Datasheet
DC Brushless Motor Drivers for Fans
Multifunction Single-phase Full-wave
Fan Motor Driver
BD69730FV
Description
BD69730FV is a pre-driver that controls the motor drive part composed of the power transistors.
It incorporates current limiting circuit, lock protection and automatic restart circuit, PWM soft switching circuit, soft start
circuit, and quick start circuit.
Features
Pre-driver for external power transistors
Speed controllable by DC / direct PWM input
PWM soft switching
Soft start
Quick start
Current limit
Lock protection and automatic restart
Rotation speed pulse signal (FG) output
Package
SSOP-B16
W(Typ) x D(Typ) x H(Max)
5.00mm x 6.40mm x 1.35mm
Applications
Fan motors for general consumer equipment of
desktop PC, and Server, etc.
SSOP-B16
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VCC
20
V
Supply Voltage
Power Dissipation
Pd
0.87
(Note 1)
W
Operating Temperature
Topr
-40 to +105
°C
Storage Temperature
Tstg
-55 to +150
°C
Junction Temperature
Tjmax
150
°C
High side output voltage
VOH
36
V
Low side output voltage
VOL
15
V
Low side output current
IOL
10
mA
Rotation speed pulse signal (FG) output voltage
VFG
20
V
Rotation speed pulse signal (FG) output current
IFG
10
mA
Reference voltage (REF) output current
IREF
12
mA
Hall bias (HB) output current
IHB
12
mA
Input voltage (H+, H-, TH, MIN, CS)
VIN
7
V
(Note 1) Reduce by 7.0mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BD69730FV
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
VCC
4.3
12
17
V
VH1
0
-
7
V
VH2
0
-
Vcc-2
V
VHAMP
±100
-
±500
mV
VIN
0
-
VREF
V
Supply Voltage
Hall Input Voltage1
(more than Vcc=9V)
Hall Input Voltage2
(less than Vcc=9V)
HALL Signal Level
Operating Input Voltage (TH, MIN)
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Parameter
Symbol
Min
Typ
Max
Unit
ICC
3
5
8
mA
Figure 1
VHYS
±5
±10
±15
mV
Figure 2
High Side Output Current
IOH
9.0
12.0
16.5
mA
VOH=12V
Figure 3
High Side Output Leak Current
IOHL
-
-
10
µA
VOH=36V
Figure 4
Low Side Output High Voltage
VOLH
9.3
9.5
-
V
IOL=–5mA
Figure 5,6
Low Side Output Low Voltage
VOLL
-
0.5
0.7
V
IOL=5mA
Figure 7,8
Lock Detection ON Time
tON
0.20
0.30
0.45
s
Figure 9
Lock Detection OFF Time
tOFF
4.0
6.0
9.0
s
Figure 10
FG Output Low Voltage
VFGL
-
-
0.3
V
IFG=5mA
Figure 11,12
FG Output Leak Current
IFGL
-
-
10
µA
VFG=17V
Figure 13
OSC High Voltage
VOSCH
2.3
2.5
2.7
V
Figure 14
OSC Low Voltage
VOSCL
0.8
1.0
1.2
V
Figure 14
OSC Charge Current
ICOSC
-55
-40
-25
µA
Figure 15
OSC Discharge Current
IDOSC
25
40
55
µA
Figure 15
Output ON Duty 1
POH1
75
80
85
%
Output ON Duty 2
POH2
45
50
55
%
Output ON Duty 3
POH3
15
20
25
%
Reference Voltage
VREF
4.8
5.0
5.2
V
IREF=-2mA
Figure 16,17
Hall Bias Voltage
VHB
1.10
1.26
1.50
V
IHB=-2mA
Figure 18,19
Current Limit Setting Voltage
VCL
120
150
180
mV
SS Charge Current
ISS
-300
-120
-50
nA
VSS=0V
Figure 21
TH Input Bias Current
ITH
-
-
-0.2
µA
VTH=0V
Figure 22
MIN Input Bias Current
IMIN
-
-
-0.2
µA
VMIN=0V
Figure 23
CS Input Bias Current
ICS
-
-
-0.2
µA
VCS=0V
Figure 24
Circuit Current
Hall Input Hysteresis Voltage
Conditions
Characteristics
VTH=VREF x 0.26
-
H side pull up R=1kΩ,OSC=470pF
VTH=VREF x 0.35
-
H side pull up R=1kΩ,OSC=470pF
VTH=VREF x 0.44
-
H side pull up R=1kΩ,OSC=470pF
Figure 20
About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation.
Truth Table
Hall Input
H+
HH
L
L
H
A1H
A1L
IC Output
A2H
Hi-Z
L
H
L
L
Hi-Z
A2L
FG
L
H
Hi-Z
L
Motor Drive Output
OUT1
OUT2
L
H
H
L
H; High, L; Low, Hi-Z; High impedance
FG output is open-drain type.
