AMD AM41DL6408H8H70IT Stacked multi-chip package (mcp) flash memory and sram Datasheet

Am41DL6408H
Data Sheet
July 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Publication Number 30785 Revision A
Amendment +1 Issue Date November 24, 2003
THIS PAGE LEFT INTENTIONALLY BLANK.
ADVANCE INFORMATION
Am41DL6408H
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM
DISTINCTIVE CHARACTERISTICS
MCP Features
■ Minimum 1 million erase cycles guaranteed per sector
■ Power supply voltage of 2.7 to 3.3 volt
■ 20 year data retention at 125°C
— Reliable operation for the life of the system
■ High performance
— Access time as fast as 70 ns Flash/55 ns SRAM
■ Package
SOFTWARE FEATURES
■ Data Management Software (DMS)
— 73-Ball FBGA
— AMD-supplied software manages data programming,
enabling EEPROM emulation
— Eases historical sector erase flash limitations
■ Operating Temperature
— –40°C to +85°C
Flash Memory Features
ARCHITECTURAL ADVANTAGES
■ Simultaneous Read/Write operations
— Data can be continuously read from one bank while
executing erase/program functions in another bank.
— Zero latency between read and write operations
■ Flexible Bank™ architecture
— Read may occur in any of the three banks not being written
or erased.
— Four banks may be grouped by customer to achieve desired
bank divisions.
■ Manufactured on 0.13 µm process technology
■ SecSi™ (Secured Silicon) Sector: Extra 256 Byte sector
— Factory locked and identifiable: 16 bytes available for
secure, random factory Electronic Serial Number; verifiable
as factory locked through autoselect function. ExpressFlash
option allows entire sector to be available for
factory-secured data
— Customer lockable: Sector is one-time programmable. Once
sector is locked, data cannot be changed.
■ Zero Power Operation
— Sophisticated power management circuits reduce power
consumed during inactive periods to nearly zero.
■ Boot sectors
— Top and bottom boot sectors in the same device
■ Compatible with JEDEC standards
— Pinout and software compatible with single-power-supply
flash standard
■ Supports Common Flash Memory Interface (CFI)
■ Program/Erase Suspend/Erase Resume
— Suspends program/erase operations to allow
programming/erasing in same bank
■ Data# Polling and Toggle Bits
— Provides a software method of detecting the status of
program or erase cycles
■ Unlock Bypass Program command
— Reduces overall programming time when issuing multiple
program command sequences
HARDWARE FEATURES
■ Any combination of sectors can be erased
■ Ready/Busy# output (RY/BY#)
— Hardware method for detecting program or erase cycle
completion
■ Hardware reset pin (RESET#)
— Hardware method of resetting the internal state machine to
the read mode
■ WP#/ACC input pin
— Write protect (WP#) function protects sectors 0, 1, 140, and
141, regardless of sector protect status
— Acceleration (ACC) function accelerates program timing
■ Sector protection
— Hardware method of locking a sector, either in-system or
using programming equipment, to prevent any program or
erase operation within that sector
— Temporary Sector Unprotect allows changing data in
protected sectors in-system
PERFORMANCE CHARACTERISTICS
SRAM Features
■ High performance
■ Power dissipation
— Access time as fast as 70 ns
— Program time: 4 µs/word typical utilizing Accelerate function
■ Ultra low power consumption (typical values)
— 2 mA active read current at 1 MHz
— 10 mA active read current at 5 MHz
— 200 nA in standby or automatic sleep mode
— Operating: 30 mA maximum
— Standby: 15µA maximum
■ CE1s# and CE2s Chip Select
■ Power down features using CE1s# and CE2s
■ Data retention supply voltage: 1.5 to 3.3 volt
■ Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8)
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Publication# 30785 Rev: A Amendment/+1
Issue Date: November 24, 2003
Refer to AMD’s Website (www.amd.com) for the latest information.
A D V A N C E
I N F O R M A T I O N
GENERAL DESCRIPTION
Am29DL640H Features
The Am29DL640H is a 64 megabit, 3.0 volt-only flash
memory device, organized as 4,194,304 words of 16
bits each or 8,388,608 bytes of 8 bits each. Word
mode data appears on DQ15–DQ0; byte mode data
appears on DQ7–DQ0. The device is designed to be
programmed in-system with the standard 3.0 volt VCC
supply, and can also be programmed in standard
EPROM programmers.
The device is available with an access time of 70 or 85
ns and is offered in a 73-ball FBGA package. Standard
control pins—chip enable (CE#f), write enable (WE#),
and output enable (OE#)—control normal read and
write operations, and avoid bus contention issues.
The device requires only a single 3.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the
program and erase operations.
Simultaneous Read/Write Operations with
Zero Latency
The Simultaneous Read/Write architecture provides
simultaneous operation by dividing the memory
space into four banks, two 8 Mb banks with small and
large sectors, and two 24 Mb banks of large sectors
only. Sector addresses are fixed, system software can
be used to form user-defined bank groups.
During an Erase/Program operation, any of the three
non-busy banks may be read from. Note that only two
banks can operate simultaneously. The device can improve overall system performance by allowing a host
system to program or erase in one bank, then
immediately and simultaneously read from the other
bank, with zero latency. This releases the system from
waiting for the completion of program or erase
operations.
The Am29DL640H can be organized as both a top and
bottom boot sector configuration.
Bank
Megabits
Bank 1
8 Mb
Bank 2
Bank 3
24 Mb
24 Mb
Bank 4
8 Mb
Sector Sizes
Eight 8 Kbyte/4 Kword,
Fifteen 64 Kbyte/32 Kword
Forty-eight 64 Kbyte/32 Kword
Forty-eight 64 Kbyte/32 Kword
Eight 8 Kbyte/4 Kword,
Fifteen 64 Kbyte/32 Kword
The SecSi™ (Secured Silicon) Sector is an extra
256 byte sector capable of being permanently locked
by AMD or customers. The SecSi Customer (DQ6) is
permanently set to 1 if the part has been customer
locked, and is 0 if customer lockable. This way, customer lockable parts can never be used to replace a
factory locked part.
Factory locked parts provide several options. The
SecSi Sector may store a secure, random 16 byte
2
ESN (Electronic Serial Number), customer code (programmed through AMD’s ExpressFlash service), or
both. Customer Lockable parts may utilize the SecSi
Sector as bonus space, reading and writing like any
other flash sector or may permanently lock their own
code there.
DMS (Data Management Software) allows systems
to easily take advantage of the advanced architecture
of the simultaneous read/write product line by allowing
removal of EEPROM devices. DMS will also allow the
system software to be simplified, as it will perform all
functions necessary to modify data in file structures,
as opposed to single-byte modifications. To write or
update a particular piece of data (a phone number or
configuration data, for example), the user only needs
to state which piece of data is to be updated, and
where the updated data is located in the system. This
i s a n a d va n t a g e c o m p a r e d t o s ys te m s w h e r e
user-written software must keep track of the old data
location, status, logical to physical translation of the
data onto the Flash memory device (or memory devices), and more. Using DMS, user-written software
does not need to interface with the Flash memory directly. Instead, the user's software accesses the Flash
memory by calling one of only six functions. AMD provides this software to simplify system design and software integration efforts.
The device offers complete compatibility with the
JEDEC single-power-supply Flash command set
standard. Commands are written to the command
register using standard microprocessor write timings.
Reading data out of the device is similar to reading
from other Flash or EPROM devices.
The host system can detect whether a program or
erase operation is complete by using the device status bits: RY/BY# pin, DQ7 (Data# Polling) and
DQ6/DQ2 (toggle bits). After a program or erase cycle
has been completed, the device automatically returns
to the read mode.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
V CC detector that automatically inhibits write operations during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment.
The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the
standby mode. Power consumption is greatly reduced in both modes.
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5
MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . 5
Flash Memory Block Diagram. . . . . . . . . . . . . . . . 6
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Chip Erase Command Sequence ........................................... 29
Sector Erase Command Sequence ........................................ 29
Figure 5. Erase Operation.............................................................. 30
Erase Suspend/Erase Resume Commands ........................... 30
Table 14. Am29DL640H Command Definitions .............................. 31
Write Operation Status . . . . . . . . . . . . . . . . . . . . 32
DQ7: Data# Polling ................................................................. 32
Figure 6. Data# Polling Algorithm .................................................. 32
Table 1. Device Bus Operations—Flash Word Mode, CIOf = VIH;
SRAM Word Mode, CIOs = VCC ..................................................... 10
Table 2. Device Bus Operations—Flash Word Mode, CIOf = VIH;
SRAM Byte Mode, CIOs = VSS ......................................................11
Table 3. Device Bus Operations—Flash Byte Mode, CIOf = VSS;
SRAM Word Mode, CIOs = VCC .....................................................12
Table 4. Device Bus Operations—Flash Byte Mode, CIOf = VIL; SRAM
Byte Mode, CIOs = VSS ..................................................................13
RY/BY#: Ready/Busy# ............................................................ 33
DQ6: Toggle Bit I .................................................................... 33
Word/Byte Configuration ........................................................ 13
Requirements for Reading Array Data ................................... 13
Writing Commands/Command Sequences ............................ 14
Accelerated Program Operation .......................................... 14
Autoselect Functions ........................................................... 14
Simultaneous Read/Write Operations with Zero Latency ....... 14
Standby Mode ........................................................................ 14
Automatic Sleep Mode ........................................................... 15
RESET#: Hardware Reset Pin ............................................... 15
Output Disable Mode .............................................................. 15
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 36
Figure 7. Toggle Bit Algorithm........................................................ 33
DQ2: Toggle Bit II ................................................................... 34
Reading Toggle Bits DQ6/DQ2 ............................................... 34
DQ5: Exceeded Timing Limits ................................................ 34
DQ3: Sector Erase Timer ....................................................... 34
Table 15. Write Operation Status ................................................... 35
Figure 8. Maximum Negative Overshoot Waveform ...................... 36
Figure 9. Maximum Positive Overshoot Waveform........................ 36
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
SRAM DC and Operating Characteristics . . . . . 38
Figure 10. ICC1 Current vs. Time (Showing Active and
Automatic Sleep Currents) ............................................................. 39
Figure 11. Typical ICC1 vs. Frequency ............................................ 39
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 12. Test Setup.................................................................... 40
Figure 13. Input Waveforms and Measurement Levels ................. 40
Table 5. Am29DL640H Sector Architecture ....................................15
Table 6. Bank Address ....................................................................18
Table 7. SecSi™ Sector Addresses ...............................................18
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 41
SRAM CE#s Timing ................................................................ 41
Sector/Sector Block Protection and Unprotection .................. 19
Figure 14. Timing Diagram for Alternating Between
SRAM to Flash ............................................................................... 41
Table 8. Am29DL640H Boot Sector/Sector Block Addresses for
Protection/Unprotection ...................................................................19
Write Protect (WP#) ................................................................ 19
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42
Flash Read-Only Operations ................................................. 42
Table 9. WP#/ACC Modes ..............................................................20
Figure 15. Read Operation Timings ............................................... 42
Temporary Sector Unprotect .................................................. 20
Hardware Reset (RESET#) .................................................... 43
Figure 1. Temporary Sector Unprotect Operation........................... 20
Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 21
Word/Byte Configuration (CIOf) .............................................. 44
SecSi™ (Secured Silicon) Sector Flash Memory Region ...... 22
Figure 3. SecSi Sector Protect Verify.............................................. 23
Hardware Data Protection ...................................................... 23
Low VCC Write Inhibit ........................................................... 23
Write Pulse “Glitch” Protection ............................................ 23
Logical Inhibit ...................................................................... 23
Power-Up Write Inhibit ......................................................... 23
Common Flash Memory Interface (CFI) . . . . . . . 23
Table 10. CFI Query Identification String ........................................ 24
System Interface String................................................................... 24
Table 12. Device Geometry Definition ............................................ 24
Table 13. Primary Vendor-Specific Extended Query ...................... 26
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 27
Reading Array Data ................................................................ 27
Reset Command ..................................................................... 27
Autoselect Command Sequence ............................................ 27
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence .............................................................. 27
Byte/Word Program Command Sequence ............................. 28
Unlock Bypass Command Sequence .................................. 28
Figure 4. Program Operation .......................................................... 29
November 24, 2003
Figure 16. Reset Timings ............................................................... 43
Figure 17. CIOf Timings for Read Operations................................ 44
Figure 18. CIOf Timings for Write Operations................................ 44
Erase and Program Operations .............................................. 45
Figure 19. Program Operation Timings..........................................
Figure 20. Accelerated Program Timing Diagram..........................
Figure 21. Chip/Sector Erase Operation Timings ..........................
Figure 22. Back-to-back Read/Write Cycle Timings ......................
Figure 23. Data# Polling Timings (During Embedded Algorithms).
Figure 24. Toggle Bit Timings (During Embedded Algorithms)......
Figure 25. DQ2 vs. DQ6.................................................................
46
46
47
48
48
49
49
Temporary Sector Unprotect .................................................. 50
Figure 26. Temporary Sector Unprotect Timing Diagram .............. 50
Figure 27. Sector/Sector Block Protect and
Unprotect Timing Diagram ............................................................. 51
Alternate CE#f Controlled Erase and Program Operations .... 52
Figure 28. Flash Alternate CE#f Controlled Write (Erase/Program)
Operation Timings.......................................................................... 53
SRAM Read Cycle .................................................................. 54
Figure 29. SRAM Read Cycle—Address Controlled...................... 54
Figure 30. SRAM Read Cycle ........................................................ 55
SRAM Write Cycle .................................................................. 56
Figure 31. SRAM Write Cycle—WE# Control ................................ 56
Am41DL6408H
3
A D V A N C E
I N F O R M A T I O N
Figure 32. SRAM Write Cycle—CE1#s Control .............................. 57
Figure 33. SRAM Write Cycle—UB#s and LB#s Control ................ 58
Flash Erase And Programming Performance . . . 59
Latchup Characteristics . . . . . . . . . . . . . . . . . . . 59
Package Pin Capacitance . . . . . . . . . . . . . . . . . . 59
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
4
SRAM Data Retention . . . . . . . . . . . . . . . . . . . . . 60
Figure 34. CE1#s Controlled Data Retention Mode....................... 60
Figure 35. CE2s Controlled Data Retention Mode......................... 60
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 61
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 62
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
PRODUCT SELECTOR GUIDE
Part Number
Speed
Options
Am41DL6408H
Standard Voltage Range:
VCC = 2.7–3.3 V
Flash Memory
SRAM
70, 71
85
71
70
85
Max Access Time (ns)
70
85
55
70
85
CE#f Access (ns)
70
85
55
70
85
OE# Access (ns)
30
40
25
35
45
MCP BLOCK DIAGRAM
VCCf
VSS
A21 to A0
RY/BY#
A21 to A0
A–1
WP#/ACC
RESET#
CE#f
CIOf
64 MBit
Flash Memory
DQ15 to DQ0
DQ15/A–1 to DQ0
VCCs/VCCQ
VSS/VSSQ
A0
toto
A19
A18
A0
SA
LB#s
UB#s
WE#
OE#
CE1#s
CE2s
CIOs
November 24, 2003
8 MBit
Static RAM
DQ15 to DQ0
Am41DL6408H
5
A D V A N C E
I N F O R M A T I O N
FLASH MEMORY BLOCK DIAGRAM
VCC
VSS
OE# BYTE#
Mux
Bank 1
Bank 2
X-Decoder
A21–A0
RESET#
WE#
CE#
BYTE#
WP#/ACC
STATE
CONTROL
&
COMMAND
REGISTER
Status
DQ15–DQ0
Control
Mux
DQ15–DQ0
DQ15–DQ0
Bank 3 Address
Bank 3
X-Decoder
Bank 4 Address
Y-gate
A0–A21
X-Decoder
A21–A0
DQ15–DQ0
Bank 2 Address
DQ15–DQ0
RY/BY#
DQ15–DQ0
A21–A0
X-Decoder
Y-gate
Bank 1 Address
A21–A0
Bank 4
Mux
6
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
CONNECTION DIAGRAM
73-Ball FBGA
Top View
A1
A10
NC
NC
B1
B5
B6
B10
NC
NC
NC
NC
C5
C3
C4
C6
C7
C8
NC
A7
LB# WP#/ACC WE#
A8
A11
D2
D3
D4
D7
D8
D9
A3
A6
UB#
A19
A12
A15
E2
E3
E4
E5
E6
E7
E8
E9
A2
A5
A18
RY/BY#
A20
A9
A13
A21
F1
F2
F3
F4
F7
F8
F9
F10
NC
A1
A4
A17
A10
A14
NC
NC
G1
G2
G3
G4
G7
G8
G9
G10
NC
A0
VSS
DQ1
DQ6
SA
A16
NC
H2
H3
H4
H5
H6
H7
H8
H9
CE#f
OE#
DQ9
DQ3
DQ4
J2
J3
J4
J5
J6
J7
J8
J9
CE1#s
DQ0
DQ10
VCCf
VCCs
DQ12
DQ7
VSS
K3
K4
K5
K6
K7
K8
DQ8
DQ2
DQ11
CIOs
DQ5
DQ14
L1
L5
L6
L10
NC
NC
NC
NC
D6
RESET# CE2s
DQ13 DQ15/A-1 CIOf
M1
M10
NC
NC
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (FBGA). The package and/or
November 24, 2003
SRAM only
Shared
C1
D5
Flash only
data integrity may be compromised if the package
body is exposed to temperatures above 150C for prolonged periods of time.
