*R & oHS AE C C OM AP P PR LI OV AN ED T Features ■ High power ratings ■ Surface mount packaging for automated assembly ■ Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications ■ Low profile ■ Compatible with Pb and Pb-free solder reflow profiles ■ RoHS compliant* and halogen free** ■ Agency recognition: ■ Standard 7555 mm (2920 mils) footprint MF-LSMF Series - PTC Resettable Fuses Electrical Characteristics Ihold V max. Volts I max. Amps MF-LSMF185/33X 33.0 MF-LSMF260X MF-LSMF300X Model*** MF-LSMF300/24X Itrip Resistance 40 Amperes at 23 °C Hold Trip 1.85 3.70 Ohms at 23 °C RMin. R1Max. 0.045 0.150 24.0 20 2.60 5.20 0.020 0.075 6.0 40 3.00 5.00 0.015 0.048 20 3.00 5.20 0.020 0.075 24.0 ® Amperes at 23 °C Seconds at 23 °C 8.0 2.50 Tripped Power Dissipation Watts at 23 °C Typ. 1.5 8.0 5.00 1.5 8.0 20.00 1.5 8.0 5.00 1.5 Max. Time To Trip ™ *** Features Multifuse Free Xpansion Design for MF-LSMF Series. Environmental Characteristics Operating Temperature......................................... -40 °C to +85 °C Maximum Device Surface Temperature in Tripped State .................................................... 125 °C Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change Condition A Test Procedures And Requirements For Model MF-LSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max Time to Trip ........................................................... At specified current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number .................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 TÜV Certificate Number ....................................... R 50256634 http://www.tuvdotcom.com/ Follow link to “Certificate Search”, enter 50256634 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Applications ■ Automotive electronics ■ Industrial controls ■ IEEE ports ■ Portable electronics MF-LSMF Series - PTC Resettable Fuses Product Dimensions A Model Min. 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) MF-LSMF185/33X MF-LSMF260X MF-LSMF300X MF-LSMF300/24X B Max. 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) Min. 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) C Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) Min. 0.75 (0.030) 0.75 (0.030) 0.35 (0.014) 0.75 (0.030) Max. 1.60 (0.063) 1.60 (0.063) 0.85 (0.033) 1.60 (0.063) Packaging: 3000 pcs. per reel. Top View D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) E Min. 0.25 (.010) 0.25 (.010) 0.25 (.010) 0.25 (.010) Max. 2.00 (.079) 2.00 (.079) 2.00 (.079) 2.00 (.079) DIMENSIONS: Bottom View Side View A Recommended Pad Layout Terminal material: Electroless Ni under immersion Au C 9 5.3 ± 0.10 (.209 ± .004) B X D 2.0 ± 0.05 (.079 ± .002) E MM (INCHES) 4.6 ± 0.10 (.181 ± .004) Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. Typical Time to Trip at 23 ˚C 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-LSMF260X Time to Trip (seconds) 10 MF-LSMF185/33X 1 MF-LSMF300/24X MF-LSMF300X 0.1 0.01 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 3312 - 2 mm SMD Trimming Potentiometer MF-LSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Model Ambient Operating Temperature 23 ˚C 40 ˚C 50 ˚C 1.85 1.54 1.39 -40 ˚C 2.80 -20 ˚C 2.47 0 ˚C 2.17 MF-LSMF260X 3.75 3.35 3.00 2.60 2.35 MF-LSMF300X 4.53 4.02 3.51 3.00 2.52 MF-LSMF300/24X 4.00 3.55 3.20 3.00 2.50 MF-LSMF185/33X Solder Reflow Recommendations 300 Preheating 70 ˚C 1.07 85 ˚C 0.85 2.15 2.05 1.80 1.30 2.26 1.99 1.75 1.34 2.25 2.15 1.85 1.50 How to Order Soldering MF - LSMF 185/33X - 2 Cooling ® Multifuse Product Designator Series LSMF = 7555 mm (2920 mils) Surface Mount Component Hold Current, Ihold 185-300 (1.85 Amps - 3.00 Amps) Higher Voltage Option /24 = 24 Volt Rated /33 = 33 Volt Rated X = Multifuse® freeXpansion™ Design MF-LSMF Series Packaging Packaged per EIA 481-1 -2 = Tape and Reel 250 Temperature (°C) 60 ˚C 1.22 200 150 100 50 0 10–20 160–220 120 Time (seconds) Notes: • MF-LSMF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. • If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. • Compatible with Pb and Pb-free solder reflow profiles. Typical Part Marking Represents total content. Layout may vary. PART IDENTIFICATION EXAMPLES: MF-LSMF185/33X = 9 MF-LSMF260X = E MF-LSMF300X = F MF-LSMF300/24X = J E X BI-WEEKLY DATE CODE: WEEKS 47-48 = X MF-LSMF SERIES, REV. B, 07/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. MF-LSMF Series Tape and Reel Specifications NOTE: Effective December 1, 2010 (product date code “X”), the cover tape was changed to the new 3M™ Universal Cover Tape (UCT). Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. MF-LSMF300X per EIA 481-2 16.0 ± 0.30 (0.630 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 5.74 ± 0.10 (0.226 ± 0.004) 8.02 ± 0.10 (0.316 ± 0.004) 12.1 (0.476) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 7.5 ± 0.05 (0.295 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 0.91 ± 0.10 (0.036 ± 0.004) 390 (15.35) 160 (6.30) MF-LSMF185/33X, MF-LSMF260X, MF-LSMF300/24X per EIA 481-2 16.0 ± 0.30 (0.630 ± 0.012) 4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 5.70 ± 0.10 (0.224 ± 0.004) 8.10 ± 0.10 (0.319 ± 0.004) 12.1 (0.476) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 7.5 ± 0.05 (0.295 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 1.70 ± 0.10 (0.067 ± 0.004) 390 (15.35) 160 (6.30) 331 (13.03) 50 (1.97) 16.4 + 2.0/-0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) 331 (13.03) 50 (1.97) 16.4 + 2.0/-0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) Reel Dimensions A max. N min. W1 W2 max. DIMENSIONS: MM (INCHES) P0 T D0 P2 E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 W1(MEASURED AT HUB) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.