1.8V to 3.3V, Micro-Power, ±15kV ESD, +125°C, Slew Rate Limited, RS-485/RS-422 Transceivers ISL32600E, ISL32601E, ISL32602E, ISL32603E The Intersil ISL32600E, ISL32601E, ISL32602E and Features ISL32603E are ±15kV IEC61000 ESD protected, micro power, wide supply range transceivers for differential communication. The ISL32600E and ISL32601E operate with VCC ≥ 2.7V and have maximum supply currents as low as 100µA with both the transmitter (Tx) and receiver (Rx) enabled. The ISL32602E and ISL32603E operate with supply voltages as low as 1.8V. These transceivers have very low bus currents, so they present less than a “1/8 unit load” to the bus. This allows more than 256 transmitters on the network, without violating the RS-485 specification’s 32 unit load maximum. • Single 1.8V, 3V, or 3.3V Supply Rx inputs feature symmetrical switching thresholds, and up to 65mV of hysteresis, to improve noise immunity and to reduce duty cycle distortion in the presence of slow moving input signals (see Figure 9). The Rx input common mode range is the full -7V to +12V RS-485 range for supply voltages ≥ 3V. • Up to 65mV Hysteresis for Improved Noise Immunity Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes. • -7V to +12V Common Mode Input/Output Voltage Range (VCC ≥ 3V) This transceiver family utilizes slew rate limited drivers, which reduce EMI, and minimize reflections from improperly terminated transmission lines, or unterminated stubs in multidrop and multipoint applications. • Half and Full Duplex Pinouts; Three State Rx and Tx Outputs The ISL32600E and ISL32602E are configured for full duplex (separate Rx input and Tx output pins) applications. The half duplex versions multiplex the Rx inputs and Tx outputs to allow transceivers with output disable functions in 8 Ld packages. See Table 1 for a summary of each device’s features. Applications • Low Supply Currents . . . . . . . ISL32601E, 100µA (Max) @ 3V . . . . . . ISL32603E, 150µA (Max) @ 1.8V - Ultra Low Shutdown Supply Current . . . . . . . . . . . . . . 10nA • IEC61000 ESD Protection on RS-485 I/O Pins . . . . . . ±15kV - Class 3 ESD Levels on all Other Pins . . . . . . . . . >8kV HBM • Symmetrical Switching Thresholds for Less Duty Cycle Distortion (See Figure 9) • Data Rates from 128kbps to 460kbps • Specified for +125°C Operation • 1/8 Unit Load Allows up to 256 Devices on the Bus • 5V Tolerant Logic Inputs • Tiny MSOP Packages Consume 50% Less Board Space • Differential Sensor Interfaces • Process Control Networks • Security Camera Networks • Building Environmental Control/Lighting Systems 10m ISL3172E DYNAMIC (9.6kbps) 25°C, RD = ∞, CD = 50pF ISL3260XE DYNAMIC (9.6kbps) 100µ ICC (A) ISL3172E STATIC ICC (A) DYNAMIC (256kbps) DE = VCC, RE = GND 1m DYNAMIC (128kbps) 1m ISL3260XE STATIC STATIC DE = VCC, RE = GND 10µ 2.7 2.8 2.9 3 25°C, RD = ∞, CD = 50pF 3.1 3.2 3.3 3.4 3.5 3.6 SUPPLY VOLTAGE (V) 1 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 SUPPLY VOLTAGE (V) FIGURE 1. ISL32600E AND ISL32601E HAVE A 9.6kbps OPERATING ICC LOWER THAN THE STATIC ICC OF MANY EXISTING 3V TRANSCEIVERS June 22, 2012 FN7967.0 100µ 1.8 FIGURE 2. ISL32602E AND ISL32603E WITH VCC = 1.8V REDUCE OPERATING ICC BY A FACTOR OF 25 TO 40, COMPARED WITH ICC AT VCC = 3.3V CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2012. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL32600E, ISL32601E, ISL32602E, ISL32603E TABLE 1. SUMMARY OF FEATURES PART NUMBER SUPPLY RANGE (V) HALF/FULL DUPLEX DATA RATE (kbps) SLEW-RATE LIMITED? HOT PLUG? # DEVICES ON BUS RX/TX ENABLE? QUIESCENT ICC (µA) LOW POWER SHUTDOWN? PIN COUNT ISL32600E 2.7 to 3.6 FULL 128 - 256 YES YES 256 YES 60 @ 3V YES 10, 14 ISL32601E 2.7 to 3.6 HALF 128 - 256 YES YES 256 YES 60 @ 3V YES 8 ISL32602E 1.8 to 3.6 FULL 256 - 460 YES YES 256 YES 105 @ 1.8V YES 10, 14 ISL32603E 1.8 to 3.6 HALF 256 - 460 YES YES 256 YES 105 @ 1.8V YES 8 Pin Configurations ISL32600E, ISL32602E (10 LD MSOP) TOP VIEW ISL32601E, ISL32603E (8 LD MSOP, SOIC) TOP VIEW RO 1 R 8 VCC RO 1 RE 2 7 B/Z RE 2 DE 3 6 A/Y DE 3 5 GND DI 4 DI 4 D R 10 VCC 9 A 8 B D GND 5 7 Z 6 Y ISL32600E, ISL32602E (14 LD SOIC) TOP VIEW 14 VCC NC 1 RO 2 RE 3 13 NC R 11 B DE 4 DI 5 12 A D 10 Z GND 6 9 Y GND 7 8 NC Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL32600EFBZ 32600EFBZ -40 to +125 14 Ld SOIC M14.15 ISL32600EFUZ 32600 -40 to +125 10 Ld MSOP M10.118 ISL32601EFBZ 32601 EFBZ -40 to +125 8 Ld SOIC M8.15 ISL32601EFUZ 32601 -40 to +125 8 Ld MSOP M8.118 ISL32602EFBZ 32602EFBZ -40 to +125 14 Ld SOIC M14.15 ISL32602EFUZ 32602 -40 to +125 10 Ld MSOP M10.118 ISL32603EFBZ 32603 EFBZ -40 to +125 8 Ld SOIC M8.15 ISL32603EFUZ 32603 -40 to +125 8 Ld MSOP M8.118 NOTES: 1. Add “-T” (full reel) or -T7A (250 piece reel) suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32600E, ISL32601E, ISL32602E, ISL32603E. For more information on MSL please see tech brief TB363. 