Material Content Data Sheet Sales Product Name IPB180P04P4L-02 MA# MA000762926 Package PG-TO263-7-3 Issued 29. August 2013 Weight* 1525.33 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 6.489 0.43 0.803 0.05 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.43 4254 4254 526 0.241 0.02 801.714 52.54 52.61 525601 158 526285 13.067 0.86 0.86 8566 8566 8.692 0.57 5698 95.610 6.27 475.155 31.15 37.99 311509 62682 379889 12.317 0.81 0.81 8075 8075 0.269 0.02 0.001 0.00 0.116 0.01 0.092 0.01 4.416 0.29 0.032 0.00 0.106 0.01 106.210 6.96 177 0.02 0 61 0.31 2895 2. 3. 70 6.97 69631 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3032 21 Important Remarks: 1. 177 76 69722 1000000