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Datasheet
BD69730FV
Reference data
20
Hall Input Hysteresis Voltage, VHYS [mV]
10
Circuit Current, Icc [mA]
8
6
105°C
25°C
4
-40°C
2
Operating Range
0
105°C
25°C
-40°C
10
0
Operating Range
-40°C
25°C
-10
105°C
-20
0
5
10
15
0
20
5
15
20
Supply Voltage, Vcc [V]
Supply Voltage, Vcc [V]
Figure 1. Circuit Current vs Supply Voltage
Figure 2. Hall Input Hysteresis Voltage vs Supply Voltage
8
High Side Output Leak Current, IOHL [uA]
17
High Side Output Current, IOH [mA]
10
105°C
25°C
-40°C
14
11
8
5
Operating Range
2
6
4
2
105°C
25°C
-40°C
0
Operating Range
-2
0
5
10
15
20
10
20
30
40
Output Voltage, VOH [V]
Supply Voltage, Vcc [V]
Figure 3. High Side Output Current vs Supply Voltage
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Figure 4. High Side Output Leak Current vs Output Voltage
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Datasheet
BD69730FV
Reference data- continued
12
-40°C
10
Low Side Output High Voltage, VOLH [V]
Low Side Output High Voltage, VOLH [V]
12
25°C
105°C
8
6
4
2
0
17V
10
12V
8
6
4
2
4.3V
0
0
2
4
6
8
10
0
Output Source Current, IO [mA]
4
6
8
10
Output Source Current, IO [mA]
Figure 5. Low Side Output High Voltage vs Output Source Current
(Vcc=12V)
Figure 6. Low Side Output High Voltage vs Output Source Current
(Ta=25°C)
1.6
Low Side Output Low Voltage, VOLL [V]
1.6
Low Side Output Low Voltage, VOLL [V]
2
1.2
0.8
105°C
25°C
0.4
-40°C
0.0
4.3V
1.2
0.8
12V
0.4
17V
0.0
0
2
4
6
8
10
Output Sink Current, IO [mA]
2
4
6
8
10
Output sink current, IO [mA]
Figure 7. Low Side Output Low Voltage vs Output Sink Current
(Vcc=12V)
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Figure 8. Low Side Output Low Voltage vs Output Sink Current
(Ta=25°C)
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Datasheet
BD69730FV
Reference data- continued
9.0
Lock Detection OFF time, tOFF [s]
Lock Detection ON Time, tON [s]
0.40
0.35
-40°C
25°C
105°C
0.30
0.25
8.0
7.0
-40°C
25°C
105°C
6.0
5.0
Operating Range
Operating Range
4.0
0.20
0
5
10
15
0
20
5
15
20
Supply Voltage, Vcc [V]
Supply Voltage, Vcc [V]
Figure 9. Lock Detection ON Time vs Supply Voltage
Figure 10. Lock Detection OFF Time vs Supply Voltage
0.8
FG Output Low Voltage, VFGL [V]
0.8
FG Output Low Voltage, VFGL [V]
10
0.6
0.4
105°C
25°C
0.2
-40°C
0.0
0.6
4.3V
0.4
12V
0.2
17V
0.0
0
2
4
6
8
10
Output Sink Current, IFG [mA]
2
4
6
8
10
Output Sink Current, IFG [mA]
Figure 11. FG Output Low Voltage vs Output Sink Current
(Vcc=12V)
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Figure 12. FG Output Low Voltage vs Output Sink Current
(Ta=25°C)
TSZ02201-0H1H0B101410-1-2
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Datasheet
BD69730FV
Reference data- continued
8
3.0
OSC High/Low Voltage, VOSCH/VOSCL [V]
FG Output Leak Current, IFGL [uA]
Operating Range
6
4
2
105°C
25°C
-40°C
0
Operating Range
105°C
25°C
-40°C
2.5
2.0
1.5
105°C
25°C
-40°C
1.0
0.5
-2
0
5
10
15
0
20
5
15
20
Supply Voltage, Vcc [V]
Output Voltage, VFG [V]
Figure 13. FG Output Leak Current vs Output Voltage
Figure 14. OSC High/Low Voltage vs Supply Voltage
6
60
105°C
40
25°C
-40°C
Reference Voltage, VREF [V]
OSC Charge/Discharge Current, ICOSC/IDOSC [uA]
10
20
0
Operating Range
-20
-40°C
25°C
-40
105°C
25°C
-40°C
5
4
3
Operating Range
105°C
-60
2
0
5
10
15
20
5
10
15
20
Supply Voltage, Vcc [V]
Supply Voltage, Vcc [V]
Figure 15. OSC Charge/Discharge Current vs Supply Voltage
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Figure 16. Reference Voltage vs Supply Voltage
