Diodes DMC4029SSD Complementary pair enhancement mode mosfet Datasheet

DMC4029SSD
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Product Summary
ADVANCE INFORMATION
NEW PRODUCT
Device
RDS(on) max
V(BR)DSS
Q2
40V
Q1
-40V
Features and Benefits
24mΩ @ VGS = 10V
32mΩ @ VGS = 4.5V
45mΩ @ VGS = -10V
55mΩ @ VGS = -4.5V
ID
TA = +25°C
9.0A
7.8A
-6.5A
-5.9A
•
Low Input Capacitance
•
Low On-Resistance
•
Fast Switching Speed
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Description
Mechanical Data
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
•
•
performance, making it ideal for high efficiency power management
Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
applications.
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminal Connections: See Diagram
Applications
•
•
DC-DC Converters
•
•
Power Management Functions
•
Backlighting
Terminals: Finish – Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
D1
D2
S2
D2
G2
D2
S1
D1
G1
D1
G1
G2
S2
TOP VIEW
Internal Schematic
Top View
e3
Weight: 0.074 grams (approximate)
N-Channel MOSFET
S1
P-Channel MOSFET
Ordering Information (Note 4 & 5)
Part Number
DMC4029SSD-13
DMC4029SSDQ-13
Notes:
Compliance
Standard
Automotive
Case
SO-8
SO-8
Packaging
2,500/Tape & Reel
2,500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the
same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_grade_definitions/.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Top View
8
5
Logo
C4029SD
Part no .
YY WW
Xth week: 01 ~ 53
Year: “13” = 2013
1
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
4
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DMC4029SSD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE INFORMATION
NEW PRODUCT
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 7) VGS = 10V
Steady
State
t<10s
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Maximum Body Diode Forward Current (Note 7)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
ID
Value_Q2
40
±20
7.0
5.6
Value_Q1
-40
±20
-5.1
-4.1
9.0
7.2
2.5
70
-6.5
-5.2
-2.5
-40
ID
IS
IDM
Units
V
V
A
A
A
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
TA = +70°C
Steady state
t<10s
TA = +25°C
TA = +70°C
Steady state
t<10s
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient (Note 7)
PD
RθJA
PD
RθJA
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
RθJC
TJ, TSTG
Value
1.3
0.8
98
59
1.8
1.1
71
43
11.8
-55 to +150
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics N-Channel Q2 (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
40
⎯
⎯
⎯
⎯
⎯
⎯
1
±100
V
µA
nA
VGS = 0V, ID = 250µA
VDS = 40V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS(ON)
VSD
⎯
15
20
0.7
3.0
24
32
1.0
V
Static Drain-Source On-Resistance
1.0
⎯
⎯
⎯
VDS = VGS, ID = 250µA
VGS = 10V, ID = 6A
VGS = 4.5V, ID = 5A
VGS = 0V, IS = 1.0A
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1060
84
58
1.6
8.8
19.1
3.0
2.5
5.3
7.1
15.1
4.8
10.5
4.15
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
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mΩ
V
Test Condition
pF
VDS = 20V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 20V, ID = 8A
nS
VDD = 25V, RL = 2.5Ω
VGS = 10V, RG = 3Ω
nS
nC
IF = 8A, di/dt = 100A/μs
IF = 8A, di/dt = 100A/μs
March 2014
© Diodes Incorporated
DMC4029SSD
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
-40
⎯
⎯
⎯
⎯
⎯
⎯
-1
±100
V
µA
nA
VGS = 0V, ID = -250µA
VDS = -40V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
RDS(ON)
VSD
⎯
33
40
-0.7
-3.0
45
55
-1.0
V
Static Drain-Source On-Resistance
-1.0
⎯
⎯
⎯
VDS = VGS, ID = -250µA
VGS = -10V, ID = -5A
VGS = -4.5V, ID = -4A
VGS = 0V, IS = -1.0A
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1154
84
66
12.6
10.6
21.5
2.2
3.3
8.7
19.6
34.9
25.5
9.61
3.3
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
mΩ
V
Test Condition
pF
VDS = -20V, VGS = 0V
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = -20V, ID = -4.9A
nS
VDS = -20V, ID = -3.9A
VGS = -4.5V, RG = 1Ω
nS
nC
IS = -3.9A, dI/dt = 100A/μs
IS = -3.9A, dI/dt = 100A/μs
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
N-Channel Q2
20.0
VGS = 10V
VGS = 5.0V
VGS = 4.5V
ID, DRAIN CURRENT (A)
VDS = 5.0V
VGS = 3.5V
VGS = 4.0V
15.0
ID, DRAIN CURRENT (A)
ADVANCE INFORMATION
NEW PRODUCT
Electrical Characteristics P-Channel Q1 (@TA = +25°C, unless otherwise specified.)
