Maxim MAX15569 2-phase/1-phase quicktune-pwm controller with serial i2c interface Datasheet

EVALUATION KIT AVAILABLE
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller
with Serial I2C Interface
General Description
The MAX15569 step-down controller consists of one
multiphase regulator. The multiphase CPU regulator uses
Maxim’s unique 2-phase QuickTune-PWM constant “ontime” architecture. The 2-phase CPU regulator runs 180°
out-of-phase for true interleaved operation, minimizing
input capacitance.
The device’s VR is controlled by writing appropriate
data into a function-mapped register file. Output voltages are dynamically changed through a 2-wire, fast I2C
interface (clock, data), allowing the switching regulator to be programmed to different voltages. A slewrate controller allows controlled voltage transition and
controlled soft-start. The regulator runs in a unique
smart, low-power pulse-skipping-state algorithm for
best efficiency over the full load range and the best
transient response with respect to common pulseskipping methods.
The device includes multiple fault-protection features:
Output overvoltage protection (OVP), undervoltage protection (UVP), and thermal protection. When any of these
fault-protection features detect a fault condition, the controller shuts down. A multifunction INT output monitors
output voltage, overcurrent (OC), overrange (VOUTMAX),
and thermal faults (VRHOT).
Benefits and Features
● 2-Phase QuickTune-PWM CPU Core Regulator
• Transient Phase Overlap Reduces Output
Capacitance
● I2C Serial-Interface Control
• Output-Voltage Control
• System Status Register
• Current Monitor Register
● Multifunction INT Output
• Overcurrent, Output Voltage Overrange,
Overvoltage, Undervoltage, and Thermal Fault
Protection
● ±5mV FB Accuracy Over Line and Load
● 7-Bit DAC (0.5V to 1.6V, 10mV/LSB)
● True Differential Remote Output Sense
● Active Load-Line with Adjustable Gain
● Accurate Current Balance and Current Limit
● 4.5V to 24V Battery Input Range
● Programmable 300kHz to 1400kHz Switching
Frequency
● Programmable Slew Rate and Soft-Start
● Passive Soft-Shutdown (2kΩ Discharge Switch)
The controller has a programmable switching frequency,
allowing 300kHz to 1400kHz per each phase of operation. The controller operates with a wide variety of drivers
and MOSFETs, such as the MAX15492 MOSFET driver
with standard MOSFETs, or with the power stage that
integrates the drivers and MOSFETs together in a single
device.
Applications
●
●
●
●
ARM Core Power Supply
Ultrabooks and Tablet Core Supply
Voltage-Positioned Step-Down Converter
Multiphase DC-DC Controllers
19-6646; Rev 0; 3/13
Ordering Information appears at end of data sheet.
For related parts and recommended products to use with this part, refer
to www.maximintegrated.com/MAX15569.related.
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Absolute Maximum Ratings
VTT to AGND......................................... -0.3V to (VBIAS + 0.3V)
BIAS to AGND..........................................................-0.3V to +6V
EN, SCL, SDA to AGND...........................................-0.3V to +6V
CSP1, CSN1, CSP2, CSN2 to AGND......................-0.3V to +6V
FB, FBAC, IMON to AGND.....................-0.3V to (VBIAS + 0.3V)
DRVPWM1, DRVPWM2 to PGND..........-0.3V to (VBIAS + 0.3V)
DRVSKP to PGND..................................-0.3V to (VBIAS + 0.3V)
INT, THERM to AGND.............................................-0.3V to +6V
IC to AGND..............................................................-0.3V to +6V
GNDS to AGND.....................................................-0.3V to +0.3V
PGND to AGND.....................................................-0.3V to +0.3V
TON to AGND.........................................................-0.3V to +26V
Continuous Power Dissipation (TA = +70°C)
TQFN (derate 27.8mW above +70°C)..............................2.2W
Operating Temperature Range.......................... -40°C to +105°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +165°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θJA)...........36°C/W
Junction-to-Case Thermal Resistance (θJC)……...........3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics (0°C to +85°C)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V [SETVOUT
register 0x07h set to 0x33h]. TA = 0°C to +85°C, unless otherwise noted. Typical values are at +25°C. All devices 100% tested at
+25°C. Limits over temperature are guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
BIAS CURRENTS
BIAS Voltage Range
VBIAS
4.75
5.25
V
I2C Interface Supply (VTT)
VTT
1.6
4.0
V
Quiescent Supply Current
(BIAS)
IBIAS
5
mA
6
µA
PWM CONTROLLER
IVTT
VBIAS = high, EN = low, TA = +25°C
3
VBIAS = high, EN = high, TA = +25°C
50
DC Output Voltage Accuracy
(Note 2)
TA = +25°C; measured at
FB, with respect to GNDS; DAC codes from
includes load regulation
0.50V to 1.60V
error
DC Output Voltage Accuracy
(Note 2)
DAC codes from
Measured at FB, with
0.50V to 1.40V
respect to GNDS; includes
DAC codes from
load regulation error
1.40V to 1.60V
Line Regulation Error
VBIAS = 4.75V to 5.25V, VIN = 5.5V to 20V
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2
Measured at BIAS, EN = GND,
VTT = 1.8V or GND, TA = +25°C
Shutdown Supply Current
(BIAS)
VTT BIAS Current
Skip mode, measured at BIAS,
VTT = 1.8V; FB forced above the regulation
point, EN = BIAS
µA
-5
+5
mV
-8
+8
mV
-0.7
+0.7
%
0.1
mV
Maxim Integrated │ 2
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Electrical Characteristics (0°C to +85°C) (continued)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V [SETVOUT
register 0x07h set to 0x33h]. TA = 0°C to +85°C, unless otherwise noted. Typical values are at +25°C. All devices 100% tested at
+25°C. Limits over temperature are guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
GNDS Input Range
AGNDS
GNDS Input BIAS Current
IGNDS
0.97
TA = +25°C
tON
tOFF(MIN)
Slew-Rate Accuracy (see Table
8 for Soft-Start and Regular
Slew-Rate Combinations)
MAX
mV
1.03
V/V
+0.5
µA
0.01
0.1
µA
Measured at DRVPWM_,
RTON = 136.3kΩ (1400kHz)
60
71
82
Measured at DRVPWM_,
RTON = 200kΩ (1000kHz)
92
104
114
Measured at DRVPWM_,
RTON = 326.7kΩ (600kHz)
141
166
192
100
133
Measured at DRVPWM_
Slew rate = 3.5mV/µs , 4.5mV/µs, 5.5mV/µs,
7mV/µs, 9mV/µs, 11mV/µs, 14mV/µs,
18mV/µs, 22mV/µs, 28mV/µs, 36mV/µs,
44mV/µs (nominal)
-20
1.78
UNITS
+200
1.00
-0.5
EN = AGND, VIN = 24V,
VBIAS = 0V or 5V, TA = +25°C
TON Shutdown Current
Minimum Off-Time (Note 3)
TYP
-200
GNDS Gain
DRVPWM_ On-Time
(Note 3)
MIN
ns
ns
%
FAULT PROTECTION
Upper INT and Output
Overvoltage-Protection Trip
Threshold
VOVP
Soft-start completed, measured at FB
Upper INT and Output
Overvoltage Propagation Delay
tOVP
FB forced 25mV above trip threshold
Lower INT and Output
Undervoltage-Protection Trip
Threshold
VUVP
Measured at FB, with respect to unloaded
output voltage
Lower INT Propagation Delay
Output Undervoltage
Propagation Delay
FB forced 25mV below trip threshold
INT Output Low Voltage
ISINK = 4mA
INT Leakage Current
High state, INT forced to 5V, TA = +25°C
INT Startup Delay and
Transitions Blanking Time
VBIAS Undervoltage-Lockout
Threshold
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tINT
VUVLO
-300
-250
100
200
-200
4.5
mV
µs
350
µs
0.3
V
1
µA
4
4.3
V
µs
5
Measured from the time when FB reaches the
target voltage
Rising edge, 50mV typical hysteresis, controller
disabled below this level
1.88
5
FB forced 25mV below trip threshold
tUVP
1.83
µs
4.7
V
Maxim Integrated │ 3
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Electrical Characteristics (0°C to +85°C) (continued)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V [SETVOUT
register 0x07h set to 0x33h]. TA = 0°C to +85°C, unless otherwise noted. Typical values are at +25°C. All devices 100% tested at
+25°C. Limits over temperature are guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Internal pullup resistance
5.24
5.35
5.48
kΩ
VRHOT Trip Threshold
Measured at THERM, with respect to VBIAS
falling edge; specify as % error for all temp max
DAC code settings; typical hysteresis = 100mV,
TA = +25°C to +100°C
49.5
50.5
%
THERM Sampling Period
5% duty cycle
0.75
1.1
ms
Typical hysteresis = +15°C
160
THERMAL PROTECTION
THERM Resistor
Internal Thermal-Fault
Shutdown Threshold
RTHERM
TTSHDN
°C
VALLEY CURRENT LIMIT AND DROOP
Valley Current-Limit Threshold
Voltage (Positive)
OC_ALARM Valley Current
Threshold Voltage (Positive,
CSP1 Only)
VCSP_ - VCSN_
35
38
41
mV
VOC_ALARM VCSP1 - VCSN1
20
23
26
mV
-1.8
+1.8
mV
0.5
1.6
V
-0.12
+0.12
µA
VILIM
Current-Balance Offset Voltage
Current-Sense Common-Mode
Input Range
CSP1, CSN1, CSP2, CSN2
Current-Sense Input Current
CSP1, CSN1, CSP2, CSN2, TA = +25°C
Discharge Switch Resistance
CSN1 only
FB Input Current
TA = +25°C
Phase 2 Disable Threshold
CSP2
Droop Amplifier (GMD) Offset
Average (VCSP_ - VCSN_) at IFBAC = 0mA
-1.0
DIFBAC/∑D (VCSP_ - VCSN_), measured at
FBAC
1.182
∑(VCSP_ - VCSN_) = 25mV
Droop Amplifier (GMD)
Transconductance
Gm(FBAC)
2
kΩ
-0.2
+0.2
µA
VBIAS
- 0.4
V
+1.0
mV
1.2
1.218
µA/mV
124.2
128
131.8
µA
4.8
5.12
5.44
µA/mV
3.2
3.6
V
3
VBIAS
- 1.0
CURRENT MONITOR (IMON)
Current Monitor Output Current
for Typical Full-Load Conditions
Current Monitor Gain
IIMON
Gm(IMON)
Current Monitor Clamp Voltage
DIIMON/∑D (VCSP_ - VCSN_), measured at
IMON
IMON
DRIVER CONTROL
DRVPWM_, DRVSKP# Output
Logic-High Voltage
VOH_DRV
ISOURCE = 3mA
DRVPWM_, DRVSKP# Output
Logic-Low Voltage
VOL_DRV
ISINK = 3mA
DRVPWM_ Output Midlevel
Voltage
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VBIAS
- 0.4
1.6
V
0.4
V
2.3
V
Maxim Integrated │ 4
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Electrical Characteristics (0°C to +85°C) (continued)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V [SETVOUT
register 0x07h set to 0x33h]. TA = 0°C to +85°C, unless otherwise noted. Typical values are at +25°C. All devices 100% tested at
+25°C. Limits over temperature are guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
ENABLE LOGIC (EN)
EN Input High Voltage
VIH_EN
EN Input Low Voltage
VIL_EN
EN Input Current
IEN
Power-Up Calibration Delay
tCAL
Enable to Startup Delay
tSTRT
0.7 x
VTT
TA = +25°C
V
-1
EN to first switching edge (fully discharged
output)
0.33
V
+1