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BD69730FV
5.2
1.5
5.1
1.4
Hall Bias Voltage, VHB [V]
Reference Voltage, VREF [V]
Reference data- continued
105°C
25°C
5.0
-40°C
4.9
105°C
25°C
-40°C
1.3
1.2
Operating Range
4.8
1.1
0
3
6
9
12
0
5
Output Source Current, IREF [mA]
15
20
Supply Voltage, Vcc [V]
Figure 17. Reference Voltage vs Output Source Current
(Vcc=12V)
Figure 18. Hall Bias Voltage vs Supply Voltage
180
Current Limit Setting Voltage, VCL [mV]
1.5
Hall Bias Voltage, VHB [V]
10
1.4
105°C
25°C
1.3
-40°C
1.2
1.1
165
105°C
25°C
-40°C
150
135
Operating Range
120
0
3
6
9
12
Output Source Current: IHB [mA]
5
10
15
20
Supply Voltage, Vcc [V]
Figure 19. Hall Bias Voltage vs Output Source Current
(Vcc=12V)
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Figure 20. Current Limit Setting Voltage vs Supply Voltage
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Datasheet
BD69730FV
Reference data- continued
-50
0.05
0.00
-40°C
25°C
105°C
-150
105°C
25°C
-40°C
TH Bias Current, ITH [uA]
SS Charge Current, ISS [nA]
-100
-0.05
-200
-0.10
-250
-0.15
Operating Range
Operating Range
-300
-0.20
0
5
10
15
20
0
5
Supply Voltage, Vcc [V]
10
15
20
Supply Voltage, Vcc [V]
Figure 21. SS Charge Current vs Supply Voltage
Figure 22. TH Bias Current vs Supply Voltage
0.05
0.05
0.00
0.00
CS Bias Current, ICS [uA]
MIN Bias Current, IMIN [uA]
105°C
25°C
-40°C
-0.05
105°C
25°C
-40°C
-0.05
-0.10
-0.10
-0.15
-0.15
Operating Range
Operating Range
-0.20
-0.20
0
5
10
15
20
Supply Voltage, Vcc [V]
5
10
15
20
Supply Voltage, Vcc [V]
Figure 23. MIN Bias Current vs Supply Voltage
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Figure 24. CS Bias Current vs Supply Voltage
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Datasheet
BD69730FV
Pin Configuration
Block Diagram
1
(TOP VIEW)
FG
OSC
MIN
1
16
15
2
3
14
GND
2
FG
SIGNAL
OUTPUT
PWM SOFT
SWITCHING
TSD
HALL
AMP
OSC
OSC
GND
H-
16
15
HALL
COMP
H3
HB
TH
4
13
H+
REF
5
12
SS
VCC
6
11
CS
A1H
7
10
A2H
A1L
8
9
A2L
4
5
MIN
PWM
COMP
TH
PWM
COMP
HB
LOCK
PROTECT
H+
QUICK
START
REF
SS
SOFT START
& CURRENT
LIMIT COMP
VCC
PREDRIVER
A1H
REG
REG
CS
13
12
11
A2H
7
8
14
VCL
REF
VCC
6
CONTROL
LOGIC
HALL
BIAS
10
A2L
A1L
9
Pin Description
Pin No.
Pin Name
1
FG
2
OSC
Oscillating capacitor connecting pin
3
MIN
Minimum output duty setting pin
4
TH
Output duty controllable input pin
5
REF
Reference voltage output pin
6
VCC
Power supply pin
7
A1H
High side output 1 pin
8
A1L
Low side output 1 pin
9
A2L
Low side output 2 pin
10
A2H
High side output 2 pin
11
CS
Output current detection pin
12
SS
Soft start capacitor connecting pin
13
H+
Hall + input pin
14
HB
Hall bias pin
15
H-
Hall - input pin
16
GND
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Speed pulse signal output pin
Ground pin
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Datasheet
BD69730FV
Application circuit example(Constant values are for reference)
1) PWM input application 1
It is an example of the application of converting the external PWM duty into DC voltage, and controlling the rotational
speed. Minimum rotational speed can be set.
Protection of FG open-drain
Output PWM frequency
setting
Minimum output duty setting
Noise measures of substrate
SIG
1
0Ω to
100pF
to 1000pF
2
FG
OSC
3
4
GND
TSD
HALL
AMP
H-
OSC
MIN
PWM
COMP
TH
CONTROL
PWM
LOGIC
COMP
PWM
5
REF
1µF to
HALL
BIAS
HB
Hall bias is set according to
the amplitude of hall element
output and hall input voltage
range.
