STMicroelectronics HCCXXXXBF Hex buffer/converter Datasheet

HCC/HCF4009UB
HCC/HCF4010B
HEX BUFFER/CONVERTERS
4009UB–INVERTING TYPE
4010B–NON INVERTING TYPE
..
..
..
.
.
.
CMOS TO DTL/TTL HEX CONVERTER
HIGH-TO-LOW LEVEL LOGIC CONVERSION
MULTIPLEXER: 1-TO-6 OR 6-TO-1
HIGH”SINK” AND ”SOURCE” CURRENT CAPABILITY
5V, 10V AND 15V PARAMETRIC RATINGS
MAXIMUM INPUT CURRENT OF 100 µA AT
18V OVER FULL
PACKAGE AND TEMPERATURE RANGE;
o
100nA AT 18V AND 25 C
100% TESTED FOR QUIESCENT CURRENT
AT 20V
MEETS ALL REQUIREMENTS OF JEDEC TENTATIVE STANDARD N. 13A, ” STANDARD
SPECIFICATIONS FOR DESCRIPTION OF B
SERIES CMOS DEVICES ”
non-inverting Hex Buffer/Converters, respectively.
Both devices can be used as CMOS to TTL or DTL
logic-level converters, as current ”sink” or ”source”
drivers or as multiplexer (1 to 6).
4049UB and 4050B are prefered replacements for
4009UB and 4010B, respectively, in buffer applications.
EY
(Plastic Package)
F
(Ceramic Package)
M1
(Micro Package)
C1
(Chip Carrier)
DESCRIPTION
The HCC4009UB/4010B (extended temperature
range) and the HCF4009UB/4010B (intermediate
temperature range) are monolithic integrated circuits available in 16-lead dual in line plastic or ceramic packages and plastic micropackage.
ORDER CODES :
HCCXXXXBF
HCFXXXXBM1
HCFXXXXBEY
HCFXXXXBC1
The HCC/HCF4009UB/4010B are inverting and
PIN CONNECTIONS
4009UB
September 1988
4010B
1/13
HCC/HCF4009UB HCC/ HCF4010B
SCHEMATIC DIAGRAM: COS/MOS TO DTL OR TTL CONVERTER (1 of 6 identical units)
4009UB
4010B
Connect VCC to DTL or TTL supply and VDD to COS/MOS supply
ABSOLUTE MAXIMUM RATING
Symbol
VDD *
Vi
Parameter
Supply Voltage: HCC Types
HCF Types
Input Voltage
II
Value
-0.5 to +20
-0.5 to +18
-0.5 to VDD + 0.5
Unit
V
V
V
DC Input Current (any one input)
± 10
mA
Ptot
Total Power Dissipation (per package)
Dissipation per Output Transistor
for Top = Full Package Temperature Range
200
mW
100
mW
Top
Operating Temperature: HCC Types
HCF Types
Storage Temperature
Tstg
-55 to +125
-40 to +85
-65 to +150
o
C
C
o
C
o
Stresses above those listed under ”Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress ratingonly and functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for external periods may affect device reliability.
