MB96620 Series
F2MC-16FX 16-Bit Microcontroller
MB96620 series is based on Cypress advanced F2MC-16FX architecture (16-bit with instruction pipeline for RISC-like performance).
2
2
The CPU uses the same instruction set as the established F MC-16LX family thus allowing for easy migration of F MC-16LX
2
Software to the new F MC-16FX products.
F2MC-16FX product improvements compared to the previous generation include significantly improved performance - even at the
same operation frequency, reduced power consumption and faster start-up time.
For high processing speed at optimized power consumption an internal PLL can be selected to supply the CPU with up to 32MHz
operation frequency from an external 4MHz to 8MHz resonator. The result is a minimum instruction cycle time of 31.2ns going
together with excellent EMI behavior. The emitted power is minimized by the on-chip voltage regulator that reduces the internal CPU
voltage. A flexible clock tree allows selecting suitable operation frequencies for peripheral resources independent of the CPU speed.
Features
Technology
DMA
0.18m CMOS
Automatic transfer function independent of CPU, can be
assigned freely to resources
CPU
F
2
MC-16FX CPU
instruction set for controller applications
(bit, byte, word and long-word data types, 23 different
addressing modes, barrel shift, variety of pointers)
8-byte instruction queue
Signed multiply (16-bit × 16-bit) and divide (32-bit/16-bit)
instructions available
Interrupts
Fast
Interrupt processing
programmable priority levels
Non-Maskable Interrupt (NMI)
Optimized
8
CAN
Supports
CAN protocol version 2.0 part A and B
certified
Bit rates up to 1Mbps
32 message objects
Each message object has its own identifier mask
Programmable FIFO mode (concatenation of message
objects)
Maskable interrupt
Disabled Automatic Retransmission mode for Time
Triggered CAN applications
Programmable loop-back mode for self-test operation
ISO16845
System clock
PLL clock multiplier (1 to 8, 1 when PLL stop)
to 8MHz crystal oscillator
(maximum frequency when using ceramic resonator
depends on Q-factor)
Up to 8MHz external clock for devices with fast clock input
feature
32.768kHz subsystem quartz clock
100kHz/2MHz internal RC clock for quick and safe startup,
clock stop detection function, watchdog
Clock source selectable from mainclock oscillator, subclock
oscillator and on-chip RC oscillator, independently for CPU
and 2 clock domains of peripherals
The subclock oscillator is enabled by the Boot ROM
program controlled by a configuration marker after a Power
or External reset
Low Power Consumption - 13 operating modes (different
Run, Sleep, Timer, Stop modes)
On-chip
4MHz
USART
Full
duplex USARTs (SCI/LIN)
range of baud rate settings using a dedicated reload
timer
Special synchronous options for adapting to different
synchronous serial protocols
LIN functionality working either as master or slave LIN
device
Extended support for LIN-Protocol to reduce interrupt load
Wide
On-chip voltage regulator
Internal voltage regulator supports a wide MCU supply
voltage range (Min=2.7V), offering low power consumption
I2 C
Low voltage detection function
Up
to 400kbps
and Slave functionality, 7-bit and 10-bit addressing
Master
Reset is generated when supply voltage falls below
programmable reference voltage
Code Security
Protects Flash Memory content from unintended read-out
Cypress Semiconductor Corporation
Document Number: 002-04712 Rev.*A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 17, 2016
MB96620 Series
A/D converter
SAR-type
8/10-bit
resolution
Signals interrupt on conversion end, single conversion
mode, continuous conversion mode,
stop conversion mode, activation by software, external
trigger, reload timers and PPGs
Range Comparator Function
Source Clock Timers
Three independent clock timers (23-bit RC clock timer,
23-bit Main clock timer, 17-bit Sub clock timer)
Hardware Watchdog Timer
Hardware
watchdog timer is active after reset
function of Watchdog Timer is used to select the
lower window limit of the watchdog interval
Window
Reload Timers
16-bit
wide
with 1/21, 1/22, 1/23, 1/24, 1/25, 1/26 of peripheral
clock frequency
Event count function
Prescaler
Free-Running Timers
Signals
an interrupt on overflow, supports timer clear upon
match with Output Compare (0, 4)
1
2
3
4
5
6
7
8
Prescaler with 1, 1/2 , 1/2 , 1/2 , 1/2 , 1/2 , 1/2 , 1/2 , 1/2
of peripheral clock frequency
Input Capture Units
16-bit
wide
an interrupt upon external event
Rising edge, Falling edge or Both (rising & falling) edges
sensitive
Signals
Output Compare Units
16-bit
wide
an interrupt when a match with Free-running Timer
occurs
A pair of compare registers can be used to generate an
output signal
Signals
Programmable Pulse Generator
16-bit
down counter, cycle and duty setting registers
be used as 2 × 8-bit PPG
Interrupt at trigger, counter borrow and/or duty match
PWM operation and one-shot operation
Internal prescaler allows 1, 1/4, 1/16, 1/64 of peripheral
clock as counter clock or of selected Reload timer
underflow as clock input
Can be triggered by software or reload timer
Can trigger ADC conversion
Timing point capture
Can
Quadrature Position/Revolution Counter (QPRC)
Up/down
count mode, Phase difference count mode,
Count mode with direction
16-bit position counter
16-bit revolution counter
Two 16-bit compare registers with interrupt
Detection edge of the three external event input pins AIN,
BIN and ZIN is configurable
Document Number: 002-04712 Rev.*A
Real Time Clock
Operational
on main oscillation (4MHz), sub oscillation
(32kHz) or RC oscillation (100kHz/2MHz)
Capable to correct oscillation deviation of Sub clock or RC
oscillator clock (clock calibration)
Read/write accessible second/minute/hour registers
Can signal interrupts every half
second/second/minute/hour/day
Internal clock divider and prescaler provide exact 1s clock
External Interrupts
Edge
or Level sensitive
mask bit per channel
Each available CAN channel RX has an external interrupt
for wake-up
Selected USART channels SIN have an external interrupt
for wake-up
Interrupt
Non Maskable Interrupt
Disabled
after reset, can be enabled by Boot-ROM
depending on ROM configuration block
Once enabled, can not be disabled other than by reset
High or Low level sensitive
Pin shared with external interrupt 0
I/O Ports
Most
of the external pins can be used as general purpose
I/O
2
All push-pull outputs (except when used as I C SDA/SCL
line)
Bit-wise programmable as input/output or peripheral signal
Bit-wise programmable input enable
One input level per GPIO-pin (either Automotive or CMOS
hysteresis)
Bit-wise programmable pull-up resistor
Built-in On Chip Debugger (OCD)
One-wire
debug tool interface
function:
• Hardware break: 6 points (shared with code event)
• Software break: 4096 points
Event function
• Code event: 6 points (shared with hardware break)
• Data event: 6 points
• Event sequencer: 2 levels + reset
Execution time measurement function
Trace function: 42 branches
Security function
Break
Flash Memory
Dual
operation flash allowing reading of one Flash bank
while programming or erasing the other bank
Command sequencer for automatic execution of
programming algorithm and for supporting DMA for
programming of the Flash Memory
Supports automatic programming, Embedded Algorithm
Write/Erase/Erase-Suspend/Resume commands
A flag indicating completion of the automatic algorithm
Erase can be performed on each sector individually
Sector protection
Flash Security feature to protect the content of the Flash
Low voltage detection during Flash erase or write
Page 2 of 65
MB96620 Series
Contents
1. Product Lineup .................................................................................................................................................................. 5
2. Block Diagram ................................................................................................................................................................... 6
3. Pin Assignment ................................................................................................................................................................. 7
4. Pin Description .................................................................................................................................................................. 8
5. Pin Circuit Type ............................................................................................................................................................... 10
6. I/O Circuit Type ............................................................................................................................................................... 12
7. Memory Map .................................................................................................................................................................... 17
8. RAMSTART Addresses................................................................................................................................................... 18
9. User ROM Memory Map For Flash Devices .................................................................................................................. 19
10. Serial Programming Communication Interface ............................................................................................................ 20
11. Interrupt Vector Table ..................................................................................................................................................... 21
12. Handling Precautions ..................................................................................................................................................... 25
12.1 Precautions for Product Design ................................................................................................................................... 25
12.2 Precautions for Package Mounting .............................................................................................................................. 26
12.3 Precautions for Use Environment ................................................................................................................................ 27
13. Handling Devices ............................................................................................................................................................ 28
13.1 Latch-up prevention ..................................................................................................................................................... 28
13.2 Unused pins handling .................................................................................................................................................. 28
13.3 External clock usage ................................................................................................................................................... 29
13.3.1 Single phase external clock for Main oscillator............................................................................................................. 29
13.3.2 Single phase external clock for Sub oscillator .............................................................................................................. 29
13.3.3 Opposite phase external clock ..................................................................................................................................... 29
13.4 Notes on PLL clock mode operation ............................................................................................................................ 29
13.5 Power supply pins (Vcc/Vss) ......................................................................................................................................... 29
13.6 Crystal oscillator and ceramic resonator circuit ........................................................................................................... 30
13.7 Turn on sequence of power supply to A/D converter and analog inputs ..................................................................... 30
13.8 Pin handling when not using the A/D converter ........................................................................................................... 30
13.9 Notes on Power-on ...................................................................................................................................................... 30
13.10 Stabilization of power supply voltage .......................................................................................................................... 30
13.11 Serial communication .................................................................................................................................................. 30
13.12 Mode Pin (MD) ............................................................................................................................................................ 30
14. Electrical Characteristics ............................................................................................................................................... 31
14.1 Absolute Maximum Ratings ......................................................................................................................................... 31
14.2 Recommended Operating Conditions ......................................................................................................................... 33
14.3 DC Characteristics ...................................................................................................................................................... 34
14.3.1 Current Rating .............................................................................................................................................................. 34
14.3.2 Pin Characteristics ....................................................................................................................................................... 38
14.4 AC Characteristics ....................................................................................................................................................... 40
14.4.1 Main Clock Input Characteristics .................................................................................................................................. 40
14.4.2 Sub Clock Input Characteristics ................................................................................................................................... 41
14.4.3 Built-in RC Oscillation Characteristics .......................................................................................................................... 42
14.4.4 Internal Clock Timing ................................................................................................................................................... 42
14.4.5 Operating Conditions of PLL ........................................................................................................................................ 43
14.4.6 Reset Input ................................................................................................................................................................... 43
14.4.7 Power-on Reset Timing ................................................................................................................................................ 44
14.4.8 USART Timing ............................................................................................................................................................. 45
Document Number: 002-04712 Rev.*A
Page 3 of 65
MB96620 Series
14.4.9 External Input Timing ................................................................................................................................................... 47
14.4.10 I2C Timing ................................................................................................................................................................. 48
14.5 A/D Converter .............................................................................................................................................................. 49
14.5.1 Electrical Characteristics for the A/D Converter ........................................................................................................... 49
14.5.2 Accuracy and Setting of the A/D Converter Sampling Time ......................................................................................... 50
14.5.3 Definition of A/D Converter Terms ............................................................................................................................... 51
14.6 Low Voltage Detection Function Characteristics ......................................................................................................... 53
14.7 Flash Memory Write/Erase Characteristics ................................................................................................................. 55
15. Example Characteristics ................................................................................................................................................ 56
16. Ordering Information ...................................................................................................................................................... 59
17. Package Dimension ........................................................................................................................................................ 60
18. Major Changes ................................................................................................................................................................ 62
Document History ................................................................................................................................................................. 64
Document Number: 002-04712 Rev.*A
Page 4 of 65
MB96620 Series
1. Product Lineup
Features
Product Type
Subclock
Dual Operation Flash Memory
32.5KB + 32KB
64.5KB + 32KB
128.5KB + 32KB
RAM
4KB
10KB
10KB
Package
DMA
USART
with automatic LIN-Header
transmission/reception
with 16 byte RX- and
TX-FIFO
2
MB96620
Flash Memory Product
Subclock can be set by software
MB96F622R, MB96F622A
MB96F623R, MB96F623A
MB96F625R, MB96F625A
LQFP-64
FPT-64P-M23/M24
2ch
3ch
Product Options
R: MCU with CAN
A: MCU without CAN
Yes (only 1ch)
LIN-USART 2
1ch
21ch
No
Yes
No
No
3ch
16-bit Free-Running Timer (FRT)
4ch
16-bit Output Compare Unit (OCU)
8/16-bit Programmable Pulse Generator (PPG)
with Timing point capture
with Start delay
with Ramp
Quadrature Position/Revolution Counter
(QPRC)
8ch
(2 channels for LIN-USART)
6ch
8ch (16-bit) / 16ch (8-bit)
Yes
No
No
2ch
CAN Interface
1ch
External Interrupts (INT)
Non-Maskable Interrupt (NMI)
Real Time Clock (RTC)
Clock Calibration Unit (CAL)
Clock Output Function
13ch
1ch
1ch
50 (Dual clock mode)
52 (Single clock mode)
1ch
2ch
Low Voltage Detection Function
Yes
Hardware Watchdog Timer
On-chip RC-oscillator
On-chip Debugger
Yes
Yes
Yes
I/O Ports
LIN-USART 2/7/8
No
IC
8/10-bit A/D Converter
with Data Buffer
with Range Comparator
with Scan Disable
with ADC Pulse Detection
16-bit Reload Timer (RLT)
16-bit Input Capture Unit (ICU)
Remark
I2 C 0
AN 0 to 14/24/25/28 to 31
RLT 1/3/6
FRT 0 to 3
FRT 2/3 does not have external
clock input pin
ICU 0/1/4 to 7/9/10
(ICU 9/10 for LIN-USART)
OCU 0/1/4 to 7
PPG 0/1/3/4/6/7/12/14
QPRC 0/1
CAN 2
32 Message Buffers
INT 0/2/3/4/7 to 15
Low voltage detection function
can be
disabled by software
Note:
All signals of the peripheral function in each product cannot be allocated by limiting the pins of package.