Am41DL6408H
7
A D V A N C E
I N F O R M A T I O N
PIN DESCRIPTION
A18–A0
LOGIC SYMBOL
= 19 Address Inputs (Common)
19
A21–A19, A-1 = 4 Address Inputs (Flash)
SA
A18–A0
= Highest Order Address Pin (SRAM)
Byte mode
A21–A19, A-1
DQ15–DQ0
= 16 Data Inputs/Outputs (Common)
SA
CE#f
= Chip Enable (Flash)
CE#s
= Chip Enable (SRAM)
OE#
= Output Enable (Common)
WE#
= Write Enable (Common)
CE#f
CE2s
OE#
= Ready/Busy Output
UB#s
= Upper Byte Control (SRAM)
LB#s
= Lower Byte Control (SRAM)
CIOf
= I/O Configuration (Flash)
CIOf = VIH = Word mode (x16),
CIOf = VIL = Byte mode (x8)
RY/BY#
WE#
WP#/ACC
= I/O Configuration (SRAM)
CIOs = VIH = Word mode (x16),
CIOs = VIL = Byte mode (x8)
RESET#
= Hardware Reset Pin, Active Low
WP#/ACC
= Hardware Write Protect/
Acceleration Pin (Flash)
VCCf
= Flash 3.0 volt-only single power supply (see Product Selector Guide for
speed options and voltage supply
tolerances)
VCCs
= SRAM Power Supply
VSS
= Device Ground (Common)
NC
= Pin Not Connected Internally
8
DQ15–DQ0
CE1#s
RY/BY#
CIOs
16 or 8
Am41DL6408H
RESET#
UB#s
LB#s
CIOf
CIOs
November 24, 2003
A D V A N C E
I N F O R M A T I O N
ORDERING INFORMATION
The order number (Valid Combination) is formed by the following:
Am41DL640
8
H
70
I
T
TAPE AND REEL
T
= 7 inches
S
= 13 inches
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
SPEED OPTION
See Product Selector Guide and Valid Combinations
PROCESS TECHNOLOGY
H
= 0.13 µm
SRAM DEVICE DENSITY
8
=
8 Mbits
AMD DEVICE NUMBER/DESCRIPTION
Am41DL6408H
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am29DL640H 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM
Valid Combinations
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD or Fujitsu sales office to
confirm availability of specific valid combinations and to check on
newly released combinations.
DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information
November 24, 2003
Order Number
Package Marking
Am41DL6408H70I
T, S
M41000009B
Am41DL6408H85I
T, S
M41000009C
Am41DL6408H71I
T, S
M41000009D
needed to execute the command. The contents of the
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Tables 1-3 lists the device bus operations, the
inputs and control levels they require, and the resulting
output. The following subsections describe each of
these operations in further detail.
Am41DL6408H
9
A D V A N C E
Table 1.
Device Bus Operations—Flash Word Mode, CIOf = VIH; SRAM Word Mode, CIOs = VCC
Operation
(Notes 1, 2)
CE#f CE1#s CE2s OE# WE#
H
X
X
L
H
X
X
L
VCC ±
0.3 V
H
X
X
L
Output Disable
L
L
H
Flash Hardware
Reset
X
H
X
X
L
H
X
X
L
H
X
X
L
H
X
X
L
Read from Flash
L
Write to Flash
L
Standby
Sector Protect
(Note 5)
L
Sector Unprotect
(Note 5)
L
Temporary Sector
Unprotect
X
Read from SRAM
Write to SRAM
I N F O R M A T I O N
H
H
L
L
H
H
SA
Addr.
LB#s UB#s RESET#
WP#/ACC DQ7–
(Note 4)
DQ0
DQ15–
DQ8
L
H
X
AIN
X
X
H
L/H
DOUT
DOUT
H
L
X
AIN
X
X
H
(Note 4)
DIN
DIN
X
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
H
H
X
X
L
X
H
H
X
X
X
L
H
L/H
High-Z
High-Z
X
X
X
X
X
X
L
L/H
High-Z
High-Z
X
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
VID
L/H
DIN
X
X
X
VID
(Note 6)
DIN
X
X
X
VID
(Note 6)
DIN
High-Z
L
L
DOUT
DOUT
H
L
H
L
X
SADD,
A6 = H,
A1 = H,
A0 = L
X
X
X
X
L
X
H
L
X
X
AIN
AIN
H
L
High-Z
DOUT
L
H
DOUT
High-Z
L
L
DIN
DIN
H
L
High-Z
DIN
L
H
DIN
High-Z
H
H
X
X
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SA = SRAM Address
Input, Byte Mode, SADD = Flash Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Other operations except for those indicated in this column are inhibited.
2. Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same time.
3. Don’t care or open LB#s or UB#s.
4. If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed.
If WP#/ACC = VACC (9V), the program time will be reduced by 40%.
5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection” section.
6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection
depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and
Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected.
10
Am41DL6408H
November 24, 2003
A D V A N C E
Table 2.
Operation
(Notes 1, 2)
Device Bus Operations—Flash Word Mode, CIOf = VIH; SRAM Byte Mode, CIOs = VSS
CE#f CE1#s CE2s OE# WE# SA
Read from Flash
L
Write to Flash
L
Standby
I N F O R M A T I O N
VCC ±
0.3 V
Output Disable
Flash Hardware
Reset
Sector Protect
(Note 5)
L
X
L
H
X
X
L
H
X
X
L
H
X
X
L
L
H
H
X
X
L
H
X
X
L
H
X
X
L
H
X
X
L
Sector Unprotect
(Note 5)
L
Temporary Sector
Unprotect
X
Read from SRAM
H
L
Write to SRAM
H
L
Addr.
LB#s
UB#s
WP#/ACC DQ7– DQ15–
RESET#
(Note 3) (Note 3)
(Note 4)
DQ0
DQ8
L
H
X
AIN
X
X
H
L/H
DOUT
DOUT
H
L
X
AIN
X
X
H
(Note 3)
DIN
DIN
X
X
X
X
X
X
VCC ±
0.3 V
H
High-Z High-Z
H
H
SA
X
DNU
DNU
H
L/H
High-Z High-Z
X
X
X
X
X
X
L
L/H
High-Z High-Z
X
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
VID
L/H
DIN
X
X
X
VID
(Note 6)
DIN
X
H
L
H
L
X
SADD,
A6 = H,
A1 = H,
A0 = L
X
X
X
AIN
X
X
VID
(Note 6)
DIN
High-Z
H
L
H
SA
AIN
X
X
H
X
DOUT
High-Z
H
X
L
SA
AIN
X
X
H
X
DIN
High-Z
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SA = SRAM Address
Input, Byte Mode, SADD = Flash Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out, DNU = Do Not Use
Notes:
1. Other operations except for those indicated in this column are inhibited.
2. Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same time.
3. Don’t care or open LB#s or UB#s.
4. If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed.
If WP#/ACC = VACC (9V), the program time will be reduced by 40%.
5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection” section.
6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection
depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and
Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected.
November 24, 2003
Am41DL6408H
11
A D V A N C E
Table 3.
Operation
(Notes 1, 2)
Device Bus Operations—Flash Byte Mode, CIOf = VSS; SRAM Word Mode, CIOs = VCC
CE#f CE1#s CE2s OE# WE# SA
H
X
X
L
H
X
X
L
VCC ±
0.3 V
H
X
X
L
Output Disable
L
L
H
Flash Hardware
Reset
X
H
X
X
L
H
X
X
L
H
X
X
L
H
x
X
L
Read from Flash
L
Write to Flash
L
Standby
Sector Protect
(Note 5)
L
Sector
Unprotect
(Note 5)
L
Temporary
Sector
Unprotect
X
Read from
SRAM
Write to SRAM
I N F O R M A T I O N
H
H
L
L
H
H
Addr.
LB#s
UB#s
WP#/ACC
RESET#
(Note 3) (Note 3)
(Note 4)
DQ7–
DQ0
DQ15–
DQ8
L
H
X
AIN
X
X
H
L/H
DOUT
High-Z
H
L
X
AIN
X
X
H
(Note 3)
DIN
High-Z
X
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
H
H
X
X
H
L/H
High-Z
High-Z
X
X
X
H
L
L
X
X
L
X
X
X
L
L/H
High-Z
High-Z
X
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
VID
L/H
DIN
X
X
X
VID
(Note 6)
DIN
X
X
X
VID
(Note 6)
DIN
High-Z
L
L
DOUT
DOUT
H
L
High-Z
DOUT
L
H
DOUT
High-Z
L
L
DIN
DIN
H
L
X
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
X
AIN
L
X
H
L
X
X
AIN
AIN
H
L
L
H
H
H
X
X
High-Z
DIN
DIN
High-Z
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SA = SRAM Address
Input, Byte Mode, SADD = Flash Sector Address, AIN = Address In (for Flash Byte Mode, DQ15 = A-1), DIN = Data In, DOUT =
Data Out
Notes:
1. Other operations except for those indicated in this column are inhibited.
2. Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same time.
3. Don’t care or open LB#s or UB#s.
4. If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed.
If WP#/ACC = VACC (9V), the program time will be reduced by 40%.
5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection” section.
6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection
depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and
Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected.
12
Am41DL6408H
November 24, 2003
A D V A N C E
Table 4.
Operation
(Notes 1, 2)
Device Bus Operations—Flash Byte Mode, CIOf = VIL; SRAM Byte Mode, CIOs = VSS
CE#f CE1#s CE2s OE# WE#
Read from Flash
L
Write to Flash
L
Standby
Output Disable
Flash Hardware
Reset
Sector Protect
(Note 5)
I N F O R M A T I O N
VCC ±
0.3 V
H
X
L
H
X
X
L
H
X
X
L
H
X
X
L
L
H
H
X
X
L
H
X
X
L
H
X
X
L
H
X
X
L
Sector Unprotect
(Note 5)
L
Temporary
Sector Unprotect
X
Read from SRAM
H
L
Write to SRAM
H
L
SA
Addr.
LB#s
UB#s
WP#/ACC
RESET#
(Note 3) (Note 3)
(Note 4)
DQ7–
DQ0
DQ15–
DQ8
L
H
X
AIN
X
X
H
L/H
DOUT
High-Z
H
L
X
AIN
X
X
H
(Note 3)
DIN
High-Z
X
X
X
X
X
X
VCC ±
0.3 V
H
High-Z
High-Z
H
H
SA
X
DNU
DNU
H
L/H
High-Z
High-Z
X
X
X
X
X
X
L
L/H
High-Z
High-Z
X
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
VID
L/H
DIN
X
X
X
VID
(Note 6)
DIN
X
H
L
H
L
X
SADD,
A6 = L,
A1 = H,
A0 = L
X
X
X
AIN
X
X
VID
(Note 6)
DIN
High-Z
H
L
H
SA
AIN
X
X
H
X
DOUT
High-Z
H
X
L
SA
AIN
X
X
H
X
DIN
High-Z
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 9.0 ± 0.5 V, X = Don’t Care, SA = SRAM Address
Input, Byte Mode, SADD = Flash Sector Address, AIN = Address In (for Flash Byte Mode, DQ15 = A-1), DIN = Data In, DOUT =
Data Out, DNU = Do Not Use
Notes:
1. Other operations except for those indicated in this column are inhibited.
2. Do not apply CE#f = VIL, CE1#s = VIL and CE2s = VIH at the same time.
3. Don’t care or open LB#s or UB#s.
4. If WP#/ACC = VIL , the boot sectors will be protected. If WP#/ACC = VIH the boot sectors protection will be removed.
If WP#/ACC = VACC (9V), the program time will be reduced by 40%.
5. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector/Sector
Block Protection and Unprotection”.
6. If WP#/ACC = VIL, the two outermost boot sectors remain protected. If WP#/ACC = VIH, the two outermost boot sector protection
depends on whether they were last protected or unprotected using the method described in “Sector/Sector Block Protection and
Unprotection”. If WP#/ACC = VHH, all sectors will be unprotected.
Word/Byte Configuration
The CIOf pin controls whether the device data I/O pins
operate in the byte or word configuration. If the CIOf
pin is set at logic ‘1’, the device is in word configuration, DQ15–DQ0 are active and controlled by CE#f
and OE#.
If the CIOf pin is set at logic ‘0’, the device is in byte
configuration, and only data I/O pins DQ7–DQ0 are
active and controlled by CE#f and OE#. The data I/O
November 24, 2003
pins DQ14–DQ8 are tri-stated, and the DQ15 pin is
used as an input for the LSB (A-1) address function.
Requirements for Reading Array Data
To read array data from the outputs, the system must
drive the CE#f and OE# pins to VIL. CE#f is the power
control and selects the device. OE# is the output control and gates array data to the output pins. WE#
should remain at V I H . The CIOf pin deter mines
whether the device outputs array data in words or
bytes.
Am41DL6408H
13
A D V A N C E
I N F O R M A T I O N
The internal state machine is set for reading array data
upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory
content occurs during the power transition. No command is necessary in this mode to obtain array data.
Standard microprocessor read cycles that assert valid
addresses on the device address inputs produce valid
data on the device data outputs. Each bank remains
enabled for read access until the command register
contents are altered.
Refer to the AC Flash Read-Only Operations table for
timing specifications and to Figure 15 for the timing diagram. ICC1 in the DC Characteristics table represents
the active current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and
CE#f to VIL, and OE# to VIH.
For program operations, the CIOf pin determines
whether the device accepts program data in bytes or
words. Refer to “Word/Byte Configuration” for more information.
The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the Unlock Bypass mode, only two write cycles are required
to program a word or byte, instead of four. The
“Byte/Word Program Command Sequence” section
has details on programming data to the device using
both standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 5 indicates the address
space that each sector occupies. Similarly, a “sector
address” is the address bits required to uniquely select
a sector. The “Command Definitions” section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation.
The device address space is divided into four banks. A
“bank address” is the address bits required to uniquely
select a bank.
ICC2 in the DC Characteristics table represents the active current specification for the write mode. The AC
Characteristics section contains timing specification
tables and timing diagrams for write operations.
Accelerated Program Operation
The device offers accelerated program operations
through the ACC function. This is one of two functions
provided by the WP#/ACC pin. This function is primarily intended to allow faster manufacturing throughput
at the factory.
14
If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass
mode, temporarily unprotects any protected sectors,
and uses the higher voltage on the pin to reduce the
time required for program operations. The system
would use a two-cycle program command sequence
as required by the Unlock Bypass mode. Removing
VHH from the WP#/ACC pin returns the device to normal operation. Note that VHH must not be asserted on
WP#/ACC for operations other than accelerated programming, or device damage may result. In addition,
the WP#/ACC pin must not be left floating or unconnected; inconsistent behavior of the device may result.
See “Write Protect (WP#)” on page 19 for related information.
Autoselect Functions
If the system writes the autoselect command sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal register (which is separate from the memory array)
on DQ15–DQ0. Standard read cycle timings apply in
this mode. Refer to the Sector/Sector Block Protection
and Unprotection and Autoselect Command Sequence sections for more information.
Simultaneous Read/Write Operations with
Zero Latency
This device is capable of reading data from one bank
of memory while programming or erasing in the other
bank of memory. An erase operation may also be suspended to read from or program to another location
within the same bank (except the sector being
erased). Figure 22 shows how read and write cycles
may be initiated for simultaneous operation with zero
latency. ICC6f and ICC7f in the table represent the current specifications for read-while-program and
read-while-erase, respectively.
