Kemet C0630C104M2GECAUTO Surface mount multilayer ceramic chip capacitors (smd mlccs) Datasheet

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s ESD Rated Commercial and Automotive Grade
Series surface mount capacitors in C0G dielectric are
suited for a variety of applications where Electro Static
Discharge events during assembly or operation could
damage the capacitor or the circuit (ESD = Electro Static
Discharge). These ESD rated capacitors provide the ability
to design to a given ESD criteria per the Human Body
Model (HBM) AEC Q200–002 criteria. KEMET's automotive
grade series capacitors also meet the other demanding
Automotive Electronics Council's AEC–Q200 qualification
requirements.
The C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.” The Electronics
Industries Alliance (EIA) characterizes C0G dielectric as
a Class I material. Components of this classification are
temperature compensating and are suited for resonant circuit
applications and those where Q and stability of capacitance
characteristics are required. The C0G dielectric exhibits no
change in capacitance with respect to time and voltage and
boasts a negligible change in capacitance compared to its
value at 25°C. Capacitance change is limited to ±30ppm/°C
from −55°C to +125°C.
Benefits
•
•
•
•
•
•
•
•
•
•
•
•
AEC–Q200 automotive qualified
ESD Qualified per HBM – AEC Q200–002
Available in package size EIA 0603 (1608)
DC Voltage ratings of 25V – 200V
Capacitance range from 1nF to 15nF
−55°C to +125°C operating temperature range
Lead (Pb)-Free, RoHS and REACH compliant
Available capacitance tolerances of ±1%, ±2%, ±5%, ±10%, and ±20%
No piezoelectric noise
Extremely low ESR and ESL
High thermal stability
High ripple current capability
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
0603
Ceramic
Case Size
(L" x W")
0603
1
2
C
104
J
3
Specification/ Capacitance Capacitance Rated Voltage
Series
Code (pF)
Tolerance1
(VDC)
C = Standard
X = Flexible
Termination
Two
significant
digits and
number of
zeros
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3 = 25
5 = 50
M = 63
1 = 100
2 = 200
R
E
C
AUTO
Dielectric
Failure Rate/
Design
Termination
Finish2
Packaging/
Grade
(C-Spec)
G = C0G
E = ESD
C = 100%
Matte Sn
See
"Packaging
C-Spec
Ordering
Options
Table"
below
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
One world. One KEMET
C1091_C0G_ESD • 12/5/2016
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Benefits (cont'd)
• Preferred capacitance solution at line frequencies and
into the MHz range
• No capacitance changes with respect to applied DC
voltage
• Negligible capacitance change with respect to temperature
from −55°C to +125°C
• No capacitance decay with time
• Non-polar devices, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• Flexible Termination option available
• EIA 0805 and 1206 Case Sizes Under Development
Applications
Typical applications include: ESD (Electrostatic discharge), Integrated Circuit (IC) Protection, RF filtering function, input and
output automotive applications like: controllers, navigation systems, airbags and keyless systems
Table 1 – Capacitance Range/Selection Waterfall (0603 Case Size)
Case Size/
Series
Capacitance
Cap Code
1.0nF
1.5nF
2.2nF
3.3nF
4.7nF
6.8nF
10nF
15nF
102
152
222
332
472
682
103
153
C0603C
Rated Voltage (VDC)
25
50
63
100
200
Voltage Code
3
5
M
1
2
Cap Tolerance
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
ESD Level per AEC–Q200
6KV
8KV
12KV
16KV
16KV
25KV
25KV
25KV
6KV
8KV
12KV
16KV
16KV
25KV
6KV
8KV
12KV
16KV
16KV
6KV
8KV
12KV
16KV
16KV
6KV
8KV
12KV
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging/Grade
Ordering Code (C-Spec)
Packaging Type
Commercial Grade1
Bulk Bag
7" Reel/Unmarked
Not required (Blank)
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
7082
13" Reel/Unmarked
7" Reel/Unmarked/2mm pitch2
13" Reel/Unmarked/2mm pitch2
Automotive Grade3
7" Reel
AUTO
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
3190
3191
13" Reel / Unmarked
7" Reel/Unmarked/2mm pitch2
13" Reel/Unmarked/2mm pitch2
Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2
The 2mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2mm pitch option see "Tape & Reel Packaging Information".
3
Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
3
For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
3
All Automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking".
1
1
Dimensions – Millimeters (Inches)
L
W
B
T
S
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0.35 (0.014)
±0.15 (0.006)
0.70 (0.028)
Solder Wave or
Solder Reflow
0.45 (0.018)
±0.15 (0.006)
0.58 (0.023)
Solder Wave or
Solder Reflow
Without Flexible Termination
0603
1608
1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
With Flexible Termination
0603
1608
1.60 (0.063)
±0.17 (0.007)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “9170”.
This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below).