2 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Truth Tables Truth Tables (continued) TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS RE DE DI Z Y X 1 1 0 1 X 1 0 1 0 0 0 X High-Z High-Z 1 0 X High-Z * High-Z * NOTE: *Shutdown Mode (See Note 11). OUTPUT RE DE Half Duplex DE Full Duplex A-B RO 0 0 X ≥ 0.2V 1 0 0 X ≤ -0.2V 0 0 0 X Inputs Open 1 1 0 0 X High-Z * 1 1 1 X High-Z NOTE: *Shutdown Mode (See Note 11). Pin Descriptions PIN 8 LD 10 LD 14 LD PACKAGE PACKAGE PACKAGE FUNCTION RO 1 1 2 Receiver output: If A-B ≥ 200mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating). RE 2 2 3 Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE directly to GND. DE 3 3 4 Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the Tx enable function isn’t required, connect DE to VCC. DI 4 4 5 Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND 5 5 6, 7 A/Y 6 - - ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z 7 - - ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. A - 9 12 ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input. B - 8 11 ±15kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input. Y - 6 9 ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output. Z - 7 10 ±15kV IEC61000 ESD Protected RS-485/422 level, inverting driver output. VCC 8 10 14 System power supply input (2.7V to 3.6V for ISL32600E and ISL32601E; 1.8V to 3.6V for ISL32602E and ISL32603E). NC - - 1, 8, 13 3 Ground connection. No Internal Connection. FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Typical Operating Circuits HALF DUPLEX NETWORK USING ISL32603E +1.8V +1.8V + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R D DI 4 2 RE B/Z 7 7 B/Z DE 3 3 DE A/Y 6 6 A/Y RE 2 4 DI GND GND 5 5 NOTE 14 RO 1 R D } FULL DUPLEX NETWORK USING ISL32600E (PIN NUMBERS FOR SOIC) +3.3V + 14 VCC 2 RO R A 12 0.1µF +3.3V 0.1µF RT + 14 VCC 9 Y B 11 D 10 Z 3 RE DE 4 RE 3 4 DE 5 DI DI 5 Z 10 Y 9 D GND 6, 7 4 RT 11 B R 12 A } NOTE 14 RO 2 GND 6, 7 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Absolute Maximum Ratings Thermal Information VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Input/Output Voltages A, B, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V A/Y, B/Z, Y, Z (VCC = 0V or ≥ 3V) . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V A/Y, B/Z, Y, Z (1.8V ≤ VCC < 3V) . . . . . . . . . . . . . . . . . . . . . . . -8V to +11V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Short Circuit Duration Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indeterminate ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Latch-up (per JESD78, Level 2, Class A) . . . . . . . . . . . . . . . . . . . . . . +125°C Thermal Resistance (Typical, Notes 4, 5) θJA (°C/W) θJC (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . 105 47 8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . 140 40 10 Ld MSOP Package . . . . . . . . . . . . . . . . . . 160 59 14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . 128 39 Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Recommended Operating Conditions (continued) Supply Voltage Range ISL32600E, ISL32601E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 3.3V ISL32602E, ISL32603E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 3.3V Differential Load Resistance ISL32600E, ISL32601E . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60Ω or 120Ω ISL32602E, ISL32603E . . . . . . . . . . . . . . . ≥10kΩ @ 1.8V; 120Ω @ 3.3V Common Mode Range ISL32600E, ISL32601E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V ISL32602E, ISL32603E VCC = 1.8V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to +2V VCC = 3.3V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to +12V Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For θJC, the “case temp” location is taken at the package top center. Electrical Specifications ISL32600E, ISL32601E: Test Conditions: VCC = 2.7V to 3.6V; Typicals are at VCC = 3V, TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) PARAMETER TEMP (°C) MIN (Note 15) TYP MAX (Note 15) UNITS RL = 100Ω (RS-422) (Figure 3A, VCC ≥ 3.15V) Full 1.95 2.1 - V RL = 54Ω (RS-485) (Figure 3A) VCC = 2.7V Full 1.2 1.5 VCC V VCC ≥ 3V SYMBOL TEST CONDITIONS DC CHARACTERISTICS Driver Differential VOUT VOD Change in Magnitude of Driver Differential VOUT for Complementary Output States Full 1.4 1.7 VCC V No Load Full - - VCC V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B, VCC ≥ 3V) Full 1.3 - - V ΔVOD RL = 54Ω or 100Ω (Figure 3A) Full - 0.01 0.2 V Driver Common-Mode VOUT VOC RL = 54Ω or 100Ω (Figure 3A) Full - - 3 V Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 54Ω or 100Ω (Figure 3A) Full - 0.01 0.2 V Output Leakage Current (Y, Z) (Full Duplex Versions Only) IOZD DE = 0V, VCC = 0V (-7V ≤ VIN ≤ 12V) or 2.7V ≤ VCC ≤ 3.6V VIN = 12V (VCC ≥ 3V) Full - 3 60 µA VIN = 10V (VCC = 2.7V) Full - 3 60 µA VIN = -7V Full -30 -10 - µA Driver Short-Circuit Current, VO = High or Low IOSD DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 8) Full - - ±250 mA Logic Input High Voltage VIH DI, DE, RE Full 2 - - V Logic Input Low Voltage VIL DI, DE, RE Full - - 0.7 V Logic Input Current IIN1 DI = DE = RE = 0V or VCC (Note 14) Full -1 - 1 µA 5 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Electrical Specifications ISL32600E, ISL32601E: Test Conditions: VCC = 2.7V to 3.6V; Typicals are at VCC = 3V, TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued) PARAMETER SYMBOL Input Current (A, B, A/Y, B/Z) IIN2 TEMP (°C) MIN (Note 15) TYP MAX (Note 15) UNITS VIN = 12V (VCC ≥ 2.7V for A, B) Full - 80 125 µA VIN = 12V (VCC ≥ 