HCC/HCF4009UB HCC/HCF4010B HEX BUFFER/CONVERTERS 4009UB–INVERTING TYPE 4010B–NON INVERTING TYPE .. .. .. . . . CMOS TO DTL/TTL HEX CONVERTER HIGH-TO-LOW LEVEL LOGIC CONVERSION MULTIPLEXER: 1-TO-6 OR 6-TO-1 HIGH”SINK” AND ”SOURCE” CURRENT CAPABILITY 5V, 10V AND 15V PARAMETRIC RATINGS MAXIMUM INPUT CURRENT OF 100 µA AT 18V OVER FULL PACKAGE AND TEMPERATURE RANGE; o 100nA AT 18V AND 25 C 100% TESTED FOR QUIESCENT CURRENT AT 20V MEETS ALL REQUIREMENTS OF JEDEC TENTATIVE STANDARD N. 13A, ” STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES ” non-inverting Hex Buffer/Converters, respectively. Both devices can be used as CMOS to TTL or DTL logic-level converters, as current ”sink” or ”source” drivers or as multiplexer (1 to 6). 4049UB and 4050B are prefered replacements for 4009UB and 4010B, respectively, in buffer applications. EY (Plastic Package) F (Ceramic Package) M1 (Micro Package) C1 (Chip Carrier) DESCRIPTION The HCC4009UB/4010B (extended temperature range) and the HCF4009UB/4010B (intermediate temperature range) are monolithic integrated circuits available in 16-lead dual in line plastic or ceramic packages and plastic micropackage. ORDER CODES : HCCXXXXBF HCFXXXXBM1 HCFXXXXBEY HCFXXXXBC1 The HCC/HCF4009UB/4010B are inverting and PIN CONNECTIONS 4009UB September 1988 4010B 1/13 HCC/HCF4009UB HCC/ HCF4010B SCHEMATIC DIAGRAM: COS/MOS TO DTL OR TTL CONVERTER (1 of 6 identical units) 4009UB 4010B Connect VCC to DTL or TTL supply and VDD to COS/MOS supply ABSOLUTE MAXIMUM RATING Symbol VDD * Vi Parameter Supply Voltage: HCC Types HCF Types Input Voltage II Value -0.5 to +20 -0.5 to +18 -0.5 to VDD + 0.5 Unit V V V DC Input Current (any one input) ± 10 mA Ptot Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range 200 mW 100 mW Top Operating Temperature: HCC Types HCF Types Storage Temperature Tstg -55 to +125 -40 to +85 -65 to +150 o C C o C o Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress ratingonly and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage. RECOMMENDED OPERATING CONDITIONS Symbol VDD Parameter Supply Voltage: HCC Types HCF Types VI Input Voltage Top Operating Temperature: HCC Types HCF Types 2/13 Value 3 to 18 3 to 15 0 to VDD -55 to +125 -40 to +85 Unit V V V o o C C HCC/HCF4009UB HCC/HCF4010B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol IL V OH VOL VIH VIH V IL V IL IOH Parameter Quiescent Current 0/5 0/10 0/15 0/20 0/5 HCF 0/10 Types 0/15 Output High 0/5 Voltage 0/10 0/15 Output Low 5/0 Voltage 10/0 15/0 Input High Voltage (4009UB) Input High Voltage (4010B) Input Low Voltage (4009UB) Input Low Voltage (4010B) Output Drive Current Output Sink Current HCC Types HCC Types HCF Types IIH, IIL CI Test Conditios VO |IO| VDD (V) (µA) (V) HCC Types HCF Types IOL VI (V) 0/5 0/5 0/10 0/15 0/5 0/5 0/10 0/15 0/5 0/10 0/15 0/5 0/10 0/15 Input Leakage 0/18 Current Input 4009UB Capacitance 4010B 0.5 1 1.5 4.5 9 13.5 4.5 9 13.5 0.5 1 1.5 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 Any Input Value TLOW * 25 oC Min. Max. Min. Typ. 1 0.02 2 0.02 4 0.02 20 0.04 4 0.02 8 0.02 16 0.02 4.95 4.95 9.95 9.95 14.95 14.95 0.05 0.05 0.05 4 4 8 8 12.5 12.5 3.5 3.5 7 7 11 11 1 2 2.5 1.5 3 4 -1 -0.8 -1.6 -0.25 -0.2 -0.4 -0.55 -0.45 -0.9 -1.65 -1.5 -3 -0.9 -0.8 -1.6 -0.23 -0.2 -0.4 -0.5 -0.45 -0.9 -1.6 -1.5 -3 3.75 3 4 10 8 10 30 24 36 3.6 3 4 0.96 8 10 40 24 36 ±0.1 THIGH * Min. Max. 30 60 120 600 30 60 120 4.95 9.95 14.95 0.05 0.05 0.05 0.05 0.05 0.05 4 8 12.5 3.5 7 11 1 1 2 2 2.5 2.5 1.5 1.5 3 3 4 4 -0.58 -0.15 -0.33 -1.1 -0.65 -0.18 -0.38 -1.25 2.1 5.6 16 2.4 6.4 1.9 Max. 1 2 4 20 4 8 16 ±10-5 ±0.1 15 5 22.6 7.5 ±1 Unit µA V V V V