi-Z /
Internal
input fixed at
Hi-Z /
0
Internal
Output
input fixed at maintains
0
previous state
Maintain
/ Internal
previous state
input fixed at
0
Maintain
previous
state
Maintain
Maintain
previous
previous state
state
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
input fixed maintains
previous
at 0
state /
Internal
input fixed
at 0
GPIO
selected
Internal
input fixed
at 0
Output
maintains
previous
state /
Hi-Z /
Internal
Internal
input fixed
input fixed at 0
at 0
Page 58 of 108
Pin status type
MB9AAA0N Series
Power-on
Device Run mode or
reset or
INITX
internal Sleep mode
low-voltage
input
reset
detection
state
state
state
state
Function
Power
Power
group
Power supply
supply
supply
stable
unstable
stable
INITX = 0 INITX = 1 INITX = 1
WKUP
enabled
T
Setting
disabled
External
interrupt Setting
enabled disabled
selected
Resource
other than
above
selected
Timer mode,
RTC mode, or
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Setting
disabled
Setting
disabled
Hi-Z /
WKUP input
Internal
input fixed enabled
at "0"
Setting
disabled
Setting
disabled
Maintain
previous
state
Maintain
Maintain
previous
previous state
state
Hi-Z
Hi-Z /
Internal
input fixed
at 0
Hi-Z /
Internal
input
fixed at 0
Hi-Z
Hi-Z /
Internal
input fixed
at 0
Hi-Z /
Maintain
Internal Maintain
previous
input
previous state
state
fixed at 0
Hi-Z
Hi-Z /
Internal
input fixed
at 0
Hi-Z /
Maintain
Internal Maintain
previous
input
previous state
state
fixed at 0
GPIO
selected
Resource
selected
U
GPIO
selected
Resource
selected
V
GPIO
selected
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
Document Number: 002-05673 Rev.*C
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
input fixed maintains
previous
at 0
state /
Internal
input fixed
at 0
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
Output
input fixed maintains
at 0
previous
state /
Internal
input fixed
at 0
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
Output
input fixed maintains
at 0
previous
state /
Internal
input fixed
at 0
Hi-Z /
WKUP
input
enabled
Power
supply
stable
INITX = 1
GPIO
selected
Internal
input fixed
at "0"
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
Output
at 0
maintains
previous
state /
Internal
input fixed
at 0
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
Output
input fixed maintains
at 0
previous
state /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0
Page 59 of 108
Pin status type
MB9AAA0N Series
W
Power-on
Device
reset or
INITX
internal
low-voltage
input
reset
detection
state
state
state
Function
Power
group
Power supply
supply
stable
unstable
INITX = 0 INITX = 1
External
interrupt Setting
Setting
Setting
enabled disabled
disabled disabled
selected
Resource
other than
above
selected
Hi-Z /
Hi-Z /
Internal
Internal
Hi-Z
input fixed input
at 0
fixed at 0
GPIO
selected
Analog
input
selected
X
Hi-Z
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
Internal
input
fixed at 0
/
Analog
input
enabled
Run mode or
Sleep mode
state
Power
supply
stable
INITX = 1
-
Timer mode,
RTC mode, or
Stop mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
Maintain
previous
state
Maintain
Maintain
previous
previous state
state
Hi-Z /
Internal input
fixed at 0 /
Analog input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
Resource
other than
above
selected
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Setting
disabled
Maintain
Maintain
previous
previous state
state
GPIO
selected
Y
Analog
output
selected
External
interrupt
enabled
selected
Resource
other than
above
selected
Hi-Z
GPIO
selected
*3
Hi-Z /
Input
enabled
Document Number: 002-05673 Rev.*C
Hi-Z /
Input
enabled
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
input fixed maintains
previous
at 0
state /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Internal
Output
input fixed maintains
at 0
previous
state /
Internal
input fixed
at 0
Power
supply
stable
INITX = 1
-
Hi-Z /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0
Hi-Z /
Internal
input fixed
at 0 /
Analog
input
enabled
Hi-Z /
Internal
input fixed
at 0 /
Analog input
enabled
GPIO
selected
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
*4
Maintain
previous
state
Maintain
previous state
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
GPIO
selected
GPIO
Internal input
selected
fixed at 0
Hi-Z /
Internal
input fixed at
0
Maintain
previous state Hi-Z /
Internal
Output
input fixed at maintains
0
previous state
/ Internal
input fixed at
0
Maintain
previous state
Page 60 of 108
Pin status type
MB9AAA0N Series
Z
Power-on
Device
reset or
INITX
internal
low-voltage
input
reset
detection
state
state
state
Function
Power
group
Power supply
supply
stable
unstable
INITX = 0 INITX = 1
Analog
Setting
Setting
Setting
output
disabled
disabled disabled
selected
Resource
other than
above
selected
Hi-Z /
Hi-Z /
Hi-Z
Input
Input
enabled
enabled
GPIO
selected
Run mode or
Sleep mode
state
Power
supply
stable
INITX = 1
-
Timer mode,
RTC mode, or
Stop mode state
Return
Deep Standby RTC
mode or Deep Standby from Deep
Standby
Stop mode state
mode state
Power supply stable
Power supply stable
INITX = 1
SPL = 0
SPL = 1
INITX = 1
SPL = 0
SPL = 1
*3
Maintain
previous state Maintain
previous
state
*4
GPIO
selected
Internal
input fixed
at 0
Hi-Z /
Output
Internal
input fixed maintains
previous
at 0
state /
Internal
input fixed
at 0
Power
supply
stable
INITX = 1
-
GPIO
selected
Hi-Z /
Internal
input fixed
at 0
Maintain
previous
state
*1: Oscillation is stopped at Sub Run mode, Low-speed CR Run mode, Sub Sleep mode, Low-speed CR Sleep mode, Sub Timer
mode, Low-speed CR Timer mode, RTC mode, Stop mode, Deep Standby RTC mode, and Deep Standby Stop mode.
*2: Oscillation is stopped at Stop mode and Deep Standby Stop mode.
*3: Maintain previous state at Timer mode. GPIO selected Internal input fixed at 0 at RTC mode, Stop mode.
*4: Maintain previous state at Timer mode. Hi-Z/Internal input fixed at 0 at RTC mode, Stop mode.
Document Number: 002-05673 Rev.*C
Page 61 of 108
MB9AAA0N Series
12. Electrical Characteristics
12.1 Absolute Maximum Ratings
Parameter
Power supply voltage*1,*2
Analog power supply voltage*1,*3
Analog reference voltage*1,*3
LCD input voltage*1,*3
Input voltage*1
Symbol
VCC
AVCC
AVRH
VV4 to
VV0
VI
Rating
Min
Vss - 0.5
Vss - 0.5
Vss - 0.5
Max
Vss + 6.5
Vss + 6.5
Vss + 6.5
Vss - 0.5
Vss + 6.5
Vss - 0.5
Vss - 0.5
Analog pin input
voltage*1
VIA
Vss - 0.5
Output voltage*1
VO
Vss - 0.5
L level maximum output current*4
L level average output current*5
L level total maximum output current
L level total average output current*6
H level maximum output current*4
H level average output current*5
H level total maximum output current
H level total average output current*6
Power consumption
Storage temperature
IOL
IOLAV
∑IOL
∑IOLAV
IOH
IOHAV
∑IOH
∑IOHAV
PD
TSTG
- 55
VCC + 0.5
(≤ 6.5 V)
Vss + 6.5
AVCC + 0.5
(≤ 6.5 V)
VCC + 0.5
(≤ 6.5 V)
10
4
100
50
-10
-4
-100
-50
400
+ 150
Unit
Remarks
V
V
V
V
V
V
5 V tolerant
V
V
mA
mA
mA
mA
mA
mA
mA
mA
mW
C
*1: These parameters are based on the condition that Vss = AVss = 0 V.
*2: VCC must not drop below Vss - 0.5 V.
*3: Be careful not to exceed VCC + 0.5 V, for example, when the power is turned on.
*4: The maximum output current is defined as the value of the peak current flowing through any one of the corresponding pins.
*5: The average output current is defined as the average current value flowing through any one of the corresponding pins for a 100
ms period.
*6: The total average output current is defined as the average current value flowing through all of corresponding pins for a 100 ms.
WARNING:
−
Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or
temperature) in excess of absolute maximum ratings.
Do not exceed any of these ratings.
Document Number: 002-05673 Rev.*C
Page 62 of 108
MB9AAA0N Series
12.2 Recommended Operating Conditions
(Vss = AVss = 0.0V)
Power supply voltage
VCC
-
LCD input voltage
Analog power supply voltage
VV4
AVCC
-
Analog reference voltage
AVRH
-
Smoothing capacitor
LQD064,
LQG064,
Operating
LQH080,
Temperature LQJ080,
LQI100,
PQH100
CS
-
Value
Min
Max
1.8
5.5
2.2
5.5
2.2
VCC
1.8
5.5
2.7
AVCC
AVCC
1
10
TA
-
- 40
Parameter
Symbol
Conditions
+ 85
Unit
V
V
V
V
μF
Remarks
*1
*2
AVCC = VCC
AVCC ≥ 2.7 V
AVCC < 2.7 V
For built-in Regulator *3
C
*1: When LCD is not used
*2: When LCD is used
*3: See C Pin in Handling Devices for the smoothing capacitor.
WARNING:
−
The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All
of the device's electrical characteristics are warranted when the device is operated under these conditions.
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device
failure.
No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you
are considering application under any conditions other than listed herein, please contact sales representatives beforehand.
