Datasheet Voltage Detector (Reset) IC Series for Automotive Application Free Time Delay Setting CMOS Voltage Detector (Reset) IC BD52xx-2C Series and BD53xx-2C Series Key Specifications General Description ROHM's BD52xx-2C and BD53xx-2C series are highly accurate, low current consumption Voltage Detector ICs with a capacitor controlled time delay. The lineup includes N-channel open drain output (BD52xx-2C) and CMOS output (BD53xx-2C) so that the users can select depending on the application. The devices are available for specific detection voltage ranging from 0.9V to 5.0V with 0.1V increment. The time delay has ±50% accuracy in the overall operating temperature range of -40°C to 125°C. Detection Voltage: 0.9V to 5.0V (Typ.) 0.1V step Ultra-Low Current Consumption: 0.27µA (Typ.) Time Delay Accuracy: ±50% (-40°C to +125°C, ) (CT pin capacitor ≥ 1nF) Special Characteristics Detection Voltage Accuracy: ±3%±12mV (VDET=0.9V to 1.6V) ±3% (VDET=1.7V to 5.0V) Special Features (Note1) Package AEC-Q100 Qualified Delay Time Setting controlled by external capacitor Two output types (Nch open drain and CMOS output) Ultra-low Current Consumption Very small, lightweight and thin package Package SSOP5 is similar to SOT-23-5 (JEDEC) (Note1: Grade 1) SSOP5: W(typ) x D(typ) x H(max) 2.90mm x 2.80mm x 1.25mm Application All automotive devices that requires voltage detection Application Circuit VDD1 VDD2 VDD1 RL Microcontroller BD52xx-2C Microcontroller BD53xx-2C RST CCT RST CCT GND GND Figure 1. Open Drain Output Type BD52xx-2C Series Pin Configuration CT SSOP5 TOP VIEW Figure 2. CMOS Output Type BD53xx-2C Series N.C. Lot No. Marking VOUT VDD GND Pin Description SSOP5 PIN No. 1 2 3 4 5 Symbol VOUT VDD GND N.C. CT Function Output pin Power supply voltage GND No connection pin Capacitor connection pin for output delay time setting ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 N.C. pin is electrically open and can be connected to either VDD or GND. ○This product has no designed protection against radioactive rays 1/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Ordering Information B D x x x x x - 2 C T R Part Output Type Detection Voltage Package Product Rank Packaging and forming Number 52 : Open Drain 09 : 0.9V G : SSOP5 C : for Automotive specification 53 : CMOS 0.1V step TR : Embossed tape and reel 50 : 5.0V Lineup Output Type Detection Voltage Marking 5.0V 1Z 4.9V 1Y 4.8V 1X 4.7V 1W 4.6V 1V 4.5V 1U 4.4V 1T 4.3V 1S 4.2V 1R 4.1V 1Q 4.0V 1P 3.9V 1N 3.8V 08 3.7V 07 3.6V 06 3.5V 05 3.4V 04 3.3V 03 3.2V 02 3.1V 01 3.0V 5G 2.9V Z9 2.8V Z8 2.7V Z7 2.6V XS 2.5V XR 2.4V 24 2.3V 23 2.2V 22 2.1V 21 2.0V 20 1.9V 19 1.8V 18 1.7V 17 1.6V 16 1.5V 15 1.4V 14 1.3V 13 1.2V 12 1.1V 11 1.0V 10 0.9V 09 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Open Drain Part Number BD5250 BD5249 BD5248 BD5247 BD5246 BD5245 BD5244 BD5243 BD5242 BD5241 BD5240 BD5239 BD5238 BD5237 BD5236 BD5235 BD5234 BD5233 BD5232 BD5231 BD5230 BD5229 BD5228 BD5227 BD5226 BD5225 BD5224 BD5223 BD5222 BD5221 BD5220 BD5219 BD5218 BD5217 BD5216 BD5215 BD5214 BD5213 BD5212 BD5211 BD5210 BD5209 2/20 CMOS Marking 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 5F 5E Part Number BD5350 BD5349 BD5348 BD5347 BD5346 BD5345 BD5344 BD5343 BD5342 BD5341 BD5340 BD5339 BD5338 BD5337 BD5336 BD5335 BD5334 BD5333 BD5332 BD5331 BD5330 BD5329 BD5328 BD5327 BD5326 BD5325 BD5324 BD5323 BD5322 BD5321 BD5320 