It is necessary to use the port relocate function of the general I/O port according to your function use.
Document Number: 002-04712 Rev.*A
Page 5 of 65
MB96620 Series
2. Block Diagram
CKOT0_R, CKOT1, CKOT1_R
CKOTX1
X0, X1
X0A, X1A
RSTX
MD
NMI_R
DEBUG I/F
Clock &
Mode Controller
Flash
Memory A
Interrupt
Controller
16FX
CPU
OCD
16FX Core Bus (CLKB)
2
SDA0
SCL0
IC
1ch
AVcc
AVss
AVRH
AN0 to AN14
AN24, AN25
AN28 to AN31
ADTG_R
TIN1, TIN3
TOT1, TOT3
8/10-bit
ADC
21ch
16-bit
Reload Timer
1/3/6
3ch
FRCK0
IN0, IN1
OUT0_R, OUT1_R
I/O Timer 0
FRT 0
ICU 0/1
OCU 0/1
FRCK1
IN4 to IN7
OUT4 to OUT7
I/O Timer 1
FRT 1
ICU 4/5/6/7
OCU 4/5/6/7
I/O Timer 2
FRT 2
ICU 9
I/O Timer 3
FRT 3
ICU 10
Document Number: 002-04712 Rev.*A
Peripheral
Bus Bridge
Peripheral Bus 2 (CLKP2)
Peripheral
Bus Bridge
Watchdog
Peripheral Bus 1 (CLKP1)
DMA
Controller
RAM
Boot ROM
Voltage
Regulator
Vcc
Vss
C
RX2
CAN Interface
1ch
USART
3ch
PPG
8ch (16-bit) /
16ch (8-bit)
Real Time
Clock
TX2
SIN2, SIN2_R, SIN7_R, SIN8_R
SOT2, SOT2_R, SOT7_R, SOT8_R
SCK2, SCK2_R, SCK7_R, SCK8_R
TTG0, TTG1, TTG4 to TTG6
TTG7, TTG12 to TTG15
PPG0, PPG1, PPG3, PPG4
PPG6, PPG7, PPG12, PPG14
PPG0_B, PPG1_B, PPG3_B, PPG4_B
PPG6_B, PPG7_B, PPG12_B, PPG14_B
WOT
AIN0, AIN1
QPRC
2ch
External
Interrupt
13ch
BIN0, BIN1
ZIN0, ZIN1
INT8 to INT15
INT0_R, INT2_R, INT4_R
INT7_R, INT9_R to INT11_R
INT3_R1
Page 6 of 65
MB96620 Series
3. Pin Assignment
P01_1 / TOT1 / CKOTX1 / OUT1_R
P01_2 / INT11_R
P01_3
P01_4 / PPG4_B
P01_5 / SIN2_R / INT7_R*1
P01_6 / SOT2_R / PPG6_B
P01_7 / SCK2_R / PPG7_B*1
P02_0 / PPG12 / CKOT1_R
P02_1
P02_2 / ZIN0 / PPG14 / CKOT0_R
P02_3
P02_4 / AIN0 / IN0 / TTG0
RSTX
X1
X0
Vss
(Top view)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
49
32
P01_0 / TIN1 / CKOT1 / OUT0_R
C
50
31
P00_7 / INT15
P02_5 / BIN0 / IN1 / TTG1 / ADTG_R
51
30
P00_6 / INT14
P04_4 / SDA0 / FRCK0*2
52
29
P00_5 / INT13 / SIN8_R / PPG14_B*1
2
53
28
P00_4 / INT12 / SOT8_R / PPG12_B
P03_0 / AIN1 / IN4 / TTG4 / TTG12 / AN24
54
27
P00_3 / INT11 / SCK8_R / PPG3_B*1
P03_1 / BIN1 / IN5 / TTG5 / TTG13 / AN25
55
26
P00_2 / INT10 / SIN7_R*1
1
56
25
P00_1 / INT9 / SOT7_R / PPG1_B
P03_3 / TX2
57
24
P00_0 / INT8 / SCK7_R / PPG0_B*1
P03_4 / OUT4 / AN28
58
23
DEBUG I/F
P03_5 / OUT5 / AN29
59
22
P17_0
P03_6 / ZIN1 / OUT6 / AN30
60
21
MD
P03_7 / OUT7 / AN31
61
20
P04_1 / X1A*3
P06_0 / AN0 / PPG0
62
19
P04_0 / X0A*3
P06_1 / AN1 / PPG1
63
18
Vss
P04_3 / IN7 / TTG7 / TTG15
P04_2 / IN6 / INT9_R / TTG6 / TTG14
P05_6 / AN14 / INT4_R
P05_4 / AN12 / TOT3 / INT2_R
P06_7 / AN7 / PPG7
P05_5 / AN13 / INT0_R / NMI_R
8
P05_3 / AN11 / TIN3 / WOT
7
P05_2 / AN10 / SCK2*1
6
P05_1 / AN9 / SOT2
5
17
9 10 11 12 13 14 15 16
P05_0 / AN8 / SIN2 / INT3_R1*1
4
P06_6 / AN6 / PPG6
3
P06_5 / AN5
2
P06_4 / AN4 / PPG4
64
1
AVss
AVcc
LQFP - 64
P06_3 / AN3 / PPG3
P03_2 / INT10_R / RX2*
P06_2 / AN2
P04_5 / SCL0 / FRCK1*
AVRH
Vcc
(FPT-64P-M23/M24)
*1: CMOS input level only
*2: CMOS input level only for I2C
*3: Please set ROM Configuration Block (RCB) to use the subclock.
Other than those above, general-purpose pins have only Automotive input level.
Document Number: 002-04712 Rev.*A
Page 7 of 65
MB96620 Series
4. Pin Description
Pin name
Feature
Description
ADTG_R
ADC
Relocated A/D converter trigger input pin
AINn
QPRC
Quadrature Position/Revolution Counter Unit n input pin
ANn
ADC
A/D converter channel n input pin
AVcc
Supply
Analog circuits power supply pin
AVRH
ADC
A/D converter high reference voltage input pin
AVss
Supply
Analog circuits power supply pin
BINn
QPRC
Quadrature Position/Revolution Counter Unit n input pin
C
Voltage regulator
Internally regulated power supply stabilization capacitor pin
CKOTn
Clock Output function
Clock Output function n output pin
CKOTn_R
Clock Output function
Relocated Clock Output function n output pin
CKOTXn
Clock Output function
Clock Output function n inverted output pin
DEBUG I/F
OCD
On Chip Debugger input/output pin
FRCKn
Free-Running Timer
Free-Running Timer n input pin
INn
ICU
Input Capture Unit n input pin
INTn
External Interrupt
External Interrupt n input pin
INTn_R
External Interrupt
Relocated External Interrupt n input pin
INTn_R1
External Interrupt
Relocated External Interrupt n input pin
MD
Core
Input pin for specifying the operating mode
NMI_R
External Interrupt
Relocated Non-Maskable Interrupt input pin
OUTn
OCU
Output Compare Unit n waveform output pin
OUTn_R
OCU
Relocated Output Compare Unit n waveform output pin
Pnn_m
GPIO
General purpose I/O pin
PPGn
PPG
Programmable Pulse Generator n output pin (16bit/8bit)
PPGn_B
PPG
Programmable Pulse Generator n output pin (16bit/8bit)
RSTX
Core
Reset input pin
RXn
CAN
CAN interface n RX input pin
SCKn
USART
USART n serial clock input/output pin
SCKn_R
USART
Relocated USART n serial clock input/output pin
2
SCLn
IC
I2C interface n clock I/O input/output pin
SDAn
I2 C
I2C interface n serial data I/O input/output pin
SINn
USART
USART n serial data input pin
SINn_R
USART
Relocated USART n serial data input pin
SOTn
USART
USART n serial data output pin
SOTn_R
USART
Relocated USART n serial data output pin
TINn
Reload Timer
Reload Timer n event input pin
TOTn
Reload Timer
Reload Timer n output pin
TTGn
PPG
Programmable Pulse Generator n trigger input pin
TXn
CAN
CAN interface n TX output pin
Vcc
Supply
Power supply pin
Vss
Supply
Power supply pin
Document Number: 002-04712 Rev.*A
Page 8 of 65
MB96620 Series
Pin name
Feature
Description
WOT
RTC
Real Time clock output pin
X0
Clock
Oscillator input pin
X0A
Clock
Subclock Oscillator input pin
X1
Clock
Oscillator output pin
X1A
Clock
Subclock Oscillator output pin
ZINn
QPRC
Quadrature Position/Revolution Counter Unit n input pin
Document Number: 002-04712 Rev.*A
Page 9 of 65
MB96620 Series
5. Pin Circuit Type
Pin no.
I/O circuit type*
Pin name
1
Supply
AVss
2
G
AVRH
3
K
P06_2 / AN2
4
K
P06_3 / AN3 / PPG3
5
K
P06_4 / AN4 / PPG4
6
K
P06_5 / AN5
7
K
P06_6 / AN6 / PPG6
8
K
P06_7 / AN7 / PPG7
9
I
P05_0 / AN8 / SIN2 / INT3_R1
10
K
P05_1 / AN9 / SOT2
11
I
P05_2 / AN10 / SCK2
12
K
P05_3 / AN11 / TIN3 / WOT
13
K
P05_4 / AN12 / TOT3 / INT2_R
14
K
P05_5 / AN13 / INT0_R / NMI_R
15
K
P05_6 / AN14 / INT4_R
16
H
P04_2 / IN6 / INT9_R / TTG6 / TTG14
17
H
P04_3 / IN7 / TTG7 / TTG15
18
Supply
Vss
19
B
P04_0 / X0A
20
B
P04_1 / X1A
21
C
MD
22
H
P17_0
23
O
DEBUG I/F
24
M
P00_0 / INT8 / SCK7_R / PPG0_B
25
H
P00_1 / INT9 / SOT7_R / PPG1_B
26
M
P00_2 / INT10 / SIN7_R
27
M
P00_3 / INT11 / SCK8_R / PPG3_B
28
H
P00_4 / INT12 / SOT8_R / PPG12_B
29
M
P00_5 / INT13 / SIN8_R / PPG14_B
30
H
P00_6 / INT14
31
H
P00_7 / INT15
32
H
P01_0 / TIN1 / CKOT1 / OUT0_R
Document Number: 002-04712 Rev.*A
Page 10 of 65
MB96620 Series
Pin no.
