HLMP-KW50 T-1 Precision Optical Performance White LED Data Sheet Description Features This high intensity white LED lamp is based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.27, y = 0.25 using the 1931 CIE Chromaticity Diagram. • Highly Luminous White Emission This T-1 lamp is untinted, nondiffused, and incorporate precise optics which produce well defined spatial radiation patterns at specific viewing cone angle. • Small Area Illumination Package Dimensions • Viewing Angle : 45° Applications • Indoor Electronic Signs and Signals • Legend Backlighting • General Purpose Indicators Benefit 3.18 (0.125) 2.67 (0.105) 3.43 (0.135) 2.92 (0.115) • Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light Sources 4.70 (0.185) 4.19 (0.165) 6.35 (0.250) 5.58 (0.220) 1.02 (0.040) NOM. 24.13 (0.95) MIN. CATHODE 1.27 (0.050) NOM. 0.45 (0.018) SQUARE NOM. ANODE 2.54 (0.100) NOM. Notes : 1. All dimensions are in milimetres /inches. 2. Epoxy meniscus may extend about 1mm (0.040”) down the leads. CAUTION : These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. Device Selection Guide Part Number Typical Viewing Angle Min Iv (mcd) @ 20mA Max Iv (mcd) @ 20mA Typical Chromaticity Coordinates (x,y) HLMP-KW50-QS000 45° 1150 2500 0.27, 0.25 Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 3. Tolerance for intensity bin limit is +/- 15% Absolute Maximum Ratings (TA = 25°C) Parameter Value Units DC Forward Current [1] 30 mA Peak Forward Current [2] 100 mA Power Dissipation 111 mW Reverse Voltage (IR = 10μA) 5 V LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Reverse Breakdown, VR (V) @ IR = 10μA Capacitance, C (pF), VF = 0,f = 1 MHz Thermal Resistance RθJ-PIN (°C/W) Notes: 1. Derate linearly as shown in Figure 5. 2. Duty factor 10%, Frequency = 1KHz. Electrical Characteristics (TA = 25°C) Forward Voltage, VF (V) @ IF = 20 mA Typ. Max. Min. Typ. Typ. 3.2 3.7 5 70 290 35 0.8 FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY 1.0 0.6 0.4 0.2 0 30 25 20 15 10 5 380 480 580 680 0 780 0 1 WAVELENGTH – nm Figure 1. Relative Intensity vs Wavelength 0.020 1.2 Y-COORDINATES RELATIVE LUMINOUS INTENSITY 0.9 0.6 0.3 1 mA 0.015 5 mA 0.010 10 mA 15 mA 0.005 0 20 mA 25 mA -0.005 0 10 20 FORWARD CURRENT - mA 30 30 mA -0.010 -0.004 -0.002 0 0.002 0.004 X-COORDINATES (X,Y) VALUES @ 20 mA REFERENCE TO (0,0) Figure 4. Chromaticity shift vs. current 35 1.0 30 0.8 25 RELATIVE INTENSITY IF MAX. - MAXIMUM FORWARD CURRENT - mA 4 0.025 Figure 3. Relative Iv vs. Forward Current 20 15 10 5 0 0 20 40 60 T A - AMBIENT TEMPERATURE - C Figure 5. Maximum Fwd. Current vs Temperature 3 Figure 2. Forward Current vs Forward Voltage 1.5 0 2 FORWARD VOLTAGE - V 80 100 0.6 0.4 0.2 0 -90 -60 -30 0 30 SPATIAL DISPLACEMENT - DEG. Figure 6. Spatial Radiation Pattern 60 90 Intensity Bin Limits (mcd at 20 mA) Bin Min. Max. Q 1150 1500 R 1500 1900 S 1900 2500 Color Bin Limit Tables Limits (Chromaticity Coordinates) Rank Tolerance for each bin limit is ± 15%. 1 x y 0.330 0.360 0.330 0.318 0.356 0.351 0.361 0.385 2 x y 0.287 0. 295 0.296 0.276 0.330 0.318 0.330 0.339 3 x y 0.264 0.267 0.280 0.248 0.296 0.276 0.283 0.305 4 x y 0.283 0.305 0.287 0.295 0.330 0.339 0.330 0.360 Tolerance for each color bin limit is ± 0.01 Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram 0.40 0.35 1 Y-COORDINATE 4 BLACK BODY CURVE 2 0.30 3 0.25 0.20 0.26 0.3 0.34 0.38 X-COORDINATE Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for information on currently available Relative Light Output vs. Junction Temperature RELATIVE LIGHT OUTPUT ( NORMALIZED AT T J = 25ºC) 10 1 0.1 -40 -20 0 20 40 60 T J - JUNCTION TEMPERATURE - °C 80 100 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. CATHODE InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 TEMPERATURE (°C) Flux: Rosin flux 200 Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A GO AVA OGIES NOL ECH + DE ANO T CAT E HOD – ANODE LEAD LEAVES THE BOX FIRST. C RL THE MO L ABE Note: For InGaN device, the ammo pack packaging box contains ESD logo. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity LPN CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: REV: (V) Vendor ID DeptID: (1P) Item: Part Number Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4157EN AV02-0372EN - April 28, 2008