µA
850
µs
150
µs
I2C INTERFACE (SDA, SCL)
I2C Input Low Voltage
VIL
I2C Input High Voltage
VIH
I2C Output Low Level
(SDA Only)
VOL
I2C Logic Inputs Leakage
Current
0.4
0.7 x
VTT
Open-drain output, 3mA pullup to VTT
TA = +25°C
-1
V
V
0.4
V
+1
µA
3.4
MHz
I2C TIMING REQUIREMENTS
I2C Clock Frequency
Hold Time Repeated START
Condition
tHD_STA
(Note 4)
160
ns
SCL Low Period
tLOW
(Note 4)
160
ns
SCL High Period
tHIGH
(Note 4)
60
ns
Setup Time Repeated START
Condition
tSU_STA
(Note 4)
160
ns
SDA Hold Time
tHD_DAT
(Note 4)
0
SDA Setup Time
tSU_DAT
(Note 4)
10
ns
Setup Time for STOP Condition
tSU_STO
(Note 4)
160
ns
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70
ns
Maxim Integrated │ 5
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Electrical Characteristics (-40°C to +105°C)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V
[SETVOUT register 0x07h set to 0x33h]. TA = -40°C to +105°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
BIAS CURRENTS
BIAS Voltage Range
VBIAS
4.75
5.25
V
I2C Interface Supply (VTT)
VTT
1.6
4.0
V
Quiescent Supply Current
(BIAS)
IBIAS
5
mA
Skip mode, measured at BIAS, VTT = 1.8V; FB
forced above the regulation point; EN = BIAS
PWM CONTROLLER
GNDS Gain
DRVPWM_ On-Time (Note 3)
Minimum Off-Time (Note 3)
DAC codes from 0.50V
to 1V
-10
+10
mV
DAC codes from 1V to
1.60V
-1.0
+1.0
%
0.97
1.03
V/V
Measured at DRVPWM_,
RTON = 136.3kΩ, (1400kHz)
60
82
Measured at DRVPWM_,
RTON = 200kΩ, (1000kHz)
92
114
Measured at DRVPWM_,
RTON = 326.7kΩ, (600kHz)
141
192
Measured at FB,
with respect to
GNDS; includes load
regulation error
DC Output Voltage Accuracy
(Note 2)
AGNDS
tON
tOFF(MIN)
Slew-Rate Accuracy (see Table
8 for Soft-Start and Regular
Slew-Rate Combinations)
Measured at DRVPWM_
Slew rate = 3.5mV/µs , 4.5mV/µs, 5.5mV/µs,
7mV/µs, 9mV/µs, 11mV/µs, 14mV/µs, 18mV/µs,
22mV/µs, 28mV/µs, 36mV/µs, 44mV/µs
(nominal)
133
-20
ns
ns
%
FAULT PROTECTION
Upper INT and Output
Overvoltage-Protection Trip
Threshold
VOVP
Soft-start completed; measured at FB
1.78
1.88
V
Lower INT and Output
Undervoltage-Protection Trip
Threshold
VUVP
Measured at FB, with respect to unloaded
output voltage
-300
-200
mV
Output Undervoltage
Propagation Delay
tUVP
FB forced 25mV below trip threshold
100
350
µs
0.3
V
4.7
V
INT Output Low Voltage
VBIAS Undervoltage-Lockout
Threshold
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ISINK = 4mA
VUVLO
Rising edge, 50mV typical hysteresis; controller
disabled below this level
4.3
Maxim Integrated │ 6
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Electrical Characteristics (-40°C to +105°C) (continued)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V
[SETVOUT register 0x07h set to 0x33h]. TA = -40°C to +105°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
THERMAL PROTECTION
THERM Resistor
RTHERM
Internal pullup resistance
5.24
5.48
kΩ
Measured at THERM, with respect to VBIAS
falling edge; specify as % error for all temp max
DAC code settings; typical hysteresis = 100mV;
TA = +25°C to +105°C
49.5
50.5
%
VCSP_ - VCSN_
35
41
mV
VOC_ALARM VCSP1 - VCSN1
20
26
mV
-2.5
+2.5
mV
0.5
1.6
V
3
VBIAS
- 0.4
V
VRHOT Trip Threshold
VALLEY CURRENT LIMIT AND DROOP
Valley Current-Limit Threshold
Voltage (Positive)
OC_ALARM Valley Current
Threshold Voltage (Positive,
CSP1 Only)
VILIM
Current-Balance Offset Voltage
Current-Sense Common-Mode
Input Range
CSP1, CSN1, CSP2, CSN2
Phase 2 Disable Threshold
CSP2
Droop Amplifier (GMD) Offset
Average (VCSP_ - VCSN_) at IFBAC = 0mA
-1.0
+1.0
mV
DIFBAC/∑D (VCSP_ - VCSN_), measured at
FBAC
1.176
1.224
µA/mV
∑(VCSP_ - VCSN_) = 25mV
122.2
133.8
µA
4.8
5.44
µA/mV
Droop Amplifier (GMD)
Transconductance
Gm(FBAC)
CURRENT MONITOR (IMON)
Current Monitor Output Current
for Typical Full-Load Conditions
IIMON
Gm(IMON)
DIIMON/∑D (VCSP_ - VCSN_), measured
at IMON
DRVPWM_, DRVSKP Output
Logic-High Voltage
VOH_DRV
ISOURCE = 3mA
DRVPWM_, DRVSKP Output
Logic-Low Voltage
VOL_DRV
ISINK = 3mA
Current Monitor Gain
DRIVER CONTROL
DRVPWM_ Output Midlevel
Voltage
VBIAS
- 0.4
1.6
V
0.4
V
2.3
V
ENABLE LOGIC (EN)
EN Input High Voltage
VIH_EN
EN Input Low Voltage
VIL_EN
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0.7 x
VTT
V
0.33
V
Maxim Integrated │ 7
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Electrical Characteristics (-40°C to +105°C) (continued)
(Circuit of Figure 1. VIN = 10V, VBIAS = 5V, VTT = 1.8V, EN = BIAS, GNDS = AGND, VFBAC = VFB = VCSP_ = VCSN_ = 1V
[SETVOUT register 0x07h set to 0x33h]. TA = -40°C to +105°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
3.4
MHz
I2C TIMING REQUIREMENTS
I2C Clock Frequency
Hold Time Repeated START
Condition
tHD_STA
(Note 4)
160
ns
SCL Low Period
tLOW
(Note 4)
160
ns
SCL High Period
tHIGH
(Note 4)
60
ns
Setup Time Repeated START
Condition
tSU_STA
(Note 4)
160
ns
SDA Hold Time
tHD_DAT
(Note 4)
0
SDA Setup Time
tSU_DAT
(Note 4)
10
ns
Setup Time for STOP Condition
tSU_STO
(Note 4)
160
ns
70
ns
Note 2: The equation for the target voltage VTARGET is: VTARGET = the output of slew control DAC, where VDAC = 0V for
shutdown, VDAC = VBOOT during startup; otherwise VDAC = SETVOUT. The output voltages for all possible codes are
given in Table 3.
Note 3: On-time and minimum off-time specifications are measured from 50% rise to 50% fall at the DRVPWM_ pin. Actual in-circuit
times can be different due to MOSFET driver characteristics.
Note 4: Guaranteed by design. Not production tested.
DRVPWM2
DRVSKP
DRVPWM1
PGND
BIAS
TOP VIEW
TON
Pin Configuration
18
17
16
15
14
13
INT 19
12
EN
CSP1 20
11
I.C. (BIAS)
10
I.C. (BIAS)
9
SCL
8
SDA
7
AGND
CSN1 21
MAX15569
N.C. 22
CSN2 23
*EP
+
1
2
3
4
5
6
GNDS
FBAC
FB
IMON
THERM
V TT
CSP2 24
TQFN
(4mm x 4mm)
*EP = EXPOSED PAD. CONNECT TO GROUND.
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Maxim Integrated │ 8
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Pin Description
PIN
1
2
3
NAME
FUNCTION
GNDS
Ground Remote-Sense Input. Connect GNDS to the ground-sense pin of the CPU located directly
at the point of load. GNDS internally connects to an internal transconductance amplifier that
adjusts the feedback voltage to compensate for voltage drops between the local controller ground
and the remote load ground.
FBAC
Output of the AC Voltage Positioning Transconductance Amplifier. The effective impedance
(ZFBAC) between this pin and the positive side of the remote-sensed output voltage sets the
transient AC droop. See the Load-Line Amplifier (Steady State and AC Droop) section.
FBAC is high impedance in shutdown.
FB
Feedback-Sense Input. An integrator on FB corrects for output ripple and ground-sense offset.
Connect a resistor (RFB) between FB and the positive output of the remote sense (output) to
set the DC steady-state droop. The impedance from FBAC to FB sets the current-loop gain over
frequency, which dominates stability. See the Load-Line Amplifier (Steady State and AC Droop)
section.
Current Monitor Output. The output current at IMON is:
IIMON = GM(IMON) x ∑ (CSP_ - CSN_)
4
IMON
where GM(IMON) = 5.12mS (typ).
An external resistor (RIMON) between IMON and GNDS sets the current monitor output voltage:
VIMON = ILOAD x RSENSE x GM(IMON) x RIMON
where RSENSE is the value of the effective current-sense resistance. Choose RIMON so that
VIMON is 2.56V at the desired full current.
IMON is high impedance when in shutdown.
5
THERM
Thermal-Sense Input. Connect a 100kΩ NTC with β = 4250K from THERM to AGND. The NTC at
THERM is used to determine the temperature of the power stages. Place near the hottest region
of the regulator (typically the MOSFETs and inductor of phase 1).
The VRHOT status bit (D5) activates when the NTC resistance drops to 5.68kΩ (100°C when
using a 100kΩ NTC with β = 4250K).
6
VTT
Interface Logic Supply. Power VTT from a 1.8V to 3.3V ±10% source with a compliance of at least
1mA. Decouple VTT with at least 1µF of ceramic capacitance.
7
AGND
8
SDA
I2C Serial-Data Input/Output. Open-Drain I/O pin. Connect an external pullup resistor between
SDA and the supply used to power the I2C interface (VTT).
9
SCL
I2C Serial-Data Clock Input
10, 11
I.C.
Internally Connected. Connect to BIAS.
EN
Controller Enable Input. Drive EN high or connect EN to BIAS for normal operation. Pull to
ground to put the controller into its 7µA (max) standby state (I2C interface active, regulator not
switching).
During soft-start, the controller slowly ramps the output voltage up to the boot voltage with
the selected slew rate (register 0x06, default is 4.5mV/µs for start-up and 9mV/μs for normal
operation). During the transition from normal operation to standby, the output is discharged
through a 2kΩ internal discharge MOSFET on CSN1.
Toggling EN does NOT reset the fault latches. Cycle power (VTT or BIAS) to trigger the power-on
reset (POR) to clear the fault conditions.
The EN input is rated for up to 5.5V.
12
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Analog Ground
Maxim Integrated │ 9
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Pin Description (continued)
PIN
NAME
FUNCTION
13
BIAS
Analog and Driver Supply Voltage Input. BIAS provides the supply voltage for the driver’s PWM
and skip control outputs. Connect BIAS to the same supply used by the external drivers (typically
the 4.5V to 5.5V system supply voltage). Bypass BIAS to power ground with a local 1μF or
greater ceramic capacitor.
14
PGND
15
DRVPWM1
16
DRVSKP
17
DRVPWM2
18
19
Power Ground
Direct-Drive PWM Output for Controlling the External First-Phase Driver. The DRVPWM1
push-pull output drives the signal between BIAS and PGND. DRVPWM1 is high impedance in
shutdown and after fault conditions (output overvoltage/undervoltage or thermal fault).
External Driver Skip-Mode Control Output. The DRVSKP output is low in standby. DRVSKP goes
high when the controller detects an output overvoltage fault condition, or during dynamic outputvoltage transitions.
For applications operating with forced-PWM operation, disable the driver zero-crossing detection
and leave DRVSKP unconnected.
Direct-Drive PWM Output for Controlling the External Second-Phase Driver. The DRVPWM2
push-pull output drives the signal between BIAS and PGND. DRVPWM2 is high impedance in
shutdown and after fault conditions (output overvoltage, output undervoltage, or thermal fault).