3V for A/Y, B/Z) Full - 80 125 µA VIN = 10V (VCC = 2.7V for A/Y, B/Z) Full - 80 125 µA VIN = -7V Full -100 -50 - µA TEST CONDITIONS DE = 0V, VCC = 0V (-7V ≤ VIN ≤ 12V) or 2.7V ≤ VCC ≤ 3.6V Receiver Differential Threshold Voltage V TH -7V ≤ VCM ≤ 12V Full -200 0 200 mV Receiver Input Hysteresis ΔV TH -7V ≤ VCM ≤ 12V Full - 40 - mV Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full VCC - 0.5 - - V Receiver Output Low Voltage VOL IO = 4mA, VID = -200mV Full - - 0.4 V Three-State (high impedance) Receiver Output Current IOZR 0V ≤ VO ≤ VCC, RE = VCC Full -1 - 1 µA Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full - 30 ±60 mA VCC = 3V Full - 60 100 µA VCC = 3.6V Full - 70 120 µA DI = 0V or VCC, Rx Only VCC = 3V (DE = 0V, RE = 0V) VCC = 3.6V Full - 42 65 µA Full - 46 80 µA DE = 0V, RE = VCC, DI = 0V or VCC Full - 0.01 1 µA IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV IEC61000-4-2, Contact Discharge Method 25 - ±8 - kV Human Body Model, From Bus Pins to GND 25 - ±15 - kV HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV Machine Model 25 - 400 - V VCC = 2.7V Full 128 - - kbps VCC ≥ 3V Full 256 - - kbps SUPPLY CURRENT No-Load Supply Current (Note 7) ICC Shutdown Supply Current ISHDN DI = 0V or VCC, DE = VCC, RE = 0V or VCC ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) All Pins SWITCHING CHARACTERISTICS Maximum Data Rate fMAX RDIFF = 54Ω, (Figures 6, 7) Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 4) Full - 340 600 ns Driver Differential Output Skew tSKEW RDIFF = 54Ω, CD = 50pF (Figure 4) Full - 1 30 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 54Ω, CD = 50pF (Figure 4) Full 200 400 1000 ns Driver Enable to Output High tZH RL = 1kΩ, CL = 50pF, SW = GND (Figure 5), (Note 9) Full - - 1000 ns Driver Enable to Output Low tZL RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5), (Note 9) Full - - 1000 ns Driver Disable from Output High tHZ RL = 1kΩ, CL = 50pF, SW = GND (Figure 5) Full - - 150 ns Driver Disable from Output Low tLZ RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5) Full - - 150 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 50pF, SW = GND (Figure 5), (Notes 11, 12) Full - - 10 µs 6 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Electrical Specifications ISL32600E, ISL32601E: Test Conditions: VCC = 2.7V to 3.6V; Typicals are at VCC = 3V, TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued) TEMP (°C) MIN (Note 15) TYP MAX (Note 15) UNITS RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5), (Notes 11, 12) Full - - 10 µs tSHDN (Note 11) Full 50 - 600 ns Receiver Input to Output Delay tPLH, tPHL (Figure 7) Full - 750 1300 ns Receiver Skew | tPLH - tPHL | tSKD (Figure 7) Full - 115 300 ns PARAMETER SYMBOL Driver Enable from Shutdown to Output Low tZL(SHDN) Time to Shutdown TEST CONDITIONS Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Note 10) Full - - 50 ns Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Note 10) Full - - 50 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) Full - 12 50 ns Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) Full - 13 50 ns Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Notes 11, 13) Full - - 12 µs Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Notes 11, 13) Full - - 12 µs NOTES: 6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 7. Supply current specification is valid for loaded drivers when DE = 0V. 8. Applies to peak current. See “Typical Performance Curves” starting on page 14 for more information. 9. When testing this parameter, keep RE = 0 to prevent the device from entering SHDN. 10. When testing this parameter, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 11. Devices are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns (1200ns if VCC=1.8V), the parts are guaranteed to have entered shutdown. See “Low Power Shutdown Mode” on page 13. 12. Keep RE = VCC, and set the DE signal low time >600ns (1200ns if VCC=1.8V) to ensure that the device enters SHDN. 13. Set the RE signal high time >600ns (1200ns if VCC=1.8V) to ensure that the device enters SHDN. 14. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” on page 3). 15. Compliance to data sheet limits is assured by one or more methods: production test, characterization and/or design. Electrical Specifications ISL32602E, ISL32603E: Test Conditions: VCC = 1.8V to 3.6V; Typicals are at VCC = 1.8V, TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS DC CHARACTERISTICS Driver Differential VOUT VOD Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT 7 RL = 100Ω (RS-422) (Figure 3A) VCC = 1.8V Full 0.8 0.9 VCC ≥ 3.15V - V V Full 1.95 2.25 - No Load, VCC = 1.8V Full 1.1 1.4 VCC RL = 54Ω (RS-485) (Figure 3A, VCC ≥ 3V) Full 1.5 1.95 - V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B, VCC ≥ 3V) Full 1.3 - - V ΔVOD RL = 100Ω (Figure 3A) Full - 0.01 0.2 V VOC RL = 100Ω (Figure 3A) Full - - 3 V FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Electrical Specifications ISL32602E, ISL32603E: Test Conditions: VCC = 1.8V to 3.6V; Typicals are at VCC = 1.8V, TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued) PARAMETER SYMBOL TEST CONDITIONS Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States ΔVOC RL = 100Ω (Figure 