16
15
LOCK
PROTECT
H+
QUICK
START
REF
SOFT START
& CURRENT
LIMIT COMP
PREDRIVER
REG
REG
CS
8
12
11
0.01µF
to 4.7µF
200Ω
to 20kΩ
10
A1L
A2L
Soft start time setting
100pF
to 0.01µF
A2H
7
So bypass capacitor,
arrangement near to VCC
terminal as much as possible
H
13
VCL
VCC
A1H
14
0Ω to
SS
Vcc
0.1µF to
6
Reverse-connected
prevention of the FAN
PWM SOFT
SWITCHING
HALL
COMP
Circuit that converts PWM
duty into DC voltage
Stabilization of REF voltage
SIGNAL
OUTPUT
Low-pass filter for RNF
voltage smoothing
9
Drive the PMOS FET gate by
constant current flowing to
IC
＋
470Ω to 1kΩ
1µF to
Reverse-connected
prevention of the FAN
Adjustment the PMOS FET
slew rate
M
So bypass capacitor,
arrangement near to FETs as
much as possible
0Ω to 2kΩ
Adjustment the NMOS FET
slew rate
0Ω to 2kΩ
2kΩ to 20kΩ
Stabilization of NMOS FET
gate drive
－
To limit motor current, the
current is detected.
Note the power consumption
of detection resistance.
Figure 25. Application of converting PWM duty to DC voltage
Substrate design note
a) Motor power and ground lines are made as fat as possible.
b) IC power line is made as fat as possible.
c) IC ground line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged
near to (-) land.
d) The bypass capacitors (VCC side and VM side) are arrangement near to VCC terminal and FETs, respectively.
e) H+ and H- lines are arranged side by side and made from the hall element to IC as shorter as possible,
because it is easy for the noise to influence the hall lines.
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BD69730FV
Application circuit example(Constant values are for reference)
2) PWM input application 2
It is an example of the application of inverting the external PWM input, and controlling the rotational speed. In this
application, if the external PWM input is OPEN, it controls by the set maximum rotational speed. Minimum rotational
speed cannot be set.
SIG
Circuit that input direct PWM
(Ref.) PWM input frequency is
20kHz to 50kHz
1
0Ω to
100pF
to 1000pF
2
FG
OSC
SIGNAL
OUTPUT
PWM SOFT
SWITCHING
GND
TSD
HALL
AMP
H-
OSC
16
15
HALL
COMP
3
MIN
PWM
COMP
TH
CONTROL
PWM
LOGIC
COMP
PWM
4
To be disable TH terminal, set
TH voltage more than OSC
high level (Typ 2.5V) and less
than REF voltage (Typ 5.0V).
5
REF
6
1µF to
HB
LOCK
PROTECT
H+
QUICK
START
REF
SOFT START
& CURRENT
LIMIT COMP
PREDRIVER
REG
REG
CS
8
12
11
A2H
10
7
A1L
H
13
VCL
VCC
A1H
14
0Ω to
SS
Vcc
0.1µF to
HALL
BIAS
A2L
0.01µF
to 4.7µF
100pF
to 0.01µF
200Ω
to 20kΩ
9
＋
470Ω to 1kΩ
1µF to
M
0Ω to 2kΩ
0Ω to 2kΩ
2kΩ to 20kΩ
－
Figure 26. Application of direct PWM input
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BD69730FV
Application circuit example(Constant values are for reference)
3) DC voltage input application 1
It is an example of the application for the fixed rotation speed control by DC voltage. Minimum rotational speed cannot
be set.
SIG
1
0Ω to
100pF
to 1000pF
2
FG
OSC
SIGNAL
OUTPUT
PWM SOFT
SWITCHING
GND
TSD
HALL
AMP
H-
OSC
16
15
HALL
COMP
3
Set TH voltage less than OSC
high level (Typ 2.5V)
4
5
MIN
PWM
COMP
TH
CONTROL
PWM
LOGIC
COMP
REF
6
1µF to
HB
LOCK
PROTECT
H+
QUICK
START
REF
SOFT START
& CURRENT
LIMIT COMP
PREDRIVER
REG
REG
CS
8
12
11
A2H
10
7
A1L
H
13
VCL
VCC
A1H
14
0Ω to
SS
Vcc
0.1µF to
HALL
BIAS
A2L
0.01µF
to 4.7µF
100pF
to 0.01µF
200Ω
to 20kΩ
9
＋
470Ω to 1kΩ
1µF to
M
0Ω to 2kΩ
0Ω to 2kΩ
2kΩ to 20kΩ
－
Figure 27. Application of DC voltage input
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BD69730FV
Application circuit example(Constant values are for reference)
4) DC voltage input application 2 (Thermistor control application)
It is an example of the application of controlling the rotational speed by the ambient temperature. In this application, if
the thermistor is OPEN, it controls by the set maximum rotational speed.
SIG
1
0Ω to
100pF
to 1000pF
2
FG
OSC
SIGNAL
OUTPUT
PWM SOFT
SWITCHING
GND
TSD
HALL
AMP
H-
OSC
16
15
HALL
COMP
3
The input voltage is
changeable in the ambient
temperature set by the
thermistor constant.
