Surface Mountable PTC Resettable Fuse Specifications: Applications Product features : All high-density boards. : Small surface mountable, solid state, faster time to trip than standard SMD devices, lower resistance than standard SMD devices. : 6V to 60V. : -40°C to 85°C. Maximum voltage Temperature range UL : E-345437 Electrical Characteristics (23°C) Hold Trip Current Current Rated Voltage Maximum Typical Current Power Maximum Time to Trip Resistance Current Time RMin R1Max Part Number IH, A IT, A VMax, V dc IMax, A Pd, W Amperes Seconds Ω Ω 0.05 0.15 60 10 0.60 0.25 3.00 3.600 50.000 MC36203 0.10 0.25 60 10 0.60 0.50 1.50 1.600 15.000 MC36205 0.20 0.40 30 10 0.60 8.00 0.02 0.800 5.000 MC36208 0.35 0.70 16 40 0.60 8.00 0.20 0.320 1.300 MC36212 0.50 1.00 16 40 0.60 8.00 0.10 0.250 0.900 MC36214 0.75 1.50 8 40 0.60 8.00 0.10 0.130 0.400 MC36217 1.10 2.20 6 100 0.80 8.00 0.30 0.060 0.210 MC36223 1.50 3.00 6 100 0.80 8.00 0.50 0.040 0.110 MC36230 1.75 4.00 6 100 0.8 8.00 0.60 0.020 0.080 MC36236 2.00 4.00 6 100 0.8 8.00 1.00 0.015 0.070 MC36239 IH IT VMAX IMAX Pd = Hold current-maximum current at which the device will not trip at 23°C still air. = Trip current-minimum current at which the device will always trip at 23°C still air. = Maximum voltage device can withstand without damage at it rated current (I maximum). = Maximum fault current device can withstand without damage at rated voltage (V maximum). = Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23°C still air environment. = Minimum device resistance at 23°C prior to tripping. RMIN R1MAX = Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of 260°C for 20 seconds. Termination pad characteristics Termination pad materials: Pure tin. http://www.farnell.com http://www.newark.com http://www.cpc.co.uk Page <1> 17/05/11 V1.1 Surface Mountable PTC Resettable Fuse FSMD Production Dimensions (Millimetre) Dimensions Table A B C D E Figure Part Number Minimum Maximum Minimum Maximum Minimum Maximum Minimum Maximum Minimum Maximum 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 1 MC36203 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 1 MC36205 3.00 3.43 2.35 2.80 0.40 0.85 0.25 0.75 1 MC36208 3.00 3.43 2.35 2.80 0.40 0.80 0.25 0.75 1 MC36212 3.00 3.43 2.35 2.80 0.30 0.75 0.25 0.75 1 MC36214 3.00 3.43 2.35 2.80 0.30 0.70 0.25 0.75 1 MC36217 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.45 2 MC36223 3.00 3.43 2.35 2.80 0.50 0.90 0.25 0.75 0.10 0.45 2 MC36230 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 2 MC36236 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 2 MC36239 Dimensions : Millimetres Thermal Derating Curve Percent of Rated Hold and Trip Current Thermal Derating Curve Ambient Temperature (°C) http://www.farnell.com http://www.newark.com http://www.cpc.co.uk Page <2> 17/05/11 V1.1 surface Mountable PTC Resettable Fuse A = MC36203 B = MC36205 C = MC36208 D = MC36212 E = MC36214 F = MC36217 G = MC36223 H = MC36230 I = MC36236 J = MC36239 Time-to-trip (S) Typical Time-To-Trip at 23°C Fault current (A) Material Specification Terminal pad material Soldering characteristics : Pure tin. : Meets EIA specification RS 186-9E, ANSI/J-std-002 category 3. Pad Layouts Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each 1210 device. Pad Dimensions Device A Nominal B Nominal C Nominal All 1210 Series 2.00 1.00 2.80 Dimensions : Millimetres http://www.farnell.com http://www.newark.com http://www.cpc.co.uk Page <3> 17/05/11 V1.1 Surface Mountable PTC Resettable Fuse Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Ts maximum to Tp) 3°C/seconds maximum Preheat: Temperature Minimum (Ts minimum) Temperature Maximum (Ts maximum) Time (ts minimum to ts maximum) 150°C 200°C 60 -180 seconds Time maintained above: Temperature(TL) Time (tL) 217°C 60-150 seconds Peak/Classification Temperature(Tp): 260°C Time within 5°C of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate: 6°C/seconds maximum Time 25°C to Peak Temperature: 8 minutes maximum Note: 1All temperatures refer to of the package, measured on the package body surface. Solder reflow Due to “Lead Free” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Environment : < 30°C/60% RH. Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Temperature Reflow Profile Time http://www.farnell.com http://www.newark.com http://www.cpc.co.uk Page <4> 17/05/11 V1.1 Surface Mountable PTC Resettable Fuse Part Number Table Description Part Number Surface Mountable PTC Resettable Fuse MC36203 Surface Mountable PTC Resettable Fuse MC36205 Surface Mountable PTC Resettable Fuse MC36208 Surface Mountable PTC Resettable Fuse MC36212 Surface Mountable PTC Resettable Fuse MC36214 Surface Mountable PTC Resettable Fuse MC36217 Surface Mountable PTC Resettable Fuse MC36223 Surface Mountable PTC Resettable Fuse MC36230 Surface Mountable PTC Resettable Fuse MC36236 Surface Mountable PTC Resettable Fuse MC36239 Disclaimer This data sheet and its contents (the "Information") belong to the Premier Farnell Group (the "Group") or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. SPC Multicomp is the registered trademark of the Group. © Premier Farnell plc 2011. http://www.farnell.com http://www.newark.com http://www.cpc.co.uk Page <5> 17/05/11 V1.1