3A) Output Leakage Current (Y, Z) (Full Duplex Versions Only) IOZD DE = 0V, VCC = 0V (-7V ≤ VIN ≤ 12V) or 1.8V or 3V ≤ VCC ≤ 3.6V TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS Full - 0.01 0.2 V VOUT = 12V (VCC ≥ 3V) Full - 1 60 µA VOUT = 10V (VCC = 1.8V) Full - 1 60 µA VOUT = -7V Full -30 -10 - µA Driver Short-Circuit Current, VO = High or Low IOSD DE = VCC, -7V ≤ VY or VZ ≤ 12V (3.0V ≤ VCC ≤ 3.6V) or -7V ≤ VY or VZ ≤ 10V (VCC = 1.8V) (Note 8) Full - - ±250 mA Logic Input High Voltage VIH DI, DE, RE VCC ≥ 1.8V Full 1.26 - - V VCC ≥ 3V Full 2 - - V VCC ≥ 1.8V Full - - 0.4 V VCC ≥ 3V Full - - 0.8 V -1 - 1 µA Logic Input Low Voltage VIL DI, DE, RE Logic Input Current IIN1 DI = DE = RE = 0V or VCC (Note 14) Full Input Current (A, B, A/Y, B/Z) IIN2 DE = 0V, VCC = 0V (-7V ≤ VIN ≤ 12V) or 1.8V or 3V ≤ VCC ≤ 3.6V VIN = 12V (A, B Only) Full - 80 125 µA VIN = 12V (VCC ≥ 3V for A/Y, B/Z) Full - 80 125 µA VIN = 10V (VCC = 1.8V for A/Y, B/Z) Full - 80 125 µA VIN = -7V Full -100 -50 - µA Receiver Differential Threshold Voltage V TH -7V ≤ VY or VZ ≤ 2V at VCC = 1.8V or -7V ≤ VY or VZ ≤ 12V at VCC ≥ 3V Full -200 0 200 mV Receiver Input Hysteresis ΔV TH -7V ≤ VY or VZ ≤ 2V at VCC = 1.8V or -7V ≤ VY or VZ ≤ 12V at VCC ≥ 3V Full - 65 - mV Receiver Output High Voltage VOH IO = -1mA, VID = 200mV Full VCC - 0.4 - - V Receiver Output Low Voltage VOL IO = 2.2mA, VID = -200mV Full - - 0.4 V Three-State (high impedance) Receiver Output Current IOZR 0V ≤ VO ≤ VCC, RE = VCC Full -1 - 1 µA Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full - - ±60 mA VCC = 1.8V Full - 105 150 µA VCC = 3.6V Full - 150 350 µA DI = 0V or VCC, Rx Only VCC = 1.8V (DE = 0V, VCC = 3.6V RE = 0V) Full - 90 115 µA Full - 125 260 µA DE = 0V, RE = VCC, DI = 0V or VCC Full - - 1 µA IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV IEC61000-4-2, Contact Discharge Method 25 - ±8 - kV Human Body Model, From Bus Pins to GND 25 - ±15 - kV HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV Machine Model 25 - 400 - V SUPPLY CURRENT No-Load Supply Current (Note 7) ICC Shutdown Supply Current ISHDN DI = 0V or VCC, DE = VCC, RE = 0V or VCC ESD PERFORMANCE RS-485 Pins (A, Y, B, Z, A/Y, B/Z) All Pins 8 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Electrical Specifications ISL32602E, ISL32603E: Test Conditions: VCC = 1.8V to 3.6V; Typicals are at VCC = 1.8V, TA = +25°C; Unless Otherwise Specified. Boldface limits apply over the operating temperature range. (Note 6) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS SWITCHING CHARACTERISTICS Maximum Data Rate fMAX Driver Differential Output Delay tDD Driver Differential Output Skew tSKEW Driver Differential Rise or Fall Time tR, tF (Figures 6, 7) CD = 50pF (Figure 4) CD = 50pF (Figure 4) CD = 50pF (Figure 4) VCC = 1.8V, RDIFF = ∞ Full 256 - - kbps VCC ≥ 3V, RDIFF = 54Ω Full 460 - - kbps VCC = 1.8V, RDIFF = ∞ Full - 750 2600 ns VCC ≥ 3V, RDIFF = 54Ω Full - 350 1500 ns VCC = 1.8V, RDIFF = ∞ Full - 120 220 ns VCC ≥ 3V, RDIFF = 54Ω Full - 2 100 ns VCC = 1.8V, RDIFF = ∞ Full 150 1700 4500 ns VCC ≥ 3V, RDIFF = 54Ω Full 200 400 900 ns Driver Enable to Output High tZH RL = 1kΩ, CL = 50pF, SW = GND (Figure 5), (Note 9) Full - - 3000 ns Driver Enable to Output Low tZL RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5), (Note 9) Full - - 3000 ns Driver Disable from Output High tHZ RL = 1kΩ, CL = 50pF, SW = GND (Figure 5) Full - - 250 ns Driver Disable from Output Low tLZ RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5) Full - - 250 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 50pF, SW = GND (Figure 5), (Notes 11, 12) Full - - 3000 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 50pF, SW = VCC (Figure 5), (Notes 11, 12) Full - - 3000 ns tSHDN (Note 11) Full 50 500 1200 ns Receiver Input to Output Delay tPLH, tPHL (Figure 7) Full - 180 1000 ns Receiver Skew | tPLH - tPHL | tSKD (Figure 7) Full - 35 250 ns Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Note 10) Full - - 100 ns Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Note 10) Full - - 100 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) Full - - 75 ns Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) Full - - 75 ns Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 8), (Notes 11, 13) Full - - 5500 ns Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8), (Notes 11, 13) Full - - 5500 ns Time to Shutdown 9 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Test Circuits and Waveforms VCC RL/2 DE VCC Z DI Z DI VOD D 375Ω DE VOD D Y VCM RL = 60Ω -7V to +12V Y RL/2 VOC 375Ω FIGURE 3B. VOD WITH COMMON MODE LOAD FIGURE 3A. VOD AND VOC FIGURE 3. DC DRIVER TEST CIRCUITS VCC DI 50% 50% tDDLH tDDHL 0V DE VCC Z DI RDIFF D OUT (Z) VOH OUT (Y) VOL CD Y SIGNAL GENERATOR 90% DIFF OUT (Y - Z) +VOD 90% 10% 10% tR -VOD tF tSKEW = |tDDLH - tDDHL| FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE Z DI 1kΩ VCC D SIGNAL GENERATOR SW Y GND 50pF VCC DE NOTE 11 50% 0V tZH, tZH(SHDN) NOTE 11 PARAMETER OUTPUT RE DI SW tHZ Y/Z X 1/0 GND OUTPUT HIGH tHZ VOH - 0.25V 50% OUT (Y, Z) VOH 0V tLZ Y/Z X 0/1 VCC tZH Y/Z 0 (Note 9) 1/0 GND tZL, tZL(SHDN) NOTE 11 tZL Y/Z 0 (Note 9) 0/1 VCC OUT (Y, Z) tZH(SHDN) Y/Z 1 (Note 12) 1/0 GND tZL(SHDN) Y/Z 1 (Note 12) 0/1 