TON
Switching Frequency Adjustment Input. An external resistor between the input power source and
TON sets the switching period (per phase) according to the following equation:
fSW = (RTON + 6.5kΩ) x 5pF
where fSW = 1/fSW is the nominal switching frequency. A 200kΩ resistor provides a typical
operating frequency of 1MHz.
TON is high impedance in shutdown.
INT
Open-Drain Interrupt Output. INT is triggered by latched faults (output undervoltage, output
overvoltage, thermal shutdown), sticky alarms (internal overcurrent (OC), non-sticky alarms
(voltage regulator hot (VRHOT), and VID code violations (VOUTMAX)). The fault conditions and
alarms can be masked through register 0x05h. Masking these signals only prevents INT from
being asserted; the STATUS register still asserts when any of these conditions occur.
INT remains high in standby mode (EN pulled low) to reduce power through the pullup resistor.
INT is pulled low during soft-start. After completing the soft-start sequence, INT becomes high
impedance as long as FB remains in regulation and there are no active alarms.
To obtain a logic signal, pull up INT with an external resistor connected to a logic supply.
20
CSP1
Positive Current-Sense Input for the First Phase.
1) Connect CSP1 to the positive side of the current-sense resistor or the DCR sense filter
capacitor of phase 1, as shown in Figure 4.
2) Connect CSP1 to the IOUT pin of the smart power stage (MAX15515). A resistor across
CSP1 and CSN1 sets the current-sense gain, as shown in Figure 3.
See the Current Sense section.
21
CSN1
Negative Current-Sense Input for the First Phase. Connect CSN1 to the negative side of the
current-sense element, as shown in Figure 4. An internal 2kΩ discharge MOSFET between CSN1
and ground is enabled under an input UVLO or shutdown condition.
22
N.C.
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No Connection Internally
Maxim Integrated │ 10
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Pin Description (continued)
PIN
NAME
23
CSN2
Negative Current-Sense Input for the Second Phase. Connect CSN2 to the negative side of the
current-sense element, as shown in Figure 4.
24
CSP2
Positive Current-Sense Input for the Second Phase.
1) Connect CSP2 to the positive side of the current-sense resistor or the DCR sense filter
capacitor of phase 2, as shown in Figure 4.
2) Connect CSP2 to the IOUT pin of the smart power stage (MAX15515). A resistor across
CSP2 and CSN2 sets the current-sense gain, as shown in Figure 3.
See the Current Sense section. To disable phase 2, short CSP2 to BIAS.
—
EP
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FUNCTION
Exposed Pad. The substrate of the controller is internally connected to the exposed pad. Connect
EP to the ground plane through multiple vias to maintain low thermal impedance.
Maxim Integrated │ 11
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
13
5V BIAS
CVCC
2.2µF 6V
10
11
22
12
VR_ENABLE
BIAS
TON
1.8V
CVCC
2.2µF 6V
5V
I.C.
4
N.C.
EN
DRVPWM1
RI2C
1kΩ
5% 0402
15
6
16
7
SDA
6
17
7
THERM
CSP2
RIMON
1% 0402
CSN2
7
14
PWR
IMON
FBAC
FB
AGND
PGND
VDD
BST
MAX15492
DH
GND
PWM
LX
SKIP
DL
2
RBST1
0Ω
CBST1
0.1µF
8
L2
1
5
GNDS
PWR
24
23
2
3
1
RFBAC
1% 0402
FEEDBACK FILTERS
CFBAC
RFB
0402 1% 0402
R10 10Ω
5% 0402
CFB
1nF 6V
0402
EP
REMOTE GROUND SENSE
AGND
ANALOG GROUND
PWR
R11 10Ω
5% 0402
REMOTE OUTPUT SENSE
CGNDS
1nF 6V
0402
POWER GROUND
PWR
COUT
VIN
EP
PWR
CIMON
0402
5
OUTPUT
4
NTCTHERM
IMON
DL
5V
SCL
4
LX
SKIP
L1
1
21
INT
DRVPWM2
5
PWM
CBST1
0.1µF
8
PWR
3
8
DH
GND
PWR
20
MAX15569
I2C
INTERFACE
BST
MAX15492
2
RBST1
0Ω
EP
CSN1
19
VDD
VTT
CSP1
RINT
10kΩ
5% 0402
3
5V TO 20V
OUTPUT
CIN
I.C.
DRVSKP
6
RTON
1% 0402
18
AGND
Figure 1. MAX15569 Typical Application Circuit (with MAX15492 Driver and MOSFET)
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Maxim Integrated │ 12
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 1. Components for Typical Application Circuit
TYPE
REF
2-PHASE DESIGN EXAMPLE
(1MHz OPERATION)
OPERATING CONDITIONS
Input Voltage
VIN
5V to 20V
Output Voltage
VOUT
1V
Output Current
IOUT
20A (max), 14A RMS
Load Transient
DIOUT
25A
Current Limit
IOCP
40A
Switching Frequency
fSW
1MHz
Number of Phases
NPH
2
RTON
200kΩ 1%
L
0.2µH/9.5mΩ/9.5A inductor
(4.06mm x 4.55mm x 1.2mm)
Vishay IHLP-1616AB-1A
DRV
MAX15492
COMPONENTS
TON
Inductor
MOSFET Driver
High-Side MOSFET
NH
Low-Side MOSFET
NL
Current Sense
—
RCS
—
Bulk Output Capacitors (Mid Frequency)
COUT
—
Ceramic Output Capacitors (High Frequency)
COUT
20 x 22µF ceramic capacitors
CIN
2 x 10µF, 16V X5R ceramic capacitors
—
RFBAC = RFB = 1kΩ 1%
CFBAC = 4.7nF
AC droop = -1.5mV/A
DC droop = 0mV/A
RIMON,
CIMON
RIMON = 5.62kΩ 1%
CIMON = 47nF
(260µs time constant)
RTHERM
100kΩ, 5% NTC thermistor
β = 4250K (0603)
Murata NCP18WF104J03RB
TDK NTCG163JF104J (0402) or
Panasonic ERT-J1VR104J
Input Capacitors
FB Droop Setting
IMON
THERM NTC
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Maxim Integrated │ 13
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
CSP2
BIAS
CSN2
ILIM
DRVPWM2
PHASE 2
CONTROL
Q
IMON
CSP2
∑
FBAC
MAX15569
CSN2
CSP1
Q
CSN2
CSP1
TRIG
ON-TIME
ONE-SHOT
(PHASE 2)
Gm(CCI)
CSP2
TRIG
MINIMUM
OFF-TIME
ONE-SHOT
CSP1
CSN1
Gm(CCI)
TON
TRIG
BIAS
R
BIAS
DRVPWM1
Q
S
SET
TARGET
DAC
EN
CSN2
FB
ONE-SHOT
ON-TIME
(PHASE 1)
Q
ILIM
CSN1
TARGET
2
1
PHASE
SELECT
TRIG
BIAS
DRVSKP
CCV
THERM
AMP
INT
SKIP
SLOPE
PHASE CONTROL
DIGITAL
CORE
FB
GNDS
AGND
THERM
SET DAC
TARGET
SCL
SDA
PGND
Figure 2. Functional Block Diagram
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Maxim Integrated │ 14
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Detailed Description
For system power management, the MAX15569
controller includes a current gauge and thermal status
(VRHOT) that can be monitored over the I2C interface.
In addition, the device’s multiple fault-protection features include: Output overvoltage protection (OVP),
undervoltage protection (UVP), and thermal protection.
When any of these fault-protection features detect a
fault condition, the controller shuts down.
Free-Running Constant On-Time Controller
with Input Feed-Forward
The QuickTune-PWM control architecture consists of a
pseudofixed frequency, constant on-time, and currentmode regulator with voltage feed-forward (Figure 2). The
control algorithm is simple; the high-side switch on-time is
determined solely by a one-shot, whose period is inversely
proportional to input voltage and directly proportional to
the feedback voltage or the difference between the main
and secondary inductor currents (see the On-Time OneShot section). Another one-shot sets a minimum off-time.
The on-time one-shot triggers when the inverting input
to the error comparator falls below the target voltage,
the inductor current of the selected phase is below the
valley current-limit threshold, and the minimum off-time
one-shot times out. The regulator maintains 180° out-ofphase operation by alternately triggering the two phases
after the error comparator drops below the output-voltage
set point.
Switching Frequency
Connect a resistor (RTON) between TON and the input
supply (VIN) to set the switching period (tSW = 1/fSW) per
phase using the following equation:
tSW (RTON + 6.5kΩ) x 5pF
High-frequency (600kHz to 1.4MHz) operation optimizes
the application for the smallest component size. A 200kΩ
resistor sets a typical operating frequency of 1MHz.
On-Time One-Shot
The device contains fast, low-jitter, adjustable one-shots
that set the respective high-side MOSFET on-times
through the DRVPWM_ outputs. The one-shot for the
main phase varies the on-time in response to the input
and feedback voltage (VFB). VFB equals the SETVOUT
voltage in steady-state. The main high-side switch
on-time is inversely proportional to the input voltage as
measured at VIN, and proportional to VFB:
t
(V + 0.075V)
t ON = SW FB
(Ignoring propagation delays)
VIN
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For SETVOUT voltages below 0.9V, the device uses a
fixed 0.9V instead to determine the on-time. Switching
frequency is reduced, improving low-voltage efficiency.
t
(0.9V + 0.075V)
t ON = SW
VIN
The one-shot for the second phase varies the on-time in
response to the input voltage and the difference between
the main and the second inductor currents. Two identical transconductance amplifiers integrate the difference
between the first and second current-sense signals. The
respective error signals are used to correct the on-time
of the high-side MOSFETs for the second phase and to
maintain current balanced between the two phases.
On-times translate only roughly to switching frequencies.
The on-times guaranteed in the Electrical Characteristics
section are influenced by parasitics in the conduction
paths and propagation delays. The following equation
shows the effect of the propagation delays on tON:
t
(V + 0.075V)
t ON = SW FB
+ t D(OFF) - t D(ON)
VIN
where tD(OFF) is the delay from the falling edge of the PWM
signal to the to the time that the high-side MOSFET turns
off. tD(ON) is the delay from the rising edge of the PWM
signal to the time that the high-side MOSFET turns on.
For loads above the critical conduction point, where the
dead-time effect (LX flying high and conducting through
the high-side FET body diode) is no longer a factor, the
actual switching frequency (per phase) is:
f SW =
(VOUT + VDIS )
t ON(VIN + VDIS + VCHG )
where VDIS is the sum of the parasitic voltage drops in the
inductor discharge and charge paths, including MOSFET,
inductor, and PCB resistances; VCHG is the sum of the
parasitic voltage drops in the inductor charge path, including high-side switch, inductor, and PCB resistances; and
tON is the on-time as determined in the prior equation.
180° Out-of-Phase Operation
The two phases in the device operate 180° out-of-phase
to minimize input and output filtering requirements,
reduce EMI, and improve efficiency. This effectively lowers component count—reducing cost, board space, and
component power requirements—making this device
ideal for high-power applications. The device shares the
current between two phases that operate 180° out-ofphase under steady-state conditions.
Maxim Integrated │ 15
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Current Sense
The instantaneous input current of each phase is
effectively reduced, resulting in reduced input-voltage
ripple, ESR power loss, and RMS ripple current (see
the Input Capacitor Selection section). Therefore, the
same performance can be achieved with fewer or lessexpensive input capacitors.
The device senses the inductor current of each phase,
allowing the use of current-sense resistors, inductor
DCR, or the current-sense signal provided by the external
power stage (MAX15515). Low-offset amplifiers are used
for current balance, load-line gain, current monitor, and
current limit.