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In
this mode, current consumption is greatly reduced,
and the outputs are placed in the high impedance
state, independent of the OE# input.
The device enters the CMOS standby mode when the
CE#f and RESET# pins are both held at VCC ± 0.3 V.
(Note that this is a more restricted voltage range than
V IH .) If CE#f and RESET# are held at V IH , but not
within VCC ± 0.3 V, the device will be in the standby
mode, but the standby current will be greater. The device requires standard access time (tCE) for read access when the device is in either of these standby
modes, before it is ready to read data.
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
If the device is deselected during erasure or programming, the device draws active current until the
operation is completed.
ICC3f in the table represents the standby current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for t ACC +
30 ns. The automatic sleep mode is independent of
the CE#f, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output
data is latched and always available to the system.
ICC5f in the table represents the automatic sleep mode
current specification.
RESET#: Hardware Reset Pin
Current is reduced for the duration of the RESET#
pulse. When RESET# is held at VSS±0.3 V, the device
draws CMOS standby current (I CC4 f). If RESET# is
held at VIL but not within VSS±0.3 V, the standby current will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the
internal reset operation is complete, which requires a
time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether
the reset operation is complete. If RESET# is asserted
when a program or erase operation is not executing
(RY/BY# pin is “1”), the reset operation is completed
within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the RESET# pin returns to VIH.
The RESET# pin provides a hardware method of resetting the device to reading array data. When the RERefer to the AC Characteristics tables for RESET# paSET# pin is driven low for at least a period of tRP, the
rameters and to Figure 16 for the timing diagram.
device immediately terminates any operation in
progress, tristates all output pins, and ignores all
Output Disable Mode
read/write commands for the duration of the RESET#
When the OE# input is at VIH, output from the device is
pulse. The device also resets the internal state madisabled. The output pins are placed in the high
chine to reading array data. The operation that was inimpedance state.
terrupted should be reinitiated once the device is
ready to accept another command sequence, to ensure data integrity.
Table 5. Am29DL640H Sector Architecture
Bank
Bank 1
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA0
0000000000
8/4
000000h–001FFFh
00000h–00FFFh
SA1
0000000001
8/4
002000h–003FFFh
01000h–01FFFh
SA2
0000000010
8/4
004000h–005FFFh
02000h–02FFFh
SA3
0000000011
8/4
006000h–007FFFh
03000h–03FFFh
SA4
0000000100
8/4
008000h–009FFFh
04000h–04FFFh
SA5
0000000101
8/4
00A000h–00BFFFh
05000h–05FFFh
SA6
0000000110
8/4
00C000h–00DFFFh
06000h–06FFFh
SA7
0000000111
8/4
00E000h–00FFFFFh
07000h–07FFFh
SA8
0000001xxx
64/32
010000h–01FFFFh
08000h–0FFFFh
SA9
0000010xxx
64/32
020000h–02FFFFh
10000h–17FFFh
SA10
0000011xxx
64/32
030000h–03FFFFh
18000h–1FFFFh
SA11
0000100xxx
64/32
040000h–04FFFFh
20000h–27FFFh
SA12
0000101xxx
64/32
050000h–05FFFFh
28000h–2FFFFh
SA13
0000110xxx
64/32
060000h–06FFFFh
30000h–37FFFh
SA14
0000111xxx
64/32
070000h–07FFFFh
38000h–3FFFFh
SA15
0001000xxx
64/32
080000h–08FFFFh
40000h–47FFFh
SA16
0001001xxx
64/32
090000h–09FFFFh
48000h–4FFFFh
SA17
0001010xxx
64/32
0A0000h–0AFFFFh
50000h–57FFFh
SA18
0001011xxx
64/32
0B0000h–0BFFFFh
58000h–5FFFFh
SA19
0001100xxx
64/32
0C0000h–0CFFFFh
60000h–67FFFh
SA20
0001101xxx
64/32
0D0000h–0DFFFFh
68000h–6FFFFh
SA21
0001101xxx
64/32
0E0000h–0EFFFFh
70000h–77FFFh
SA22
0001111xxx
64/32
0F0000h–0FFFFFh
78000h–7FFFFh
November 24, 2003
Am41DL6408H
15
A D V A N C E
Table 5.
Bank
Bank 2
16
I N F O R M A T I O N
Am29DL640H Sector Architecture (Continued)
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA23
0010000xxx
64/32
100000h–00FFFFh
80000h–87FFFh
SA24
0010001xxx
64/32
110000h–11FFFFh
88000h–8FFFFh
SA25
0010010xxx
64/32
120000h–12FFFFh
90000h–97FFFh
SA26
0010011xxx
64/32
130000h–13FFFFh
98000h–9FFFFh
SA27
0010100xxx
64/32
140000h–14FFFFh
A0000h–A7FFFh
SA28
0010101xxx
64/32
150000h–15FFFFh
A8000h–AFFFFh
SA29
0010110xxx
64/32
160000h–16FFFFh
B0000h–B7FFFh
SA30
0010111xxx
64/32
170000h–17FFFFh
B8000h–BFFFFh
SA31
0011000xxx
64/32
180000h–18FFFFh
C0000h–C7FFFh
SA32
0011001xxx
64/32
190000h–19FFFFh
C8000h–CFFFFh
SA33
0011010xxx
64/32
1A0000h–1AFFFFh
D0000h–D7FFFh
SA34
0011011xxx
64/32
1B0000h–1BFFFFh
D8000h–DFFFFh
SA35
0011000xxx
64/32
1C0000h–1CFFFFh
E0000h–E7FFFh
SA36
0011101xxx
64/32
1D0000h–1DFFFFh
E8000h–EFFFFh
SA37
0011110xxx
64/32
1E0000h–1EFFFFh
F0000h–F7FFFh
SA38
0011111xxx
64/32
1F0000h–1FFFFFh
F8000h–FFFFFh
SA39
0100000xxx
64/32
200000h–20FFFFh
F9000h–107FFFh
SA40
0100001xxx
64/32
210000h–21FFFFh
108000h–10FFFFh
SA41
0100010xxx
64/32
220000h–22FFFFh
110000h–117FFFh
SA42
0101011xxx
64/32
230000h–23FFFFh
118000h–11FFFFh
SA43
0100100xxx
64/32
240000h–24FFFFh
120000h–127FFFh
SA44
0100101xxx
64/32
250000h–25FFFFh
128000h–12FFFFh
SA45
0100110xxx
64/32
260000h–26FFFFh
130000h–137FFFh
SA46
0100111xxx
64/32
270000h–27FFFFh
138000h–13FFFFh
SA47
0101000xxx
64/32
280000h–28FFFFh
140000h–147FFFh
SA48
0101001xxx
64/32
290000h–29FFFFh
148000h–14FFFFh
SA49
0101010xxx
64/32
2A0000h–2AFFFFh
150000h–157FFFh
SA50
0101011xxx
64/32
2B0000h–2BFFFFh
158000h–15FFFFh
SA51
0101100xxx
64/32
2C0000h–2CFFFFh
160000h–167FFFh
SA52
0101101xxx
64/32
2D0000h–2DFFFFh
168000h–16FFFFh
SA53
0101110xxx
64/32
2E0000h–2EFFFFh
170000h–177FFFh
SA54
0101111xxx
64/32
2F0000h–2FFFFFh
178000h–17FFFFh
SA55
0110000xxx
64/32
300000h–30FFFFh
180000h–187FFFh
SA56
0110001xxx
64/32
310000h–31FFFFh
188000h–18FFFFh
SA57
0110010xxx
64/32
320000h–32FFFFh
190000h–197FFFh
SA58
0110011xxx
64/32
330000h–33FFFFh
198000h–19FFFFh
SA59
0100100xxx
64/32
340000h–34FFFFh
1A0000h–1A7FFFh
SA60
0110101xxx
64/32
350000h–35FFFFh
1A8000h–1AFFFFh
SA61
0110110xxx
64/32
360000h–36FFFFh
1B0000h–1B7FFFh
SA62
0110111xxx
64/32
370000h–37FFFFh
1B8000h–1BFFFFh
SA63
0111000xxx
64/32
380000h–38FFFFh
1C0000h–1C7FFFh
SA64
0111001xxx
64/32
390000h–39FFFFh
1C8000h–1CFFFFh
SA65
0111010xxx
64/32
3A0000h–3AFFFFh
1D0000h–1D7FFFh
SA66
0111011xxx
64/32
3B0000h–3BFFFFh
1D8000h–1DFFFFh
SA67
0111100xxx
64/32
3C0000h–3CFFFFh
1E0000h–1E7FFFh
SA68
0111101xxx
64/32
3D0000h–3DFFFFh
1E8000h–1EFFFFh
SA69
0111110xxx
64/32
3E0000h–3EFFFFh
1F0000h–1F7FFFh
SA70
0111111xxx
64/32
3F0000h–3FFFFFh
1F8000h–1FFFFFh
Am41DL6408H
November 24, 2003
A D V A N C E
Table 5.
Bank
Bank 3
I N F O R M A T I O N
Am29DL640H Sector Architecture (Continued)
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA71
1000000xxx
64/32
400000h–40FFFFh
200000h–207FFFh
SA72
1000001xxx
64/32
410000h–41FFFFh
208000h–20FFFFh
SA73
1000010xxx
64/32
420000h–42FFFFh
210000h–217FFFh
SA74
1000011xxx
64/32
430000h–43FFFFh
218000h–21FFFFh
SA75
1000100xxx
64/32
440000h–44FFFFh
220000h–227FFFh
SA76
1000101xxx
64/32
450000h–45FFFFh
228000h–22FFFFh
SA77
1000110xxx
64/32
460000h–46FFFFh
230000h–237FFFh
SA78
1000111xxx
64/32
470000h–47FFFFh
238000h–23FFFFh
SA79
1001000xxx
64/32
480000h–48FFFFh
240000h–247FFFh
SA80
1001001xxx
64/32
490000h–49FFFFh
248000h–24FFFFh
SA81
1001010xxx
64/32
4A0000h–4AFFFFh
250000h–257FFFh
SA82
1001011xxx
64/32
4B0000h–4BFFFFh
258000h–25FFFFh
SA83
1001100xxx
64/32
4C0000h–4CFFFFh
260000h–267FFFh
SA84
1001101xxx
64/32
4D0000h–4DFFFFh
268000h–26FFFFh
SA85
1001110xxx
64/32
4E0000h–4EFFFFh
270000h–277FFFh
SA86
1001111xxx
64/32
4F0000h–4FFFFFh
278000h–27FFFFh
SA87
1010000xxx
64/32
500000h–50FFFFh
280000h–28FFFFh
SA88
1010001xxx
64/32
510000h–51FFFFh
288000h–28FFFFh
SA89
1010010xxx
64/32
520000h–52FFFFh
290000h–297FFFh
SA90
1010011xxx
64/32
530000h–53FFFFh
298000h–29FFFFh
SA91
1010100xxx
64/32
540000h–54FFFFh
2A0000h–2A7FFFh
SA92
1010101xxx
64/32
550000h–55FFFFh
2A8000h–2AFFFFh
SA93
1010110xxx
64/32
560000h–56FFFFh
2B0000h–2B7FFFh
SA94
1010111xxx
64/32
570000h–57FFFFh
2B8000h–2BFFFFh
SA95
1011000xxx
64/32
580000h–58FFFFh
2C0000h–2C7FFFh
SA96
1011001xxx
64/32
590000h–59FFFFh
2C8000h–2CFFFFh
SA97
1011010xxx
64/32
5A0000h–5AFFFFh
2D0000h–2D7FFFh
SA98
1011011xxx
64/32
5B0000h–5BFFFFh
2D8000h–2DFFFFh
SA99
1011100xxx
64/32
5C0000h–5CFFFFh
2E0000h–2E7FFFh
SA100
1011101xxx
64/32
5D0000h–5DFFFFh
2E8000h–2EFFFFh
SA101
1011110xxx
64/32
5E0000h–5EFFFFh
2F0000h–2FFFFFh
SA102
1011111xxx
64/32
5F0000h–5FFFFFh
2F8000h–2FFFFFh
SA103
1100000xxx
64/32
600000h–60FFFFh
300000h–307FFFh
SA104
1100001xxx
64/32
610000h–61FFFFh
308000h–30FFFFh
SA105
1100010xxx
64/32
620000h–62FFFFh
310000h–317FFFh
SA106
1100011xxx
64/32
630000h–63FFFFh
318000h–31FFFFh
SA107
1100100xxx
64/32
640000h–64FFFFh
320000h–327FFFh
SA108
1100101xxx
64/32
650000h–65FFFFh
328000h–32FFFFh
SA109
1100110xxx
64/32
660000h–66FFFFh
330000h–337FFFh
SA110
1100111xxx
64/32
670000h–67FFFFh
338000h–33FFFFh
SA111
1101000xxx
64/32
680000h–68FFFFh
340000h–347FFFh
SA112
1101001xxx
64/32
690000h–69FFFFh
348000h–34FFFFh
SA113
1101010xxx
64/32
6A0000h–6AFFFFh
350000h–357FFFh
SA114
1101011xxx
64/32
6B0000h–6BFFFFh
358000h–35FFFFh
SA115
1101100xxx
64/32
6C0000h–6CFFFFh
360000h–367FFFh
SA116
1101101xxx
64/32
6D0000h–6DFFFFh
368000h–36FFFFh
SA117
1101110xxx
64/32
6E0000h–6EFFFFh
370000h–377FFFh
SA118
1101111xxx
64/32
6F0000h–6FFFFFh
378000h–37FFFFh
November 24, 2003
Am41DL6408H
17
A D V A N C E
Table 5.
Bank
Bank 4
I N F O R M A T I O N
Am29DL640H Sector Architecture (Continued)
Sector
Sector Address
A21–A12
Sector Size
(Kbytes/Kwords)
(x8)
Address Range
(x16)
Address Range
SA119
1110000xxx
64/32
700000h–70FFFFh
380000h–387FFFh
SA120
1110001xxx
64/32
710000h–71FFFFh
388000h–38FFFFh
SA121
1110010xxx
64/32
720000h–72FFFFh
390000h–397FFFh
SA122
1110011xxx
64/32
730000h–73FFFFh
398000h–39FFFFh
SA123
1110100xxx
64/32
740000h–74FFFFh
3A0000h–3A7FFFh
SA124
1110101xxx
64/32
750000h–75FFFFh
3A8000h–3AFFFFh
SA125
1110110xxx
64/32
760000h–76FFFFh
3B0000h–3B7FFFh
SA126
1110111xxx
64/32
770000h–77FFFFh
3B8000h–3BFFFFh
SA127
1111000xxx
64/32
780000h–78FFFFh
3C0000h–3C7FFFh
SA128
1111001xxx
64/32
790000h–79FFFFh
3C8000h–3CFFFFh
SA129
1111010xxx
64/32
7A0000h–7AFFFFh
3D0000h–3D7FFFh
SA130
1111011xxx
64/32
7B0000h–7BFFFFh
3D8000h–3DFFFFh
SA131
1111100xxx
64/32
7C0000h–7CFFFFh
3E0000h–3E7FFFh
SA132
1111101xxx
64/32
7D0000h–7DFFFFh
3E8000h–3EFFFFh
SA133
1111110xxx
64/32
7E0000h–7EFFFFh
3F0000h–3F7FFFh
SA134
1111111000
8/4
7F0000h–7F1FFFh
3F8000h–3F8FFFh
SA135
1111111001
8/4
7F2000h–7F3FFFh
3F9000h–3F9FFFh
SA136
1111111010
8/4
7F4000h–7F5FFFh
3FA000h–3FAFFFh
SA137
1111111011
8/4
7F6000h–7F7FFFh
3FB000h–3FBFFFh
SA138
1111111100
8/4
7F8000h–7F9FFFh
3FC000h–3FCFFFh
SA139
1111111101
8/4
7FA000h–7FBFFFh
3FD000h–3FDFFFh
SA140
1111111110
8/4
7FC000h–7FDFFFh
3FE000h–3FEFFFh
SA141
1111111111
8/4
7FE000h–7FFFFFh
3FF000h–3FFFFFh
Note: The address range is A21:A-1 in byte mode (CIOf=VIL) or A21:A0 in word mode (CIOf=VIH).
Table 6.
Bank Address
Bank
1
2
3
4
A21–A19
000
001, 010, 011
100, 101, 110
111
Table 7.
