Diodes DMN1003UCA6 N-channel enhancement mode mosfet Datasheet

DMN1003UCA6
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
RSS(ON) Max
IS
TA = +25°C
3.2mΩ @ VGS = 4.5V
23.6A
6.3mΩ @ VGS = 2.5V
16.8A
BVSSS
12V
Features





CSP with Footprint 3.54mm × 1.77mm
Height = 0.21mm for Low Profile
ESD Protection of Gate
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Description
This new generation MOSFET has been designed to minimize the onstate resistance (RSS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications



Mechanical Data




Case: X3-DSN3518-6
Terminal Connections: See Diagram Below
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish — NiPdAu. Solderable per MIL-STD-202,
Method 208 e4
Battery Management
Load Switch
Battery Protection
G1
1. Source 1
2. Gate 1
3. Source 1
4. Source 2
5. Gate 2
6. Source 2
ESD PROTECTED
G2
Top View
S1
S2
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN1003UCA6-7
Notes:
Case
X3-DSN3518-6
Packaging
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
M1 = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: E= 2017)
M or M = Month (ex: 9 = September)
Date Code Key
Year
Code
Month
Code
2015
C
Jan
1
2016
D
Feb
2
DMN1003UCA6
Document number: DS39389 Rev. 4 - 2
Mar
3
2017
E
Apr
4
May
5
2018
F
Jun
6
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2019
G
Jul
7
Aug
8
2020
H
Sep
9
Oct
O
2021
I
Nov
N
Dec
D
June 2017
© Diodes Incorporated
DMN1003UCA6
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VSSS
VGSS
Source-Source Voltage
Gate-Source Voltage
Continuous Source Current (Note 5) VGS = 4.5V
Steady
State
Continuous Source Current (Note 5) VGS = 2.5V
Steady
State
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Value
12
±8
23.6
18.9
IS
Unit
V
V
A
ISM
16.8
13.4
100
Symbol
PD
RθJA
PD
RθJA
TJ, TSTG
Value
1.05
120.7
2.67
46.8
-55 to +150
IS
Pulsed Source Current (Note 6)
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 7)
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient @TA = +25°C (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics
Unit
W
°C/W
W
°C/W
°C
(@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Source-Source Breakdown Voltage
Zero Gate Voltage Source Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVSSS
ISSS
IGSS
12
-
-
1
±10
V
A
A
VGS = 0V, IS = 1mA
VSS = 10V, VGS = 0V
VGS = ±8V, VSS=0V
VGS(TH)
RSS(ON)
VSS
2.3
2.4
2.5
2.7
3.0
0.7
1.3
3.2
3.2
3.2
4.4
6.3
1.2
V
Static Source-Source On-Resistance
0.5
1.2
1.2
1.3
1.3
1.4
-
VSS = 6V, IS = 1mA
VGS = 4.5V, IS = 5A
VGS = 4.0V, IS = 5A
VGS = 3.8V, IS = 5A
VGS = 3.1V, IS = 5A
VGS = 2.5V, IS = 5A
VGS = 0V, IS = 3A
Ciss
Coss
Crss
Qg
Qgs
Qgd
Qg(TH)
tD(ON)
tR
tD(OFF)
tF
-
3315
850
248
56.5
8.8
13.3
6.9
603
1694
4749
6208
-
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Charge at VTH
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
mΩ
V
Test Condition
pF
VSS = 6V, VGS = 0V,
f = 1.0MHz
nC
VSS = 6V, VGS = 4.5V,
IS = 27A
ns
VSS = 6V, VGS = 4.5V,
IS = 3A
5. Device mounted on FR-4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
6. Repetitive rating, pulse width limited by junction temperature.
7. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
DMN1003UCA6
Document number: DS39389 Rev. 4 - 2
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June 2017
© Diodes Incorporated
DMN1003UCA6
30
30.0
VSS=5V
VGS = 2.0V
25.0
VGS = 3.0V
IS, SOURCE-SOURCE CURRENT (A)
IS, SOURCE-SOURCE CURRENT (A)
VGS = 1.5V
VGS = 1.2V
VGS = 4.5V
20.0
VGS = 8.0V
15.0
10.0
VGS = 1.1V
5.0
VGS = 1.0V
20
15
10
0.5
1
1.5
2
2.5
3
3.5
VSS, SOURCE-SOURCE VOLTAGE(V)
Figure 1. Typical Output Characteristic
5
TJ= 25℃
TJ= 125℃
TJ=-55℃
0.0034
0.0032
VGS = 2.5V
0.003
0.0028
VGS = 3.8V
0.0026
VGS = 4.5V
0.0024
0.4
4
RSS(ON), SOURCE-SOURCE ON-RESISTANCE
(Ω)
0
0.0022
0.002
0.06
0.0035
TJ= 150℃
TJ= 125℃
