TI1 OPA846TDB1 Wideband, low-noise, voltage-feedback operational amplifier Datasheet

OPA846-DIE
www.ti.com
SBOS696 – DECEMBER 2013
WIDEBAND, LOW-NOISE, VOLTAGE-FEEDBACK OPERATIONAL AMPLIFIER
Check for Samples: OPA846-DIE
FEATURES
1
•
•
•
•
•
•
•
APPLICATIONS
High Bandwidth
Low Input Voltage Noise
Very Low Distortion
High Slew Rate
High DC Accuracy
Low Supply Current
High Gain Bandwidth Product
•
•
•
•
•
•
•
High Dynamic Range ADC Preamps
Low-Noise, Wideband, Transimpedance
Amplifiers
Wideband, High Gain Amplifiers
Low-Noise Differential Receivers
VDSL Line Receivers
Ultrasound Channel Amplifiers
Security Sensor Front Ends
DESCRIPTION
The OPA846-DIE combines very high gain bandwidth and large signal performance with very low input voltage
noise, while dissipating a low supply current. The classical differential input stage, along with two stages of
forward gain and a high power output stage, combine to make the OPA846-DIE an exceptionally low distortion
amplifier with excellent DC accuracy and output drive. The voltage-feedback architecture allows all standard op
amp applications to be implemented with very high performance.
The combination of low input voltage and current noise, along with gain bandwidth, make the OPA846 an ideal
amplifier for wideband transimpedance stages.
A new external compensation technique can be used to give a very flat frequency response below the minimum
stable gain for the OPA846-DIE, further improving its already exceptional distortion performance.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
OPA846
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
OPA846TDB1
300
OPA846TDB2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
OPA846-DIE
SBOS696 – DECEMBER 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
Ti/Alcu0.5%/TiW
1010 nm
Table 1. Bond Pad Coordinates in Microns
2
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
N/C
1
27
477
103
553
Inverting Input
2
27
251
105
329
Noninverting Input
3
27
27
103
103
Output
4
949
27
1025
103
+Vs
5
947
251
1025
329
-Vs
6
949
477
1025
553
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: OPA846-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
13-Dec-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA846TDB1
ACTIVE
0
300
TBD
Call TI
N / A for Pkg Type
25 Only
OPA846TDB2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
25 Only
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
13-Dec-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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