18
SecSi™ Sector Addresses
Device
Sector Size
(x8)
Address Range
(x16)
Address Range
Am29DL640H
256 bytes
000000h–0000FFh
00000h–0007Fh
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
Sector/Sector Block Protection and
Unprotection
Sector
A21–A12
Sector/
Sector Block Size
SA95–SA98
10110XXXXX
256 (4x64) Kbytes
SA99–SA102
10111XXXXX
256 (4x64) Kbytes
SA103–SA106
11000XXXXX
256 (4x64) Kbytes
SA107–SA110
11001XXXXX
256 (4x64) Kbytes
SA111–SA114
11010XXXXX
256 (4x64) Kbytes
The hardware sector protection feature disables both
program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected
sectors. Sector protection/unprotection can be implemented via two methods.
SA115–SA118
11011XXXXX
256 (4x64) Kbytes
SA119–SA122
11100XXXXX
256 (4x64) Kbytes
SA123–SA126
11101XXXXX
256 (4x64) Kbytes
SA127–SA130
11110XXXXX
256 (4x64) Kbytes
SA131–SA133
1111100XXX,
1111101XXX,
1111110XXX
192 (3x64) Kbytes
Table 8. Am29DL640H Boot
Sector/Sector Block Addresses for
Protection/Unprotection
SA134
1111111000
8 Kbytes
SA135
1111111001
8 Kbytes
SA136
1111111010
8 Kbytes
(Note: For the following discussion, the term “sector”
applies to both sectors and sector blocks. A sector
block consists of two or more adjacent sectors that are
protected or unprotected at the same time (see Table
8).
1111111011
8 Kbytes
A21–A12
Sector/
Sector Block Size
SA137
Sector
SA138
1111111100
8 Kbytes
SA0
0000000000
8 Kbytes
SA139
1111111101
8 Kbytes
SA1
0000000001
8 Kbytes
SA140
1111111110
8 Kbytes
SA2
0000000010
8 Kbytes
SA141
1111111111
8 Kbytes
SA3
0000000011
8 Kbytes
SA4
0000000100
8 Kbytes
SA5
0000000101
8 Kbytes
SA6
0000000110
8 Kbytes
SA7
0000000111
8 Kbytes
SA8–SA10
0000001XXX,
0000010XXX,
0000011XXX,
192 (3x64) Kbytes
SA11–SA14
00001XXXXX
256 (4x64) Kbytes
SA15–SA18
00010XXXXX
256 (4x64) Kbytes
SA19–SA22
00011XXXXX
256 (4x64) Kbytes
SA23–SA26
00100XXXXX
256 (4x64) Kbytes
SA27-SA30
00101XXXXX
256 (4x64) Kbytes
SA31-SA34
00110XXXXX
256 (4x64) Kbytes
SA35-SA38
00111XXXXX
256 (4x64) Kbytes
SA39-SA42
01000XXXXX
256 (4x64) Kbytes
SA43-SA46
01001XXXXX
256 (4x64) Kbytes
SA47-SA50
01010XXXXX
256 (4x64) Kbytes
SA51-SA54
01011XXXXX
256 (4x64) Kbytes
SA55–SA58
01100XXXXX
256 (4x64) Kbytes
SA59–SA62
01101XXXXX
256 (4x64) Kbytes
SA63–SA66
01110XXXXX
256 (4x64) Kbytes
SA67–SA70
01111XXXXX
256 (4x64) Kbytes
SA71–SA74
10000XXXXX
256 (4x64) Kbytes
SA75–SA78
10001XXXXX
256 (4x64) Kbytes
SA79–SA82
10010XXXXX
256 (4x64) Kbytes
SA83–SA86
10011XXXXX
256 (4x64) Kbytes
SA87–SA90
10100XXXXX
256 (4x64) Kbytes
SA91–SA94
10101XXXXX
256 (4x64) Kbytes
November 24, 2003
Sector Protect/Sector Unprotect requires VID on the
RESET# pin only, and can be implemented either
in-system or via programming equipment. Figure 2
shows the algorithms and Figure 27 shows the timing
diagram. For sector unprotect, all unprotected sectors
must first be protected prior to the first sector unprotect write cycle. Note that the sector unprotect algorithm unprotects all sectors in parallel. All previously
protected sectors must be individually re-protected. To
change data in protected sectors efficiently, the temporary sector unprotect function is available. See
“Temporary Sector Unprotect”.
The device is shipped with all sectors unprotected.
AMD offers the option of programming and protecting
sectors at its factory prior to shipping the device
through AMD’s ExpressFlash™ Service. Contact an
AMD representative for details.
It is possible to determine whether a sector is protected or unprotected. See the Sector/Sector Block
Protection and Unprotection section for details.
Write Protect (WP#)
The Write Protect function provides a hardware
method of protecting without using VID. This function is
one of two provided by the WP#/ACC pin.
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in sectors
0, 1, 140, and 141, independently of whether those
sectors were protected or unprotected using the
Am41DL6408H
19
A D V A N C E
I N F O R M A T I O N
method described in “Sector/Sector Block Protection
and Unprotection”.
If the system asserts VIH on the WP#/ACC pin, the device reverts to whether sectors 0, 1, 140, and 141
were last set to be protected or unprotected. That is,
sector protection or unprotection for these sectors depends on whether they were last protected or unprotected using the method described in “Sector/Sector
Block Protection and Unprotection”.
Note that the WP#/ACC pin must not be left floating or
unconnected; inconsistent behavior of the device may
result.
Table 9.
WP# Input
Voltage
WP#/ACC Modes
Device
Mode
VIL
Disables programming and erasing in
SA0, SA1, SA140, and SA141
VIH
Enables programming and erasing in
SA0, SA1, SA140, and SA141
VHH
Enables accelerated programming
(ACC). See “Accelerated Program
Operation” on page 14.
Temporary Sector Unprotect
(Note: For the following discussion, the term “sector”
applies to both sectors and sector blocks. A sector
block consists of two or more adjacent sectors that are
protected or unprotected at the same time (see Table
8).
This feature allows temporary unprotection of previously protected sectors to change data in-system. The
Sector Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly protected
sectors can be programmed or erased by selecting the
sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are
protected again. Figure 1 shows the algorithm, and
Figure 26 shows the timing diagrams, for this feature.
If the WP#/ACC pin is at VIL , sectors 0, 1, 140, and
141 will remain protected during the Temporary sector
Unprotect mode.
START
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector
Unprotect Completed
(Note 2)
Notes:
1. All protected sectors unprotected (If WP#/ACC = VIL,
sectors 0, 1, 140, and 141 will remain protected).
2. All previously protected sectors are protected once
again.
Figure 1.
20
Am41DL6408H
Temporary Sector Unprotect Operation
November 24, 2003
A D V A N C E
I N F O R M A T I O N
START
START
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
unprotected sectors
prior to issuing the
first sector
unprotect address
PLSCNT = 1
RESET# = VID
Wait 1 µs
Temporary Sector
Unprotect Mode
No
PLSCNT = 1
RESET# = VID
Wait 1 µs
No
First Write
Cycle = 60h?
First Write
Cycle = 60h?
Yes
Yes
Set up sector
address
No
All sectors
protected?
Sector Protect:
Write 60h to sector
address with
A6 = 0, A1 = 1,
A0 = 0
Yes
Set up first sector
address
Sector Unprotect:
Write 60h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Wait 150 µs
Verify Sector
Protect: Write 40h
to sector address
with A6 = 0,
A1 = 1, A0 = 0
Increment
PLSCNT
Temporary Sector
Unprotect Mode
Reset
PLSCNT = 1
Read from
sector address
with A6 = 0,
A1 = 1, A0 = 0
Wait 15 ms
Verify Sector
Unprotect: Write
40h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Increment
PLSCNT
No
No
PLSCNT
= 25?
Yes
Yes
No
Yes
Device failed
Read from
sector address
with A6 = 1,
A1 = 1, A0 = 0
Data = 01h?
Protect another
sector?
PLSCNT
= 1000?
No
Data = 00h?
Yes
Yes
Remove VID
from RESET#
Device failed
Last sector
verified?
Write reset
command
Sector Protect
Algorithm
Sector Protect
complete
Set up
next sector
address
No
No
Yes
Sector Unprotect
Algorithm
Remove VID
from RESET#
Write reset
command
Sector Unprotect
complete
Figure 2.
November 24, 2003
In-System Sector Protect/Unprotect Algorithms
Am41DL6408H
21
A D V A N C E
I N F O R M A T I O N
SecSi™ (Secured Silicon)
Sector Flash Memory Region
The SecSi (Secured Silicon) Sector feature provides a
Flash memory region that enables permanent part
identification through an Electronic Serial Number
(ESN). The SecSi Sector is 256 bytes in length, and
uses a SecSi Sector Indicator Bit (DQ7) to indicate
whether or not the SecSi Sector is locked when
shipped from the factory. This bit is permanently set at
the factory and cannot be changed, which prevents
cloning of a factory locked part. This ensures the security of the ESN once the product is shipped to the field.
AMD offers the device with the SecSi Sector either
fac t or y l ocke d or c u s t om e r l o ckabl e. T he fac tory-locked version is always protected when shipped
from the factory, and has the SecSi (Secured Silicon)
Sector Indicator Bit permanently set to a “1.” The customer-lockable version is shipped with the SecSi Sector unprotected, allowing customers to utilize the that
sector in any manner they choose. The customer-lockable version has the SecSi (Secured Silicon) Sector
Indicator Bit permanently set to a “0.” Thus, the SecSi
Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are factory locked.
The system accesses the SecSi Sector Secure
through a command sequence (see “Enter SecSi™
Sector/Exit SecSi Sector Command Sequence”). After
the system has written the Enter SecSi Sector command sequence, it may read the SecSi Sector by
using the addresses normally occupied by the boot
sectors. This mode of operation continues until the
system issues the Exit SecSi Sector command sequence, or until power is removed from the device. On
power-up, or following a hardware reset, the device reverts to sending commands to the first 256 bytes of
Sector 0. Note that ACC or Unlock bypass not available.
Factory Locked: SecSi Sector Programmed and
Protected At the Factory
In a factory locked device, the SecSi Sector is protected when the device is shipped from the factory.
The SecSi Sector cannot be modified in any way. The
device is preprogrammed with both a random number
and a secure ESN. The 8-word random number will at
addresses 000000h–000007h in word mode (or
000000h–00000Fh in byte mode). The secure ESN
will be programmed in the next 8 words at addresses
22
000008h–00000Fh (or 000010h–000020h in byte
mode). The device is available preprogrammed with
one of the following:
■ A random, secure ESN only
■ Customer code through the ExpressFlash service
■ Both a random, secure ESN and customer code
through the ExpressFlash service.
Customers may opt to have their code programmed by
AMD through the AMD ExpressFlash service. AMD
programs the customer’s code, with or without the random ESN. The devices are then shipped from AMD’s
factory with the SecSi Sector permanently locked.
Contact an AMD representative for details on using
AMD’s ExpressFlash service.
Customer Lockable: SecSi Sector NOT
Programmed or Protected At the Factory
If the security feature is not required, the SecSi Sector
can be treated as an additional Flash memory space.
The SecSi Sector can be read any number of times,
but can be programmed and locked only once. Note
that the accelerated programming (ACC) and unlock
bypass functions are not available when programming
the SecSi Sector.
The SecSi Sector area can be protected using one of
the following procedures:
■ Write the three-cycle Enter SecSi Sector Region
command sequence, and then follow the in-system
sector protect algorithm as shown in Figure 2, except that RESET# may be at either VIH or VID. This
allows in-system protection of the SecSi Sector Region without raising any device pin to a high voltage.
Note that this method is only applicable to the SecSi
Sector.
■ Write the three-cycle Enter SecSi Region command
sequence, and then use the alternate method of
sector protection described in the “Sector/Sector
Block Protection and Unprotection” section.
Once the SecSi Sector is locked and verified, the system must write the Exit SecSi Sector Region command sequence to return to reading and writing the
remainder of the array.
The SecSi Sector lock must be used with caution
since, once locked, there is no procedure available for
unlocking the SecSi Sector area and none of the bits
in the SecSi Sector memory space can be modified in
any way.
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
Logical Inhibit
Write cycles are inhibited by holding any one of OE# =
VIL, CE#f = VIH or WE# = VIH. To initiate a write cycle,
CE#f and WE# must be a logical zero while OE# is a
logical one.
START
RESET# =
VIH or VID
Wait 1 µs
Write 60h to
any address
Write 40h to SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Read from SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
Figure 3.
If data = 00h,
SecSi Sector is
unprotected.
If data = 01h,
SecSi Sector is
protected.
Power-Up Write Inhibit
If WE# = CE#f = VIL and OE# = VIH during power up,
the device does not accept commands on the rising
edge of WE#. The internal state machine is automatically reset to the read mode on power-up.
Remove VIH or VID
from RESET#
COMMON FLASH MEMORY INTERFACE
(CFI)
Write reset
command
The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified
software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device
families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
SecSi Sector
Protect Verify
complete
SecSi Sector Protect Verify
Hardware Data Protection
The command sequence requirement of unlock cycles
for programming or erasing provides data protection
against inadvertent writes (refer to Table 14 for command definitions). In addition, the following hardware
data protection measures prevent accidental erasure
or programming, which might otherwise be caused by
spurious system level signals during V CC power-up
and power-down transitions, or from system noise.
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register
and all internal program/erase circuits are disabled,
and the device resets to the read mode. Subsequent
writes are ignored until VCC is greater than VLKO. The
system must provide the proper signals to the control
pins to prevent unintentional writes when V CC is
greater than VLKO.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h in word mode (or address AAh in byte mode), any
time the device is ready to read array data. The
system can read CFI information at the addresses
given in Tables 10–13. To terminate reading CFI data,
the system must write the reset command.The CFI
Query mode is not accessible when the device is executing an Embedded Program or embedded Erase algorithm.
The system can also write the CFI query command
when the device is in the autoselect mode. The device
enters the CFI query mode, and the system can read
CFI data at the addresses given in Tables 10–13. The
system must write the reset command to return the
device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100, available via the World
Wide Web at http://www.amd.com/flash/cfi. Alternatively, contact an AMD representative for copies of
these documents.
Write Pulse “Glitch” Protection
Noise pulses of less than 5 ns (typical) on OE#, CE#f
or WE# do not initiate a write cycle.
November 24, 2003
Am41DL6408H
23
A D V A N C E
Table 10.
I N F O R M A T I O N
CFI Query Identification String
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
10h
11h
12h
20h
22h
24h
0051h
0052h
0059h
Query Unique ASCII string “QRY”
13h
14h
26h
28h
0002h
0000h
Primary OEM Command Set
15h
16h
2Ah
2Ch
0040h
0000h
Address for Primary Extended Table
17h
18h
2Eh
30h
0000h
0000h
Alternate OEM Command Set (00h = none exists)
19h
1Ah
32h
34h
0000h
0000h
Address for Alternate OEM Extended Table (00h = none exists)
Table 11.
Description
System Interface String
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
1Bh
36h
0027h
VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch
38h
0036h
VCC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh
3Ah
0000h
VPP Min. voltage (00h = no VPP pin present)
1Eh
3Ch
0000h
VPP Max. voltage (00h = no VPP pin present)
1Fh
3Eh
0003h
Typical timeout per single byte/word write 2N µs
20h
40h
0000h
Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h
42h
0009h
Typical timeout per individual block erase 2N ms
22h
44h
0000h
Typical timeout for full chip erase 2N ms (00h = not supported)
23h
46h
0005h
Max. timeout for byte/word write 2N times typical
24h
48h
0000h
Max. timeout for buffer write 2N times typical
25h
4Ah
0004h
Max. timeout per individual block erase 2N times typical
26h
4Ch
0000h
Max. timeout for full chip erase 2N times typical (00h = not supported)
Table 12.
Description
Device Geometry Definition
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
27h
4Eh
0017h
Device Size = 2N byte
28h
29h
50h
52h
0002h
0000h
Flash Device Interface description (refer to CFI publication 100)
2Ah
2Bh
54h
56h
0000h
0000h
Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch
58h
0003h
Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
5Ah
5Ch
5Eh
60h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
24
Description
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
31h
32h
33h
34h
62h
64h
66h
68h
007Dh
0000h
0000h
0001h
Erase Block Region 2 Information
(refer to the CFI specification or CFI publication 100)
35h
36h
37h
38h
6Ah
6Ch
6Eh
70h
0007h
0000h
0020h
0000h
Erase Block Region 3 Information
(refer to the CFI specification or CFI publication 100)
39h
3Ah
3Bh
3Ch
72h
74h
76h
78h
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
(refer to the CFI specification or CFI publication 100)
November 24, 2003
Am41DL6408H
25
A D V A N C E
Table 13.
