TI LM140LAH-5.0/NOPB Lm140lqml series 3-terminal positive regulator Datasheet

LM140LQML
www.ti.com
SNVS381A – MARCH 2006 – REVISED MAY 2013
LM140LQML Series 3-Terminal Positive Regulators
Check for Samples: LM140LQML
FEATURES
DESCRIPTION
•
•
•
The LM140L series of three terminal positive
regulators is available with several fixed output
voltages making them useful in a wide range of
applications. The LM140LA is an improved version of
the LM78LXX series with a tighter output voltage
tolerance (specified over the full military temperature
range), higher ripple rejection, better regulation and
lower quiescent current. The LM140LA regulators
have ±2% VOUT specification, 0.04%/V line regulation,
and 0.01%/mA load regulation. When used as a
zener diode/resistor combination replacement, the
LM140LA usually results in an effective output
impedance improvement of two orders of magnitude,
and lower quiescent current. These regulators can
provide local on card regulation, eliminating the
distribution problems associated with single point
regulation. The voltages available allow the LM140LA
to be used in logic systems, instrumentation, Hi-Fi,
and other solid state electronic equipment. Although
designed primarily as fixed voltage regulators, these
devices can be used with external components to
obtain adjustable voltages and currents.
1
2
•
•
•
•
Line Regulation of 0.04%/V
Load Regulation of 0.01%/mA
Output Voltage Tolerances of ±2% at Tj = 25°C
and ±4% over the Temperature Range
Output Current of 100 mA
Internal Thermal Overload Protection
Output Transistor Safe Area Protection
Internal Short Circuit Current Limit
With adequate heat sinking the regulator can deliver
100 mA output current. Current limiting is included to
limit the peak output current to a safe value. Safe
area protection for the output transistor is provided to
limit internal power dissipation. If internal power
dissipation becomes too high for the heat sinking
provided, the thermal shut-down circuit takes over,
preventing the IC from overheating.
Output Voltage Options
Device ID
Output Voltage
LM140LA-5.0
5V
LM140LA-12
12V
LM140LA-15
15V
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2013, Texas Instruments Incorporated
LM140LQML
SNVS381A – MARCH 2006 – REVISED MAY 2013
www.ti.com
Connection Diagrams
TO-39 Metal Can Package
Figure 1. Bottom View
See Package NDT0003A
Equivalent Circuit
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
LM140LQML
www.ti.com
SNVS381A – MARCH 2006 – REVISED MAY 2013
Absolute Maximum Ratings (1)
Input Voltage
35V
Internal Power Dissipation (2)
Internally Limited
−55°C ≤ TA ≤ +125°C
Operating Temperature Range
Maximum Junction Temperature
+150°C
−65°C ≤ TA ≤ +150°C
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
Thermal Resistance
+300°C
Still Air @ 0.5W
θJA
201°C/W
500LF / Min Air Flow @ 0.5W
79°C/W
θJC (@ 1.0W)
38°C/W
ESD Susceptibility (3)
(1)
(2)
(3)
TBD
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not specify specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Human body model, 100pF discharged through 1.5KΩ
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
1
Static tests at
Temp °C
25
2
Static tests at
125
3
Static tests at
-55
4
Dynamic tests at
25
5
Dynamic tests at
125
6
Dynamic tests at
-55
7
Functional tests at
25
8A
Functional tests at
125
8B
Functional tests at
-55
9
Switching tests at
25
10
Switching tests at
125
11
Switching tests at
-55
12
Settling time at
25
13
Settling time at
125
14
Settling time at
-55
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
3
LM140LQML
SNVS381A – MARCH 2006 – REVISED MAY 2013
www.ti.com
LM140LA-5.0 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. DC: VI = 10V, IL = 40mA
Symbol
IQ
Parameter
Max
Unit
Subgroups
4.5
mA
1
4.2
mA
2
4.9
5.1
V
1
VI = 20V, IL = 5mA
4.8
5.2
V
1, 2, 3
VI = 20V, IL = 100mA
4.8
5.2
V
1, 2, 3
VI = 7.2V, IL = 5mA
4.8
5.2
V
1, 2, 3
VI = 7.2V, IL = 100mA
4.8
5.2
V
1, 2, 3
5mA ≤ IL ≤ 40 mA
-20
20
mV
1
5mA ≤ IL ≤ 100mA
-40
40
mV
1
IL = 100mA, 7.5V ≤ VI ≤ 25V
-30
30
mV
1
Conditions
Notes
Min
Quiescent Current
VO
Output Voltage
RLoad
Load Regulation
RLine
Line Regulation
ΔIQ
Quiescent Current Change
7V ≤ VI ≤ 25V
-30
30
mV
1
5mA ≤ IL ≤ 40mA
-0.1
0.1
mA
1, 2, 3
7.5V ≤ VI ≤ 35V
-0.5
0.5
mA
1
Min
Max
Unit
Subgroups
dB
4
Max
Unit
Subgroups