* All voltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol
VDD
Parameter
Supply Voltage: HCC Types
HCF Types
VI
Input Voltage
Top
Operating Temperature: HCC Types
HCF Types
2/13
Value
3 to 18
3 to 15
0 to VDD
-55 to +125
-40 to +85
Unit
V
V
V
o
o
C
C
HCC/HCF4009UB HCC/HCF4010B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Symbol
IL
V OH
VOL
VIH
VIH
V IL
V IL
IOH
Parameter
Quiescent
Current
0/5
0/10
0/15
0/20
0/5
HCF
0/10
Types
0/15
Output High
0/5
Voltage
0/10
0/15
Output Low
5/0
Voltage
10/0
15/0
Input High
Voltage (4009UB)
Input High
Voltage (4010B)
Input Low
Voltage (4009UB)
Input Low
Voltage (4010B)
Output
Drive
Current
Output
Sink
Current
HCC
Types
HCC
Types
HCF
Types
IIH, IIL
CI
Test Conditios
VO
|IO| VDD
(V)
(µA) (V)
HCC
Types
HCF
Types
IOL
VI
(V)
0/5
0/5
0/10
0/15
0/5
0/5
0/10
0/15
0/5
0/10
0/15
0/5
0/10
0/15
Input Leakage
0/18
Current
Input
4009UB
Capacitance 4010B
0.5
1
1.5
4.5
9
13.5
4.5
9
13.5
0.5
1
1.5
2.5
4.6
9.5
13.5
2.5
4.6
9.5
13.5
0.4
0.5
1.5
0.4
0.5
1.5
5
10
15
20
5
10
15
5
10
15
5
10
15
5
10
15
5
10
15
5
10
15
5
10
15
5
5
10
15
5
5
10
15
5
10
15
5
10
15
18
Any Input
Value
TLOW *
25 oC
Min. Max. Min. Typ.
1
0.02
2
0.02
4
0.02
20
0.04
4
0.02
8
0.02
16
0.02
4.95
4.95
9.95
9.95
14.95
14.95
0.05
0.05
0.05
4
4
8
8
12.5
12.5
3.5
3.5
7
7
11
11
1
2
2.5
1.5
3
4
-1
-0.8 -1.6
-0.25
-0.2 -0.4
-0.55
-0.45 -0.9
-1.65
-1.5
-3
-0.9
-0.8 -1.6
-0.23
-0.2 -0.4
-0.5
-0.45 -0.9
-1.6
-1.5
-3
3.75
3
4
10
8
10
30
24
36
3.6
3
4
0.96
8
10
40
24
36
±0.1
THIGH *
Min. Max.
30
60
120
600
30
60
120
4.95
9.95
14.95
0.05
0.05
0.05
0.05
0.05
0.05
4
8
12.5
3.5
7
11
1
1
2
2
2.5
2.5
1.5
1.5
3
3
4
4
-0.58
-0.15
-0.33
-1.1
-0.65
-0.18
-0.38
-1.25
2.1
5.6
16
2.4
6.4
1.9
Max.
1
2
4
20
4
8
16
±10-5
±0.1
15
5
22.6
7.5
±1
Unit
µA
V
V
V
V
V
V
mA
mA
µA
pF
* TLOW = -55 oC for HCC device: -40 oC for HCF device.
* THIGH = +125 oC for HCC device: +85 oC for HCF device.
The Noise Margin for both ”1” and ”0” level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. with VDD = 15 V
3/13
HCC/HCF4009UB HCC/ HCF4010B
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 o C, C L = 50 pF, RL = 200 KΩ,
o
typical temperature coefficent for all VDD values is 03 %/ C, all input rise and fall times= 20 ns)
Symbol
tPLH
tPLH
tPHL
tPHL
tTLH
tTHL
Parameter
Propagation Delay Time
(4009UB)
Propagation Delay Time
(4010B)
Propagation Delay Time
(4009UB)
Propagation Delay Time
(4010B)
Transition Time
Transition Time
Minimum and Maximum Voltage Transfer Characteristics for 4009UB
4/13
Test Conditions
VDD (V) VI (V) VCC (V)
5
5
5
10
10
10
10
10
5
15
15
15
15
15
5
5
5
5
10
10
10
10
10
5
15
15
15
15
15
5
5
5
5
10
10
10
10
10
5
15
15
15
15
15
5
5
5
5
10
10
10
10
10
5
15
15
15
15
15
5
5
5
5
10
10
10
15
15
15
5
5
5
10
10
10
15
15
15
Min.
Value
Typ.
70
40
35
30
30
100
50
50
35
35
30
20
15
15
10
65
35
30
25
20
150
75
55
35
20
15
Max.