5V Bias Supply
Power Stage Current-Sense Support
(MAX15515 Only)
The QuickTune-PWM controller requires an external 5V
bias supply in addition to the system supply. Typically,
the system has a regulated 5V bias for interface (USB)
or hard-drive support that can be used. The maximum
current drawn from the 5V bias supply is provided in the
Electrical Characteristics section. If the 5V bias supply is
powered up prior to the system supply, the enable signal
(EN going from low to high) should be delayed until the
system voltage is present to ensure startup.
The MAX15515 features a transconductance currentsense amplifier with a current monitor output (IOUT) with
an output current of:
IOUT = A × ILX
-5
where A is 10 (typ) and ILX is the inductor current. IOUT
is internally temperature compensated and therefore,
external temperature compensation is not required. Refer
to the MAX15515 data sheet for more information.
A resistor between CSP_ and CSN_ (see Figure 3) sets
the gain of the current-sense signal to the controller.
CSP1
IMON
BST
MAX15515
RILIM1
LX
CBST
L
CBST
L
CSN1
CSP2
IMON
RILIM2
MAX15569
CSN2
BST
MAX15515
LX
COUT
RDROOP
FB
FBAC
A) MAX15569 AND SMART POWER STAGE (MAX15515) – WITH DC LOAD REGULATION
CSP1
IMON
BST
MAX15515
RILIM1
CBST
L
CBST
L
LX
CSN1
IMON
CSP2
RILIM2
MAX15569
BST
MAX15515
LX
CSN2
RFB
FB
CFB
COUT
RFBAC
FBAC
B) MAX15569 AND SMART POWER STAGE (MAX15515) – NO DC LOAD REGULATION
Figure 3. The MAX15569 Using the MAX15515 Internal Current-Sense Method
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Maxim Integrated │ 16
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
INDUCTOR
BST
CBST
MAX15569
RDCR
L
LX
RCS =
COUT
POWER
STAGE
R1
RDCR =
R2
CEQ
R2
R1 + R2
L
CEQ
RDCR
1
1
+
R1 R2
FOR THERMAL COMPENSATION:
R2 SHOULD CONSIST OF AN NTC RESISTOR
IN SERIES WITH A STANDARD THIN-FILM RESISTOR
CSP_
CSN_
A) LOSSLESS INDUCTOR SENSING
SENSE RESISTOR
BST
CBST
LX
MAX15569
L
POWER
STAGE
LESL
RSENSE
CEQ REQ =
LESL
RSENSE
R1
CEQ
CSP_
CSN_
B) OUTPUT SERIES RESISTOR SENSING
Figure 4. Sense Resistor and DCR Current-Sense Methods
Inductor DCR and Sense Resistor Current Sense
Using the DC resistance (RDCR) of the output inductor
allows higher efficiency compared to using a currentsense resistor. The initial tolerance and temperature
coefficient of the inductor’s DCR must be accounted
for in the output-voltage droop-error budget and current
monitor. This current-sense method uses an RC filter
network to extract the current information from the output
inductor (see Figure 4).
The RC network should match the time constant of the
inductor (L/RDCR):
 R2 
R CS = 
R DCR
 R1 + R2 
and:
=
R DCR
L 1
1
+
C EQ R1 R2 
where RCS is the required current-sense resistance and
RDCR is the inductor’s series DC resistance. Use the
typical inductance and RDCR values provided by the
inductor manufacturer. To minimize the current-sense
error, due to the leakage current of the current-sense
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inputs (ICSP_ and ICSN_), choose R1||R2 to be less than
2kΩ and use the previous equation to determine the
sense capacitance (CEQ). Choose capacitors with 5%
tolerance and resistors with 1% tolerance specifications.
Temperature compensation is recommended for this current-sense method. See the Load-Line Amplifier (Steady
State and AC Droop)section for detailed information.
When using a current-sense resistor for accurate output
load-line control, the circuit requires a differential RC filter
to eliminate the AC voltage step caused by the equivalent
series inductance (LESL) of the current-sense resistor
(see Figure 4). The ESL-induced voltage step might affect
the average current-sense voltage. The time constant
of the RC filter should match the LESL/RSENSE time
constant formed by the parasitic inductance of the
current-sense resistor:
L ESL
= C EQR EQ
R SENSE
where LESL is the equivalent series inductance of the
current-sense resistor, RSENSE is the current-sense
resistance value, and CEQ and REQ are the time-constant
matching components.
Maxim Integrated │ 17
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Current Balance
The device integrates the difference between the currentsense voltages and adjusts the on-time of the second
phase to maintain current balance. The current balance
relies on the accuracy of the current-sense signals across
the current-sense resistor, inductor DCR, or provided
by the power stage (MAX15515). With active current
balancing, the current mismatch is determined by the
current-sense element values and the offset voltage of the
transconductance amplifiers:
=
I OS(IBAL) ILMAIN
=
- ILSEC
VOS(IBAL)
R SENSE
where RSENSE is the equivalent sense resistance across
CSP_, CSN_, and VOS(IBAL) is the current-balance offset specification in the Electrical Characteristics section.
The worst-case current mismatch occurs immediately
after a load transient due to inductor value mismatches,
resulting in different dI/dt for the two phases. The time it
takes for the current-balance loop to correct the transient
imbalance depends on the mismatch between the
inductor values and switching frequency.
Current Limit
The current-limit circuit employs a “valley” current-sensing
algorithm that senses the voltage across the currentsense inputs (CSP_ and CSN_). If the current-sense
signal (VCSP2, VCSN2 or VCSP1, VCSN1) of the selected
phase is above the current-limit threshold (VILIM), the
PWM controller does not initiate a new cycle for that
phase until its inductor current drops below the valley
current-limit threshold. Since only the valley current is
actively limited, the actual peak current is greater than
the current-limit threshold by an amount equal to 1/2 the
inductor ripple current:
DI
ILX(PEAK) = ILOAD +
2
ILX (VALLEY) = ILOAD -
DI
2
where :
t (V - V
)
DI = ON IN OUT
L
where L is the inductance value, tON is the on-time of
the high-side MOSFET, VOUT is the output voltage, and
VIN is the input voltage. Therefore, the exact current-limit
characteristic and maximum load capability are functions
of the current-sense resistance, inductor value, and
battery voltage.
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The positive valley current-limit threshold is preset for the
MAX15569. See the Electrical Characteristics section.
Current Limit Using Inductor DCR
or Sense Resistors
When using sense resistors or inductor DCR as
current-sensing elements, calculate the required sense
resistance (RSENSE) with the following equation:
R SENSE =
VLIM(MIN)
ILX(VALLEY)
where ILX(VALLEY) is the inductor valley current at OCP,
and VILIM(MIN) is 38mV ±3mV.
Carefully observe the PCB layout guidelines to ensure
that noise and trace errors do not corrupt the currentsense signals seen by the current-sense inputs (CSP_,
CSN_).
Current Limit with the MAX15515 Current Sense
When using the current-sensing method of the MAX15515,
calculate the CSP_ - CSN_ resistor (RCSP_) using the
following equation:
VLIM(MIN)
R CSP_ =
A×ILX(VALLEY)
where A is 10-5, ILX(VALLEY) is the inductor valley current
at OCP, and VILIM(MIN) is 38mV ±3mV.
Current Monitoring (IMON)
The device includes a current monitoring function. A
simplified data-acquisition system is employed to convert
the analog signals from the current-sense inputs to 8-bit
values in the IMON register (see Figure 5). The ADC converter filters the current-sense signal by averaging over
eight samples. The acquisition rate is 100µs. The content
of the IMON register is updated every 400µs.
The device includes a unidirectional transconductance
amplifier that sources current proportional to the positive current-sense voltage. The IMON output current is
defined by:
IIMON = Gm(IMON) x ∑(VCSP_ - VCSN_)
= Gm(IMON) x ILOAD x RSENSE
where Gm(IMON) is the transconductance amplifier
gain, as defined in the Electrical Characteristics section
(5.12µA/mV typ).
An external resistor (RIMON) between IMON and AGND
sets the current monitor output voltage:
VIMON = IIMON x RIMON
Maxim Integrated │ 18
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
MAX15569
IMON REGISTER
8-BIT DAC
RIMON = 2.56V/(RSENSE_ x Gm(IMON) x IOUT(MAX))
CIMON x RIMON = 150µs
0 TO 2.56V RANGE
CSP1
RSENSE1
NETWORK
CSN1
(VCSP1 - VCSN1)
IIMON
Gm(IMON)
IIMON
VIMON
RIMON
CIMON
CSP2
RSENSE2
NETWORK
CSN2
(VCSP2 - VCSN2)
3.2V
IMON CLAMP
Figure 5. IMON Network
where RSENSE is the value of the effective current-sense
resistance. Choose RIMON so that VIMON is 2.56V at the
full load current.
CIMON is the IMON averaging capacitor. IMON is
sampled every 400µs. Choose CIMON such that RIMON
x CIMON gives a time constant of approximately 150µs
(see Figure 5).
The IMON voltage is internally clamped to a maximum
3.2V (typ), preventing the IMON output from exceeding
the IMON voltage rating even under overload or shortcircuit conditions. IMON is high impedance when in
shutdown.
Feedback Adjustment Amplifier
Load-Line Amplifier (Steady State and AC Droop)
The device includes a transconductance amplifier for
controlling the load-line regardless of the sense impedance value. The input signal of the amplifier is the sum of
the current-sense voltages (VCSP1, VCSN1, and VCSP2,
VCSN2), which differentially sense the current-sense voltage. See Figure 6.
The AC-droop amplifier output (FBAC) connects to the
remote-sense point of the output through a resistor network
(RDROOP) that sets the DC and AC current-loop gain:
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VOUT = VTARGET - (RDROOP × IFBAC)
where the target voltage (VTARGET) is defined in the
Nominal Output-Voltage Selection section, and FBAC
amplifier’s output current (IFBAC) is determined by the
current-sense voltage:
IFBAC = Gm(FBAC) × Σ(VCSP_ - VCSN_)
where Gm(FBAC) = 1.2µA/mV (typ), as defined in the
Electrical Characteristics section. Since the feedback
voltage (VFB) is regulated to the SETVOUT voltage, the
output voltage changes in response to the FBAC current
(IFBAC) to create a load-line with accuracy defined by the
characteristics of the RDROOP network and Gm(FBAC).
The device supports flexible combinations of AC and DC
load-lines: An AC load-line > DC load-line, an AC load-line
= DC load-line, and an AC load-line < DC load-line.
● The effective impedance (ZFBAC) between the output
of the load-line transconductance amplifier (FBAC)
and the positive side of the remote-sensed output
voltage sets the transient AC droop.
● The effective impedance (ZFB) between the feedbacksense input (FB) and the positive side of the feedback
remote sense sets the static (DC) droop.
Maxim Integrated │ 19
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
● A capacitor from FBAC to FB (CFBAC) couples the AC
ripple from the output of the load-line transconductance amplifier to the feedback sense input.
• An integrator on FB corrects for output ripple and
ground-sense offset (see Figure 6).
When the device is used with differential current sensing:
RLL ≈ RDROOP × RSENSE × Gm(FBAC)
where RLL is the load-line, RSENSE is the effective
current-sense resistance across CSP_ and CSN_.
RDROOP is the effective resistance between the FBAC
output (for AC droop) or the FB input (for DC droop) and
the positive side of the remote-sensed output voltage.
See Table 2 for AC- and DC-droop settings circuit configuration.
When the inductor’s DCR is used as the current-sense
element, the current-sense inputs should include an NTC
thermistor to minimize the temperature dependence of
the load-line variation due to the DCR temperature coefficient. FBAC and FB are high impedance in shutdown.
