Kemet C1812C104BAGACAUTO C0g dielectric, 10 - 250 vdc (automotive grade) Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Overview
KEMET’s Automotive Grade Series surface mount
capacitors in C0G dielectric are suited for a variety of
applications requiring proven, reliable performance in
harsh environments. Whether under-hood or in-cabin,
these devices emphasize the vital and robust nature
of capacitors required for mission and safety critical
automotive circuits. Stricter testing protocol and inspection
criteria have been established for automotive grade
products in recognition of potentially harsh environmental
conditions. KEMET automotive grade series capacitors
meet the demanding Automotive Electronics Council's
AEC–Q200 qualification requirements.
C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.” The Electronics
Industries Alliance (EIA) characterizes C0G dielectric as
a Class I material. Components of this classification are
temperature compensating and are suited for resonant circuit
applications or those where Q and stability of capacitance
characteristics are required. C0G exhibits no change in
capacitance with respect to time and voltage and boasts a
negligible change in capacitance with reference to ambient
temperature. Capacitance change is limited to ±30 ppm/ºC
from −55°C to +125°C.
Benefits
•
•
•
•
AEC–Q200 automotive qualified
−55°C to +125°C operating temperature range
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0402, 0603, 0805, 1206, 1210, 1812, and
2220 case sizes
• DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, 200 V,
and 250 V
• Capacitance offerings ranging from 0.5 pF up to 0.47 μF
• Available capacitance tolerances of ±0.10 pF, ±0.25 pF, ±0.5
pF, ±1%, ±2%, ±5%, ±10%, and ±20%
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Ordering Information
C
Ceramic
1206
Case Size Specification/
(L" x W")
Series
0402
0603
0805
1206
1210
1812
2220
1
2
C
C = Standard
104
Capacitance
Code (pF)
Two significant
digits + number
of zeros
Use 9 for
1.0 – 9.9 pF
Use 8 for
0.5 – .99 pF
ex. 2.2 pF = 229
ex. 0.5 pF = 508
J
3
G
A
C
AUTO
Failure Rate/
Packaging/Grade
Capacitance Rated Voltage
Dielectric
Termination Finish2
(C-Spec)
Tolerance1
(VDC)
Design
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
G = C0G
A = N/A
C = 100% Matte Sn
See "Packaging
C-Spec Ordering
Options Table"
below
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type1
7" Reel
13" Reel/Unmarked
7" Reel/Unmarked/2 mm pitch2
13" Reel/Unmarked/2 mm pitch2
Packaging/Grade
Ordering Code (C-Spec)3
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
2
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking".
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
1
Benefits cont'd
•
•
•
•
•
No piezoelectric noise
Extremely low ESR and ESL
High thermal stability
High ripple current capability
Preferred capacitance solution at line frequencies and into
the MHz range
• No capacitance change with respect to applied rated DC
voltage
• Negligible capacitance change with respect to temperature
from −55°C to +125°C
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb plated termination finish option available upon
request (5% minimum)
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling,
bypass, filtering, transient voltage suppression, blocking and energy storage.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,
“AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive
grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review
by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers
and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are
limited (see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
1
1
Customer Notification due to:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
1
2
3
4
5
KEMET assigned
●
●
●
●
●
AUTO
○
1
1
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA Size
Code
Metric Size
Code
0402
1005
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
2220
5650
L
Length
W
Width
1.00 (0.040)
±0.05 (0.002)
1.60 (0.063)
±0.15 (0.006)
2.00 (0.079)
±0.20 (0.008)
3.20 (0.126)
±0.20 (0.008)
3.20 (0.126)
±0.20 (.008)
4.50 (0.177)
±0.30 (0.012)
5.70 (0.224)
±0.40 (0.016)
0.50 (0.020)
±0.05 (0.002)
0.80 (0.032)
±0.15 (0.006)
1.25 (0.049)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
3.20 (0.126)
±0.30 (0.012)
5.00 (0.197)
±0.40 (0.016)
T
Thickness
B
Bandwidth
See Table 2 for
Thickness
0.30 (0.012)
±0.10 (0.004)
0.35 (0.014)
±0.15 (0.006)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.50 (0.02)
±0.25 (0.010)
0.60 (0.024)
