Material Content Data Sheet Sales Product Name TLE7234EM Issued MA# MA000982088 Package PG-SSOP-24-4 28. August 2013 Weight* 150.84 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 4.306 2.85 0.017 0.01 0.067 0.04 446 1.345 0.89 8917 54.617 36.21 37.15 362087 371561 0.478 0.32 0.32 3167 3167 0.171 0.11 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.85 28546 28546 111 1136 7.881 5.22 77.609 51.46 56.79 514517 567900 2.911 1.93 1.93 19298 19298 0.234 0.16 0.16 1553 1553 0.301 0.20 0.902 0.60 52247 1994 0.80 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5981 7975 1000000