I/O circuit type*
Pin name
33
N
P04_5 / SCL0
34
O
DEBUG I/F
35
H
P17_0
36
C
MD
37
A
X0
38
A
X1
39
Supply
Vss
40
B
P04_0 / X0A
41
B
P04_1 / X1A
42
C
RSTX
43
J
P11_7 / SEG3 / IN0_R
44
J
P11_0 / COM0
45
J
P11_1 / COM1 / PPG0_R
46
J
P11_2 / COM2 / PPG1_R
47
J
P11_3 / COM3 / PPG2_R
48
J
P12_0 / SEG4 / IN1_R
49
J
P12_1 / SEG5 / TIN1_R / PPG0_B
50
J
P12_2 / SEG6 / TOT1_R / PPG1_B
51
J
P12_4 / SEG8
52
J
P12_5 / SEG9 / TIN2_R / PPG2_B
53
J
P12_6 / SEG10 / TOT2_R / PPG3_B
54
J
P12_7 / SEG11 / INT1_R
55
J
P01_1 / SEG21 / CKOT1
56
J
P01_3 / SEG23
57
L
P03_0 / SEG36 / V0
58
L
P03_1 / SEG37 / V1
59
L
P03_2 / SEG38 / V2
60
L
P03_3 / SEG39 / V3
61
M
P03_4 / RX0 / INT4
62
H
P03_5 / TX0
63
H
P03_6 / INT0 / NMI
64
Supply
Vcc
*: See “I/O Circuit Type” for details on the I/O circuit types.
Document Number: 002-04712 Rev.*A
Page 11 of 65
MB96620 Series
6. I/O Circuit Type
Type
A
Circuit
X1
R
0
1
X out
Remarks
High-speed oscillation circuit:
• Programmable between
oscillation mode (external
crystal or resonator connected
to X0/X1 pins) and Fast
external Clock Input (FCI)
mode (external clock
connected to X0 pin)
• Feedback resistor = approx.
1.0M
• The amplitude: 1.8V±0.15V
to operate by the internal
supply voltage
FCI
X0
FCI or Osc disable
Document Number: 002-04712 Rev.*A
Page 12 of 65
MB96620 Series
Type
B
Circuit
Pull-up control
P-ch
Standby
control
for input
shutdown
P-ch
Pout
N-ch
Nout
Remarks
Low-speed oscillation circuit
shared with GPIO functionality:
• Feedback resistor = approx.
5.0M
• GPIO functionality selectable
(CMOS level output (IOL =
4mA, IOH = -4mA), Automotive
input with input shutdown
function and programmable
pull-up resistor)
R
Automotive input
X1A
R
X out
0
1
FCI
X0A
FCI or Osc disable
Pull-up control
P-ch
Standby
control
for input
shutdown
P-ch
Pout
N-ch
Nout
R
C
Document Number: 002-04712 Rev.*A
Automotive input
CMOS hysteresis input pin
Page 13 of 65
MB96620 Series
Type
F
Circuit
Remarks
Power supply input protection
circuit
P-ch
N-ch
• A/D converter ref+ (AVRH)
power supply input pin with
protection circuit
• Without protection circuit
against VCC for pins AVRH
G
P-ch
N-ch
H
Pull-up control
P-ch
P-ch
Pout
N-ch
Nout
• CMOS level output
(IOL = 4mA, IOH = -4mA)
• Automotive input with input
shutdown function
• Programmable pull-up resistor
R
Standby control
for input shutdown
Automotive input
I
Pull-up control
P-ch
P-ch
Pout
N-ch
Nout
• CMOS level output
(IOL = 4mA, IOH = -4mA)
• CMOS hysteresis input with
input shutdown function
• Programmable pull-up resistor
• Analog input
R
Hysteresis input
Standby control
for input shutdown
Analog input
Document Number: 002-04712 Rev.*A
Page 14 of 65
MB96620 Series
Type
K
Circuit
Remarks
Pull-up control
P-ch
P-ch
Pout
N-ch
Nout
• CMOS level output
(IOL = 4mA, IOH = -4mA)
• Automotive input with input
shutdown function
• Programmable pull-up resistor
• Analog input
R
Automotive input
Standby control
for input shutdown
Analog input
M
Pull-up control
P-ch
P-ch
Pout
N-ch
Nout
R
• CMOS level output
(IOL = 4mA, IOH = -4mA)
• CMOS hysteresis input with
input shutdown function
• Programmable pull-up resistor
Hysteresis input
Standby control
for input shutdown
N
Pull-up control
P-ch
R
P-ch
Pout
N-ch
Nout*
• CMOS level output
(IOL = 3mA, IOH = -3mA)
• CMOS hysteresis input with
input shutdown function
• Programmable pull-up resistor
*: N-channel transistor has slew
rate control according to I2C
spec, irrespective of usage.
Hysteresis input
Standby control
for input shutdown
Document Number: 002-04712 Rev.*A
Page 15 of 65
MB96620 Series
Type
O
Circuit
Remarks
• Open-drain I/O
• Output 25mA, Vcc = 2.7V
• TTL input
N-ch
Nout
R
Standby control
for input shutdown
Document Number: 002-04712 Rev.*A
TTL input
Page 16 of 65
MB96620 Series
7. Memory Map
FF:FFFFH
USER ROM*1
DE:0000H
DD:FFFFH
Reserved
10:0000H
0F:C000H
Boot-ROM
Peripheral
0E:9000H
Reserved
01:0000H
00:8000H
RAMSTART0*2
ROM/RAM
MIRROR
Internal RAM
bank0
Reserved
00:0C00H
00:0380H
Peripheral
00:0180H
GPR*3
00:0100H
DMA
00:00F0H
Reserved
00:0000H
Peripheral
*1: For details about USER ROM area, see “USER ROM MEMORY MAP FOR FLASH DEVICES” on the following pages.
*2: For RAMSTART addresses, see the table on the next page.
*3: Unused GPR banks can be used as RAM area.
GPR: General-Purpose Register
The DMA area is only available if the device contains the corresponding resource.
The available RAM and ROM area depends on the device.
Document Number: 002-04712 Rev.*A
Page 17 of 65
MB96620 Series
8. RAMSTART Addresses
Bank 0
RAM size
Devices
RAMSTART0
MB96F622
4KB
00:7200H
MB96F623
MB96F625
10KB
00:5A00H
Document Number: 002-04712 Rev.*A
Page 18 of 65
MB96620 Series
9. User ROM Memory Map For Flash Devices
MB96F622
CPU mode
address
FF:FFFFH
Flash memory
mode address
3F:FFFFH
FF:8000H
3F:8000H
FF:7FFFH
3F:7FFFH
FF:0000H
3F:0000H
FE:FFFFH
3E:FFFFH
FE:0000H
3E:0000H
MB96F623
MB96F625
Flash size
Flash size
Flash size
32.5KB + 32KB
64.5KB + 32KB
128.5KB + 32KB
SA39 - 64KB
SA39 - 64KB
SA39 - 32KB
Bank A of Flash A
SA38 - 64KB
FD:FFFFH
Reserved
Reserved
Reserved
DF:A000H
DF:9FFFH
1F:9FFFH
DF:8000H
1F:8000H
DF:7FFFH
1F:7FFFH
DF:6000H
1F:6000H
DF:5FFFH
1F:5FFFH
DF:4000H
1F:4000H
DF:3FFFH
1F:3FFFH
DF:2000H
1F:2000H
DF:1FFFH
1F:1FFFH
DF:0000H
1F:0000H
DE:FFFFH
DE:0000H
SA4 - 8KB
SA4 - 8KB
SA4 - 8KB
SA3 - 8KB
SA3 - 8KB
SA3 - 8KB
SA2 - 8KB
SA2 - 8KB
SA2 - 8KB
SA1 - 8KB
SA1 - 8KB
SA1 - 8KB
SAS - 512B*
SAS - 512B*
SAS - 512B*
Reserved
Reserved
Reserved
Bank B of Flash A
Bank A of Flash A
*: Physical address area of SAS-512B is from DF:0000H to DF:01FFH.
Others (from DF:0200H to DF:1FFFH) is mirror area of SAS-512B.
Sector SAS contains the ROM configuration block RCBA at CPU address DF:0000H -DF:01FFH.
SAS can not be used for E2PROM emulation.
Document Number: 002-04712 Rev.*A
Page 19 of 65
MB96620 Series
10. Serial Programming Communication Interface
USART pins for Flash serial programming (MD = 0, DEBUG I/F = 0, Serial Communication mode)
MB96620
Pin Number
USART Number
9
10
Normal Function
SIN2
USART2
SOT2
11
SCK2
26
SIN7_R
25
USART7
SOT7_R
24
SCK7_R
29
SIN8_R
28
USART8
27
Document Number: 002-04712 Rev.*A
SOT8_R
SCK8_R
Page 20 of 65
MB96620 Series
11. Interrupt Vector Table
Vector
number
Offset in
vector table
Index in
ICR to
program
Cleared by
DMA
Vector name
Description
0
3FCH
CALLV0
No
-
CALLV instruction
1
3F8H
CALLV1
No
-
CALLV instruction
2
3F4H
CALLV2
No
-
CALLV instruction
3
3F0H
CALLV3
No
-
CALLV instruction
4
3ECH
CALLV4
No
-
CALLV instruction
5
3E8H
CALLV5
No
-
CALLV instruction
6
3E4H
CALLV6
No
-
CALLV instruction
7
3E0H
CALLV7
No
-
CALLV instruction
8
3DCH
RESET
No
-
Reset vector
9
3D8H
INT9
No
-
INT9 instruction
10
3D4H
EXCEPTION
No
-
Undefined instruction execution
11
3D0H
NMI
No
-
Non-Maskable Interrupt
12
3CCH
DLY
No
12
Delayed Interrupt
13
3C8H
RC_TIMER
No
13
RC Clock Timer
14
3C4H
MC_TIMER
No
14
Main Clock Timer
15
3C0H
SC_TIMER
No
15
Sub Clock Timer
16
3BCH
LVDI
No
16
Low Voltage Detector
17
3B8H
EXTINT0
Yes
17
External Interrupt 0
18
3B4H
-
-
18
Reserved
19
3B0H
EXTINT2
Yes
19
External Interrupt 2
20
3ACH
EXTINT3
Yes
20
External Interrupt 3
21
3A8H
EXTINT4
Yes
21
External Interrupt 4
22
3A4H
-
-
22
Reserved
23
3A0H
-
-
23
Reserved
24
39CH
EXTINT7
Yes
24
External Interrupt 7
25
398H
EXTINT8
Yes
25
External Interrupt 8
26
394H
EXTINT9
Yes
26
External Interrupt 9
27
390H
EXTINT10
Yes
27
External Interrupt 10
28
38CH
EXTINT11
Yes
28
External Interrupt 11
29
388H
EXTINT12
Yes
29
External Interrupt 12
30
384H
EXTINT13
Yes
30
External Interrupt 13
31
380H
EXTINT14
Yes
31
External Interrupt 14
32
37CH
EXTINT15
Yes
32
External Interrupt 15
33
378H
-
-
33
Reserved
34
374H
-
-
34
Reserved
35
370H
CAN2
No
35
CAN Controller 2
36
36CH
-
-
36
Reserved
37
368H
-
-
37
Reserved
38
364H
PPG0
Yes
38
Programmable Pulse Generator 0
39
360H
PPG1
Yes
39
Programmable Pulse Generator 1
Document Number: 002-04712 Rev.*A
Page 21 of 65
MB96620 Series
Vector
number
Offset in
vector table
Index in
ICR to
program
Cleared by
DMA
Vector name
Description
40
35CH
-
-
40
Reserved
41
358H
PPG3
Yes
41
Programmable Pulse Generator 3
42
354H
PPG4
Yes
42
Programmable Pulse Generator 4
43
350H
-
-
43
Reserved
44
34CH
PPG6
Yes
44
Programmable Pulse Generator 6
45
348H
PPG7
Yes
45
Programmable Pulse Generator 7
46
344H
-
-
46
Reserved
47
340H
-
-
47
Reserved
48
33CH
-
-
48
Reserved
49
338H
-
-
49
Reserved
50
334H
PPG12
Yes
50
Programmable Pulse Generator 12
51
330H
-
-
51
Reserved
52
32CH
PPG14
Yes
52
Programmable Pulse Generator 14
53
328H
-
-
53
Reserved
54
324H
-
-
54
Reserved
55
320H
-
-
55
Reserved
56
31CH
-
-
56
Reserved
57
318H
-
-
57
Reserved
58
314H
-
-
58
Reserved
59
310H
RLT1
Yes
59
Reload Timer 1
60
30CH
-
-
60
Reserved
61
308H
RLT3
Yes
61
Reload Timer 3
62
304H
-
-
62
Reserved
63
300H
-
-
63
Reserved
64
2FCH
RLT6
Yes
64
Reload Timer 6
65
2F8H
ICU0
Yes
65
Input Capture Unit 0
66
2F4H
ICU1
Yes
66
Input Capture Unit 1
67
2F0H
-
-
67
Reserved
68
2ECH
-
-
68
Reserved
69
2E8H
ICU4
Yes
69
Input Capture Unit 4
70
2E4H
ICU5
Yes
70
Input Capture Unit 5
71
2E0H
ICU6
Yes
71
Input Capture Unit 6
72
2DCH
ICU7
Yes
72
Input Capture Unit 7
73
2D8H
-
-
73
Reserved
74
2D4H
ICU9
Yes
74
Input Capture Unit 9
75
2D0H
ICU10
Yes
75
Input Capture Unit 10
76
2CCH
-
-
76
Reserved
77
2C8H
OCU0
Yes
77
Output Compare Unit 0
78
2C4H
OCU1
Yes
78
Output Compare Unit 1
79
2C0H
-
-
79
Reserved
80
2BCH
-
-
80
Reserved
Document Number: 002-04712 Rev.*A
Page 22 of 65
MB96620 Series
Vector
number
Offset in
vector table
Index in
ICR to
program
Cleared by
DMA
Vector name
Description
81
2B8H
OCU4
Yes
81
Output Compare Unit 4
82
2B4H
OCU5
Yes
82
Output Compare Unit 5
83
2B0H
OCU6
Yes
83
Output Compare Unit 6
84
2ACH
OCU7
Yes
84
Output Compare Unit 7
85
2A8H
-
-
85
Reserved
86
2A4H
-
-
86
Reserved
87
2A0H
-
-
87
Reserved
88
29CH
-
-
88
Reserved
89
298H
FRT0
Yes
89
Free-Running Timer 0
90
294H
FRT1
Yes
90
Free-Running Timer 1
91
290H
FRT2
Yes
91
Free-Running Timer 2
92
28CH
FRT3
Yes
92
Free-Running Timer 3
93
288H
RTC0
No
93
Real Time Clock
94
284H
CAL0
No
94
Clock Calibration Unit
95
280H
-
-
95
Reserved
96
27CH
IIC0
Yes
96
I2C interface 0
97
278H
-
-
97
Reserved
98
274H
ADC0
Yes
98
A/D Converter 0
99
270H
-
-
99
Reserved
100
26CH
-
-
100
Reserved
101
268H
-
-
101
Reserved
102
264H
-
-
102
Reserved
103
260H
-
-
103
Reserved
104
25CH
-
-
104
Reserved
105
258H
LINR2
Yes
105
LIN USART 2 RX
106
254H
LINT2
Yes
106
LIN USART 2 TX
107
250H
-
-
107
Reserved
108
24CH
-
-
108
Reserved
109
248H
-
-
109
Reserved
110
244H
-
-
110
Reserved
111
240H
-
-
111
Reserved
112
23CH
-
-
112
Reserved
113
238H
-
-
113
Reserved
114
234H
-
-
114
Reserved
115
230H
LINR7
Yes
115
LIN USART 7 RX
116
22CH
LINT7
Yes
116
LIN USART 7 TX
117
228H
LINR8
Yes
117
LIN USART 8 RX
118
224H
LINT8
Yes
118
LIN USART 8 TX
119
220H
-
-
119
Reserved
120
21CH
-
-
120
Reserved
121
218H
-
-
121
Reserved
122
214H
-
-
122
Reserved
Document Number: 002-04712 Rev.*A
Page 23 of 65
MB96620 Series
123
210H
-
-
Index in
ICR to
program
123
124
20CH
-
-
124
Reserved
125
208H
-
-
125
Reserved
126
204H
-
-
126
Reserved
127
200H
-
-
127
Reserved
128
1FCH
-
-
128
Reserved
129
1F8H
-
-
129
Reserved
130
1F4H
-
-
130
Reserved
131
1F0H
-
-
131
Reserved
132
1ECH
-
-
132
Reserved
133
1E8H
FLASHA
Yes
133
Flash memory A interrupt
134
1E4H
-
-
134
Reserved
135
1E0H
-
-
135
Reserved
136
1DCH
-
-
136
Reserved
137
1D8H
QPRC0
Yes
137
Quad Position/Revolution counter 0
138
1D4H
QPRC1
Yes
138
Quad Position/Revolution counter 1
139
1D0H
ADCRC0
No
139
A/D Converter 0 - Range Comparator
140
1CCH
-
-
140
Reserved
141
1C8H
-
-
141
Reserved
142
1C4H
-
-
142
Reserved
143
1C0H
-
-
143
Reserved
Vector
number
Offset in
vector table