ZFBAC x IFBAC SETS THE AC LOAD-LINE
MAX15569
CFBAC x RDROOP = tSW TO (10 x tSW)
RIPPLECOMPENSATION
CAPACITOR
IFBAC
Σ(CSP_ - CSN_)
RDROOP
RFBAC
FBAC
RFB
CFBAC
RFBS
FB
TO ERROR
AMPLIFIER
OUTPUT
10Ω
ZFB x IFBAC SETS THE STATIC LOAD-LINE
CPU VCC
SENSE
CFB
1nF
10Ω
GNDS
10Ω
COUT
10Ω
CPU GND
SENSE
CGNDS
1nF
HIGH-FREQUENCY CATCH RESISTORS
FILTER
SO FB REMAINS
CLOSED LOOPED
WITHOUT CPU
PRESENT
Figure 6. FB Network (Load-Line Control and Remote Sensing)
Table 2. AC-Droop and DC-Droop Settings
DC LOAD-LINE AC LOAD-LINE
(mV/A)
(mV/A)
RDROOP_AC
RDROOP_DC
RFB
CFBAC
NOTE
0
RLL_AC
RFBAC║RFBS*
0Ω
Open
CFBAC
RFBAC = RFBS*
RLL_DC
RLL_AC
RFBS* + RFB
(RFBAC = open)
RFBS*
(RFBAC = open)
RFB
CFBAC
DC load-line < AC load-line
RLL
RLL
Open
RFBS*
0Ω
Open
DC load-line = AC load-line
*See Figure 6.
www.maximintegrated.com
Maxim Integrated │ 20
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Differential Output-Voltage Remote Sense
ground-sense adjustment (VGNDS), as defined in the
following equation:
The device includes differential, remote-sense inputs
to eliminate the effects of voltage drops along the PCB
traces and through the power pins of the processor. The
feedback-sense node connects to the load-line resistor/
capacitor network (RDROOP/CFBAC). The ground-sense
(GNDS) input connects to an amplifier that adjusts the
feedback voltage to counteract the voltage drop in the
ground plane. Connect the load-line resistor (RDROOP)
and ground-sense (GNDS) input directly to the remotesense outputs of the processor, as shown in Figure 6. The
correction range is bounded to less than ±200mV. The
remote-sense lines draw less than ±0.5µA to minimize
the offset errors.
VTARGET = VFB - VDAC + VGNDS
where VDAC is the selected output voltage.
On startup, the device slews the target voltage from
ground to the default 1V boot voltage unless a different
voltage code is selected before EN is pulled high.
Dynamic Output-Voltage Transitions
The device’s transition time depends on the slew-rate
setting, the selected SETVOUT voltage difference, and
the accuracy of the slew-rate controller (see the slew rate
section in the Electrical Characteristics section). The slew
rate is not dependent on the total output capacitance, as
long as the required transition current plus existing load
current remains below the current limit. For dynamic VID
transitions, the transition time (tTRAN) is given by:
Steady-State Integrator Amplifier
The device utilizes internal integrator amplifiers that force
the DC average of the FB voltage to equal the target
voltage, allowing accurate DC output-voltage regulation regardless of the output voltage. The integrator is
designed to correct for the steady-state offsets/errors.
t TRAN =
Nominal Output-Voltage Selection
VNEW - VOLD
dV
( TARGET )
dt
where dVTARGET/dt is the slew rate (register 0x06h),
VOLD is the original output voltage, and VNEW is the new
target voltage (see Table 3).
The nominal no-load output voltage (VTARGET) is defined
by the selected voltage reference, plus the remote
Table 3. Output-Voltage Selection
LINE
BIT 7*
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
HEX
VOLTAGE
0
X
0
0
0
0
0
0
0
00h
0.000
1
X
0
0
0
0
0
0
1
01h
0.500
2
X
0
0
0
0
0
1
0
02h
0.510
3
X
0
0
0
0
0
1
1
03h
0.520
4
X
0
0
0
0
1
0
0
04h
0.530
5
X
0
0
0
0
1
0
1
05h
0.540
6
X
0
0
0
0
1
1
0
06h
0.550
7
X
0
0
0
0
1
1
1
07h
0.560
8
X
0
0
0
1
0
0
0
08h
0.570
9
X
0
0
0
1
0
0
1
09h
0.580
10
X
0
0
0
1
0
1
0
0Ah
0.590
11
X
0
0
0
1
0
1
1
0Bh
0.600
12
X
0
0
0
1
1
0
0
0Ch
0.610
13
X
0
0
0
1
1
0
1
0Dh
0.620
14
X
0
0
0
1
1
1
0
0Eh
0.630
15
X
0
0
0
1
1
1
1
0Fh
0.640
16
X
0
0
1
0
0
0
0
10h
0.650
17
X
0
0
1
0
0
0
1
11h
0.660
www.maximintegrated.com
Maxim Integrated │ 21
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 3. Output-Voltage Selection (continued)
LINE
BIT 7*
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
HEX
VOLTAGE
18
X
0
0
1
0
0
1
0
12h
0.670
19
X
0
0
1
0
0
1
1
13h
0.680
20
X
0
0
1
0
1
0
0
14h
0.690
21
X
0
0
1
0
1
0
1
15h
0.700
22
X
0
0
1
0
1
1
0
16h
0.710
23
X
0
0
1
0
1
1
1
17h
0.720
24
X
0
0
1
1
0
0
0
18h
0.730
25
X
0
0
1
1
0
0
1
19h
0.740
26
X
0
0
1
1
0
1
0
1Ah
0.750
27
X
0
0
1
1
0
1
1
1Bh
0.760
28
X
0
0
1
1
1
0
0
1Ch
0.770
29
X
0
0
1
1
1
0
1
1Dh
0.780
30
X
0
0
1
1
1
1
0
1Eh
0.790
31
X
0
0
1
1
1
1
1
1Fh
0.800
32
X
0
1
0
0
0
0
0
20h
0.810
33
X
0
1
0
0
0
0
1
21h
0.820
34
X
0
1
0
0
0
1
0
22h
0.830
35
X
0
1
0
0
0
1
1
23h
0.840
36
X
0
1
0
0
1
0
0
24h
0.850
37
X
0
1
0
0
1
0
1
25h
0.860
38
X
0
1
0
0
1
1
0
26h
0.870
39
X
0
1
0
0
1
1
1
27h
0.880
40
X
0
1
0
1
0
0
0
28h
0.890
41
X
0
1
0
1
0
0
1
29h
0.900
42
X
0
1
0
1
0
1
0
2Ah
0.910
43
X
0
1
0
1
0
1
1
2Bh
0.920
44
X
0
1
0
1
1
0
0
2Ch
0.930
45
X
0
1
0
1
1
0
1
2Dh
0.940
46
X
0
1
0
1
1
1
0
2Eh
0.950
47
X
0
1
0
1
1
1
1
2Fh
0.960
48
X
0
1
1
0
0
0
0
30h
0.970
49
X
0
1
1
0
0
0
1
31h
0.980
50
X
0
1
1
0
0
1
0
32h
0.990
51
X
0
1
1
0
0
1
1
33h
1.000
52
X
0
1
1
0
1
0
0
34h
1.010
53
X
0
1
1
0
1
0
1
35h
1.020
54
X
0
1
1
0
1
1
0
36h
1.030
55
X
0
1
1
0
1
1
1
37h
1.040
www.maximintegrated.com
Maxim Integrated │ 22
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 3. Output-Voltage Selection (continued)
LINE
BIT 7*
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
HEX
VOLTAGE
56
X
0
1
1
1
0
0
0
38h
1.050
57
X
0
1
1
1
0
0
1
39h
1.060
58
X
0
1
1
1
0
1
0
3Ah
1.070
59
X
0
1
1
1
0
1
1
3Bh
1.080
60
X
0
1
1
1
1
0
0
3Ch
1.090
61
X
0
1
1
1
1
0
1
3Dh
1.100
62
X
0
1
1
1
1
1
0
3Eh
1.110
63
X
0
1
1
1
1
1
1
3Fh
1.120
64
X
1
0
0
0
0
0
0
40h
1.130
65
X
1
0
0
0
0
0
1
41h
1.140
66
X
1
0
0
0
0
1
0
42h
1.150
67
X
1
0
0
0
0
1
1
43h
1.160
68
X
1
0
0
0
1
0
0
44h
1.170
69
X
1
0
0
0
1
0
1
45h
1.180
70
X
1
0
0
0
1
1
0
46h
1.190
71
X
1
0
0
0
1
1
1
47h
1.200
72
X
1
0
0
1
0
0
0
48h
1.210
73
X
1
0
0
1
0
0
1
49h
1.220
74
X
1
0
0
1
0
1
0
4Ah
1.230
75
X
1
0
0
1
0
1
1
4Bh
1.240
76
X
1
0
0
1
1
0
0
4Ch
1.250
77
X
1
0
0
1
1
0
1
4Dh
1.260
78
X
1
0
0
1
1
1
0
4Eh
1.270
79
X
1
0
0
1
1
1
1
4Fh
1.280
80
X
1
0
1
0
0
0
0
50h
1.290
81
X
1
0
1
0
0
0
1
51h
1.300
82
X
1
0
1
0
0
1
0
52h
1.310
83
X
1
0
1
0
0
1
1
53h
1.320
84
X
1
0
1
0
1
0
0
54h
1.330
85
X
1
0
1
0
1
0
1
55h
1.340
86
X
1
0
1
0
1
1
0
56h
1.350
87
X
1
0
1
0
1
1
1
57h
1.360
88
X
1
0
1
1
0
0
0
58h
1.370
89
X
1
0
1
1
0
0
1
59h
1.380
90
X
1
0
1
1
0
1
0
5Ah
1.390
91
X
1
0
1
1
0
1
1
5Bh
1.400
92
X
1
0
1
1
1
0
0
5Ch
1.410
93
X
1
0
1
1
1
0
1
5Dh
1.420
www.maximintegrated.com
Maxim Integrated │ 23
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 3. Output-Voltage Selection (continued)
LINE
BIT 7*
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
HEX
VOLTAGE
94
X
1
0
1
1
1
1
0
5Eh
1.430
95
X
1
0
1
1
1
1
1
5Fh
1.440
96
X
1
1
0
0
0
0
0
60h
1.450
97
X
1
1
0
0
0
0
1
61h
1.460
98
X
1
1
0
0
0
1
0
62h
1.470
99
X
1
1
0
0
0
1
1
63h
1.480
100
X
1
1
0
0
1
0
0
64h
1.490
101
X
1
1
0
0
1
0
1
65h
1.500
102
X
1
1
0
0
1
1
0
66h
1.510
103
X
1
1
0
0
1
1
1
67h
1.520
104
X
1
1
0
1
0
0
0
68h
1.530
105
X
1
1
0
1
0
0
1
69h
1.540
106
X
1
1
0
1
0
1
0
6Ah
1.550
107
X
1
1
0
1
0
1
1
6Bh
1.560
108
X
1
1
0
1
1
0
0
6Ch
1.570
109
X
1
1
0
1
1
0
1
6Dh
1.580
110
X
1
1
0
1
1
1
0
6Eh
1.590
111
X
1
1
0
1
1
1
1
6Fh
1.600
112
X
1
1
1
0
0
0
0
70h
1.610
113
X
1
1
1
0
0
0
1
71h
1.620
114
X
1
1
1
0
0
1
0
72h
1.630
115
X
1
1
1
0
0
1
1
73h
1.640
116
X
1
1
1
0
1
0
0
74h
1.650
117
X
1
1
1
0
1
0
1
75h
1.660
118
X
1
1
1
0
1
1
0
76h
1.670
119
X
1
1
1
0
1
1
1
77h
1.680
120
X
1
1
1
1
0
0
0
78h
1.690
121
X
1
1
1
1
0
0
1
79h
1.700
122
X
1
1
1
1
0
1
0
7Ah
1.710
123
X
1
1
1
1
0
1
1
7Bh
1.720
124
X
1
1
1
1
1
0
0
7Ch
1.730
125
X
1
1
1
1
1
0
1
7Dh
1.740
126
X
1
1
1
1
1
1
0
7Eh
1.750
127
X
1
1
1
1
1
1
1
7Fh
1.760
*Bit 7 is ignored (don’t care), but listed here to match the VOUTMAX register.
X = Don’t care.
Note: DAC codes above 1.6V are not advised due to proximity to the overvoltage threshold.
www.maximintegrated.com
Maxim Integrated │ 24
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Soft-start uses the slow slew rate, as set by the default
setting in the SRREG register, which is a fraction of the
fast slew rate. See the slew-rate accuracy specification in
the Electrical Characteristics section. The average inductor current per phase that is required to make an outputvoltage transition is given by:
IL =
C OUT dV TARGET
×
NPH
dt
where dVTARGET/dt is the required slew rate, COUT is
the total output capacitance, and NPH is the number of
active phases.
At the beginning of an output-voltage transition, the
device blanks the INT, so the open-drain output enters a
high-impedance state during output-voltage transitions.
The controller releases the INT output approximately
4µs (typ) after the slew-rate controller reaches the target
output voltage.
Automatic Pulse-Skipping Operation
The device automatically operates with a 2-phase pulseskipping control scheme. A logic-low level on DRVSKP
enables the zero-crossing comparator of the driver
(MAX17492) or power stage (MAX15515). Therefore,
these devices disable their low-side MOSFETs when they
detect “zero” inductor current. This keeps the inductor
from discharging the output capacitors and forces the
controller to skip pulses under light-load conditions to
avoid overcharging the output.
If the system changes the VID code to a lower voltage, the
device drives DRVSKP high to disable the pulse-skipping
mode. This allows the regulator to actively discharge the
output at the programmed slew rate.
To disable pulse-skipping mode so the regulator continually operates in forced-PWM operation, leave DRVSKP
unconnected and connect the pulse-skipping control input
on the driver or power stage to ground.
Automatic Pulse-Skipping Switchover
In pulse-skipping mode, an inherent automatic switchover
to PFM takes place at light loads. This switchover is affected by a comparator that truncates the low-side switch
on-time at the inductor current’s zero crossing. The zerocrossing detection is designed into the MAX17492 driver
and the MAX15515 power stage. They sense the inductor
current across the low-side MOSFET. Once the LX voltage crosses the zero-crossing comparator threshold, the
low-side MOSFET turns off. This mechanism causes the
www.maximintegrated.com
threshold between pulse-skipping PFM and non-skipping
PWM operation to coincide with the boundary between
continuous and discontinuous inductor-current operation.
The PFM/PWM crossover occurs when the load current of
each phase is equal to 1/2 the peak-to-peak ripple current
that is a function of the inductor value. Even for wide 4.5V
to 14V input voltage ranges, this crossover is relatively
constant, with only a minor dependence on the input voltage due to the typically low duty cycles. The total load current at the PFM/PWM crossover threshold (ILOAD(SKIP))
is approximately:
(V -V
)t
ILOAD(SKIP) = IN OUT ON
2L
Power-Up Sequence (POR, UVLO)
Power-on reset (POR) occurs when VBIAS and VTT
rise above approximately 2V. POR resets the fault
latch and loads the default register settings. The VBIAS
UVLO circuitry inhibits switching until VBIAS rises
above 4.5V. The controller powers up the reference
once the system enables the controller, VBIAS is above
4.5V, and EN is driven high (see Figure 2). With the
reference in regulation, the controller ramps up to the
selected output voltage (register 0x07h) at the selected
slow slew rate (register 0x06h)
After this initialization, the PWM controller begins
switching:
t TRAN(START) =
VBOOT
(dV TARGET /dt)
where dVTARGET/dt is the slew rate. The soft-start slew
rate is the slow slew rate set by the default setting in the
SRREG register. The soft-start circuitry does not use a
variable current limit, so full output current is available
immediately.
Interrupt (INT)
The device provides an active-low interrupt output (INT)
to indicate that the startup sequence is complete and
the output voltage has moved to the programmed VID
value. This signal is intended for system monitoring of
the device. INT remains high impedance during normal
DC-DC operation. The controller asserts INT to alert the
system of an alarm event or if a fault condition occurs.
See the Alarms and Fault Protection (Latched) sections
for details (and Figure 7).
Use an external pullup resistor between INT and 3.3V to
deliver a valid logic-level output.
Maxim Integrated │ 25
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
tEN ≥ = 0ns
VBIAS
VTT
ENABLE
INT
VOUT
tCAL
tSS
tSTRT
tSS
Figure 7. Startup Sequence
Alarms
Temperature Comparator (VRHOT)
The device features an independent comparator with
input at THERM. This comparator has an accurate threshold of 0.5 x VBIAS. Use a 100kΩ NTC with a β of 4250K.
The NTC resistance drops to 5.68kΩ when the temperature reaches +100°C. The NTC forms a divider with the
internal 5.35kΩ pullup resistance, so the voltage drops
below the 0.5 x VBIAS threshold. VRHOT is then asserted.
The internal 5.35kΩ resistor is disconnected in shutdown,
saving power.
Overcurrent Warning (OC)
The device includes an overcurrent-warning threshold
that samples the phase 1 current-sense signal before
each phase 1 on-time. When the CSP1 - CSN1 voltage
exceeds the 23mV (typ) threshold, the status bit (D2) in
register 0x04h) is asserted. If the warning is not masked,
the controller asserts the INT output to alert the system to
the overcurrent condition.
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The fixed 23mV OC_ALARM threshold is 15mV
lower than the valley current-limit threshold to provide
sufficient design margin before the regulator limits the output
current. Additionally, the controller includes a IMON
register that can be monitored by the system.
Output-Code Violation (VOUTMAX)
The controller includes a maximum output register
(VOUTMAX register 0x02h) to protect against target
output voltage codes that could violate the absolute maximum rating of the load. The value of this configuration
register limits the output range. If a target output voltage
is loaded into register 0x07h, the regulator sets the appropriate status bit. If the warning is not masked, the controller asserts the INT output to alert the system to the overcurrent condition. The output voltage attempts to ramp to
the new target, but the regulator effectively clamps the
output to the VOUTMAX voltage to avoid an overvoltage
condition. See the I2C Commands and Registers section
for additional details.
Maxim Integrated │ 26
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Fault Protection (Latched)
TON Open-Circuit Protection
The TON input includes open-circuit protection to avoid
long, uncontrolled on-times that could result in an overvoltage condition on the output. The device detects an
open-circuit fault if the TON current drops below 6µA
(typ) for any reason (e.g., the TON resistor (RTON) is
unpopulated, a high-resistance value is used, the input
voltage is low, etc.). Under these conditions, the device
stops switching (DRVPWM_ outputs become high impedance and DRVSKP is pulled low) and immediately sets
the fault latch.
Toggle EN or cycle power (BIAS) below 1V to clear the
fault latch and reactivate the controller. The TON opencircuit fault is not indicated in the STATUS register.
Output Overvoltage Protection (OVP)
The OVP circuit is designed to protect the load against a
shorted high-side MOSFET by drawing high current and
activating the adapter or battery protection circuits. The
device continuously monitors the output for an overvoltage fault. An OVP fault is detected if the output voltage
exceeds the VID DAC voltage by more than 300mV (min),
or the fixed 1.83V (typ) threshold during a downward VID
transition in skip mode.
During pulse-skipping operation, the OVP threshold
tracks the VID DAC voltage as soon as the output is in
regulation; otherwise, the fixed 1.83V (typ) threshold is
used. When the OVP circuit detects an overvoltage fault,
the DRVPWM_ outputs become high impedance and the
DRVSKP output is pulled high. OVP is disabled in the
standby power state (EN pulled low).
After the fault condition occurs, the I2C interface remains
active so the STATUS register can be read to determine
what triggered the fault. Toggle EN or cycle power (BIAS)
below 1V to clear the fault latch. With the fault latch
cleared and the fault condition removed, the regulator
powers back up and the fault conditions are deasserted
in the STATUS register.
Output Undervoltage Protection (UVP)
If the output voltage is 200mV (min) below the target voltage and stays below this level for 200µs (typ), the controller activates the shutdown sequence. The regulator
turns on a 2kΩ discharge resistor and sets the fault latch.
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DRVPWM_ outputs go to the high-impedance mode and
DRVSKP is pulled low.
After the fault condition occurs, the I2C interface remains
active so the STATUS register can be read to determine
what triggered the fault. Toggle EN or cycle power (BIAS)
below 1V to clear the fault latch. With the fault latch
cleared and the fault condition removed, the regulator
powers back up and the fault conditions are deasserted
in the STATUS register.
Thermal-Fault Protection (TSHDN)
The device features an internal thermal-fault protection circuit. When the junction temperature rises above
+160°C, a thermal sensor sets the fault latch and
DRVPWM_ becomes high impedance.
After the fault condition occurs, the I2C interface remains
active so the STATUS register can be read to determine
what triggered the fault. Toggle EN or cycle power (BIAS)
below 1V to clear the fault latch. With the fault latch
cleared, the regulator powers back up and the fault conditions are deasserted in the STATUS register, as long as
the regulator has cooled by 15°C (typ).
External Driver and Disabling Phases
The device supports an external driver (MAX15515) for
both phases. The DRVPWM_ outputs provide the signals
to trigger the drivers. Connecting CSP2 to BIAS of the
device disables the second phase.
The device provides a pulse-skipping-mode control output
(DRVSKP) for the external driver control. DRVSKP goes
high when the controller detects an output overvoltagefault condition. DRVSKP is high during output-voltage
transitions. The DRVSKP output is unconnected in shutdown.
I2C Interface, Commands, Registers,
and Digital Control
A simplified register summery of the I2C interface for the
device is shown in Table 4. The I2C interface consists of
a high-speed transceiver capable of 3.4MHz data rate.
Regulator Address
The device does not feature programmable addressing.
These devices are hard-coded with bus address 70h.
Maxim Integrated │ 27
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 4. I2C Command and Data Register Summary
COMMAND
MASTER
PAYLOAD
SLAVE
PAYLOAD
DESCRIPTION
HEX
NAME
WRITE
READ
00h
—
—
—
Reserved.
01h
—
—
—
Reserved.
02h
VOUTMAX
Configures
maximum output
code
03h
—
—
The maximum allowable output voltage (0.510V to 1.76V) that can
Returns maximum be set by user. In case the I2C interface receives a set voltage
command higher than the VOUTMAX value, the regulator slews the
output code
output to VOUTMAX set voltage. Default is 51h (1.3V).
—
Reserved.
Bits D[5:0] of this register consist of the VRHOT flag (bit D5),
undervoltage flag (bit D4), overvoltage flag (bit D3), overcurrent
flag (bit D2), VOUTMAX flag (bit D1), and INT flag (bit D0). Bits
D[7:6] are not used and return 0. For a detailed description, see
the Regulator Status (0x04h) section. The STATUS register is set
regardless of the MASK register (0x05) content.
STATUS
—
Regulator
status
MASK
Configures mask
status
Current mask
status
Writing to this register prevents the assertion of the INT output when
the specific fault or alarm is masked. This register does not mask
the STATUS register indication.
Default is 00h (no masking).
SLEW_RATE
Configures the
output-voltage
slew rate
Returns the
output-voltage
slew rate
Writing to this register sets the slew rate (volt/second) of the
output voltage during the initial startup and dynamic output-voltage
transitions.
Default is 04h (4.5mV/µs for soft-start and 9mV/µs for dynamic
transitions).
07h
SETVOUT
Selects the
output code
Returns the
output code
08h
IMON
—
04h
05h
06h
Returns the output This register returns the average output current value. IMON is
current value
updated every 400µs.
I2C Commands and Registers
The device supports the following commands and
registers shown in Table 4.
VOUTMAX Control (0x02h)
This register is programmed by the bus master to the
maximum output voltage the regulator is allowed to support. Any attempts to set the SETVOUT above VOUTMAX
are acknowledged by setting the output voltage to the
content of the VOUTMAX register. The default value is
51h (1.3V). See Table 5 for bit descriptions.
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The 07h command sets the target output voltage. The regulator
transitions up or down to the new output voltage 0.5µs after the
command is acknowledged.