Document Number: 002-05673 Rev.*C
Page 63 of 108
MB9AAA0N Series
12.3 DC Characteristics
12.3.1 Current Rating
(VCC = AVCC = 1.8V to 5.5V, VSS = AVSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Value
Pin
name
Conditions
PLL
Run mode
High-speed
CR
Run mode
ICC
Power
supply
current
VCC
Sub
Run mode
Low-speed
CR
Run mode
ICCS
PLL
Sleep mode
High-speed
CR
Sleep mode
Sub
Sleep mode
Low-speed
CR
Sleep mode
Unit
Remarks
Typ*3
Max*4
19
24
mA
*1, *5
9.5
12.5
mA
*1, *5
4.5
5
mA
*1
0.25
0.55
mA
*1, *6
0.3
0.95
mA
*1
Peripheral: 20 MHz
8
10.5
mA
*1, *5
Peripheral: 4 MHz*2
2
2.5
mA
*1
Peripheral: 32 kHz
0.2
0.45
mA
*1, *6
Peripheral: 100 kHz
0.25
0.65
mA
*1
CPU: 20 MHz,
Peripheral: 20 MHz,
Flash memory 0 Wait,
FRWTR.RWT = 00,
FSYNDN.SD = 000
CPU: 20 MHz,
Peripheral: clock stopped,
NOP operation
CPU/Peripheral: 4 MHz*2
Flash memory 0 Wait
FRWTR.RWT = 00
FSYNDN.SD = 000
CPU/Peripheral: 32 kHz,
Flash memory 0 Wait,
FRWTR.RWT = 00,
FSYNDN.SD = 000
CPU/Peripheral: 100 kHz,
Flash memory 0 Wait,
FRWTR.RWT = 00,
FSYNDN.SD = 000
*1: When all ports are fixed.
*2: When setting it to 4 MHz by trimming.
*3: TA=+25°C, VCC=3.3 V
*4: TA=+85°C, VCC=5.5 V
*5: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit)
*6: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)
Document Number: 002-05673 Rev.*C
Page 64 of 108
MB9AAA0N Series
Parameter
Value
Pin
name
Symbol
Conditions
Main
Timer mode
ICCT
Sub
Timer mode
ICCR
Power
supply
current
RTC mode
VCC
ICCH
ICCRD
ICCHD
Stop mode
Deep
Standby
RTC mode
Deep
Standby
Stop mode
Unit
Remarks
Typ*2
Max*3
0.9
3.3
mA
*1, *4
1.5
3.5
mA
*1, *4
7.5
60
μA
*1, *5
16
150
μA
*1, *5
TA = + 25C,
When LVD is off
1.5
6.5
μA
*1, *5
TA = + 85C,
When LVD is off
6
79
μA
*1, *5
TA = + 25C,
When LVD is off
0.6
5
μA
*1
TA = + 85C,
When LVD is off
4.2
77
μA
*1
TA = + 25C,
When LVD is off
1.3
4.5
μA
*1, *5
TA = + 85C,
When LVD is off
3
22
μA
*1, *5
TA = + 25C,
When LVD is off
0.4
3
μA
*1
TA = + 85C,
When LVD is off
1.4
20
μA
*1
TA = + 25°C,
When LVD is off
TA = + 85°C,
When LVD is off
TA = + 25°C,
When LVD is off
TA = + 85°C,
When LVD is off
*1: When all ports are fixed.
*2: VCC=3.3 V
*3: VCC=5.5 V
*4: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit)
*5: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)
Document Number: 002-05673 Rev.*C
Page 65 of 108
MB9AAA0N Series
Low Voltage Detection Current
(VCC = AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0 V, TA = - 40C to + 85C)
Parameter
Low-voltage
detection circuit
(LVD) power
supply current
Symbol
ICCLVD
Pin
name
VCC
Value
Conditions
Typ*
Max
10
20
For occurrence of reset or for
occurrence of interrupt in normal
mode operation
For occurrence of reset and for
occurrence of interrupt in normal
mode operation
For occurrence of interrupt in
low-power mode operation
Unit
Remarks
μA
When not
detected
14
30
μA
0.3
2
μA
When not
detected
*: When VCC=3.3V
Flash Memory Current
(VCC = 1.8 V to 5.5 V, VSS = 0 V, TA = - 40°C to + 85°C)
Parameter
Flash memory
write/erase
current
Pin
name
Symbol
ICCFLASH
VCC
Value
Conditions
At Write/Erase
Typ
Max
10.8
11.9
Unit
Remarks
mA
A/D Converter Current
(VCC = AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0 V, TA = - 40°C to + 85°C)
Parameter
Power supply
current
Reference power
supply current
Pin
name
Symbol
ICCAD
ICCAVRH
AVCC
AVRH
Value
Conditions
Unit
Typ
Max
At 1unit
operation
1.4
2.5
mA
At stop
0.1
0.35
μA
At 1unit
operation
AVRH=5.5 V
0.5
1.5
mA
At stop
0.1
0.3
μA
Remarks
D/A Converter Current
(VCC = AVCC = 1.8 V to 5.5 V, VSS = AVSS = 0 V, TA = - 40°C to + 85°C)
Parameter
Power supply
current
Symbol
Pin
name
IDDA
AVCC
IDSA
Conditions
At D/A 1ch.
operation
AVCC=3.3 V
At D/A 1ch.
operation
AVCC=5.0 V
At D/A stop
Value
Unit
Remarks
Typ
Max
314
440
μA
*1, *2
476
670
μA
*1, *2
-
1.0
μA
*1
*1: No-load
*2: Generates the max current by the CODE about 0x200
Document Number: 002-05673 Rev.*C
Page 66 of 108
MB9AAA0N Series
12.3.2 Pin Characteristics
(VCC = AVCC = 1.8V to 5.5V, VSS = AVSS = 0V, TA = - 40C to + 85C)
Value
Parameter
H level input
voltage
(hysteresis
input)
L level input
voltage
(hysteresis
input)
H level
output voltage
L level
output voltage
Symbol
VIHS
VILS
VOH
VOL
Pin name
MD0, MD1
PE0, PE2,
PE3,
P46, P47,
P3A, P3B,
P3C, P3D,
P3E, P3F,
INITX
P0A, P0B,
P0C, P4C,
P60,
P80, P81,
P82
CMOS
hysteresis
input pins other
than the above
MD0, MD1
PE0, PE2,
PE3,
P46, P47,
INITX
CMOS
hysteresis
input pins other
than the above
Pxx
Pxx
Max
-
VCC× 0.8
-
VCC+ 0.3
V
-
VCC× 0.7
-
VSS+ 5.5
V
-
VCC× 0.7
-
VCC+ 0.3
V
-
VSS- 0.3
-
VCC× 0.2
V
-
VSS- 0.3
-
VCC× 0.3
V
VCC- 0.5
-
VCC
V
VSS
-
0.4
V
-5
-
+5
VCC ≥ 4.5 V,
IOH = - 4 mA
VCC < 4.5 V,
IOH = - 1 mA
VCC ≥ 4.5 V,
IOL = 4 mA
VCC < 4.5 V,
IOL = 2 mA
VCC = AVCC
= AVRH =
VSS = AVSS
= 0.0 V
-
-
+ 1.8
VCC ≥ 4.5 V
25
50
100
VCC 4.5 V
40
100
400
-
5
15
CEC0,
CEC1
Pull-up resistor
value
RPU
Pull-up pin
CIN
Typ
-
IIL
Other than
VCC, VSS,
AVCC, AVSS,
AVRH
Document Number: 002-05673 Rev.*C
Unit
Min
Input leak
current
Input
capacitance
Conditions
-
Remarks
5V tolerant
μA
kΩ
pF
Page 67 of 108
MB9AAA0N Series
12.3.3 LCD Characteristics
(VCC = 2.2V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
VV0 to VV3
Output voltage
(1/4 bias)
VV0 to VV3
Output voltage
(1/3 bias)
VV0 to VV3
Output voltage
(1/2 bias)
Symbol
VVV0
Pin
name
Value
Conditions
VV0
VVV1
VVV2
VVV3
VV1
VV2
VV3
VVV0
VV0
VVV1
VVV2
VVV3
VV1
VV2
VV3
VVV0
VV0
When using
internal dividing
register
When using
internal dividing
register
When using
internal dividing
register
Min
Typ
Max
0
-
VVV4 × 5%
VVV4 × 1/4 -10%
VVV4 × 1/2 -10%
VVV4 × 3/4 -10%
-
VVV4 × 1/4 +10%
VVV4 × 1/2 +10%
VVV4 × 3/4 +10%
Unit
V
0
-
VVV4 × 5%
VVV4 × 1/3 -10%
VVV4 × 2/3 -10%
VVV4 × 2/3 -10%
-
VVV4 × 1/3 +10%
VVV4 × 2/3 +10%
VVV4 × 2/3 +10%
0
-
VVV4 × 5%
VVV4 × 1/2 -10%
VVV4 × 1/2 -10%
VVV4 × 1/2 -10%
-
VVV4 × 1/2 +10%
VVV4 × 1/2 +10%
VVV4 × 1/2 +10%
V
-
15
35
μA
-
130
250
μA
-
18
45
μA
-
170
350
μA
-
27
75
μA
-
250
500
μA
V
VVV1
VVV2
VVV3
VV1
VV2
VV3
IR100K
VV4
IR10K
VV4
IR100K
VV4
IR10K
VV4
IR100K
VV4
IR10K
VV4
VV4
Static current
Ioff_vv4
VV4
When LCD stops
-
-
0.5
μA
VV0
Output Voltage
in using
external
resistor
VVV0E
VV0
IOL=1mA
-
-
1.0
V
VV4
Active current
(1/4 bias)
VV4
Active current
(1/3 bias)
VV4
Active current
(1/2 bias)
Document Number: 002-05673 Rev.*C
When using
100 kΩ internal
dividing register
When using
10 kΩ internal
dividing register
When using
100 kΩ internal
dividing register
When using
10 kΩ internal
dividing register
When using
100 kΩ internal
dividing register
When using
10 kΩ internal
dividing register
Remarks
Page 68 of 108
MB9AAA0N Series
12.4 AC Characteristics
12.4.1 Main Clock Input Characteristics
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Pin
name
Symbol
Conditions
tCYLH
Input clock pulse
width
-
Input clock rising
time and falling time
Internal operating
clock*1
cycle time
tCF,
tCR
fCM
fCC
fCP0
fCP1
fCP2
tCYCC
tCYCP0
tCYCP1
tCYCP2
Remarks
Max
4
4
4
4
50
62.5
20
4
20
16
250
250
MHz
MHz
MHz
MHz
ns
ns
45
55
%
-
-
5
ns
-
-
-
20
20
20
20
20
MHz
MHz
MHz
MHz
MHz
When using external
clock
When using external
clock
Master clock
Base clock (HCLK/FCLK)
APB0 bus clock*2
APB1 bus clock*2
APB2 bus clock*2
-
-
50
-
ns
Base clock (HCLK/FCLK)
-
-
50
-
ns
APB0 bus clock*2
-
-
50
-
ns
APB1 bus clock*2
-
-
50
-
ns
APB2 bus clock*2
VCC 2.0 V
VCC ≥ 4.5 V
fCH
Input clock cycle
Unit
Min
VCC ≥ 2.0 V
Input frequency
Value
X0,
X1
VCC 4.5 V
VCC ≥ 4.5 V
VCC 4.5 V
PWH/tCYLH,
PWL/tCYLH
When crystal oscillator is
connected
When using external
clock
When using external
clock
*1: For more information about each internal operating clock, see Chapter 2-1: Clock in FM3 Family Peripheral Manual.