Document Number: 002-04712 Rev.*A
Cleared by
DMA
Vector name
Description
Reserved
Page 24 of 65
MB96620 Series
12. Handling Precautions
Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in
which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to
minimize the chance of failure and to obtain higher reliability from your Cypress semiconductor devices.
12.1 Precautions for Product Design
This section describes precautions when designing electronic equipment using semiconductor devices.
Absolute Maximum Ratings
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of
certain established limits, called absolute maximum ratings. Do not exceed these ratings.
Recommended Operating Conditions
Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical
characteristics are warranted when operated within these ranges.
Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely
affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users
considering application outside the listed conditions are advised to contact their sales representative beforehand.
Processing and Protection of Pins
These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output
functions.
1. Preventing Over-Voltage and Over-Current Conditions
Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device,
and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at
the design stage.
2. Protection of Output Pins
Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows.
Such conditions if present for extended periods of time can damage the device.
Therefore, avoid this type of connection.
3. Handling of Unused Input Pins
Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be
connected through an appropriate resistance to a power supply pin or ground pin.
Latch-up
Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally
high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of
several hundred mA to flow continuously at the power supply pin. This condition is called latch-up.
CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or
damage from high heat, smoke or flame. To prevent this from happening, do the following:
1. Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal
noise, surge levels, etc.
2. Be sure that abnormal current flows do not occur during the power-on sequence.
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic
interference, etc. Customers are requested to observe applicable regulations and standards in the design of products.
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such
failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating conditions.
Document Number: 002-04712 Rev.*A
Page 25 of 65
MB96620 Series
Precautions Related to Usage of Devices
Cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office
equipment, industrial, communications, and measurement equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.)
are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from
such use without prior approval.
12.2 Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you
should only mount under Cypress's recommended conditions. For detailed information about mount conditions, contact your sales
representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or
mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow
soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected
to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Cypress
recommended mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact
deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be
verified before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed
or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections
caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. Cypress recommends the solder reflow method, and has established a ranking of
mounting conditions for each product. Users are advised to mount packages in accordance with Cypress ranking of recommended
conditions.
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength
may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of
moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing
moisture resistance and causing packages to crack. To prevent, do the following:
1. Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in
locations where temperature changes are slight.
2. Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C
and 30°C.
When you open Dry Package that recommends humidity 40% to 70% relative humidity.
3. When necessary, Cypress packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica
gel desiccant. Devices should be sealed in their aluminum laminate bags for storage.
4. Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
Baking
Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Cypress recommended
conditions for baking.
Condition: 125°C/24 h
Document Number: 002-04712 Rev.*A
Page 26 of 65
MB96620 Series
Static Electricity
Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions:
1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be
needed to remove electricity.
2. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
3. Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1
MΩ).
Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is
recommended.
4. Ground all fixtures and instruments, or protect with anti-static measures.
5. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.
12.3 Precautions for Use Environment
Reliability of semiconductor devices depends on ambient temperature and other conditions as described above.
For reliable performance, do the following:
1. Humidity
Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are
anticipated, consider anti-humidity processing.
2. Discharge of Static Electricity
When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases,
use anti-static measures or processing to prevent discharges.
3. Corrosive Gases, Dust, or Oil
Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If
you use devices in such conditions, consider ways to prevent such exposure or to protect the devices.
4. Radiation, Including Cosmic Radiation
Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide
shielding as appropriate.
5. Smoke, Flame
CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin
to smoke or burn, there is danger of the release of toxic gases.
Customers considering the use of Cypress products in other special environmental conditions should consult with sales
representatives.
Document Number: 002-04712 Rev.*A
Page 27 of 65
MB96620 Series
13. Handling Devices
Special care is required for the following when handling the device:
•
•
•
•
•
•
•
•
•
•
•
•
Latch-up prevention
Unused pins handling
External clock usage
Notes on PLL clock mode operation
Power supply pins (Vcc/Vss)
Crystal oscillator and ceramic resonator circuit
Turn on sequence of power supply to A/D converter and analog inputs
Pin handling when not using the A/D converter
Notes on Power-on
Stabilization of power supply voltage
Serial communication
Mode Pin (MD)
13.1 Latch-up prevention
CMOS IC chips may suffer latch-up under the following conditions:
• A voltage higher than VCC or lower than VSS is applied to an input or output pin.
• A voltage higher than the rated voltage is applied between Vcc pins and Vss pins.
• The AVCC power supply is applied before the VCC voltage.
Latch-up may increase the power supply current dramatically, causing thermal damages to the device.
For the same reason, extra care is required to not let the analog power-supply voltage (AVCC, AVRH) exceed the digital
power-supply voltage.
13.2 Unused pins handling
Unused input pins can be left open when the input is disabled (corresponding bit of Port Input Enable register PIER = 0).
Leaving unused input pins open when the input is enabled may result in misbehavior and possible permanent damage of the device.
To prevent latch-up, they must therefore be pulled up or pulled down through resistors which should be more than 2k.
Unused bidirectional pins can be set either to the output state and be then left open, or to the input state with either input disabled or
external pull-up/pull-down resistor as described above.
Document Number: 002-04712 Rev.*A
Page 28 of 65
MB96620 Series
13.3 External clock usage
The permitted frequency range of an external clock depends on the oscillator type and configuration.
See AC Characteristics for detailed modes and frequency limits. Single and opposite phase external clocks must be connected as
follows:
13.3.1 Single phase external clock for Main oscillator
When using a single phase external clock for the Main oscillator, X0 pin must be driven and X1 pin left open.
And supply 1.8V power to the external clock.
X0
X1
13.3.2 Single phase external clock for Sub oscillator
When using a single phase external clock for the Sub oscillator, “External clock mode” must be selected and
X0A/P04_0 pin must be driven. X1A/P04_1 pin can be configured as GPIO.
13.3.3 Opposite phase external clock
When using an opposite phase external clock, X1 (X1A) pins must be supplied with a clock signal which has
the opposite phase to the X0 (X0A) pins. Supply level on X0 and X1 pins must be 1.8V.
X0
X1
13.4 Notes on PLL clock mode operation
If the microcontroller is operated with PLL clock mode and no external oscillator is operating or no external clock is supplied, the
microcontroller attempts to work with the free oscillating PLL. Performance of this operation, however, cannot be guaranteed.
13.5 Power supply pins (Vcc/Vss)
It is required that all VCC-level as well as all VSS-level power supply pins are at the same potential. If there is more than one VCC or
VSS level, the device may operate incorrectly or be damaged even within the guaranteed operating range.
Vcc and Vss pins must be connected to the device from the power supply with lowest possible impedance.
The smoothing capacitor at Vcc pin must use the one of a capacity value that is larger than Cs.
Besides this, as a measure against power supply noise, it is required to connect a bypass capacitor of about 0.1F between Vcc and
Vss pins as close as possible to Vcc and Vss pins.
Document Number: 002-04712 Rev.*A
Page 29 of 65
MB96620 Series
13.6 Crystal oscillator and ceramic resonator circuit
Noise at X0, X1 pins or X0A, X1A pins might cause abnormal operation. It is required to provide bypass capacitors with shortest
possible distance to X0, X1 pins and X0A, X1A pins, crystal oscillator (or ceramic resonator) and ground lines, and, to the utmost
effort, that the lines of oscillation circuit do not cross the lines of other circuits.
It is highly recommended to provide a printed circuit board art work surrounding X0, X1 pins and X0A, X1A pins with a ground area
for stabilizing the operation.
It is highly recommended to evaluate the quartz/MCU or resonator/MCU system at the quartz or resonator manufacturer, especially
when using low-Q resonators at higher frequencies.
13.7 Turn on sequence of power supply to A/D converter and analog inputs
It is required to turn the A/D converter power supply (AVCC, AVRH) and analog inputs (ANn) on after turning the digital power supply
(VCC) on.
It is also required to turn the digital power off after turning the A/D converter supply and analog inputs off. In this case, AVRH must
not exceed AVCC . Input voltage for ports shared with analog input ports also must not exceed AVCC (turning the analog and digital
power supplies simultaneously on or off is acceptable).
13.8 Pin handling when not using the A/D converter
If the A/D converter is not used, the power supply pins for A/D converter should be connected such as AVCC = VCC , AVSS = AVRH =
VSS.