I N F O R M A T I O N
Primary Vendor-Specific Extended Query
Addresses
(Word Mode)
Addresses
(Byte Mode)
Data
40h
41h
42h
80h
82h
84h
0050h
0052h
0049h
Query-unique ASCII string “PRI”
43h
86h
0031h
Major version number, ASCII (reflects modifications to the silicon)
44h
88h
0033h
Minor version number, ASCII (reflects modifications to the CFI table)
45h
8Ah
0004h
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Description
Silicon Revision Number (Bits 7-2)
46h
8Ch
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
8Eh
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
90h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
92h
0004h
Sector Protect/Unprotect scheme
01 =29F040 mode, 02 = 29F016 mode, 03 = 29F400, 04 = 29LV800
mode
4Ah
94h
4Bh
96h
0000h
Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch
98h
0000h
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
4Dh
9Ah
0085h
4Eh
9Ch
0095h
0077h
Simultaneous Operation
00 = Not Supported, X = Number of Sectors (excluding Bank 1)
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
Top/Bottom Boot Sector Flag
26
4Fh
9Eh
0000h
50h
A0h
0001h
57h
AEh
0004h
58h
B0h
0017h
59h
B2h
0030h
5Ah
B4h
0030h
5Bh
B6h
0017h
00h = Uniform device, 01h = 8 x 8 Kbyte Sectors, Top And Bottom Boot
with Write Protect, 02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
Program Suspend
0 = Not supported, 1 = Supported
Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
Bank 1 Region Information
X = Number of Sectors in Bank 1
Bank 2 Region Information
X = Number of Sectors in Bank 2
Bank 3 Region Information
X = Number of Sectors in Bank 3
Bank 4 Region Information
X = Number of Sectors in Bank 4
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
COMMAND DEFINITIONS
Writing specific address and data commands or sequences into the command register initiates device operations. Table 14 defines the valid register command
sequences. Writing incorrect address and data values or writing them in the improper sequence may
place the device in an unknown state. A reset command is then required to return the device to reading
array data.
All addresses are latched on the falling edge of WE#
or CE#f, whichever happens later. All data is latched
on the rising edge of WE# or CE#f, whichever happens first. Refer to the AC Characteristics section for
timing diagrams.
Reading Array Data
The device is automatically set to reading array data
after device power-up. No commands are required to
retrieve data. Each bank is ready to read array data
after completing an Embedded Program or Embedded
Erase algorithm.
After the device accepts an Erase Suspend command,
the corresponding ban k enters the erase-suspend-read mode, after which the system can read
data from any non-erase-suspended sector within the
same bank. The system can read array data using the
standard read timing, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming
operation in the Erase Suspend mode, the system
may once again read array data with the same exception. See the Erase Suspend/Erase Resume Commands section for more information.
The system must issue the reset command to return a
bank to the read (or erase-suspend-read) mode if DQ5
goes high during an active program or erase operation, or if the bank is in the autoselect mode. See the
next section, Reset Command, for more information.
See also Requirements for Reading Array Data in the
section for more information. The Flash Read-Only
Operations table provides the read parameters, and
Figure 15 shows the timing diagram.
The reset command may be written between the
sequence cycles in a program command sequence
before programming begins. This resets the bank to
which the system was writing to the read mode. If the
program command sequence is written to a bank that
is in the Erase Suspend mode, writing the reset
co m m an d re tur ns th a t ba nk to the e ra s e- s us pend-read mode. Once programming begins, however,
the device ignores reset commands until the operation
is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command
must be written to return to the read mode. If a bank
entered the autoselect mode while in the Erase Suspend mode, writing the reset command returns that
bank to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation,
writing the reset command returns the banks to the
read mode (or erase-suspend-read mode if that bank
was in Erase Suspend).
Autoselect Command Sequence
The autoselect command sequence allows the host
system to access the manufacturer and device codes,
and determine whether or not a sector is protected.
The autoselect command sequence may be written to
an address within a bank that is either in the read or
erase-suspend-read mode. The autoselect command
may not be written while the device is actively programming or erasing in the other bank.
The autoselect command sequence is initiated by first
writing two unlock cycles. This is followed by a third
write cycle that contains the bank address and the autoselect command. The bank then enters the autoselect mode. The system may read any number of
autoselect codes without re-initiating the command sequence.
Reset Command
Table 14 shows the address and data requirements.
To determine sector protection information, the system
must write to the appropriate bank address (BA) and
sector address (SADD). Table 5 shows the address
range and bank number associated with each sector.
Writing the reset command resets the banks to the
read or erase-suspend-read mode. Address bits are
don’t cares for this command.
The system must write the reset command to return to
the read mode (or erase-suspend-read mode if the
bank was previously in Erase Suspend).
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the bank to which the system was writing to the read mode. Once erasure begins, however, the device ignores reset commands
until the operation is complete.
November 24, 2003
Enter SecSi™ Sector/Exit SecSi Sector
Command Sequence
The SecSi Sector region provides a secured data area
containing a random, sixteen-byte electronic serial
number (ESN). The system can access the SecSi
Sector region by issuing the three-cycle Enter SecSi
Am41DL6408H
27
A D V A N C E
I N F O R M A T I O N
Sector command sequence. The device continues to
access the SecSi Sector region until the system issues the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector command sequence
returns the device to normal operation. The SecSi
Sector is not accessible when the device is executing
an Embedded Program or embedded Erase algorithm.
Table 14 shows the address and data requirements for
both command sequences. See also “SecSi™ (Secured Silicon) Sector Flash Memory Region” for further
information.
Byte/Word Program Command Sequence
The system may program the device by word or byte,
depending on the state of the CIOf pin. Programming
is a four-bus-cycle operation. The program command
sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The
program address and data are written next, which in
turn initiate the Embedded Program algorithm. The
system is not required to provide further controls or
timings. The device automatically provides internally
generated program pulses and verifies the programmed cell margin. Table 14 shows the address and
data requirements for the byte program command sequence. Please note that there is no ACC or unlock
bypass.
When the Embedded Program algorithm is complete,
that bank then returns to the read mode and addresses are no longer latched. The system can determine the status of the program operation by using
DQ7, DQ6, or RY/BY#. Refer to the Write Operation
Status section for information on these status bits.
DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the
data is still “0.” Only erase operations can convert a “0”
to a “1.”
Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program bytes or words to a bank faster than using the
standard program command sequence. The unlock
bypass command sequence is initiated by first writing
two unlock cycles. This is followed by a third write
cycle containing the unlock bypass command, 20h.
That bank then enters the unlock bypass mode. A
two-cycle unlock bypass program command sequence
is all that is required to program in this mode. The first
cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the
program address and data. Additional data is programmed in the same manner. This mode dispenses
with the initial two unlock cycles required in the standard program command sequence, resulting in faster
total programming time. Table 14 shows the requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands
are valid. To exit the unlock bypass mode, the system
must issue the two-cycle unlock bypass reset command sequence. (See Table 12)
Any commands written to the device during the Embedded Program Algorithm are ignored. SecSi,
auto-select, and CFI is not allowed. Note that a
hardware reset immediately terminates the program
operation. The program command sequence should
be reinitiated once that bank has returned to the read
mode, to ensure data integrity.
The device offers accelerated program operations
through the WP#/ACC pin. When the system asserts
VHH on the WP#/ACC pin, the device automatically enters the Unlock Bypass mode. The system may then
write the two-cycle Unlock Bypass program command
sequence. The device uses the higher voltage on the
WP#/ACC pin to accelerate the operation. Note that
the WP#/ACC pin must not be at V HH any operation
other than accelerated programming, or device damage may result. In addition, the WP#/ACC pin must not
be left floating or unconnected; inconsistent behavior
of the device may result.
Programming is allowed in any sequence and across
sector boundaries. A bit cannot be programmed
from “0” back to a “1.” Attempting to do so may
cause that bank to set DQ5 = 1, or cause the DQ7 and
Figure 4 illustrates the algorithm for the program operation. Refer to the Erase and Program Operations
table in the AC Characteristics section for parameters,
and Figure 19 for timing diagrams.
28
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
START
ately terminates the erase operation. If that occurs, the
chip erase command sequence should be reinitiated
once that bank has returned to reading array data, to
ensure data integrity.
Write Program
Command Sequence
Figure 5 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters,
and Figure 21 section for timing diagrams.
Sector Erase Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
No
Yes
Increment Address
No
The device does not require the system to preprogram
prior to erase. The Embedded Erase algorithm automatically programs and verifies the entire memory for
an all zero data pattern prior to electrical erase. The
system is not required to provide any controls or timings during these operations.
Last Address?
Yes
Programming
Completed
Note: See Table 14 for program command sequence.
Figure 4.
Program Operation
Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase
command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional
unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase
algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical
erase. The system is not required to provide any controls or timings during these operations. Table 14
shows the address and data requirements for the chip
erase command sequence.
When the Embedded Erase algorithm is complete,
that bank returns to the read mode and addresses are
no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2,
or RY/BY#. Refer to the Write Operation Status section for information on these status bits.
Any commands written during the chip erase operation
are ignored. SecSi, auto-select, and CFI is not allowed. However, note that a hardware reset immedi-
November 24, 2003
Sector erase is a six bus cycle operation. The sector
erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock cycles are written, and are then followed by the address of the sector to be erased, and
the sector erase command. Table 14 shows the address and data requirements for the sector erase command sequence.
After the command sequence is written, a sector erase
time-out of 80 µs occurs. During the time-out period,
additional sector addresses and sector erase commands may be written. Loading the sector erase buffer
may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time
between these additional cycles must be less than 80
µs, otherwise erasure may begin. Any sector erase address and command following the exceeded time-out
may or may not be accepted. It is recommended that
processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can
be re-enabled after the last Sector Erase command is
written. Any command other than Sector Erase or
Erase Suspend during the time-out period resets
that bank to the read mode. SecSi, auto-select,
and CFI is not allowed.The system must rewrite the
command sequence and any additional addresses
and commands.
The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3:
Sector Erase Timer.). The time-out begins from the rising edge of the final WE# pulse in the command
sequence.
When the Embedded Erase algorithm is complete, the
bank returns to reading array data and addresses are
no longer latched. Note that while the Embedded
Erase operation is in progress, the system can read
data from the non-erasing bank. The system can determine the status of the erase operation by reading
DQ7, DQ6, DQ2, or RY/BY# in the erasing bank. Refer
Am41DL6408H
29
A D V A N C E
I N F O R M A T I O N
to the Write Operation Status section for information
on these status bits.
Once the sector erase operation has begun, only the
Erase Suspend command is valid. All other commands are ignored. However, note that a hardware
reset immediately terminates the erase operation. If
that occurs, the sector erase command sequence
should be reinitiated once that bank has returned to
reading array data, to ensure data integrity.
Figure 5 illustrates the algorithm for the erase operation. Refer to the Erase and Program Operations tables in the AC Characteristics section for parameters,
and Figure 21 section for timing diagrams.
Write Erase
Command Sequence
(Notes 1, 2)
No
After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read
mode. The system can determine the status of the
program operation using the DQ7 or DQ6 status bits,
just as in the standard Byte Program operation.
Refer to the Write Operation Status section for more
information.
Embedded
Erase
algorithm
in progress
Data = FFh?
Yes
Erasure Completed
Notes:
1. See Table 14 for erase command sequence.
2. See the section on DQ3 for information on the sector
erase timer.
Figure 5.
Erase Operation
Erase Suspend/Erase Resume
Commands
The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read
data from, or program data to, any sector not selected
for erasure. The bank address is required when writing
this command. This command is valid only during the
30
When the Erase Suspend command is written during
the sector erase operation, the device requires a maximum of 20 µs to suspend the erase operation. However, when the Erase Suspend command is written
during the sector erase time-out, the device immediately terminates the time-out period and suspends the
erase operation. Addresses are “don’t-cares” when
writing the Erase suspend command.
After the erase operation has been suspended, the
bank enters the erase-suspend-read mode. The system can read data from or program data to any sector
not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at
any address within erase-suspended sectors produces status information on DQ7–DQ0. The system
can use DQ7, or DQ6 and DQ2 together, to determine
if a sector is actively erasing or is erase-suspended.
Refer to the Write Operation Status section for information on these status bits.
START
Data Poll to Erasing
Bank from System
sector erase operation, including the 80 µs time-out
period during the sector erase command sequence.
The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program
algorithm.
In the erase-suspend-read mode, the system can also
issue the autoselect command sequence. The device
allows reading autoselect codes even at addresses
within erasing sectors, since the codes are not stored
in the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation.
Refer to the Sector/Sector Block Protection and Unprotection and Autoselect Command Sequence sections for details.
To resume the sector erase operation, the system
must write the Erase Resume command (address bits
are don’t care). The bank address of the erase-suspended bank is required when writing this command.
Further writes of the Resume command are ignored.
Another Erase Suspend command can be written after
the chip has resumed erasing.
Am41DL6408H
November 24, 2003
A D V A N C E
Cycles
Table 14.
Command
Sequence
(Note 1)
Read (Note 6)
Reset (Note 7)
Autoselect (Note 8)
Manufacturer ID
Device ID (Note 9)
SecSi Sector Factory
Protect (Note 10)
Sector/Sector Block
Protect Verify
(Note 11)
1
1
Word
Byte
Word
Byte
Word
Byte
6
4
Word
555
4
Byte
Word
Byte
Word
Exit SecSi Sector Region
Byte
Word
Program
Byte
Word
Unlock Bypass
Byte
Unlock Bypass Program (Note 12)
Unlock Bypass Reset (Note 13)
Word
Chip Erase
Byte
Word
Sector Erase
Byte
Erase Suspend (Note 14)
Erase Resume (Note 15)
Word
CFI Query (Note 16)
Byte
Enter SecSi Sector Region
4
First
Addr Data
RA
RD
XXX
F0
555
AA
AAA
555
AA
AAA
555
AA
AAA
4
4
3
2
2
6
6
1
1
1
Am29DL640H Command Definitions
Second
Addr Data
2AA
555
2AA
555
2AA
555
555
AAA
555
AAA
555
AAA
555
AAA
XXX
XXX
555
AAA
555
AAA
BA
BA
55
AA
55
55
55
2AA
AA
AAA
3
I N F O R M A T I O N
AA
AA
AA
A0
90
AA
AA
2AA
555
2AA
555
2AA
555
2AA
555
PA
XXX
2AA
555
2AA
555
90
90
90
(BA)555
90
(BA)AAA
55
55
55
55
555
AAA
555
AAA
555
AAA
555
AAA
(BA)X00
Fifth
Addr
Data
Sixth
Addr
Data
01
(BA)X01
(BA)X0E
7E
(BA)X02
(BA)X1C
(BA)X03
80/00
(BA)X06
(SADD)
X02
00/01
(SADD)
X04
02
(BA)X0F
(BA)X1E
01
55
555
AAA
10
55
SADD
30
88
90
XXX
00
A0
PA
PD
20
PD
00
55
55
555
AAA
555
AAA
80
80
555
AAA
555
AAA
AA
AA
2AA
555
2AA
555
B0
30
98
Legend:
X = Don’t care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses
latch on the falling edge of the WE# or CE#f pulse, whichever happens
later.
Notes:
1. See Tables 1 to 3 for description of bus operations.
2. All values are in hexadecimal.
3. Except for the read cycle and the fourth cycle of the autoselect
command sequence, all bus cycles are write cycles.
4. Data bits DQ15–DQ8 are don’t care in command sequences,
except for RD and PD.
5. Unless otherwise noted, address bits A21–A12 are don’t cares for
unlock and command cycles, unless SADD or PA is required.
6. No unlock or command cycles required when bank is reading
array data.
7. The Reset command is required to return to the read mode (or to
the erase-suspend-read mode if previously in Erase Suspend)
when a bank is in the autoselect mode, or if DQ5 goes high (while
the bank is providing status information).
8. The fourth cycle of the autoselect command sequence is a read
cycle. The system must provide the bank address to obtain the
manufacturer ID, device ID, or SecSi Sector factory protect
information. Data bits DQ15–DQ8 are don’t care. See the
Autoselect Command Sequence section for more information.