*2: For about each APB bus which each peripheral is connected to, see Block Diagram in this data sheet.
X0
Document Number: 002-05673 Rev.*C
Page 69 of 108
MB9AAA0N Series
12.4.2 Sub Clock Input Characteristics
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Input frequency
fCL
Input clock cycle
tCYLL
Input clock pulse
width
-
Pin
name
X0A,
X1A
Conditions
Value
Unit
Remarks
Min
Typ
Max
-
-
32.768
-
kHz
-
32
-
100
kHz
When crystal oscillator is
connected
When using external clock
-
10
-
31.25
μs
When using external clock
PWH/tCYLL,
PWL/tCYLL
45
-
55
%
When using external clock
X0A
12.4.3 Built-in CR Oscillation Characteristics
Built-in High-speed CR
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Conditions
VCC ≥
2.2 V
Clock frequency
fCRH
VCC
2.2 V
Value
Min
Typ
Max
TA = + 25C
3.92
4
4.08
TA = - 40C to + 85C
3.8
4
4.2
TA = - 40C to + 85C
2.3
-
7.03
TA = + 25C
3.4
4
4.6
TA = - 40C to + 85C
3.16
4
4.84
TA = - 40C to + 85C
2.3
-
7.03
Unit
MHz
Remarks
When trimming*1
When not trimming
MHz
When trimming*1
When not trimming
Frequency
tCRWT
10
μs
*2
stabilization time
*1: In the case of using the values in CR trimming area of Flash memory at shipment for frequency trimming.
*2: This is the time to stabilize the frequency of High-speed CR clock after setting trimming value.
This period is able to use High-speed CR clock as source clock.
Built-in Low-speed CR
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Clock frequency
Symbol
fCRL
Conditions
-
Document Number: 002-05673 Rev.*C
Value
Min
Typ
Max
50
100
150
Unit
Remarks
kHz
Page 70 of 108
MB9AAA0N Series
12.4.4 Operating Conditions of Main PLL (In the case of using main clock for input of PLL)
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
PLL oscillation stabilization wait time*1
(LOCK UP time)
PLL input clock frequency
PLL multiplication rate
PLL macro oscillation clock frequency
Main PLL clock frequency*2
Symbol
Value
Unit
Remarks
Min
Typ
Max
tLOCK
200
-
-
μs
fPLLI
fPLLO
fCLKPLL
4
1
10
-
-
20
5
20
20
MHz
multiplier
MHz
MHz
*1: Time from when the PLL starts operating until the oscillation stabilizes.
*2: For more information about Main PLL clock (CLKPLL), see Chapter 2-1: Clock in FM3 Family Peripheral Manual.
12.4.5 Operating Conditions of Main PLL (In the case of using the built-in High-speed CR for the input clock of the Main
PLL)
(VCC = 2.2V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
PLL oscillation stabilization wait time*1
(LOCK UP time)
PLL input clock frequency
PLL multiplication rate
PLL macro oscillation clock frequency
Main PLL clock frequency*2
Symbol
Value
Unit
Min
Typ
Max
tLOCK
200
-
-
μs
fPLLI
fPLLO
fCLKPLL
3.8
3
11.4
-
4
-
4.2
4
16.8
16.8
MHz
multiplier
MHz
MHz
Remarks
*1: Time from when the PLL starts operating until the oscillation stabilizes.
*2: For more information about Main PLL clock (CLKPLL), see Chapter 2-1: Clock in FM3 Family Peripheral Manual.
Note:
−
Make sure to input to the Main PLL source clock, the High-speed CR clock (CLKHC) that the frequency has been trimmed.
When setting PLL multiple rate, please take the accuracy of the built-in High-speed CR clock into account and prevent the
master clock from exceeding the maximum frequency.
Main PLL connection
Main clock (CLKMO)
High-speed CR clock (CLKHC)
K
divider
PLL input
clock
PLL macro
oscillation clock
Main
PLL
M
divider
Main PLL
clock
(CLKPLL)
N
divider
Document Number: 002-05673 Rev.*C
Page 71 of 108
MB9AAA0N Series
12.4.6 Reset Input Characteristics
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Pin
name
Symbol
Reset input time
tINITX
INITX
Conditions
-
Value
Unit
Min
Max
500
-
ns
1.5
-
ms
1.5
-
ms
Remarks
When RTC mode or Stop
mode
When Deep Standby mode
12.4.7 Power-on Reset Timing
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Power supply rising time
dV/dt
Power supply shut down time
tOFF
Reset release voltage
VDETH
Value
Pin
name
VCC
Unit
Remarks
Min
Typ
Max
0.1
-
-
V/ms
1
-
-
ms
1.44
1.60
1.76
V
When voltage rises
1.39
1.55
1.71
V
When voltage drops
Reset detection voltage
VDETL
Time until releasing
Power-on reset
tPRT
0.46
-
11.4
ms
dV/dt ≥ 0.1mV/μs
Reset detection delay time
tOFFD
-
-
0.4
ms
dV/dt ≥ -0.04mV/μs
VDETH
VDETL
VCC
dV
0.2V
dt
0.2V
tOFF
tPRT
Internal reset
CPU Operation
Document Number: 002-05673 Rev.*C
Reset active
tOFFD
Release
Reset active
start
Page 72 of 108
MB9AAA0N Series
12.4.8 Base Timer Input Timing
Timer input timing
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Input pulse width
Symbol
Pin name
Conditions
TIOAn/TIOBn
(when using as
ECK, TIN)
tTIWH,
tTIWL
-
tTIWH
Value
Min
Max
2tCYCP
-
Unit
Remarks
ns
tTIWL
ECK
VIHS
TIN
VIHS
VILS
VILS
Trigger input timing
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Input pulse width
Symbol
tTRGH,
tTRGL
Pin name
Conditions
TIOAn/TIOBn
(when using
as TGIN)
-
tTRGH
TGIN
VIHS
Value
Min
Max
2tCYCP
-
Unit
Remarks
ns
tTRGL
VIHS
VILS
VILS
Note:
−
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which the Base Timer is connected to, see Block Diagram in this data sheet.
Document Number: 002-05673 Rev.*C
Page 73 of 108
MB9AAA0N Series
12.4.9 CSIO/UART Timing
CSIO (SPI = 0, SCINV = 0)
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Baud rate
Serial clock
cycle time
Symbol
Pin
name
Conditions
-
-
-
tSCYC
SCK SOT
delay time
tSLOVI
SIN SCK
setup time
tIVSHI
SCK SIN
hold time
Serial clock L
pulse width
Serial clock H
pulse width
tSHIXI
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
VCC ≥ 4.5 V
Unit
Max
5
Min
-
Max
5
Min
-
Max
5
Mbps
4tCYCP
-
4tCYCP
-
4tCYCP
-
ns
-40
+40
-30
+30
-20
+20
ns
75
-
50
-
30
-
ns
0
-
0
-
0
-
ns
Master mode
tSLSH
SCKx
2tCYCP -10
-
2tCYCP -10
-
2tCYCP -10
-
ns
tSHSL
SCKx
tCYCP + 10
-
tCYCP + 10
-
tCYCP + 10
-
ns
-
75
-
50
-
30
ns
10
-
10
-
10
-
ns
20
-
20
-
20
-
ns
-
5
5
-
5
5
-
5
5
ns
ns
SCK SOT
delay time
tSLOVE
SIN SCK
setup time
tIVSHE
SCK SIN
hold time
SCK falling time
SCK rising time
SCKx
2.7 V ≤VCC 4.5 V
VCC 2.7 V
Min
-
tSHIXE
tF
tR
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
SCKx
SCKx
Slave mode
Notes:
−
The above characteristics apply to clock synchronous mode.
−
−
−
tCYCP indicates the APB bus clock cycle time.
−
When the external load capacitance CL = 50 pF.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in this data sheet.