±0.35 (0.014)
0.60 (0.024)
±0.35 (0.014)
S
Separation
Minimum
Mounting
Technique
0.30 (0.012)
Solder Reflow
Only
0.70 (0.028)
0.75 (0.030)
N/A
Solder Wave or
Solder Reflow
Solder Reflow
Only
Qualification/Certification
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website @www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
Dissipation Factor (DF) Maximum Limit at 25ºC
3
Insulation Resistance (IR) Limit at 25°C
−55°C to +125°C ±30 ppm/ºC
0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50 mA)
0.1%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
1
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric
Rated DC Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
C0G
All
All
0.5
0.3% or ±0.25 pF Insulation
Resistance
10% of Initial
Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 0805 Case Sizes)
250
A
200
2
100
1
50
5
25
3
16
4
10
200
8
250
100
A
200
50
2
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CH
CH
CH
CH
CH
CH
CH
CH
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CH
CH
CH
CH
CH
CH
CH
CH
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
DG
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
DG
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DF
DG
DG
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DP
DP
DP
DE
DE
DE
DE
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DF
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DN
DN
DP
DP
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DE
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DN
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DN
DP
DP
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DN
DP
DP
DP
DP
DP
DP
DG
DG
DG
DG
Rated Voltage (VDC)
250
10
16
25
50
100
200
250
10
16
25
50
100
200
250
BB
BB
BB
BD
BD
200
BB
BB
BB
BD
BD
100
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
50
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
1
25
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
5
16
Cap Code
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
BB
3
10
Capacitance
508 & 758 B C D
BB
109 – 919* B C D
BB
100 – 910*
F G J K M BB
101
F G J K M BB
111 – 181*
F G J K M BB
201 – 271*
F G J K M BB
301
F G J K M BB
331
F G J K M BB
361
F G J K M BB
391
F G J K M BB
431
F G J K M BB
471
F G J K M BB
511 – 821*
F G J K M BB
911
F G J K M BB
102
F G J K M BB
112
F G J K M BB
122
F G J K M BB
132
F G J K M BB
152
F G J K M BB
162
F G J K M BB
182
F G J K M BB
202
F G J K M BB
222
F G J K M BB
242
F G J K M
272
F G J K M
302
F G J K M
332
F G J K M
362
F G J K M
392
F G J K M
432
F G J K M
472
F G J K M
512
F G J K M
562
F G J K M
622
F G J K M
682
F G J K M
752
F G J K M
822
F G J K M
912
F G J K M
103
F G J K M
123
F G J K M
153
F G J K M
183
F G J K M
223
F G J K M
273
F G J K M
333
F G J K M
393
F G J K M
473
F G J K M
4
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
Capacitance Tolerance
0.50 & 0.75 pF
1.0 – 9.1 pF*
10 – 91 pF*
100 pF
110 – 180 pF*
200 – 270 pF*
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 – 820 pF*
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
8
100
Rated Voltage (VDC)
C0805C
A
50
2
25
1
16
5
10
3
250
4
25
Cap
Code
C0603C
8
16
Capacitance
C0402C
Voltage Code
10
Case Size/Series
Voltage Code
8
4
3
5
1
2
A
8
4
3
5
1
2
A
8
4
3
5
1
2
A
Case Size/Series
C0402C
C0603C
C0805C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1206 – 2220 Case Sizes)
Case Size/Series
200
250
50
100
200
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GD
GB
GB
GH
GH
GB
GB
GJ
GJ
JE
JE
JB
GB
GH
GB
GB
JE
JE
JB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GK
GH
GG
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
GD
GH
GN
GB GB
GB GB
GB GB
GB GB
GB GB
GB GB
GB GB
GB GB
GD GD
GD GD
GK GK
GM GM
GM GM
JE
JE
JE
JE
JE
JE
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JD
JG
JG
JE
JE
JE
JE
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JD
JD
JF
JG
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JB
JD
JD
JG
JG
JL
250
50
100
200
50
GB
GB
GB
GB
GB
GB
GB
GB
GB
GB
200
1
100
5
2
100
3
1
50
4
5
A
5
1
2
A
5
1
2
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
EB
EB
EB
EB
EE
EB
EB
EC
EC
ED
ED
ED
ED
EC
EC
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
ED
EF
EH
EH
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FJ
FK
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FJ
FK
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FB
FC
FE
FG
FH
FJ
FK
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FF
FB
FB
FB
FB
FC
FC
FE
FF
FG
FG
FB
FB
FB
FB
FB
FB
FB
FC
FF
FG
FH
FM