VCC FIGURE 5A. TEST CIRCUIT 50% tLZ VCC 50% OUTPUT LOW VOL + 0.25V V OL FIGURE 5B. MEASUREMENT POINTS FIGURE 5. DRIVER ENABLE AND DISABLE TIMES 10 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Test Circuits and Waveforms (Continued) VCC DE DI VCC - Z 0V VOD 50pF RDIFF D DI Y + SIGNAL GENERATOR +VOD DIFF OUT (Y - Z) -VOD 0V FIGURE 6B. MEASUREMENT POINTS FIGURE 6A. TEST CIRCUIT FIGURE 6. DRIVER DATA RATE +1V RE GND 15pF B R A A 0V 0V RO -1V tPLH tPHL VCC SIGNAL GENERATOR 50% RO 50% 0V FIGURE 7B. MEASUREMENT POINTS FIGURE 7A. TEST CIRCUIT FIGURE 7. RECEIVER PROPAGATION DELAY AND DATA RATE RE GND B A R NOTE 11 1kΩ RO VCC SW SIGNAL GENERATOR GND VCC RE 50% 50% 0V 15pF tZH, tZH(SHDN) NOTE 11 PARAMETER DE A SW tHZ X +1.5V GND tLZ X -1.5V VCC tZH (Note 10) 0 +1.5V GND tZL (Note 10) 0 -1.5V VCC tZH(SHDN) (Note 13) 0 +1.5V GND tZL(SHDN) (Note 11) 0 -1.5V OUTPUT HIGH tHZ V VOH - 0.25V OH 1.5V RO 0V tZL, tZL(SHDN) NOTE 11 RO tLZ VCC 1.5V OUTPUT LOW VCC VOL + 0.25V V OL FIGURE 8B. MEASUREMENT POINTS FIGURE 8A. TEST CIRCUIT FIGURE 8. RECEIVER ENABLE AND DISABLE TIMES Application Information RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one-unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. 11 Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from -7V to +12V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. Receiver Features These devices utilize a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is better than ±200mV, as required by the RS-422 and RS-485 specifications. The symmetrical ±200mV switching thresholds FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E RECEIVER OUTPUT (V) RECEIVER INPUT (V) eliminate the duty cycle distortion that occurs on receivers with full fail safe (FFS) functionality and with slowly transitioning input signals (see Figure 9). FFS receiver switching points have a 1 A-B 0 -1 4 ISL3260XE 0 Driver Features These drivers are differential output devices that deliver at least 1.4V with VCC ≥ 3V across a 54Ω load (RS-485) and at least 1.95V with VCC ≥ 3.15V across a 100Ω load (RS-422). The 1.8V transmitters deliver a 1.1V unloaded, differential level. Drivers operate at data rates from 128kbps to 460kbps depending on the supply voltage - and they feature low propagation delay skews to maximize bit width. Driver outputs are slew rate limited to minimize EMI and to reduce reflections in unterminated or improperly terminated networks. All drivers are tri-statable via the active high DE input. There are no parasitic nor ESD diodes to VCC on the DI and DE inputs, so these inputs are tolerant of input voltages up to 5.5V, even with the ISL3260XE powered down (i.e., VCC = 0V). 4 ISL3172E 1.8V Operation 0 VCC = 3.3V, DATA RATE = 125kbps TIME (4µs/DIV) FIGURE 9. COMPARED WITH A FULL-FAILSAFE ISL3172E RECEIVER, THE SYMMETRICAL RX THRESHOLDS OF THE ISL3260XE DELIVER LESS OUTPUT DUTY CYCLE DISTORTION WHEN DRIVEN WITH SLOW INPUT SIGNALS negative offset, so the RO high time is naturally longer than the low time. The ISL3260XE’s larger receiver input sensitivity range enables an increase of the receiver input hysteresis. The 40mV to 65mV receiver hysteresis increases the noise immunity, which is a big advantage for noisy networks, or networks with slow bus transitions. Receiver input resistance of 96kΩ surpasses the RS-422 spec of 4kΩ and is eight times the RS-485 “Unit Load (UL)” requirement of 12kΩ minimum. Thus, these products are known as “one-eighth UL” transceivers and there can be up to 256 of these devices on a network while still complying with the RS-485 loading specification. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and -7V) at VCC = 3V, making them ideal for long networks where induced voltages and ground potential differences are realistic concerns. The positive CMR is limited to +2V when the ISL32602E or ISL32603E is operated with VCC = 1.8V. All the receivers include a “Fail-Safe if open” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating). Because the Rx is not full failsafe, terminated networks may require bus biasing resistors (pull-up on noninverting input, pull-down on inverting input) to preserve the bus idle state when the bus is not actively driven. Receivers operate at data rates from 128kbps to 460kbps depending on the supply voltage - and all receiver outputs are tri-statable via the active low RE input. There are no parasitic nor ESD diodes to VCC on the RE input, so it is tolerant of input voltages up to 5.5V, even with the ISL3260XE powered down (i.e., VCC = 0V). 12 The ISL32602E and ISL32603E are specifically designed to operate with supply voltages as low as 1.8V. Termination resistors should be avoided at this operating condition, and the unterminated driver is guaranteed to deliver a healthy 1.1V differential output voltage. This low supply voltage limits the +CMR to +2V, but the CMR increases as VCC increases. To get good 1.8V operation, the ISL32602E and ISL32603E have to run at a higher operating current. Thus, their ICC with VCC = 3.3V is considerably higher than the ICC of the ISL32600E and ISL32601E, which are optimized for low ICC at 3.3V (see Figures 1 and 2). Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-485 control lines (DE, RE) is unable to ensure that the RS-485 Tx and Rx outputs are kept disabled. If the equipment is connected to the bus, a driver activating prematurely during power up may crash the bus. To avoid this scenario, the ISL3260XE devices incorporate a “Hot Plug” function. During power up, circuitry monitoring VCC ensures that the Tx and Rx outputs remain disabled for a period of time, regardless of the state of DE and RE. This gives the processor/ASIC a chance to stabilize and drive the RS-485 control lines to the proper states. ESD Protection All pins on these devices include class 3 (>8kV) Human Body Model (HBM) ESD protection structures, but the RS-485 pins (driver outputs and receiver inputs) incorporate advanced structures allowing them to survive ESD events in excess of ±15kV HBM and ±15kV IEC61000. The RS-485 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the transceiver’s common mode range. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E IEC61000-4-2 Testing The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-485 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device’s RS-485 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-485 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc. so it is difficult to obtain repeatable results. The ISL3260XE RS-485 pins withstand ±15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. The ISL3260XE survive ±8kV contact discharges on the RS-485 pins. Data Rate, Cables, and Terminations RS-485/422 are intended for network lengths up to 4000’ (1220m), but the maximum system data rate decreases as the transmission length increases. The ISL32600E and ISL32601E operate at data rates up to 128kbps at the maximum (4000’) distance, or at data rates of 256kbps for cable lengths less than 3000’ (915m). The ISL32602E and ISL32603E, with VCC = 1.8V, are limited to 1000’ (305m) at 256kbps, or 2000’ (610m) at 128kbps. With VCC = 3.3V, the ISL32602E and ISL32603E deliver 460kbps over 2000’, 256kbps over 3000’, or 128kbps over 4000’ cables. Twisted pair is the cable of choice for RS-485/422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. Short networks using these transceivers need not be terminated, but terminations are recommended for 2.7V to 3.6V powered networks unless power dissipation is an overriding concern. Terminations are not recommended for 1.8V applications, due to the low drive available from those transmitters. main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. Terminated networks using the ISL3260XE may require bus biasing resistors (pull-up on noninverting input, pull-down on inverting input) to preserve the bus idle state when the bus is not actively driven. Without bus biasing, the termination resistor collapses the undriven, differential bus voltage to 0V, which is an undefined level to the ISL3260XE Rx. Bus biasing forces a few hundred milli-volt positive differential voltage on the undriven bus, which all RS-485/422 Rx interpret as a valid logic high. Built-In Driver Overload Protection As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. These devices meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The driver output stages incorporate short circuit current limiting circuitry that ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, these devices utilize a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. In the event of a major short circuit condition, these ICs also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops by about 20°C. If the condition persists, the thermal shutdown / re-enable cycle repeats until the fault is cleared. Receivers remain operational during thermal shutdown. Low Power Shutdown Mode These micro-power transceivers all use a fraction of the power required by their counterparts, but they also include a shutdown feature that reduces the already low quiescent ICC to a 10nA trickle. These devices enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 600ns (1200ns at VCC = 1.8V). Disabling both the driver and the receiver for less than 50ns guarantees that the transceiver will not enter shutdown. Note that most receiver and driver enable times increase when the transceiver enables from shutdown. Refer to Notes 9 through 13, at the end of the “Electrical Specification table” on page 7, for more information. In point-to-point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multi-driver) systems require that the 13 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Typical Performance Curves Specified VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise 30 RECEIVER OUTPUT CURRENT (mA) DIFFERENTIAL OUTPUT VOLTAGE (V) 2.9 2.7 RDIFF = 10kΩ 2.5 2.3 2.1 RDIFF = 100Ω 1.9 1.7 RDIFF = 54Ω 1.5 -40 -25 -10 5 20 35 50 65 80 95 20 VOL, +125°C 15 VOL, +85°C 10 5 0 -5 VOH, +85°C -10 VOH, +125°C -15 -20 110 125 VOL, +25°C 25 VOH, +25°C 0 0.5 TEMPERATURE (°C) FIGURE 10. ISL32600E, ISL32601E DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 10m 65 1.5 2.0 2.5 3.0 FIGURE 11. ISL32600E, ISL32601E RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 70 RE = 0V 1.0 RECEIVER OUTPUT VOLTAGE (V) RD = ∞, CD = 50pF DE = VCC, RE = 0V VCC = 3.3V 256kbps 60 VCC = 3.0V 50 45 128kbps DE = VCC VCC = 2.7V ICC (A) ICC (µA) 55 VCC = 3.3V 40 Tx AND