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
Document Number: 002-05673 Rev.*C
Page 74 of 108
MB9AAA0N Series
tSCYC
VOH
SCK
VOH
VOL
tSHOVI
VOH
SOT
VOL
tIVSLI
VIH
SIN
tSLIXI
VIH
VIL
VIL
Master mode
tSHSL
SCK
tSLSH
VIH
VIH
VIL
tR
tF
VIL
VIL
tSHOVE
SOT
VOH
VOL
tIVSLE
SIN
VIH
VIL
tSLIXE
VIH
VIL
Slave mode
Document Number: 002-05673 Rev.*C
Page 75 of 108
MB9AAA0N Series
CSIO (SPI = 0, SCINV = 1)
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Baud rate
Serial clock
cycle time
Symbol
tSCYC
tSHOVI
SIN SCK
setup time
tIVSLI
tSLIXI
-
-
SCKx
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
Master
mode
VCC 2.7 V
2.7 V ≤
VCC 4.5 V
Min
Max
5
Min
-
Max
5
4tCYCP
-
4tCYCP
-40
+40
75
VCC ≥ 4.5 V
Unit
Min
-
Max
5
Mbps
-
4tCYCP
-
ns
-30
+30
-20
+20
ns
-
50
-
30
-
ns
0
-
0
-
0
-
ns
tSLSH
SCKx
2tCYCP - 10
-
2tCYCP - 10
-
2tCYCP - 10
-
ns
tSHSL
SCKx
tCYCP + 10
-
tCYCP + 10
-
tCYCP + 10
-
ns
-
75
-
50
-
30
ns
10
-
10
-
10
-
ns
20
-
20
-
20
-
ns
-
5
5
-
5
5
-
5
5
ns
ns
SCK SOT
delay time
tSHOVE
SIN SCK
setup time
tIVSLE
SCK SIN
hold time
SCK falling time
SCK rising time
Conditions
-
SCK SOT
delay time
SCK SIN
hold time
Serial clock L
pulse width
Serial clock H
pulse width
Pin
name
tSLIXE
tF
tR
SCKx,
SOTx
SCKx,
SINx
SCKx,
SINx
SCKx
SCKx
Slave mode
Notes:
−
The above characteristics apply to clock synchronous mode.
−
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in this data sheet.
−
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
−
When the external load capacitance CL = 50 pF.
Document Number: 002-05673 Rev.*C
Page 76 of 108
MB9AAA0N Series
tSCYC
VOH
SCK
VOH
VOL
tSHOVI
VOH
SOT
VOL
tIVSLI
VIH
SIN
tSLIXI
VIH
VIL
VIL
Master mode
tSHSL
SCK
tSLSH
VIH
VIH
VIL
tR
tF
VIL
VIL
tSHOVE
SOT
VOH
VOL
tIVSLE
SIN
VIH
VIL
tSLIXE
VIH
VIL
Slave mode
Document Number: 002-05673 Rev.*C
Page 77 of 108
MB9AAA0N Series
CSIO (SPI = 1, SCINV = 0)
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Baud rate
Serial clock
cycle time
Symbol
tSCYC
SCK SOT
delay time
tSHOVI
SIN SCK
setup time
tIVSLI
SCK SIN
hold time
tSLIXI
SOT SCK
delay time
tSOVLI
Serial clock L
pulse width
Serial clock H
pulse width
Pin
name
Conditions
-
-
SCKx
SCKx
,
SOTx
SCKx
,
SINx
SCKx
,
SINx
SCKx
,
SOTx
Master
mode
2.7 V ≤
VCC 4.5 V
Min
Max
5
VCC 2.7 V
Min
-
Max
5
4tCYCP
-
4tCYCP
-40
+40
75
VCC ≥ 4.5 V
Unit
Min
-
Max
5
Mbps
-
4tCYCP
-
ns
-30
+30
-20
+20
ns
-
50
-
30
-
ns
0
-
0
-
0
-
ns
2tCYCP - 30
-
2tCYCP - 30
-
2tCYCP - 30
-
ns
tSLSH
SCKx
2tCYCP - 10
-
2tCYCP - 10
-
2tCYCP - 10
-
ns
tSHSL
SCKx
tCYCP + 10
-
tCYCP + 10
-
tCYCP + 10
-
ns
-
75
-
50
-
30
ns
10
-
10
-
10
-
ns
20
-
20
-
20
-
ns
-
5
5
-
5
5
-
5
5
ns
ns
SCK SOT
delay time
tSHOVE
SIN SCK
setup time
tIVSLE
SCK SIN
hold time
tSLIXE
SCK falling time
SCK rising time
tF
tR
SCKx
,
SOTx
SCKx
,
SINx
SCKx
,
SINx
SCKx
SCKx
Slave mode
Notes:
−
The above characteristics apply to clock synchronous mode.
−
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in this data sheet.
−
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
−
When the external load capacitance CL = 50 pF.
Document Number: 002-05673 Rev.*C
Page 78 of 108
MB9AAA0N Series
tSCYC
VOH
SCK
VOL
SOT
VOH
VOL
VOH
VOL
tIVSLI
tSLIXI
VIH
VIL
SIN
VOL
tSHOVI
tSOVLI
VIH
VIL
Master mode
tSLSH
VIH
SCK
tR
VOH
VOL
tIVSLE
SIN
VIL
tF
*
SOT
VIL
tSHSL
VIH
VIH
tSHOVE
VOH
VOL
tSLIXE
VIH
VIL
VIH
VIL
Slave mode
*: Changes when writing to TDR register
Document Number: 002-05673 Rev.*C
Page 79 of 108
MB9AAA0N Series
CSIO (SPI = 1, SCINV = 1)
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Baud rate
-
Serial clock
cycle time
tSCYC
SCK SOT
delay time
tSLOVI
SIN SCK
setup time
tIVSHI
SCK SIN
hold time
tSHIXI
SOT SCK
delay time
tSOVHI
Serial clock L
pulse width
Serial clock H
pulse width
Pin
name
Conditions
-
-
SCKx
SCKx
,
SOTx
SCKx
,
SINx
SCKx
,
SINx
SCKx
,
SOTx
Master
mode
VCC 2.7 V
2.7 V ≤
VCC 4.5 V
VCC ≥ 4.5 V
Unit
Min
Max
Min
Max
Min
Max
-
5
-
5
-
5
Mbps
4tCYCP
-
4tCYCP
-
4tCYCP
-
ns
-40
+40
-30
+30
-20
+20
ns
75
-
50
-
30
-
ns
0
-
0
-
0
-
ns
2tCYCP - 30
-
2tCYCP - 30
-
2tCYCP - 30
-
ns
tSLSH
SCKx
2tCYCP - 10
-
2tCYCP - 10
-
2tCYCP - 10
-
ns
tSHSL
SCKx
tCYCP + 10
-
tCYCP + 10
-
tCYCP + 10
-
ns
-
75
-
50
-
30
ns
10
-
10
-
10
-
ns
20
-
20
-
20
-
ns
-
5
5
-
5
5
-
5
5
ns
ns
SCK SOT
delay time
tSLOVE
SIN SCK
setup time
tIVSHE
SCK SIN
hold time
tSHIXE
SCK falling time
SCK rising time
tF
tR
SCKx
,
SOTx
SCKx
,
SINx
SCKx
,
SINx
SCKx
SCKx
Slave mode
Notes:
−
The above characteristics apply to clock synchronous mode.
−
tCYCP indicates the APB bus clock cycle time.
About the APB bus number which Multi-function serial is connected to, see Block Diagram in this data sheet.
−
These characteristics only guarantee the same relocate port number.
For example, the combination of SCKx_0 and SOTx_1 is not guaranteed.
−
When the external load capacitance CL = 50 pF.
Document Number: 002-05673 Rev.*C
Page 80 of 108
MB9AAA0N Series
tSCYC
VOH
SCK
tSOVHI
SOT
VOH
VOL
tSLOVI
VOH
VOL
VOH
VOL
tSHIXI
tIVSHI
VIH
VIL
SIN
VIH
VIL
Master mode
tR
SCK
tF
tSHSL
VIH
VIH
VIL
tSLSH
VIL
VIL
tSLOVE
SOT
VOH
VOL
VOH
VOL
tIVSHE
tSHIXE
VIH
VIL
SIN
VIH
VIL
Slave mode
UART external clock input (EXT = 1)
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Serial clock L pulse width
Serial clock H pulse width
SCK falling time
SCK rising time
Symbol
tSLSH
tSHSL
tF
tR
Conditions
CL = 50 pF
Max
tCYCP + 10
tCYCP + 10
-
5
5
Unit
Remarks
ns
ns
ns
ns
tF
tR
tSHSL
SCK
V IL
Document Number: 002-05673 Rev.*C
Value
Min
V IH
tSLSH
V IH
V IL
V IL
V IH
Page 81 of 108
MB9AAA0N Series
12.4.10 External Input Timing
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Pin name
Value
Min
Conditions
Max
Unit
ADTG
Input pulse width
tINH,
tINL
A/D converter trigger input
2tCYCP*1
-
ns
INTxx,
NMIX
*2
*3
2tCYCP*1
2tCYCP*1
2tCYCP + 100*1
500
-
ns
ns
ns
ns
WKUPx
*4
500
-
ns
FRCKx
ICxx
DTTIxX
IGTRG
Remarks
-
Free-run timer input clock
Input capture
Waveform generator
PPG IGBT mode
External interrupt,
NMI
Deep standby wake up
*1: tCYCP indicates the APB bus clock cycle time.
About the APB bus number which the A/D converter, Multi-function Timer, PPG, External interrupt, Deep Standby mode
Controller are connected to, see Block Diagram in this data sheet.
*2: When in Run mode, in Sleep mode.
*3: When in Timer mode, in RTC mode, in Stop mode.
*4: When in Deep Standby RTC mode, in Deep Standby Stop mode.