Default is 33h (1V).
Regulator Status (0x04h)
This register consists of six flags that determine the status
of the regulator in case of thermal warning, overvoltage
fault, undervoltage fault, output overcurrent warning, and
maximum output violation. The INT bit (D0) is asserted in
case of any unmasked event. See Table 6 for bit descriptions.
1) The VRHOT bit (D5) is set when the voltage at
THERM pin goes below its nominal threshold (see the
Electrical Characteristics section).
2) The UV bit (D4) is set when the output voltage drops
200mV lower than SETVOUT value for 200µs.
Maxim Integrated │ 28
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 5. VOUTMAX (Maximum Output Voltage Allowed)
I2C
COMMAND
DEFAULT
0x02h
0x51h
TYPE
D7
D6
D5
D4
D3
D2
D1
D0
VMAX_7
VMAX_6
VMAX_5
VMAX_4
VMAX_3
VMAX_2
VMAX_1
VMAX_0
BIT
NAME
D7
VMAX_7
R/W
Don’t care bit. Returns 0 when read.
DESCRIPTION
D6
VMAX_6
R/W
MSB of the maximum allowed output voltage code.
D5
VMAX_5
R/W
D4
VMAX_4
R/W
—
—
D3
VMAX_3
R/W
D2
VMAX_2
R/W
D1
VMAX_1
R/W
—
D0
VMAX_0
R/W
LSB of the maximum allowed output voltage code. 10mV resolution.
—
—
Table 6. STATUS (Regulator Status)
I2C
COMMAND
DEFAULT
0x04h
0x00h
BIT
NAME
D7
—
R
Always reads 0.
D6
—
R
Always reads 0.
D5
VRHOT
R
VRHOT
D4
UV
R
UV (VOUT undervoltage)
D3
OV
R
OV (VOUT overvoltage)
D2
OC
R
OC (output current over current limit). This bit is sticky and cleared when read if the OC fault
is no longer present.
D1
VMERR
R
VOUTMAX error. Set = 1 if (VID > VOUTMAX)
D0
INT
R
NORed bits D[5:1], read-only, sets the INT output.
TYPE
D7
D6
D5
D4
D3
D2
D1
D0
X
X
VRHOT
UV
OV
OC
VMERR
INT#
DESCRIPTION
X = Don’t care.
3) The OV bit (D3) is set when the output voltage rises
300mV above (or 1.83V fixed) the output voltage.
4) The OC bit (D2) is set when the valley of (∑CSP1 CSN1) current signal exceeds 23mV (OC_ALARM).
The current-limit protection threshold is 15mV higher
than the OC_ALARM.
5) The VMERR bit (D1) is set in case the SETVOUT
exceeds the content of VOUTMAX. Changing SETVOUT
to values lower than VOUTMAX clears the VMERR warning.
6) Masking of the status bit only prevents the INT bit (D0)
from being set by the specific status bit. The status bit
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is still set if the fault occurs, regardless of the status
mask setting. The OC bit (D2) is sticky, but it does not
hold INT low when the OC fault goes away. This allows
the system to determine what event triggered INT to
go low. All other fault bits are not sticky. Reading the
register after the OC event clears the flag.
Mask Status (0x05h)
Masking of the status bit only prevents the INT bit (D0)
from being set by the specific status bit. The status bit is
still set if the fault occurs, regardless of the Status Mask
setting. See Table 7 for bit descriptions.
Maxim Integrated │ 29
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 7. MASK (Regulator Status Mask Register)
I2C COMMAND
DEFAULT
0x05h
0x00h
BIT
NAME
D7
—
TYPE
D7
D6
X
X
D5
D4
D3
VRHMSK UVMSK
D2
OVMSK
D1
D0
OCMSK VMERRMSK Reserved
DESCRIPTION
R
Always reads 0.
Always reads 0.
D6
—
R
D5
VRHMSK
R/W
VRHOT masking bit.
D4
UVMSK
R/W
Undervoltage-fault masking bit.
D3
OVMSK
R/W
Overvoltage-fault masking bit.
D2
OCMSK
R/W
Overcurrent-fault masking bit.
D1
VMERRMSK
R/W
VOUTMAX error masking bit.
D0
—
R
Always reads 0.
X = Don’t care.
Note: In the event of UV, OC, OV, VRHOT, or VMERR, the signal is ANDed by the complement of the MASK register content.
STATUS REGISTER
FAULT OR ALARM EVENT
STATUS BIT 0
(INT STATE)
INT
OUTPUT PIN
MASK REGISTER
OTHER STATUS
LOGIC
Figure 8. Status Bit Masking
Table 8. SRREG (Slew-Rate Setting Register)
I2C COMMAND
DEFAULT
TYPE
D7
D6
X
X
0x06h
0x04h
BIT
NAME
D7
—
R/W
See Table 9
D6
—
R/W
See Table 9
D5
SRREG_5
R/W
See Table 9
D4
SRREG_4
R/W
See Table 9
D3
SRREG_3
R/W
See Table 9
D2
SRREG_2
R/W
See Table 9
D1
SRREG_1
R/W
See Table 9
D0
SRREG_0
R/W
See Table 9
D5
D4
D3
D2
D1
D0
SRREG_5 SRREG_4 SRREG_3 SRREG_2 SRREG_1 SRREG_0
DESCRIPTION
X = Don’t care.
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Maxim Integrated │ 30
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Slew-Rate Configuration (0x06h)
The content of the SRREG register determines the slew
rate at both initial startup and dynamic output-voltage
transition. There are 52 possibilities of selectable slew
rates (4.5mV/µs to 44mV/µs) that cover the initial startup
(soft-start) and dynamic output-voltage transition with
different slew rates in one setting. See Table 8 for bit
descriptions and Table 9 for slew-rate selections.
Table 9. Slew-Rate Selections (Register 0x06h)
D7
D6
D5
D4
D3
D2
D1
D0
SOFT-START SLEW RATE
(mV/µs)
REGULAR SLEW RATE
(mV/µs)
X
X
0
0
0
0
0
0
18
18
X
X
0
0
0
0
0
1
9
18
X
X
0
0
0
0
1
0
4.5
18
X
X
0
0
0
0
1
1
9
9
X
X
0
0
0
1
0
0
4.5*
9*
X
X
0
0
0
1
0
1
36
36
X
X
0
0
0
1
1
0
18
36
X
X
0
0
0
1
1
1
9
36
X
X
0
0
1
0
0
0
4.5
36
X
X
0
0
1
0
0
1
4.5
4.5
X
X
0
0
1
0
1
X
4.5
9
X
X
0
0
1
1
0
X
4.5
9
X
X
0
0
1
1
1
0
4.5
9
X
X
0
1
0
0
0
0
22
22
X
X
0
1
0
0
0
1
11
22
X
X
0
1
0
0
1
0
5.5
22
X
X
0
1
0
0
1
1
11
11
X
X
0
1
0
1
0
0
5.5
11
X
X
0
1
0
1
0
1
44
44
X
X
0
1
0
1
1
0
22
44
X
X
0
1
0
1
1
1
11
44
X
X
0
1
1
0
0
0
5.5
44
X
X
0
1
1
0
0
1
5.5
5.5
X
X
0
1
1
0
X
X
5.5
11
X
X
0
1
1
1
1
0
5.5
11
X
X
1
0
0
0
0
0
14
14
X
X
1
0
0
0
0
1
7
14
X
X
1
0
0
0
1
0
3.5
14
X
X
1
0
0
0
1
1
7
7
X
X
1
0
0
1
0
0
3.5
7
X
X
1
0
0
1
0
1
28
28
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Maxim Integrated │ 31
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 9. Slew-Rate Selections (Register 0x06h) (continued)
D7
D6
D5
D4
D3
D2
D1
D0
SOFT-START SLEW RATE
(mV/µs)
REGULAR SLEW RATE
(mV/µs)
X
X
1
0
0
1
1
0
14
28
X
X
1
0
0
1
1
1
7
28
X
X
1
0
1
0
0
0
3.5
28
X
X
1
0
1
0
0
1
3.5
3.5
X
X
1
0
1
0
1
0
3.5
7
X
X
1
0
1
0
1
1
3.5
7
X
X
1
0
1
1
0
0
3.5
7
X
X
1
0
1
1
0
1
3.5
7
X
X
1
0
1
1
1
0
3.5
7
X
X
1
1
0
0
0
0
18
18
X
X
1
1
0
0
0
1
9
18
X
X
1
1
0
0
1
0
4.5
18
X
X
1
1
0
0
1
1
9
9
X
X
1
1
0
1
0
0
4.5
9
X
X
1
1
0
1
0
1
36
36
X
X
1
1
0
1
1
0
18
36
X
X
1
1
0
1
1
1
9
36
X
X
1
1
1
0
0
0
4.5
36
X
X
1
1
1
0
0
1
4.5
4.5
X
X
1
1
1
0
X
X
4.5
9
X
X
1
1
1
1
1
0
4.5
9
*POR default setting.
X = Don’t care.
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Maxim Integrated │ 32
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Output-Voltage Set Register (0x07h)
Current Monitor Register (0x08h)
The SETVOUT register slews the output voltage 0.5µs
after the SETVOUT command is acknowledged. The
slew rate of the change in output voltage is equal to the
value set by SRREG. The device DAC supports voltages between 0.5V and 1.6V. See Table 3 for the outputvoltage codes and Table 10 for bit descriptions.
The device includes a current monitoring function. An
internal ADC converts the analog signals from the IMON
pin output to 8-bit values in the IMON register. The ADC
converter filters the current-sense signal by averaging
over four samples. The acquisition rate is 100µs. The
content of this register is updated every 400µs. For more
information on how to set the desired value for IMON
resolution, see the Current Monitoring (IMON) section.
See Table 11 for bit descriptions.
Table 10. SETVOUT (Output-Voltage Set Register)
I2C COMMAND
DEFAULT
0x07
0x33
BIT
NAME
D7
VID_7
R
Don’t care bit. Returns 0 when read.
D6
VID_6
R
MSB of the maximum allowed output voltage code
D5
VID_5
R
D4
VID_4
R
D3
VID_3
R
D2
VID_2
R
D1
VID_1
R
D0
VID_0
R
TYPE
D7
D6
D5
D4
D3
D2
D1
D0
VID_7
VID_6
VID_5
VID_4
VID_3
VID_2
VID_1
VID_0
DESCRIPTION
See Table 3 for the actual output-voltage code.
LSB of the maximum allowed output-voltage code. 10mV resolution.
Table 11. IMON (Current Monitor Register)
I2C COMMAND
DEFAULT
0x08h
0x00h
BIT
NAME
D7
IM_7
R
D6
IM_6
R
D5
IM_5
R
D4
IM_4
R
D3
IM_3
R
D2
IM_2
R
D1
IM_1
R
D0
IM_0
R
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TYPE
D7
D6
D5
D4
D3
D2
D1
D0
—
—
—
—
—
—
—
—
DESCRIPTION
—
—
—
—
—
—
—
—
Maxim Integrated │ 33
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Multiphase QuickTune-PWM Design
Procedure
Firmly establish the input voltage range and maximum
load current before choosing a switching frequency
and inductor operating point (ripple-current ratio). The
primary design trade-off lies in choosing a good switching
frequency and inductor operating point, and the following
four factors dictate the rest of the design:
1) Input Voltage Range: The maximum value (VIN(MAX))
must accommodate the worst-case high AC adapter voltage. The minimum value (VIN(MIN)) must
account for the lowest input voltage after drops due to
connectors, fuses, and battery selector switches. If
there is a choice at all, lower input voltages result in
better efficiency.
