Material Content Data Sheet Sales Product Name SPB11N60S5 MA# MA000737530 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1560.25 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 6.625 0.42 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.42 4246 4246 195 0.091 0.01 304.026 19.49 19.52 194857 59 195111 0.732 0.05 0.05 469 469 10.281 0.66 6589 113.092 7.25 562.031 36.01 43.92 360218 439291 9.657 0.62 0.62 6189 6189 0.228 0.01 0.001 0.00 0.120 0.01 0.096 0.01 4.590 0.29 0.165 0.01 0.548 0.04 547.666 35.10 72483 146 0.01 1 62 0.31 2942 2. 3. 351 35.15 351011 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3081 105 Important Remarks: 1. 146 77 351467 1000000