10.0
VGS = 3.0V
5.0
TA = 150°C
TA = 125°C
TA = 85°C
T A = 25°C
TA = -55°C
0.0
VGS = 2.5V
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
5
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0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
5
March 2014
© Diodes Incorporated
DMC4029SSD
0.2
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.022
VGS = 4.5V
0.02
0.018
0.016
VGS = 10V
0.014
0.012
0.01
0.008
0
5
10
15
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0.18
0.16
ID = 5.0A
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
20
0.05
3
4
5
6
7
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 4 Typical Transfer Characteristic
8
2
0.045
0.04
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
VGS = 4.5V
TA = 150°C
0.035
T A = 125°C
0.03
TA = 85°C
0.025
TA = 25°C
0.02
TA = -55°C
0.015
0.01
VGS = 10V
ID = 10A
1.5
VGS = 4.5V
ID = 5A
1
0.5
0.005
0
0
5
10
15
20
25
ID, DRAIN CURRENT (A)
Figure 5 Typical On-Resistance vs.
Drain Current and Temperature
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
30
3
0.04
0.035
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ADVANCE INFORMATION
NEW PRODUCT
0.024
VGS = 4.5V
ID = 5A
0.03
0.025
0.02
VGS = 10V
ID = 10A
0.015
0.01
0.005
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 On-Resistance Variation with Temperature
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
2.8
2.6
2.4
2.2
2
ID = 1mA
ID = 250µA
1.8
1.6
1.4
1.2
1
-50
-25
0
25
50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 8 Gate Threshold Variation vs. Ambient Temperature
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DMC4029SSD
30
IS, SOURCE CURRENT (A)
20
T A = 150°C
15
TA = 125°C
TA = 85°C
10
TA = 25°C
TA = -55°C
5
0
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9 Diode Forward Voltage vs. Current
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RθJA(t) = r(t) * RθJA
RθJA = 94°C/W
Duty Cycle, D = t1/ t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (sec)
Figure 10 Transient Thermal Resistance
10
100
1,000
P-Channel Q1
30
25
-ID, DRAIN CURRENT (A)
ADVANCE INFORMATION
NEW PRODUCT
25
VGS = -10V
VGS = -5.0V
20
VDS = -5.0V
VGS = -3.5V
VGS = -4.5V
VGS = -4.0V
VGS = -3.0V
15
10
VGS = -2.5V
TA = 125°C
TA = 85°C
5
T A = 150 °C
VGS = -2.0V
0
0
1
2
3
4
-VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
T A = 25°C
T A = -55°C
5
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
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DMC4029SSD
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.18
0.16
0.14
0.12
0.1
0.08
0.06
VGS = -4.5V
0.04
VGS = -10V
0.02
0
0
5
10
15
-ID, DRAIN SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
20
VGS = -10V
ID = -10A
1.5
VGS = -4.5V
ID = -5A
1.0
0.5
0
-50
RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
VGS = -2.5V
2.0
0.1
VGS = -4.5V
0.09
0.08
TA = 150°C
0.07
T A = 125°C
0.06
TA = 85°C
0.05
TA = 25°C
0.04
0.03
T A = -55°C
0.02
0
5
10
15
20
25
-ID, DRAIN SOURCE CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
30
0.08
0.07
0.06
VGS = -4.5V
ID = -5A
0.05
0.04
VGS = -10V
ID = -10A
0.03
0.02
0.01
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
30
2.0
1.8
25
1.6
-IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
ADVANCE INFORMATION
NEW PRODUCT
0.2
ID = -1mA
1.4
1.2
1.0
ID = -250µA
0.8
0.6
0.4
20
15
TA= 25°C
10
5
0.2
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
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0
0
0.3
0.6
0.9
1.2
1.5
-VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
March 2014
© Diodes Incorporated
D = 0.7
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.5
D = 0.3
D = 0.1
D = 0.9
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Figure 9 Transient Thermal Resistance
10
100
1,000
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
0.254
ADVANCE INFORMATION
NEW PRODUCT
DMC4029SSD
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°
θ
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
X
C1
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
DMC4029SSD
Document number: DS36350 Rev. 3 - 2
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DMC4029SSD
ADVANCE INFORMATION
NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
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Copyright © 2013, Diodes Incorporated
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DMC4029SSD
Document number: DS36350 Rev. 3 - 2
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