November 24, 2003
(BA)555
(BA)AAA
(BA)555
(BA)AAA
(BA)555
(BA)AAA
55
555
AA
Bus Cycles (Notes 2–5)
Third
Fourth
Addr
Data
Addr
Data
PD = Data to be programmed at location PA. Data latches on the rising
edge of WE# or CE#f pulse, whichever happens first.
SADD = Address of the sector to be verified (in autoselect mode) or
erased. Address bits A21–A12 uniquely select any sector. Refer to
Table 5 for information on sector addresses.
BA = Address of the bank that is being switched to autoselect mode, is
in bypass mode, or is being erased. Address bits A21–A19 select a
bank. Refer to Table 6 for information on sector addresses.
9. The device ID must be read across the fourth, fifth, and sixth
cycles.
10. The data is 80h for factory locked, 40h for customer locked and
00h for not locked.
11. The data is 00h for an unprotected sector/sector block and 01h for
a protected sector/sector block.
12. The Unlock Bypass command is required prior to the Unlock
Bypass Program command.
13. The Unlock Bypass Reset command is required to return to the
read mode when the bank is in the unlock bypass mode.
14. The system may read and program in non-erasing sectors, or
enter the autoselect mode, when in the Erase Suspend mode.
The Erase Suspend command is valid only during a sector erase
operation, and requires the bank address.
15. The Erase Resume command is valid only during the Erase
Suspend mode, and requires the bank address.
16. Command is valid when device is ready to read array data or when
device is in autoselect mode.
Am41DL6408H
31
A D V A N C E
I N F O R M A T I O N
WRITE OPERATION STATUS
The device provides several bits to determine the status of a
program or erase operation: DQ2, DQ3, DQ5, DQ6, and
DQ7. Table 15 and the following subsections describe the
function of these bits. DQ7 and DQ6 each offer a method for
determining whether a program or erase operation is complete or in progress. The device also provides a hardware-based output signal, RY/BY#, to determine whether
an Embedded Program or Erase operation is in progress or
has been completed.
the status or valid data. Even if the device has completed the program or erase operation and DQ7 has
valid data, the data outputs on DQ15–DQ0 may be still
invalid. Valid data on DQ15–DQ0 (or DQ7–DQ0 for
byte mode) will appear on successive read cycles.
Table 15 shows the outputs for Data# Polling on DQ7.
Figure 6 shows the Data# Polling algorithm. Figure 23
in the AC Characteristics section shows the Data#
Polling timing diagram.
DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system
whether an Embedded Program or Erase algorithm is in
progress or completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising edge of the final
WE# pulse in the command sequence.
START
Read DQ7–DQ0
Addr = VA
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to
DQ7. This DQ7 status also applies to programming during
Erase Suspend. When the Embedded Program algorithm is
complete, the device outputs the datum programmed to
DQ7. The system must provide the program address to
read valid status information on DQ7. If a program address
falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to the
read mode.
During the Embedded Erase algorithm, Data# Polling
produces a “0” on DQ7. When the Embedded Erase
algorithm is complete, or if the bank enters the Erase
Suspend mode, Data# Polling produces a “1” on DQ7.
The system must provide an address within any of the
sectors selected for erasure to read valid status information on DQ7.
DQ7 = Data?
No
No
32
DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
After an erase command sequence is written, if all
sectors selected for erasing are protected, Data# Polling on DQ7 is active for approximately 100 µs, then the
bank returns to the read mode. If not all selected sectors are protected, the Embedded Erase algorithm
erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected
sector, the status may not be valid.
When the system detects DQ7 has changed from the
complement to true data, it can read valid data at
DQ15–DQ0 (or DQ7–DQ0 for byte mode) on the following read cycles. Just prior to the completion of an
Embedded Program or Erase operation, DQ7 may
change asynchronously with DQ15–DQ8 (DQ7–DQ0
in byte mode) while Output Enable (OE#) is asserted
low. That is, the device may change from providing
status information to valid data on DQ7. Depending on
when the system samples the DQ7 output, it may read
Yes
DQ7 = Data?
Yes
No
FAIL
PASS
Notes:
1. VA = Valid address for programming. During a sector
erase operation, a valid address is any sector address
within the sector being erased. During chip erase, a
valid address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because
DQ7 may change simultaneously with DQ5.
Am41DL6408H
Figure 6. Data# Polling Algorithm
November 24, 2003
A D V A N C E
I N F O R M A T I O N
RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin
which indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after
the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a
pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in
the Erase Suspend mode.) If the output is high
(Ready), the device is in the read mode, the standby
mode, or one of the banks is in the erase-suspend-read mode.
DQ6 also toggles during the erase-suspend-program
mode, and stops toggling once the Embedded Program algorithm is complete.
Table 15 shows the outputs for Toggle Bit I on DQ6.
Figure 7 shows the toggle bit algorithm. Figure 24 in
the “AC Characteristics” section shows the toggle bit
timing diagrams. Figure 25 shows the differences between DQ2 and DQ6 in graphical form. See also the
subsection on DQ2: Toggle Bit II.
START
Read Byte
(DQ7–DQ0)
Address =VA
Table 15 shows the outputs for RY/BY#.
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded
Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase
Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final
WE# pulse in the command sequence (prior to the
program or erase operation), and during the sector
erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. The system may use either OE# or
CE#f to control the read cycles. When the operation is
complete, DQ6 stops toggling.
Read Byte
(DQ7–DQ0)
Address =VA
Toggle Bit
= Toggle?
Yes
No
After an erase command sequence is written, if all
sectors selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading
array data. If not all selected sectors are protected, the
Embedded Erase algorithm erases the unprotected
sectors, and ignores the selected sectors that are protected.
DQ5 = 1?
Yes
Read Byte Twice
(DQ7–DQ0)
Address = VA
The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is
erase-suspended. When the device is actively erasing
(that is, the Embedded Erase algorithm is in progress),
DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system
must also use DQ2 to determine which sectors are
erasing or erase-suspended. Alternatively, the system
can use DQ7 (see the subsection on DQ7: Data# Polling).
If a program address falls within a protected sector,
DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading
array data.
Toggle Bit
= Toggle?
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Note: The system should recheck the toggle bit even if DQ5
= “1” because the toggle bit may stop toggling as DQ5
changes to “1.” See the subsections on DQ6 and DQ2 for
more information.
Figure 7.
November 24, 2003
No
Am41DL6408H
Toggle Bit Algorithm
33
A D V A N C E
I N F O R M A T I O N
DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing
(that is, the Embedded Erase algorithm is in progress),
or whether that sector is erase-suspended. Toggle Bit
II is valid after the rising edge of the final WE# pulse in
the command sequence.
DQ2 toggles when the system reads at addresses
within those sectors that have been selected for erasure. (The system may use either OE# or CE#f to control the read cycles.) But DQ2 cannot distinguish
whether the sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the
device is actively erasing, or is in Erase Suspend, but
cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and
mode information. Refer to Table 15 to compare outputs for DQ2 and DQ6.
Figure 7 shows the toggle bit algorithm in flowchart
form, and the section “DQ2: Toggle Bit II” explains the
algorithm. See also the DQ6: Toggle Bit I subsection.
Figure 24 shows the toggle bit timing diagram. Figure
25 shows the differences between DQ2 and DQ6 in
graphical form.
Reading Toggle Bits DQ6/DQ2
Refer to Figure 7 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read DQ15–DQ0 (or DQ7–DQ0 for byte
mode) at least twice in a row to determine whether a
toggle bit is toggling. Typically, the system would note
and store the value of the toggle bit after the first read.
After the second read, the system would compare the
new value of the toggle bit with the first. If the toggle bit
is not toggling, the device has completed the program
or erase operation. The system can read array data on
DQ15–DQ0 (or DQ7–DQ0 for byte mode) on the following read cycle.
not gone high. The system may continue to monitor
the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform
other system tasks. In this case, the system must start
at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 7).
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has
exceeded a specified internal pulse count limit. Under these
conditions DQ5 produces a “1,” indicating that the program
or erase cycle was not successfully completed.
The device may output a “1” on DQ5 if the system tries
to program a “1” to a location that was previously programmed to “0.” Only an erase operation can
change a “0” back to a “1.” Under this condition, the
device halts the operation, and when the timing limit
has been exceeded, DQ5 produces a “1.”
Under both these conditions, the system must write
the reset command to return to the read mode (or to
the erase-suspend-read mode if a bank was previously in the erase-suspend-program mode).
DQ3: Sector Erase Timer
After writing a sector erase command sequence, the
system may read DQ3 to determine whether or not
erasure has begun. (The sector erase timer does not
apply to the chip erase command.) If additional
sectors are selected for erasure, the entire time-out
also applies after each additional sector erase command. When the time-out period is complete, DQ3
switches from a “0” to a “1.” If the time between additional sector erase commands from the system can be
assumed to be less than 50 µs, the system need not
monitor DQ3. See also the Sector Erase Command
Sequence section.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high
(see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling
just as DQ5 went high. If the toggle bit is no longer
toggling, the device has successfully completed the
program or erase operation. If it is still toggling, the device did not completed the operation successfully, and
the system must write the reset command to return to
reading array data.
After the sector erase command is written, the system
should read the status of DQ7 (Data# Polling) or DQ6
(Toggle Bit I) to ensure that the device has accepted
the command sequence, and then read DQ3. If DQ3 is
“1,” the Embedded Erase algorithm has begun; all further commands (except Erase Suspend) are ignored
until the erase operation is complete. If DQ3 is “0,” the
device will accept additional sector erase commands.
To ensure the command has been accepted, the system software should check the status of DQ3 prior to
and following each subsequent sector erase command. If DQ3 is high on the second status check, the
last command might not have been accepted.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has
Table 15 shows the status of DQ3 relative to the other
status bits.
34
Am41DL6408H
November 24, 2003
A D V A N C E
Table 15.
Standard
Mode
Erase
Suspend
Mode
Status
Embedded Program Algorithm
Embedded Erase Algorithm
Erase
Erase-Suspend- Suspended Sector
Read
Non-Erase
Suspended Sector
Erase-Suspend-Program
I N F O R M A T I O N
Write Operation Status
DQ7
(Note 2)
DQ7#
0
DQ6
Toggle
Toggle
DQ5
(Note 1)
0
0
DQ3
N/A
1
DQ2
(Note 2)
No toggle
Toggle
RY/BY#
0
0
1
No toggle
0
N/A
Toggle
1
Data
Data
Data
Data
Data
1
DQ7#
Toggle
0
N/A
N/A
0
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits.
Refer to the section on DQ5 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further
details.
3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm
is in progress. The device outputs array data if the system addresses a non-busy bank.
November 24, 2003
Am41DL6408H
35
A D V A N C E
I N F O R M A T I O N
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . –55°C to +125°C
20 ns
Ambient Temperature
with Power Applied. . . . . . . . . . . . . . . –40°C to +85°C
+0.8 V
Voltage with Respect to Ground
–0.5 V
VCC (Note 1) . . . . . . . . . . . . . . . . .–0.5 V to +4.0 V
RESET# (Note 2) . . . . . . . . . . . .–0.5 V to +12.5 V
20 ns
–2.0 V
WP#/ACC . . . . . . . . . . . . . . . . . . –0.5 V to +10.5 V
20 ns
All other pins (Note 1) . . . . . . –0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) . . . . . . 200 mA
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V.
During voltage transitions, input or I/O pins may
overshoot V SS to –2.0 V for periods of up to 20 ns.
Maximum DC voltage on input or I/O pins is VCC +0.5 V.
See Figure 8. During voltage transitions, input or I/O pins
may overshoot to VCC +2.0 V for periods up to 20 ns. See
Figure 9.
2. Minimum DC input voltage on pins RESET#, and
WP# /ACC is –0 .5 V. D ur ing volt age trans itions,
WP#/ACC, and RESET# may overshoot VSS to –2.0 V for
periods of up to 20 ns. See Figure 8. Maximum DC input
voltage on pin RESET# is +12.5 V which may overshoot
to +14.0 V for periods up to 20 ns. Maximum DC input
voltage on WP#/ACC is +9.5 V which may overshoot to
+12.0 V for periods up to 20 ns.
Figure 8. Maximum Negative
Overshoot Waveform
20 ns
VCC
+2.0 V
VCC
+0.5 V
2.0 V
3. No more than one output may be shorted to ground at a
time. Duration of the short circuit should not be greater
than one second.
20 ns
20 ns
Figure 9. Maximum Positive
Overshoot Waveform
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational sections of this data sheet is not implied.
Exposure of the device to absolute maximum rating
conditions for extended periods may affect device reliability.
OPERATING RANGES
Industrial (I) Devices
Ambient Temperature (TA) . . . . . . . . . –40°C to +85°C
VCCf/VCCs Supply Voltages
VCCf/VCCs for standard voltage range . . 2.7 V to 3.3 V
Operating ranges define those limits between which the
functionality of the device is guaranteed.
36
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
DC CHARACTERISTICS
CMOS Compatible
Parameter
Symbol
Parameter Description
Test Conditions
Min
Typ
Max
Unit
±1.0
µA
35
µA
±1.0
µA
ILI
Input Load Current
VIN = VSS to VCC,
VCC = VCC max
ILIT
RESET# Input Load Current
VCC = VCC max; RESET# = 12.5 V
ILO
Output Leakage Current
VOUT = VSS to VCC,
VCC = VCC max
ILR
Reset Leakage Current
VCC = VCC max; RESET# = 12.5 V
35
µA
ILIA
ACC Input Leakage Current
VCC = VCC max, WP#/ACC
= VACC max
35
µA
ICC1f
Flash VCC Active Read Current
(Notes 1, 2)
CE#f = VIL, OE# = VIH,
Byte Mode
5 MHz
10
16
1 MHz
2
4
CE#f = VIL, OE# = VIH,
Word Mode
5 MHz
10
16
1 MHz
2
4
mA
ICC2f
Flash VCC Active Write Current (Notes 2,
3)
CE#f = VIL, OE# = VIH, WE# = VIL
15
30
mA
ICC3f
Flash VCC Standby Current (Note 2)
VCCf = VCC max, CE#f, RESET#,
WP#/ACC = VCCf ± 0.3 V
0.2
5
µA
ICC4f
Flash VCC Reset Current (Note 2)
VCCf = VCC max, RESET# = VSS ± 0.3 V,
WP#/ACC = VCCf ± 0.3 V
0.2
5
µA
ICC5f
Flash VCC Current Automatic Sleep Mode
(Notes 2, 4)
VCCf = VCC max, VIH = VCC ± 0.3 V;
VIL = VSS ± 0.3 V
0.2
5
µA
ICC6f
Flash VCC Active Read-While-Program
Current (Notes 1, 2)
CE#f = VIL, OE# = VIH
ICC7f
Flash VCC Active Read-While-Erase
Current (Notes 1, 2)
CE#f = VIL, OE# = VIH
ICC8f
Flash VCC Active
Program-While-Erase-Suspended
Current (Notes 2, 5)
CE#f = VIL, OE#f = VIH
Byte
21
45
Word
21
45
Byte
21
45
Word
21
45
17
35
mA
mA
mA
VIL
Input Low Voltage
–0.2
0.8
V
VIH
Input High Voltage
2.4
VCC + 0.2
V
VHH
Voltage for WP#/ACC Program
Acceleration and Sector
Protection/Unprotection
8.5
9.5
V
VID
Voltage for Sector Protection, Autoselect
and Temporary Sector Unprotect
11.5
12.5
V
VOL
Output Low Voltage
0.45
V
VOH1
Output High Voltage
IOH = –2.0 mA, VCCf = VCCs = VCC min
IOH = –100 µA, VCC = VCC min
VOH2
VLKO
IOL = 2.0 mA, VCCf = VCCs = VCC min
Flash Low VCC Lock-Out Voltage (Note 5)
0.85 x
VCC
V
VCC–0.4
2.0
2.5
V
Notes:
1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH.
2.
3.
4.
5.
Maximum ICC specifications are tested with VCC = VCCmax.
ICC active while Embedded Erase or Embedded Program is in progress.
Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is 200 nA.
Not 100% tested.