Rx BOTH SWITCHING DE = 0V VCC = 3.0V 35 1m 9.6kbps VCC = 2.7V 30 -25 -10 5 20 35 50 65 80 95 100µ 2.7 110 125 2.8 TEMPERATURE (°C) DI 3 2 1 0 A-B -1 -2 RD = ∞ 3 2 1 0 TIME (10µs/DIV) FIGURE 14. ISL32600E, ISL32601E PERFORMANCE WITH VCC = 3V, 256kbps, 3000’ (915m) CAT 5 CABLE 14 3.1 3.2 3.3 3.4 3.5 3.6 FIGURE 13. ISL32600E, ISL32601E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES 3 RECEIVER OUTPUT (V) RECEIVER INPUTS (V) DRIVER INPUT (V) RECEIVER OUTPUT (V) RECEIVER INPUTS (V) 0 3.0 VCC (V) FIGURE 12. ISL32600E, ISL32601E STATIC SUPPLY CURRENT vs TEMPERATURE 3 2.9 DRIVER INPUT (V) 25 -40 0 DI 3 2 1 0 A-B -1 -2 RD = ∞ 3 2 1 0 TIME (20µs/DIV) FIGURE 15. ISL32600E, ISL32601E PERFORMANCE WITH VCC = 2.7V, 128kbps, 4000’ (1220m) CAT 5 CABLE FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Typical Performance Curves Specified (Continued) VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise 3.0 400 RD = 54Ω, CD = 50pF RD = 54Ω, CD = 50pF PROPAGATION DELAY (ns) 390 2.5 380 2.0 SKEW (ns) 370 360 1.5 1.0 350 tDDLH 0.5 340 tDDHL 330 -40 -25 -10 5 tSKEW = |tDDLH - tDDHL| 20 35 50 65 80 95 0 -40 110 125 -25 -10 5 TEMPERATURE (°C) 20 35 50 65 80 95 110 125 TEMPERATURE (°C) FIGURE 16. ISL32600E, ISL32601E DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE FIGURE 17. ISL32600E, ISL32601E DRIVER DIFFERENTIAL SKEW vs TEMPERATURE 130 1000 128 950 126 124 850 SKEW (ns) 800 122 tPLH 750 120 118 116 700 tPHL 114 650 112 600 -40 -25 -10 5 20 35 50 65 80 95 110 tSKEW = |tPLH - tPHL| 110 -40 125 -25 -10 DRIVER OUTPUT (V) 2 1 0 RECEIVER OUTPUT (V) 0 RO DRIVER INPUT (V) RECEIVER OUTPUT (V) DRIVER OUTPUT (V) 3 0 3 A/Y - B/Z -1 -2 TIME (200ns/DIV) FIGURE 20. ISL32600E, ISL32601E DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH 15 35 50 65 80 95 110 125 FIGURE 19. ISL32600E, ISL32601E RECEIVER SKEW vs TEMPERATURE FIGURE 18. ISL32600E, ISL32601E RECEIVER PROPAGATION DELAY vs TEMPERATURE DI 20 TEMPERATURE (°C) TEMPERATURE (°C) RDIFF = 54Ω, CD = 50pF 5 RDIFF = 54Ω, CD = 50pF DI 3 0 3 0 RO DRIVER INPUT (V) PROPAGATION DELAY (ns) 900 2 1 0 A/Y - B/Z -1 -2 TIME (200ns/DIV) FIGURE 21. ISL32600E, ISL32601E DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Typical Performance Curves Specified (Continued) VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise 140 200 120 -40°C 150 +125°C Y OR Z = LOW 50 0 Y OR Z = HIGH -50 +125°C -100 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) +25°C 100 100 -40°C 80 +25°C 60 Y OR Z = LOW +25°C 20 -40°C 0 +125°C -20 +25°C -40°C -150 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 -40 Y OR Z = HIGH -40°C -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 FIGURE 22. ISL32600E, ISL32601E DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 23. ISL32602E, ISL32603E DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE VCC = 3.3V, RDIFF = 100Ω 2.1 VCC = 3.3V, RDIFF = 54Ω 1.7 1.5 VCC = 1.8V, RDIFF = 10kΩ 1.3 1.1 0.9 VCC = 1.8V, RDIFF = 100Ω 0.7 -40 -25 -10 5 20 35 50 65 80 95 30 RECEIVER OUTPUT CURRENT (mA) DIFFERENTIAL OUTPUT VOLTAGE (V) 2.5 1.9 VOL, +25°C 20 VCC = 1.8V 0 VOL, +85°C VOL, +25°C VOL, +85°C VOL, +125°C 10 VOH, +25°C, +85°C, +125°C VOH, +85°C VOH, +125°C -10 VCC = 3.3V -20 VOH, +25°C -30 110 125 VOL, +125°C VCC = 3.3V 0 0.5 1.0 1.5 2.0 2.5 FIGURE 24. ISL32602E, ISL32603E DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE RE = 0V Tx AND Rx BOTH SWITCHING RD = ∞, CD = 50pF DE = VCC, RE = 0V 160 460kbps 10m 256kbps VCC = 3.3V, DE = VCC ICC (A) ICC (µA) 3.3 FIGURE 25. ISL32602E, ISL32603E RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE 100m 180 120 3.0 RECEIVER OUTPUT VOLTAGE (V) TEMPERATURE (°C) 140 8 9 10 11 12 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 2.3 +125°C 40 VCC = 3.3V, DE = 0V VCC = 1.8V, DE = VCC 128kbps 1m 9.6kbps 100 100µ 80 60 -40 STATIC VCC = 1.8V, DE = 0V -25 -10 5 20 35 50 65 80 95 110 125 TEMPERATURE (°C) FIGURE 26. ISL32602E, ISL32603E STATIC SUPPLY CURRENT vs TEMPERATURE 16 10µ 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 VCC (V) FIGURE 27. ISL32602E, ISL32603E DYNAMIC SUPPLY CURRENT vs SUPPLY VOLTAGE AT DIFFERENT DATA RATES FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E DI A-B RD = ∞ 2.0 1.5 1.0 0.5 0 TIME (10µs/DIV) FIGURE 28. ISL32602E, ISL32603E PERFORMANCE WITH VCC = 1.8V, 256kbps, 1000’ (305m) CAT 5 CABLE 1200 DI 0 4 3 2 1 0 -1 -2 -3 A-B RD = ∞ 4 3 2 1 0 TIME (10µs/DIV) FIGURE 29. ISL32602E, ISL32603E PERFORMANCE WITH VCC = 3.3V, 460kbps, 2000’ (610m) CAT 5 CABLE CD = 50pF 1100 CD = 50pF 120 tSKEW = |tDDLH - tDDHL| VCC = 1.8V, RD = ∞ 1000 100 900 800 SKEW (ns) PROPAGATION DELAY (ns) 3 DRIVER INPUT (V) 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 DRIVER INPUT (V) RECEIVER OUTPUT (V) RECEIVER INPUTS (V) 2 0 VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise RECEIVER OUTPUT (V) RECEIVER INPUTS (V) Typical Performance Curves Specified (Continued) tDDHL 700 tDDLH 600 VCC = 1.8V, RD = ∞ 80 60 40 500 400 300 -40 -25 -10 5 20 tDDHL VCC = 3.3V, RD = 54Ω VCC = 3.3V, RD = 54Ω tDDLH 20 35 50 65 TEMPERATURE (°C) 80 95 0 110 125 FIGURE 30. ISL32602E, ISL32603E DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE -40 -25 -10 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 FIGURE 31. ISL32602E, ISL32603E