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FB
FC
FC
FC
FC
FC
FF
FF
FF
FF
FG
FG
FG
FG
FG
FC
FC
FE
FF
FB
FB
FB
FB
FB
FB
FE
FE
FF
FG
FH
FM
FB
FB
FB
FB
FB
FB
FB
FC
FE
FE
FE
FE
FG
FC
FC
FF
FF
FF
FF
FF
FG
FG
FG
FB
FB
FB
FB
FB
FB
FB
FC
FC
FF
FG
FH
FH
FJ
FB
FB
FB
FB
FB
FB
FB
FC
FE
FE
FE
FE
FG
FC
FC
FF
FF
FF
FF
FF
FG
FG
FG
FB
FB
FB
FB
FB
FB
FB
FC
FC
FF
FG
FH
FH
FJ
200
8
A
100
Voltage Code
2
50
Rated Voltage (VDC)
1
25
EB
EB
EB
EB
EE
EB
EB
EC
EC
ED
ED
ED
EE
EC
EC
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
ED
EF
EH
EH
5
16
EB
EB
EB
EB
EB
EB
EB
EC
ED
ED
ED
ED
EE
EC
EC
EC
EE
EE
EF
EC
EC
ED
ED
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EE
EE
EH
EH
A
10
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EE
EE
EF
EH
EH
2
250
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
1
250
200
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EB
EC
EC
EC
EC
EC
EC
ED
ED
EB
EB
EB
EC
EC
ED
EB
EB
EB
EB
EB
EB
EC
EC
ED
EF
EH
EH
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
F G
5
200
D
3
250
100
C
4
200
50
EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EB
M EC
M EC
M EC
M EC
M EC
M EC
M ED
M ED
M EB
M EB
M EB
M EC
M EC
M ED
M EB
M EB
M EB
M EB
M EB
M EB
M EC
M EC
M ED
M EF
M EH
M EH
M
M
M
M
M
M
M
M
100
Cap Code
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
50
Cap
B
25
109 – 919*
100 – 910*
101 – 431*
471 – 911*
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
16
1.0 – 9.1 pF*
10 – 91 pF*
100 – 430 pF*
470 – 910 pF*
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
39,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
0.10 µF
0.12 µF
0.15 µF
0.18 µF
0.22 µF
0.27 µF
0.33 µF
0.39 µF
0.47 µF
10
Capacitance Tolerance
C2220C
8
100
Rated Voltage (VDC)
C1812C
A
50
2
25
1
16
5
10
3
250
4
25
Cap Code
C1210C
8
16
Cap
C1206C
Voltage Code
10
Case Size/Series
2
A
8
4
3
5
1
2
C1206C
C1210C
C1812C
C2220C
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (configuration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
BD
CF
CH
DN
DP
DE
DF
DG
EB
EC
ED
EE
EF
EH
FB
FC
FE
FF
FG
FH
FM
FJ
FK
GB
GD
GH
GG
GK
GJ
GN
GM
JB
JD
JE
JF
JG
JL
0402
0402
0603
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
1812
1812
1812
1812
2220
2220
2220
2220
2220
2220
0.50 ± 0.05
0.55 ± 0.05
0.80 ± 0.07
0.85 ± 0.07
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.20 ± 0.15
1.60 ± 0.20
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
1.85 ± 0.20
2.10 ± 0.20
1.00 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.10
1.60 ± 0.20
1.70 ± 0.15
1.70 ± 0.20
2.00 ± 0.20
1.00 ± 0.15
1.30 ± 0.15
1.40 ± 0.15
1.50 ± 0.15
1.70 ± 0.15
2.00 ± 0.20
10,000
10,000
4,000
4,000
4,000
4,000
0
0
0
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
50,000
50,000
15,000
10,000
15,000
15,000
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
2,500
2,500
2,500
4,000
4,000
2,500
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
2,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
500
1,000
1,000
1,000
1,000
1,000
500
0
0
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
8,000
4,000
4,000
4,000
4,000
4,000
4,000
4,000
2,000
4,000
4,000
4,000
4,000
4,000
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
Paper Quantity
1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1
If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
0402
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
1005
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
12101
3225
1.50
1.60
2.90
5.60
3.90
1.40
1.40
2.80
4.70
3.30
1.30
1.20
2.70
4.00
3.00
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
1
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Termination Finish
SnPb
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
100°C
150°C
60 – 120 seconds
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
tL
Tsmax
Tsmin
25
ts
25ºC to Peak
Time
Time 25°C to Peak
6 minutes
8 minutes
Temperature
maximum
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Construction
Detailed Cross Section
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Dielectric Material
(CaZrO3)
Dielectric
Material (CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Capacitor Marking (Optional):
Laser marking option is not available on:
•
•
•
•
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B
o.
1
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Bending
Radius
R
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1022_C0G_AUTO_SMD • 1/9/2017
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
KEMET Electronic Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
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