TJ= 85℃
0.003
TJ= 25℃
0.0025
TJ=-55℃
0.002
0.0015
0.02
0
5
10
15
20
25
30
IS, SOURCE-SOURCE CURRENT (A)
Figure 5. Typical On-Resistance vs. Source Current and
Junction Temperature
Document number: DS39389 Rev. 4 - 2
1
2
3
4
5
6
7
8
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
0
DMN1003UCA6
IS = 5.0A
0.04
0
RSS(ON), SOURCE-SOURCE ON-RESISTANCE
(NORMALIZED)
VGS=4.5V
1.4
0.08
5
10
15
20
25
30
IS, SOURCE-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Source Current and
Gate Voltage
0.004
0.6
0.8
1
1.2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
0.1
0
RSS(ON), SOURCE-SOURCE ON-RESISTANCE
(Ω)
TJ= 85℃
TJ= 150℃
0
0.0
RSS(ON), SOURCE-SOURCE ON-RESISTANCE
(Ω)
25
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1.8
1.6
VGS = 3.8V, IS = 5A
1.4
1.2
VGS = 2.5V, IS = 5A
VGS = 4.5V, IS = 5A
1
0.8
0.6
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Junction
Temperature
June 2017
© Diodes Incorporated
0.9
0.005
0.004
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RSS(ON), SOURCE-SOURCE ON-RESISTANCE
(Ω)
DMN1003UCA6
VGS = 2.5V, IS = 5A
0.003
VGS = 3.8V, IS = 5A
0.002
VGS = 4.5V, IS = 5A
0.001
0.8
0.7
0.6
0.5
IS = 250μA
0.4
0.3
0.2
0.1
-50
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 7. On-Resistance Variation with Junction
Temperature
-25
25
50
75
100
125
150
10000
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
8
6
4
TJ= 85℃
TJ= 150℃
TJ= 25℃
2
TJ= 125℃
f=1MHz
Ciss
TJ= -55℃
0
0.2
0.4
0.6
Coss
1000
Crss
100
0
0.8
0
1
2
4
6
8
10
VSS, SOURCE-SOURCE VOLTAGE(V)
Figure 10. Typical Junction Capacitance
VSS, SOURCE-SOURCE VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
12
1000
8
IS, SOURCE-SOURCE CURRENT (A)
RSS(ON) LIMITED
7
6
5
VGS (V)
0
TJ, JUNCTION TEMPERATURE (℃)
Figure 8. Gate Threshold Variation vs. Junction
Temperature
10
IS, SOURCE-SOURCE CURRENT (A)
IS= 1mA
4
3
VSS = 6V, IS = 27A
2
1
PW =1ms
10
0
10
20
30
40
50
60
70
80
90 100
Qg (nC)
Figure 11. Gate Charge
DMN1003UCA6
Document number: DS39389 Rev. 4 - 2
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PW =10ms
PW =100ms
1
0.1
0.01
0
PW =100µs
100
TJ(MAX)=150℃
TC=25℃
Single Pulse
DUT on
1*MRP Board
VGS=4.5V
0.01
PW =1s
PW =10s
DC
0.1
1
10
VSS, SOURCE-SOURCE VOLTAGE(V)
Figure 12. SOA, Safe Operation Area
100
June 2017
© Diodes Incorporated
DMN1003UCA6
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.5
D=0.9
D=0.7
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA(t) = r(t) * RθJA
RθJA= 117℃/W
Duty Cycle, D = t1 / t2
D=Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
100
1000
Figure 13. Transient Thermal Resistance
DMN1003UCA6
Document number: DS39389 Rev. 4 - 2
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DMN1003UCA6
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X3-DSN3518-6
e2
D
e2
e1
E
e
b2
L
Ø b(2x)
A
X3-DSN3518-6
Dim
Min
Max
Typ
A
0.16
0.26
0.21
b
0.22
0.28
0.25
b2
0.22
0.28
0.25
D
3.49
3.59
3.54
E
1.72
1.82
1.77
e
0.47
0.53
0.50
e1
0.22
0.28
0.25
e2
0.97
1.03
1.00
L
1.22
1.28
1.25
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X3-DSN3518-6
C1
Dimensions
C
C1
D
X
C
X
DMN1003UCA6
Document number: DS39389 Rev. 4 - 2
Value
(in mm)
0.50
2.00
0.25
1.25
Ø D
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DMN1003UCA6
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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website, harmless against all damages.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
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failure of the life support device or to affect its safety or effectiveness.
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Copyright © 2017, Diodes Incorporated
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DMN1003UCA6
Document number: DS39389 Rev. 4 - 2
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