140
80
70
60
60
200
100
100
70
70
60
40
30
30
20
130
70
70
50
40
350
150
110
70
40
30
Unit
ns
ns
ns
ns
ns
ns
Typical Voltage Transfer Characteristics As a
Function of Temperature for 4009UB
HCC/HCF4009UB HCC/HCF4010B
Minimum and Maximum Voltage Transfer Characteristics for 4010B
Minimum and Maximum Voltage Transfer Characteristics for 4010B
Minimum and Maximum Voltage Transfer Characteristics for 4010B
Typical Voltage Transfer Characteristics As a
Function ot Temperature for 4010B
Typical Output Los (sink) Current Characteristics
Minimum output Low (sink) Current Characteristics
5/13
HCC/HCF4009UB HCC/ HCF4010B
Typical Output High (source) Current Characteristics
Minimum output High (source) Current Characteristics
Typical Low to High Propagation Delay Time vs
Load Capacitance for 4009UB
Typical High to Low Propagation Delay Time vs
Load Capacitance for 4009UB
Typical Low to High Propagation Delay Time vs
Load Capacitance for 4010B
typical High to Low Propagation Delay Time vs
Load Capacitance for 4010B
6/13
HCC/HCF4009UB HCC/HCF4010B
Typical Low to High Transition Time vs Load Capacitance
Typical High to Low Transition Time vs Load Capacitance
Typical Dissipation Characteristics
7/13
HCC/HCF4009UB HCC/ HCF4010B
TEST CIRCUITS
Quiescent Device Current.
Input Leakage Current.
8/13
Noise Immunity.
HCC/HCF4009UB HCC/HCF4010B
Plastic DIP16 (0.25) MECHANICAL DATA
mm
DIM.
MIN.
a1
0.51
B
0.77
TYP.
inch
MAX.
MIN.
TYP.
MAX.
0.020
1.65
0.030
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
0.787
E
8.5
0.335
e
2.54
0.100
e3
17.78
0.700
F
7.1
0.280
I
5.1
0.201
L
Z
3.3
0.130
1.27
0.050
P001C
9/13
HCC/HCF4009UB HCC/ HCF4010B
Ceramic DIP16/1 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
20
0.787
B
7
0.276
D
E
3.3
0.130
0.38
e3
0.015
17.78
0.700
F
2.29
2.79
0.090
0.110
G
0.4
0.55
0.016
0.022
H
1.17
1.52
0.046
0.060
L
0.22
0.31
0.009
0.012
M
0.51
1.27
0.020
0.050
N
P
Q
10.3
7.8
8.05
5.08
0.406
0.307
0.317
0.200
P053D
10/13
HCC/HCF4009UB HCC/HCF4010B
SO16 (Narrow) MECHANICAL DATA
mm
DIM.
MIN.
TYP.
A
a1
inch
MAX.
MIN.
TYP.
1.75
0.1
0.068
0.2
a2
MAX.
0.004
0.007
1.65
0.064
b
0.35
0.46
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.5
0.019
c1
45° (typ.)
D
9.8
E
5.8
10
0.385
6.2
0.228
0.393
0.244
e
1.27
0.050
e3
8.89
0.350
F
3.8
4.0
0.149
0.157
G
4.6
5.3
0.181
0.208
L
0.5
1.27
0.019
0.050
M
S
0.62
0.024
8° (max.)
P013H
11/13
HCC/HCF4009UB HCC/ HCF4010B
PLCC20 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
9.78
10.03
0.385
0.395
B
8.89
9.04
0.350
0.356
D
4.2
4.57
0.165
0.180
d1
2.54
0.100
d2
0.56
0.022
E
7.37
8.38
0.290
0.330
e
1.27
0.050
e3
5.08
0.200
F
0.38
0.015
G
0.101
0.004
M
1.27
0.050
M1
1.14
0.045
P027A
12/13
HCC/HCF4009UB HCC/HCF4010B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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13/13
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