5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 PACKAGE DIMENSIONS Note: 1.All Dimensions are in millimeters. 2.Tolerance is ±0.25mm(0.010 ") Unless otherwise specified. 3.Protruded resin under flange is 1.5mm(0.059 ") max. 4.Lead spacing is measured where the leads emerge from the package. 5.Specification are subject to change without notice 6.highlight <-500V the led can withstand the max static level when assembling or operation. DRAWING NO. : DS-35-04-0636 DATE : 2005-10-19 Page : 1 HD-R/RD013 5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 FEATURES * 5.0mm DIA LED LAMP * LOW POWER CONSUMPTION. * I.C. COMPATIBLE. * THREE CHIPS ARE MATCHED FOR UNIFORM LIGHT OUTPUT. * LONG LIFE-SOLIDSTATE RELIABILITY. * FULL COLOR AND HIGH CONTRAST LAMP CHIP MATERIALS * Dice Material : AlGaInP/GaAs & GaInN/GaN & GaInN/GaN * Light Color : FULL COLOR(SUPER RED & ULTRA PURE GREEN & ULTRA BLUE) * Lens Color : WATER CLEAR ABSOLUTE MAXIMUM RATING:(Ta＝25°C) ULTRA ULTRA PURE ULTRA RED GREEN BLUE UNIT PAD Power Dissipation Per Chip mW 80 130 120 VR Reverse Voltage Per Chip V 5 5 5 IF Average Forward Current Per Chip mA 30 30 30 IPF Peak Forward Current Per Chip (Duty=0.1,1KHZ) 60 mA 120 70 Derating Linear From 25°C Per Chip mA/°C 0.4 0.4 0.4 Topr Operating Temperature Range -25°C to 85°C Tstg Storage Temperature Range -40°C to 85°C Lead Soldering Temperature｛1.6mm(0.063 inch) From Body｝260°C±5°C For 5 Seconds SYMBOL DESCRIPTION ELECTRO-OPTICAL CHARACTERISTICS:(Ta=25°C) SYMBOL VF IR λD ∆λ 2θ1/2 IV PARAMETER TEST CONDITION Ultra Red Forward Voltage IF=20mAUltra Pure Green Ultra Blue Ultra Red Reverse Current VR=5V Ultra Pure Green Ultra Blue Ultra Red Dominant Wavelength IF=20mA Ultra Pure Green Ultra Blue Ultra Red Spectral Line Half-Width IF=20mA Ultra Pure Green Ultra Blue Ultra Red Half Intensity Angle IF=20mA Ultra Pure Green Ultra Blue Ultra Red Ultra Pure Green Luminous Intensity IF=20mA Ultra Blue DRAWING NO. : DS-35-04-0636 MIN. 1500 4200 1100 TYP. MAX. UNIT 2.0 2.6 V 3.5 4.0 V 3.5 4.0 V 100 µA 100 µA 100 µA 625 nm 525 nm 460 nm 20 nm 22 nm 30 nm 40 deg 40 deg 40 deg 2100 mcd 5800 mcd 1500 mcd DATE : 2005-10-19 Page : 2 HD-R/RD014 5.0 mm DIA LED LAMP 540R2GBC-CC DRAWING NO. : DS-35-04-0636 DATE : 2005-10-19 REV:A / 0 Page : 3 5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 ySOLDERING METHOD DIP SOLDERING SOLDERING CONDITIONS Bath temperature: 260±5℃ Immersion time: with 5 sec REMARK y Solder no closer than 3mm from the base of the package y Using soldering flux,” RESIN FLUX” is recommended. y During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260℃ or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip. s e i r w d a e L l e n a P (Fig.1) 2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package. s e i r w d a e L te hc gn ia lr sa e al c e v a e L (Fig.2) DRAWING NO. : DS-35-04-0636 DATE : 2005-10-19 Page : 4 5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3). d r a o b C P （Fig.3 ） jig 4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature. yLED MOUNTING METHOD 1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4) case pc board Fig.4 DRAWING NO. : DS-35-04-0636 DATE : 2005-10-19 Page : 5 5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs. Tube Stand-off Fig.5 Fig.6 yFORMED LEAD 1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7) m m 2 7 . g i F 2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8) DRAWING NO. : DS-35-04-0636 DATE : 2005-10-19 Page : 6 5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 yLEAD STRENGTH 1) Bend strength Do not bend the lead more than twice. (Fig.9) Fig.9 2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10) OK！ 1Kg Fig.10 yHANDLING PRECAUTIONS Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling. yCHEMICAL RESISTANCE 1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT ADAPTABILITY Freon TE ⊙ Chlorothene ╳ Isopropyl Alcohol ⊙ Thinner ╳ Acetone ╳ Trichloroethylene ╳ ⊙--Usable ╳--Do not use. DRAWING NO. : DS-35-04-0636 NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by DATE : 2005-10-19 Page : 7 5.0 mm DIA LED LAMP 540R2GBC-CC REV:A / 0 Experiment Item: Item OPERATION LIFE HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING THERMAL SHOCK SOLDER RESISTANCE SOLDERABILITY Test Condition Lamp & IR Ta： 25±5℃ IF= 20mA RH：＜=60%RH ① DYNAMIC:100mA 1ms 1/10 duty ② STATIC STATE: IF＝20mA TEST TIME: 168HRS（-24HRS，+24HRS） 500HRS（-24HRS，+24HRS） 1000HRS（-24HRS，+72HRS） Reference Standard MIL-STD-750：1026 MIL-STD-883：1005 JIS C 7021：B-1 Ta： 65℃±5℃ RH： 90〜95%RH TEST TIME：240HRS±2HRS MIL-STD-202：103B JIS C 7021 ：B-1 105℃〜25℃〜-55℃〜25℃ 30min 5min 30min 5min 10CYCLES MIL-STD-202：107D MIL-STD-750：1051 MIL-STD-883：1010 JIS C 7021 ：A-4 105℃±5℃〜-55℃±5℃ 10min 10min 10CYCLES T，sol：260℃±5℃ DWELL TIME：10±lsec T，sol：230℃±5℃ DWELL TIME：5±lsec DRAWING NO. : DS-35-04-0636 MIL-STD-202：107D MIL-STD-750：1051 MIL-SYD-883：1011 MIL-STD-202：210A MIL-STD-750-2031 JIS C 7021：A-1 MIL-STD-202：208D MIL-STD-750：2026 MIL-STD-883：2003 JIS C 7021 ：A-2 DATE : 2005-10-19 Page : 8