Document Number: 002-05673 Rev.*C
Page 82 of 108
MB9AAA0N Series
12.4.11 I2C Timing
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
SCL clock frequency
(Repeated) START condition
hold time
SDA SCL
SCL clock L width
SCL clock H width
(Repeated) START condition
setup time
SCL SDA
Data hold time
SCL SDA
Data setup time
SDA SCL
STOP condition setup time
SCL SDA
Bus free time between
STOP condition and
START condition
Noise filter
Symbol
Conditions
fSCL
Standard-mode
Min
Max
0
100
Fast-mode
Min
Max
0
400
Unit
kHz
tHDSTA
4.0
-
0.6
-
μs
tLOW
tHIGH
4.7
4.0
-
1.3
0.6
-
μs
μs
4.7
-
0.6
-
μs
0
3.45*2
0
0.9*3
μs
tSUDAT
250
-
100
-
ns
tSUSTO
4.0
-
0.6
-
μs
tBUF
4.7
-
1.3
-
μs
2 tCYCP*4
-
2 tCYCP*4
-
ns
tSUSTA
tHDDAT
tSP
CL = 50 pF,
R = (VP/IOL)*1
-
Remarks
*1: R and CL represent the pull-up resistor and load capacitance of the SCL and SDA lines, respectively.
VP indicates the power supply voltage of the pull-up resistor and IOL indicates VOL guaranteed current.
*2: The maximum tHDDAT must satisfy that it does not extend at least L period (tLOW) of device's SCL signal.
*3: A Fast-mode I2C bus device can be used on a Standard-mode I2C bus system as long as the device satisfies the
requirement of tSUDAT ≥ 250 ns.
*4: tCYCP is the APB bus clock cycle time.
About the APB bus number which I2C is connected to, see Block Diagram in this data sheet.
To use Standard-mode, set the APB bus clock at 2 MHz or more.
To use Fast-mode, set the APB bus clock at 8 MHz or more.
SDA
SCL
Document Number: 002-05673 Rev.*C
Page 83 of 108
MB9AAA0N Series
12.4.12 JTAG Timing
(VCC = 1.8V to 5.5V, VSS = 0V, TA = - 40C to + 85C)
Parameter
Symbol
Pin name
TMS,TDI setup
time
tJTAGS
TCK,
TMS, TDI
TMS,TDI hold
time
tJTAGH
TCK,
TMS, TDI
tJTAGD
TCK,
TDO
TDO delay time
Conditions
Value
Unit
Min
Max
15
-
ns
VCC 4.5 V
15
-
ns
VCC ≥ 4.5 V
-
30
2.7 V ≤ VCC 4.5 V
-
45
VCC 2.7 V
-
60
VCC ≥ 4.5 V
VCC 4.5 V
VCC ≥ 4.5 V
Remarks
ns
Note:
−
When the external load capacitance CL = 50 pF.
TCK
TMS/TDI
TDO
Document Number: 002-05673 Rev.*C
Page 84 of 108
MB9AAA0N Series
12.5 12-bit A/D Converter
Electrical Characteristics for the A/D Converter
(VCC = AVCC = 1.8V to 5.5V, VSS = AVSS = 0V, TA = - 40C to + 85C)
Symbol
Pin
name
Resolution
-
-
Integral Nonlinearity
INL
-
Differential Nonlinearity
DNL
-
Zero transition voltage
Full-scale transition voltage
VZT
VFST
ANxx
ANxx
Conversion time*1
-
-
Sampling time*2
tS
-
Compare clock cycle*3
tCCK
-
tSTT
-
CAIN
-
Parameter
Period of operation enable
state transitions
Analog input capacity
Value
Typ
± 2.5
± 3.5
± 1.8
± 2.7
±9
AVRH ± 9
Max
12
± 3.0
± 4.0
± 1.9
± 2.9
± 20
AVRH ± 20
-
-
μs
-
10
μs
-
1000
ns
-
-
1
μs
-
-
pF
LSB
Min
1.0
4.0
0.3
1.2
50
200
Unit
bit
LSB
LSB
LSB
LSB
mV
mV
Analog input resistor
RAIN
-
-
-
Interchannel disparity
Analog port input leak
current
Analog input voltage
-
-
-
-
15
0.9
1.6
4.0
4
-
ANxx
-
-
0.3
μA
-
ANxx
-
AVRH
V
Reference voltage
-
AVRH
AVSS
2.7
AVCC
-
AVCC
V
kΩ
Remarks
AVCC ≥ 2.7 V
AVCC < 2.7 V
AVCC ≥ 2.7 V
AVCC < 2.7 V
AVCC ≥ 2.7 V
AVCC < 2.7 V
AVCC ≥ 2.7 V
AVCC < 2.7 V
AVCC ≥ 2.7 V
AVCC < 2.7 V
AVCC ≥ 4.5 V
2.7 V ≤ AVCC < 4.5 V
AVCC < 2.7 V
AVCC ≥ 2.7 V
AVCC < 2.7 V
*1: The conversion time is the value of sampling time (tS) + compare time (tC).
The condition of the minimum conversion time is the following.
AVCC ≥ 2.7 V, HCLK=20 MHz
sampling time: 0.3 μs, compare time: 0.7 μs
AVCC < 2.7 V, HCLK=20 MHz
sampling time: 1.2 μs, compare time: 2.8 μs
Ensure that it satisfies the value of the sampling time (tS) and compare clock cycle (tCCK).
For setting*4 of the sampling time and compare clock cycle, see Chapter 1-1: A/D Converter in FM3 Family Peripheral Manual
Analog Macro Part.
The register settings of the A/D Converter are reflected in the operation according to the APB bus clock timing.
For the number of the APB bus to which the A/D Converter is connected, see Block Diagram.
The Base clock (HCLK) is used to generate the sampling time and the compare clock cycle.
*2: A necessary sampling time changes by external impedance.
Ensure to set the sampling time to satisfy (Equation 1).
*3: The compare time (tC) is the value of (Equation 2).
Document Number: 002-05673 Rev.*C
Page 85 of 108
MB9AAA0N Series
ANxx
Analog input pin
REXT
Analog signal
source
Comparator
RAIN
CAIN
(Equation 1) tS ≥ ( RAIN + REXT ) × CAIN × 9
tS:
Sampling time
RAIN:
Input resistor of A/D = 0.9 kΩ at 4.5 V ≤ AVCC ≤ 5.5 V
Input resistor of A/D = 1.6 kΩ at 2.7 V ≤ AVCC < 4.5 V
Input resistor of A/D = 4.0 kΩ at 1.8 V ≤ AVCC < 2.7 V
CAIN:
Input capacity of A/D = 15 pF at 1.8 V ≤ AVCC ≤ 5.5 V
REXT:
Output impedance of external circuit
(Equation 2) tC = tCCK × 14
tC:
Compare time
tCCK:
Compare clock cycle
Document Number: 002-05673 Rev.*C
Page 86 of 108
MB9AAA0N Series
Definition of 12-bit A/D Converter Terms
• Resolution:
• Integral Nonlinearity:
• Differential Nonlinearity:
Analog variation that is recognized by an A/D converter.
Deviation of the line between the zero-transition point
(0b000000000000←→0b000000000001) and the full-scale transition point
(0b111111111110←→0b111111111111) from the actual conversion characteristics.
Deviation from the ideal value of the input voltage that is required to change
the output code by 1 LSB.
Integral Nonlinearity
Differential Nonlinearity
0xFFF
Actual conversion
characteristics
0xFFE
0x(N+1)
{1 LSB(N-1) + VZT}
VFST
VNT
0x004
(Actuallymeasured
value)
(Actually-measured
value)
0x003
Digital output
Digital output
0xFFD
0xN
Actual conversion
characteristics
Ideal characteristics
V(N+1)T
0x(N-1)
(Actually-measured
value)
Actual conversion
characteristics
Ideal characteristics
0x002
VNT
(Actually-measured
value)
0x(N-2)
0x001
VZT (Actually-measured value)
AVSS
Actual conversion characteristics
AVRH
AVSS
AVRH
Analog input
Integral Nonlinearity of digital output N =
Differential Nonlinearity of digital output N =
1LSB =
N:
VZT:
VFST:
VNT:
Analog input
VNT - {1LSB × (N - 1) + VZT}
1LSB
V(N + 1) T - VNT
1LSB
[LSB]
- 1 [LSB]
VFST – VZT
4094
A/D converter digital output value.
Voltage at which the digital output changes from 0x000 to 0x001.
Voltage at which the digital output changes from 0xFFE to 0xFFF.
Voltage at which the digital output changes from 0x(N − 1) to 0xN.
Document Number: 002-05673 Rev.*C
Page 87 of 108
MB9AAA0N Series
12.6 10-bit D/A Converter
Electrical Characteristics for the D/A Converter
(VCC = AVCC = 1.8V to 5.5V, VSS = AVSS = 0V, TA = - 40C to + 85C)
Value
Parameter
Resolution
Symbol
Integral Nonlinearity
Differential Nonlinearity
tC20
tC100
INL
DNL
Output Voltage offset
VOFF
Analog output
impedance
RO
Output undefined
period
tR
Conversion time
Pin name
DAx
Unit
Min
Typ
Max
0.37
1.87
-4.0
-0.9
-50.0
2.45
5.0
0.53
2.67
3.50
9.0
10
0.69
3.47
+4.0
+0.9
10.0
+5.5
4.55
-
bit
μs
μs
LSB
LSB
mV
mV
kΩ
MΩ
-
-
250
ns
Remarks
Load 20 pF
Load 100 pF
*
*
Code is 0x000
Code is 0x3FF
D/A operation
D/A stop
*: No-load
Document Number: 002-05673 Rev.*C
Page 88 of 108
MB9AAA0N Series
12.7 Low-Voltage Detection Characteristics
12.7.1 Low-Voltage Detection Reset
(TA = - 40C to + 85C)
Value
Parameter
Symbol
Conditions
Unit
Min
Typ
Max
1.43
1.53
1.80
1.90
1.53
1.63
1.93
2.03
1.63
1.73
2.06
2.16
V
V
V
V
Detected voltage
Released voltage
Detected voltage
Released voltage
VDLR
VDHR
VDLR
VDHR
LVD stabilization wait
time
tLVDRW
-
-
-
633 × tCYCP *
μs
Detection delay time
tLVDRD
dV/dt ≥ -4mV/μs
-
-
60
μs
SVHR = 0001
SVHR = 0100
Remarks
When voltage drops
When voltage rises
When voltage drops
When voltage rises
*: tCYCP indicates the APB2 bus clock cycle time.