DRIVER DIFFERENTIAL SKEW vs TEMPERATURE 300 140 tSKEW = |tPLH - tPHL| 280 120 100 240 220 SKEW (ns) PROPAGATION DELAY (ns) 260 VCC = 1.8V, tPLH 200 180 160 80 60 VCC = 1.8V, tPHL 40 VCC = 3.3V, tPHL 140 VCC = 3.3V, tPLH 20 120 100 -40 VCC = 1.8V -25 -10 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 FIGURE 32. ISL32602E, ISL32603E RECEIVER PROPAGATION DELAY vs TEMPERATURE 17 0 -40 VCC = 3.3V -25 -10 5 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 FIGURE 33. ISL32602E, ISL32603E RECEIVER SKEW vs TEMPERATURE FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E 2 RO 0 1.5 1.0 0.5 0 A/Y - B/Z -0.5 -1.0 -1.5 DI 2 RO 0 1.5 1.0 0.5 0 A/Y - B/Z -0.5 -1.0 -1.5 TIME (1µs/DIV) 0 3 RO 0 3 2 1 0 -1 RECEIVER OUTPUT (V) 3 DRIVER INPUT (V) DI FIGURE 35. ISL32602E, ISL32603E DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 34. ISL32602E, ISL32603E DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH RDIFF = 54Ω, CD = 50pF A/Y - B/Z -2 -3 TIME (200ns/DIV) FIGURE 36. ISL32602E, ISL32603E DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH 2 0 TIME (1µs/DIV) VCC = 3.3V RDIFF = 10kΩ, CD = 50pF DRIVER INPUT (V) 0 VCC = 1.8V VCC = 3.3V RDIFF = 54Ω, CD = 50pF DI 3 0 3 0 RO DRIVER INPUT (V) DI 2 RECEIVER OUTPUT (V) RDIFF = 10kΩ, CD = 50pF DRIVER OUTPUT (V) RECEIVER OUTPUT (V) DRIVER OUTPUT (V) VCC = 1.8V VCC = 3V (ISL32600E, ISL32601E) or 1.8V (ISL32602E, ISL32603E), TA = +25°C; Unless Otherwise DRIVER INPUT (V) Typical Performance Curves Specified (Continued) 3 2 1 0 -1 A/Y - B/Z -2 -3 TIME (200ns/DIV) FIGURE 37. ISL32602E, ISL32603E DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND PROCESS: Si Gate BiCMOS 18 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision. DATE REVISION June 22, 2012 FN7967.0 CHANGE Initial Release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL32600E, ISL32601E, ISL32602E, ISL32603E To report errors or suggestions for this data sheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/search.php For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 19 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Package Outline Drawing M8.118 8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 4, 7/11 5 3.0±0.05 A DETAIL "X" D 8 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 B 0.65 BSC GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.25 - 0.36 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. (0.65) (0.40) (1.40) TYPICAL RECOMMENDED LAND PATTERN 20 2. Dimensioning and tolerancing conform to JEDEC MO-187-AA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Package Outline Drawing M8.15 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 4, 1/12 DETAIL "A" 1.27 (0.050) 0.40 (0.016) INDEX 6.20 (0.244) 5.80 (0.228) AREA 0.50 (0.20) x 45° 0.25 (0.01) 4.00 (0.157) 3.80 (0.150) 1 2 8° 0° 3 0.25 (0.010) 0.19 (0.008) SIDE VIEW “B” TOP VIEW 2.20 (0.087) SEATING PLANE 5.00 (0.197) 4.80 (0.189) 1.75 (0.069) 1.35 (0.053) 1 8 2 7 0.60 (0.023) 1.27 (0.050) 3 6 4 5 -C- 1.27 (0.050) 0.51(0.020) 0.33(0.013) SIDE VIEW “A 0.25(0.010) 0.10(0.004) 5.20(0.205) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1994. 2. Package length does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 3. Package width does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 4. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 5. Terminal numbers are shown for reference only. 6. The lead width as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 8. This outline conforms to JEDEC publication MS-012-AA ISSUE C. 21 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Package Outline Drawing M10.118 10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE Rev 1, 4/12 5 3.0±0.05 A DETAIL "X" D 10 1.10 MAX SIDE VIEW 2 0.09 - 0.20 4.9±0.15 3.0±0.05 5 0.95 REF PIN# 1 ID 1 2 0.50 BSC B GAUGE PLANE TOP VIEW 0.55 ± 0.15 0.25 3°±3° 0.85±010 H DETAIL "X" C SEATING PLANE 0.18 - 0.27 0.08 M C A-B D 0.10 ± 0.05 0.10 C SIDE VIEW 1 (5.80) NOTES: (4.40) (3.00) 1. Dimensions are in millimeters. 2. Dimensioning and tolerancing conform to JEDEC MO-187-BA and AMSEY14.5m-1994. 3. Plastic or metal protrusions of 0.15mm max per side are not included. 4. Plastic interlead protrusions of 0.15mm max per side are not included. (0.50) (0.29) (1.40) 5. Dimensions are measured at Datum Plane "H". 6. Dimensions in ( ) are for reference only. TYPICAL RECOMMENDED LAND PATTERN 22 FN7967.0 June 22, 2012 ISL32600E, ISL32601E, ISL32602E, ISL32603E Package Outline Drawing M14.15 14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 1, 10/09 8.65 A 3 4 0.10 C A-B 2X 6 14 DETAIL"A" 8 0.22±0.03 D 6.0 3.9 4 0.10 C D 2X 0.20 C 2X 7 PIN NO.1 ID MARK 5 0.31-0.51 B 3 (0.35) x 45° 4° ± 4° 6 0.25 M C A-B D TOP VIEW 0.10 C 1.75 MAX H 1.25 MIN 0.25 GAUGE PLANE C SEATING PLANE 0.10 C 0.10-0.25 1.27 SIDE VIEW (1.27) DETAIL "A" (0.6) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Datums A and B to be determined at Datum H. (5.40) 4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. 5. The pin #1 identifier may be either a mold or mark feature. (1.50) 6. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm total in excess of lead width at maximum condition. 7. Reference to JEDEC MS-012-AB. TYPICAL RECOMMENDED LAND PATTERN 23 FN7967.0 June 22, 2012