4.5
mA
1
4.2
mA
2
LM140LA-5.0 Electrical Characteristics AC Parameters
Symbol
RR
Parameter
Ripple Rejection
Conditions
Notes
ƒ = 120Hz, eI = 1VRMS
55
LM140LA-12 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. DC: VI = 19V, IL = 40mA
Symbol
IQ
Parameter
Conditions
Notes
Min
Quiescent Current
VO
Output Voltage
RLoad
Load Regulation
RLine
Line Regulation
ΔIQ
Quiescent Current Change
11.75
12.25
V
1
VI = 27V, IL = 5mA
11.5
12.5
V
1, 2, 3
VI = 27V, IL = 100mA
11.5
12.5
V
1, 2, 3
VI = 14.5V, IL = 5mA
11.5
12.5
V
1, 2, 3
VI = 14.5V, IL = 100mA
11.5
12.5
V
1, 2, 3
5mA ≤ IL ≤ 40mA
-40
40
mV
1
5mA ≤ IL ≤ 100mA
-80
80
mV
1
IL = 100mA, 14.5V ≤ VI ≤ 30V
-65
65
mV
1
14.2V ≤ VI ≤ 30V
-65
65
mV
1
5mA ≤ IL ≤ 40mA
-0.1
0.1
mA
1, 2, 3
14.3V ≤ VI ≤ 35V
-0.5
0.5
mA
1
Max
Unit
Subgroups
dB
4
LM140LA-12 Electrical Characteristics AC Parameters
Symbol
RR
4
Parameter
Ripple Rejection
Conditions
ƒ = 120Hz, eI = 1VRMS
Submit Documentation Feedback
Notes
Min
47
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
LM140LQML
www.ti.com
SNVS381A – MARCH 2006 – REVISED MAY 2013
LM140LA-15 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. DC: VI = 23V, IL = 40mA
Symbol
IQ
Parameter
Max
Unit
Subgroups
4.5
mA
1
4.2
mA
2
14.7
15.3
V
1
VI = 30V, IL = 5mA
14.4
15.6
V
1, 2, 3
VI = 30V, IL = 100mA
14.4
15.6
V
1, 2, 3
VI = 17.6V, IL = 5mA
14.4
15.6
V
1, 2, 3
VI = 17.6V, IL = 100mA
14.4
15.6
V
1, 2, 3
5mA ≤ IL ≤ 40mA
-50
50
mV
1
5mA ≤ IL ≤ 100mA
-100
100
mV
1
IL = 100mA, 17.3V ≤ VI ≤ 30V
-70
70
mV
1
Conditions
Notes
Min
Quiescent Current
VO
Output Voltage
RLoad
RLine
ΔIQ
Load Regulation
Line Regulation
Quiescent Current Change
17.3V ≤ VI ≤ 30V
-70
70
mV
1
5mA ≤ IL ≤ 40mA
-0.1
0.1
mA
1, 2, 3
17.5V ≤ VI ≤ 35V
-0.5
0.5
mA
1
Min
Max
Unit
Subgroups
dB
4
LM140LA-15 Electrical Characteristics AC Parameters
Symbol
RR
Parameter
Ripple Rejectionƒ
Conditions
f = 120Hz, eI = 1VRMS
Notes
47
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
5
LM140LQML
SNVS381A – MARCH 2006 – REVISED MAY 2013
www.ti.com
Typical Performance Characteristics
6
Maximum Average
Power Dissipation
Maximum Average
Power Dissipation
Figure 2.
Figure 3.
Peak Output Current
Dropout Voltage
Figure 4.
Figure 5.
Output Impedance
Ripple Rejection
Figure 6.
Figure 7.
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
LM140LQML
www.ti.com
SNVS381A – MARCH 2006 – REVISED MAY 2013
Typical Performance Characteristics (continued)
Quiescent Current
Quiescent Current
Figure 8.
Figure 9.
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
7
LM140LQML
SNVS381A – MARCH 2006 – REVISED MAY 2013
www.ti.com
TYPICAL APPLICATIONS
NOTE
It is recommended that a minimum load capacitor of 0.01 μF be used to limit the high
frequency noise bandwidth.
*Required if the regulator is located far from the power supply filter.
**Human body model, 100pF discharged through 1.5KΩ
Figure 10. Fixed Output Regulator
VOUT = 5V + (5V/R1 + IO) R2
5V/R1 = 3 IO load regulation (L,) [(R1 + R2)/R1] (L, of LM140LA-5.0)
Figure 11. Adjustable Output Regulator
8
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
LM140LQML
www.ti.com
SNVS381A – MARCH 2006 – REVISED MAY 2013
Revision History
Released
Revision
03/10/06
A
05/02/13
A
Section
New release to corporate format
Originator
L. Lytle
Changes
3 MDS data sheets converted into one Corp.
data sheet format. Drift tables were removed
from electrical characteristics since not
performed on 883 product. MDS data sheets
MNLM140LA-05-H Rev. 0B0, MNLM140LA-12H Rev. 0B0 and MNLM140LA-15-H Rev. 0B0.
will be archived.
Changed layout of National Data Sheet to TI
format.
Submit Documentation Feedback
Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: LM140LQML
9
PACKAGE OPTION ADDENDUM
www.ti.com
2-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
(3)
Top-Side Markings
(4)
LM140LAH-12/883
ACTIVE
TO
NDT
3
20
TBD
Call TI
Call TI
-55 to 125
LM140LAH-12/883 Q
ACO
LM140LAH-12/883 Q
>T
LM140LAH-15/883
ACTIVE
TO
NDT
3
20
TBD
Call TI
Call TI
-55 to 125
LM140LAH-15/883 Q
ACO
LM140LAH-15/883 Q
>T
LM140LAH5.0/883
ACTIVE
TO
NDT
3
20
TBD
Call TI
Call TI
-55 to 125
LM140LAH5.0/883 Q
ACO
LM140LAH5.0/883 Q
>T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-May-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
NDT0003A
H03A (Rev D)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages