Stacked Film Capacitor Chips NSWC Series FEATURES NSWC IS • STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM RECOMMENDED • STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES FOR NEW DESIGNS • WIDE TEMPERATURE RANGE UP TO +125OC* • HIGH HEAT AND MOISTURE RESISTANT RoHS • VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS Compliant includes all homogeneous materials nCHARACTERISTICS • REFLOW SOLDERING ONLY *See Part Number System for Details • TAPE AND REEL PACKAGING SPECIFICATIONS 1206 0.001 ~ 0.0047μF Capacitance Range Votage Ratings Case Sizes 1913 2416 2820 3022 3925 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF 100Vdc 0.001 ~ 0.01μF 5% (J) only, 0.012 ~ 0.15μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only -55°C ~ +105°C (0.001μF ~ 0.01μF) -55°C ~ +125°C (0.012μF ~ 1.0μF with derating above +85°C) 1.0% max. @ 1KHz 3 Gigohms or 1000Ω/F whichever is lower 1210 0.0056 ~ 0.01μF Capacitance Tolerance Temperature Range Dissipation factor (20°C) Insulation resistance (20°C) Dielectric Withstanding Voltage 150% of Rated Voltage 60 Seconds ENVIRONMENTAL CHARACTERISTICS Life Test At +105°C 1,000 Hours at 125% of Rated Voltage (125°C for 0.012μF ~ 1.0μF) Resistance to Soldering Heat: +240°C Peak Humidity Load Life (90% ~ 95% RH) (1) 1,000 Hours, +40°C 500 Hours for 0.012μF ~ 1.0μF (2) 500 Hours, +60°C for 0.001 ~ 0.01μF Solderability with 25% Wt Rosin-Methanol Flux Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance Capacitance Change Dissipation Factor Insulation Resistance 90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot RECOMMENDED REFLOW PROFILE RECOMMENDED LAND PATTERN (mm) A 1.8 1.8 2.6 3.8 4.5 5.1 7.2 B 3.6 3.6 6.6 7.8 9.0 9.7 11.9 C 1.4 2.3 3.0 3.8 4.6 5.0 5.7 300 Temperature - Deg. C EIA Size 1206 1210 1913 2416 2820 3022 3925 C ® Standard: +240 °C Peak Temperature +250°C Special Order (see part numbering system) 250 200 150 Cool Down 100 Time above 220°C 60 sec. max. 50 25 A B Within +1%/-6% of Initial Value 1.1% Maximum 1 Gigohm Minimum or 300Ω/F whichever is lower Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value 1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF 1 Gigohm Minimum or 300Ω/F whichever is lower (1) +8%/-5% (2) ±10% of Initial Value (1) 1.5% Max. (2) 2.0% Max. (1) 100 Megohm Min. or 30Ω/F (2) 10 Megohm Min. or 3Ω/F whichever is lower 0 Ramp-up 25°C ~ 150°C 90 sec. max. Pre-heat 150°C ~ 180°C 120 sec. max. Time PART NUMBER SYSTEM NSWC 823 J 100 TR D4 N F RoHS Compliant Optional High Temp. Reflow (+250°C)* Size Code Tape & Reel Voltage Tolerance Code: J = ±5% Capacitance in pF, 1st two digits are significant, 3rd digit is no. of zeros Series *Special packaging and handling required. NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com SPECIFICATIONS ARE SUBJECT TO CHANGE www.SMTmagnetics.com 1 Stacked Film Capacitor Chips NSWC Series 100V STANDARD PRODUCTS AND CASE SIZES Cap. Cap. Size Value Code Code NSWC102J100TRB2F 0.001 102 B2 NSWC122J100TRB2F 0.0012 122 B2 NSWC152J100TRB2F 0.0015 152 B2 NSWC182J100TRB2F 0.0018 182 B2 NSWC222J100TRB2F 0.0022 222 B2 NSWC272J100TRB2F 0.0027 272 B2 NSWC332J100TRB3F 0.0033 332 B3 NSWC392J100TRB3F 0.0039 392 B3 NSWC472J100TRB3F 0.0047 472 B3 NSWC562J100TRC2F 0.0056 562 C2 NSWC682J100TRC2F 0.0068 682 C2 NSWC822J100TRC3F 0.0082 822 C3 NSWC103J100TRC3F 0.010 103 C3 NSWC123*100TRD1F 0.012 123 D1 NSWC153*100TRD1F 0.015 153 D1 NSWC183*100TRD1F 0.018 183 D1 NSWC223*100TRD1F 0.022 223 D1 NSWC273*100TRD1F 0.027 273 D1 NSWC333*100TRD1F 0.033 333 D1 NSWC393*100TRD1F 0.039 393 D1 NSWC473*100TRD2F 0.047 473 D2 NSWC563*100TRD2F 0.056 563 D2 NSWC683*100TRD3F 0.068 683 D3 NSWC823*100TRD4F 0.082 823 D4 NSWC104*100TRE1F 0.1 104 E1 NSWC124*100TRE3F 0.12 124 E3 NSWC154*100TRE4F 0.15 154 E4 NSWC184K100TRG1F 0.18 184 G1 NSWC224K100TRG2F 0.22 224 G2 NSWC274K100TRG3F 0.27 274 G3 NSWC334K100TRG5F 0.33 334 G5 NSWC394K100TRQ1F 0.39 394 Q1 NSWC474K100TRQ2F 0.47 474 Q2 NSWC564K100TRR1F 0.56 564 R1 NSWC684K100TRR3F 0.68 684 R3 NSWC824K100TRR6F 0.82 824 R6 NSWC105K100TRR8F 1.0 105 R8 *These values available in J (±5%) or K (±10%) tolerance. Length L ±0.2 Part Number Width W p 3.2 ± 0.2 1.6 ± 0.2 1206 1.5 ± 0.3 0.65 ± 0.3 (Fig. 1) 1.5 3.2 ± 0.2 2.5 ± 0.2 1210 2.1 1.4 4.8 ± 0.2 3.3 ± 0.3 1913 2.0 6.0 ± 0.2 4.1 ± 0.3 7.1 ± 0.2 5.0 ± 0.4 7.7 ± 0.2 5.5 ± 0.4 9.8 ± 0.2 6.3 ± 0.4 2.4 2.8 1.8 2.4 2.8 2.0 2.4 2.9 3.5 3.4 4.0 3.0 3.6 4.3 5.1 0.35 ± 0.2 (Fig. 2) L2 p 2416 2820 3022 3925 Fig. 2 (B2~C3) Stacked Element Terminations: 95.5% Sn, 4% Ag and 0.5% Cu over phosphorus copper barrier over copper base 95.5% Sn, 4% Ag and 0.5% Cu over phenolic resin/Ag/Ni/Cu over copper base H H p EIA 1.1 ± 0.3 Fig. 1 (D1~R8) Stacked Element Terminations: Height H ±0.2 W L2 p p W L1 L1 ® 2 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Stacked Film Capacitor Chips NSWC Series TAPE DIMENSIONS (mm) EMBOSSED PLASTIC CARRIER 1.5 +0.1 -0 4.0 ±0.1 80 ±1.0 .0 21 0.8 ± 13.4 ±1.0 B W F t 2.0 ±0.5 13 ±0 .0 .5 330 ±2.0 Qty/Reel 3,000 2,000 2,000 2,000 3,000 3,000 2,000 3,000 2,000 1,500 1,000 1,000 1.75 ±0.1 Case Code A±0.1 B±0.1 C±0.2 t W±0.3 F P±0.1 D+0.2/-0 B2 1.5 1.9 B3 1.9 3.5 0.25 8.0 3.5 4.0 1.0 C2 1.9 2.8 C3 2.5 2.0 D1 D2 3.8 5.1 2.6 1.5 D3, D4 3.4 0.3 5.5 12.0 8.0 ±0.05 ±0.05 E1, E2 2.7 4.6 6.3 E3, E4 3.5 G1 ~ G5 5.5 7.4 4.7 Q1, Q2 6.91 8.43 5.685 0.343 7.5 16.0 12.0 1.5 ±0.1 R1 ~ R8 8.94 10.54 5.795 ±0.013 17.4 ±1.0 D∅ A C P ® NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com 3