2) Maximum Load Current: There are two values to
consider. The peak load current (ILOAD(MAX)) determines the instantaneous component stresses and
filtering requirements, and drives output-capacitor
selection, inductor saturation rating, and the design of
the current-limit circuit. The continuous-load current
(ILOAD) determines the thermal stresses and drives
the selection of the input capacitors, MOSFETs, and
other critical heat-contributing components. Modern
notebook CPUs generally exhibit ILOAD = 0.8 x
ILOAD(MAX). For multiphase systems, each phase
supports a fraction of the load, depending on the
current balancing. When properly balanced, the load
current is evenly distributed among phases:
I
ILOAD(PHASE) = LOAD
NPH
where NPH is the total number of active phases.
3) Switching Frequency: This choice determines the
basic trade-off between size and efficiency. The
optimal frequency is largely a function of maximum
input voltage due to MOSFET switching losses
that are proportional to frequency and VIN2. The
optimum frequency is also a moving target due to rapid
improvements in MOSFET technology that are making
higher frequencies more practical.
4) Inductor Operation Point: This choice provides tradeoffs between size vs. efficiency and transient responses vs. output noise. Low inductor values provide better
transient response and smaller physical size, but also
result in lower efficiency and higher output noise due
to increased ripple current. The minimum practical
inductor value is one that causes the circuit to operate
at the edge of critical conduction (where the inductor
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current just touches zero with every cycle at maximum
load). Inductor values lower than this grant no further
size-reduction benefit. The optimum operating point is
usually between 30% and 50% ripple current. For a
multiphase core regulator, select an LIR value of ~0.4.
Inductor Selection
The switching frequency and operating point (% ripple
current or LIR) determine the inductor value as follows:

 V

VIN - VOUT
 OUT
 f SW × ILOAD(MAX) × LIR  VIN 


L = NPH 
where NPH is the total number of phases. Find a low-loss
inductor having the lowest possible DC resistance that fits
in the allotted dimensions. The core must not saturate at
the peak-inductor current (IPEAK):
 ILOAD(MAX)  LIR 
1 +

NPH
2 


=
IPEAK 

Output Capacitor Selection
Output capacitor selection is determined by the controller
stability and the transient soar and sag requirements of
the application.
Output Capacitor ESR
The output filter capacitor must have low enough
effective series resistance (ESR) to meet output-ripple
and load-transient requirements, yet have high enough
ESR to satisfy stability requirements. In CPU VCORE
converters and other applications where the output is
subject to large-load transients, the size of the output
capacitor typically depends on how much ESR is needed
to prevent the output from dipping too low under a load
transient. Ignoring the sag due to finite capacitance:
VSTEP
(R ESR + R PCB ) ≤
DILOAD(MAX)
The output-voltage ripple of a step-down controller equals
the total inductor ripple current multiplied by the output
capacitor’s ESR. When operating multiphase out-ofphase systems, the peak inductor currents of each phase
are staggered, resulting in lower output ripple voltage by
reducing the total inductor ripple current. For multiphase
operation, the maximum ESR to meet ripple requirements
is given in the following equation:


VIN × f SW × L
R ESR ≤ 
 VRIPPLE
(VIN − (NPH × VOUT ))VOUT 
where NPH is the total number of active phases and fSW
is the switching frequency per phase.
Maxim Integrated │ 34
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
The actual capacitance value required relates to the
physical size needed to achieve low ESR, as well as to
the chemistry of the capacitor technology. The capacitor is
usually selected by ESR and voltage rating rather than by
capacitance value (this is true for polymer types). When
using low-capacity ceramic filter capacitors, capacitor size
is usually determined by the capacity needed to prevent
VSAG and VSOAR from causing problems during load
transients. Generally, once enough capacitance is added
to meet the overshoot requirement, undershoot at the
rising load edge is no longer a problem (see the VSAG
and VSOAR equations in the Transient Response section).
Output Capacitor Stability Considerations
For QuickTune-PWM controllers, stability is determined
by the value of the ESR zero relative to the switching
frequency. The boundary of instability is given by the
following equation:
f
f ESR ≤ SW
π
where:
f ESR =
and:
1
2π × R EFF × C OUT
R EFF= R ESR + R LL + R PCB
where COUT is the total output capacitance, RESR is the
total equivalent series resistance, RLL is the load-line
gain, and RPCB is the parasitic board resistance between
the output capacitors and sense resistors. For a 1MHz
application, the ESR zero frequency must be well below
300kHz, preferably below 100kHz. SANYO POSCAP
and Panasonic SP capacitors are widely used and have
typical ESR zero frequencies below 100kHz.
Ceramic capacitors have a high-ESR zero frequency,
but applications with significant load-line (DC-coupled
or AC-coupled) can take advantage of their size and
low ESR. When using only ceramic output capacitors,
output overshoot (VSOAR) typically determines the minimum output-capacitance requirement. Their relatively
low capacitance value favors high-switching-frequency
operation with small inductor values to minimize the
energy transferred from inductor to capacitor during loadstep recovery. Unstable operation manifests itself in two
related but distinctly different ways: Double pulsing and
feedback-loop instability.
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Double Pulsing and Feedback-Loop Instability
Double pulsing occurs due to noise on the output or
because the ESR is so low that there is not enough voltage ramp in the output-voltage signal. This “fools” the error
comparator into triggering a new cycle immediately after
the minimum off-time period has expired. Double pulsing
is more annoying than harmful, resulting in nothing worse
than increased output ripple. However, it can indicate the
possible presence of loop instability due to insufficient
ESR. Loop instability can result in oscillations at the output after line or load steps. Such perturbations are usually
damped, but can cause the output voltage to rise above
or fall below the tolerance limits. The easiest method
for checking stability is to apply a very fast 10% to 90%
maximum load transient and carefully observe the outputvoltage ripple envelope for overshoot and ringing. It can
help to simultaneously monitor the inductor current with
an AC current probe. Do not allow more than one cycle
of ringing after the initial step-response under/overshoot.
Transient Response
The inductor-ripple current impacts transient-response
performance, especially at low VIN - VOUT differentials.
Low inductor values allow the inductor current to slew
faster, replenishing charge removed from the output filter
capacitors by a sudden load step. The amount of output
sag is also a function of the maximum duty factor, which
can be calculated from the on-time and minimum off-time.
For a multiphase controller, the worst-case output sag
voltage can be determined by:
VSAG ≈
and:
L( DILOAD(MAX) ) 2
2NPH × C OUT × VOUT
×
t MIN
t SW - t MIN
t MIN
= t ON + t OFF(MIN)
where tOFF(MIN) is the minimum off-time (see the Electrical
Characteristics section), tSW is the programmed switching period, and NPH is the total number of active phases.
VSAG must be less than the transient droop, ΔILOAD(MAX)
x RLL. The capacitive soar voltage due to stored inductor
energy can be calculated as:
VSOAR ≈
( DILOAD(MAX) ) 2 L
2NPH × C OUT × VOUT
The actual peak of the soar voltage depends on the time
where the decaying ESR step and rising capacitive soar
are at their maximum. This is best simulated or measured.
Maxim Integrated │ 35
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Input Capacitor Selection
The input capacitor must meet the ripple-current requirement (IRMS) imposed by the switching currents. The
multiphase QuickTune-PWM controllers operate out-of
phase, reducing the RMS input. The IRMS requirements
can be determined by the following equation:
 I

IRMS =  LOAD  NPH × VOUT ( VIN - (NPH × VOUT ))
 NPH × VIN 
The worst-case RMS current requirement occurs when
operating with VIN = 2 (NPH × VOUT). Therefore, the
above equation simplifies to IRMS = 0.5 x (ILOAD/NPH).
Choose an input capacitor that exhibits less than 10°C
temperature rise at the RMS input current for optimal
circuit longevity.
Applications Information
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. The switching power
stage requires particular attention. If possible, mount
all the power components on the top side of the board,
with their ground terminals flush against one another.
The layout of the device is intimately related to the
layout of the CPU. The high-current output paths from the
regulator must flow cleanly into the high-current inputs
on the processor. For VR12.6 processors, these inputs
are orthogonal. This arrangement effectively forces the
regulator to be located diagonally, with respect to the
processor. Refer to the MAX15569 evaluation kit specifications for layout examples and follow these guidelines
for good PCB layout:
● Connect all analog grounds to a separate solidcopper plane that connects to the ground pin of the
QuickTune-PWM controller. This includes the VBIAS
bypass capacitor, FB, and GNDS bypass capacitors.
● Keep the power traces and load connections short.
This is essential for high efficiency. The use of thick
copper PCB (2oz vs. 1oz) can enhance full-load
efficiency by 1% or more. Correctly routing PCB traces
is a difficult task that must be approached in terms of
fractions of centimeters, where a single mΩ of excess
trace resistance causes a measurable efficiency
penalty.
● CSP_ and CSN_ connections for current limiting, loadline control, and current monitoring must be made
using Kelvin-sense connections to guarantee the
current-sense accuracy.
● When trade-offs in trace lengths must be made, it is
preferable to allow the inductor charging path to be
made longer than the discharge path. For example,
it is better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the low-side
MOSFET, or between the inductor and the output filter
capacitor.
● Route high-speed switching nodes away from sensitive analog areas (i.e., FB, FBAC, CSP_, CSN_, etc.).
See Table 12 for layout procedures.
● Keep the high-current paths short, especially at the
ground terminals. This is essential for stable, jitter-free
operation.
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Maxim Integrated │ 36
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Table 12. Layout Procedures
COMPONENTS
DESCRIPTION
Capacitors
The general rule is that capacitors take priority over resistors since they provide a filtering function. The list
below is in order of priority:
1) VBIAS Capacitors: Place these near the IC pins with wide traces and good connection to PGND.
2) CSP_ - CSN_ Differential Filter Capacitors: Place the capacitors and the step resistor near the IC pins.
These inputs are critical because they are used for regulation and load-line, as well as current limit and
current balance.
3) Common-Mode Capacitors: The capacitors to AGND take the next priority.
4) FB and GNDS Capacitors: The FB capacitor can be slightly farther away from the IC since the FB resistor
has priority to be closer to the IC.
FB and FBAC
The FB and FBAC resistors should be near the respective pins. Keep the trace short to reduce any inductance.
Current Sense
Use Kelvin-sense connection to the sense element (inductor or sense resistor).
Route CSP_ traces near CSN_. Avoid any switching signals, especially LX when routing these current-sensing
signals.
Thermistors
The NTC for THERM sensing should be placed near the power components of the first phase.
Catch Resistors
Catch resistors should be placed near the point of load so that the output-voltage trace does not need to route
back to the IC. The ground catch resistor is less critical as it only requires a via to connect to the PGND plane.
Remote Sense
Route together in a quiet layer, avoiding any switching signals, especially LX.
I2C
Pullups for I2C Interface and INT do not need to be too close to the IC and can be placed farther away to make
space for other more important components near the IC.
Place a small 0.1µF decoupling capacitor for the VTT near the pullup resistors.
AGND
Keep the AGND polygon just large enough to cover AGND components. Do not make it any larger than
necessary. The AGND polygon should not run under any high-voltage switching traces since all AGND
connections should be on the other side of the IC, away from the driver pins.
AGND-PGND
AGND-PGND connection should be made away from the PGND pins so as not to be in the path of the
DRVPWM_ drive currents. A good location is near the BIAS pin.
Exposed Pad
Connect to AGND.
Power
Components
Place the power components close to keep the current loop small. Avoid large LX nodes. Use multiple vias to
keep the impedance low and to carry the high currents.
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Maxim Integrated │ 37
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Chip Information
Package Information
PROCESS: BiCMOS
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX15569GTG+
-40°C to +105°C
24 TQFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
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For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND PATTERN
NO.
24 TQFN-EP
T2444+4
21-0139
90-0022
Maxim Integrated │ 38
MAX15569
2-Phase/1-Phase QuickTune-PWM Controller with
Serial I2C Interface
Revision History
REVISION
NUMBER
REVISION
DATE
0
3/13
DESCRIPTION
Initial release
PAGES
CHANGED
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For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
© 2013 Maxim Integrated Products, Inc. │ 39
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