GeneSiC GBJ30G Low forward voltage, high forward current Datasheet

GBJ30B thru GBJ30G
Single Phase Glass Passivated
Silicon Bridge Rectifier
VRRM = 100 V - 400 V
IO = 30 A
Features
• Epoxy Resin material compliant with 94V-0 standards
of UL Material Flammability Provisions
• Compliant with RoHS Provisions
• Single in-line DIP package, compact size
• Low forward voltage, high forward current
• High surge current capability
• Types from 100 V to 400 V VRRM
GBJ Package
• Small size, high heat-conducting performance
• Thermal welding performance: 260 oC/10 s
• Weight: 7.25 g (0.25 Oz)
• Not ESD Sensitive
Maximum ratings at TA = 25 °C (ambient temperature), unless otherwise specified
Conditions
GBJ30B
Parameter
Symbol
Repetitive peak reverse voltage
VRRM
100
DC blocking voltage
Operating temperature
Storage temperature
VDC
Tj
Tstg
100
-50 to 150
-50 to 150
GBJ30G
Unit
200
400
V
200
-50 to 150
-50 to 150
400
-50 to 150
-50 to 150
°C
°C
Unit
GBJ30D
Electrical characteristics at TA = 25 °C, unless otherwise specified
Resistive load, single phase, half sine wave, 60 Hz.
For capacitive load derate current by 20%.
Parameter
Symbol
Maximum average forward
rectified current
IO
Maximum forward surge current
IFSM
VF
Maximum forward voltage
Max. reverse current leakage at
rated DC blocking voltage
IR
Insulation strengthg (Lead wire
to case)
Vdis
Fusing feature
Thermal resistance
Mounting torgue
I2 t
RΘJA
RΘJC
TOR
Conditions
GBJ30B
GBJ30D
GBJ30G
TC = 98 °C
30 (1)
30 (1)
30 (1)
TA = 25 °C
(2)
(2)
5.2 (2)
5.2
5.2
A
8.3 ms pulse width,
single pulse sine-wave,
rated load, Tj = 25 °C
420
420
420
A
IF = 15 A
1.05
1.05
1.05
V
TA = 25 °C
5
5
5
TA = 125 °C
500
500
500
2.5
2.5
2.5
kV
350
350
350
A2 s
AC Voltage: 1 minute,
current leakage < 1 mA
1ms ≤ t < 10ms, Tj=25 °C
without heatsink
with stated size heatsink
(2)
22
1.0 (1)
(2)
22
1.0 (1)
(2)
22
1.0 (1)
1.0 ( 0.8 Nm is recomended )
μA
o
C/W
Nm
Remarks: (1) Install on PCB with stated size heat sink. In order to reach excellent heat dissipation performance, please coat thermal
conductive sillica gel in moderation, use M3 screw to screw up. Recommended heatsink size: 15.2*15.2*12.8 cm.
(2) Install on PCB without heatsink.
Apr 2016
Latest version of this datasheet at: www.genesicsemi.com/silicon-products/bridge-rectifiers/
1
GBJ30B thru GBJ30G
Apr 2016
Latest version of this datasheet at: www.genesicsemi.com/silicon-products/bridge-rectifiers/
2
GBJ30B thru GBJ30G
Package dimensions and terminal configuration
Product is marked with part number and terminal configuration.
Dimensions in millimeters
Apr 2016
Latest version of this datasheet at: www.genesicsemi.com/silicon-products/bridge-rectifiers/
3
Similar pages