Diodes DMN60H4D5SK3-13 N-channel enhancement mode mosfet Datasheet

DMN60H4D5SK3
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features
BVDSS
RDS(ON)
ID
TC = +25°C

Low Input Capacitance

High BVDSS Rating for Power Application
600V
4.5Ω@VGS = 10V
2.5A

Low Input/Output Leakage

Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)
Description
This new generation MOSFET features low on-resistance and fast
switching, making it ideal for high efficiency power management
applications.
Applications
Mechanical Data

Case: TO252 (DPAK) (Type TH)

Case Material: Molded Plastic, UL Flammability Classification
Rating 94V-0

Terminals: Matte Tin Finish Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208

Motor Control

Backlighting

Terminal Connections: See Diagram Below

DC-DC Converters

Weight: TO252 (DPAK) (Type TH) – 0.33 grams (Approximate)

Power Management Functions
TO252 (DPAK) (Type TH)
D
D
G
Equivalent Circuit
Top View
S
Top View
Pin Out Configuration
Ordering Information (Note 4)
Part Number
DMN60H4D5SK3-13
Notes:
Case
TO252 (DPAK) (Type TH)
Packaging
2,500/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
60H4D5S
YYWW
DMN60H4D5SK3
Document number: DS39430 Rev. 2 - 2
= Manufacturer’s Marking
60H4D5S = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Last Two Digits of Year (ex: 17 = 2017)
WW or WW = Week Code (01 to 53)
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DMN60H4D5SK3
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5)
TC = +25°C
Steady
State
VGS = 10V
TC = +100°C
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current (Note 6)
L = 60mH
Avalanche Energy (Note 6)
L = 60mH
Peak Diode Recovery dv/dt
7
Symbol
VDSS
VGSS
Value
600
±30
2.5
1.6
2.6
1.0
33
5
ID
IDM
IAS
EAS
dv/dt
Unit
V
V
A
A
A
mJ
V/ns
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Symbol
TC = +25°C
TC = +100°C
TC = +25°C
Unit
PD
Max
41
16
RθJC
TJ, TSTG
3.0
-55 to +150
°C/W
°C
W
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
600
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 250µA
VDS = 600V, VGS = 0V
VGS = ±30V, VDS = 0V
VGS(TH)
RDS(ON)
VSD
2.0
—
—
—
—
—
4.0
4.5
1.5
V
Ω
V
VDS = VGS, ID = 250μA
VGS = 10V, ID = 1.0A
VGS = 0V, IS = 2.0A
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
273.5
30.8
4.2
3.5
8.2
1.1
3.7
9.8
10.5
33.4
13.2
172
682
—
—
—
—
—
—
—
—
—
—
—
—
—
pF
VDS = 25V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VGS = 10V, VDS = 480V,
ID = 2A
ns
ns
ns
ns
ns
μC
Test Condition
VGS = 10V, VDD = 300V,
RG = 25Ω, ID = 2A
dI/dt = 100A/µs, VGS = 0V,
IF = 2A
5. Device mounted on an infinite heatsink.
6. Guaranteed by design. Not subject to production testing.
7. Short duration pulse test used to minimize self-heating effect.
DMN60H4D5SK3
Document number: DS39430 Rev. 2 - 2
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DMN60H4D5SK3
3.0
1
VGS = 6.0V
2.5
0.8
VGS = 8.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
VDS = 10V
VGS = 5.0V
VGS = 7.0V
VGS = 10V
2.0
VGS = 4.5V
1.5
1.0
VGS = 4.0V
0.6
0.4
85oC
0.2
0.5
150oC
125oC
VGS = 3.5V
0.0
2
4
6
8
10
12
14
16
18
20
0
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
4
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
-55oC
0
0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
VGS = 10V
3.2
3.1
3
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
1
2
3
4
5
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
6
10
9
ID = 1.0A
8
7
6
5
4
3
0
2
5
10
15
20
25
30
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current
and Gate Voltage
15
3
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
25oC
VGS = 10V
150oC
12
125oC
9
6
85oC
3
25oC
-55oC
0
2.5
VGS = 10V, ID = 1A
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain
Current and Temperature
DMN60H4D5SK3
Document number: DS39430 Rev. 2 - 2
3
-50
0
25
50
75
100 125 150
TJ, JUNCTION TEMPERATURE (℃)
Figure 6. On-Resistance Variation with Temperature
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4
VGS(TH), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
DMN60H4D5SK3
9
8
7
6
5
4
3
VGS = 10V, ID = 1A
2
1
0
3.5
ID = 1mA
3
2.5
ID = 250µA
2
1.5
1
-50
-25
0
25
50
75 100 125
TJ, JUNCTION TEMPERATURE (℃)
150
-50
Figure 7. On-Resistance Variation with
Temperature
150
Figure 8. Gate Threshold Variation vs. Junction
Temperature
1000
5
CT, JUNCTION CAPACITANCE (pF)
VGS = 0V
IS, SOURCE CURRENT (A)
-25
0
25
50
75
100 125
TJ, JUNCTION TEMPERATURE (℃)
4
3
2
TA =
1
TA =
TA =
150oC
85oC
TA = 25oC
125oC
TA = -55oC
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
f = 1MHz
100
Coss
10
Crss
1
0
0
Ciss
0
1.5
10
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
40
10
RDS(ON)
Limited
PW = 10µs
PW = 1µs
ID, DRAIN CURRENT (A)
8
VGS (V)
6
4
VDS = 480V, ID = 2A
1
PW = 1s
PW = 100ms
PW = 10ms
0.1
TJ(Max) = 150℃
PW = 1ms
TC = 25℃
PW = 100µs
Single Pulse
DUT on Infinite Heatsink
VGS =10V
2
0
0.01
0
2
4
6
8
10
Qg (nC)
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. Gate Charge
Figure 12. SOA, Safe Operation Area
DMN60H4D5SK3
Document number: DS39430 Rev. 2 - 2
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DMN60H4D5SK3
1
D=0.9
D=0.7
r(t), TRANSIENT THERMAL RESISTANCE
D=0.5
D=0.3
0.1
D=0.1
D=0.05
0.01
D=0.02
D=0.01
D=0.005
RθJC (t) = r(t) * RθJC
RθJC = 2.91℃/W
Duty Cycle, D = t1/t2
D=Single Pulse
0.001
1E-06
1E-05
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
DMN60H4D5SK3
Document number: DS39430 Rev. 2 - 2
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK) (Type TH)
E
L3
A
b3
7° ± 2°
L5
c
A4
Ø
D
0
20
1.
L4
H
A2
7° ± 2°
e
7° ± 2°
b(3x)
Gauge Plane
L2
D1
E1
Seating Plane
a
L
A1
2.90REF
TO252 (DPAK)
(Type TH)
Dim Min Max Typ
A 2.20 2.38 2.30
A1 0.00 0.10
A2 0.97 1.17 1.07
A4
0.10 REF
b 0.72 0.85 0.78
b3 5.23 5.45 5.33
c
0.47 0.58 0.53
D 6.00 6.20 6.10
D1
5.30 REF
e
2.286 BSC
E 6.50 6.70 6.60
E1 4.70 4.92 4.83
H 9.90 10.10 10.30
L 1.40 1.70 1.60
L2
0.51 BSC
L3 0.90 1.25
L4 0.60 1.00 0.80
L5 1.70 1.90 1.80
a
0°
8°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
TO252 (DPAK) (Type TH)
X1
Dimensions
C
X
X1
Y
Y1
Y2
Y1
Y2
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
C
Y
X
DMN60H4D5SK3
Document number: DS39430 Rev. 2 - 2
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IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
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labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
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