IXYS LKK47-06C5 Dual coolmosâ ¢ 1) power mosfet Datasheet

LKK 47-06C5
Advanced Technical Information
Dual CoolMOS™ 1) Power MOSFET
VDSS
= 600 V
ID25
= 47 A
Ω/MOSFET
RDS(on) max = 45 mΩ
Common Source Topology
DCB isoated package
4
D1
T1
2
G1
3
S
1
2
3
4
5
T2
1
G2
5
D2
Features
MOSFET T1/T2
Symbol
Conditions
VDSS
VD1D2
TVJ = 25°C
TVJ = 25°C
Maximum Ratings
VGS
600
±600
V
V
±20
V
47
32
A
A
1950
3
mJ
mJ
ID25
ID90
TC = 25°C
TC = 90°C
EAS
EAR
single pulse
repetitive
Symbol
Conditions
RDSon
VGS = 10 V; ID = 44 A
40
45 mΩ
RDSon
total between D1 and D2
VG1S = VG2S = 10 V; ID = 44 A
80
mΩ
VGSth
VDS = VGS; ID = 3 mA
IDSS
VDS = VDSS; VGS = 0 V; TVJ = 25°C
TVJ = 125°C
ID = 11 A; TC = 25°C
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min.
typ. max.
2.5
3
3.5
V
10
µA
µA
100
nA
50
IGSS
VGS = ±20 V; VDS = 0 V
Ciss
Coss
VGS = 0 V; VDS = 100 V
f = 1 MHz
Qg
Qgs
Qgd
VGS= 0 to10 V; VDS = 400 V; ID = 44 A
150
35
50
td(on)
tr
td(off)
tf
VGS= 10 V; VDS = 400 V;
ID = 44 A; RG = 3.3 Ω
30
20
100
10
ns
ns
ns
ns
RthJC
RthCH
with heatsink compound
0.25
0.45 K/W
K/W
IXYS reserves the right to change limits, test conditions and dimensions.
© 2009 IXYS All rights reserved
6800
320
• fast CoolMOS™ 1) power MOSFET
4th generation
- High blocking capability
- Lowest resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
• Enhanced total power density
Applications
• AC Switch
- power regulation of AC heating
- light dimming
• Power factor correction (PFC)
interleaved operation mode
• Push pull converter
1)
CoolMOS™ is a trademark of
Infineon Technologies AG.
pF
pF
190
nC
nC
nC
20090209b
1-4
Advanced Technical Information
LKK 47-06C5
Source-Drain Diode
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min.
typ. max.
IS
VGS = 0 V
VSD
IF = 44 A; VGS = 0 V
t rr
QRM
IRM
IF = 44 A; -di/dt = 100 A/µs; VR = 400 V
0.9
44
A
1.2
V
600
17
60
ns
µC
A
Component
Symbol
Conditions
Maximum Ratings
TVJ
Tstg
VISOL
IISOL < 1 mA; 50/60 Hz; t = 1 min
FC
Mounting force with clip
Symbol
Conditions
CP
coupling capacity between shorted
pins and mounting tab in the case
dS, dA
dS, dA
pin - pin
pin - backside metal
Weight
-55...+150
-55...+150
°C
°C
2500
V~
40 - 180
N
Characteristic Values
min.
typ. max.
50
tbd
tbd
pF
mm
mm
10
g
20090209b
© 2009 IXYS All rights reserved
2-4
LKK 47-06C5
Advanced Technical Information
ISOPLUS264
S
U
A
E
R1
D
Q1
T
R
Q
A2
6
1
3
4
5
L
L1
2
b
c
b2
b1
b3
A1
e
NOTE:
1.TAP 6 = ELECTRICALLY ISOLATED 2,500V FROM THEOTHERPINS.
2. ALL LEADSAREPb FREESOLDER DIPPE
D.
All curves for single MOSFET T1 or T2 only
250
TJ = 25°C
VGS = 20 V
140
10 V 8 V
8V
TJ = 150°C
7V
10 V
120
7V
200
6V
VGS = 20 V
100
5.5 V
150
I D [A]
I D [A]
80
6V
60
100
5V
5.5 V
40
4.5 V
5V
50
20
4.5 V
0
0
0
5
10
15
20
0
5
10
15
20
V DS [V]
V DS [V]
Fig. 1 Typ. output characteristics
Fig. 2 Typ. output characteristics
20090209b
© 2009 IXYS All rights reserved
3-4
LKK 47-06C5
Advanced Technical Information
0.16
320
0.12
ID = 44 A
VGS = 10 V
TJV = 150°C
5.5 V
VDS = 5 V
6V
6.5 V
7V
0.12
VDS > 2·RDS(on) max · ID
25 °C
280
0.1
240
0.08
0.08
I D [A]
R DS(on) [ ]
R DS(on) [ ]
200
20 V
0.06
98 %
160
150 °C
120
typ
TJ =
0.04
0.04
80
0.02
40
0
0
0
20
40
60
80
0
100
-60
-20
20
60
I D [A]
140
180
0
2
4
T j [°C]
Fig. 3 Typ. drain-source on-state
resistance
10
100
Fig. 4 Drain-source on-state
resistance
3
6
8
10
V GS [V]
Fig. 5 Typ. transfer characteristics
12
10
5
ID = 11 A pulsed
VGS = 0 V
f = 1 MHz
10
10
4
10
3
Ciss
VDS = 50 V
2
1 20 V
8
150 °C, 98%
25 °C
40 0V
I F [A]
V GS [ V]
TJ = 150 °C
C [ p F]
10
6
25 °C, 98%
10
1
Coss
10
2
10
1
10
0
4
Crss
2
10
0
0
0
0.5
1
1.5
2
0
50
100
0
150
Fig. 6 Forward characteristic
of reverse diode
100
200
Fig. 8 Typ. capacitances
700
10
ID = 11 A
150
V DS [V]
Fig. 7 Typ. gate charge
2000
0
ID = 0.25 mA
1500
660
0.5
1000
-1
Z th J C [ K / W ]
V BR(DSS) [ V]
10
E AS [ m J ]
50
Q gate [nC]
V SD [V]
620
0.2
D = tp/T
0.1
0.05
10
-2
0.02
500
580
0.01
0
540
20
60
100
140
T j [°C]
Fig. 9 Avalanche energy
180
10
-60
-20
20
60
100
140
T j [°C]
180
single pulse
-3
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
t p [s]
Fig. 10 Drain-source breakdown voltage
20090209b
© 2009 IXYS All rights reserved
4-4
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