AIC1733 500mA, Low Dropout Linear Regulator with Shutdown FEATURES DESCRIPTION Active Low Shutdown Control. Very Low Quiescent Current. Very Low Dropout Voltage of 650mV at 500mA Output Current (3.0V Output Version) 1.3V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V Output Voltage. Short Circuit and Thermal Protection. ±2% Output Tolerance. Miniature Package: SOT-23-5, TO-252-5, SOT-89-5 AIC1733 is a 500mA low noise, low dropout linear regulator, and is housed in small SOT-23-5 package. The device is in the “ON” state when the SHDN pin is set to logic high level. An internal P-MOSFET pass transistor is used to achieve 650mV low dropout voltage at 500mA load current. It offers high precision output voltage of ±2%. The quality of low quiescent current and low dropout voltage makes this APPLICATIONS device ideal for battery power applications. The internal reverse bias protection eliminates the PDA DSC Notebook Pagers Personal Communication Equipment Cordless Telephones Portable Instrumentation Portable Consumer Equipment Battery Powered Systems requirement for a reverse voltage protection diode. The high ripple rejection and low noise of AIC1733 provide enhanced performance for critical applications. The noise bypass pin can be connected an external capacitor to reduce the output noise level. TYPICAL APPLICATION CIRCUIT VIN VIN CIN VOUT + + 1µF GND VOUT COUT 4.7µF (Note1) BP SHDN CBP SHDN AIC1733 0.1µF Low Noise Low Dropout Linear Regulator Analog Integrations Corporation Si-Soft Research Center DS-1733G-01 120408 3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1733 ORDERING INFORMATION AIC1733-XXXXXX PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL BG: BAG SOT-23-5 TOP VIEW 1: VIN 2: GND 3: SHDN 4: BP 5: VOUT PACKAGE TYPE X5: SOT-89-5 V: SOT-23-5 E5: TO-252-5 P: LEAD FREE COMMERCIAL G: GREEN PACKAGE (TO-252-5 is NOT available in GREEN PACKAGE) OUTPUT VOLTAGE 28: 2.8V 13: 1.3V 30: 3.0V 15: 1.5V 33: 3.3V 18: 1.8V 25: 2.5V SOT-89-5 TOP VIEW 1: VIN 2: GND 3: SHDN 4: BP 5: VOUT 5 1 TO-252-5 TOP VIEW 1: SHDN 2: VIN 3: GND 4: VOUT 5: N/C 2 3 5 4 2 1 (Of a unit of 0.1V within the voltage range from 1.3V to 3.3V, additional voltage versions for this product line may be available on demand with prior consultation with AIC.) Example: AIC1733-18PX5TR 1.8V Version, in SOT-89-5 Lead Free Package & Tape & Reel Packing Type AIC1733-18PVTR 1.8V Version, in SOT-23-5 Lead Free Package & Tape & Reel Packing Type 4 3 123 45 • SOT-89-5 Marking Part No. AIC1733-13CX5 AIC1733-15CX5 AIC1733-18CX5 AIC1733-25CX5 AIC1733-28CX5 AIC1733-30CX5 AIC1733-33CX5 Marking EI13 EI15 EI18 EI25 EI28 EI30 EI33 Part No. AIC1733-13PX5 AIC1733-15PX5 AIC1733-18PX5 AIC1733-25PX5 AIC1733-28PX5 AIC1733-30PX5 AIC1733-33PX5 Marking EI13P EI15P EI18P EI25P EI28P EI30P EI33P Part No. AIC1733-13GX5 AIC1733-15GX5 AIC1733-18GX5 AIC1733-25GX5 AIC1733-28GX5 AIC1733-30GX5 AIC1733-33GX5 Marking EI13G EI15G EI18G EI25G EI28G EI30G EI33G Part No. AIC1733-13CV AIC1733-15CV AIC1733-18CV AIC1733-25CV AIC1733-28CV AIC1733-30CV AIC1733-33CV Marking EE13 EE15 EE18 EE25 EE28 EE30 EE33 Part No. AIC1733-13PV AIC1733-15PV AIC1733-18PV AIC1733-25PV AIC1733-28PV AIC1733-30PV AIC1733-33PV Marking EE13P EE15P EE18P EE25P EE28P EE30P EE33P Part No. AIC1733-13GV AIC1733-15GV AIC1733-18GV AIC1733-25GV AIC1733-28GV AIC1733-30GV AIC1733-33GV Marking EE13G EE15G EE18G EE25G EE28G EE30G EE33G • SOT-23-5 Marking 2 AIC1733 ABSOLUTE MAXIMUM RATINGS Supply Voltage .................