November 24, 2003
Am41DL6408H
37
A D V A N C E
I N F O R M A T I O N
DC CHARACTERISTICS
SRAM DC AND OPERATING CHARACTERISTICS
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
ILI
Input Leakage Current
VIN = VSS to VCC
–1.0
1.0
µA
ILO
Output Leakage Current
CE1#s = VIH, CE2s = VIL or OE# =
VIH or WE# = VIL, VIO= VSS to VCC
–1.0
1.0
µA
ICC
Operating Power Supply Current
IIO = 0 mA, CE1#s = VIL, CE2s =
WE# = VIH, VIN = VIH or VIL
3
mA
ICC1s
Average Operating Current
Cycle time = 1 µs, 100% duty,
IIO = 0 mA, CE1#s ≤ 0.2 V,
CE2 ≥ VCC – 0.2 V, VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
3
mA
ICC2s
Average Operating Current
Cycle time = Min., IIO = 0 mA,
100% duty, CE1#s = VIL, CE2s =
VIH, VIN = VIL = or VIH
30
mA
VOL
Output Low Voltage
IOL = 2.1 mA
0.4
V
VOH
Output High Voltage
IOH = –1.0 mA
ISB
Standby Current (TTL)
CE1#s = VIH, CE2 = VIL, Other
inputs = VIH or VIL
0.3
mA
Standby Current (CMOS)
CE1#s ≥ VCC – 0.2 V, CE2 ≥ VCC –
0.2 V (CE1#s controlled) or CE2 ≤
0.2 V (CE2s controlled), CIOs =
VSS or VCC, Other input = 0 ~ VCC
15
µA
ISB1
38
Parameter Description
Am41DL6408H
2.4
V
November 24, 2003
A D V A N C E
I N F O R M A T I O N
DC CHARACTERISTICS
Zero-Power Flash
Supply Current in mA
25
20
15
10
5
0
0
500
1000
1500
2000
2500
3000
3500
4000
Time in ns
Note: Addresses are switching at 1 MHz
Figure 10.
ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)
12
3.3 V
10
2.7 V
Supply Current in mA
8
6
4
2
0
1
2
3
4
5
Frequency in MHz
Note: T = 25 °C
Figure 11.
November 24, 2003
Typical ICC1 vs. Frequency
Am41DL6408H
39
A D V A N C E
I N F O R M A T I O N
TEST CONDITIONS
Table 16.
3.3 V
Test Condition
2.7 kΩ
Device
Under
Test
CL
Test Specifications
6.2 kΩ
All Speeds
Output Load
1 TTL gate
Output Load Capacitance, CL
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
0.0–3.0
V
Input timing measurement
reference levels
1.5
V
Output timing measurement
reference levels
1.5
V
Input Pulse Levels
Note: Diodes are IN3064 or equivalent
Figure 12.
Unit
Test Setup
KEY TO SWITCHING WAVEFORMS
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
KS000010-PAL
3.0 V
Input
1.5 V
Measurement Level
1.5 V
Output
0.0 V
Figure 13.
40
Input Waveforms and Measurement Levels
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
SRAM CE#s Timing
Parameter
Test Setup
JEDEC
Std
Description
—
tCCR
CE#s Recover Time
—
Min
All Speeds
Unit
0
ns
CE#f
tCCR
tCCR
tCCR
tCCR
CE1#s
CE2s
Figure 14.
November 24, 2003
Timing Diagram for Alternating Between
SRAM to Flash
Am41DL6408H
41
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Flash Read-Only Operations
Parameter
Speed
JEDEC
Std.
Description
Test Setup
70, 71
85
Unit
tAVAV
tRC
Read Cycle Time (Note 1)
Min
70
85
ns
tAVQV
tACC
Address to Output Delay
CE#f, OE# = VIL
Max
70
85
ns
tELQV
tCE
Chip Enable to Output Delay
OE# = VIL
Max
70
85
ns
tGLQV
tOE
Output Enable to Output Delay
Max
30
40
ns
tEHQZ
tDF
Chip Enable to Output High Z (Notes 1, 3)
Max
30
ns
tGHQZ
tDF
Output Enable to Output High Z (Notes 1, 3)
Max
30
ns
tAXQX
tOH
Output Hold Time From Addresses, CE#f or
OE#, Whichever Occurs First
Min
0
ns
Read
Min
0
ns
tOEH
Output Enable Hold Time
(Note 1)
Toggle and
Data# Polling
Min
10
ns
Notes:
1. Not 100% tested.
2. See Figure 12 and Table 16 for test specifications
3. Measurements performed by placing a 50Ω termination on the data pin with a bias of VCC/2. The time from OE# high to the
data bus driven to VCC/2 is taken as tDF
.
tRC
Addresses Stable
Addresses
tACC
CE#f
tRH
tRH
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
HIGH Z
HIGH Z
Output Valid
Outputs
RESET#
RY/BY#
0V
Figure 15.
42
Read Operation Timings
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Hardware Reset (RESET#)
Parameter
JEDEC
Std
Description
All Speed Options
Unit
tReady
RESET# Pin Low (During Embedded Algorithms)
to Read Mode (See Note)
Max
20
µs
tReady
RESET# Pin Low (NOT During Embedded
Algorithms) to Read Mode (See Note)
Max
500
ns
tRP
RESET# Pulse Width
Min
500
ns
tRH
Reset High Time Before Read (See Note)
Min
50
ns
tRPD
RESET# Low to Standby Mode
Min
20
µs
tRB
RY/BY# Recovery Time
Min
0
ns
Note: Not 100% tested.
RY/BY#
CE#f, OE#
tRH
RESET#
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#f, OE#
RESET#
tRP
Figure 16.
November 24, 2003
Reset Timings
Am41DL6408H
43
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Word/Byte Configuration (CIOf)
Parameter
JEDEC
Std
Speed
Description
70, 71
85
Unit
tELFL/tELFH
CE#f to CIOf Switching Low or High
Max
5
ns
tFLQZ
CIOf Switching Low to Output HIGH Z
Max
16
ns
tFHQV
CIOf Switching High to Output Active
Min
70
85
ns
CE#f
OE#
CIOf
CIOf
Switching
from word
to byte
mode
tELFL
Data Output
(DQ14–DQ0)
DQ0–DQ14
Address
Input
DQ15
Output
DQ15/A-1
Data Output
(DQ7–DQ0)
tFLQZ
tELFH
CIOf
CIOf
Switching
from byte
to word
mode
Data Output
(DQ7–DQ0)
DQ0–DQ14
Address
Input
DQ15/A-1
Data Output
(DQ14–DQ0)
DQ15
Output
tFHQV
Figure 17.
CIOf Timings for Read Operations
CE#f
The falling edge of the last WE# signal
WE#
CIOf
tSET
(tAS)
tHOLD (tAH)
Note: Refer to the Erase/Program Operations table for tAS and tAH specifications.
Figure 18.
44
CIOf Timings for Write Operations
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Erase and Program Operations
Parameter
Speed
JEDEC
Std
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVWL
tAS
Address Setup Time
Min
0
ns
tASO
Address Setup Time to OE# low during toggle bit polling
Min
15
ns
tAH
Address Hold Time
Min
tAHT
Address Hold Time From CE#f or OE# high
during toggle bit polling
Min
tDVWH
tDS
Data Setup Time
Min
tWHDX
tDH
Data Hold Time
Min
0
ns
tOEPH
Output Enable High during toggle bit polling
Min
20
ns
tGHWL
tGHWL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time (CE#f to WE#)
Min
0
ns
tELWL
tCS
CE#f Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time (CE#f to WE#)
Min
0
ns
tWHEH
tCH
CE#f Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
tWHDL
tWPH
Write Pulse Width High
Min
30
ns
tSR/W
Latency Between Read and Write Operations
Min
0
ns
Byte
Typ
5
Word
Typ
7
tWLAX
70, 71
85
Unit
70
85
ns
40
45
0
40
ns
45
30
ns
35
ns
ns
tWHWH1
tWHWH1
Programming Operation (Note 2)
tWHWH1
tWHWH1
Accelerated Programming Operation,
Word or Byte (Note 2)
Typ
4
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.4
sec
tVCS
VCC Setup Time (Note 1)
Min
50
µs
tRB
Write Recovery Time from RY/BY#
Min
0
ns
Program/Erase Valid to RY/BY# Delay
Max
90
ns
tBUSY
µs
Notes:
1. Not 100% tested.
2. See the “Flash Erase And Programming Performance” section for more information.
November 24, 2003
Am41DL6408H
45
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
Read Status Data (last two cycles)
555h
PA
PA
PA
tAH
CE#f
tCH
tGHWL
OE#
tWHWH1
tWP
WE#
tWPH
tCS
tDS
tDH
PD
A0h
Data
Status
tBUSY
DOUT
tRB
RY/BY#
VCCf
tVCS
Notes:
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
Figure 19.
Program Operation Timings
VHH
WP#/ACC
VIL or VIH
VIL or VIH
tVHH
Figure 20.
46
tVHH
Accelerated Program Timing Diagram
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SADD
VA
555h for chip erase
tAH
CE#f
tGHWL
tCH
OE#
tWP
WE#
tWPH
tCS
tWHWH2
tDS
tDH
Data
55h
In
Progress
30h
Complete
10 for Chip Erase
tBUSY
tRB
RY/BY#
tVCS
VCCf
Notes:
1. SADD = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”.
2. These waveforms are for the word mode.
Figure 21.
November 24, 2003
Chip/Sector Erase Operation Timings
Am41DL6408H
47
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Addresses
tWC
tWC
tRC
Valid PA
Valid RA
tWC
Valid PA
Valid PA
tAH
tCPH
tACC
tCE
CE#f
tCP
tOE
OE#
tOEH
tGHWL
tWP
WE#
tDF
tWPH
tDS
tOH
tDH
Valid
Out
Valid
In
Data
Valid
In
Valid
In
tSR/W
WE# Controlled Write Cycle
Read Cycle
Figure 22.
CE#f Controlled Write Cycles
Back-to-back Read/Write Cycle Timings
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#f
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ7
Complement
Complement
DQ0–DQ6
Status Data
Status Data
True
Valid Data
High Z
True
Valid Data
tBUSY
RY/BY#
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data
read cycle.
Figure 23.
48
Data# Polling Timings (During Embedded Algorithms)
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
tAHT
tAS
Addresses
tAHT
tASO
CE#f
tCEPH
tOEH
WE#
tOEPH
OE#
tDH
DQ6/DQ2
tOE
Valid
Status
Valid
Status
Valid
Status
(first read)
(second read)
(stops toggling)
Valid Data
Valid Data
RY/BY#
Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read
cycle, and array data read cycle.
Figure 24.
Enter
Embedded
Erasing
WE#
Erase
Suspend
Erase
Toggle Bit Timings (During Embedded Algorithms)
Enter Erase
Suspend Program
Erase Suspend
Read
Erase
Suspend
Program
Erase
Resume
Erase Suspend
Read
Erase
Erase
Complete
DQ6
DQ2
Note: DQ2 toggles only when read at an address within an erase-suspended sector. The system may use OE# or CE#f to
toggle DQ2 and DQ6.
Figure 25.
November 24, 2003
DQ2 vs. DQ6
Am41DL6408H
49
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Temporary Sector Unprotect
Parameter
JEDEC
Std
Description
All Speed Options
Unit
tVIDR
VID Rise and Fall Time (See Note)
Min
500
ns
tVHH
VHH Rise and Fall Time (See Note)
Min
250
ns
tRSP
RESET# Setup Time for Temporary Sector
Unprotect
Min
4
µs
tRRB
RESET# Hold Time from RY/BY# High for
Temporary Sector Unprotect
Min
4
µs
Note: Not 100% tested.
VID
RESET#
VID
VSS, VIL,
or VIH
VSS, VIL,
or VIH
tVIDR
tVIDR
Program or Erase Command Sequence
CE#f
WE#
tRRB
tRSP
RY/BY#
Figure 26.
50
Temporary Sector Unprotect Timing Diagram
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
VID
VIH
RESET#
SADD,
A6, A1, A0
Valid*
Valid*
Sector/Sector Block Protect or Unprotect
Data
60h
60h
Valid*
Verify
40h
Status
Sector/Sector Block Protect: 150 µs,
Sector/Sector Block Unprotect: 15 ms
1 µs
CE#f
WE#
OE#
* For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0, SADD = Sector Address.
Figure 27. Sector/Sector Block Protect and
Unprotect Timing Diagram
November 24, 2003
Am41DL6408H
51
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
Alternate CE#f Controlled Erase and Program Operations
Parameter
Speed
JEDEC
Std
Description
70, 71
85
Unit
tAVAV
tWC
Write Cycle Time (Note 1)
Min
70
85
ns
tAVWL
tAS
Address Setup Time
Min
tELAX
tAH
Address Hold Time
Min
40
45
ns
tDVEH
tDS
Data Setup Time
Min
40
45
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tGHEL
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE#f Pulse Width
Min
tEHEL
tCPH
CE#f Pulse Width High
Min
30
Typ
5
tWHWH1
Programming Operation
(Note 2)
Byte
tWHWH1
Word
Typ
7
tWHWH1
tWHWH1
Accelerated Programming Operation,
Word or Byte (Note 2)
Typ
4
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 2)
Typ
0.4
sec
0
40
ns
45
ns
ns
µs
Notes:
1. Not 100% tested.
2. See the “Flash Erase And Programming Performance” section for more information.
52
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
555 for program
2AA for erase
PA for program
SADD for sector erase
555 for chip erase
Data# Polling
Addresses
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tWHWH1 or 2
tCP
CE#f
tWS
tCPH
tBUSY
tDS
tDH
DQ7#
Data
tRH
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SADD = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device.
4. Waveforms are for the word mode.
Figure 28.
November 24, 2003
Flash Alternate CE#f Controlled Write (Erase/Program) Operation Timings
Am41DL6408H
53
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
SRAM Read Cycle
Parameter
Symbol
Speed
Description
Unit
71
70
85
tRC
Read Cycle Time
Min
55
70
85
ns
tAA
Address Access Time
Max
55
70
85
ns
tCO1, tCO2
Chip Enable to Output
Max
55
70
85
ns
tOE
Output Enable Access Time
Max
25
35
45
ns
tBA
LB#s, UB#s to Access Time
Max
55
70
85
ns
Chip Enable (CE1#s Low and CE2s High) to Low-Z
Output
Min
10
ns
tBLZ
UB#, LB# Enable to Low-Z Output
Min
10
ns
tOLZ
Output Enable to Low-Z Output
Min
5
ns
tHZ1, tHZ2
Chip Disable to High-Z Output
Max
20
25
ns
tBHZ
UB#s, LB#s Disable to High-Z Output
Max
20
25
ns
tOHZ
Output Disable to High-Z Output
Max
20
25
ns
tOH
Output Data Hold from Address Change
Min
tLZ1, tLZ2
10
ns
tRC
Address
tOH
Data Out
tAA
Data Valid
Previous Data Valid
Note: CE1#s = OE# = VIL, CE2s = WE# = VIH, UB#s and/or LB#s = VIL
Figure 29.
54
SRAM Read Cycle—Address Controlled
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
tRC
Address
tAA
tCO1
CE#1s
CE2s
tOH
tCO2
tHZ
tOE
OE#
tOLZ
tBLZ
Data Out
High-Z
tOHZ
tLZ
Data Valid
Figure 30.
SRAM Read Cycle
Notes:
1. WE# = VIH, if CIOs is low, ignore UB#s/LB#s timing.
2. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output
voltage levels.
3. At any given temperature and voltage condition, tHZ (Max.) is less than tLZ (Min.) both for a given device and from device to device
interconnection.
November 24, 2003
Am41DL6408H
55
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
SRAM Write Cycle
Parameter
Symbol
Speed
Description
Unit
71
70
85
tWC
Write Cycle Time
Min
55
70
85
ns
tCw
Chip Enable to End of Write
Min
45
60
70
ns
tAS
Address Setup Time
Min
tAW
Address Valid to End of Write
Min
45
60
70
ns
tBW
UB#s, LB#s to End of Write
Min
45
60
70
ns
tWP
Write Pulse Time
Min
40
50
60
ns
tWR
Write Recovery Time
Min
0
Min
0
tWHZ
Write to Output High-Z
tDW
Data to Write Time Overlap
Min
tDH
Data Hold from Write Time
Min
0
ns
tOW
End Write to Output Low-Z
min
5
ns
0
ns
ns
ns
Max
20
25
25
30
35
ns
tWC
Address
tWR
tCW
(See Note 1)
CE1#s
tAW
CE2s
WE#
Data In
tCW
(See Note 1)
tWP
(See Note 4)
tAS
(See Note 3)
tDW
High-Z
High-Z
Data Valid
tWHZ
Data Out
tDH
tOW
Data Undefined
Notes:
1. WE# controlled, if CIOs is low, ignore UB#s and LB#s timing.
2. tCW is measured from CE1#s going low to the end of write.