BD5319 BD5318 BD5317 BD5316 BD5315 BD5314 BD5313 BD5312 BD5311 BD5310 BD5309 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Absolute Maximum Ratings (Ta=-40°C to +125°C) Parameter Symbol VDD－GND Limit -0.3 to +7 GND-0.3 to +7 GND-0.3 to VDD+0.3 Unit V 70 -40 to +125 mA °C Junction Temperature Range Io Topr Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C Power Supply Voltage Output Voltage Nch Open Drain Output VOUT CMOS Output Output Current Operating Temperature Range V Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s (Note 3) (Note 4) 2s2p Unit SSOP5 Junction to Ambient Junction to Top Characterization Parameter (Note 2) θJA 376.5 185.4 °C/W ΨJT 40 30 °C/W (Note 1)Based on JESD51-2A(Still-Air). (Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3)Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mm Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4)Using a PCB board based on JESD51-7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mm Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Electrical Characteristics (Unless otherwise specified Ta=-40°C to +125°C, VDD=0.8V to 6V) Parameter Symbol Condition VDET=0.9V to 1.6V, VDD=HL, RL=100kΩ Detection Voltage VDET VDET=1.7V to 5.0V, VDD=HL, RL=100kΩ Hysteresis Voltage ∆VDET VDD=LHL, RL=100kΩ Circuit Current when ON Circuit Current when OFF Operating Voltage Range IDD1 IDD2 VOPL “Low” Output Voltage (Nch) VOL “High” Output Voltage (Pch) VOH Output Leak Current (BD52xx) ILEAK Delay Time (L → H) tPLH VDD= VDET-0.2V VDD= VDET+0.5V VOL≤0.4V, Ta=-40°C to 125°C, RL=100kΩ VDD=0.8V, ISINK = 0.17mA, VDET=0.9V to 1.6V VDD=1.2V, ISINK = 1.0mA, VDET=1.7V to 5.0V VDD=2.4V, ISINK = 2.0mA, VDET=2.7V to 5.0V VDD=4.8V, ISOURCE=2.0mA, VDET(0.9V to 4.2V) VDD=6.0V, ISOURCE=2.5mA, VDET(0.9V to 5.0V) VDD= VDS=6V VOUT＝GND→50%, CT=0.01μF Note 1 Note 2 Min VDET(T) ×0.97 -0.012 VDET (T) ×0.97 VDET ×0.03 0.80 VDD-0.4 Limit Typ VDET ×0.05 0.23 0.27 - Max VDET(T) ×1.03 +0.012 VDET(T) ×1.03 VDET ×0.07 1.50 1.60 0.4 0.4 0.4 - - VDET(T) VDET(T) Unit V V µA µA V V V VDD-0.4 - - - - 1.0 µA 27.7 55.5 83.2 ms VDET(T) : Standard Detection Voltage(0.9V to 5.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. Note 1 tPLH : VDD=(VDET(T)–0.1V) → (VDET(T)+0.5V) for VDET=0.9V to 1.2V tPLH : VDD=(VDET(T)–0.5V) → (VDET(T)+0.5V) for VDET=1.3V to 5.0V Note 2 CT delay capacitor range: open to 4.7µF. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Block Diagram VDD VOUT Delay Delay Circuit Vref *1 T *1 *1 GND *1: Parasitic Diode CT Figure 3. BD52xx-2C Series VDD *1 Delay Delay Circuit Circuit Vref VOUT *1 *1 *1 GND *1: Parasitic Diode CT Figure 4. BD53xx-2C Series www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Typical Performance Curves 0.6 1.0 BD5209G-2C 0.9 BD5209G-2C 0.5 0.7 Circuit Current : IDD(µA) Circuit Current : IDD(µA) 0.8 Ta=125°C Ta=105°C 0.6 Ta=25°C 0.5 0.4 0.3 0.2 VDD=VDET+0.5V 0.3 0.2 VDD=VDET-0.2V 0.1 Ta=-40°C 0.1 0.4 0.0 0.0 0 1 2 3 4 5 -40 -25 -10 6 20 35 50 65 80 95 110 125 Temperature : Ta (°C) Supply Voltage : VDD (V) Figure 6. Circuit Current vs. Temp Figure 5. Circuit Current vs. VDD 1.0 0.6 0.9 BD5230G-2C BD5230G-2C 0.5 Circuit Current : IDD(µA) 0.8 Circuit Current : IDD(µA) 5 0.7 Ta=125°C 0.6 Ta=105°C 0.5 Ta=25°C 0.4 0.3 0.2 0.4 VDD=VDET+0.5V 0.3 0.2 VDD=VDET-0.2V 0.1 Ta=-40°C 0.1 0.0 0.0 0 1 2 3 4 5 -40 -25 -10 6 20 35 50 65 80 95 110 125 Temperature : Ta (°C) Supply Voltage : VDD (V) Figure 8. Circuit Current vs. Temp Figure 7. Circuit Current vs. VDD www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 6/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Typical Performance Curves - continued 0.6 1.0 0.9 BD5250G-2C BD5250G-2C 0.5 Circuit Current : IDD(µA) Circuit Current : IDD(µA) 0.8 0.7 0.6 Ta=125°C 0.5 Ta=25°C Ta=105°C 0.4 0.3 0.2 0.3 VDD=VDET-0.2V 0.2 0.1 Ta=-40°C 0.1 VDD=VDET+0.5V 0.4 0.0 0.0 0 1 2 3 4 5 -40 -25 -10 6 20 35 50 65 80 95 110 125 Temperature : Ta (°C) Supply Voltage : VDD (V) Figure 10. Circuit Current vs. Temp Figure 9. Circuit Current vs. VDD 6.0 1.3 BD5209G-2C BD5209G-2C 1.2 Detection Voltage : VDET(V) 5.0 Output Voltage : VOUT(V) 5 4.0 3.0 2.0 1.0 1.1 VDET + ΔVDET 1.0 0.9 VDET 0.8 0.7 0.0 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -40 -25 -10 5 20 35 50 65 80 95 110 125 Supply Voltage : VDD (V) Temperature : Ta (°C) Figure 11. Detection Voltage Figure 12. Detection Voltage and Release Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Typical Performance Curves - continued 6.0 3.6 3.5 BD5230G-2C Detection Voltage : VDET(V) Output Voltage : VOUT(V) 5.0 4.0 3.0 2.0 1.0 BD5230G-2C 3.4 VDET + ΔVDET 3.3 3.2 3.1 3.0 2.9 VDET 2.8 2.7 0.0 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 -40 -25 -10 20 35 50 65 80 95 110 125 Temperature : Ta (°C) Figure 13. Detection Voltage Figure 14. Detection Voltage and Release Voltage 5.6 6.0 5.5 BD5250G-2C Detection Voltage : VDET(V) 5.0 Output Voltage : VOUT(V) 5 Supply Voltage : VDD (V) 4.0 3.0 2.0 1.0 BC BD5250G-2C VDET + ΔVDET 5.4 5.3 5.2 5.1 5.0 VDET 4.9 4.8 4.7 0.0 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 -40 -25 -10 5 20 35 50 65 80 95 110 125 Supply Voltage : VDD (V) Temperature : Ta (°C) Figure 15. Detection Voltage Figure 16. Detection Voltage and Release Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Typical Performance Curves - continued Pull-up to 5V Pull-up resistance: 100kΩ Pull-up to VDD Pull-up resistance: 100kΩ 6.0 4.0 BD5230G-2C BD5230G-2C 3.5 Output Voltage : VOUT(V) Output Voltage : VOUT(V) 5.0 Ta=125°C 4.0 Ta=105°C Ta=25°C 3.0 Ta=-40°C 2.0 1.0 3.0 2.5 2.0 1.5 Ta=125°C 1.0 Ta=105°C Ta=25°C 0.5 Ta=-40°C 0.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 0.5 1.0 2.0 2.5 Supply Voltage : VDD (V) Supply Voltage : VDD (V) Figure 17. I/O Characteristics Figure 18. I/O Characteristics 3.0 3.5 Pull-up to VDD Pull-up resistance: 100kΩ Pull-up to 5V Pull-up resistance: 100kΩ 1.0 Minimum Operating Voltage: VOPL(V) 1.0 Minimum Operating Voltage: VOPL(V) 1.5 0.8 0.6 0.4 0.2 0.8 0.6 0.4 0.2 0.0 0.0 -40 -25 -10 5 -40 -25 -10 20 35 50 65 80 95 110 125 5 20 35 50 65 80 95 110 125 Temperature : Ta (°C) Temperature : Ta (°C) Figure 19. Operating Limit Voltage Figure 20. Operating Limit Voltage www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Typical Performance Curves - continued 70 70 BD5309G-2C BD5250G-2C VDD = 2V 60 "Low" Output Current : IOL(mA) "High" Output Current : IOH(mA) 60 VDD = 4V 50 40 30 VDD = 3V 20 VDD = 2V 10 50 40 30 20 VDD = 1.2V 10 VDD = 0.85V VDD = 1.2V 0 0 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 1.5 2.0 2.5 Drain-Source Voltage : VDS (V) Drain-Source Voltage : VDS (V) Figure 21. “High” Output Current Figure 22. “Low” Output Current 35 3.0 70 BD5309G-2C 30 25 Ta=25°C Ta=105°C 20 BD5220G-2C 60 Ta=-40°C "Low" Output Current : IOL(mA) "High" Output Current : IOH(mA) 0.5 