V V mA mA µA pF * TLOW = -55 oC for HCC device: -40 oC for HCF device. * THIGH = +125 oC for HCC device: +85 oC for HCF device. The Noise Margin for both ”1” and ”0” level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. with VDD = 15 V 3/13 HCC/HCF4009UB HCC/ HCF4010B DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 o C, C L = 50 pF, RL = 200 KΩ, o typical temperature coefficent for all VDD values is 03 %/ C, all input rise and fall times= 20 ns) Symbol tPLH tPLH tPHL tPHL tTLH tTHL Parameter Propagation Delay Time (4009UB) Propagation Delay Time (4010B) Propagation Delay Time (4009UB) Propagation Delay Time (4010B) Transition Time Transition Time Minimum and Maximum Voltage Transfer Characteristics for 4009UB 4/13 Test Conditions VDD (V) VI (V) VCC (V) 5 5 5 10 10 10 10 10 5 15 15 15 15 15 5 5 5 5 10 10 10 10 10 5 15 15 15 15 15 5 5 5 5 10 10 10 10 10 5 15 15 15 15 15 5 5 5 5 10 10 10 10 10 5 15 15 15 15 15 5 5 5 5 10 10 10 15 15 15 5 5 5 10 10 10 15 15 15 Min. Value Typ. 70 40 35 30 30 100 50 50 35 35 30 20 15 15 10 65 35 30 25 20 150 75 55 35 20 15 Max. 140 80 70 60 60 200 100 100 70 70 60 40 30 30 20 130 70 70 50 40 350 150 110 70 40 30 Unit ns ns ns ns ns ns Typical Voltage Transfer Characteristics As a Function of Temperature for 4009UB HCC/HCF4009UB HCC/HCF4010B Minimum and Maximum Voltage Transfer Characteristics for 4010B Minimum and Maximum Voltage Transfer Characteristics for 4010B Minimum and Maximum Voltage Transfer Characteristics for 4010B Typical Voltage Transfer Characteristics As a Function ot Temperature for 4010B Typical Output Los (sink) Current Characteristics Minimum output Low (sink) Current Characteristics 5/13 HCC/HCF4009UB HCC/ HCF4010B Typical Output High (source) Current Characteristics Minimum output High (source) Current Characteristics Typical Low to High Propagation Delay Time vs Load Capacitance for 4009UB Typical High to Low Propagation Delay Time vs Load Capacitance for 4009UB Typical Low to High Propagation Delay Time vs Load Capacitance for 4010B typical High to Low Propagation Delay Time vs Load Capacitance for 4010B 6/13 HCC/HCF4009UB HCC/HCF4010B Typical Low to High Transition Time vs Load Capacitance Typical High to Low Transition Time vs Load Capacitance Typical Dissipation Characteristics 7/13 HCC/HCF4009UB HCC/ HCF4010B TEST CIRCUITS Quiescent Device Current. Input Leakage Current. 8/13 Noise Immunity. HCC/HCF4009UB HCC/HCF4010B Plastic DIP16 (0.25) MECHANICAL DATA mm DIM. MIN. a1 0.51 B 0.77 TYP. inch MAX. MIN. TYP. MAX. 0.020 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L Z 3.3 0.130 1.27 0.050 P001C 9/13 HCC/HCF4009UB HCC/ HCF4010B Ceramic DIP16/1 MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 20 0.787 B 7 0.276 D E 3.3 0.130 0.38 e3 0.015 17.78 0.700 F 2.29 2.79 0.090 0.110 G 0.4 0.55 0.016 0.022 H 1.17 1.52 0.046 0.060 L 0.22 0.31 0.009 0.012 M 0.51 1.27 0.020 0.050 N P Q 10.3 7.8 8.05 5.08 0.406 0.307 0.317 0.200 P053D 10/13 HCC/HCF4009UB HCC/HCF4010B SO16 (Narrow) MECHANICAL DATA mm DIM. MIN. TYP. A a1 inch MAX. MIN. TYP. 1.75 0.1 0.068 0.2 a2 MAX. 0.004 0.007 1.65 0.064 b 0.35 0.46 0.013 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 0.019 c1 45° (typ.) D 9.8 E 5.8 10 0.385 6.2 0.228 0.393 0.244 e 1.27 0.050 e3 8.89 0.350 F 3.8 4.0 0.149 0.157 G 4.6 5.3 0.181 0.208 L 0.5 1.27 0.019 0.050 M S 0.62 0.024 8° (max.) P013H 11/13 HCC/HCF4009UB HCC/ HCF4010B PLCC20 MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 e3 5.08 0.200 F 0.38 0.015 G 0.101 0.004 M 1.27 0.050 M1 1.14 0.045 P027A 12/13 HCC/HCF4009UB HCC/HCF4010B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 13/13