Document Number: 002-05673 Rev.*C
Page 89 of 108
MB9AAA0N Series
12.7.2 Interrupt of Low-Voltage Detection
Normal mode
(TA = - 40C to + 85C)
Parameter
Symbol
Conditions
Value
Unit
Min
Typ
Max
1.87
1.97
1.96
2.06
2.05
2.15
2.15
2.25
2.24
2.34
2.33
2.43
2.43
2.53
2.61
2.71
2.80
2.90
2.99
3.09
3.36
3.46
3.45
3.55
3.73
3.83
3.83
3.93
3.92
4.02
2.00
2.10
2.10
2.20
2.20
2.30
2.30
2.40
2.40
2.50
2.50
2.60
2.60
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.60
3.70
3.70
3.80
4.00
4.10
4.10
4.20
4.20
4.30
2.13
2.23
2.24
2.34
2.35
2.45
2.45
2.55
2.56
2.66
2.67
2.77
2.77
2.87
2.99
3.09
3.20
3.30
3.41
3.51
3.84
3.94
3.95
4.05
4.27
4.37
4.37
4.47
4.48
4.58
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
VDLI
VDHI
LVD stabilization
wait time
tLVDIW
-
-
-
633 × tCYCP *
μs
Detection delay time
tLVDID
dV/dt ≥ - 4mV/μs
-
-
60
μs
SVHI = 0000
SVHI = 0001
SVHI = 0010
SVHI = 0011
SVHI = 0100
SVHI = 0101
SVHI = 0110
SVHI = 0111
SVHI = 1000
SVHI = 1001
SVHI = 1010
SVHI = 1011
SVHI = 1100
SVHI = 1101
SVHI = 1110
Remarks
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
*: tCYCP indicates the APB2 bus clock cycle time.
Document Number: 002-05673 Rev.*C
Page 90 of 108
MB9AAA0N Series
Low-power mode
(TA = - 40C to + 85C)
Parameter
Symbol
Conditions
Min
1.80
1.90
1.89
1.99
1.98
2.08
2.07
2.17
2.16
2.26
2.25
2.35
2.34
2.44
2.52
2.62
2.70
2.80
2.88
2.98
3.24
3.34
3.33
3.43
3.60
3.70
3.69
3.79
3.78
3.88
Value
Typ
2.00
2.10
2.10
2.20
2.20
2.30
2.30
2.40
2.40
2.50
2.50
2.60
2.60
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.60
3.70
3.70
3.80
4.00
4.10
4.10
4.20
4.20
4.30
Max
2.20
2.30
2.31
2.41
2.42
2.52
2.53
2.63
2.64
2.74
2.75
2.85
2.86
2.96
3.08
3.18
3.30
3.40
3.52
3.62
3.96
4.06
4.07
4.17
4.40
4.50
4.51
4.61
4.62
4.72
Unit
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
Detected voltage
Released voltage
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
VDLIL
VDHIL
LVD stabilization
wait time
tLVDILW
-
-
-
8039 × tCYCP *
μs
Detection delay time
tLVDILD
dV/dt ≥ - 0.4mV/μs
-
-
800
μs
SVHI = 0000
SVHI = 0001
SVHI = 0010
SVHI = 0011
SVHI = 0100
SVHI = 0101
SVHI = 0110
SVHI = 0111
SVHI = 1000
SVHI = 1001
SVHI = 1010
SVHI = 1011
SVHI = 1100
SVHI = 1101
SVHI = 1110
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Remarks
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
When voltage drops
When voltage rises
*: tCYCP indicates the APB2 bus clock cycle time.
Document Number: 002-05673 Rev.*C
Page 91 of 108
MB9AAA0N Series
12.8 Flash Memory Write/Erase Characteristics
12.8.1 Write / Erase time
(VCC = 2.0V to 5.5V, TA = - 40C to + 85C)
Parameter
Value
Typ*
1.6
0.4
Max*
7.5
2.1
Half word (16-bit)
write time
25
Chip erase time
4
Sector erase
time
Large Sector
Small Sector
Unit
Remarks
s
Includes write time prior to internal erase
400
μs
Not including system-level overhead time.
19.2
s
Includes write time prior to internal erase
*: The typical value is immediately after shipment, the maximam value is guarantee value under 100,000 cycle of erase/write.
12.8.2 Write cycles and data hold time
Erase/write cycles (cycle)
Data hold time (year)
1,000
20 *
10,000
100,000
10 *
5*
Remarks
*: At average + 85C
Document Number: 002-05673 Rev.*C
Page 92 of 108
MB9AAA0N Series
12.9 Return Time from Low-Power Consumption Mode
12.9.1 Return Factor: Interrupt/WKUP
The return time from Low-Power consumption mode is indicated as follows. It is from receiving the return factor to starting the
program operation.
Return Count Time
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Value
Parameter
Symbol
Typ
Sleep mode
High-speed CR Timer mode,
Main Timer mode,
PLL Timer mode
Max*
40
80
μs
630
1260
μs
630
1260
μs
1083
2100
μs
1099
2127
μs
tICNT
Sub Timer mode
RTC mode,
Stop mode
Deep Standby RTC mode
Deep Standby Stop mode
Remarks
μs
tCYCC
Low-speed CR Timer mode
Unit
*: The maximum value depends on the accuracy of built-in CR.
Operation example of return from Low-Power consumption mode (by external interrupt*)
External
interrupt
Interrupt factor
accept
Active
tICNT
CPU
Operation
Interrupt factor
clear by CPU
Start
*: External interrupt is set to detecting fall edge.
Document Number: 002-05673 Rev.*C
Page 93 of 108
MB9AAA0N Series
Operation example of return from Low-Power consumption mode (by internal resource interrupt*)
Internal
resource
interrupt
Interrupt factor
accept
Active
tICNT
CPU
Operation
Interrupt factor
clear by CPU
Start
*: Internal resource interrupt is not included in return factor by the kind of Low-Power consumption mode.
Notes:
−
The return factor is different in each Low-Power consumption modes.
See Chapter 6: Low Power Consumption Mode and Operations of Standby Modes in FM3 Family
Peripheral Manual.
−
When interrupt recoveries, the operation mode that CPU recoveries depend on the state before
the Low-Power consumption mode transition. See Chapter 6: Low Power Consumption Mode in
FM3 Family Peripheral Manual.
Document Number: 002-05673 Rev.*C
Page 94 of 108
MB9AAA0N Series
12.9.2 Return Factor: Reset
The return time from Low-Power consumption mode is indicated as follows. It is from releasing reset to starting the program
operation.
Return Count Time
(VCC = 1.65V to 3.6V, VSS = 0V, TA = - 40°C to + 85°C)
Parameter
Symbol
Value
Unit
Typ
359
Max*
647
359
647
μs
929
1787
μs
Sub Timer mode
929
1787
μs
RTC/Stop mode
1099
2127
μs
Deep Standby RTC mode
Deep Standby Stop mode
1099
2127
μs
Sleep mode
High-speed CR Timer mode,
Main Timer mode,
PLL Timer mode
Low-speed CR Timer mode
tRCNT
Remarks
μs
*: The maximum value depends on the accuracy of built-in CR.
Operation example of return from Low-Power consumption mode (by INITX)
INITX
Internal reset
Reset active
Release
tRCNT
CPU
Operation
Document Number: 002-05673 Rev.*C
Start
Page 95 of 108
MB9AAA0N Series
Operation example of return from low power consumption mode (by internal resource reset*)
Internal
resource
reset
Internal reset
Reset active
Release
tRCNT
CPU
Operation
Start
*: Internal resource reset is not included in return factor by the kind of Low-Power consumption mode.
Notes:
−
The return factor is different in each Low-Power consumption modes.
See Chapter 6: Low Power Consumption Mode and Operations of Standby Modes in FM3 Family
Peripheral Manual.
−
When interrupt recoveries, the operation mode that CPU recoveries depend on the state before
the Low-Power consumption mode transition. See Chapter 6: Low Power Consumption Mode in
FM3 Family Peripheral Manual.
−
The time during the power-on reset/low-voltage detection reset is excluded. See (6) Power-on
Reset Timing in 4. AC Characteristics in Electrical Characteristics for the detail on the time during
the power-on reset/low-voltage detection reset.
−
When in recovery from reset, CPU changes to the High-speed CR Run mode. When using the
main clock or the PLL clock, it is necessary to add the main clock oscillation stabilization wait time
or the Main PLL clock stabilization wait time.
−
The internal resource reset means the watchdog reset and the CSV reset.