Correction resistance of
making to linear
Insertion if necessary
4
5
MIN
PWM
COMP
TH
CONTROL
PWM
LOGIC
COMP
REF
6
1µF to
HB
LOCK
PROTECT
H+
QUICK
START
REF
SOFT START
& CURRENT
LIMIT COMP
PREDRIVER
REG
REG
CS
8
12
11
A2H
10
7
A1L
A2L
H
13
VCL
VCC
A1H
14
0Ω to
SS
Vcc
0.1µF to
HALL
BIAS
0.01µF
to 4.7µF
100pF
to 0.01µF
200Ω
to 20kΩ
9
＋
470Ω to 1kΩ
1µF to
M
0Ω to 2kΩ
0Ω to 2kΩ
2kΩ to 20kΩ
－
Figure 28. Application of thermistor control
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Application circuit example(Constant values are for reference)
5) High voltage (24V power supply) application (PWM input application 1)
It is an example of the application of converting the external PWM duty into DC voltage, and controlling the rotational
speed. Minimum rotational speed can be set.
Take a measure to ensure
maximum absolute rating of
FG (20V).
SIG
0Ω to
1
100pF
to 1000pF
2
FG
OSC
SIGNAL
OUTPUT
PWM SOFT
SWITCHING
GND
TSD
HALL
AMP
H-
OSC
16
15
HALL
COMP
Regenerative circuit of back
EMF
3
4
MIN
PWM
COMP
TH
CONTROL
PWM
LOGIC
COMP
PWM
5
0.1µF to
0Ω to 1kΩ
REF
1µF to
HB
LOCK
PROTECT
H+
QUICK
START
REF
SOFT START
& CURRENT
LIMIT COMP
PREDRIVER
REG
REG
CS
8
12
11
0.01µF
to 4.7µF
100pF
to 0.01µF
A2H
10
7
A1L
A2L
H
13
VCL
VCC
A1H
14
0Ω to
SS
Vcc
6
HALL
BIAS
200Ω
to 20kΩ
9
＋
1µF to
Generative circuit of Vcc
input voltage
M
0Ω to 2kΩ
Protection of FET (between
drain and source) and motor
coil
2kΩ to 20kΩ
－
Figure 29. 24V power supply application of PWM input
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Application circuit example(Constant values are for reference)
6) High voltage (over 48V power supply) application (PWM input application 1)
It is an example of the application of converting the external PWM duty into DC voltage, and controlling the rotational
speed. Minimum rotational speed can be set.
SIG
0Ω to
1
100pF
to 1000pF
2
FG
OSC
SIGNAL
OUTPUT
PWM SOFT
SWITCHING
GND
TSD
HALL
AMP
H-
OSC
16
15
HALL
COMP
3
4
MIN
PWM
COMP
TH
CONTROL
PWM
LOGIC
COMP
PWM
5
6
1µF to
HB
LOCK
PROTECT
H+
QUICK
START
REF
SOFT START
& CURRENT
LIMIT COMP
PREDRIVER
REG
REG
CS
8
12
11
0.01µF
to 4.7µF
100pF
to 0.01µF
200Ω
to 20kΩ
A2H
7
10
A1L
A2L
H
13
VCL
VCC
A1H
14
0Ω to
SS
Vcc
0.1µF to
0Ω to 1kΩ
REF
HALL
BIAS
9
＋
1µF to
Take a measure to ensure
maximum absolute rating of
A1H and A2H (36V).
M
0Ω to 2kΩ
2kΩ to 20kΩ
－
Figure 30. Over 48V power supply application of PWM input
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Functional descriptions
1) Variable speed operation
Rotating speed changes by PWM duty on the high side outputs (A1H, A2H terminals). PWM operation enables,
a) By DC voltage input in TH terminal, and MIN terminal
b) By pulse input in MIN terminal
a) PWM operation by DC input
As shown in Figure 31, to change high side output ON duty, DC voltage input from TH terminal is compared with
triangle wave produced by the OSC circuit. MIN terminal is for setting the minimum rotating speed. ON duty is
determined by either TH terminal voltage or MIN terminal voltage, whichever is lower.
OSC voltage > TH voltage (MIN voltage): high side output is ON
OSC voltage < TH voltage (MIN voltage): high side output is OFF
REF
PWM
REF
REF
PWM
COMP
OSC
LPF
TH
PWM
COMP
MIN
OSC
REF
REF
PWM
COMP
OSC
TH
MIN
OSC
TH
PWM
COMP
MIN
OSC
REF
PWM
COMP
PWM
COMP
OSC
If thermistor is OPEN,
motor drives the full speed.
Figure 31. DC input application 1
Figure 32. DC input application 2
Figure 33. Protection for thermistor coming off
H–
High
H+
REF
TH
MIN
OSC
Low
5.0V
2.5V
1.0V
0.0V
GND
High
A1H
Low
High side output ON
: High impedance
High
A2H
Low
Full
Motor
Tor que
Min.