13.9 Notes on Power-on
To prevent malfunction of the internal voltage regulator, supply voltage profile while turning the power supply on should be slower
than 50s from 0.2V to 2.7V.
13.10 Stabilization of power supply voltage
If the power supply voltage varies acutely even within the operation safety range of the VCC power supply voltage, a malfunction may
occur. The VCC power supply voltage must therefore be stabilized. As stabilization guidelines, the power supply voltage must be
stabilized in such a way that VCC ripple fluctuations (peak to peak value) in the commercial frequencies (50Hz to 60Hz) fall within
10% of the standard VCC power supply voltage and the transient fluctuation rate becomes 0.1V/s or less in instantaneous
fluctuation for power supply switching.
13.11 Serial communication
There is a possibility to receive wrong data due to noise or other causes on the serial communication.
Therefore, design a printed circuit board so as to avoid noise.
Consider receiving of wrong data when designing the system. For example apply a checksum and retransmit
the data if an error occurs.
13.12 Mode Pin (MD)
Connect the mode pin directly to Vcc or Vss pin. To prevent the device unintentionally entering test mode due to noise, lay out the
printed circuit board so as to minimize the distance from the mode pin to Vcc or Vss pin and provide a low-impedance connection.
Document Number: 002-04712 Rev.*A
Page 30 of 65
MB96620 Series
14. Electrical Characteristics
14.1 Absolute Maximum Ratings
Parameter
Power supply
voltage*1
Analog power supply
voltage*1
Analog reference
voltage*1
Input voltage*1
Output voltage*1
Maximum Clamp
Current
Total Maximum
Clamp Current
"L" level maximum
output current
"L" level average
output current
"L" level maximum
overall output current
"L" level average
overall output current
"H" level maximum
output current
"H" level average
output current
"H" level maximum
overall output current
"H" level average
overall output current
Power
consumption*5
Operating ambient
temperature
Storage temperature
Symbol
Rating
Condition
Min
Max
Unit
VCC
-
VSS - 0.3
VSS + 6.0
V
AVCC
-
VSS - 0.3
VSS + 6.0
V
AVRH
-
VSS - 0.3
VSS + 6.0
V
VI
VO
-
VSS - 0.3
VSS - 0.3
VSS + 6.0
VSS + 6.0
V
V
ICLAMP
-
-4.0
+4.0
mA
Σ|ICLAMP|
-
-
17
mA
IOL
-
-
15
mA
IOLAV
-
-
4
mA
ΣIOL
-
-
42
mA
ΣIOLAV
-
-
21
mA
IOH
-
-
-15
mA
IOHAV
-
-
-4
mA
ΣIOH
-
-
-42
mA
ΣIOHAV
-
-
-21
mA
PD
TA= +125°C
-
352*6
mW
TA
-
-40
+125*7
°C
TSTG
-
-55
+150
°C
Remarks
VCC = AVCC*2
AVCC ≥ AVRH,
AVRH ≥ AVSS
VI ≤ VCC + 0.3V*3
VO ≤ VCC + 0.3V*3
Applicable to general
purpose I/O pins *4
Applicable to general
purpose I/O pins *4
*1
: This parameter is based on VSS = AVSS = 0V.
*2
: AVCC and VCC must be set to the same voltage. It is required that AVCC does not exceed VCC and that the
voltage at the analog inputs does not exceed AVCC when the power is switched on.
*3
: VI and VO should not exceed VCC + 0.3V. VI should also not exceed the specified ratings. However if the
maximum current to/from an input is limited by some means with external components, the ICLAMP rating
supersedes the VI rating. Input/Output voltages of standard ports depend on VCC.
*4
: Applicable to all general purpose I/O pins (Pnn_m).
•
•
•
•
Use within recommended operating conditions.
Use at DC voltage (current).
The +B signal should always be applied a limiting resistance placed between the +B signal and the microcontroller.
The value of the limiting resistance should be set so that when the +B signal is applied the input current to the microcontroller
pin does not exceed rated values, either instantaneously or for prolonged periods.
• Note that when the microcontroller drive current is low, such as in the power saving modes, the +B input potential may pass
through the protective diode and increase the potential at the VCC pin, and this may affect other devices.
• Note that if a +B signal is input when the microcontroller power supply is off (not fixed at 0V), the power supply is provided
from the pins, so that incomplete operation may result.
• Note that if the +B input is applied during power-on, the power supply is provided from the pins and the resulting supply
voltage may not be sufficient to operate the Power reset.
Document Number: 002-04712 Rev.*A
Page 31 of 65
MB96620 Series
• The DEBUG I/F pin has only a protective diode against VSS. Hence it is only permitted to input a negative clamping current
(4mA). For protection against positive input voltages, use an external clamping diode which limits the input voltage to
maximum 6.0V.
• Sample recommended circuits:
Protective diode
VCC
Limiting
resistance
P-ch
+B input (0V to 16V)
N-ch
R
*5
: The maximum permitted power dissipation depends on the ambient temperature, the air flow velocity and the thermal
conductance of the package on the PCB.
The actual power dissipation depends on the customer application and can be calculated as follows:
PD = PIO + PINT
PIO = Σ (VOL IOL + VOH IOH) (I/O load power dissipation, sum is performed on all I/O ports)
PINT = VCC (ICC + IA) (internal power dissipation)
ICC is the total core current consumption into VCC as described in the “DC characteristics” and depends on the selected operation
mode and clock frequency and the usage of functions like Flash programming.
IA is the analog current consumption into AVCC.
*6
: Worst case value for a package mounted on single layer PCB at specified TA without air flow.
*7
: Write/erase to a large sector in flash memory is warranted with TA ≤ + 105°C.
WARNING
Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of
absolute maximum ratings. Do not exceed these ratings.
Document Number: 002-04712 Rev.*A
Page 32 of 65
MB96620 Series
14.2 Recommended Operating Conditions
(VSS = AVSS = 0V)
Parameter
Symbol
Power supply
voltage
VCC, AVCC
Smoothing capacitor
at C pin
CS
Min
2.7
2.0
0.5
Value
Typ
Unit
-
Max
5.5
5.5
V
V
1.0 to 3.9
4.7
F
Remarks
Maintains RAM data in stop mode
1.0F (Allowance within ± 50%)
3.9µF (Allowance within ± 20%)
Please use the ceramic capacitor or the
capacitor of the frequency response of this
level.
The smoothing capacitor at VCC must use the
one of a capacity value that is larger than CS.
WARNING
The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the
device's electrical characteristics are warranted when the device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may
adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or
combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact
their representatives beforehand.
Document Number: 002-04712 Rev.*A
Page 33 of 65
MB96620 Series
14.3 DC Characteristics
14.3.1
Current Rating
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Symbol
Pin
name
ICCPLL
Min
Value
Typ
Max
PLL Run mode with CLKS1/2 =
CLKB = CLKP1/2 = 32MHz
-
25
-
mA
TA = +25°C
Flash 0 wait
-
-
34
mA
TA = +105°C
-
-
35
mA
TA = +125°C
-
3.5
-
mA
TA = +25°C
-
-
7.5
mA
TA = +105°C
-
-
8.5
mA
TA = +125°C
-
1.7
-
mA
TA = +25°C
Flash 0 wait
-
-
5.5
mA
TA = +105°C
(CLKMC, CLKPLL and CLKSC
stopped)
-
-
6.5
mA
TA = +125°C
RC Run mode with CLKS1/2 =
CLKB = CLKP1/2 = CLKRC =
100kHz
-
0.15
-
mA
TA = +25°C
Flash 0 wait
-
-
3.2
mA
TA = +105°C
(CLKMC, CLKPLL and CLKSC
stopped)
-
-
4.2
mA
TA = +125°C
Sub Run mode with CLKS1/2 =
CLKB = CLKP1/2 = 32kHz
-
0.1
-
mA
TA = +25°C
Flash 0 wait
-
-
3
mA
TA = +105°C
(CLKMC, CLKPLL and CLKRC
stopped)
-
-
4
mA
TA = +125°C
Conditions
(CLKRC and CLKSC stopped)
Main Run mode with CLKS1/2 =
CLKB = CLKP1/2 = 4MHz
ICCMAIN
Flash 0 wait
(CLKPLL, CLKSC and CLKRC
stopped)
RC Run mode with CLKS1/2 =
CLKB = CLKP1/2 = CLKRC =
2MHz
Power supply
current in Run
modes*1
ICCRCH
Vcc
ICCRCL
ICCSUB
Document Number: 002-04712 Rev.*A
Unit
Remarks
Page 34 of 65
MB96620 Series
Parameter
Symbol
Pin
name
ICCSMAIN
ICCSRCH
ICCSRCL
ICCSSUB
Document Number: 002-04712 Rev.*A
Vcc
Value
Typ
Min
Max
Unit
Remarks
-
6.5
-
mA
TA = +25°C
-
-
13
mA
TA = +105°C
-
-
14
mA
TA = +125°C
Main Sleep mode with
CLKS1/2 = CLKP1/2 =
4MHz,
SMCR:LPMSS = 0
(CLKPLL, CLKRC and
CLKSC stopped)
-
0.9
-
mA
TA = +25°C
-
-
4
mA
TA = +105°C
-
-
5
mA
TA = +125°C
RC Sleep mode with
CLKS1/2 = CLKP1/2 =
CLKRC = 2MHz,
SMCR:LPMSS = 0
(CLKMC, CLKPLL and
CLKSC stopped)
-
0.5
-
mA
TA = +25°C
-
-
3.5
mA
TA = +105°C
-
-
4.5
mA
TA = +125°C
-
0.06
-
mA
TA = +25°C
-
-
2.7
mA
TA = +105°C
-
-
3.7
mA
TA = +125°C
-
0.04
-
mA
TA = +25°C
-
-
2.5
mA
TA = +105°C
-
-
3.5
mA
TA = +125°C
PLL Sleep mode with
CLKS1/2 = CLKP1/2 =
32MHz
(CLKRC and CLKSC
stopped)
ICCSPLL
Power supply
current in Sleep
modes*1
Conditions
RC Sleep mode with
CLKS1/2 = CLKP1/2 =
CLKRC = 100kHz
(CLKMC, CLKPLL and
CLKSC stopped)
Sub Sleep mode with
CLKS1/2 = CLKP1/2 =
32kHz,
(CLKMC, CLKPLL and
CLKRC stopped)
Page 35 of 65
MB96620 Series
Parameter
Symbol
Pin
name
ICCTMAIN
ICCTRCH
Vcc
ICCTRCL
ICCTSUB
Document Number: 002-04712 Rev.*A
Value
Typ
Min
Max
Unit
Remarks
-
1800
2245
A
TA = +25°C
-
-
3165
A
TA = +105°C
-
-
3975
A
TA = +125°C
Main Timer mode with
CLKMC = 4MHz,
SMCR:LPMSS = 0
(CLKPLL, CLKRC and CLKSC
stopped)
-
285
325
A
TA = +25°C
-
-
1085
A
TA = +105°C
-
-
1930
A
TA = +125°C
RC Timer mode with
CLKRC = 2MHz,
SMCR:LPMSS = 0
(CLKPLL, CLKMC and CLKSC
stopped)
-
160
210
A
TA = +25°C
-
-
1025
A
TA = +105°C
-
-
1840
A
TA = +125°C
-
35
75
A
TA = +25°C
-
-
855
A
TA = +105°C
-
-
1640
A
TA = +125°C
-
25
65
A
TA = +25°C
-
-
830
A
TA = +105°C
-
-
1620
A
TA = +125°C
PLL Timer mode with CLKPLL =
32MHz (CLKRC and CLKSC
stopped)
ICCTPLL
Power supply
current in
Timer modes*2
Conditions
RC Timer mode with
CLKRC = 100kHz
(CLKPLL, CLKMC and CLKSC
stopped)
Sub Timer mode with
CLKSC = 32kHz
(CLKMC, CLKPLL and CLKRC
stopped)
Page 36 of 65
MB96620 Series
Parameter
Power supply current
in Stop mode*3
Flash Power Down
current
Symbol
-
Value
Typ
20
Max
55
A
TA = +25°C
-
-
825
A
TA = +105°C
-
-
1615
A
TA = +125°C
-
-
36
70
A
Low voltage detector
enabled
-
5
-
A
TA = +25°C
-
-
12.5
A
TA = +125°C
-
12.5
-
mA
TA = +25°C
-
-
20
mA
TA = +125°C
Pin
name
ICCH
Conditions
-
ICCFLASHPD
Min
Unit
Remarks
Vcc
Power supply current
for active Low
Voltage detector*4
ICCLVD
Flash Write/
Erase current*5
ICCFLASH
-
*1
: The power supply current is measured with a 4MHz external clock connected to the Main oscillator and
a 32kHz external clock connected to the Sub oscillator. See chapter “Standby mode and voltage regulator control circuit” of the
Hardware Manual for further details about voltage regulator control. Current for "On Chip Debugger" part is not included. Power
supply current in Run mode does not include Flash Write / Erase current.