Document Number: 002-05673 Rev.*C
Page 96 of 108
MB9AAA0N Series
13. Ordering Information
Part number
On-chip
Flash
memory
On-chip
SRAM
MB9AFAA1LPMC1-G-SNE2
64 Kbyte
12 Kbyte
MB9AFAA2LPMC1-G-UNE2
128 Kbyte
16 Kbyte
MB9AFAA1LPMC-G-SNE2
64 Kbyte
12 Kbyte
MB9AFAA2LPMC-G-SNE2
128 Kbyte
16 Kbyte
MB9AFAA1MPMC-G-SNE2
64 Kbyte
12 Kbyte
MB9AFAA2MPMC-G-UNE2
128 Kbyte
16 Kbyte
MB9AFAA1MPMC1-G-SNE2
64 Kbyte
12 Kbyte
MB9AFAA2MPMC1-G-SNE2
128 Kbyte
16 Kbyte
MB9AFAA1NPMC-G-UNE2
64 Kbyte
12 Kbyte
MB9AFAA2NPMC-G-UNE2
128 Kbyte
16 Kbyte
MB9AFAA1NPF-G-SNE1
64 Kbyte
12 Kbyte
MB9AFAA2NPF-G-SNE1
128 Kbyte
16 Kbyte
Document Number: 002-05673 Rev.*C
Package
Packing
Plastic LQFP
(0.5mm pitch), 64-pin
(LQD064)
Plastic LQFP
(0.65mm pitch), 64-pin
(LQG064)
Plastic LQFP
(0.5mm pitch), 80-pin
(LQH080)
Plastic LQFP
(0.65mm pitch), 80-pin
(LQJ080)
Tray
Plastic LQFP
(0.5mm pitch), 100-pin
(LQI100)
Plastic QFP
(0.65mm pitch), 100-pin
(PQH100)
Page 97 of 108
MB9AAA0N Series
14. Package Dimensions
Package Type
Package Code
LQFP 64
LQD064
4
D
D1
48
5 7
33
33
32
49
48
32
49
17
64
5
7
E1
E
4
3
6
17
64
1
16
e
1
16
2 5 7
3
BOTTOM VIEW
0.10 C A-B D
0.20 C A-B D
b
0.08
C A-B
D
8
TOP VIEW
A
2
9
A
A'
0.08 C
SEATING
PLANE
L1
0.25
L
A1
c
b
SECTION A-A'
10
SIDE VIEW
SYMBOL
DIMENSIONS
MIN. NOM. MAX.
A
A1
1. 70
0.00
0.20
b
0.15
0.2
c
0.09
0.20
D
12.00 BSC.
D1
10.00 BSC.
e
0.50 BSC
E
12.00 BSC.
E1
10.00 BSC.
L
0.45
0.60
0.75
L1
0.30
0.50
0.70
002-11499 **
PACKAGE OUTLINE, 64 LEAD LQFP
10.0X10.0X1.7 MM LQD064 Rev**
Document Number: 002-05673 Rev.*C
Page 98 of 108
MB9AAA0N Series
Package Type
Package Code
LQFP 64
LQG064
D
D1
48
4
5 7
33
33
32
49
48
32
49
17
64
E1 E
5
7
4
3
17
64
1
16
e
1
16
2 5 7
3
BOTTOM VIEW
0.10 C A-B D
0.20 C A-B D
b
0.13
C A-B
D
8
TOP VIEW
2
A
A
A'
0.10 C
SEATI NG
PLA NE
0.2 5
L1
L
9
A1
10
c
b
SEC TION A -A'
SIDE VIEW
SYMBOL
DIMENSION
MIN.
NOM. MAX.
1.70
A
A1
0.00
b
0.27
0.20
c
0.09
0.32
0.37
0.20
D
14.00 BSC
D1
12.00 BSC
e
0.65 BSC
E
14.00 BSC
E1
12.00 BSC
L
0.45
0.60
0.75
L1
0.30
0.50
0.70
0
002-13881 **
PACKAGE OUTLINE, 64 LEAD LQFP
12.0X12.0X1.7 MM LQG064 REV**
Document Number: 002-05673 Rev.*C
Page 99 of 108
MB9AAA0N Series
Package Type
Package Code
LQFP 80
LQH080
D
D1
60
4
5 7
41
41
40
61
60
40
61
21
80
5
7
E1
E
4
3
6
80
21
1
20
D
e
20
2 5 7
0.10 C A-B D
3
b
0.08
C A-B
1
BOTTOM VIEW
D
0.20 C A-B D
8
TOP VIEW
2
A
A
A'
0.08 C
SIDE VIEW
SEATING
PLANE
9
L1
L
0.25
A1
10
c
b
SECTION A-A'
DIMENSIONS
SYMBOL
MIN. NOM. MAX.
A
A1
1. 70
0.05
0.15
b
0.15
0.27
c
0.09
0.20
D
14.00 BSC.
D1
12.00 BSC.
e
0.50 BSC
E
14.00 BSC.
E1
12.00 BSC.
L
0.45
0.60
0.75
L1
0.30
0.50
0.70
002-11501 **
PACKAGE OUTLINE, 80 LEAD LQFP
12.0X12.0X1.7 MM LQH080 Rev **
Document Number: 002-05673 Rev.*C
Page 100 of 108
MB9AAA0N Series
Package Type
Package Code
LQFP 80
LQJ080
D
D1
60
4
5 7
41
41
61
40
E1
60
40
61
21
80
E
5
7
4
3
6
80
21
1
20
20
2 5 7
1
0.10 C A-B D
3
e
0.20 C A-B D
b
ddd
C A-B
D
8
2
A
9
A
A'
0.10 C
SEATING
PLANE
c
L1
0.2 5
A1
10
b
SECTION A-A'
L
SYMBOL
DIMENSIONS
MIN. NOM. MAX.
1.70
A
A1
0.00
b
0.16
c
0.09
0.20
0.32
0.38
0.20
D
16.00 BSC
D1
14.00 BSC
e
0.65 BSC
E
16.00 BSC
E1
14.00 BSC
L
0.45
0.60
0.75
L1
0.30
0.50
0.70
0
8
002-14043 **
PACKAGE OUTLINE, 80 LEAD LQFP
14.0X14.0X1.7 MM LQJ080 REV**
Document Number: 002-05673 Rev.*C
Page 101 of 108
MB9AAA0N Series
Package Type
Package Code
LQFP 100
LQI100
D
4
D1
75
D
5 7
51
D1
51
50
76
4
5 7
75
50
76
E1 E
5 4
7
E1 E
5 4
7
3
6
26
100
1
26
25
1
25
2 5 7
e
100
BOTTOM VIEW
0.1 0 C A-B D
3
0.2 0 C A-B D
b
TOP VIEW
8
0.0 8
C A-B
D
2
A
9
A
SEAT ING
PLA NE
A'
0.25
L1
0.0 8 C
c
A1
b
10
SECTION A-A'
L
SIDE VIEW
SYMBOL
DETAIL A
DIMENSIONS
MIN.
NOM. MAX.
1.70
A
A1
0.05
b
0.15
0.15
0.27
c
0.09
0.20
D
16.00 BSC
D1
14.00 BSC
e
0.50 BSC
E
16.00 BSC
E1
14.00 BSC
L
0.45
0.60
0.75
L1
0.30
0.50
0.70
NOTES :
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DATUM PLANE H IS LOCATED AT THE BOTTOM OF THE MOLD PARTING
LINE COINCIDENT WITH WHERE THE LEAD EXITS THE BODY.
3. DATUMS A-B AND D TO BE DETERMINED AT DATUM PLANE H.
4. TO BE DETERMINED AT SEATING PLANE C.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25mm PRE SIDE.
DIMENSIONS D1 AND E1 INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE H.
6. DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL BUT MUST BE LOCATED
WITHIN THE ZONE INDICATED.
7. REGARDLESS OF THE RELATIVE SIZE OF THE UPPER AND LOWER BODY
SECTIONS. DIMENSIONS D1 AND E1 ARE DETERMINED AT THE LARGEST
FEATURE OF THE BODY EXCLUSIVE OF MOLD FLASH AND GATE BURRS.
BUT INCLUDING ANY MISMATCH BETWEEN THE UPPER AND LOWER
SECTIONS OF THE MOLDER BODY.
8. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. THE DAMBAR
PROTRUSION (S) SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED b
MAXIMUM BY MORE THAN 0.08mm. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE LEAD FOOT.
9. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10mm AND 0.25mm FROM THE LEAD TIP.
10. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO
THE LOWEST POINT OF THE PACKAGE BODY.
002-11500 *A
PACKAGE OUTLINE, 100 LEAD LQFP
14.0X14.0X1.7 MM LQI100 REV*A
Document Number: 002-05673 Rev.*C
Page 102 of 108
MB9AAA0N Series
Package Type
Package Code
QFP 100
PQH100
D
D1
4
5 7
80
51
81
51
50
80
50
81
31
100
E1 E
5
7
6
3
4
31
100
1
30
e
3
0.40 C A-B D
30
2 5 7
1
0.20 C A-B D
b
0.13
C A-B
D
BOTTOM VIEW
8
TOP VIEW
2
9
A
A'
SEATING
PLANE
L2
c
10
b
0.10 C
SECTION A-A'
DETAIL A
SIDE VIEW
SYMBOL
DIMENSIONS
MIN.
NOM. MAX.
A1
0.05
0.45
b
0.27
c
0.11
A
3.35
0.32
0.23
D
23.90 BSC
D1
20.00 BSC
e
0.65 BSC
E
17.90 BSC
E1
14.00 BSC
0
L
0.37
8
0.73
0.88
L1
1.95 REF
L2
0.25 BSC
1.03
002-15156 **
PACKAGE OUTLINE, 100 LEAD QFP
20.00X14.00X3.35 MM PQH100 REV**
Document Number: 002-05673 Rev.*C
Page 103 of 108
MB9AAA0N Series
15. Errata
This chapter describes the errata for MB9AAA0N Series. Details include errata trigger conditions, scope of impact, available
workaround, and silicon revision applicability.