Zero
Figure 34. DC input operation timing chart
Dividing resistance of the internal regulator (equal to Typ 5.0V REF terminal) generates OSC high level (Typ
2.5V) and OSC low level (Typ 1.0V) voltage, and the ratio of those voltages is designed to be hard to fluctuate.
When the input voltage at TH terminal is constant, effect by fluctuation of OSC H/L voltage is large. However, by
setting that an application of REF voltage generates input voltage via TH, application can be made hard to be
affected by voltage fluctuation of triangle wave. For an application that requires strict precision, determine a
value with sufficient margin after full consideration of external constant is taken.
Protection against thermistor coming off
When the thermistor becomes an opening (the TH voltage is more than the REF voltage) as a protection
function in the DC input application that uses the thermistor like Figure 33, it doesn't depend on the MIN
voltage and it sets by the maximum rotation speed.
Setting of output oscillating frequency at DC voltage input
Frequency (Fosc) in which the high side outputs are operated PWM by DC voltage input is set according to
capacity value (Cosc) of the capacitor connected with OSC terminal.
FOSC[Hz] = (|IDOSC[A] x ICOSC[A]|) / {COSC[F] x (|IDOSC[A]| + |ICOSC[A]|) x (VOSCH[V] - VOSCL[V])}
(ex.) The frequency when output PWM operates becomes about 28kHz when assuming that Cosc is 470pF.
FOSC[Hz] = {|40[µA] x (-40[µA])|} / {470[pF] x (|40[µA]| + |-40[µA]|) x (2.5[V] - 1.0[V])}
= 28369[Hz]
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1) Variable speed operation – Continued
The voltage of the terminal becomes irregular as for TH or MIN terminals when opening, and input both voltages
to both terminals when you turn on IC power supply (Vcc).
Setting less than internal
OSC High level
(Torque ON setting)
OK
REF
Pull down setting
(Torque ON setting)
OK
Pull up setting
(Protection against thermistor
coming off enables)
OK
REF
REF
TH
MIN
TH
MIN
TH
MIN
Open setting
(Prohibit input)
NG
REF
TH
MIN
Figure 35. Setting of the variable speed function
b) PWM operation by pulse input
Pulse signal can be input to MIN terminal for PWM operation as shown in Figure 38. The ON duty of the high
side output changes by the cycle of the input pulse signal as shown in Figure 38. The TH terminal is set more
than OSC high level and less than REF voltage. Set the voltage of MIN terminal as,
REF ≥ MIN > OSC high level: high side output is OFF
GND ≤ MIN < OSC low level: high side output is ON
REF
OSC
PWM
MIN
TH
REF
REF or
V CC
REF
PWM
COMP
PWM
COMP
REF
PWM
COMP
OSC
MIN
PWM
COMP
TH
PWM
OSC
OSC
If PWM is OPEN,
MIN is REF
If PWM is OPEN,
MIN is 0V
Figure 36. PWM input application 1
Figure 37. PWM input application 2
H–
High
H+
Low
High
PWM
Low
REFMIN
TH
5.0V
2.5V
OSC
1.0V
0.0V
GND
High
A1H
Low
High side output ON
: High impedance
High
A2H
Low
Full
Motor
Tor que
Zero
Figure 38. PWM input operation timing chart
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2) Current limit
The current limit circuit turns off the output, when the current that flows to the motor coil is detected exceeding a set
value. The current value that current limit operates is determined by internal setting voltage and voltage of CS terminal.
In Figure 39, Io is the current flowed to the motor coil, RNF is the resistance detected the current, and PR is the power
consumption of RNF. When RNF=0.1[Ω], the current limit setting voltage (VCL) is 150mV,
Io[A] = VCL[V] / RNF[Ω]
= 150[mV] / 0.1[Ω]
= 1.5[A]
PR[W] = VCL[V] x Io[A]
= 150[mV] x 1.5[A]
= 0.225[W]
Be shorted CS terminal to GND, when the current limit
function is not used.
RCS and CCS consist of the low-pass filter for smoothing
RNF voltage.
Share and assume the ground of CCS to be the small
signal ground line with the GND pin of IC for the
malfunction prevention of a current limit. Separate with
the motor large current ground line with which RNF is
connected. Soft start capacitor CSS described later is
similar. (Refer to P.10 substrate design note c))
M
CSS
CS
GND
CCS
RNF
SOFT START &
CURRENTLIMIT
COMP
SS
RCS
Io
Vcl
ISS
Small signal ground line of driver IC
Large current ground line of motor
－
Figure 39. Setting of current limit and ground line
3) Soft start
Soft start is a function to gradually raise a driving torque at the time of motor start.
Be effective against reducing undesired sound and inrush current.