………………………………..…………………....................12V Shutdown Terminal Voltage ..………………………………………………………..............8V Noise Bypass Terminal Voltage .…………………………….………………………..............5V Operating Temperature Range .………………………………………………….....-40ºC~85ºC Maximum Junction Temperature Storage Temperature Range 125°C ................…………………………………….........-65ºC~150ºC Lead Temperature (Soldering, 10 sec) Thermal Resistance (Junction to Case) 260°C SOT-23-5…....………..………..………….130°C /W TO-252-5…..……..…..…………………..12.5°C /W SOT-89-5…..……..…..……………………..30°C /W Thermal Resistance Junction to Ambient SOT-23-5…....……..……………..………..220°C /W TO-252-5…....………….…..……..……….100°C /W SOT-89-5…....……………...……..……….160°C /W (Assume no ambient airflow, no heatsink) Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. TEST CIRCUIT Refer to TYPICAL APPLICATION CIRCUIT. 3 AIC1733 ELECTRICAL CHARACTERISTICS (CIN=1µF, COUT=4.7µF, TJ=25°C, unless otherwise specified) (Note2) PARAMETER TEST CONDITIONS SYMBOL MIN. Quiescent Current IOUT = 0mA, VIN = 3.6~7V IQ Standby Current VIN = 3.6~7V, output OFF ISTBY GND Pin Current IOUT = 0.1~500mA IGND Continuous Output Current VIN = 5V IOUT Output Current Limit VIN = 5V, VOUT = 0V Output Voltage Tolerance VIN = 5V, no load Temperature Coefficient Line Regulation Load Regulation Dropout Voltage VIN = VOUT(TYP) + 1V to 7V VIN = VOUT + 1.2V (Vout≥ 2.5V) VIN = VOUT + 1.8V (Vout≤ 2.4V) IOUT = 0.1~500mA 3.0V≤VOUT≤3.3V 2.5V≤VOUT≤2.9V IL=500mA 2.0V≤VOUT≤2.4V 1.3V≤VOUT≤1.9V Noise Bypass Terminal Voltage Output Noise Ripple Rejection CBP = 0.1µF, f = 1KHz,VIN = 5V f = 1KHz, Ripple = 0.5VP-P, TYP. MAX. UNIT 40 55 µA 0.1 µA 50 µA 500 mA 30 IIL 500 VOUT -2 600 mA 2 % TC 50 150 ppm/ºC ∆VLIR 3 10 mV ∆VLOR 20 40 mV VDROP 650 780 1100 1400 1050 1180 1500 1800 mV VREF 1.23 ∆n 0.46 RR 55 V µV Hz dB CBP = 0.1µF Shutdown Pin Current I SHDN Shutdown Pin Voltage (ON) Output ON V SHDN (ON) Shutdown Pin Voltage (OFF) Output OFF V SHDN (OFF) Shutdown Exit Delay Time CBP = 0.1µF, COUT = 1µF, IOUT=30mA Thermal Shutdown Temperature 0.1 µA V 1.6 0.6 V ∆t 300 µS TSD 155 ºC Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic capacitor is not suggested. Note 2: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). 4 AIC1733 TYPICAL PERFORMANCE CHARACTERISTICS 60 700 40 TA=80°C AIC1733-33 600 1.5V TA=50°C 500 3.3V VDROP (mV) Quiescent current (µA) 50 400 30 TA=20°C 300 20 TA=-40°C 200 10 100 0 0 1 2 3 4 5 6 0 7 0 50 100 150 VIN (V) Fig. 1 Quiescent Current vs. VIN 250 300 350 400 450 500 ILOAD (mA) Fig. 2 VDROP vs. ILOAD 44.0 800 Short Circuit Current (mA) 43.5 Ground Current (µA) 200 43.0 3.3V 42.5 42.0 1.5V 41.5 41.0 40.5 VIN=5V 40.0 T=25°C 39.5 700 600 3.3V 500 1.5V 400 300 200 100 39.0 0 0 50 100 150 200 250 300 350 400 450 500 0 1 2 3 AIC1733-33 Quiescent Current ((µA) Ground Current (µA) 44 42 5 6 7 46 45 43 4 Input Voltage(V) Fig. 4 Input Voltage vs. Short Circuit Current ILOAD (V) Fig. 3 Ground Current vs. ILOAD 500mA 300mA 41 40 150mA 39 -40 1.5V 44 3.3V 42 40 38 VIN=5V 36 -20 0 20 40 60 80 Temperature (°C) Fig. 5 Ground Current vs. Temperature 100 -40 -20 0 20 40 60 80 100 Temperature (°C) Fig. 6 Quiescent vs. Temperature 5 AIC1733 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 1.60 840 1.58 1.56 Output Voltage (V) Current Limit (mA) 800 760 720 VIN=7V 680 VIN=6V VIN=5V 640 AIC1733-15 1.54 1.52 1.50 1.48 1.46 1.44 600 VIN=5V 1.42 560 -40 -20 0 20 40 60 80 1.40 -40 100 -20 0 Temperature (°C) Fig. 7 Current Limit vs. Temperature 40 60 80 100 1.40 3.50 AIC1733-15 AIC1733-33 3.45 1.35 3.40 1.30 3.35 1.25 VDROP (V) Output Voltage (V) 20 Temperature (°C) Fig. 8 VOUT vs. Temperature 3.30 3.25 o TA=-40 C 1.20 o 1.15 TA=20 C o 3.20 1.10 TA=50 C VIN=5V o 1.05 TA=85 C 3.15 3.10 -40 -20 0 20 40 60 80 100 Temperature (°C) Fig. 9 VOUT vs. Temperature 50 100 150 200 250 300 350 400 450 500 IOUT(mA) Fig. 10 800 700 1.00 0 VDROP vs. ILOAD o TA=85 C AIC1733-25 o TA=50 C VDROP (mV) 600 500 o TA=-40 C o 400 TA=20 C 300 200 100 0 0 50 100 150 200 250 300 350 400 450 500 IOUT(mA) Fig. 11 VDROP vs. ILOAD 6 AIC1733 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) IOUT=30mA IOUT=30mA CBP=0.1µF,COUT=1µF CBP=0.1µF VOUT VOUT COUT=4.7µF VSHDN VSHDN Fig. 12 Shutdown Exit Time Fig. 13 Shutdown Exit Time IOUT=30mA CBP=0.1µF,COUT=10µF Vin=VOUT+2V VOUT Vin=VOUT+1V VSHDN VOUT=3.3V CIN=1µF, COUT=1µF CBP=0.1µF Iout=50mA Fig. 14 Shutdown Exit Time Fig. 15 Line Transient Response Vin=VOUT+2V Vin=VOUT+2V Vin=VOUT+1V VOUT=3.3V Vin=VOUT+1V CIN=1µF, COUT=4.7µF Fig. 16 Line Transient Response VOUT=1.5V CIN=1µF, COUT=1µF CBP=0.1µF CBP=0.1µF Iout=50mA Iout=50mA Fig. 17 Line Transient Response 7 AIC1733 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) COUT=4.7µF Vin=VOUT+2V CBP=0.1µF VOUT Vin=VOUT+1V IOUT=180mA VOUT=1.5V CIN=1µF, COUT=4.7µF IOUT=120mA CBP=0.1µF IIout=50mA Fig. 18 Line Transient Response Fig. 19 Load Transient Response COUT=1µF CBP=0.1µF VOUT IOUT=180mA IOUT=120mA Fig. 20 Load Transient Response 8 AIC1733 BLOCK DIAGRAM VIN Current Limiting BP SHDN VREF 1.23V Power Shutdown - Error Amp. + VOUT Thermal Limiting GND PIN DESCRIPTIONS PIN 1 : VIN - Power supply input pin. Bypass with a 1µF capacitor to GND PIN 2 : GND - Ground pin. PIN 3 : SHDN - Active-Low shutdown input pin. PIN 4 : BP - Noise bypass pin. An external bypass capacitor connected to BP pin reduces noises at the output. PIN 5 : VOUT - Output pin. Sources up to 500 mA. DETAILED DESCRIPTIONS OF TECHNICAL TERMS DROPOUT VOLTAGE (VDROP) The dropout voltage is defined as the difference between the input voltage and output voltage at which the output voltage drops 100mV. Below this value, the output voltage will fall as the input voltage reduces. It depends on the load current and junction temperature. LINE REGULATION Line regulation is the