TDK C1608C0G2E122J080AA Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : February 09, 2017
(GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G2E122J080AA
TDK item description C1608C0G2E122JT****
Applications
Commercial Grade
Feature
Mid Mid Voltage (100 to 630V)
Series
C1608 [EIA 0603]
Status
Production
Size
Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
Thickness(T)
0.80mm ±0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.70mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PA)
0.60mm to 0.80mm(Reflow Soldering)
0.80mm to 1.00mm(Flow Soldering)
Recommended Land Pattern (PB)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
Capacitance
1.2nF ±5%
Rated Voltage
250VDC
Temperature Characteristic
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : February 09, 2017
(GMT)
Multilayer Ceramic Chip Capacitors
C1608C0G2E122J080AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C1608C0G2E122J080AA
ESR
C1608C0G2E122J080AA
Capacitance
C1608C0G2E122J080AA
C1608C0G2E122J080AA
Temperature Characteristic
C1608C0G2E122J080AA(No Bias)
DC Bias Characteristic
C1608C0G2E122J080AA(DC Bias =
125V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
C1608C0G2E122J080AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : February 09, 2017
(GMT)
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