MAX6100EUR Rev. A RELIABILITY REPORT FOR MAX6100EUR PLASTIC ENCAPSULATED DEVICES February 14, 2003 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Written by Reviewed by Jim Pedicord Quality Assurance Reliability Lab Manager Bryan J. Preeshl Quality Assurance Executive Director Conclusion The MAX6100 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards. Table of Contents I. ........Device Description II. ........Ma nufacturing Information III. .......Packaging Information V. ........Quality Assurance Information VI. .......Reliability Evaluation IV. .......Die Information .....Attachments I. Device Description A. General The MAX6100 is a low-cost, low-dropout (LDO), micropower voltage references. This three-terminal reference has an output voltage option of 1.8V. It features a proprietary curvature-correction circuit and laser-trimmed, thin-film resistors that result in a low temperature coefficient of 75ppm/°C (max) and an initial accuracy of ±0.4% (max). This device is specified over the extended temperature range (-40°C to +85°C). This series-mode voltage reference draws only 90µA of supply current and can source 5mA and sink 2mA of load current. Unlike conventional shunt-mode (two-terminal) references that waste supply current and require an external resistor, this device offers a supply current that is virtually independent of the supply voltage (with only a 4µA/V variation with supply voltage) and does not require an external resistor. Additionally, this internally compensated device does not require an external compensation capacitor and is stable with load capacitance. Eliminating the external compensation capacitor saves valuable board area in space-critical applications. Low dropout voltage and supply-independent, ultra-low supply current makes this device ideal for battery-operated, high-performance, lowvoltage systems. The MAX6100 is available in a tiny 3-pin SOT23 packages. B. Absolute Maximum Ratings Item (Voltages Referenced to GND) IN OUT Output Short-Circuit to GND or IN (VIN < 6V) Output Short-Circuit to GND or IN (VIN = 6V) Operating Temperature Range Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70°C) 3-Pin SOT23 Derates above +70°C 3-Pin SOT23 Rating -0.3V to +13.5V -0.3V to (VIN + 0.3V) Continuous 60s -40°C to +85°C -65°C to +150°C +300°C 320mW 4.0mW/°C II. Manufacturing Information A. Description/Function: Low-Cost, Micropower, Low-Dropout, High-Output-Current, SOT23 Voltage References B. Process: B12 (Standard 1.2 micron silicon gate CMOS) C. Number of Device Transistors: 117 D. Fabrication Location: California or Oregon, USA E. Assembly Location: Malaysia or Thailand F. Date of Initial Production: March, 2001 III. Packaging Information A. Package Type: 3-Pin SOT23 B. Lead Frame: Copper or Alloy 42 C. Lead Finish: Solder Plate D. Die Attach: Silver-filled Epoxy E. Bondwire: Gold (1.0 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: # 05-0901-0179 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard JESD22-112: Level 1 IV. Die Information A. Dimensions: 44 x 31mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Aluminum/Si (Si = 1%) D. Backside Metallization: None E. Minimum Metal Width: 1.2 microns (as drawn) F. Minimum Metal Spacing: 1.2 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw V. Quality Assurance Information A. Quality Assurance Contacts: B. Outgoing Inspection Level: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Executive Director) Kenneth Huening (Vice President) 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows: λ= 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 160 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV λ = 6.79 x 10-9 λ = 6.79 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5630) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85°C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The RF24-7 die type has been found to have all pins able to withstand a transient pulse of ±1500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA. Table 1 Reliability Evaluation Test Results MAX6100EUR TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135°C Biased Time = 192 hrs. FAILURE IDENTIFICATION PACKAGE DC Parameters & functionality SAMPLE SIZE NUMBER OF FAILURES 160 0 77 0 0 Moisture Testing (Note 2) Pressure Pot Ta = 121°C P = 15 psi. RH= 100% Time = 168hrs. DC Parameters & functionality SOT 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality 77 DC Parameters & functionality 77 Mechanical Stress (Note 2) Temperature Cycle -65°C/150°C 1000 Cycles Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data 0 Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/ Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except VPS1 3/ All VPS1 pins 2. All input and output pins All other input-output pins 1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 Pin combinations to be tested. a. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1 , or VCC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open. TERMINAL C R1 R2 S1 TERMINAL A REGULATED HIGH VOLTAGE SUPPLY S2 C1 DUT SOCKET SHORT TERMINAL B TERMINAL D Mil Std 883D Method 3015.7 Notice 8 R = 1.5kΩ C = 100pf CURRENT PROBE (NOTE 6) ONCE PER SOCKET ONCE PER BOARD 5K OHMS 35 uA + 10 VOLTS 1 3 0.1 uF 2 3 PIN SOT DEVICES: MAX 6012 / 6021 / 6025 / 6030 / 6041 / 6050/6018 Notes: +38 Volts for MAX6035 only. Apply jumper pin 6061/6062/6063/6064/6065/6066/6067/6068/6035 to +20V pin. +5.5V for the MAX6018. Max current = 35 uA /MAX6061-6068= 125uA / MAX6035= 100uA. DOCUMENT I.D. 06-5630 REVISION D MAXIM TITLE: BI Circuit (MAX6012/6021/6025/6030/6041/6050/6018/6061/6062/6063/6064/6065/6066/6067/606 8/6035) PAGE 2 OF 3