ability of the regulator to maintain a constant output voltage as the input voltage changes. The line regulation is specified as the input voltage changes from VIN = VOUT + 1V to VIN = 7V and IOUT = 1mA. LOAD REGULATION Load regulation is the ability of the regulator to maintain a constant output voltage as the load current changes. A pulsed measurement with an input voltage set to VIN = VOUT + VDROP can minimize temperature effects. The load regulation is specified by the output current ranging from 0.1mA to 500mA. 9 AIC1733 CURRENT LIMIT (IIL) AIC1733 includes a current limiting, which monitors and controls the maximum output current if the output is shorted to ground. This can protect the device from being damaged. THERMAL PROTECTION Thermal sensor protects device when the junction temperature exceeds TJ= +155ºC. It signals shutdown logic, turning off pass transistor and allowing IC to cool down. After the IC’s junction temperature cools by 15ºC, the thermal sensor will turn the pass transistor back on. Thermal protection is designed to protect the device in the event of fault conditions. For a continuous operation, do not exceed the absolute maximum junction-temperature rating of TJ= 150ºC, or damage may occur to the device. APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1µF with a 4.7uF aluminum electrolytic output capacitor is recommended. NOISE BYPASS CAPACITOR 0.1µF bypass capacitor at BP pin reduces output voltage noise. And the BP pin has to connect a capacitor to GND. POWER DISSIPATION The maximum power dissipation of AIC1733 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: PMAX = (TJ − TA) (RθJB + RθBA) Where TJ-TA is the temperature difference between the die junction and the surrounding air, RθJB is the thermal resistance of the package, and RθBA is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature 10 AIC1733 PHYSICAL DIMENSIONS SOT-23-5 (unit: mm) D A A E E1 S Y M B O L e e1 SEE VIEW B WITH PLATING MIN. MAX. A 0.95 1.45 A1 0.05 0.15 A2 0.90 1.30 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 e 1.70 0.95 BSC c A A2 b SOT-25 MILLIMETERS e1 BASE METAL A1 SECTION A-A L 1.90 BSC 0.30 L1 0.60 REF 0° 8° 0.25 θ 0.60 GAUGE PLANE SEATING PLANE θ L L1 VIEW B Note : 1. Refer to JEDEC MO-178AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 11 AIC1733 TO-252-5 (unit: mm) A E c2 S Y M B O L L3 b3 e H D A A A TO-252-5L MILLIMETERS MIN. MAX. 2.19 2.38 A1 0.00 0.13 b 0.51 0.71 b3 4.32 5.46 c 0.46 0.61 c2 0.46 0.89 D 5.33 6.22 E 6.35 6.73 e SEE VIEW B b c WITH PLATING BASE METAL 1.27 BSC H 9.40 10.41 L 1.40 1.78 L1 2.67 REF L2 0.51 BSC L3 0.89 2.03 q 0° 8° SECTION A-A θ GAUGE PLANE SEATING PLANE L1 A1 L2 L VIEW B Note: 1. Refer to JEDEC TO-252AD and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 12 AIC1733 SOT-89-5 (unit: mm) D A H E L e e1 S Y M B O L C D1 SOT-89-5 MILLIMETERS MIN. MAX. A 1.40 1.60 B 0.36 0.56 C 0.35 0.44 D 4.40 4.60 D1 1.50 1.83 E 2.29 2.60 e 1.50 BSC e1 3.00 BSC H 3.94 4.25 L 0.80 1.20 B Note: 1. Refer to JEDEC TO-243AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 13