*2
: The power supply current in Timer mode is the value when Flash is in Power-down / reset mode.
When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current.
The power supply current is measured with a 4MHz external clock connected to the Main oscillator and a 32kHz external clock
connected to the Sub oscillator. The current for "On Chip Debugger" part is not included.
*3
: The power supply current in Stop mode is the value when Flash is in Power-down / reset mode.
When Flash is not in Power-down / reset mode, ICCFLASHPD must be added to the Power supply current.
*4
: When low voltage detector is enabled, ICCLVD must be added to Power supply current.
*5
: When Flash Write / Erase program is executed, ICCFLASH must be added to Power supply current.
Document Number: 002-04712 Rev.*A
Page 37 of 65
MB96620 Series
14.3.2
Pin Characteristics
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Symbol
VIH
"H" level
input voltage
"L" level input
voltage
Pin name
Port
inputs
Pnn_m
Conditions
External clock in
"Fast Clock Input mode"
External clock in
"Oscillation mode"
VIHX0S
X0
VIHX0AS
X0A
VIHR
RSTX
-
VIHM
MD
-
VIHD
DEBUG
I/F
-
VIL
Port
inputs
Pnn_m
External clock in "Fast Clock
Input mode"
External clock in
"Oscillation mode"
VILX0S
X0
VILX0AS
X0A
VILR
RSTX
-
VILM
MD
-
VILD
DEBUG
I/F
-
Document Number: 002-04712 Rev.*A
Min
VCC
0.7
VCC
0.8
VD
0.8
VCC
0.8
VCC
0.8
VCC
- 0.3
2.0
VSS
- 0.3
VSS
- 0.3
VSS
VSS
- 0.3
VSS
- 0.3
VSS
- 0.3
VSS
- 0.3
Value
Typ
-
Max
VCC
+ 0.3
VCC
+ 0.3
VD
VCC
+ 0.3
VCC
+ 0.3
VCC
+ 0.3
VCC
+ 0.3
VCC
0.3
VCC
0.5
VD
0.2
VCC
0.2
VCC
0.2
VSS
+ 0.3
0.8
Unit
V
V
V
Remarks
CMOS Hysteresis
input
AUTOMOTIVE
Hysteresis input
VD=1.8V±0.15V
V
V
V
V
V
V
V
CMOS Hysteresis
input
CMOS Hysteresis
input
TTL Input
CMOS Hysteresis
input
AUTOMOTIVE
Hysteresis input
VD=1.8V±0.15V
V
V
V
V
CMOS Hysteresis
input
CMOS Hysteresis
input
TTL Input
Page 38 of 65
MB96620 Series
Parameter
Symbol
Pin name
VOH4
4mA type
VOH3
3mA type
VOL4
4mA type
VOL3
3mA type
VOLD
DEBUG
I/F
Input leak
current
IIL
Pnn_m
Pull-up
resistance
value
RPU
Pnn_m
CIN
Other
than C,
Vcc,
Vss,
AVcc,
AVss,
AVRH
"H" level
output
voltage
"L" level
output
voltage
Input
capacitance
Document Number: 002-04712 Rev.*A
Conditions
4.5V ≤ VCC ≤ 5.5V
IOH = -4mA
2.7V ≤ VCC < 4.5V
IOH = -1.5mA
4.5V ≤ VCC ≤ 5.5V
IOH = -3mA
2.7V ≤ VCC < 4.5V
IOH = -1.5mA
4.5V ≤ VCC ≤ 5.5V
IOL = +4mA
2.7V ≤ VCC < 4.5V
IOL = +1.7mA
2.7V ≤ VCC < 5.5V
IOL = +3mA
VCC = 2.7V
IOL = +25mA
VSS < VI < VCC
AVSS < VI <
AVCC, AVRH
Min
Value
Typ
Max
Unit
VCC
- 0.5
-
VCC
V
VCC
- 0.5
-
VCC
V
-
-
0.4
V
-
-
0.4
V
0
-
0.25
V
-1
-
+1
A
VCC = 5.0V ±10%
25
50
100
k
-
-
5
15
pF
Remarks
Page 39 of 65
MB96620 Series
14.4 AC Characteristics
14.4.1
Main Clock Input Characteristics
(VCC = AVCC = 2.7V to 5.5V, VD=1.8V±0.15V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Input frequency
Symbol
fC
Pin name
X0,
X1
fFCI
Max
Unit
4
-
8
MHz
-
-
8
MHz
4
-
8
MHz
Input frequency
Value
Typ
Min
-
8
When using a crystal
oscillator, PLL off
When using an opposite
phase external
clock, PLL off
When using a crystal
oscillator or opposite
phase external clock, PLL
on
MHz
When using a single phase
external
clock in “Fast Clock Input
mode”, PLL off
When using a single phase
external
clock in “Fast Clock Input
mode”, PLL on
X0
4
-
8
MHz
Input clock cycle
tCYLH
-
125
-
-
ns
Input clock pulse width
PWH,
PWL
-
55
-
-
ns
Document Number: 002-04712 Rev.*A
Remarks
Page 40 of 65
MB96620 Series
14.4.2
Sub Clock Input Characteristics
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Input frequency
Pin
name
Symbol
fCL
Value
Conditions
Min
Typ
Max
Unit
-
-
32.768
-
kHz
-
-
-
100
kHz
X0A
-
-
-
50
kHz
X0A,
X1A
Input clock cycle
tCYLL
-
-
10
-
-
s
Input clock pulse
width
-
-
PWH/tCYLL,
PWL/tCYLL
30
-
70
%
Document Number: 002-04712 Rev.*A
Remarks
When using an
oscillation circuit
When using an
opposite phase
external clock
When using a single
phase external clock
Page 41 of 65
MB96620 Series
14.4.3
Built-in RC Oscillation Characteristics
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Clock frequency
RC clock stabilization
time
14.4.4
Value
Symbol
Min
Typ
Unit
Max
50
100
200
kHz
1
2
4
MHz
80
160
320
s
64
128
256
s
Remarks
When using slow frequency of RC
oscillator
When using fast frequency of RC
oscillator
When using slow frequency of RC
oscillator
(16 RC clock cycles)
When using fast frequency of RC
oscillator
(256 RC clock cycles)
fRC
tRCSTAB
Internal Clock Timing
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Value
Symbol
Min
Max
Unit
Internal System clock frequency
(CLKS1 and CLKS2)
fCLKS1, fCLKS2
-
54
MHz
Internal CPU clock frequency (CLKB),
Internal peripheral clock frequency (CLKP1)
fCLKB, fCLKP1
-
32
MHz
Internal peripheral clock frequency (CLKP2)
fCLKP2
-
32
MHz
Document Number: 002-04712 Rev.*A
Page 42 of 65
MB96620 Series
14.4.5
Operating Conditions of PLL
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Symbol
Value
Min
Typ
Unit
Max
Remarks
PLL oscillation stabilization wait time
tLOCK
1
-
4
ms
PLL input clock frequency
fPLLI
4
-
8
MHz
PLL oscillation clock frequency
fCLKVCO
56
-
108
MHz
Permitted VCO output
frequency of PLL (CLKVCO)
PLL phase jitter
tPSKEW
-5
-
+5
ns
For CLKMC (PLL input clock)
≥ 4MHz
14.4.6
For CLKMC = 4MHz
Reset Input
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Symbol
Reset input time
tRSTL
Value
Pin name
Min
10
-
s
1
-
s
RSTX
Rejection of reset input time
Unit
Max
tRSTL
RSTX
0.2VCC
Document Number: 002-04712 Rev.*A
0.2VCC
Page 43 of 65
MB96620 Series
14.4.7
Power-on Reset Timing
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Power on rise time
Power off time
Symbol
tR
tOFF
Document Number: 002-04712 Rev.*A
Pin name
Vcc
Vcc
Value
Min
0.05
1
Typ
-
Unit
Max
30
-
ms
ms
Page 44 of 65
MB96620 Series
14.4.8
USART Timing
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C, CL=50pF)
Serial clock cycle time
Symbo
l
tSCYC
SCK SOT delay time
tSLOVI
SOT SCK delay time
tOVSHI
SIN SCK setup time
tIVSHI
SCK SIN hold time
tSHIXI
Serial clock "L" pulse width
tSLSH
SCKn
Serial clock "H" pulse width
tSHSL
SCKn
SCK SOT delay time
tSLOVE
Parameter
SIN SCK setup time
tIVSHE
SCK SIN hold time
tSHIXE
SCK fall time
SCK rise time
tF
tR
Pin
name
SCKn
SCKn
,
SOTn
SCKn
,
SOTn
SCKn
,
SINn
SCKn
,
SINn
SCKn
,
SOTn
SCKn
,
SINn
SCKn
,
SINn
SCKn
SCKn
Conditions
Internal shift
clock mode
4.5V VCC 5.5V
Min
Max
4tCLKP1
-
2.7V VCC 4.5V
Min
Max
4tCLKP1
-
ns
- 20
+ 20
- 30
+ 30
ns
NtCLKP1
– 20*
-
NtCLKP1
– 30*
-
ns
tCLKP1
+ 45
-
tCLKP1
+ 55
-
ns
0
-
0
-
ns
-
ns
-
ns
tCLKP1
+ 10
tCLKP1
+ 10
External
shift
clock mode
-
tCLKP1
+ 10
tCLKP1
+ 10
Unit
-
2tCLKP1
+ 45
-
2tCLKP1
+ 55
ns
tCLKP1/2
+ 10
-
tCLKP1/2
+ 10
-
ns
tCLKP1
+ 10
-
tCLKP1
+ 10
-
ns
-
20
20
-
20
20
ns
ns
Notes:
• AC characteristic in CLK synchronized mode.
• CL is the load capacity value of pins when testing.
• Depending on the used machine clock frequency, the maximum possible baud rate can be limited by
some parameters. These parameters are shown in “MB96600 series HARDWARE MANUAL”.
• tCLKP1 indicates the peripheral clock 1 (CLKP1), Unit: ns
• These characteristics only guarantee the same relocate port number.
For example, the combination of SCKn and SOTn_R is not guaranteed.
*: Parameter N depends on tSCYC and can be calculated as follows:
• If tSCYC = 2 k tCLKP1, then N = k, where k is an integer > 2
• If tSCYC = (2 k + 1) tCLKP1, then N = k + 1, where k is an integer > 1
Examples:
tSCYC
N
4 tCLKP1
2
5 tCLKP1, 6 tCLKP1
3
7 tCLKP1, 8 tCLKP1
4
…
…
Document Number: 002-04712 Rev.*A
Page 45 of 65
MB96620 Series
tSCYC
VOH
SCK
VOL
VOL
tOVSHI
tSLOVI
VOH
SOT
VOL
tIVSHI
SIN
tSHIXI
VIH
VIH
VIL
VIL
Internal shift clock mode
SCK
tSHSL
tSLSH
VIH
VIH
VIL
tF
SOT
VIL
VIH
tR
tSLOVE
VOH
VOL
SIN
tIVSHE
VIH
VIL
tSHIXE
VIH
VIL
External shift clock mode
Document Number: 002-04712 Rev.*A
Page 46 of 65
MB96620 Series
14.4.9
External Input Timing
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Symbol
Input pulse width
Min
Max
Unit
Remarks
Pnn_m
General Purpose I/O
ADTG_R
A/D Converter trigger input
TINn
TTGn
Reload Timer
PPG trigger input
Free-Running Timer input
clock
Input Capture
Quadrature
Position/Revolution
Counter
FRCKn
tINH,
tINL
Value
Pin name
INn
AINn,
BINn,
ZINn
INTn, INTn_R,
INTn_R1
NMI_R
2tCLKP1 +200
(tCLKP1=
1/fCLKP1)*
-
ns
200
-
ns
External Interrupt
Non-Maskable Interrupt
*: tCLKP1 indicates the peripheral clock1 (CLKP1) cycle time except stop when in stop mode.
tINH
External input timing
VIH
tINL
VIH
VIL
Document Number: 002-04712 Rev.*A
VIL
Page 47 of 65
MB96620 Series
14.4.10 I2C Timing
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
fSCL
Typical mode
Min
Max
0
100
High-speed mode*4
Min
Max
0
400
kHz
tHDSTA
4.0
-
0.6
-
s
tLOW
tHIGH
4.7
4.0
-
1.3
0.6
-
s
s
4.7
-
0.6
-
s
0
3.45*2
0
0.9*3
s
tSUDAT
250
-
100
-
ns
tSUSTO
4.0
-
0.6
-
s
tBUS
4.7
-
1.3
-
s
0
(1-1.5)
tCLKP1*5
0
(1-1.5)
tCLKP1*5
ns
Symbol
SCL clock frequency
(Repeated) START condition hold
time
SDA SCL
SCL clock "L" width
SCL clock "H" width
(Repeated) START condition setup
time
SCL SDA
Data hold time
SCL SDA
Data setup time
SDA SCL
STOP condition setup time
SCL SDA
Bus free time between
"STOP condition" and
"START condition"
Pulse width of spikes which will be
suppressed by input noise filter
Conditions
tSUSTA
CL = 50pF,
R = (Vp/IOL)*1
tHDDAT
tSP
-
*1
: R and CL represent the pull-up resistance and load capacitance of the SCL and SDA lines, respectively.