Contact your local Cypress Sales Representative if you have questions.
15.1 Part Numbers Affected
Part Number
Initial Revision
MB9AFAA1LPMC1-G-SNE2, MB9AFAA2LPMC1-G-SNE2, MB9AFAA2LPMC1-G-UNE2,
MB9AFAA1LPMC-G-SNE2, MB9AFAA2LPMC-G-SNE2, MB9AFAA1MPMC-G-SNE2,
MB9AFAA2MPMC-G-SNE2, MB9AFAA2MPMC-G-UNE2, MB9AFAA1MPMC1-G-SNE2,
MB9AFAA2MPMC1-G-SNE2, MB9AFAA1NPMC-G-SNE2, MB9AFAA1NPMC-G-UNE2,
MB9AFAA2NPMC-G-SNE2, MB9AFAA2NPMC-G-UNE2, MB9AFAA1NPF-G-SNE1,
MB9AFAA2NPF-G-SNE1
15.2 Qualification Status
Product Status: In Production − Qual.
15.3 Errata Summary
This table defines the errata applicability to available devices.
Items
Part Number
Silicon Revision
Fix Status
[15.4.1] HDMI-CEC polling message issue
Refer to 15.1
Initial Rev
Next silicon is not planned
[15.4.2] RTC delay issue
Refer to 15.1
Initial Rev
Next silicon is not planned
15.4 Errata Detail
15.4.1 HDMI-CEC polling message issue
PROBLEM DEFINITION
Error#1) While MCU sends a Polling Message, it always returns a NACK to a message coming to the MCU from another node.
Error#2) MCU always waits for 7-bit signal free on CEC line before it drives the line even when the last line initiator was another
node.
PARAMETERS AFFECTED
N/A
TRIGGER CONDITION(S)
This error always happens.
SCOPE OF IMPACT
MCU does not reply properly to another node.
WORKAROUND
The software workaround is applied to Error #1.
1.
Store 0x0 to SFREE register.
2.
Monitor CEC line with GPIO and wait until 1 lasts for the signal free time.
3.
Store frame data to TXDATA register and store 0x0F to RCADR1 or RCADR2 register.
It sends a message after 3~4 clocks of 32.768 kHz clock when TXDATA is stored 0x0F.
Document Number: 002-05673 Rev.*C
Page 104 of 108
MB9AAA0N Series
If the device receives a frame from another node within 2~3 clocks after storing TXDATA, the bus error occurs and if the device
receives a frame from another node within 3~4 clocks after storing TXDATA, the arbitration lost occurs. In these cases:
4-A-1. Set RCADR1 or RCADR2 to former value from 0x0F to reply ACK
4-A-2. Return back to step 2 above
If the device receives a frame from another node within 1~2 clocks after storing TXDATA, take these steps.
4-B-1. Monitor CEC line with GPIO after 50us from storing TXDATA
4-B-2. Set TXEN to 1 -> 0 -> 1 immediately when GPIO finds state low on the CEC line
4-B-3. Set RCADR1 or RCADR2 to former value from 0x0F to reply ACK
4-B-4. Return back to step 2 above
For Error #2, there is no software workaround, but signal free time of fixed 7-bit does not violate HDMI-CEC specification. The
specification says signal free time must be more than and equals to 5-bit.
FIX STATUS
The user uses the workaround to avoid the issue. The next silicon fixing the issue is not planned.
15.4.2 RTC delay issue
PROBLEM DEFINITION
RTC delays when software reset or APB2 reset occurs.
PARAMETERS AFFECTED
N/A
TRIGGER CONDITION(S)
This error happens when software reset or APB2 reset occurs.
SCOPE OF IMPACT
RTC delays and does not time correctly.
WORKAROUND
RTC block is supplied with sub-clock. Both software reset and APB2 reset disable two clocks of sub-clock to RTC block. The
workaround is to count occurrence of software and APB2 reset and calculate how many clocks of sub-clock were disabled and add
one second to RTC counter when accumulated disabled sub-clock period reaches one second.
FIX STATUS
The user uses the workaround to avoid the issue. The next silicon fixing the issue is not planned.
Document Number: 002-05673 Rev.*C
Page 105 of 108
MB9AAA0N Series
Major Changes
Spansion Publication Number: DS706-00067
Page
Section
Revision 0.1
Revision 1.0
ELECTRICAL CHARACTERISTICS
66,67
3.DC Characteristics (1) Current Rating
Revision 2.0
Features
2
· On-chip Memories
Packages
7 - 33
Pin Assignment
List of Pin Functions
Change Results
Initial release
Changed from Preliminary to Full Producton
Deleted a part of QFN
Revised the values of “TBD”
Changed the description of on-chip SRAM
Deleted QFN package
45
Handling Devices
Crystal oscillator circuit
Added the following description
"Evaluate oscillation of your using crystal oscillator by your mount
board."
49
Memory Map
· Memory map(2)
Added the summary of Flash memory sector
64 - 66
Electrical Characteristics
3. DC Characteristics
(1) Current rating
· Changed the table format
· Added Main Timer mode current
· Added Flash Memory Current
· Moved A/D Converter Current
· Moved D/A Converter Current
67
71
72
Electrical Characteristics
3. DC Characteristics
(2) Pin Characteristics
Electrical Characteristics
4. AC Characteristics
(4-1) Operating Conditions of Main PLL
(4-2) Operating Conditions of Main PLL
Electrical Characteristics
4. AC Characteristics
(6) Power-on Reset Timing
74 - 81
Electrical Characteristics
4. AC Characteristics
(8) CSIO/UART Timing
85
Electrical Characteristics
5. 12bit A/D Converter
89
92
93 - 96
97
Electrical Characteristics
7. Low-voltage Detection Characteristics
Electrical Characteristics
8. Flash Memory Write/Erase Characteristics
Electrical Characteristics
9. Return Time from Low-Power Consumption
Mode
Ordering Information
Added the input leak current of CEC port at power off
· Added the figure of Main PLL connection
· Changed the figure of timing
· Changed from Reset release delay time(tOND) to Time until
releasing Power-on reset(tPRT)
· Modified from UART Timing to CSIO/UART Timing
· Changed from Internal shift clock operation to Master mode
· Changed from External shift clock operation to Slave mode
· Added the typical value of Integral Nonlinearity, Differential
Nonlinearity, Zero transition voltage and Full-scale transition
voltage
· Added Conversion time at AVCC < 2.7 V
Deleted the figure
Change to the erase time of include write time prior to internal erase
Added Return Time from Low-Power Consumption Mode
Changed notation of part number
NOTE: Please see “Document History” about later revised information.
Document Number: 002-05673 Rev.*C
Page 106 of 108
MB9AAA0N Series
Document History
Document Title: MB9AAA0N Series 32-bit ARM® Cortex®-M3 FM3 Microcontroller
Document Number: 002-05673
Revision
ECN
**
-
Orig. of
Submission
Change
Date
AKIH
06/30/2015
Description of Change
Migrated to Cypress and assigned document number 002-05673.
No change to document contents or format.
*A
5209465
AKIH
04/07/2016
Updated to Cypress format.
Modified RTC description in “Features, Real-Time Clock(RTC)”. Changed starting
count value from 01 to 00. Deleted “second, or day of the week” in the Interrupt
function. (Page 2)
Changed package code as the following table in following section.
2. Package (Page 7)
3. Pin Assignment (Page 8 -11)
12. Electrical Characteristics (Page 63)
13. Ordering Information (Page 97)
14. Package Dimensions (Page 98 - 103)
Before
*B
5513605
HTER
02/08/2017
After
FPT-64P-M38
LQD064
FPT-64P-M39
LQG064
FPT-80P-M37
LQH080
FPT-80P-M40
LQJ080
FPT-100P-M23
LQI100
FPT-100P-M06
PQH100
Added the Baud rate spec in “12.4.9 CSIO/UART Timing” (Page 64 - 70)
Changed Part numbers in 13. Ordering Information (Page 97)
“MB9AFAA2LPMC1-G-SNE2” to “MB9AFAA2LPMC1-G-UNE2”
“MB9AFAA2MPMC-G-SNE2” to “MB9AFAA2MPMC-G-UNE2”
“MB9AFAA1NPMC-G-SNE2” to “MB9AFAA1NPMC-G-UNE2”
“MB9AFAA2NPMC-G-SNE2” to “MB9AFAA2NPMC-G-UNE2”
Added 15. Errata (Page 104 - 105)
*C
5768634
YSAT
Document Number: 002-05673 Rev.*C
06/12/2017
Adapted new cypress logo
Page 107 of 108
MB9AAA0N Series
Sales, Solutions, and Legal Information
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All other trademarks or registered trademarks referenced herein are the property of their respective owners.
© Cypress Semiconductor Corporation, 2014-2017. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document,
including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or
other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software,
then Cypress hereby grants you a personal, non-exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the Software (a) for Software provided in source
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TO THE EXTENT PERMITTED BY APPLICABLE LAW, CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS DOCUMENT OR ANY SOFTWARE
OR ACCOMPANYING HARDWARE, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. To the extent
permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any
product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It
is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. Cypress
products are not designed, intended, or authorized for use as critical components in systems designed or intended for the operation of weapons, weapons systems, nuclear installations, life-support
devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollution control or hazardous substances management, or other uses where the
failure of the device or system could cause personal injury, death, or property damage (“Unintended Uses”). A critical component is any component of a device or system whose failure to perform
can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress
from any claim, damage, or other liability arising from or related to all Unintended Uses of Cypress products. You shall indemnify and hold Cypress harmless from and against all claims, costs,
damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress products.
Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in
the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 002-05673 Rev.*C
June 12, 2017
Page 108 of 108