Ta=125°C 15 10 5 Ta=-40°C 50 Ta=25°C 40 Ta=105°C 30 Ta=125°C 20 10 0 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 0.5 1.0 1.5 2.0 2.5 Supply Voltage : VDD (V) Supply Voltage : VDD (V) Figure 23. “High” Output Current (VDS=0.5V) Figure 24. “Low” Output Current (VDS=0.5V) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/20 3.0 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Typical Performance Curves - continued 70 80 60 CCT=10nF Delay Time (H~L) : tPHL(µs) Delay Time (L~H) : tPLH(ms) 70 60 50 40 CCT=4.7nF 30 20 50 40 30 20 10 10 0 0 -40 -25 -10 5 -40 -25 -10 20 35 50 65 80 95 110 125 5 20 35 50 65 80 95 110 125 Temperature : Ta (°C) Temperature : Ta (°C) Figure 26. Output Delay Time (H~L) Figure 25. Output Delay Time (L~H) 100000 70 Ta=-40°C Delay Time (H~L) : tPHL(µs) Delay Time (L~H) : tPLH(ms) 60 Ta=25°C 10000 Ta=105°C 1000 Ta=125°C 100 10 1 0.1 0.0001 50 40 30 20 10 0.001 0.01 0.1 1 10 CT Pin Capacitance : CCT (µF) 0.001 0.01 0.1 1 10 CT Pin Capacitance : CCT (µF) Figure 27. Output Delay Time (L~H) www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 0.0001 Figure 28. Output Delay Time (H~L) 11/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Application Information 1. Explanation of Operation For both the open drain type (Figure 29) and the CMOS output type (Figure 30), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pin reaches the applicable threshold voltage, the VOUT pin voltage switches from either “High” to “Low” or from “Low” to “High”. BD52xx-2C series and BD53xx-2C series have delay time function which set tPLH (output “Low” to ”High”) using an external capacitor connected in CT pin (CCT). Because the BD52xx-2C series uses an open drain output type, it is necessary to connect a pull up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VOUT Vref Delay Circuit Delay Circuit Vref GND GND CT CT Figure 30. (BD53xx-2C type internal block diagram) Figure 29. (BD52xx-2C type internal block diagram) 2. VOUT Setting of Detector Delay Time Delay time L~H (tPLH) is the time when VOUT rises to 1/2 of VDD after VDD rises up and beyond the release voltage (VDET+∆VDET). The delay time (tPLH) at the rise of VDD is determined by delay coefficient, CT capacitor and delay time when CT pin is open (tCTO) and calculated from the following formula. When CT capacitor ≥ 1nF, tCTO has less effect and tPLH computation is shown on Example No.2. The result has ±50% tolerance within the operating temperature range of -40°C to +125°C Formula: (Ta=25°C) 𝑡𝑃𝐿𝐻 = 𝐶𝐶𝑇 × 𝐷𝑒𝑙𝑎𝑦 𝐶𝑜𝑒𝑓𝑓𝑖𝑐𝑖𝑒𝑛𝑡 + 𝑡𝐶𝑇𝑂 [s] where: CCT is the CT pin external capacitor 6 Delay Coefficient is equal to 5.55 x 10 Note1 tCTO is the delay time when CT=open Temperature Ta = -40°C to +125°C Delay Time (tCTO) Min 15µs Typ 50µs Max 150µs Note1: tCTO is design guarantee only; outgoing inspection is not done on all products. Example No.1: CT capacitor = 100pF 𝑡𝑃𝐿𝐻_𝑚𝑖𝑛 = (100 × 10−12 × 5.55 × 106 ) × 0.5 + 15 × 10−6 = 292µ𝑠 𝑡𝑃𝐿𝐻_𝑡𝑦𝑝 = (100 × 10−12 × 5.55 × 106 ) × 1.0 + 50 × 10−6 = 605µ𝑠 𝑡𝑃𝐿𝐻_𝑚𝑎𝑥 = (100 × 10−12 × 5.55 × 106 ) × 1.5 + 150 × 10−6 = 983µ𝑠 Example No.2: CT capacitor = 1nF 𝑡𝑃𝐿𝐻_𝑡𝑦𝑝 = 1 × 10−9 × 5.55 × 106 = 5.55𝑚𝑠 www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series 3. BD53xx-2C Series Timing Waveform The following shows the relationship between the input voltage VDD and the output voltage VOUT when the power supply voltage VDD is sweep up and sweep down. VDD