MADP-000504-10720T Non Magnetic MELF PIN Diode Features • • • • • • • High Power Handling Low Loss / Low Distortion Leadless Low Inductance MELF Package Non-Magnetic Surface Mountable RoHS Compliant MSL 1 V1 Package Style 1072 Dot Denotes Cathode Description M/A-COM Technology Solutions product line of MELF, PIN diodes, encompass a comprehensive range of electrical characteristics. The chip used in the MADP-000504-10720T is manufactured using a unique, CERMACHIP, passivation process which provides for a hard glass encapsulation that protects and hermetically seals the active area of the chip. This packaged, CERMACHIP, PIN diode is ideally suited for use in applications where high RF and DC voltages are present. The chip is enclosed in a rugged, ceramic, Metal Electrode Leadless Faced (MELF), surface mount package that is full face bonded to refractory metal plugs on both the anode and cathode. The result is a low loss PIN diode with low thermal resistance due to its symmetrical thermal paths. MELF PIN diodes are designed specifically for high volume tape and reel assembly. Their user friendly design provides for extremely easy, automatic, pick and place, indexing and assembly. All solderable surfaces are tin plated and are compatible with all industry standard reflow and vapor phase soldering processes. Absolute Maximum Ratings @ 25°C Parameter Forward Voltage Absolute Maximum 1,2 1.0 V 1,2 500V Reverse Voltage Operating Temperature -65°C to +175°C Storage Temperature -65°C to +200°C Mounting Temperature +260°C for 30 seconds 1. Exceeding these limits may cause permanent damage to the device. 2. Values will de-rate linearly over temperature. Applications The MADP-000504-10720T MELF is well suited for use in low loss, low distortion, UHF and VHF high power switching circuits. It is specifically designed to operate in high magnetic fields and to tune or protect RF coils in MRI circuits. This device is designed to meet the most demanding electrical and mechanical environments. Ordering Information Part Number MADP-000504-10720T Packaging Quantity Tape and reel 1500 pcs Tape and reel information can be found in Application Note M513 on the M/A-COM website 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000504-10720T Non Magnetic MELF PIN Diode V1 Electrical Specifications @ TA = +25°C Parameters Symbols Conditions Units Min. Typ. Max. CT100V -100 V @ 1 MHz pF — — 0.50 Package Capacitance Cp — pF Series Resistance RS +100 mA @ 100 MHz Ω — — 0.60 Minority Carrier Lifetime TL IF = +10 mA / IR = -6 mA µS — 1.0 — Forward Voltage VF + 50 mA V — — 1.0 -IR -500 V nA — — | -100 | θ — °C/W — 16 20 Pd — W — 7.5 θ — °C/W — 48 51 Pd — W — — 2.9 — — µm IIP3 Power In = +10dBm Freq. = 1000 MHz Spacing = 1 MHz dBm Total Capacitance1 Reverse Leakage Current 2 Thermal Resistance Power Dissipation 2,3 4 Thermal Resistance Power Dissipation 4,5 I Region Thickness 3rd Order Input Intermodulation Distortion 1. 2. 3. 4. 5. 0.16 44 — >54 — Total capacitance Ct = Cj (Chip Junction Capacitance) + Cp (Parasitic Package Capacitance) Diode attached to an infinite heatsink. De-rate linearly by -50 mw/°C to 0W @ +125 °C . Diode in air. De-rate linearly by -19.3 mw/°C to 0W @ +125 °C Typical DC Performance Curves Series Resistance vs. Forward Current Capacitance vs. Reverse Voltage 0.54 7 0.53 6 0.52 Capacitance (pF) Rs (Ohms) 5 100 MHz 4 3 2 100 MHz 0.51 0.5 0.49 0.48 1 0.47 0.46 0 0 20 40 60 Forward Bias (mA) 80 100 0 20 40 60 80 100 Reverse Bias (V) 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000504-10720T Non Magnetic MELF PIN Diode V1 Typical RF Performance Curves (50 – 4000 MHz) MOUNTED IN A SERIES CONFIGURATION Output Return Loss 0 0 -10 -10 S22 Mag (dB) S11 Mag (dB) Input Return Loss -20 -30 -40 -20 -30 -40 -50 0 1 2 3 -50 4 0 1 Frequency (GHz) Insertion Loss 3 4 Isolation 0 0 IL (10mA) IL (50mA) IL (100mA) -10 Isolation (dB) -0.1 Insertion Loss (dB) 2 Frequency (GHz) -0.2 -0.3 -20 -10V -25V -30 -40 -0.4 -0.5 -50 0 1 2 Frequency (GHz) 3 4 0 1 2 3 4 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000504-10720T Non Magnetic MELF PIN Diode V1 Typical RF Performance Curves (50 – 4000 MHz) MOUNTED IN A SHUNT CONFIGURATION Output Return Loss 0 0 -10 -10 S22 Mag (dB) S11 Mag (dB) Input Return Loss -20 -30 -20 -30 -40 -40 -50 -50 0 1 2 3 0 4 1 3 4 Frequency (GHz) Frequency (GHz) Insertion Loss Isolation 0 0 -0.2 -5 -0.4 -10 Isolation (dB) Insertion Loss (dB) 2 -0.6 -0.8 IL (10V) -1 -15 10mA 50mA 100mA -20 -25 -1.2 -30 -1.4 -35 -1.6 0 1 2 Frequency (GHz) 3 4 0 1 2 3 4 Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000504-10720T Non Magnetic MELF PIN Diode V1 Circuit Pad Layout Package Outline (1072 MELF ) Cathode B A Solderable Surfaces A Package Style 1072 Dimension inches mm A 0.093 2.36 B 0.050 1.27 C 0.060 1.52 C Dimension MIN. MAX. MIN. MAX. A 0.080 0.095 2.032 2.413 B 0.115 0.125 2.921 3.175 C 0.008 0.023 0.203 0.584 INCHES MM A B C B 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice. MADP-000504-10720T Non Magnetic MELF PIN Diode V1 Assembly Recommendations • Devices may be soldered using standard Sn63/Pb37 or any RoHS compliant solder. Leads are bright tin plated to a minimum thickness of 50μm to ensure an optimum connection. • For recommended Sn/Pb and RoHS soldering time/temperature profiles. See Application Note M538 on the M/A-COM Technology Solutions website. Handling Procedures RoHS The following precautions should be observed to avoid damaging these devices. The MADP-000504-10720T is fully RoHS compliant meaning it contains less than the maximum allowable concentration of 0.1%, by weight, in homogenous materials for lead, hex chrome, mercury, PBB, PBDE, and 0.01% for cadmium. Cleanliness and Storage MELF devices should be handled and stored in a clean environment. The metalized ends of the device are tin plated for greater solderability and any continuous exposure to high humidity (>80%) for extended periods of time may cause the surface to oxidize. Caution should be taken when storing devices for extended intervals. ESD Mounting Techniques Solder Attach Typical wave soldering or reflow techniques may be used to mount MELF packages to circuit boards. Alloys such as Sn63/Pb37 or any RoHS compliant solder may be used. For more information visit the M/A-COM Tech website and refer to application note M538. These devices are susceptible to ESD and are rated Class 1C. General Handling Device can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment. Note: Click links below to view datasheets of other MELF and packaged PIN diodes. PACKAGED_PIN_DIODES and/or MA4P MELF & HIPAX Series 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under developVisit www.macom.com for additional data sheets and product information. ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or volume is not guaranteed. information contained herein without notice.