Thru-Hole Tuning Fork RoHS Compliant / pB Free Model: NC15LF/NC26LF/NC38LF Rev. 1/13/2012 http://www.foxonline.com/need_a_sample.htm FEATURES • • • • • Miniature Packages Low Cost Cold Weld Design Long Term Stability Tight Tolerance NC15LF Click to view mounting precautions 1.5 Max • PART NUMBER SELECTION Learn More - Internet Required Part Number 298LF-Frequency-xxxxx 299LF-Frequency-xxxxx 300LF-Frequency-xxxxx Model Number Frequency Stability Operating Temperature Frequency NC15LF NC26LF NC38LF -0.04 PPM / (∆ºC)2 -0.04 PPM / (∆ºC)2 -0.04 PPM / (∆ºC)2 -20 ºC~ +60 ºC -20 ºC~ +60 ºC -20 ºC~ +60 ºC 32.768 kHz 32.768 kHz 32.768 kHz 5.0 Max 0.22 ±0.05 4.5 Min • STANDARD SPECIFICATIONS PARAMETERS Frequency Frequency Tolerance @ 25ºC Frequency Stability Temperature Coefficient Temperature Range Turnover (TO) Operating (TOPR) Storage (TSTG) Equivalent Series Resistance (RS) NC15 / NC26 NC38 Load Capacitance (Cl) Insulation Resistance @ 100VDC Drive Level Aging per year MAX (unless otherwise noted) 32.768 kHz ± 20 PPM 0.45 NC26LF -0.04 PPM / (∆ºC)2 2.0 Max +20ºC ~ +30ºC -20ºC ~ +60ºC -30ºC ~ +70ºC 50 kΩ 35 kΩ 12.5 pF (Standard) 6 pF (Optional) 500 MΩ Min 1.0 µW ±3 PPM 6.0 Max 0.2 ±0.07 4.0 Min 0.7 ±0.15 All specifications subject to change without notice. Note: Can should not be soldered to the circuit board or grounded. If securing the can to the board is desired, a rubber adhesive is recommended. NC38LF 3.2 Max 8.3 Max 0.38±0.05 9.0 Min 0.8 ±0.1 All dimensions are in millimeters. FOXElectronics 5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 www.foxonline.com EMEA Tel: +44 .1283.568153 | Canada +1.888.438.2369 | Asia Hong Kong Tel: +852.2854.4285 | Japan Tel: +81.3.3374.2079 © 2012 FOX ELECTRONICS | ISO9001:2008 Certified 1. Mounting Precautions 1.1 Lead Type Crystal Units 1.1.1. Structure Tubular crystal units are hermetically sealed using glass (see Figures 1 and 2). Case Case Hermetic Glass Hermetic Glass Lead Lead Figure 1 Figure 2 1.1.2 Unbending the lead (1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the characteristics and may also break the crystal chip see Figure 3). (2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of lead tightly. (see Figure 4). Tweezers or needle-nose pliers Breakage Pull out Case Lead Figure 3 Figure 4 Page 1 of 2 7/7/2011 1.1.3 Bending the lead (1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6). (2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7). D 0.5mm 0.5mm L>D Solder Printed circuit board Solder L Solder Figure 5 Figure 6 Soldering directly to the case will reduce the degree of vacuum and may result in deterioration of the characteristics and may break the crystal chip. Figure 7 Make the length from the case to the printed circuit board (L) longer than the case diameter (D) so that the lead wire will not be pulled in case the crystal unit falls over. 1.1.4 Soldering When mounting or removing a quartz crystal unit, heat the lead part at 300°C or lower for 5 seconds or less (in the case of a lead-type conventional product). A long period of time of heating may result in deterioration of the characteristics and may break the crystal unit. Be sure to keep the case at or below 150°C. Page 2 of 2 7/7/2011