RL VDD Delay Circuit Vref VOUT GND CT CCT Figure 31. BD52xx-2C Set-up VDD ⑤ VDET+ΔVDET Hysteresis Voltage (ΔVDET) VDET VOPL: <0.8V t ① ② ③ ④ ⑤ ② ③ ④ ⑤ ② ① VOUT t undefined tPLH tPHL tPLH undefined tPHL Figure 32. Timing Diagram ① When the power supply turns on, the Output Voltage (VOUT) is undefined until VDD overcomes the Operating Voltage Limit (VOPL). ② VOUT will turn to “Low” as VDD increases above VOPL but less than the Release Voltage (VDET+ΔVDET), ③ When VDD exceeds the Release Voltage (VDET+ΔVDET), delay time (tPLH) set by capacitor at CT pin (CCT) will happen then VOUT will switch from “Low” to “High”. ④ VOUT will remain “High” until VDD do not fall below the Detection Voltage (VDET). ⑤ When VDD drops below VDET, VOUT will switch from “High” to “Low” with a delay of tPHL. *The potential difference between the detection voltage and the release voltage is known as the Hysteresis Voltage width (∆VDET). The system is designed such that the output will not toggle with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series 4. BD53xx-2C Series Circuit Applications (1) Examples of common application circuits VDD1 VDD2 RL Application examples of BD52xx-2C series (Open-drain output type) and BD53xx-2C series (CMOS output type) are shown below. Microcontroller BD52xx-2C RST CCT GND Figure 33. Open Drain Output Type CASE2: Power supply of the microcontroller (VDD1) is the same as the power supply of the reset detection (VDD1). Use a CMOS output type (BD53xx-2C) device or an open-drain output type (BD52xx-2C) device with a pull-up resistor between the output and VDD1. VDD1 Microcontroller BD53xx-2C CASE1: Power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use an open drain output type (BD52xx-2C) device with a load resistance RL attached as shown in Figure33. RST CCT GND Figure 34. CMOS Output type (2) The following is an example of circuit application in which an OR connection between two types of detection voltage resets the microcontroller. VDD1 VDD2 VDD3 RL Microcontroller BD52xx-2C NO.1 CCT BD52xx-2C NO.2 RST CCT GND Figure 35. OR Circuit Connection Application To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain output type (BD52xx-2C series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller (VDD3) as shown in Figure 35. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Circuit Applications (continued) (3) Examples of the power supply with resistor dividers In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an inrush current will flow into the circuit when the output level switches from “Low” to “High” or vice versa. Inrush current is a sudden surge of current that flows from the power supply (V DD) to ground (GND) as the output logic changes its state. This current flow may cause malfunction in the systems operation such as output oscillations, etc. V1 (Note1) IDD RA (RA≤100kohm) I1 VDD Inrush Current BD52xx-2C BD53xx-2C (Note1) RB CVDD (CVDD≥0.1μF) VOUT GND 0 Figure 36. Resistor Divider Connection Application VDD VDET Figure 37. VDD Voltage vs. Current Consumption A voltage drop [Inrush current (I1)] × [input resistor (RA)] is caused by the inrush current, and causes the input voltage to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the inrush current stops flowing through output “Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which again causes the inrush current to flow and the voltage to drop. This operation repeats and will result to oscillation. In case resistor divider will not use and only RA will use, same response will happen. Note1: The circuit connection mentioned above does not guarantee successful operation. Please perform thorough evaluation using the actual application and set countermeasures 100 100.0 BD5309G-2C 90 BD5309G-2C Inrush Current : IDD (µA) Inrush Current : IDD (µA) 80 10.0 1.0 70 60 50 40 30 20 10 0.1 0 1.0 2.0 3.0 4.0 5.0 6.0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Supply Voltage : VDD (V) Temperature : Ta (°C) Figure 38. IDD Inrush Current Ta=25°C Figure 39. IDD Inrush Current VDD=6V www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Circuit Applications (continued) Depending on the application set-up, there are times that VDD voltage is always below the Release Voltage (VDET+ΔVDET) because of the effect of inrush current as shown in Figure 40. Voltage V1 VDET+ΔVDET VDD ΔVDROP = Inrush Current x RA Hysteresis Voltage (ΔVDET) VDET t Figure 40. VDD Drop Caused by Inrush Current www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Line Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Operational Notes – continued 12. Regarding Input Pins of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 15. Bypass Capacitor for Noise Rejection To help reject noise, put more than 0.1µF capacitor between VDD pin and GND. Be careful when using extremely big capacitor as transient response will be affected. 16. The VDD line impedance might cause oscillation because of the detection current. 17. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 18. External Parameters The recommended value of CT Capacitor is from open to 4.7µF and pull-up resistance value is 50kΩ to 1MΩ. There are many factors (board layout, etc) that can affect characteristics. Operating beyond the recommended values does not guarantee correct operation. Please verify and confirm using practical applications. 19. When VDD falls below the minimum operating voltage, output will be open. When output is connected to pull-up voltage, output will be equivalent to pull-up voltage. 20. Power-on Reset Operation Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual operation. 21. CT Pin Discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 22. This IC has extremely high impedance pins. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed between the CT and GND pin, it is recommended to insert 1MΩ resistor between CT and VDD pin. However, delay time will change when resistor is connected externally to CT pin so verify the delay time requirements when using this set-up. Also, when similar leakage is assumed between VOUT and GND pin, consider to set the value of pull up resistor lower than 1/10 of the impedance of assumed leakage route. www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series External Dimension Diagram, Packaging and Forming Specification Package Name www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP5 19/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 BD52xx-2C Series BD53xx-2C Series Revision History Date Revision 2016/04/25 001 Changes New www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/20 TSZ02201-0R7R0G300200-1-2 25.Apr.2016 Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD5209G-2C - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD5209G-2C SSOP5 3000 3000 Taping inquiry Yes