Product Change Notification (PCN)
The KEMET Product Change Notification system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fit, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
Process/Product change
Obsolescence*
Days prior to
implementation
KEMET assigned
Yes (with approval and sign off)
Yes
180 days Minimum
AUTO
Yes (without approval)
Yes
90 days Minimum
1
1
Customer Notification due to:
KEMET Automotive
C-Spec
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specification requirements are properly
understood and
fulfilled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
1
2
3
4
5
KEMET assigned
●
●
●
●
●
AUTO
○
1
1
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
○
KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
● Part Number specific PPAP available
○ Product family PPAP only
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC)
Aging Rate (Maximum % Capacitance Loss/Decade Hour)
Dielectric Withstanding Voltage (DWV)
1
2
3
Dissipation Factor (DF) Maximum Limit at 25°C
Insulation Resistance (IR) Minimum Limit at 25°C
−55°C to +125°C ±30 ppm/ºC
0%
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50mA)"
0.1%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
1
Post Environmental Limits
Post Environmental Limits
Dielectric
Rated DC
Voltage
Capacitance
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
C0G
All
All
0.5
0.3% or
±0.25 pf
10% of
Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 2 – Capacitance Range/Selection Waterfall (0603 Case Size)
Case Size /
Series
Voltage Code
3
5
M
1
2
Rated Voltage (VDC)
25
50
63
100
200
Cap
Capacitance
Code
C0603C
Product Availability and
Chip Thickness Codes – See
Packaging Specs for Chip
Thickness Dimensions
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
CF
Rated Voltage (VDC)
3
5
M
1
2
Voltage Code
100
200
Capacitance
Cap
Code
M
M
M
M
M
M
M
M
63
102
152
222
332
472
682
103
153
50
1,000 pF
1,500 pF
2,200 pF
3,300 pF
4,700 pF
6,800 pF
10,000 pF
15,000 pF
25
Capacitance
Tolerance
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
K
K
K
K
K
K
K
K
Case Size
/Series
C0603C
These products are protected under US Patent 7,172,985 and 7,670,981, other patents pending, and any foreign counterparts.
Table 3 – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
CF
0603
0.80 ± 0.07*
4,000
15,000
0
0
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 4 – Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
C
Y
X
V1
Density Level B:
Median (Nominal)
Land Protrusion (mm)
V2
C
Y
X
Density Level C:
Minimum (Least)
Land Protrusion (mm)
V1
V2
C
Y
X
V1
V2
3.10
1.50
0.60
0.75
0.90
2.40
1.20
3.10
1.50
0.65
0.85
0.90
2.40
1.20
Without Flexible Termination
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
With Flexible Termination
0603
1608
0.85
1.25
1.10
4.00
2.10
0.75
1.05
1.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
V1
Y
Y
X
X
C
C
V2
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/JSTD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Termination Finish
TP
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tS) from TSmin to TSmax
150°C
200°C
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second maximum
Liquidous Temperature (TL)
217°C
Time Above Liquidous (tL)
60 – 150 seconds
Peak Temperature (TP)
260°C
Time Within 5°C of Maximum Peak
Temperature (tP)
30 seconds maximum
Ramp-Down Rate (TP to TL)
6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
TL
Temperature
Profile Feature
tP
Maximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
tL
Tsmax
Tsmin
25
ts
25ºC to Peak
Time
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Table 5 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Terminal Strength
JIS–C–6429
Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex
JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for
C0G. Flexible termination system – 3.0 mm (minimum).
Magnification 50 X. Conditions:
Solderability
J–STD–002
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling
JESD22 Method JA–104
1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/− 4 hours after test conclusion.
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/− 4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours +/− 4 hours after test conclusion.
−55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
seconds.
Dwell time – 15 minutes. Air – Air.
Biased Humidity
MIL–STD–202 Method
103
Moisture Resistance
MIL–STD–202 Method
106
Thermal Shock
MIL–STD–202 Method
107
High Temperature Life
MIL–STD–202 Method
108/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life
MIL–STD–202 Method
108
150°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202 Method
204
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
Resistance to Solvents
MIL–STD–202 Method
213
MIL–STD–202 Method
215
Figure 1 of Method 213, Condition F.
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Dielectric Material
(CaZrO3)
Dielectric
Material (CaZrO3)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Construction – Flexible Termination
Detailed Cross Section
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Epoxy Layer
(Ag)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Termination
Finish
(100% Matte Sn)
C1091_C0G_ESD • 12/5/2016
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
Laser marking option is not available on:
•
•
•
•
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel
®
Embossed Plastic* or
Punched Paper Carrier.