The soft start time is set by the charge to the capacitor connected with the terminal SS.
If motor output current (IO) and SS time (TSS) are decided, the value of capacitor (CSS) that sets a soft start can be
calculated by the following expressions because SS charge current (ISS) is 120nA.
CSS[F] = (ISS[A] x TSS[s]) / (IO[A] x RNF[Ω])
(ex.) When assuming that TSS = 0.47[s], IO = 1.2[A], and RNF = 0.1[Ω],
CSS[F] = (120[nA] x 0.47[s]) / (1.2[A] x 0.1[Ω])
= 0.47 x 10-6[F]
Power supply
0V
SS discharge current time (1ms)
50mV
SS voltage
0V
IO
ICC
0A
Soft Start time (TSS)
LOCK protection function :ON
LOCK protection function :OFF
Figure 40. Output current characteristics by the soft start function
When Soft start time is set for a long time, lock protection may be detected without enough motor torque.
Therefore, a lock protection function is turned off until SS voltage becomes 50mV (Typ).
If it is not used the soft start function, open the SS terminal.
Pull down setting
(Current limit disables)
OK
Connecting to RNF
(Current limit enables)
OK
Open setting
(Prohibit input)
NG
Open setting
(Soft start disables)
OK
Setting of capacitor
(Soft start enables)
OK
RNF
CS
CS
CS
SS
SS
Figure 41. Setting of the current limit and the soft start functions
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4) Quick start
When torque off logic is input by the control signal over fixed time (1.0ms), the lock protection function disables. And
the motor could restart quickly at the timing of control signal is input.
The lock protection function doesn’t work in an input frequency that is slower than 1kHz when assuming high level
duty = 100% of the MIN input signal. Input signal frequency is faster than 2kHz.
Motor idling
H–
High
H+
Low
Vref
MIN
0V
Lock
protection
signal
Enable
typ. 1.0ms
Disable
Tss
TH
or MIN
torque
Quick start standby mode
Motor
Output
ON duty
0%
Torque OFF
Motor stop
Tor que ON
Figure 42. PWM input and quick start timing chart
5) Hall input setting
Hall input voltage range is shown in operating conditions (P.2).
Hall input voltage range
Hall input upper limit voltage
7V (Vcc>9V)
Vcc-2V (Vcc<9V)
Figure 43. Hall input voltage range
Hall input lower voltage
GND
Adjust the value of hall element bias resistor R1 in Figure 44 so that the input voltage of a hall amplifier is input in "Hall
Input Voltage" including signal amplitude.
In order to detect rotation of a motor, the amplitude of hall signal more than "Hall Input Hysteresis Voltage" is required.
In consideration of PWM soft switching to mention later, input hall signal more than ±100mV at least.
Reducing the noise of hall signal
Vcc noise or the like depending on the wiring pattern of board may affect Hall element. In this case, place a
capacitor like C1 in Figure 44. In addition, when wiring from the hall element output to IC hall input is long, noise
may be loaded on wiring. In this case, place a capacitor like C2 in Figure 44.
H-
H+
HB
C2
R1
C1
RH
Hall element
Hall bias current
= HB / (R1 + RH )
Figure 44. Application near hall signal
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6) PWM soft switching
The PWM soft switching section is set to the timing before and after the change of the hall signal. Be effective against
reducing undesired sound. Adjusting the amplitude of the hall signal can change the length of the PWM soft switching
section. The PWM soft switching section becomes wide if the amplitude of the hall signal is reduced, and the gradient
of the output current becomes smooth. However, when a soft switching is applied too much, torque shortage might be
caused. Input hall signal more than ±100mV at least.
The PWM soft switching function operates in the DC input application and the pulse input application.
Hall amplitude; Middle
Hall amplitude; Large
Hall amplitude; small
Large
H–
Mid
Small
Small
Mid
H+
Large
High
OUT1
Low
High
OUT2
Low
Motor
Current
0A
Figure 45. Relation between hall signal amplitude and output wave
.
7) Lock protection and automatic restart
Motor rotation is detected by hall signal period. IC detects motor rotation is stop when the period becomes longer than
the time set up at the internal counter, and IC turns off the output. Lock detection ON time (tON) and lock detection OFF
time (tOFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF time is always
constant. Timing chart is shown in Figure 46.
Motor idling
H–
High
H+
Low
Toff (typ. 6.0s)
Ton (typ. 0.3s)
Toff
Toff
Ton
Ton
High
A1H
Low
High
A1L
Low
High
A2H
Low
High
A2L
Low
High
FG
Low
TH or MI N
torque
Motor
Output
ON duty
Motor locking Lock detection
Tss
Tss
Lock r elease
Tss
0%
: High impedance
: ON duty up from 0%
Figure 46. Lock protection (incorporated counter system) timing chart
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8) The upper side output of pre driver
The upper side output of pre driver is constant current open-drain. In Figure 47, decide the resistance of R1 so that the
voltage generated between gate and source of external PMOS transistor may exceed enough the threshold voltage of
the transistor.
