Product Folder Order Now Support & Community Tools & Software Technical Documents AFE4410 SBAS832 – MAY 2017 AFE4410 Ultra-Small, Integrated AFE With FIFO for Wearable, Continuous Optical Heart-Rate Monitoring and Biosensing 1 Features 2 Applications • • 1 • • • • • • • • • Accurate, Continuous Heart-Rate Monitoring: – Up to 100-dB Dynamic Range for Accurate Heart-Rate Detection – Low Current for Continuous Operation on a Wearable Device With a Typical Value: – 30 µA for an LED, 25 µA for the Receiver Transmitter: – 4 LEDs in Common Anode Configurations – 8-Bit Programmable LED Current to 200 mA – Mode to Fire Two LEDs in Parallel – Programmable LED On-Time – Simultaneous Support of 3 LEDs for Optimized SpO2, HRM, or Multiwavelength HRM – Average Current of 30 µA Adequate for a Typical Heart-Rate Monitoring Scenario: – 20-mA Setting, 60-µs Pulse Duration, 25-Hz Sampling Rate Receiver: – Supports 3 Time-Multiplexed PD Inputs – 24-Bit Representation of Current Input From PD in Twos Complement Format – Individual DC Offset Subtraction DAC (Up to ±126-µA Range) at TIA Input for Each LED, Ambient – Digital Ambient Subtraction at ADC Output – Transimpedance Gain: 10 kΩ to 2 MΩ – Noise Filtering With Programmable Bandwidth – Receiver Operates at Approximately 1-µA/Hz Sampling Rate (Example, 25 µA at 25 Hz) – Hardware Power-Down Mode: Approximately 0-µA Current Flexible Pulse Sequencing and Timing Control Clocking Via External Clock or Internal Oscillator FIFO With 128-Sample Depth: – Programmable Partitioning Across Phases Pin-Selectable I2C, SPI Interface Operating Temperature Range: –20°C to +70°C 2.6-mm × 2.1-mm, 0.4-mm Pitch DSBGA Package Supplies: – Tx: 3 V to 5.25 V – Rx: 1.8 V to 1.9 V (LDO Bypass), 2.0 V to 3.6 V (LDO Enabled) – IO: 1.7 V to Rx_SUP Optical Heart-Rate Monitoring (HRM) for Wearables, Hearables Heart-Rate Variability (HRV) Pulse Oximetry (SpO2) Measurements Maximum Oxygen Consumption (VO2 Max) • • • 3 Description The AFE4410 is an analog front-end for optical biosensing applications, such as heart-rate monitoring (HRM). The device supports up to four switching light-emitting diodes (LEDs) and up to three photodiodes (PDs). The current from the photodiode is converted into voltage by the transimpedance amplifier (TIA) and digitized using an analog-to-digital converter (ADC). The ADC code is stored in a 128sample first in, first-out block (FIFO) with programmable depth. The FIFO can be read out using either an I2C interface or a serial peripheral interface (SPI). The AFE also has a fully integrated LED driver with 8-bit current control. The device has high dynamic range transmit-and-receive circuitry offering a dynamic range of up to 100 dB that enables accurate heart-rate sensing. The AFE achieves extremely low current levels by operating an ultralow power (ULP) mode set by using the ENABLE_ULP register bit. Device Information(1) PART NUMBER PACKAGE AFE4410 BODY SIZE (NOM) DSBGA (30) 2.60 mm × 2.10 mm (1) For all available packages, see the package option addendum at the end of the datasheet. Simplified Block Diagram TX_SUP LED1 CONTROL1 RX_SUP INP1 LED3 LED4 TX_SUP IO_SUP TX1 1.8 V LDOs LED2 TX2 TX3 TX4 ALDO_1V8, DLDO_1V8 CF PD1 ILED INM1 Offset DAC INP2 PD2 INM2 TIA RF THR_DET_RDY Threshold Detection RF Noise reduction filter (x4) ADC Decimation FIFO I2C_SPI_SEL SPI/ I2C Interface SPI I2C RESETZ INP3 PD3 INM3 CF 4 MHz Oscillator ADC_RDY PROG_OUT1 Timing Engine 128 kHz Oscillator CLK 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. AFE4410 SBAS832 – MAY 2017 www.ti.com 4 Device and Documentation Support 4.1 Trademarks All trademarks are the property of their respective owners. 4.2 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: AFE4410 AFE4410 www.ti.com SBAS832 – MAY 2017 YZ0030-C01 PACKAGE OUTLINE DSBGA - 0.5 mm max height SC ALE 5.000 DIE SIZE BALL GRID ARRAY 2.13 2.07 B A BALL A1 CORNER 2.63 2.57 0.5 MAX C SEATING PLANE BALL TYP 0.19 0.13 0.05 C 1.6 TYP 0.85 F E 2 TYP D 0.4 TYP SYMM C B A 0.25 0.21 C A B 30X 0.015 1 2 3 4 5 PKG 0.4 TYP 4222550/B 12/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: AFE4410 3 AFE4410 SBAS832 – MAY 2017 www.ti.com YZ0030-C01 EXAMPLE BOARD LAYOUT DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.85) (0.4)TYP 30X ( 0.23) 1 3 2 4 5 A (0.4)TYP B C PKG SYMM D E F PKG LAND PATTERN EXAMPLE SCALE:30X ( 0.23) METAL 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN SOLDER MASK OPENING ( 0.23) SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222550/B 12/2015 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). 4 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: AFE4410 AFE4410 www.ti.com SBAS832 – MAY 2017 YZ0030-C01 EXAMPLE STENCIL DESIGN DSBGA - 0.5 mm max height DIE SIZE BALL GRID ARRAY (0.85) (0.4) TYP 30X ( 0.25) (R0.05) TYP 1 2 3 4 5 A (0.4) TYP B METAL TYP C PKG SYMM D E F PKG SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:35X 4222550/B 12/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: AFE4410 5 PACKAGE OPTION ADDENDUM www.ti.com 1-Jul-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) AFE4410YZR ACTIVE DSBGA YZ 30 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -20 to 70 AFE4410 AFE4410YZT ACTIVE DSBGA YZ 30 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -20 to 70 AFE4410 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Jul-2017 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jun-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) AFE4410YZR DSBGA YZ 30 3000 180.0 8.4 AFE4410YZT DSBGA YZ 30 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.16 2.66 0.6 4.0 8.0 Q1 2.16 2.66 0.6 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jun-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AFE4410YZR DSBGA YZ 30 3000 182.0 182.0 20.0 AFE4410YZT DSBGA YZ 30 250 182.0 182.0 20.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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