Vp indicates the power supply voltage of the pull-up resistance and IOL indicates VOL guaranteed current.
*2
: The maximum tHDDAT only has to be met if the device does not extend the "L" width (tLOW) of the SCL signal.
*3
: A high-speed mode I2C bus device can be used on a standard mode I2C bus system as long as the device satisfies the
requirement of "tSUDAT ≥ 250ns".
*4
: For use at over 100kHz, set the peripheral clock1 (CLKP1) to at least 6MHz.
*5
: tCLKP1 indicates the peripheral clock1 (CLKP1) cycle time.
Unit
SDA
tSUDAT
tSUSTA
tBUS
tLOW
SCL
tHDSTA
Document Number: 002-04712 Rev.*A
tHDDAT
tHIGH
tHDSTA
tSP
tSUSTO
Page 48 of 65
MB96620 Series
14.5 A/D Converter
14.5.1
Electrical Characteristics for the A/D Converter
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Value
Typ
Symbol
Pin name
Resolution
-
-
-
-
10
bit
Total error
-
-
- 3.0
-
+ 3.0
LSB
Nonlinearity error
-
-
- 2.5
-
+ 2.5
LSB
Differential
Nonlinearity error
-
-
- 1.9
-
+ 1.9
LSB
Zero transition
voltage
VOT
ANn
Typ - 20
AVSS
+ 0.5LSB
Typ + 20
mV
Full scale transition
voltage
VFST
ANn
Typ - 20
Typ + 20
mV
Compare time*
-
-
Sampling time*
-
-
5.0
8.0
3.1
s
s
s
s
mA
Power supply
current
Reference power
supply current
(between AVRH
and AVSS )
IA
IAH
AVCC
IR
IRH
AN8, 9,
12, 13
AN16 to
23
CVIN
Analog impedance
RVIN
ANn
IAIN
AN8, 9,
12, 13
AN16 to
23
Analog input
voltage
Reference voltage
range
Variation between
channels
Max
Unit
Remarks
1.0
2.2
0.5
1.2
-
AVRH
- 1.5LSB
2.0
-
-
3.3
A
-
520
810
A
A/D Converter active
-
-
1.0
A
A/D Converter not
operated
-
-
15.5
pF
Normal outputs
-
-
17.4
pF
High current outputs
-
-
1450
2700
4.5V ≤ AVCC ≤ 5.5V
2.7V ≤ AVCC < 4.5V
- 1.0
-
+ 1.0
A
- 3.0
-
+ 3.0
A
AVRH
Analog input
capacity
Analog port input
current (during
conversion)
Min
VAIN
ANn
AVSS
-
AVRH
V
-
AVRH
AVCC
- 0.1
-
AVCC
V
-
ANn
-
-
4.0
LSB
4.5V ≤ ΑVCC ≤ 5.5V
2.7V ≤ ΑVCC 4.5V
4.5V ≤ ΑVCC ≤ 5.5V
2.7V ≤ ΑVCC 4.5V
A/D Converter active
A/D Converter not
operated
AVSS VAIN
AVCC, AVRH
*: Time for each channel.
Document Number: 002-04712 Rev.*A
Page 49 of 65
MB96620 Series
14.5.2 Accuracy and Setting of the A/D Converter Sampling Time
If the external impedance is too high or the sampling time too short, the analog voltage charged to the internal sample and hold
capacitor is insufficient, adversely affecting the A/D conversion precision.
To satisfy the A/D conversion precision, a sufficient sampling time must be selected. The required sampling time (Tsamp) depends
on the external driving impedance Rext, the board capacitance of the A/D converter input pin Cext and the AVCC voltage level. The
following replacement model can be used for the calculation:
MCU
Rext
Analog
input
RVIN
Source
Comparator
Cext
CVIN
Sampling switch
(During sampling:ON)
Rext: External driving impedance
Cext: Capacitance of PCB at A/D converter input
CVIN: Analog input capacity (I/O, analog switch and ADC are contained)
RVIN: Analog input impedance (I/O, analog switch and ADC are contained)
The following approximation formula for the replacement model above can be used:
Tsamp = 7.62 × (Rext × Cext + (Rext + RVIN) × CVIN)
• Do not select a sampling time below the absolute minimum permitted value.
(0.5s for 4.5V ≤ AVCC ≤ 5.5V, 1.2s for 2.7V ≤ AVCC < 4.5V)
• If the sampling time cannot be sufficient, connect a capacitor of about 0.1F to the analog input pin.
• A big external driving impedance also adversely affects the A/D conversion precision due to the pin input leakage current IIL
(static current before the sampling switch) or the analog input leakage current IAIN (total leakage current of pin input and
comparator during sampling). The effect of the pin input leakage current IIL cannot be compensated by an external capacitor.
• The accuracy gets worse as |AVRH - AVSS| becomes smaller.
Document Number: 002-04712 Rev.*A
Page 50 of 65
MB96620 Series
14.5.3
Definition of A/D Converter Terms
• Resolution
• Nonlinearity error
transition point
•
•
•
•
: Analog variation that is recognized by an A/D converter.
: Deviation of the actual conversion characteristics from a straight line that connects the zero
(0b0000000000 ←→ 0b0000000001) to the full-scale transition point
(0b1111111110 ←→ 0b1111111111).
Differential nonlinearity error : Deviation from the ideal value of the input voltage that is required to change the
output code by 1LSB.
Total error
: Difference between the actual value and the theoretical value. The total error includes zero
transition error, full-scale transition error and nonlinearity error.
Zero transition voltage
: Input voltage which results in the minimum conversion value.
Full scale transition voltage: Input voltage which results in the maximum conversion value.
Nonlinearity error of digital output N =
VNT - {1LSB (N - 1) + VOT}
1LSB
Differential nonlinearity error of digital output N =
1LSB =
N
VOT
VFST
VNT
:
:
:
:
V(N + 1) T - VNT
1LSB
[LSB]
- 1 [LSB]
VFST - VOT
1022
A/D converter digital output value.
Voltage at which the digital output changes from 0x000 to 0x001.
Voltage at which the digital output changes from 0x3FE to 0x3FF.
Voltage at which the digital output changes from 0x(N − 1) to 0xN.
Document Number: 002-04712 Rev.*A
Page 51 of 65
MB96620 Series
1LSB (Ideal value) =
Total error of digital output N =
AVRH - AVSS
1024
[V]
VNT - {1LSB (N - 1) + 0.5LSB}
1LSB
N
: A/D converter digital output value.
VNT
: Voltage at which the digital output changes from 0x(N + 1) to 0xN.
VOT (Ideal value) = AVSS + 0.5LSB[V]
VFST (Ideal value) = AVRH - 1.5LSB[V]
Document Number: 002-04712 Rev.*A
Page 52 of 65
MB96620 Series
14.6 Low Voltage Detection Function Characteristics
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Symbol
Conditions
Value
Typ
2.90
3.00
3.20
3.50
3.70
4.00
4.20
Max
3.10
3.21
3.42
3.74
3.95
4.27
4.49
V
V
V
V
V
V
V
Unit
Detected voltage*1
VDL0
VDL1
VDL2
VDL3
VDL4
VDL5
VDL6
CILCR:LVL = 0000B
CILCR:LVL = 0001B
CILCR:LVL = 0010B
CILCR:LVL = 0011B
CILCR:LVL = 0100B
CILCR:LVL = 0111B
CILCR:LVL = 1001B
Min
2.70
2.79
2.98
3.26
3.45
3.73
3.91
Power supply voltage
change rate*2
dV/dt
-
- 0.004
-
+ 0.004
V/s
Hysteresis width
VHYS
CILCR:LVHYS=0
-
-
50
mV
CILCR:LVHYS=1
80
100
120
mV
Stabilization time
TLVDSTAB
-
-
-
75
s
Detection delay time
td
-
-
-
30
s
*1
: If the power supply voltage fluctuates within the time less than the detection delay time (td), there is a possibility that the low
voltage detection will occur or stop after the power supply voltage passes the detection range.
*2
: In order to perform the low voltage detection at the detection voltage (VDLX), be sure to suppress fluctuation of the power supply
voltage within the limits of the change ration of power supply voltage.
Document Number: 002-04712 Rev.*A
Page 53 of 65
MB96620 Series
Voltage
Vcc
dV
Detected Voltage
dt
VDLX max
VDLX min
Time
RCR:LVDE
···Low voltage detection
function enable
Document Number: 002-04712 Rev.*A
Low voltage detection
function disable
Stabilization time
TLVDSTAB
Low voltage detection
function enable···
Page 54 of 65
MB96620 Series
14.7 Flash Memory Write/Erase Characteristics
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 125°C)
Parameter
Sector erase time
Word (16-bit) write
time
Conditions
Min
Value
Typ
Unit
Max
Large Sector
TA ≤ + 105°C
-
1.6
7.5
s
Small Sector
-
-
0.4
2.1
s
Security Sector
-
-
0.31
1.65
s
Large Sector
TA ≤ + 105°C
-
25
400
s
Small Sector
-
-
25
400
s
TA ≤ + 105°C
-
5.11
25.05
s
Chip erase time
Remarks
Includes write time prior to
internal erase.
Not including system-level
overhead
time.
Includes write time prior to
internal erase.
Note:
While the Flash memory is written or erased, shutdown of the external power (VCC) is prohibited. In the application system where the
external power (VCC) might be shut down while writing or erasing, be sure to turn the power off by using a low voltage detection
function.
To put it concrete, change the external power in the range of change ration of power supply voltage (-0.004V/s to +0.004V/s) after
the external power falls below the detection voltage (VDLX)*1.
Write/Erase cycles and data hold time
Write/Erase cycles
(cycle)
1,000
10,000
100,000
*1
Data hold time
(year)
20 *2
10 *2
5 *2
: See "Low Voltage Detection Function Characteristics".
*2
: This value comes from the technology qualification (using Arrhenius equation to translate high temperature
measurements into normalized value at + 85C).
Document Number: 002-04712 Rev.*A
Page 55 of 65
MB96620 Series
15. Example Characteristics
This characteristic is an actual value of the arbitrary sample. It is not the guaranteed value.
MB96F625
Run Mode
(VCC = 5.5V)
100.00
PLL clock (32MHz)
10.00
ICC [mA]
Main osc. (4MHz)
1.00
RC clock (2MHz)
RC clock (100kHz)
0.10
Sub osc. (32kHz)
0.01
-50
0
50
100
150
TA [ºC]
Sleep Mode
100.000
PLL clock (32MHz)
10.000
ICC [mA]
(VCC = 5.5V)
Main osc. (4MHz)
1.000
RC clock (2MHz)
0.100
RC clock (100kHz)
0.010
Sub osc. (32kHz)
0.001
-50
0
50
100
150
TA [ºC]
Document Number: 002-04712 Rev.*A
Page 56 of 65
MB96620 Series
MB96F625
Timer Mode
(VCC = 5.5V)
10.000
PLL clock (32MHz)
1.000
ICC [mA]
Main osc. (4MHz)
0.100
RC clock (2MHz)
RC clock (100kHz)
0.010
Sub osc. (32kHz)
0.001
-50
0
50
100
150
TA [ºC]
Stop Mode
(VCC = 5.5V)
1.000
ICC [mA]
0.100
0.010
0.001
-50
0
50
100
150
TA [ºC]
Document Number: 002-04712 Rev.*A
Page 57 of 65
MB96620 Series
Used setting
Selected Source
Clock
Mode
Run mode
Sleep mode
PLL
CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 32MHz
Main osc.
CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 4MHz
RC clock fast
CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 2MHz
RC clock slow
CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 100kHz
Sub osc.
CLKS1 = CLKS2 = CLKB = CLKP1 = CLKP2 = 32kHz
CLKS1 = CLKS2 = CLKP1 = CLKP2 = 32MHz
Regulator in High Power Mode,
(CLKB is stopped in this mode)
CLKS1 = CLKS2 = CLKP1 = CLKP2 = 4MHz
Regulator in High Power Mode,
(CLKB is stopped in this mode)
CLKS1 = CLKS2 = CLKP1 = CLKP2 = 2MHz
Regulator in High Power Mode,
(CLKB is stopped in this mode)
CLKS1 = CLKS2 = CLKP1 = CLKP2 = 100kHz
Regulator in Low Power Mode,
(CLKB is stopped in this mode)
CLKS1 = CLKS2 = CLKP1 = CLKP2 = 32kHz
Regulator in Low Power Mode,
(CLKB is stopped in this mode)
CLKMC = 4MHz, CLKPLL = 32MHz
(System clocks are stopped in this mode)
Regulator in High Power Mode,
FLASH in Power-down / reset mode
CLKMC = 4MHz
(System clocks are stopped in this mode)
Regulator in High Power Mode,
FLASH in Power-down / reset mode
CLKMC = 2MHz
(System clocks are stopped in this mode)
Regulator in High Power Mode,
FLASH in Power-down / reset mode
CLKMC = 100kHz
(System clocks are stopped in this mode)
Regulator in Low Power Mode,
FLASH in Power-down / reset mode
CLKMC = 32 kHz
(System clocks are stopped in this mode)
Regulator in Low Power Mode,
FLASH in Power-down / reset mode
(All clocks are stopped in this mode)
Regulator in Low Power Mode,
FLASH in Power-down / reset mode
PLL
Main osc.
RC clock fast
RC clock slow
Sub osc.
Timer mode
PLL
Main osc.
RC clock fast
RC clock slow
Sub osc.
Stop mode
Clock/Regulator and FLASH Settings
stopped
Document Number: 002-04712 Rev.*A
Page 58 of 65
MB96620 Series
16. Ordering Information
MCU with CAN controller
Part number
MB96F622RBPMC-GSE1
MB96F622RBPMC-GSE2
MB96F622RBPMC-GTE1
MB96F622RBPMC1-GSE1
MB96F622RBPMC1-GSE2
MB96F622RBPMC1-GTE1
MB96F623RBPMC-GSE1
MB96F623RBPMC-GSE2
MB96F623RBPMC-GTE1
MB96F623RBPMC1-GSE1
MB96F623RBPMC1-GSE2
MB96F623RBPMC1-GTE1
MB96F625RBPMC-GSE1
MB96F625RBPMC-GSE2
MB96F625RBPMC-GTE1
MB96F625RBPMC1-GSE1
MB96F625RBPMC1-GSE2
MB96F625RBPMC1-GTE1
Flash memory
Package*
64-pin plastic LQFP
(FPT-64P-M23)
Flash A
(64.5KB)
64-pin plastic LQFP
(FPT-64P-M24)
64-pin plastic LQFP
(FPT-64P-M23)
Flash A
(96.5KB)
64-pin plastic LQFP
(FPT-64P-M24)
64-pin plastic LQFP
(FPT-64P-M23)
Flash A
(160.5KB)
64-pin plastic LQFP
(FPT-64P-M24)
*: For details about package, see "PACKAGE DIMENSION".
MCU without CAN controller
Part number
MB96F622ABPMC-GSE1
MB96F622ABPMC-GSE2
MB96F622ABPMC-GTE1
MB96F622ABPMC1-GSE1
MB96F622ABPMC1-GSE2
MB96F622ABPMC1-GTE1
MB96F623ABPMC-GSE1
MB96F623ABPMC-GSE2
MB96F623ABPMC-GTE1
MB96F623ABPMC1-GSE1
MB96F623ABPMC1-GSE2
MB96F623ABPMC1-GTE1
MB96F625ABPMC-GSE1
MB96F625ABPMC-GSE2
MB96F625ABPMC-GTE1
MB96F625ABPMC1-GSE1
MB96F625ABPMC1-GSE2
MB96F625ABPMC1-GTE1
Flash memory
Package*
64-pin plastic LQFP
(FPT-64P-M23)
Flash A
(64.5KB)
64-pin plastic LQFP
(FPT-64P-M24)
64-pin plastic LQFP
(FPT-64P-M23)
Flash A
(96.5KB)
64-pin plastic LQFP
(FPT-64P-M24)
64-pin plastic LQFP
(FPT-64P-M23)
Flash A
(160.5KB)
64-pin plastic LQFP
(FPT-64P-M24)
*: For details about package, see "PACKAGE DIMENSION".
Document Number: 002-04712 Rev.*A
Page 59 of 65
MB96620 Series
17. Package Dimension
64-pin plastic LQFP
Lead pitch
0.65 mm
Package width ×
package length
12.0 × 12.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.47 g
Code
(Reference)
P-LQFP64-12 × 12-0.65
(FPT-64P-M23)
64-pin plastic LQFP
(FPT-64P-M23)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
14.00± 0.20(.551± .008)SQ
0.145± 0.055
(.006 ± .002)
*12.00± 0.10(.472± .004)SQ
48
33
49
32
0.10(.004)
Details of "A" part
+0.20
1.50 –0.10
+.008 (Mounting height)
.059 –.004
0.25(.010)
INDEX
0~8°
64
17
0.65(.026)
C
"A"
16
1
0.32 ± 0.05
(.013 ± .002)
0.13(.005)
2003-2010 FUJITSU SEMICONDUCTOR LIMITED F64034S-c-1-4
Document Number: 002-04712 Rev.*A
0.50 ± 0.20
(.020 ± .008)
0.60 ± 0.15
(.024 ± .006)
0.10 ± 0.10
(.004 ± .004)
(Stand off)
M
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Page 60 of 65
MB96620 Series
64-pin plastic LQFP
Lead pitch
0.50 mm
Package width ×
package length
10.0 × 10.0 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
1.70 mm MAX
Weight
0.32 g
Code
(Reference)
P-LFQFP64-10×10-0.50
(FPT-64P-M24)
64-pin plastic LQFP
(FPT-64P-M24)
Note 1) * : These dimensions do not include resin protrusion.
Note 2) Pins width and pins thickness include plating thickness.
Note 3) Pins width do not include tie bar cutting remainder.
12.00±0.20(.472±.008)SQ
*10.00±0.10(.394±.004)SQ
48
0.145±0.055
(.006±.002)
33
32
49
Details of "A" part
0.08(.003)
+0.20
1.50 –0.10
+.008 (Mounting height)
.059 –.004
INDEX
64
0°~8°
17
0.10±0.10
(.004±.004)
(Stand off)
"A"
LEAD No.
1
16
0.50(.020)
0.20±0.05
(.008±.002)
C
0.08(.003)
2005-2010 FUJITSU SEMICONDUCTOR LIMITED F64036S-c-1-3
Document Number: 002-04712 Rev.*A
M
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.25(.010)
Dimensions in mm (inches).
Note: The values in parentheses are reference values
Page 61 of 65
MB96620 Series
18. Major Changes
Spansion Publication Number: MB96620_DS704-00008
Page
Section
Revision 2.0
Features
4
25 to 28
Handling Precautions
Electrical Characteristics
3. Dc Characteristics
(1) Current Rating
36
37
38
49
51
4. Ac Characteristics
(10) I2c Timing
5. A/D Converter
(2) Accuracy And Setting Of The A/D
Converter Sampling Time
7. Flash Memory Write/Erase
Characteristics
56
Document Number: 002-04712 Rev.*A
Change Results
Changed the description of “External Interrupts”
Interrupt mask and pending bit per channel
→
Interrupt mask bit per channel
Added a section
Changed the Conditions for ICCSRCH
CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 2MHz,
→
CLKS1/2 = CLKP1/2 = CLKRC = 2MHz,
Changed the Conditions for ICCSRCL
CLKS1/2 = CLKB = CLKP1/2 = CLKRC = 100kHz
→
CLKS1/2 = CLKP1/2 = CLKRC = 100kHz
Changed the Conditions for ICCTPLL
PLL Timer mode with CLKP1 = 32MHz
→
PLL Timer mode with CLKPLL = 32MHz
Changed the Value of “Power supply current in Timer modes”
ICCTPLL
Typ: 2480μA → 1800μA (TA = +25°C)
Max: 2710μA → 2245μA (TA = +25°C)
Max: 3985μA → 3165μA (TA = +105°C)
Max: 4830μA → 3975μA (TA = +125°C)
Changed the Conditions for ICCTRCL
RC Timer mode with CLKRC = 100kHz,
SMCR:LPMSS = 0 (CLKPLL, CLKMC and CLKSC stopped)
→
RC Timer mode with CLKRC = 100kHz
(CLKPLL, CLKMC and CLKSC stopped)
Changed the annotation *2
Power supply for "On Chip Debugger" part is not included.
Power supply current in Run mode does not include
Flash Write / Erase current.
→
The current for "On Chip Debugger" part is not included.
Added parameter, “Noise filter” and an annotation *5 for it
Added tSP to the figure
Deleted the unit “[Min]” from approximation formula of
Sampling time
Changed the condition
(VCC = AVCC = 2.7V to 5.5V, VD=1.8V±0.15V, VSS = AVSS =
0V, TA = - 40°C to + 125°C)
→
(VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to +
125°C)
Page 62 of 65
MB96620 Series
Page
Section
Electrical Characteristics
7. Flash Memory Write/Erase
Characteristics
56
Ordering Information
60
Revision 2.1
-
Change Results
Changed the Note
While the Flash memory is written or erased, shutdown of the
external power (VCC) is prohibited. In the application system
where the external power (VCC) might be shut down while
writing, be sure to turn the power off by using an external
voltage detector.
→
While the Flash memory is written or erased, shutdown of the
external power (VCC) is prohibited. In the application system
where the external power (VCC) might be shut down while
writing or erasing, be sure to turn the power off by using a low
voltage detection function.
Deleted the Part number
MCU with CAN controller
MB96F622RBPMC-GTE2
MB96F622RBPMC1-GTE2
MB96F623RBPMC-GTE2
MB96F623RBPMC1-GTE2
MB96F625RBPMC-GTE2
MB96F625RBPMC1-GTE2
MCU without CAN controller
MB96F622ABPMC-GTE2
MB96F622ABPMC1-GTE2
MB96F623ABPMC-GTE2
MB96F623ABPMC1-GTE2
MB96F625ABPMC-GTE2
MB96F625ABPMC1-GTE2
Company name and layout design change
NOTE: Please see “Document History” about later revised information.
Document Number: 002-04712 Rev.*A
Page 63 of 65
MB96620 Series
Document History
Document Title: MB96620 Series F2MC-16FX 16-Bit Microcontroller
Document Number: 002-04712
Revision
ECN
**
-
Orig. of
Submission
Change
Date
KSUN
01/31/2014
Description of Change
Migrated to Cypress and assigned document number 002-04712.
No change to document contents or format.
*A
5137624
KSUN
Document Number: 002-04712 Rev.*A
02/17/2016
Updated to Cypress format.
Page 64 of 65
MB96620 Series
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the
office closest to you, visit us at Cypress Locations.
PSoC® Solutions
Products
Automotive
cypress.com/go/automotive
Clocks & Buffers
cypress.com/go/clocks
Interface
Lighting & Power Control
cypress.com/go/interface
cypress.com/go/powerpsoc
Memory
cypress.com/go/memory
PSoC
cypress.com/go/psoc
Touch Sensing
PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP
Cypress Developer Community
Community | Forums | Blogs | Video | Training
Technical Support
cypress.com/go/support
cypress.com/go/touch
USB Controllers
cypress.com/go/USB
Wireless/RF
Spansion Products
psoc.cypress.com/solutions
cypress.com/go/wireless
cypress.com/spansionproducts
Cypress, the Cypress logo, Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered
trademarks of Cypress Semiconductor Corp. ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries. All other trademarks or registered trademarks referenced
herein are the property of their respective owners.
© Cypress Semiconductor Corporation, 2014-2016. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
This Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a
Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is
prohibited without the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 002-04712 Rev.*A
February 17, 2016
Page 65 of 65