CS
Vcc
6
11
IH
A1H
A2H
7
10
M1
A1L
A2L
8
9
R1
24V
R2
Figure 47. 24V application
(ex.) At R1=1kΩ, PMOS transistor gate-source voltage VGSP can be shown below,
VGSP = R1×IH
= 1kΩ×12mA (Typ)
= 12V
R2 is used to suppress the power consumption of IC.
At power supply = 24V, the power consumption PM1 of upside output transistor M1 is
PM1 = { VM - (R1 + R2)×IH }×IH
= 144mW (at R1 = 1kΩ, R2 = 0Ω)
= 72mW (at R1 = 1kΩ, R2 = 0.5kΩ)
Useless power consumption in the upside output is suppressed by appropriately setting R2, and a permissible loss of the package
can be used effectively in lower output.
High voltage application
It is possible to correspond to 24V and 48V power supply by using the application circuit that is set not to exceed
the absolute maximum rating of Vcc, A1H to A2L, and FG terminal.
Refer to the application circuit of P14 and P15.
Absolute maximum rating voltage of pre driver
Power supply
Lower output
15V
20V
(CMOS output)
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Equivalent circuit
1) Hall input terminal
2) Motor output terminal
Output current detecting resistor connecting terminal
A1H
A2H
A1L
A2L
H+, H-
3) Output current detecting terminal
CS
4) Reference voltage terminal
5) Hall bias terminal
6) FG output terminal
FG
HB
REF
31kΩ
36kΩ
7) Variable amplifier input terminal 8) Minimum rotating speed setting terminal 9) Oscillating capacitor connecting terminal
OSC
TH
MIN
10) Soft start capacitor-connecting terminal
SS
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Safety Measure
1) Reverse Connection Protection Diode
Reverse connection of power results in IC destruction as shown in Figure 48. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC.
In normal energization
Reverse power connection
VCC
After reverse connection
destruction prevention
VCC
VCC
Circuit
block
Each
pin
Circuit
block
Each
pin
Circuit
block
GND
Large current flows
Æ Thermal destruction
GND
Internal circuit impedance high
Æ amperage small
Each
pin
GND
No destruction
Figure 48. Flow of Current when Power is Connected Reversely
2) Protection against VCC Voltage Rise by Back Electromotive Force
Back EMF generates regenerative current to power supply. However, when reverse connection protection diode is
connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
ON
ON
Phase
switching
ON
Figure 49. VCC Voltage Rise by Back Electromotive Force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place
(A) Capacitor or (B) Zener diode between VCC and GND. It necessary, add both (C).
(B) Zener Diode
(A) Capacitor
ON
ON
ON
ON
(C) Capacitor and Zener Diode
ON
ON
Figure 50. Protection against VCC Voltage Rise
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3) Problem of GND Line PWM Switching
Do not perform PWM switching of GND line because GND potential cannot be kept to a minimum.
VCC
M
Motor
Driver
Controller
GND
PWM input
Prohibited
Figure 51. GND Line PWM Switching Prohibited
4) FG Output
FG is an open drain outuput and requires pull-up resistor. VCC voltage that is beyond its absolute maximum rating
when FG pin is directly connected to power supply, could damage the IC. The IC can be protected by adding resistor
R1. (as shown in Figure 52)
VCC
Pull-up
resistor
FG
Protection
Resistor R1
Connector
of board
Figure 52. Protection of FG Pin
Thermal Derating Curve
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja.
Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured
at a specified condition. Figure 53 shows a thermal derating curve.
Pd(W)
1.0
0.87
0.8
0.6
0.4
0.2
0
25
50
75
100 105 125
150
Ta(°C)
Reduce by 7.0 mW/°C over 25°C.
(70.0mm x 70.0mm x 1.6mm glass epoxy board)
Figure 53. Thermal Derating Curve
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 54. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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8.Jun.2015 Rev.001
Datasheet
BD69730FV
Ordering Information
B
D
6
9
7
3
0
Part Number
F
V
-
Package
FV: SSOP-B16
GE2
Packaging and forming specification
G: Halogen free
E2: Embossed tape and reel
Marking Diagrams
SSOP-B16(TOP VIEW)
Part Number Marking
69730
LOT Number
1PIN MARK
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TSZ22111・15・001
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TSZ02201-0H1H0B101410-1-2
8.Jun.2015 Rev.001
Datasheet
BD69730FV
Physical Dimension, Tape and Reel Information
Package Name
SSOP-B16
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
)
∗ Order quantity needs to be multiple of the minimum quantity.
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8.Jun.2015 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD69730FV - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD69730FV
SSOP-B16
2500
2500
Taping
inquiry
Yes