ET
KEM
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 and 2225 Military)
Sprocket Holes
Embossment or Punched Cavity
8 mm, 12 mm
or 16 mm Carrier Tape
178 mm (7.00")
or
330 mm (13.00")
Anti-Static Cover Tape
(.10 mm (.004") Maximum Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic
7" Reel
13" Reel
Pitch (P1)*
Punched Paper
7" Reel
13" Reel
Pitch (P1)*
01005 – 0402
8
2
2
0603
8
2/4
2/4
0805
8
4
4
4
4
1206 – 1210
8
4
4
4
4
1805 – 1808
12
4
4
≥ 1812
12
8
8
KPS 1210
12
8
8
KPS 1812 & 2220
16
12
12
Array 0508 & 0612
8
4
4
*Refer to Figures 1 & 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 & 7 for tolerance specifications.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
C-3191
C-7081
C-7082
Automotive grade 7" reel unmarked
Automotive grade 13" reel unmarked
Commercial grade 7" reel unmarked
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs
• Double the parts on each reel results in fewer reel
changes and increased efficiency
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P2
T
T2
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Po
E1
Ao
F
Ko
B1
E2
Bo
S1
W
P1
T1
Center Lines of Cavity
ØD
Cover Tape
B 1 is for tape feeder reference only,
including draft concentric about B
o.
1
Embossment
For cavity size,
see Note 1 Table 4
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
8 mm
12 mm
1.5 +0.10/-0.0
(0.059 +0.004/0.0)
16 mm
D1 Minimum
Note 1
1.0
(0.039)
1.5
(0.059)
R Reference S1 Minimum
T
Note 2
Note 3
Maximum
25.0
(0.984)
1.75 ±0.10
4.0 ±0.10
2.0 ±0.05
0.600
0.600
(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)
(0.024)
(0.024)
30
(1.181)
E1
P0
P2
T1
Maximum
0.100
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Single (4 mm)
12 mm
Single (4 mm) &
Double (8 mm)
16 mm
Triple (12 mm)
B1 Maximum
Note 4
4.35
(0.171)
8.2
(0.323)
12.1
(0.476)
E2
Minimum
6.25
(0.246)
10.25
(0.404)
14.25
(0.561)
F
P1
3.5 ±0.05
4.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
5.5 ±0.05
8.0 ±0.10
(0.217 ±0.002) (0.315 ±0.004)
7.5 ±0.05
12.0 ±0.10
(0.138 ±0.002) (0.157 ±0.004)
T2
Maximum
2.5
(0.098)
4.6
(0.181)
4.6
(0.181)
W
Maximum
8.3
(0.327)
12.3
(0.484)
16.3
(0.642)
A0,B0 & K0
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T
Po
ØDo
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
A0
F
P1
T1
T1
Top Cover Tape
W
E2
B0
Bottom Cover Tape
E1
G
Cavity Size,
See
Note 1, Table 7
Center Lines of Cavity
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
D0
E1
P0
P2
T1 Maximum
G Minimum
8 mm
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
Maximum
R Reference
Note 2
0.75
(0.030)
25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
8 mm
Half (2 mm)
8 mm
Single (4 mm)
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B 0
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
1.1
(0.098)
8.3
(0.327)
8.3
(0.327)
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm
0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
Width (mm) Rotation (
8,12
20
16 – 200
10
Bo
°
T)
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
8 mm & 12 mm Tape
0.5 mm maximum
0.5 mm maximum
°
s
Tape
Width (mm)
8,12
16 – 56
72 – 200
Maximum
Rotation (
20
10
5
Figure 5 – Bending Radius
Embossed
Carrier
16 mm Tape
°
S)
Punched
Carrier
1.0 mm maximum
1.0 mm maximum
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
Bending
Radius
R
C1091_C0G_ESD • 12/5/2016
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
Full Radius,
See Note
W3
(Includes
flange distortion
at outer edge)
Access Hole at
Slot Location
(Ø 40 mm minimum)
W2
D
A
(See Note)
N
C
(Arbor hole
diameter)
B
(see Note)
(Measured at hub)
W1
(Measured at hub)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
Note: Drive spokes optional; if used, dimensions B and D shall apply.
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size
A
B Minimum
C
D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
W1
W2 Maximum
W3
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
14.4
(0.567)
18.4
(0.724)
22.4
(0.882)
Shall accommodate tape
width without interference
8 mm
12 mm
16 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Embossed Carrier
Carrier Tape
Punched Carrier
8 mm & 12 mm only
END
Round Sprocket Holes
START
Top Cover Tape
Elongated Sprocket Holes
(32 mm tape and wider)
Trailer
160 mm Minimum
Components
100 mm
Minimum Leader
400 mm Minimum
Top Cover Tape
Figure 8 – Maximum Camber
Elongated sprocket holes
(32 mm & wider tapes)
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 200 VDC (Commercial & Automotive Grade)
KEMET Electronic Corporation Sales Offices
For a complete list of our global sales offices, please visit www.kemet.com/sales.
Disclaimer
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifically disclaims – any warranty concerning suitability for a specific customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1091_C0G_ESD • 12/5/2016
18