OPA846-DIE www.ti.com SBOS696 – DECEMBER 2013 WIDEBAND, LOW-NOISE, VOLTAGE-FEEDBACK OPERATIONAL AMPLIFIER Check for Samples: OPA846-DIE FEATURES 1 • • • • • • • APPLICATIONS High Bandwidth Low Input Voltage Noise Very Low Distortion High Slew Rate High DC Accuracy Low Supply Current High Gain Bandwidth Product • • • • • • • High Dynamic Range ADC Preamps Low-Noise, Wideband, Transimpedance Amplifiers Wideband, High Gain Amplifiers Low-Noise Differential Receivers VDSL Line Receivers Ultrasound Channel Amplifiers Security Sensor Front Ends DESCRIPTION The OPA846-DIE combines very high gain bandwidth and large signal performance with very low input voltage noise, while dissipating a low supply current. The classical differential input stage, along with two stages of forward gain and a high power output stage, combine to make the OPA846-DIE an exceptionally low distortion amplifier with excellent DC accuracy and output drive. The voltage-feedback architecture allows all standard op amp applications to be implemented with very high performance. The combination of low input voltage and current noise, along with gain bandwidth, make the OPA846 an ideal amplifier for wideband transimpedance stages. A new external compensation technique can be used to give a very flat frequency response below the minimum stable gain for the OPA846-DIE, further improving its already exceptional distortion performance. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE OPA846 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY OPA846TDB1 300 OPA846TDB2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated OPA846-DIE SBOS696 – DECEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating Ti/Alcu0.5%/TiW 1010 nm Table 1. Bond Pad Coordinates in Microns 2 DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX N/C 1 27 477 103 553 Inverting Input 2 27 251 105 329 Noninverting Input 3 27 27 103 103 Output 4 949 27 1025 103 +Vs 5 947 251 1025 329 -Vs 6 949 477 1025 553 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: OPA846-DIE PACKAGE OPTION ADDENDUM www.ti.com 13-Dec-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA846TDB1 ACTIVE 0 300 TBD Call TI N / A for Pkg Type 25 Only OPA846TDB2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type 25 Only (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. 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