3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high.
4. tAS is measured from the address valid to the beginning of write.
5. A write occurs during the overlap (tWP) of low CE#1 and low WE#. A write begins when CE1#s goes low and WE# goes low when
asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A
write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write
to the end of write.
Figure 31.
56
SRAM Write Cycle—WE# Control
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
tWC
Address
tAS (See Note 2 ) t
CW
(See Note 3)
tWR (See Note 4)
CE1#s
tAW
CE2s
tBW
UB#s, LB#s
tWP
(See Note 5)
WE#
tDW
Data Valid
Data In
Data Out
tDH
High-Z
High-Z
Notes:
1. CE1#s controlled, if CIOs is low, ignore UB#s and LB#s timing.
2. tCW is measured from CE1#s going low to the end of write.
3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high.
4. tAS is measured from the address valid to the beginning of write.
5. A write occurs during the overlap (tWP) of low CE1#s and low WE#. A write begins when CE1#s goes low and WE# goes low when
asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A
write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write
to the end of write.
Figure 32.
November 24, 2003
SRAM Write Cycle—CE1#s Control
Am41DL6408H
57
A D V A N C E
I N F O R M A T I O N
AC CHARACTERISTICS
tWC
Address
tCW
(See Note 2)
CE1#s
tWR (See Note 3)
tAW
tCW (See Note 2)
CE2s
tBW
UB#s, LB#s
tAS
(See Note 4)
WE#
tWP
(See Note 5)
tDW
Data In
Data Out
tDH
Data Valid
High-Z
High-Z
Notes:
1. UB#s and LB#s controlled, CIOs must be high.
2. tCW is measured from CE1#s going low to the end of write.
3. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CE1#s or WE# going high.
4. tAS is measured from the address valid to the beginning of write.
5. A write occurs during the overlap (tWP) of low CE#1s and low WE#. A write begins when CE1#s goes low and WE# goes low when
asserting UB#s or LB#s for a single byte operation or simultaneously asserting UB#s and LB#s for a double byte operation. A
write ends at the earliest transition when CE1#s goes high and WE# goes high. The tWP is measured from the beginning of write
to the end of write.
Figure 33.
58
SRAM Write Cycle—UB#s and LB#s Control
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
FLASH ERASE AND PROGRAMMING PERFORMANCE
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
0.4
5
sec
Chip Erase Time
56
Excludes 00h programming
prior to erasure (Note 4)
Byte Program Time
5
150
µs
Accelerated Byte/Word Program Time
4
120
µs
Word Program Time
7
210
µs
Byte Mode
42
126
Word Mode
28
84
Chip Program Time
(Note 3)
sec
Excludes system level
overhead (Note 5)
sec
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 1,000,000 cycles. Additionally, programming typicals
assume checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the
maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 14 for further
information on command definitions. The device has a minimum erase and program cycle endurance of 1,000,000 cycles.
LATCHUP CHARACTERISTICS
Description
Min
Max
Input voltage with respect to VSS on all pins except I/O pins
(including A9, OE#, and RESET#)
–1.0 V
12.5 V
Input voltage with respect to VSS on all I/O pins
–1.0 V
VCC + 1.0 V
–100 mA
+100 mA
VCC Current
Note: Includes all pins except VCC. Test conditions: VCC = 3.0 V, one pin at a time.
PACKAGE PIN CAPACITANCE
Parameter Symbol
Parameter Description
CIN
Test Setup
Input Capacitance
VIN = 0
COUT
Output Capacitance
VOUT = 0
CIN2
Control Pin Capacitance
CIN3
WP#/ACC Pin Capacitance
Typ
Max
Unit
TSOP
6
7.5
Fine-pitch
BGA
4.2
5.0
TSOP
8.5
12
Fine-pitch
BGA
5.4
6.5
TSOP
7.5
9
VIN = 0
Fine-pitch
BGA
3.9
4.7
VIN = 0
17
20
pF
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
DATA RETENTION
Parameter Description
Minimum Pattern Data Retention Time
November 24, 2003
Am41DL6408H
59
A D V A N C E
I N F O R M A T I O N
SRAM DATA RETENTION
Parameter
Symbol
Parameter Description
VDR
VCC for Data Retention
CS1#s ≥ VCC – 0.2 V (Note 1)
IDR
Data Retention Current
VCC = 3.0 V, CE1#s ≥ VCC – 0.2 V
(Note 1)
tSDR
Data Retention Set-Up Time
tRDR
Recovery Time
Test Setup
See data retention waveforms
Min
Typ
1.5
1.0
(Note 2)
Max
Unit
3.3
V
15
µA
0
ns
tRC
ns
Notes:
1. CE1#s ≥ VCC – 0.2 V, CE2s ≥ VCC – 0.2 V (CE1#s controlled) or CE2s ≤ 0.2 V (CE2s controlled), CIOs = VSS or VCC.
2. Typical values are not 100% tested.
VCC
Data Retention Mode
tSDR
tRDR
2.7V
2.2V
VDR
CE1#s ≥ VCC - 0.2 V
CE1#s
GND
Figure 34.
CE1#s Controlled Data Retention Mode
Data Retention Mode
VCC
2.7 V
CE2s
tSDR
tRDR
VDR
CE2s < 0.2 V
0.4 V
GND
Figure 35.
60
CE2s Controlled Data Retention Mode
Am41DL6408H
November 24, 2003
A D V A N C E
I N F O R M A T I O N
PHYSICAL DIMENSIONS
FLB073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
November 24, 2003
Am41DL6408H
61
A D V A N C E
I N F O R M A T I O N
REVISION SUMMARY
Revision A (September 17, 2003)
Initial release.
Revision A+1 (November 24, 2003)
Corrected DC characteristics for test condition IOL of
Vol (Output Low Voltage). See DC Characteristics CMOS Compatible table.
November 24, 2003
Am41DL6408H
62
A D V A N C E
I N F O R M A T I O N
Trademarks
Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
63
Am41DL6408H
November 24, 2003
Representatives in U.S. and Canada
Sales Offices and Representatives
North America
ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 5 6 ) 8 3 0 - 9 1 9 2
ARIZONA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 2 ) 24 2 - 4 4 0 0
CALIFORNIA,
Irvine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 4 5 0 - 7 5 0 0
Sunnyvale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 7 3 2 - 24 0 0
COLORADO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 74 1 - 2 9 0 0
CONNECTICUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 0 3 ) 2 6 4 - 7 8 0 0
FLORIDA,
Clearwater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 2 7 ) 7 9 3 - 0 0 5 5
Miami (Lakes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 0 5 ) 8 2 0 - 1 1 1 3
GEORGIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 7 0 ) 8 1 4 - 0 2 2 4
ILLINOIS,
Chicago . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 3 0 ) 7 7 3 - 4 4 2 2
MASSACHUSETTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 1 3 - 6 4 0 0
MICHIGAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 4 8 ) 4 7 1 - 6 2 9 4
MINNESOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 1 2 ) 74 5 - 0 0 0 5
NEW JERSEY,
Chatham . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 3 ) 7 0 1 - 1 7 7 7
NEW YORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 4 2 5 - 8 0 5 0
NORTH CAROLINA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 0 - 8 0 8 0
OREGON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 24 5 - 0 0 8 0
PENNSYLVANIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 1 5 ) 3 4 0 - 1 1 8 7
SOUTH DAKOTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 0 5 ) 69 2 - 5 7 7 7
TEXAS,
Austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 1 2 ) 3 4 6 - 7 8 3 0
Dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 2 ) 9 8 5 - 1 3 4 4
Houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 2 8 1 ) 3 76 - 8 0 8 4
VIRGINIA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 0 3 ) 7 3 6 - 9 5 6 8
International
AUSTRALIA, North Ryde . . . . . . . . . . . . . . . . . . . . . . . T E L ( 6 1 ) 2 - 8 8 - 7 7 7 - 2 2 2
BELGIUM, Antwerpen . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 2 ) 3 - 2 4 8 - 4 3 - 0 0
BRAZIL, San Paulo . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 5 5 ) 1 1 - 5 5 0 1 - 2 1 0 5
CHINA,
Beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 1 0 - 6 5 1 0 - 2 1 8 8
Shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 2 1 - 6 3 5 - 0 0 8 3 8
Shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 6 ) 7 5 5 - 24 6 - 1 5 5 0
FINLAND, Helsinki . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 5 8 ) 8 8 1 - 3 1 1 7
FRANCE, Paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 3 ) - 1 - 4 9 7 5 1 0 1 0
GERMANY,
Bad Homburg . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 6 1 7 2 - 9 2 6 7 0
Munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 9 ) - 8 9 - 4 5 0 5 3 0
HONG KONG, Causeway Bay . . . . . . . . . . . . . . . . . . . T E L ( 8 5 ) 2 - 2 9 5 6 - 0 3 8 8
ITALY, Milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 3 9 ) - 0 2 - 3 8 1 9 6 1
INDIA, New Delhi . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 9 1 ) 1 1 - 6 2 3 - 8 6 2 0
JAPAN,
Osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 6 - 6 2 4 3 - 3 2 5 0
Tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 1 ) 3 - 3 3 4 6 - 7 6 0 0
KOREA, Seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 2 ) 2 - 3 4 6 8 - 2 6 0 0
RUSSIA, Moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TEL(7)-095-795-06-22
SWEDEN, Stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 6 ) 8 - 5 62 - 5 4 0 - 0 0
TAIWAN,Taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 8 8 6 ) 2 - 8 7 7 3 - 1 5 5 5
UNITED KINGDOM,
Frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 2 7 6 - 8 0 3 1 0 0
Haydock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T E L ( 4 4 ) 1 9 4 2 - 2 7 2 8 8 8
Advanced Micro Devices reserves the right to make changes in its product without notice
in order to improve design or performance characteristics.The performance
characteristics listed in this document are guaranteed by specific tests, guard banding,
design and other practices common to the industry. For specific testing details, contact
your local AMD sales representative.The company assumes no responsibility for the use of
any circuits described herein.
© Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD Arrow logo and combination thereof, are trademarks of
Advanced Micro Devices, Inc. Other product names are for informational purposes only
and may be trademarks of their respective companies.
es
ARIZONA,
Tempe - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 8 0 ) 8 3 9 - 2 3 2 0
CALIFORNIA,
Calabasas - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 8 ) 8 7 8 - 5 8 0 0
Irvine - Centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 4 9 ) 2 6 1 - 2 1 2 3
San Diego - Centaur. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 8 ) 2 7 8 - 4 9 5 0
Santa Clara - Fourfront. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8 ) 3 5 0 - 4 8 0 0
CANADA,
Burnaby, B.C. - Davetek Marketing. . . . . . . . . . . . . . . . . . . . ( 6 0 4 ) 4 3 0 - 3 6 8 0
Calgary, Alberta - Davetek Marketing. . . . . . . . . . . . . . . . . ( 4 0 3 ) 2 8 3 - 3 5 7 7
Kanata, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . . . ( 6 1 3 ) 5 9 2 - 9 5 4 0
Mississauga, Ontario - J-Squared Tech. . . . . . . . . . . . . . . . . . ( 9 0 5 ) 6 7 2 - 2 0 3 0
St Laurent, Quebec - J-Squared Tech. . . . . . . . . . . . . . . . ( 5 1 4 ) 7 4 7 - 1 2 1 1
COLORADO,
Golden - Compass Marketing . . . . . . . . . . . . . . . . . . . . . . ( 3 0 3 ) 2 7 7 - 0 4 5 6
FLORIDA,
Melbourne - Marathon Technical Sales . . . . . . . . . . . . . . . . ( 3 2 1 ) 7 2 8 - 7 7 0 6
Ft. Lauderdale - Marathon Technical Sales . . . . . . . . . . . . . . ( 9 5 4 ) 5 2 7 - 4 9 4 9
Orlando - Marathon Technical Sales . . . . . . . . . . . . . . . . . . ( 4 0 7 ) 8 7 2 - 5 7 7 5
St. Petersburg - Marathon Technical Sales . . . . . . . . . . . . . . ( 7 2 7 ) 8 9 4 - 3 6 0 3
GEORGIA,
Duluth - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . ( 6 7 8 ) 5 8 4 - 1 1 2 8
ILLINOIS,
Skokie - Industrial Reps, Inc. . . . . . . . . . . . . . . . . . . . . . . . . ( 8 4 7 ) 9 6 7 - 8 4 3 0
INDIANA,
Kokomo - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 6 5 ) 4 5 7 - 7 2 4 1
IOWA,
Cedar Rapids - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . ( 3 1 9 ) 2 9 4 - 1 0 0 0
KANSAS,
Lenexa - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 1 3 ) 4 6 9 - 1 3 1 2
MASSACHUSETTS,
Burlington - Synergy Associates . . . . . . . . . . . . . . . . . . . . . ( 7 8 1 ) 2 3 8 - 0 8 7 0
MICHIGAN,
Brighton - SAI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 1 0 ) 2 2 7 - 0 0 0 7
MINNESOTA,
St. Paul - Cahill, Schmitz & Cahill, Inc. . . . . . . . . . . . . . . . . . ( 6 5 1 ) 69 9 - 0 2 0 0
MISSOURI,
St. Louis - Lorenz Sales . . . . . . . . . . . . . . . . . . . . . . . . . . ( 3 1 4 ) 9 9 7 - 4 5 5 8
NEW JERSEY,
Mt. Laurel - SJ Associates . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 5 6 ) 8 6 6 - 1 2 3 4
NEW YORK,
Buffalo - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 7 4 1 - 7 1 1 6
East Syracuse - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 3 1 5 ) 4 3 7 - 8 3 4 3
Pittsford - Nycom, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 1 6 ) 5 8 6 - 3 6 6 0
Rockville Centre - SJ Associates . . . . . . . . . . . . . . . . . . . . ( 5 1 6 ) 5 3 6 - 4 2 4 2
NORTH CAROLINA,
Raleigh - Quantum Marketing . . . . . . . . . . . . . . . . . . . . . . ( 9 1 9 ) 8 4 6 - 5 7 2 8
OHIO,
Middleburg Hts - Dolfuss Root & Co. . . . . . . . . . . . . . . . . ( 4 4 0 ) 8 1 6 - 1 6 6 0
Powell - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 7 8 1 - 0 7 2 5
Vandalia - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . . . . ( 9 3 7 ) 8 9 8 - 9 6 1 0
Westerville - Dolfuss Root & Co. . . . . . . . . . . . . . . . . . . ( 6 1 4 ) 5 2 3 - 1 9 9 0
OREGON,
Lake Oswego - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . ( 5 0 3 ) 6 7 0 - 0 5 5 7
UTAH,
Murray - Front Range Marketing . . . . . . . . . . . . . . . . . . . . ( 8 0 1 ) 2 8 8 - 2 5 0 0
VIRGINIA,
Glen Burnie - Coherent Solution, Inc. . . . . . . . . . . . . . . . . ( 4 1 0 ) 7 6 1 - 2 2 5 5
WASHINGTON,
Kirkland - I Squared, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 2 5 ) 8 2 2 - 9 2 2 0
WISCONSIN,
Pewaukee - Industrial Representatives . . . . . . . . . . . . . . . . ( 2 6 2 ) 5 74 - 9 3 9 3
Representatives in Latin America
ARGENTINA,
Capital Federal Argentina/WW Rep. . . . . . . . . . . . . . . . . . . .54-11)4373-0655
CHILE,
Santiago - LatinRep/WWRep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993
COLUMBIA,
Bogota - Dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 5 7 1 ) 4 1 0 - 4 1 8 2
MEXICO,
Guadalajara - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 3 ) 8 1 7 - 3 9 0 0
Mexico City - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . ( 5 2 5 ) 7 5 2 - 2 7 2 7
Monterrey - LatinRep/WW Rep. . . . . . . . . . . . . . . . . . . . . ( 5 2 8 ) 3 69 - 6 8 2 8
PUERTO RICO,
Boqueron - Infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 8 7 ) 8 5 1 - 6 0 0 0
One AMD Place, P.O. Box 3453, Sunnyvale, CA 94088-3453 408-732-2400
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©2003 Advanced Micro Devices, Inc.
01/03
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